JP7240300B2 - Particle supply device, resin molding device, and method for manufacturing resin molded product - Google Patents

Description

TECHNICAL FIELD The present invention relates to a powder supply device, a resin molding device, and a method for manufacturing a resin molded product.

For example, as shown in Patent Document 1, a resin molding apparatus for compression molding conveys a resin material, which is a granular material, from a resin material holding part to a trough by vibrating a resin material holding part and a trough, and the resin material is transferred from the trough to the resin material holding part. The resin material is supplied to the material transfer tray. After that, the resin molding apparatus supplies the resin material in the resin material transfer tray into the cavity of the molding die and clamps the molding die to manufacture a resin molded product.

Japanese Patent No. 6279047

2. Description of the Related Art In recent years, in order to improve the mounting efficiency of electronic components in a finished product, it is sometimes desired to reduce the thickness of a package portion (resin portion) of an electronic component. In order to meet such demands, it is necessary to control the amount of resin material supplied to the cavity of the mold with higher accuracy.

For this reason, it is desired to increase the accuracy of the resin material supply amount in the configuration of the resin material holding portion and the trough described in Patent Document 1 as well.
It should be noted that there is a demand not only for reducing the thickness of the package portion (resin portion) of the electronic component, but also in many other fields to increase the accuracy of the supply amount of the powder.

Accordingly, the main object of the present invention is to control the supply amount of powder or granular material with high accuracy.

That is, the granular material supply device according to the present invention includes: a storage section in which an outlet is formed for storing the granular material and for discharging the granular material downward; and an introduction port connected to the outlet of the storage section. a conveying path having an opening formed therein and extending laterally from the inlet; a vibrating section for vibrating the conveying path to move the powder or granular material introduced from the inlet along the conveying path; A blocking member for blocking an end portion side in a direction in which the transport path extends is provided at a connecting portion of the outlet of the storage section and the inlet of the transport path.

According to the present invention configured as described above, it is possible to control the supply amount of the granular material with high accuracy.

1 is a plan view schematically showing the configuration of one embodiment of a resin molding apparatus according to the present invention; FIG. It is a sectional view showing typically composition of a resin material supply device of the embodiment. FIG. 4 is (1) a vertical cross-sectional view, (2) a cross-sectional view taken along the line AA, and (3) a plan view mainly showing a storage section, a conveying path, and a blocking member of the same embodiment. FIG. 4 is a schematic diagram showing (1) a resin material supply state in the resin material supply device of the same embodiment (this example) and (2) a resin material supply state in a conventional resin material supply device (conventional example). 5 is a histogram showing the flow rate distributions of the present embodiment and the conventional example when the target value of the supply flow rate of the resin material is set to 2.0 [g/s]. 5 is a histogram showing the flow rate distributions of the present embodiment and the conventional example when the target value of the supply flow rate of the resin material is set to 1.0 [g/s]. 5 is a histogram showing the flow rate distributions of the present embodiment and the conventional example when the target value of the supply flow rate of the resin material is set to 0.5 [g/s]. It is a schematic diagram which shows the structure of the resin material supply apparatus based on deformation|transformation embodiment.

The invention will now be described in more detail by means of examples. However, the invention is not limited by the following description.

As described above, the powdery or granular material supply apparatus of the present invention includes a storage section that stores powdery or granular material and is formed with an outlet port for leading out the powdery or granular material downward, and a storage section that is connected to the outlet port of the storage section. a conveying path extending laterally from the introducing port, and a vibrating section that vibrates the conveying path to move the powder or granular material introduced from the introducing port along the conveying path. and a blocking member that blocks an end portion side in a direction in which the transport path extends at a connecting portion of the outlet of the storage portion and the introduction port of the transport path.
With this powdery material supply device, since the end portion side in the direction in which the conveying path extends is blocked by the blocking member at the connecting portion of the outlet of the storing section and the inlet of the conveying path, the powder particles can be separated from the storing section. The direction in which the bodies flow down is opposite to the direction in which the conveying path extends. This prevents the powder in the reservoir from unintentionally flowing down in the direction in which the conveying path extends, stabilizes the flow rate of the powder in the conveying path, and stabilizes the flow of the granular material from the conveying path. The amount of supply can be controlled with high precision.

As a specific configuration of the blocking member, it is desirable that the blocking member is provided in the connecting portion so as to face the side opposite to the direction in which the transport path extends from the end portion in the direction in which the transport path extends. .

In order to simplify the configuration of the blocking member, it is desirable that the blocking member be flat.

In the case where a blocking member is provided at the connecting portion between the outlet port of the reservoir and the inlet port of the conveying path, there is a risk that the powder particles will accumulate in the blocking member.
In order to preferably solve this problem, it is desirable that the upper surface of the blocking portion is formed with an inclined surface facing the opposite direction to the direction in which the conveying path extends.
With this configuration, it is possible to suppress accumulation of the granular material on the upper surface of the blocking member.

Further, a resin molding apparatus according to the present invention includes the above-described powdery material supply apparatus that supplies the resin material, which is a powdery material, and a compression mold that performs compression molding using the resin material supplied by the powdery material supply apparatus. and a molding portion.
With this resin molding apparatus, the amount of resin material supplied can be controlled with high precision, so that the thickness of the resin molded product can be made uniform. Even with a thin package, the thickness of the package can be made uniform.

Further, a method for manufacturing a resin molded product according to the present invention includes a resin material supplying step of supplying a resin material, which is a granular material, by the above-described granular material supplying apparatus, and performing compression molding using the supplied resin material. and a compression molding step.
With this method of manufacturing a resin molded product, the amount of resin material supplied can be controlled with high precision, so that the thickness of the resin molded product can be made uniform. In this case, even if there is a thin package, the package thickness can be made uniform.

<One embodiment of the present invention>
As used herein, the term "granular material" is a term that includes aggregates of substances having arbitrary particle sizes. "Powder" is a concept that includes "powder", and as an aggregate, it has properties like fluid. That is, in the present specification, the term "granular material" includes aggregates that move or deform under arbitrary external force.

In the following description, a granular resin material is taken as an example of the powdery material, and a resin material supply device that supplies a predetermined weight of the granular resin material is taken as an example of the powdery material supply device. do. However, the granular material supplied by the granular material supply apparatus of the present invention is not limited to the granular resin material, and may be any material or substance.

An embodiment of a resin molding apparatus according to the present invention will be described below with reference to the drawings. It should be noted that all of the drawings shown below are schematically drawn with appropriate omissions or exaggerations for the sake of clarity. The same components are given the same reference numerals, and the description thereof is omitted as appropriate.

<Overall Configuration of Resin Molding Apparatus 100>
The resin molding apparatus 100 of the present embodiment manufactures a resin molded product P by sealing a component mounting surface on which electronic components are mounted on a substrate W on which electronic components such as semiconductor chips are mounted. be.

Examples of the substrate W include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, ceramic substrates, and the like. Further, the substrate W may be a carrier used for FOWLP (Fan Out Wafer Level Packaging) and FOPLP (Fan Out Panel Level Packaging). Furthermore, it may be one with wiring already applied, or one without wiring.

Specifically, as shown in FIG. 1, the resin molding apparatus 100 includes a substrate supply/storage module A, two resin molding modules B, and a resin material supply module C as constituent elements. Each component (each module A to C) is detachable and replaceable with respect to the respective component.

The substrate supply/accommodation module A includes a substrate supply unit 1 that supplies pre-sealed substrates W, a substrate storage unit 2 that stores sealed substrates W (resin molded products P), pre-sealed substrates W, and sealed substrates W. It has a substrate platform 3 for transferring the completed substrate W, and a substrate transfer mechanism 4 for transferring the substrate W before sealing and the substrate W after sealing. The substrate placement part 3 moves in the Y direction between a position corresponding to the substrate supply part 1 and a position corresponding to the substrate storage part 2 in the substrate supply/storage module A. As shown in FIG. The board transfer mechanism 4 moves in the X direction and the Y direction within the board supply/storage module A and each resin molding module B. As shown in FIG.

Each resin molding module B has a compression molding section 5 for molding resin on the substrate W. As shown in FIG. The compression molding unit 5 performs compression molding using a granular resin material P supplied from a resin material supply device 8, which will be described later, to manufacture a resin molded product P (compression molding step). Specifically, the compression molding unit 5 includes a lower mold 51 which is a first mold having a cavity 51C, an upper mold 52 which is a second mold for holding the substrate W, a lower mold 51 and an upper mold. and a mold clamping mechanism (not shown) for clamping the mold 52 .

The resin material supply module C includes a moving table 6, a resin material container 7 placed on the moving table 6, a resin material supply device 8 for supplying the resin material P to the resin material container 7, and a resin material container. It has a resin material transport mechanism 9 that transports the part 7 and supplies the resin material P to the cavity 51C of the lower mold. The resin material accommodating portion 7 has a recess 71 corresponding to the size of the cavity 51C. The moving table 6 is configured to move in the X direction and the Y direction within the resin material supply module C, and the resin material P dropped from the discharge port 122 of the resin material supply device 8 enters the concave portion of the resin material container 7 . It moves relative to the discharge port 122 of the resin material supply device 8 so that the inside of the resin material supply device 8 is spread evenly. The resin material transport mechanism 9 moves in the X direction and the Y direction within the resin material supply module C and each resin molding module B. As shown in FIG. Then, the resin material conveying mechanism 9 conveys the resin material accommodating portion 7 accommodating the resin material P to the lower mold 5 and supplies the resin material P to the cavity 51C (resin material supplying step).

<Resin material supply device 8>
Next, the resin material supply device 8 of this embodiment will be described in detail.

The resin material supply device 8 supplies a preset weight of the resin material P to the resin material container 7, and as shown in FIG. A reservoir 11, a transport path 12 for transporting the resin material P from the storage part 11, a vibrating part 13 for transporting the resin material P along the transport path 12 by vibrating at least the transport path 12, and the vibrating part. 13 is provided.

As shown in FIGS. 2 and 3, the reservoir 11 has, for example, a powder inlet 111 for introducing the resin material P at its upper portion, and an outlet port 112 for leading out the resin material P downwardly at its lower portion. formed. The outlet 112 opens downward in the horizontal direction, and the resin material P stored in the reservoir 11 moves downward under its own weight and is discharged from the outlet 112 . It should be noted that the resin material P is also facilitated to be led out from the lead-out port 112 by the vibration of the vibrating portion 13 .

As shown in FIGS. 2 and 3, the conveying path 12 has an inlet 121 connected to the outlet 112 of the reservoir 11 and extends laterally from the inlet 121 . In other words, the transport path 12 extends in a direction away from the reservoir 11 with the introduction port 121 as a starting point. Here, the horizontal direction is not limited to the horizontal direction, and may be inclined upward or downward from the horizontal direction.

The conveying path 12 of this embodiment is linear and is formed by a conveying member 15 (also referred to as a trough). The conveying member 15 has a linear groove that opens upward, and this linear groove serves as the conveying path 12 . The conveying member 15 is connected to the reservoir 11 such that the upper opening of the groove at one end thereof is aligned with the outlet port 112 of the reservoir 11 . An upper opening at one end of the conveying member 15 serves as an introduction port 121 formed along the horizontal direction, and the other end of the conveying member 15 is provided with a discharge port 122 for discharging the conveyed resin material P. ing. In addition, in the upper opening of the conveying member 15 , a cover member is provided to close the upper opening except for the connecting portion with the storage section 11 .

The vibrating section 13 vibrates the transport path 12 (transport member 15 ) to move the resin material P introduced from the introduction port 121 into the transport path 12 along the transport path 12 toward the discharge port 122 . be. The vibrating section 13 of the present embodiment is provided below the conveying path 12 and vibrates the conveying path 12 in a predetermined vibration mode (predetermined amplitude, frequency and vibration direction).

The control unit 14 feedback-controls the vibrating unit 13 so that the supply amount (supply flow rate) per unit time of the resin material P discharged from the discharge port 122 of the transport path 12 reaches a predetermined target value. Here, the predetermined target value is set using a control device (not shown) or the like according to the type of the substrate W to be resin-molded.

This embodiment has a weighing unit 16 for measuring the amount of resin material P supplied to the resin material storage unit 7 . The weighing unit 16 measures the weight of the storage unit 11 and the conveying member 15 together with the resin material P held therein. By vibrating the vibrating section 13, the resin material P in the conveying path 12 is discharged from the discharge port 122, so that the measured value by the weighing section 16 decreases. The supply amount of the resin material P can be measured from the difference between the measured value from the weighing unit 16 before the vibration of the vibrating unit 13 is started and the measured value from the weighing unit 16 after the vibration of the vibrating unit 13 is completed. Also, the amount of change per unit time of the measured value from the weighing unit 16 corresponds to the supply flow rate (g/s) of the resin material P.

Based on the measured value from the weighing unit 16, the control unit 14 feedback-controls the vibrating unit 13 so that the supply flow rate of the resin material P reaches the set target amount. More specifically, the control unit 14 adjusts the amplitude command value given to the vibrating unit 13 so as to change the amplitude of the vibrating unit 13 .

In addition, in the resin material supply device 8 shown in FIG. Alternatively, instead of the weighing unit 16, a weighing unit for measuring the weight of the resin material storage unit 7 and the resin material P held therein may be arranged. In this case also, the amount of resin material P to be supplied can be measured based on the difference between the measured values from the weighing unit before the start of vibration of the vibrating unit 13 and after the completion of the vibration. Also, the supply flow rate of the resin material P can be calculated based on the amount of change per unit time.

In the resin material supply device 8, the resin material P stored in the storage part 11 moves toward the discharge port 122 after being introduced from the introduction port 121 into the transport path 12 due to the vibration of the storage part 11 and the transport path 12. do. Then, the resin material P drops from the discharge port 122 and is supplied to the resin material container 7 .

Furthermore, as shown in FIGS. 2 and 3, the resin material supply device 8 of the present embodiment blocks the end portion side in the direction in which the transport path 12 extends at the connecting portion X between the storage section 11 and the transport path 12. A blocking member 17 is provided. Here, the connection portion X is specifically a connection portion between the outlet port 112 of the storage portion 11 and the inlet port 121 of the transport path 12, and is formed along the lateral direction (horizontal direction).

Specifically, the blocking member 17 blocks the end portion side in the direction in which the conveying path 12 extends at the connecting portion X. As shown in FIG. That is, the blocking member 17 blocks the end portion of the outlet port 112 of the storage portion 11 in the direction in which the transport path 12 extends, and blocks the end portion side of the direction in which the transport path 12 extends at the inlet 121 of the transport path 12 . do.

The blocking member 17 of the present embodiment is provided so as to face the side opposite to the direction in which the conveying path 12 extends from the end X1 of the connecting portion X in the direction in which the conveying path 12 extends. Specifically, as shown in the plan view of FIG. 3 , the blocking member 17 has an end portion X1 in the direction in which the conveying path 12 extends at the connecting portion X (the outlet port 112 of the storage portion 11 and the inlet port 121 of the conveying path 12). , to a predetermined position on the side opposite to the direction in which the conveying path 12 extends. The blocking member 17 of this embodiment has a flat plate shape provided along the direction in which the conveying path 12 extends.

By providing the blocking member 17 at the end portion side of the connecting portion X in the direction in which the conveying path 12 extends, the resin material P stored in the storage portion 11 is depleted under its own weight or as shown in FIG. 4(1). When the resin material P flows into the conveying path 12 due to the vibration of the vibrating section 13, it is blocked by the blocking member 17, and the resin material P moves toward the conveying path in the direction opposite to the moving direction of the resin material P in the conveying path 12 (conveying direction by the vibrating section 13). Flow into 12. At this time, one end of the conveying path 12 is a closed space and is temporarily clogged with the resin material P, thereby preventing the resin material P from unintentionally flowing down.

In the absence of the blocking member 17 (in the case of the conventional example), the resin material P stored in the storage section 11 is transported in the transport direction by the vibrating section 13 as shown in FIG. 4(2). It flows into the road 12. At this time, since the conveying path 12 is an open space facing the conveying direction of the vibrating portion 13, the resin material P unintentionally flows down as a lump. As a result, the resin material P tends to have a wavy distribution in the conveying path 12, and the feedback control becomes unstable.

Next, experimental results regarding the stability of the supply flow rate of the resin material P by the resin material supply device (this embodiment) provided with the blocking member 17 and the conventional resin material supply device (conventional example) not provided with the blocking member 17 are shown. show.

In this experiment, the target value [g/s] of the supply flow rate of the resin material P was set to 2.0 g/s, 1.0 g/s, and 0.5 g/s. In both the present embodiment and the conventional example, the vibration frequency (frequency) of the vibrating section 13 was fixed at 160.0 Hz, and the amplitude of the vibrating section 13 was adjusted to perform feedback control so as to achieve respective target values.

5 to 7 are histograms of the present embodiment and the conventional example when the resin material P is sprinkled 50 times at each target value. This histogram is created using the flow rate measured at 100 msec intervals for the period in which the supply flow rate falls within a predetermined range (1.5 seconds to 15 seconds after the start of vibration). Measured values [g/s] of the supply flow rate are shown, and the horizontal axis indicates the frequency (frequency) of each measured value.

As is clear from this histogram, the error with respect to the target value is smaller in this embodiment (configuration with the blocking member 17) than in the conventional example (configuration without the blocking member 17). That is, in FIG. 5, the frequency of the present embodiment is higher at the target value of 2.0 g/s than in the conventional example, and in FIG. The frequency of examples is higher than that of the conventional example, and in FIG. 7, the target value of 0.5
In g/s, the frequency of this embodiment is higher than that of the conventional example. Thus, it can be seen that the supply flow rate of the resin material P can be controlled with high precision by providing the blocking member 17 as in this embodiment.

<Effects of this embodiment>
According to the resin molding apparatus 100 of the present embodiment, the blocking member 17 blocks the end portion side in the direction in which the transport path 12 extends at the connecting portion X between the outlet port 112 of the storage section 11 and the inlet port 121 of the transport path 12 . Therefore, the direction in which the resin material P flows down from the reservoir 11 is opposite to the direction in which the conveying path 12 extends. This prevents the resin material P in the reservoir 11 from unintentionally flowing down in the direction in which the transport path 12 extends. The supply amount of the resin material P can be controlled with high accuracy. As a result, the thickness of the resin-molded product T can be made uniform, and when it is applied to the resin molding of electronic parts, even if there is a thin package, the package thickness can be made uniform.

<Other Modified Embodiments>
It should be noted that the present invention is not limited to the above embodiments.

For example, the shape of the blocking member 17 is not limited to a flat plate shape. Various shapes may be used as long as they do. For example, as shown in FIG. 8, an inclined surface 171 may be formed on the upper surface of the blocking member 17 so as to face the direction opposite to the direction in which the conveying path 12 extends. Although the shielding member 17 shown in FIG. 8 has a triangular cross-section, the flat shielding member 17 may be inclined. With this configuration, it is possible to suppress accumulation of the granular material on the upper surface of the blocking member 17 .

Further, although the conveying path 12 in the above-described embodiment has a straight shape, it may have a curved or curved shape as long as it extends laterally from the introduction port 121 .

In addition, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

100... Resin molding device P... Resin material (granular material)
T... Resin molded product 5... Compression molding unit 8... Resin material supply device (granular material supply device)
DESCRIPTION OF SYMBOLS 11... Storage part 112... Outlet 12... Conveyance path 121... Inlet 13... Vibration part X... Connection part 17... Blocking member

Claims (6)

a storage part for storing the granular material and formed with an outlet for discharging the granular material downward;
a transport path formed with an inlet connected to the outlet of the reservoir and extending laterally from the inlet;
a vibrating section that vibrates the storage section and the conveying path to move the granular material introduced from the introduction port along the conveying path;
A granular material supply device, comprising: a blocking member that blocks an end portion side in a direction in which the transport path extends, at a connecting portion of the outlet of the storage section and the introduction port of the transport path. 2. The granular material supply device according to claim 1, wherein said blocking member is provided at said connecting portion so as to extend from an end in a direction in which said conveying path extends toward a side opposite to a direction in which said conveying path extends. 3. The granular material supply device according to claim 1, wherein said blocking member has a flat plate shape. 3. The granular material supply device according to claim 1, wherein an upper surface of said blocking member is formed with an inclined surface facing a side opposite to a direction in which said conveying path extends. The granular material supply device according to any one of claims 1 to 4, which supplies a resin material that is a granular material;
A resin molding device, comprising: a compression molding unit that performs compression molding using the resin material supplied by the granular material supply device. A resin material supplying step of supplying a resin material, which is a granular material, by the granular material supply device according to any one of claims 1 to 4;
and a compression molding step of performing compression molding using the supplied resin material.

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