JP6270532B2 - Resin molding apparatus and resin molding method - Google Patents

Resin molding apparatus and resin molding method Download PDF

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JP6270532B2
JP6270532B2 JP2014032835A JP2014032835A JP6270532B2 JP 6270532 B2 JP6270532 B2 JP 6270532B2 JP 2014032835 A JP2014032835 A JP 2014032835A JP 2014032835 A JP2014032835 A JP 2014032835A JP 6270532 B2 JP6270532 B2 JP 6270532B2
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resin
liquid resin
molding
storage
mold
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JP2015157397A (en
Inventor
山田 哲也
哲也 山田
智行 後藤
智行 後藤
準子 高田
準子 高田
直己 藤原
直己 藤原
岩田 康弘
康弘 岩田
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Towa株式会社
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/10Feeding of the material to be moulded, e.g. into a mould cavity of several materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22Component parts, details or accessories; Auxiliary operations
    • B29C39/24Feeding the material into the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00Mixing; Kneading
    • B29B7/02Mixing; Kneading non-continuous, with mechanical mixing or kneading devices, i.e. batch type
    • B29B7/06Mixing; Kneading non-continuous, with mechanical mixing or kneading devices, i.e. batch type with movable mixing or kneading devices
    • B29B7/08Mixing; Kneading non-continuous, with mechanical mixing or kneading devices, i.e. batch type with movable mixing or kneading devices shaking, oscillating or vibrating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B7/00Mixing; Kneading
    • B29B7/80Component parts, details or accessories; Auxiliary operations
    • B29B7/88Adding charges, i.e. additives
    • B29B7/94Liquid charges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008Inserting articles into the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/1703Introducing an auxiliary fluid into the mould

Description

  The present invention stably stores liquid resin used for resin-sealing electronic components such as transistors, integrated circuits (ICs), and light emitting diodes (LEDs). The present invention relates to a resin molding apparatus and a resin molding method that can be performed. In the present application document, the term “liquid” means that it is liquid at room temperature and has fluidity, regardless of the degree of fluidity, in other words, the degree of viscosity.

  Conventionally, an optical element such as an LED is resin-sealed using a liquid resin that is thermosetting and transmits light, such as a silicone resin or an epoxy resin. As a resin sealing technique, a resin molding technique such as compression molding or transfer molding is used. In resin molding, a liquid resin as a main agent is mixed with a liquid resin as an auxiliary agent such as a curing agent, and the mixed liquid resin is cured by heating. Hereinafter, the liquid resin as the main agent is referred to as “main agent”, and the liquid resin produced by mixing the main agent and the curing agent is referred to as “mixed liquid resin”.

  In a resin molding apparatus using a liquid resin, two kinds of liquid resins (hereinafter referred to as “two liquids”) composed of a main agent and a curing agent are mixed when actually used to produce a mixed liquid resin. There are two-liquid mixing type apparatuses that use liquid resins, and one-liquid type apparatuses that use mixed liquid resins that have been mixed in advance with a main agent and a curing agent. Depending on the product and application, a two-component mixed type device or a one-component type device is used. The two-component mixing type apparatus includes a container filled with a main agent and a container filled with a curing agent. The main agent and the curing agent are stored in separate containers at room temperature, and the two liquids are mixed in a mixing container or the like when actually used. The mixing ratio of the main agent and the curing agent is adjusted according to the object to be molded, and the viscosity of the mixed liquid resin is optimized. In the one-liquid type apparatus, a mixed liquid resin that has been mixed in advance and produced into one liquid is filled in a container, and the mixed liquid resin is used.

  In LED resin sealing, a phosphor, a light diffusing agent, or the like is added as an additive to a liquid resin serving as a main agent in accordance with LED characteristics. The phosphor or light diffusing agent is a crystal, and does not dissolve in the liquid resin, but precipitates in the liquid resin over time. In the case of using either a two-component mixed type device or a one-component type device, the phosphor and the light diffusing agent added to the liquid resin are precipitated. When the phosphor and the light diffusing agent are precipitated, the viscosity and specific gravity of the liquid resin are changed to cause variation. In order to stably store the liquid resin, it is important to keep the phosphor and the light diffusing agent flowing in the liquid resin by a method such as stirring so as to maintain a uniform state.

  As a raw material mixing device that mixes a plurality of raw materials, “In a raw material mixing device that has a plurality of measuring containers and discharges each amount of raw materials from each measuring container at the same time, Stroke amount setting means for setting the amount to be variable; movement amount detection means for detecting (approximately) the movement amount of the piston; and (approximately) the movement amount of the piston detected by the movement amount detection means is a predetermined target value. And a control means for controlling the moving speed of the piston so as to be close to the “raw material mixing apparatus” (for example, refer to paragraph [0005] of FIG. 1 and FIG. 1).

JP-A-10-193345

  However, the raw material mixing apparatus disclosed in Patent Document 1 has the following problems. As shown in FIG. 1 of Patent Document 1, the raw material mixing apparatus includes a first measuring container 1 that measures a raw material A that is a main agent such as a sealing material, and a second material B that measures a raw material B that is a catalyst such as a sealing material. A measuring container 2 is provided. By changing the stroke amount of the piston 2a of the second measuring container 2, the raw material discharge amount of the first and second measuring containers 13 is set according to the mixing ratio of the raw materials A and B.

  Although not shown in Patent Document 1, before the raw material A and the raw material B are mixed, a wide variety of additives are added to the raw material A or the raw material B depending on the application. For example, a tackifier, a filler, a thickener, a pigment and the like are added to the raw material A or the raw material B. When the additive is added to the raw material A, the additive may not be dissolved in the raw material A. In this case, the additive floats in the raw material A and precipitates over time. When the additive is precipitated, variations occur in viscosity, specific gravity, etc., and it becomes difficult to keep the raw material A in a uniform state.

  The present invention solves the above-mentioned problems, and in a resin molding apparatus, even when an additive is added to the liquid resin, the liquid resin to be stored is stirred by flowing and added in the liquid resin. It aims at providing the resin molding apparatus and resin molding method which prevent that an agent precipitates.

In order to solve the above problems, a resin molding apparatus according to the present invention is provided in at least one of an upper mold, a lower mold provided opposite to the upper mold, and the lower mold and the upper mold. A cavity, a housing part containing at least a first liquid resin containing an additive and containing a raw material resin that should be cured in the cavity to become a cured resin, and a resin supply mechanism for supplying the raw material resin to the housing part And a mold-clamping mechanism for clamping a mold having at least an upper mold and a lower mold, and a resin molding apparatus that molds a molded product containing a cured resin, the first liquid resin storing the first liquid resin A storage unit, a stirring mechanism for stirring the first liquid resin by flowing the first liquid resin, a second storage unit for storing the second liquid resin, a first storage unit, and a second storage unit A connecting part for connecting the storage part, the first storage part and the second storage part. A flow mechanism for flowing together first and the liquid resin and a second liquid resin through the connecting portion between the parts, provided on the resin supply mechanism, a discharge for discharging toward the raw material resin in the housing portion A first supply port through which the first liquid resin is supplied from the first storage unit, and a second supply through which the second liquid resin is supplied from the second storage unit. And a delivery mechanism for delivering the raw material resin to the discharge section, and the flow mechanism is configured to start from the first supply port in a state where the delivery port is closed and the first supply port and the second supply port are opened. The first liquid resin is supplied into the connecting portion and the liquid resin in the connecting portion is injected into the second storage portion to flow, and the second liquid resin is supplied into the connecting portion from the second supply port. And a second operation in which the liquid resin in the connecting portion is injected into the first storage portion to flow. Characterized by stirring first with liquid resin and a second liquid resin by performing alternately switched.

  The resin molding apparatus according to the present invention is characterized in that, in the above-described resin molding apparatus, the stirring mechanism is a mechanism that vibrates at least the first storage unit.

  The resin molding apparatus according to the present invention is characterized in that, in the above-described resin molding apparatus, the stirring mechanism is a movable member that moves inside the first storage unit.

In order to solve the above-described problems, a resin molding apparatus according to the present invention includes a resin supply mechanism that supplies a raw material resin including a first liquid resin containing an additive and a second liquid resin to a storage unit, and a storage A mold clamping mechanism for clamping a mold having at least an upper mold and a lower mold facing each other so as to mold a molded product using the raw material resin supplied to the section, and a first liquid resin storing the first liquid resin Storage unit, a second storage unit for storing the second liquid resin, a connecting unit for connecting the first storage unit and the second storage unit, a first storage unit and a second storage unit A flow mechanism that causes the first liquid resin and the second liquid resin to flow through each other via the connecting portion, and a discharge portion that is provided in the resin supply mechanism and discharges the raw resin toward the housing portion. The connecting portion is provided with a first supply port through which the first liquid resin is supplied from the first storage portion. And a second supply port to which the second liquid resin is supplied from the second storage unit, and a delivery port for sending the raw material resin to the discharge unit, and the flow mechanism closes the delivery port and supplies the first supply. In a state where the opening and the second supply port are opened, the first liquid resin is supplied from the first supply port into the connecting portion, and the liquid resin in the connecting portion is injected into the second storage portion to flow. And the second operation in which the second liquid resin is supplied from the second supply port into the connecting portion and the liquid resin in the connecting portion is injected into the first storage portion to flow. By performing, the first liquid resin and the second liquid resin are agitated .

  In the resin molding apparatus according to the present invention, the first liquid resin and the second liquid resin are the same type in the above-described resin molding apparatus.

  Moreover, the resin molding apparatus according to the present invention is characterized in that, in the above-described resin molding apparatus, the first liquid resin and the second liquid resin are different types.

  Moreover, the resin molding apparatus according to the present invention is characterized in that in the above-described resin molding apparatus, a mixing member is provided inside the connecting portion.

  The resin molding apparatus according to the present invention is characterized in that, in the above-described resin molding apparatus, the first liquid resin has translucency, and the additive is a phosphor or a light diffusing agent.

  The resin molding apparatus according to the present invention is characterized in that, in the above-described resin molding apparatus, the additive includes a white pigment, and the cured resin has a function of reflecting light.

  In addition, the resin molding apparatus according to the present invention includes a supply module that receives the first liquid resin from the outside of the resin molding apparatus and supplies the first liquid resin toward the housing portion in the above-described resin molding apparatus, and molding At least one molding module having a mold and a mold clamping mechanism, the supply module and one molding module are connected, and the supply module and one molding module are detachable, and one molding The module is detachable from other molding modules.

In order to solve the above problems, a resin molding method according to the present invention includes a step of preparing a molding die having at least an upper die and a lower die provided opposite to the upper die, and an additive. A step of containing a raw material resin that contains at least a first liquid resin and is to be cured in a cavity provided in at least one of the lower mold and the upper mold into a cured resin; The resin molding method includes a step of filling the cavity using the raw material resin, a step of clamping the mold, and a step of curing the raw material resin in the cavity to form a cured resin. Preparing a first storage unit for storing the first liquid resin, storing the first liquid resin in the first storage unit, and flowing the first liquid resin to the first To stir liquid resin When a step of preparing a second second storage unit storing the liquid resin, comprising the steps storing a second liquid resin to the second storage unit, a first storage unit and the second storage unit A step of preparing a connecting portion for connecting the first liquid resin, a step of sending the first liquid resin from the first storage portion toward the discharge portion, and a raw material resin containing at least the first liquid resin sent from the discharge portion And a step of discharging toward the housing portion , wherein the connecting portion includes a first supply port to which the first liquid resin is supplied from the first storage portion, and a second liquid resin from the second storage portion. A second supply port to be supplied and a delivery port for sending the raw material resin to the discharge part are provided, and in the sending process, the liquid resin in the connection part is sent from the delivery port provided in the connection part toward the discharge part. In the agitation step, the delivery port is closed and the first supply port and the second supply port are opened. The first operation is to supply the first liquid resin from the first storage unit into the connection unit and to inject the liquid resin in the connection unit into the second storage unit to flow, and from the second storage unit to the second operation. And the second operation of injecting and flowing the liquid resin in the connection portion into the first storage portion and alternately switching the liquid resin in the connection portion to the first storage portion and the second liquid resin. The liquid resin is agitated .

  The resin molding method according to the present invention is characterized in that, in the above-described resin molding method, the first liquid resin is caused to flow by vibrating the first storage unit in the stirring step.

  In the resin molding method according to the present invention, in the resin molding method described above, in the stirring step, the first liquid resin is caused to flow by moving the movable member inside the first storage unit. And

In order to solve the above-described problems, a resin molding method according to the present invention includes a raw material resin that is discharged from a discharge portion and stored in a storage portion, including a first liquid resin containing an additive and a second liquid resin. Is a resin molding method in which a mold having at least an upper mold and a lower mold facing each other is clamped and resin molding is performed, wherein the first storage unit and the second storage unit store the first liquid resin. In a state in which the second storage for storing the liquid resin is connected by the connecting portion, the connecting portion is supplied from the first supply port to which the first liquid resin is supplied from the first storage portion and the second storage portion. A second supply port to which the second liquid resin is supplied and a delivery port for sending the raw material resin to the discharge part are provided. The liquid resin in the connection part is directed from the delivery port provided in the connection part to the discharge part. And the process of sending
Prior to the feeding step, the first liquid resin is supplied from the first storage unit into the connection unit and the connection unit in the connection unit in a state where the supply port is closed and the first supply port and the second supply port are opened. A first operation for injecting and flowing a liquid resin into the second storage unit; and supplying the second liquid resin from the second storage unit into the connecting unit and supplying the liquid resin in the connecting unit to the first storing unit. A step of agitating the first liquid resin and the second liquid resin by alternately switching and performing the second operation of injecting and flowing .

  The resin molding method according to the present invention is characterized in that, in the above-described resin molding method, the first liquid resin and the second liquid resin are of the same type.

  The resin molding method according to the present invention is characterized in that, in the above-described resin molding method, the first liquid resin and the second liquid resin are different types.

  Moreover, the resin molding method according to the present invention includes a step of mixing the first liquid resin and the second liquid resin by using a mixing member provided inside the connecting portion in the resin molding method described above. It is characterized by providing.

  The resin molding method according to the present invention is characterized in that, in the above-described resin molding method, the first liquid resin has translucency and the additive is a phosphor or a light diffusing agent.

  The resin molding method according to the present invention is characterized in that, in the above-described resin molding method, the additive includes a white pigment, and the cured resin has a function of reflecting light.

  In addition, the resin molding method according to the present invention includes a step of preparing a supply module that receives the first liquid resin and supplies the first liquid resin toward the housing portion in the above-described resin molding method, And a step of preparing at least one molding module having a clamping mechanism for clamping the molding die, wherein the supply module and one molding module are detachable, and one molding module is the other. It is detachable from the molding module.

  According to the present invention, a housing part that accommodates a raw material resin that should be cured into a cured resin in a cavity of the mold, a resin supply mechanism that supplies the raw material resin to the housing part, an upper mold, and a lower mold And a mold clamping mechanism for clamping a mold having at least. The first liquid resin containing the additive stored in the first storage unit is fluidized by the stirring mechanism. As a result, the additive contained in the first liquid resin flows together with the first liquid resin in the first storage unit. Accordingly, the additive is prevented from being precipitated in the first storage unit.

  Moreover, according to this invention, a 1st storage part and a 2nd storage part are connected by a connection part. The flow mechanism causes the first liquid resin stored in the first storage unit and the second liquid resin stored in the second storage unit to flow through each other through the connecting unit. Accordingly, the additive flows in the first liquid resin and the second liquid resin, so that the additive is prevented from being precipitated in the first storage unit or the second storage unit.

In the resin molding apparatus which concerns on this invention, it is the schematic which shows Example 1 of the supply mechanism which supplies mixed liquid resin. In the resin molding apparatus which concerns on this invention, it is the schematic which shows Example 2 of the supply mechanism which supplies mixed liquid resin. In the resin molding apparatus which concerns on this invention, it is the schematic which shows Example 3 of the supply mechanism which supplies mixed liquid resin. It is a top view which shows the outline | summary of the resin molding apparatus which concerns on this invention. It is the schematic which shows the supply mechanism in Example 4 of the resin molding apparatus which concerns on this invention. FIG. 5A is a schematic partial sectional view showing a state in which the supply mechanism supplies the mixed liquid resin to the cavity of the movable lower mold, and FIG. 5B is a schematic plan view showing the supply mechanism. It is the schematic which shows the supply mechanism in Example 5 of the resin molding apparatus which concerns on this invention. FIG. 6A is a schematic partial sectional view showing a state in which the supply mechanism supplies the mixed liquid resin to the cavity of the movable lower mold, and FIG. 6B is a schematic plan view showing the supply mechanism.

  As shown in FIG. 1, at least one of the cartridge 4 for storing the mixed liquid resin 6 to which the phosphor 5 is added, the storage portion 9 for the mixed liquid resin 6 provided in the dispenser 3, and the static mixer 11 is provided. A stirring mechanism MOV is provided. The mixed liquid resin 6 is stirred by providing the stirring mechanism MOV. Since the mixed liquid resin 6 is stirred, the phosphor 5 added to the mixed liquid resin 6 flows together with the mixed liquid resin 6. Therefore, it can prevent that the fluorescent substance 5 precipitates.

  As shown in FIG. 2, the liquid resin storage mechanism 2 is provided with a plurality of cartridges 4 </ b> A and 4 </ b> B and a connecting portion 16 </ b> A that connects the cartridges. The mixed liquid resin 6 stored in each of the cartridges 4A and 4B is appropriately pressurized with compressed air supplied from the compressor 13. As a result, in each cartridge 4A, 4B, the mixed liquid resin 6 to which the phosphor 5 is added flows through the connecting portion 16A. By causing the mixed liquid resin 6 to flow between the cartridges 4 </ b> A and 4 </ b> B, the phosphor 5 added to the mixed liquid resin 6 flows together with the mixed liquid resin 6. Therefore, it can prevent that the fluorescent substance 5 precipitates.

  Embodiment 1 of a supply mechanism for supplying a mixed liquid resin in a resin molding apparatus according to the present invention will be described with reference to FIG. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

  Hereinafter, in each Example, the case where resin sealing an LED chip is demonstrated. When the LED chip is resin-sealed, a thermosetting silicone resin or an epoxy resin is used as the liquid resin. A phosphor is added to the liquid resin in order to create a color that the LED emits light. The phosphor is powder (powder crystal) and does not dissolve in the liquid resin. Therefore, the phosphor floats in the liquid resin and precipitates in the container with the passage of time.

  As shown in FIG. 1, a supply mechanism 1 that supplies a mixed liquid resin includes a liquid resin storage mechanism 2 that stores the liquid resin, and a dispenser 3 that is a discharge mechanism that discharges the mixed liquid resin. The liquid resin storage mechanism 2 includes a cartridge 4 that stores the liquid resin. The liquid resin storage mechanism 2 is provided with a required number of cartridges 4 according to the type of liquid resin to be used and the production amount.

  The liquid resin includes a liquid resin as a main agent, a liquid resin as a curing agent, a mixed liquid resin produced by mixing the main agent and the curing agent in advance, and a liquid resin as a main agent to which additives such as phosphors are added. A mixed liquid resin to which an additive such as a phosphor is added is stored in the cartridge 4 according to the application. Therefore, the term “liquid resin” refers to a liquid resin in any of these states.

  FIG. 1 shows a case in which a mixed liquid resin 6 produced by mixing a main agent to which an additive such as a phosphor 5 has been added in advance and a curing agent into one liquid is stored in the cartridge 4. The phosphor 5 is a powdery crystal and does not dissolve in the mixed liquid resin 6. Therefore, the phosphor 5 floats in the mixed liquid resin 6 and settles in the cartridge 4 with time. A plunger 7 for pressing and feeding the mixed liquid resin 6 is provided in the cartridge 4. The cartridge 4 and the dispenser 3 are connected by a fluororesin tube 8 that is a pipe. The fluororesin tube 8 preferably has pressure resistance, heat resistance, flexibility, and the like.

  The dispenser 3 shown in FIG. 1 is a so-called one-component dispenser that uses a mixed liquid resin. The one-liquid type dispenser 3 is fed with a storage unit 9 for storing the mixed liquid resin 6 transferred from the cartridge 4, and a metering delivery mechanism 10 for measuring and sending the stored mixed liquid resin 6 by a predetermined amount. The static mixer 11 that is a static mixing member that stirs the mixed liquid resin 6 and the nozzle 12 that is a discharge unit that discharges the mixed liquid resin 6 are connected and integrated.

  As the metering delivery mechanism 10, for example, a combination of a servo motor and a ball screw can be used. The delivery amount of the mixed liquid resin 6 to be delivered can be accurately controlled by the rotation speed of the servo motor. In addition to the servo motor, a combination of a stepping motor and a ball screw, a uniaxial eccentric screw system, an air cylinder or other delivery means can be used.

  At least one of the cartridge 4 for storing the mixed liquid resin 6 to which the phosphor 5 is added, the storage unit 9 provided in the dispenser 3, and the static mixer 11 includes an agitation mechanism MOV ( A portion schematically shown by a dotted line in the figure) is provided. For example, as the stirring mechanism MOV, a vibration mechanism that applies vibration to the mixed liquid resin 6 to which the phosphor 5 is added, a swing mechanism that swings the mixed liquid resin 6, or the like is used. About the stirring mechanism MOV, the same thing can be used also in each Example mentioned later.

  The compressor 13 is a pressurizing mechanism that generates compressed air for pressurizing the mixed liquid resin 6 via the plunger 7. The compressor 13 and the cartridge 4 are connected by a nylon tube 14. The nylon tube 14 preferably has flexibility. Compressed air is supplied from the compressor 13 through the nylon tube 14 to the cartridge 4. An electropneumatic regulator 15 that controls the pressure of the compressed air is provided between the compressor 13 and the cartridge 4.

  Hereinafter, an operation in which the supply mechanism 1 supplies the mixed liquid resin 6 will be described. First, compressed air is supplied to the cartridge 4 from the compressor 13 through the nylon tube 14 and the electropneumatic regulator 15 in order. The plunger 7 is pressed using the compressed air supplied into the cartridge 4. The pressed plunger 7 descends and presses the mixed liquid resin 6 to which the phosphor 5 is added. Thus, the mixed liquid resin 6 is transferred to the storage portion 9 provided in the dispenser 3 via the fluororesin tube 8.

  The mixed liquid resin 6 transferred to the storage unit 9 is sent to the static mixer 11 using the metering delivery mechanism 10. The mixed liquid resin 6 to which the phosphor 5 is added is stirred using the static mixer 11. A mixed liquid resin 6 serving as a raw material resin is discharged from a nozzle 12 provided at the tip of the dispenser 3.

  According to the present embodiment, the stirring mechanism MOV is provided in the cartridge 4 for storing the mixed liquid resin 6 to which the phosphor 5 is added, the storage section for the mixed liquid resin 6 provided in the dispenser 3, and the static mixer 11. be able to. By providing the stirring mechanism MOV, the mixed liquid resin 6 to which the phosphor 5 is added can be flowed. Since the mixed liquid resin 6 flows, the phosphor 5 added to the mixed liquid resin 6 flows together with the mixed liquid resin 6. Therefore, it can prevent that the fluorescent substance 5 precipitates. Since the phosphor 5 can be prevented from precipitating, it is possible to prevent variations in the specific gravity and viscosity of the mixed liquid resin 6 to which the phosphor 5 is added.

  As the stirring mechanism MOV, a vibration mechanism using resonance, ultrasonic waves, a piezoelectric element, or the like can be used. A vibration mechanism can be provided around the cartridge 4, the reservoir 9 provided in the dispenser 3, and the static mixer 11. Of the cartridge 4, the reservoir 9 of the dispenser 3, and the static mixer 11, a component that provides a vibration mechanism may be selected as necessary. By the vibration mechanism, vibration is given to the mixed liquid resin 6 to which the phosphor 5 is added. By applying vibration, the phosphor 5 added to the mixed liquid resin 6 flows in the mixed liquid resin 6. Therefore, it can prevent that the fluorescent substance 5 precipitates.

  Further, as the stirring mechanism MOV, a mechanism for swinging the mixed liquid resin 6 can be used. For example, a mechanism for rotating the storage unit 9 provided in the cartridge 4 or the dispenser 3 can be provided as the swinging mechanism. By rotating the cartridge 4 or the storage unit 9, the mixed liquid resin 6 stored therein flows. Since the mixed liquid resin 6 flows, the phosphor 5 added to the mixed liquid resin 6 flows together with the mixed liquid resin 6. Therefore, the phosphor 5 can be prevented from being precipitated in the cartridge 4 or the storage unit 9.

  Further, as the stirring mechanism MOV, a movable member that moves inside the cartridge 4 or the storage unit 9 can be provided. For example, like a magnetic stirrer, a stirrer in which a bar magnet is sealed with a fluororesin is accommodated or inserted into the cartridge 4 or the storage unit 9. The stirrer is rotated from the outside using magnetic force. Thereby, the mixed liquid resin 6 is stirred, and the phosphor 5 added to the mixed liquid resin 6 is also stirred together with the mixed liquid resin 6. Therefore, the phosphor 5 can be prevented from being precipitated in the cartridge 4 or the storage unit 9.

  Embodiment 2 of a supply mechanism for supplying a mixed liquid resin according to the present invention will be described with reference to FIG. The difference from the first embodiment is that two cartridges are provided as the liquid resin storage mechanism 2. The mixed liquid resin 6 to which the phosphor 5 is added is stored in the two cartridges 4A and 4B. Since the configuration of the two cartridges 4A and 4B and the dispenser 3 is the same as that of the first embodiment, the description thereof is omitted. In the liquid resin storage mechanism 2 and the dispenser 3, the same components will be described with reference numerals such as A, B, C, and D as appropriate.

  As shown in FIG. 2, the liquid resin storage mechanism 2 includes two cartridges 4A and 4B and a connecting portion 16A that connects the cartridges 4A and 4B. The connecting portion 16A includes supply ports 17A and 17B that receive the mixed liquid resin 6 delivered from the cartridges 4A and 4B, and a delivery port 18A that transfers the mixed liquid resin 6 supplied into the connecting portion 16A to the dispenser 3. Prepare. Static mixers 19A and 19B, which are static mixing members for stirring the mixed liquid resin 6 delivered from the cartridges 4A and 4B, are provided inside the connecting portion 16A. The static mixers 19A and 19B are provided from the vicinity of the supply ports 17A and 17B toward the delivery port 18A. Depending on the viscosity of the mixed liquid resin 6, the number of elements of the static mixers 19A and 19B is optimized. Further, depending on the viscosity of the mixed liquid resin 6, the static mixers 19A and 19B may not be provided.

  The delivery port 18A of the connecting part 16A is connected to the storage part 9 of the dispenser 3 by a fluororesin tube 8A. The mixed liquid resin 6 is transferred from the cartridges 4A and 4B to the storage portion 9 of the dispenser 3 via the connecting portion 16A and the fluororesin tube 8A sequentially. In the connecting portion 16A, the opening and closing of the supply ports 17A and 17B and the outlet 18A is controlled by an on-off valve (not shown).

  Cartridges 4A and 4B for storing the mixed liquid resin 6 to which the phosphor 5 is added, a connecting portion 16A for connecting the cartridges 4A and 4B, a reservoir 9 for the mixed liquid resin 6 provided in the dispenser 3, and static At least one of the mixers 11 can be provided with a stirring mechanism MOV (portion schematically shown by a dotted line in the figure) for stirring the mixed liquid resin 6.

  Similarly to the first embodiment, the cartridges 4 </ b> A and 4 </ b> B and the compressor 13 are connected by a nylon tube 14. Compressed air is supplied from the compressor 13 to one of the two cartridges 4A and 4B using a switching valve (not shown). FIG. 2 shows a case where two cartridges 4A and 4B are provided. Three or more cartridges may be provided.

  Hereinafter, the operation for preventing the phosphor 5 added to the mixed liquid resin 6 from being precipitated in the mixed liquid resin 6 in the liquid resin storage mechanism 2 according to the present invention will be described. First, in the connecting portion 16A, an opening / closing valve (not shown) is used to open the supply ports 17A and 17B with the delivery port 18A closed. Next, for example, compressed air is supplied from the compressor 13 to the cartridge 4A. Using the compressed air supplied to the cartridge 4A, the plunger 7A is pressed. The pressed plunger 7A descends to press the mixed liquid resin 6 to which the phosphor 5 is added, and sends the mixed liquid resin 6 into the connecting portion 16A from the supply port 17A. The delivered mixed liquid resin 6 is sequentially stirred by static mixers 19A and 19B provided in the connecting portion 16A. The phosphor 5 is caused to flow together with the mixed liquid resin 6 by stirring. The stirred mixed liquid resin 6 is injected into the cartridge 4B from the supply port 17B. The injected mixed liquid resin 6 and the mixed liquid resin 6 stored in the cartridge 4B are merged.

  Next, the supply destination of the compressed air supplied from the compressor 13 is switched from the cartridge 4A to the cartridge 4B using a switching valve. The compressed air supplied to the cartridge 4B is used to press the plunger 7B, and the mixed liquid resin 6 to which the phosphor 5 joined in the cartridge 4B is added is sent from the supply port 17B into the connecting portion 16A. The sent mixed liquid resin 6 is sequentially stirred by static mixers 19B and 19A provided in the connecting portion 16A. The phosphor 5 is caused to flow together with the mixed liquid resin 6 by stirring. The stirred mixed liquid resin 6 is injected into the cartridge 4A from the supply port 17A. The injected mixed liquid resin 6 and the mixed liquid resin 6 remaining in the cartridge 4A are merged.

  Next, the supply destination of the compressed air supplied from the compressor 13 is switched from the cartridge 4B to the cartridge 4A using a switching valve. The compressed air supplied to the cartridge 4A is used to press the plunger 7A, and the mixed liquid resin 6 merged in the cartridge 4A is sent again from the supply port 17A into the connecting portion 16A. By repeating such an operation, the mixed liquid resin 6 to which the phosphor 5 is added flows between the cartridge 4A and the cartridge 4B via the connecting portion 16A. The mixed liquid resin 6 flowing in the connecting portion 16A is stirred by the static mixers 19A and 19B provided in the connecting portion 16A. In this way, the phosphor 5 added to the mixed liquid resin 6 is caused to flow and further stirred to prevent the phosphor 5 from being precipitated. Therefore, even when the phosphor 5 is added, the mixed liquid resin 6 can be stored in each cartridge 4A, 4B in a uniform state.

  Next, the operation of transferring the mixed liquid resin 6 from the liquid resin storage mechanism 2 to the dispenser 3 will be described. First, in the connecting portion 16A, for example, the supply port 17A and the delivery port 18A are opened while the supply port 17B is closed using an on-off valve (not shown). Next, compressed air is supplied from the compressor 13 to the cartridge 4A. Using the supplied compressed air, the plunger 7A is pressed, and the mixed liquid resin 6 to which the phosphor 5 is added is sent from the supply port 17A into the connecting portion 16A. The mixed liquid resin 6 delivered from the cartridge 4A is stirred by a static mixer 19A provided in the connecting portion 16A. The phosphor 5 is caused to flow together with the mixed liquid resin 6 by stirring. The stirred mixed liquid resin 6 is transferred from the outlet 18A of the connecting portion 16A to the storage portion 9 of the dispenser 3 via the fluororesin tube 8A.

  In the connecting portion 16A, the supply port 17B and the delivery port 18A may be opened with the supply port 17A closed, and the mixed liquid resin 6 stored in the cartridge 4B may be transferred to the dispenser 3. Furthermore, the supply port 17A, the supply port 17B, and the delivery port 18A are all opened, and compressed air can be supplied to both the cartridges 4A and 4B to transfer the mixed liquid resin 6 to the dispenser 3.

  According to the present embodiment, the liquid resin storage mechanism 2 includes the plurality of cartridges 4A and 4B and the connecting portion 16A that connects the cartridges. The plurality of cartridges 4A and 4B are connected by the connecting portion 16A. Thereby, between each cartridge 4A, 4B, the mixed liquid resin 6 with which the fluorescent substance 5 was added can be made to flow mutually via the connection part 16A. The phosphor 5 is caused to flow together with the mixed liquid resin 6 by flowing the mixed liquid resin 6 between the cartridges 4A and 4B. This can prevent the phosphor 5 from being precipitated. Therefore, it is possible to prevent variation in specific gravity and viscosity of the mixed liquid resin 6.

  Further, the static mixers 19A and 19B can be provided inside the connecting portion 16A. The mixed liquid resin 6 flowing between the cartridges 4A and 4B is stirred by the static mixers 19A and 19B. By stirring the mixed liquid resin 6 to which the phosphor 5 is added, the phosphor 5 is caused to flow together with the mixed liquid resin 6. This can prevent the phosphor 5 from being precipitated. Therefore, it is possible to prevent variation in specific gravity and viscosity of the mixed liquid resin 6.

  Further, the pressure of the compressed air supplied from the compressor 13 can be controlled using the electropneumatic regulator 15. By controlling the pressure of the compressed air, the delivery amount and delivery speed of the mixed liquid resin 6 delivered from each cartridge 4A, 4B can be controlled according to the viscosity of the mixed liquid resin 6. Furthermore, the pressure of compressed air can be controlled in multiple stages, and the delivery amount and delivery speed of the mixed liquid resin 6 can be controlled more accurately. By controlling the pressure of the compressed air in this way, the mixed liquid resin 6 can be stably transferred to the storage portion 9 of the dispenser 3.

  Further, the cartridges 4A and 4B for storing the mixed liquid resin 6 to which the phosphor 5 is added, the connecting portion 16A for connecting the cartridges 4A and 4B, the storage portion 9 for the mixed liquid resin 6 provided in the dispenser 3, and At least one of the static mixers 11 can be provided with a stirring mechanism MOV for stirring the mixed liquid resin 6. By providing the stirring mechanism MOV, the mixed liquid resin 6 can be stirred. Since the mixed liquid resin 6 is stirred, the phosphor 5 added to the mixed liquid resin 6 flows together with the mixed liquid resin 6. Therefore, it can prevent that the fluorescent substance 5 precipitates. Since the phosphor 5 can be prevented from precipitating, it is possible to prevent variations in the specific gravity and viscosity of the mixed liquid resin 6 to which the phosphor 5 is added.

  Embodiment 3 of a supply mechanism for supplying a mixed liquid resin according to the present invention will be described with reference to FIG. The difference from the second embodiment is that a so-called two-liquid mixing type dispenser 3 is used, which is mixed when a liquid resin as a main agent and a curing agent as an auxiliary agent are actually used. FIG. 3 shows a case where two cartridges for storing the main agent and the curing agent are provided.

  As shown in FIG. 3, the cartridges 4A and 4B store a liquid resin as the main agent 20 to which the phosphor 5 is added. As the liquid resin used as the main agent 20, a silicone resin, an epoxy resin, or the like is used. In the cartridges 4C and 4D, a curing agent 21 serving as an auxiliary agent is stored.

  The cartridges 4A and 4B that store the main agent 20 are connected by a connecting portion 16A. Similarly, the cartridges 4C and 4D that store the curing agent 21 are connected by a connecting portion 16C. The configurations of the cartridges 4A and 4B and the connecting portion 16A and the configurations of the cartridges 4C and 4D and the connecting portion 16C are the same as those in the second embodiment, and the description thereof is omitted. FIG. 3 shows a case where two cartridges for storing the main agent 20 and two cartridges for storing the curing agent 21 are provided. Not limited to this, three or more cartridges may be provided.

  The delivery port 18A of the connecting portion 16A connecting the main agent cartridges 4A and 4B is connected to the main agent storage portion 9A provided in the dispenser 3 by the fluororesin tube 8A. The delivery port 18C of the connecting portion 16C that connects the hardener cartridges 4C and 4D is connected to the hardener storage portion 9C provided in the dispenser 3 by the fluororesin tube 8C.

  Main agent metering mechanism 10A is connected to main agent reservoir 9A. The curing agent metering mechanism 10C is connected to the curing agent reservoir 9C. Both the main agent reservoir 9 </ b> A and the hardener reservoir 9 </ b> C are connected to a common space called the mixing chamber 22.

  A static mixer 11 serving as a mixing member is connected to the mixing chamber 22. The mixing chamber 22 and the static mixer 11 together constitute a mixing unit that mixes the main agent 20 and the curing agent 21. A nozzle 12 that is a discharge unit is attached to the tip of the static mixer 11.

  At least one of the cartridges 4A and 4B for storing the main agent 20 to which the phosphor 5 is added, the connecting portion 16A for connecting the cartridges 4A and 4B, the main agent reservoir 9A provided in the dispenser 3, and the static mixer 11 First, a stirring mechanism MOV can be provided. The main agent 20 can be stirred by providing the stirring mechanism MOV. Since the main agent 20 is agitated, the phosphor 5 added to the main agent 20 flows together with the main agent 20. Therefore, it can prevent that the fluorescent substance 5 precipitates. Since it can prevent that the fluorescent substance 5 precipitates, it can prevent that dispersion | variation generate | occur | produces in the specific gravity, the viscosity, etc. of the main ingredient 20 to which the fluorescent substance 5 was added.

  An operation of mixing the main agent 20 and the curing agent 21 in the two-liquid mixing type dispenser 3 will be described. The main agent 20 to which the phosphor 5 is added is transferred from one of the cartridges 4A and 4B to the main agent storage portion 9A provided in the dispenser 3 through the connecting portion 16A and the fluororesin tube 8A sequentially. . The curing agent 21 is transferred from either one of the cartridges 4C and 4D to the curing agent reservoir 9C provided in the dispenser 3 via the connecting portion 16C and the fluororesin tube 8C in this order.

  Using the metering delivery mechanism 10A, the main agent 20 transferred to the reservoir 9A is delivered from the reservoir 9A to the mixing chamber 22. The curing agent 21 transferred to the storage unit 9C is sent from the storage unit 9C to the mixing chamber 22 using the metering delivery mechanism 10C. In the mixing chamber 22, the main agent 20 and the curing agent 21 are merged. The main agent 20 and the curing agent 21 which have started to be mixed and mixed in the mixing chamber 22 are further mixed using the static mixer 11. As a result, a mixed liquid resin serving as a raw material resin to which the phosphor 5 is added is generated. The mixed liquid resin to which the phosphor 5 is added is discharged from the nozzle 12 of the dispenser 3.

  According to the present embodiment, the outlets 18A and 18C of the connecting portions 16A and 16C are closed except when the main agent 20 and the curing agent 21 are transferred to the dispenser 3. In the connecting portion 16A, the supply ports 17A and 17B connected to the main cartridges 4A and 4B are opened, and the main agent 20 to which the phosphor 5 is added flows between the cartridges 4A and 4B. As a result, the phosphor 5 added to the main agent 20 can flow together with the main agent 20. Therefore, it is possible to prevent variation in the specific gravity and viscosity of the main agent 20 to which the phosphor 5 is added without the phosphor 5 being precipitated in each cartridge 4A, 4B.

  Further, the main agent 20 flowing between the cartridges 4A and 4B is agitated using the static mixers 19A and 19B provided inside the connecting portion 16A. The phosphor 5 is caused to flow together with the main agent 20 by stirring the main agent 20. Therefore, it is possible to prevent the phosphor 5 from precipitating and to prevent variations in the specific gravity and viscosity of the main agent 20 to which the phosphor 5 is added.

  Further, the cartridges 4A and 4B for storing the main agent 20 to which the phosphor 5 is added, the connecting portion 16A for connecting the cartridges 4A and 4B, the main agent storage portion 9A provided in the dispenser 3, and the static mixer 11 At least one can be provided with a stirring mechanism MOV. The main agent 20 can be stirred by providing the stirring mechanism MOV. Since the main agent 20 is agitated, the phosphor 5 added to the main agent 20 flows together with the main agent 20. Therefore, it can prevent that the fluorescent substance 5 precipitates. Since it can prevent that the fluorescent substance 5 precipitates, it can prevent that dispersion | variation generate | occur | produces in the specific gravity, the viscosity, etc. of the main ingredient 20 to which the fluorescent substance 5 was added.

  In FIG. 3, the cartridges 4C and 4D that store the curing agent 21 are also connected by the connecting portion 16C. If an additive that precipitates in the curing agent 21 is included, static mixers 19C and 19D may be provided in the connecting portion 16C. When the additive which precipitates in the curing agent 21 is not included, the connecting portion 16C may not be provided. In this case, the cartridges 4C, 4D and the curing agent storage portion 9C provided in the dispenser 3 are directly connected by the fluororesin tube 8C.

  With reference to FIG. 4 and FIG. 5, Example 4 of the resin molding apparatus which concerns on this invention is demonstrated. The resin molding apparatus 23 shown in FIG. 4 includes a substrate supply / storage module 24, four molding modules 25A, 25B, 25C, and 25D, and a liquid resin supply module 26 as components. The substrate supply / storage module 24, the molding modules 25A, 25B, 25C, and 25D, and the liquid resin supply module 26, which are constituent elements, can be attached to and detached from other constituent elements, and can be replaced. Can be done. For example, in a state where the substrate supply / storage module 24 and the molding module 25A are mounted, the molding module 25B can be mounted on the molding module 25A, and the liquid resin supply module 26 can be mounted on the molding module 25B.

  The substrate supply / storage module 24 includes a pre-sealing substrate supply unit 28 that supplies the pre-sealing substrate 27 and a sealed substrate storage unit 30 that stores the sealed substrate 29. The substrate supply / storage module 24 includes a loader 31 and an unloader 32, and a rail 33 that supports the loader 31 and the unloader 32 is provided along the X direction. The loader 31 and the unloader 32 move along the rail 33.

  The loader 31 and unloader 32 supported by the rail 33 move in the X direction between the substrate supply / storage module 24, the molding modules 25A, 25B, 25C, 25D and the liquid resin supply module 26. Therefore, in a state where the substrate supply / storage module 24 and the molding module 25A are mounted, the loader 31 and the unloader 32 move along the direction (X direction) in which the substrate supply / storage module 27 and the molding module 25A are arranged. .

  In addition, the loader 31 and the unloader 32 move in the Y direction. That is, the loader 31 and the unloader 32 move in the horizontal direction. In the present application document, the terms horizontal direction and vertical direction include not only the strict horizontal direction and vertical direction but also the case where the direction is tilted to the extent that it does not interfere with the operation of the moving component.

  Each molding module 25A, 25B, 25C, 25D is provided with a movable lower mold 34 that can be moved up and down, and a fixed upper mold (not shown, see FIG. 5) disposed opposite to the movable lower mold 34. The fixed upper mold and the movable lower mold 34 constitute a mold. Each molding module has a clamping mechanism 35 (a circular portion indicated by a two-dot chain line) for clamping and opening the fixed upper mold and the movable lower mold 34. A cavity 36 to which the mixed liquid resin is supplied is provided in the movable lower mold 34, and the cavity 36 is covered with a release film 37 (a rectangular portion indicated by a two-dot chain line). Note that the movable lower mold 34 and the fixed upper mold only need to move relative to each other so that the mold can be clamped and opened.

  The liquid resin supply module 26 is provided with a supply mechanism 1. The supply mechanism 1 is supported by the rail 33 and moves along the rail 33. Accordingly, in a state where the liquid resin supply module 26 and the molding module 25D are mounted, the supply mechanism 1 moves along the direction (X direction) in which the liquid resin supply module 26 and the molding module 25D are arranged.

  The supply mechanism 1 is configured by integrating a liquid resin storage mechanism 2 and a dispenser 3. The liquid resin storage mechanism 2 is provided with a plurality of cartridges 4A and 4B and a connecting portion 16A for connecting the cartridges. The supply mechanism 1 includes a dispenser 3 corresponding to a use and a liquid resin storage mechanism 2 corresponding to the dispenser 3. The dispenser 3 shown in FIG. 4 is the same as the one-component dispenser shown in the second embodiment. In this case, two cartridges 4A and 4B for storing the mixed liquid resin 6 to which the phosphor 5 is added are provided. The cartridges 4A, 4B and the dispenser 3 are connected to each other by a fluororesin tube 8A (see FIG. 5) via the connecting portion 16A.

  The liquid resin supply module 26 is provided with a moving mechanism 38. The supply mechanism 1 supported by the rail 33 is moved in the X direction along the rail 33 by the moving mechanism 38. More specifically, the supply mechanism 1 moves between the liquid resin supply module 26 and the molding modules 25A, 25B, 25C, and 25D. The dispenser 3 moves in the Y direction. In addition, the supply mechanism 1 itself may be moved in the Y direction.

  In addition, in this application document, the terms “integrated and configured”, “integrated”, “integrated”, etc., indicate that multiple components can be moved together as a group. Means. Terms such as “integrated and configured”, “integrated”, and “integrally” include cases where a plurality of components that can move together can be separated from each other. In addition, expressions such as “C in which A and B are integrated” do not exclude that C includes components other than A and B.

  The liquid resin supply module 26 includes a vacuuming mechanism 39 that forcibly sucks and discharges air from the cavity 36 in a state where the fixed upper mold and the movable lower mold 34 are clamped in the molding modules 25A, 25B, 25C, and 25D. Is provided. The liquid resin supply module 26 is provided with a control unit 40 that controls the operation of the entire resin molding apparatus 23. In FIG. 4, the case where the evacuation mechanism 39 and the control unit 40 are provided in the liquid resin supply module 26 is shown. Not only this but the vacuuming mechanism 39 and the control part 40 may be provided in another module.

  A mechanism in which the supply mechanism 1 supplies the mixed liquid resin 6 to the cavity 36 will be described with reference to FIGS. 4 and 5. As shown in FIG. 5A, each molding module 25A, 25B, 25C, 25D (see FIG. 4) is provided with a fixed upper die 41, a movable lower die 34, and a film pressing member 42. At least the fixed upper die 41 and the movable lower die 34 constitute a molding die. Each molding module 25A, 25B, 25C, 25D has a mold clamping mechanism 35 (see FIG. 4) for clamping the mold and opening the mold.

  The release film 37 covers the cavity 36 and its periphery. The film pressing member 42 is a member for pressing and fixing the release film 37 to the mold surface of the movable lower mold 34 around the cavity 36. The film pressing member 42 has an opening at the center, and the mold is located inside the opening. For example, the pre-sealing substrate 27 on which the LED chip 43 or the like is mounted is fixed to the fixed upper die 41 by suction or clamping. The movable lower mold 34 is provided with an overall cavity 36 and individual cavities 44 corresponding to the respective LED chips 43 in the overall cavity 36.

  A release film 37 is supplied so as to cover the entire surface of the entire cavity 36. Around the entire cavity 36, the release film 37 is pressed and fixed to the mold surface of the movable lower mold 34 by the film pressing member 42. The release film 37 is adsorbed along the mold surface of each individual cavity 44. FIG. 5A shows a case where the film pressing member 42 is used. Not only this but the release film 37 and the film pressing member 42 do not need to be used.

  As shown in FIG. 5B, the supply mechanism 1 is configured by integrating a liquid resin storage mechanism 2 and a dispenser 3. The dispenser 3 shown in FIG. 5 is the one-liquid type dispenser shown in FIG. The liquid resin storage mechanism 2 is provided with cartridges 4A and 4B for storing the mixed liquid resin 6 and a connecting portion 16A for connecting the cartridges 4A and 4B. A phosphor 5 is added to the mixed liquid resin 6. Each cartridge 4A, 4B is connected to the storage part 9 of the dispenser 3 via the connecting part 16A and the fluororesin tube 8A.

  The dispenser 3 includes a storage unit 9 for storing the mixed liquid resin 6, a metering and feeding mechanism 10 for sending the mixed liquid resin 6 by a predetermined amount, a static mixer 11 for stirring the mixed liquid resin 6, and the mixed liquid resin stirred. 6 and the nozzle 12 which discharges 6 are comprised integrally. Thus, by integrating the configuration of the dispenser 3, the dispenser 3 can be reduced in size. Since the dispenser 3 can be reduced in size, the supply mechanism 1 in which the dispenser 3 and the liquid resin storage mechanism 2 are integrated can be reduced in size.

  The supply mechanism 1 is provided with a moving mechanism 45 that moves the dispenser 3 in the Y direction. The dispenser 3 can also be moved in the vertical direction (Z direction). The dispenser 3 shown in FIG. 5A is centered on one point in the vertical plane (in the plane including the Y axis and the Z axis) or in the horizontal plane (in the plane including the X axis and the Y axis). And can be reciprocated so as to partially rotate. In this case, the dispenser 3 reciprocates so as to draw a part of the arc.

  Moreover, each component (the storage part 9, the measurement delivery mechanism 10, the static mixer 11, and the nozzle 12) which comprises the dispenser 3 can be mutually attached or detached, and can each be replaced | exchanged individually. By exchanging the nozzle 12, the direction in which the mixed liquid resin 6 is discharged can be set to an arbitrary direction such as right below, right next, or diagonally downward. In addition, when the mixed liquid resin 6 previously mixed with one liquid is used, the static mixer 11 may not be provided. In this case, the dispenser 3 can be further downsized.

  As in the second embodiment, in the supply mechanism 1, the cartridge 4A, 4B for storing the mixed liquid resin 6 to which the phosphor 5 is added, the connecting portion 16A for connecting the cartridges 4A, 4B, and the dispenser 3 are provided. An agitation mechanism MOV for agitating the mixed liquid resin 6 can be provided in at least one of the storage unit 9 for the mixed liquid resin 6 and the static mixer 11. The mixed liquid resin 6 can be stirred by the stirring mechanism MOV. The mixed liquid resin 6 is caused to flow by stirring. Therefore, the phosphor 5 can be prevented from being precipitated in the mixed liquid resin 6. Since the phosphor 5 can be prevented from precipitating, it is possible to prevent variations in the specific gravity and viscosity of the mixed liquid resin 6 to which the phosphor 5 is added.

  FIG. 5 shows a case where two cartridges for storing the mixed liquid resin 6 are provided. Not limited to this, three or more cartridges may be provided. All the three or more cartridges are connected to the dispenser 3 through the connecting portion 16A.

  With reference to FIG. 6, Example 5 of the resin molding apparatus based on this invention is demonstrated. The difference from the fourth embodiment is that a two-liquid mixing type dispenser is used as the dispenser 3. The dispenser 3 shown in FIG. 6 is the same as the two-liquid mixing type dispenser shown in FIG. The liquid resin storage mechanism 2 includes a liquid resin storage mechanism 2 </ b> A that stores the main agent 20 and a liquid resin storage mechanism 2 </ b> C that stores the curing agent 21. The supply mechanism 1 is configured by integrating liquid resin storage mechanisms 2A, 2C and a dispenser 3.

  The liquid resin storage mechanism 2A is provided with cartridges 4A and 4B for storing the main agent 20 and a connecting portion 16A for connecting the cartridges 4A and 4B. The phosphor 5 is added to the main agent 20. Each cartridge 4A, 4B is connected to the storage part 9A of the dispenser 3 via the connecting part 16A and the fluororesin tube 8A.

  Similarly, the liquid resin storage mechanism 2C is provided with cartridges 4C and 4D for storing the curing agent 21 and a connecting portion 16C for connecting the cartridges 4C and 4D. Each cartridge 4C, 4D is connected to the storage portion 9C of the dispenser 3 via the connecting portion 16C and the fluororesin tube 8C.

  The dispenser 3 includes storage portions 9A and 9C for storing the main agent 20 and the curing agent 21, respectively, metering delivery mechanisms 10A and 10C for sending the main agent 20 and the curing agent 21 by a predetermined amount, and the main agent 20 and the curing agent 21, respectively. The mixing chamber 22 and the static mixer 11 to be mixed, and the nozzle 12 for discharging the mixed liquid resin 46 mixed are configured integrally. Thus, by integrating the configuration of the dispenser 3, the dispenser 3 can be reduced in size. Since the dispenser 3 can be reduced in size, the supply mechanism 1 in which the dispenser 3 and the liquid resin storage mechanisms 2A and 2C are integrated can be reduced in size.

  The supply mechanism 1 is provided with a moving mechanism 47 that moves the dispenser 3 in the Y direction. Similar to the fourth embodiment, the dispenser 3 can be moved in the vertical direction (Z direction). Further, it can be reciprocated so as to partially rotate around a certain point.

  The static mixer 11 and the nozzle 12 shown in FIG. 6 are attached to and detached from each other. Therefore, the static mixer 11 and the nozzle 12 can be exchanged individually. By exchanging the nozzle 12, the direction in which the mixed liquid resin 46 is discharged can be set to an arbitrary direction such as right below, right next, or diagonally downward.

  Similarly to Example 3, the cartridges 4A and 4B for storing the main agent 20 to which the phosphor 5 is added, the connecting portion 16A for connecting the cartridges 4A and 4B, and the main agent storage portion 9A provided in the dispenser 3 are provided. And at least one of the static mixers 11 can be provided with a stirring mechanism MOV. The main agent 20 can be stirred by the stirring mechanism MOV. The main agent 20 is caused to flow by stirring. Therefore, it can prevent that the fluorescent substance 5 precipitates. Since it can prevent that the fluorescent substance 5 precipitates, it can prevent that dispersion | variation generate | occur | produces in the specific gravity, the viscosity, etc. of the main ingredient 20 to which the fluorescent substance 5 was added.

  FIG. 6 shows a case where two cartridges for storing the main agent 20 and the curing agent 21 are provided. Not limited to this, three or more cartridges may be provided. All the three or more cartridges are connected to the dispenser 3 through the connecting portions 16A and 16C.

  In Examples 4 and 5 (see FIGS. 4 to 6), the supply mechanism 1 in which the liquid resin storage mechanism 2 (2A, 2C) and the dispenser 3 are integrated can be moved along the rail 33. Configured. Not only this but liquid resin storage mechanism 2 (2A, 2C) and dispenser 3 can also be constituted separately, respectively. In this case, the supply mechanism 1 provided with only the dispenser 3 can be moved along the rail 33.

  In Examples 4 and 5 (see FIGS. 4 to 6), the dispenser 3 itself is disposed along the horizontal direction, in other words, it is disposed sideways. As a result, the height of the resin molding device 23 can be reduced. The dispenser 3 itself may be arranged along the vertical direction, in other words, vertically. Thereby, the plane area of the resin molding apparatus 23 can be reduced. In addition, the dispenser 3 itself may be disposed obliquely downward.

  In Examples 4 and 5 (see FIGS. 4 to 6), four molding modules 25A, 25B, 25C, and 25D are arranged in the X direction between the substrate supply / storage module 24 and the liquid resin supply module 26. Installed side by side. The substrate supply / storage module 24 and the liquid resin supply module 26 may be combined into one module, and one molding module 25A may be mounted side by side in the X direction. Further, the molding module 25A may be mounted side by side in the X direction on one module, and another molding module 25B may be mounted on the molding module 25A. Therefore, the configuration of the resin molding apparatus 23 can be optimized in accordance with the production form and production volume, and the productivity can be improved.

  In each Example, the case where the fluorescent substance 5 was added as an additive to the mixed liquid resin 6 or the liquid resin as the main agent 20 was shown. The additive is not limited to the phosphor 5 but may be a light diffusing agent or the like. Further, the mixed liquid resin 6 may include a plurality of types of liquid resins that are easily separated. If the additive is granular, fine powder, powder, granule, flake (flaky), lump, etc., and has the property of precipitating in the liquid resin, the present invention has the same effect. .

  In addition, in each Example mentioned above, the resin molding apparatus and the resin molding method used when resin-sealing an LED chip were demonstrated. The target for resin sealing may be a semiconductor chip such as an IC or a transistor, or a passive element. The present invention can be applied when resin-sealing one or a plurality of electronic components mounted on a substrate such as a printed circuit board or a ceramic substrate.

In addition, the present invention is applied not only to resin-sealing electronic components but also to optical components such as lenses, reflecting members (reflectors), optical modules, and light guide plates, and other resin products manufactured by resin molding. can do. In the case of a reflecting member, a white pigment such as titanium dioxide (TiO 2 ) is used as an additive.

  In Examples 4 and 5, the resin molding apparatus and the resin molding method by compression molding have been described. In addition, the present invention can be applied to a resin molding apparatus and a resin molding method by transfer molding. In this case, there is a resin storage portion formed of a cylindrical space provided in the mold (a portion where a lifting member called a plunger is disposed below and a columnar resin material usually made of a solid resin is stored. The raw material resin made of the mixed liquid resin is supplied to a pot).

  In Examples 4 and 5, an example in which a cavity provided in the lower mold is used as a housing portion and a raw material resin (hereinafter referred to as “raw resin”) made of a mixed liquid resin is supplied to the cavity is described. In addition to the cavity, the accommodating portion may be any of the following. 1stly, an accommodating part is the pot (above-mentioned) provided in the lower mold | type.

  Second, the accommodating portion is a space including the upper surface of the substrate and including a chip (chip of an electronic component such as a semiconductor chip or a passive component chip) mounted on the upper surface of the substrate. The raw material resin is supplied so as to cover the chip mounted on the upper surface of the substrate. In this case, it is preferable to perform electrical connection between the chip and the substrate by flip chip.

  Third, the accommodating portion is a space including the upper surface of a semiconductor substrate such as a silicon wafer. The raw material resin is supplied so as to cover a functional part such as a semiconductor circuit formed on the semiconductor substrate. In this case, it is preferable that a protruding electrode (bump) is formed on the upper surface of the semiconductor substrate.

  Fourth, the accommodating portion is a space including the upper surface of the film that is to be finally accommodated in the cavity of the mold. The accommodating part in this case is a recessed part formed, for example, when a film is dented. The raw material resin is supplied to the recess formed by the depression of the film. Examples of the purpose of the film include improvement of releasability, transfer of a shape composed of irregularities on the surface of the film, and transfer of a pattern formed in advance on the film. The raw material resin stored in the concave portion of the film is transported together with the film using an appropriate transport mechanism, and finally stored in the cavity of the mold.

  In any of the first to fourth cases, the raw material resin accommodated in the accommodating portion is finally accommodated in the cavity of the mold and hardened in the cavity.

  In any of the second to fourth cases, the raw material resin is supplied to the housing part outside the pair of molds facing each other, and the components including at least the housing part are conveyed between the molding dies. it can.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. It is.

1 Supply mechanism (resin supply mechanism)
2, 2A, 2C Liquid resin storage mechanism 3 Dispenser (resin supply mechanism)
4, 4A cartridge (first storage)
4B cartridge (second storage)
4C, 4D cartridge 5 Phosphor (additive)
6 Mixed liquid resin (raw resin, first liquid resin, second liquid resin)
7, 7A, 7B, 7C, 7D Plunger 8, 8A, 8C Fluororesin tube 9, 9A, 9C Storage part 10, 10A, 10C Metering delivery mechanism 11 Static mixer 12 Nozzle (discharge part)
13 Compressor (flow mechanism, stirring mechanism)
14 Nylon tube 15, 15A, 15C Electropneumatic regulator 16A, 16C Connecting part 17A, 17B, 17C, 17D Supply port 18A, 18C Outlet 19A, 19B Static mixer (mixing member)
19C, 19D Static mixer (mixing member)
20 Main agent (first liquid resin containing additive, second liquid resin)
21 Hardener 22 Mixing Chamber 23 Resin Molding Device 24 Substrate Supply / Storage Module 25A, 25B, 25C, 25D Molding Module 26 Liquid Resin Supply Module (Supply Module)
27 Pre-sealing substrate 28 Pre-sealing substrate supply unit 29 Sealed substrate (molded product)
30 Sealed substrate storage unit 31 Loader 32 Unloader 33 Rail 34 Movable lower mold (lower mold, mold)
35 Clamping mechanism 36 Cavity, whole cavity (cavity, accommodating part)
37 Release film 38 Moving mechanism 39 Vacuum pulling mechanism 40 Control unit 41 Fixed upper mold (upper mold, mold)
42 Film pressing member 43 LED chip 44 Individual cavity 45 Moving mechanism 46 Mixed liquid resin (raw resin)
47 Movement mechanism MOV Agitation mechanism

Claims (20)

  1. An upper mold; a lower mold provided opposite to the upper mold; a cavity provided in at least one of the lower mold and the upper mold; and at least a first liquid resin containing an additive. Molding part having at least a housing part for housing a raw material resin that should be cured into a cured resin in the cavity, a resin supply mechanism for supplying the raw material resin to the housing part, and the upper mold and the lower mold A mold-clamping mechanism for clamping a mold, and a resin molding apparatus for molding a molded product containing the cured resin,
    A first storage unit for storing the first liquid resin;
    An agitation mechanism for agitating the first liquid resin by flowing the first liquid resin;
    A second storage unit for storing the second liquid resin;
    A connecting portion connecting the first storage portion and the second storage portion;
    A flow mechanism for flowing the first liquid resin and the second liquid resin between the first storage unit and the second storage unit via the connecting unit;
    A discharge part provided in the resin supply mechanism, for discharging the raw resin toward the housing part ,
    The connecting portion includes a first supply port to which the first liquid resin is supplied from the first storage portion, and a second supply to which the second liquid resin is supplied from the second storage portion. A mouth and a delivery port for delivering the raw material resin to the discharge part;
    The flow mechanism supplies the first liquid resin into the connecting portion from the first supply port in a state where the delivery port is closed and the first supply port and the second supply port are opened. And a first operation for injecting and flowing the liquid resin in the connecting part into the second storage part, and supplying the second liquid resin into the connecting part from the second supply port and in the connecting part. The first liquid resin and the second liquid resin are agitated by alternately switching the second operation of injecting and flowing the liquid resin into the first storage unit. Resin molding equipment.
  2. In the resin molding apparatus described in claim 1,
    The resin molding apparatus, wherein the stirring mechanism is a mechanism that vibrates at least the first storage unit.
  3. In the resin molding apparatus described in claim 1,
    The resin molding apparatus, wherein the stirring mechanism is a movable member that moves inside the first storage unit.
  4. A resin supply mechanism for supplying a raw material resin containing the first liquid resin containing the additive and the second liquid resin to the storage unit;
    A mold clamping mechanism for clamping a mold having at least an upper mold and a lower mold opposed to each other so as to mold a molded product using the raw material resin supplied to the housing portion;
    A first storage unit for storing the first liquid resin;
    A second storage unit for storing the second liquid resin;
    A connecting portion connecting the first storage portion and the second storage portion;
    A flow mechanism for flowing the first liquid resin and the second liquid resin between the first storage unit and the second storage unit via the connecting unit ;
    A discharge part provided in the resin supply mechanism, for discharging the raw resin toward the housing part,
    The connecting portion includes a first supply port to which the first liquid resin is supplied from the first storage portion, and a second supply to which the second liquid resin is supplied from the second storage portion. A mouth and a delivery port for delivering the raw material resin to the discharge part;
    The flow mechanism supplies the first liquid resin into the connecting portion from the first supply port in a state where the delivery port is closed and the first supply port and the second supply port are opened. And a first operation for injecting and flowing the liquid resin in the connecting part into the second storage part, and supplying the second liquid resin into the connecting part from the second supply port and in the connecting part. The first liquid resin and the second liquid resin are agitated by alternately switching the second operation of injecting and flowing the liquid resin into the first storage unit. Resin molding equipment.
  5. In the resin molding apparatus as described in any one of Claims 1-3 ,
    The first liquid resin and the second liquid resin are of the same type.
  6. In the resin molding apparatus as described in any one of Claims 1-3 ,
    The resin molding apparatus, wherein the first liquid resin and the second liquid resin are different types.
  7. In the resin molding apparatus described in Claim 5 or 6,
    A resin molding apparatus comprising a mixing member inside the connecting portion.
  8. In the resin molding apparatus as described in any one of Claims 1-7,
    The first liquid resin has translucency,
    The resin molding apparatus, wherein the additive is a phosphor or a light diffusing agent.
  9. In the resin molding apparatus as described in any one of Claims 1-7,
    The additive comprises a white pigment;
    The resin molding apparatus, wherein the cured resin has a function of reflecting light.
  10. The resin molding apparatus as described in any one of Claims 1-9 WHEREIN: The said 1st liquid resin is received from the exterior of the said resin molding apparatus, and the said 1st liquid resin is supplied toward the said accommodating part. A supply module;
    Comprising at least one molding module having the molding die and the clamping mechanism;
    The supply module and the one molding module are connected,
    The supply module and the one molding module are detachable,
    The resin molding apparatus, wherein the one molding module is detachable from other molding modules.
  11. A step of preparing a mold having at least an upper mold and a lower mold provided opposite to the upper mold; and at least a first liquid resin containing an additive; the lower mold and the upper mold And a step of containing a raw material resin that should be cured to become a cured resin in a cavity provided in at least one of the cavities, and filling the cavity using the raw material resin contained in the accommodation portion A resin molding method comprising: a step of making a state; a step of clamping the molding die; and a step of curing the raw resin in the cavity to form the cured resin,
    Preparing a first storage unit for storing the first liquid resin;
    Storing the first liquid resin in the first storage unit;
    Agitating the first liquid resin by flowing the first liquid resin;
    Preparing a second storage unit for storing the second liquid resin;
    Storing the second liquid resin in the second storage unit;
    Preparing a connecting portion for connecting the first storage portion and the second storage portion;
    Sending the first liquid resin from the first storage unit toward the discharge unit;
    A step of discharging the raw resin containing at least the first liquid resin that has been sent out from the discharge portion toward the housing portion ,
    The connecting portion includes a first supply port to which the first liquid resin is supplied from the first storage portion, and a second supply to which the second liquid resin is supplied from the second storage portion. A mouth and a delivery port for delivering the raw material resin to the discharge part;
    In the sending step, the liquid resin in the connecting portion is sent from the outlet provided in the connecting portion toward the discharge portion,
    In the stirring step, the first liquid resin is supplied from the first storage unit into the connecting unit in a state where the delivery port is closed and the first supply port and the second supply port are opened. And a first operation for injecting and flowing the liquid resin in the connecting part into the second storage part, and supplying the second liquid resin from the second storage part into the connecting part and the connection. Stirring the first liquid resin and the second liquid resin by alternately switching the second operation of injecting and flowing the liquid resin in the section into the first storage section A resin molding method characterized.
  12. In the resin molding method according to claim 11,
    In the stirring step, the first liquid resin is caused to flow by vibrating the first storage unit.
  13. In the resin molding method according to claim 11,
    In the stirring step, the first liquid resin is caused to flow by moving a movable member inside the first storage unit.
  14. A molding die having at least an upper die and a lower die facing each other using a raw material resin containing a first liquid resin containing an additive and a second liquid resin and being discharged from a discharge portion and stored in the storage portion It is a resin molding method for performing mold clamping and resin molding,
    The first storage unit that stores the first liquid resin and the second storage unit that stores the second liquid resin include a first storage unit that supplies the first liquid resin from the first storage unit. Connected by a connecting portion including a supply port for supplying the second liquid resin from the second storage portion and a delivery port for sending the raw resin to the discharge portion. And sending the liquid resin in the connecting portion from the outlet provided in the connecting portion toward the discharge portion;
    Prior to the feeding step, in the state where the delivery port is closed and the first supply port and the second supply port are opened, the first liquid resin is transferred from the first storage unit into the connection unit. And supplying the second liquid resin from the second storage part into the connection part, and supplying the second liquid resin from the second storage part to the connection part. The first liquid resin and the second liquid resin are agitated by alternately switching the second operation of injecting and flowing the liquid resin in the connecting portion into the first storage portion. A resin molding method comprising the steps of :
  15. In the resin molding method described in any one of Claims 11-14 ,
    The resin molding method, wherein the first liquid resin and the second liquid resin are of the same type.
  16. In the resin molding method described in any one of Claims 11-14 ,
    The resin molding method, wherein the first liquid resin and the second liquid resin are different types.
  17. In the resin molding method according to claim 15 or 16,
    A resin molding method comprising a step of mixing the first liquid resin and the second liquid resin by using a mixing member provided inside the connecting portion.
  18. In the resin molding method as described in any one of Claims 11-17,
    The first liquid resin has translucency,
    The resin molding method, wherein the additive is a phosphor or a light diffusing agent.
  19. In the resin molding method as described in any one of Claims 11-17,
    The additive comprises a white pigment;
    The resin molding method, wherein the cured resin has a function of reflecting light.
  20. In the resin molding method as described in any one of Claims 11-19,
    Preparing a supply module that receives the first liquid resin and supplies the first liquid resin toward the housing;
    Providing at least one molding module having the molding die and a clamping mechanism for clamping the molding die,
    The supply module and the one molding module are detachable,
    The resin molding method, wherein the one molding module is detachable from other molding modules.
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TW104103124A TWI580545B (en) 2014-02-24 2015-01-30 Resin forming apparatus and resin forming method
CN201510083905.4A CN104859089B (en) 2014-02-24 2015-02-09 Resin molding apparatus and resin molding method
KR1020150025330A KR101676557B1 (en) 2014-02-24 2015-02-23 Resin molding apparatus and resin molding method

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KR20150100537A (en) 2015-09-02
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KR101676557B1 (en) 2016-11-15
TWI580545B (en) 2017-05-01
TW201540464A (en) 2015-11-01
CN104859089B (en) 2017-07-14

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