JP6696489B2 - Resin material conveying mechanism and resin material conveying method - Google Patents

Description

  The present invention relates to a resin material conveying mechanism and a resin material conveying method.

  A resin encapsulation molding apparatus that manufactures various semiconductor packages includes a material supply unit that includes a transfer mechanism that transfers a resin material that seals a base material on which semiconductor elements are mounted to a predetermined position.

  In this material supply unit, the resin material to be supplied is conveyed to a predetermined position by a resin material conveying mechanism such as a belt conveyor or a rotating device, and the tablet carrier receives the resin material at the same position. Then, the tablet carrier conveys the resin material to the molding die of the resin sealing unit that seals the base material with the resin.

  As a carrying mechanism for carrying such a resin material to a molding die of a resin sealing unit, for example, there is a resin material carrying mechanism described in Patent Document 1.

  In the resin material transport mechanism described in Patent Document 1, the resin material is transported by the supply conveyor, and the resin material is loaded into the holding holes for holding a plurality of resin materials provided in the tablet carrier via the transfer cylinder. To be done. When the resin material is filled in the holding hole, the rod of the transfer cylinder moves up and down to push the resin material into the holding hole.

  Further, the transfer cylinder reciprocates between the supply conveyor and the holding hole of the tablet carrier, and the resin material is loaded into the plurality of holding holes. After that, the tablet carrier moves to the molding die, and the tablet carrier sends out the resin material toward the mounting hole of the resin material in the molding die.

JP-A-2-218141

  Here, in the resin material transport mechanism described in Patent Document 1, the tablet carrier moves toward the supply conveyor after the resin material is delivered to the molding die by the tablet carrier. Then, since the resin material to be conveyed next is loaded into the holding hole by the transfer cylinder, the supply conveyor and the transfer cylinder cannot convey the next resin material until the tablet carrier returns, and there is an extra waiting time. Time was coming up.

  In such a resin material transport mechanism, it is required to efficiently transport the resin material in order to increase the operating rate of the resin encapsulation molding apparatus. However, in the conventional resin material transport mechanism including the resin material transport mechanism described in Patent Document 1, the efficiency of the resin material transport is poor, and there is room for improvement.

  The present invention was created in view of the above points, and an object thereof is to provide a resin material transfer mechanism and a resin material transfer method that can shorten the cycle time of the step of transferring a resin material.

  In order to achieve the above object, the resin material transport mechanism of the present invention is a resin sealing unit that holds the resin material in a predetermined arrangement and seals the base material on which the semiconductor elements are mounted with the resin material. Is a resin material transporting mechanism for continuously transporting the resin material toward a predetermined position, a supply means for supplying the resin material to a predetermined position, a distribution section in which the resin material can be arranged, and a distribution section arranged in the distribution section. And a transfer unit that receives the resin material from the distribution transfer unit and transfers the resin material toward the resin sealing unit; While gripping the resin material supplied to the position, from the time the starting resin material is transferred to the delivery means until it is conveyed to the resin sealing unit, in accordance with the predetermined arrangement, And a gripping and conveying means for arranging the next resin material in the distribution portion.

  Here, by the supply means for supplying the resin material to the predetermined position, the distributing portion in which the resin material can be arranged, and the gripping and conveying means for gripping the resin material supplied to the predetermined position and arranging it in the distributing portion, It is possible to convey the resin material supplied to the position to the distribution unit and arrange it.

  Further, the transfer means of the distribution transfer section transfers the resin material arranged in the distribution section, the transfer means receives the resin material from the distribution transfer section, and transfers the resin material toward the resin sealing unit, thereby distributing the resin material. The resin material arranged in the section can be conveyed toward the resin sealing unit.

  The "predetermined array" referred to in the present invention is an array of resin materials held by the resin sealing unit, and more specifically, an array of pots provided in a molding die of the resin sealing unit. To do.

  The "base material" in the present invention means, for example, a lead frame or a substrate on which a semiconductor element is mounted, which is used for manufacturing a resin-molded semiconductor package.

  In addition, the gripping and conveying means arranges the next resin material in the distribution unit in accordance with a predetermined arrangement during a period from the transfer of the first resin material to the delivery means to the conveyance to the resin sealing unit. By doing so, it is possible to prepare a necessary number of resin materials in a line in the distribution unit before starting the conveyance of the next resin material to the resin sealing unit. Therefore, the resin material can be promptly transferred to the delivery means when the transfer of the next resin material to the resin sealing unit is started.

  It should be noted that the terms “first start” and “next start” as used herein refer to the order of one transfer in the transfer of the resin material toward the resin sealing unit. For example, in a mode in which the tablet carrier conveys the resin material to the resin encapsulating unit, if a certain one-time resin material conveying step is “starting”, the tablet carrier conveys the resin material to the resin encapsulating unit as follows. The resin material transfer process for each time is the "next".

  Further, when the delivery means has a holding portion capable of holding the resin material in accordance with a predetermined arrangement, and the transfer means pushes and transfers the resin material arranged in the distribution portion toward the holding portion, It is possible to cause the holding unit to hold the resin material while the transfer unit pushes the resin material toward the holding unit while maintaining the aligned state of the resin material arranged in the distribution unit. That is, for example, if the resin material is arranged in the distribution unit at a constant interval, the transfer unit pushes the resin material from the distribution unit to the holding unit while maintaining the interval, and the resin material is held in the holding unit. Can be held.

  Further, when the delivery means has a holding portion capable of holding the resin material in a predetermined arrangement, the resin material can be aligned and held in accordance with the arrangement of the molding die pots in the resin sealing unit. Becomes That is, a plurality of resin materials can be held by the transfer means in a state where they can be easily transferred to the resin sealing unit, and the efficiency of the transfer of the resin material can be improved.

  Further, when a substantially V-shaped groove portion is formed in the distribution portion along the direction in which the resin material is arranged, the resin material is fitted into the groove portion of the distribution portion to stably dispose the resin material. can do.

  When the gripping and conveying means has a holding claw for gripping and conveying the resin material, the resin material can be sandwiched between the holding claws and lifted and conveyed. Therefore, the resin material can be conveyed in a state of being in contact with the holding claw of the gripping and conveying means, and the resin material can be conveyed after reducing the frictional force generated by the contact with the object other than the holding claw. .

  When the holding claw has a first holding claw and a second holding claw that can be driven independently of the first holding claw, the first holding claw and the second holding claw are separately provided. The resin material can be gripped and released to be placed in the distribution unit, and the efficiency of transportation can be improved. For example, when the resin materials are alternately arranged in two rows (staggered pattern) in the distribution section, the first holding claws are used to carry the one row of the resin material and the other row of the resin material is arranged. The second holding claw can be made to bear the carrying. As a result, the placement of the resin material on the distribution unit can be completed in a shorter time.

  In addition, in order to achieve the above-mentioned object, the resin material conveying method of the present invention is a resin encapsulation method in which a resin material arranged in a predetermined arrangement is resin-sealed with a base material on which semiconductor elements are mounted. A method of continuously conveying a resin material to a stop unit, comprising a supplying step of supplying the resin material to a predetermined position, and the resin material arranged in a distribution section in which the resin material can be arranged. A transfer step of transferring the resin material to a holding portion capable of holding the resin material, a transfer step of delivering the resin material held by the holding portion toward the resin sealing unit, and a step of supplying the resin material to the predetermined position. In addition to gripping the resin material, while the previous resin material is transferred to the holding portion and is then conveyed to the resin sealing unit, the next material of the next material is aligned with the predetermined arrangement. A gripping and conveying step of conveying and arranging the resin material to the distributor.

  Here, a predetermined step is performed by a supplying step of supplying the resin material to a predetermined position and a gripping and conveying step of grasping the resin material supplied to the predetermined position and conveying and arranging the resin material to a distributable distribution unit. It is possible to convey the resin material supplied to the position to the distribution unit and arrange it.

  In addition, a transfer process of transferring the resin material arranged in the distributing portion in which the resin material can be arranged to a holding portion capable of holding the resin material, and the resin material held in the holding portion toward the resin sealing unit. By the delivering step, the resin material placed in the distributing section can be transferred to the holding section and delivered to the resin sealing unit.

  Further, in the gripping and conveying step, the resin material supplied to a predetermined position is grasped, and a predetermined arrangement is carried out after the starting resin material is transferred to the holding portion and is conveyed to the resin sealing unit. In accordance with the above, by arranging the next resin material to be conveyed and arranged in the distribution unit, the necessary number of resin materials in the distribution unit can be provided before the conveyance of the next resin material to the resin sealing unit is started. You can prepare them side by side. Therefore, when starting the next conveyance of the resin material to the resin sealing unit, the resin material can be promptly transferred to the holding portion.

  INDUSTRIAL APPLICABILITY The resin material conveying mechanism and the resin material conveying method according to the present invention can shorten the cycle time of the step of conveying the resin material.

It is a plane view schematic explanatory view which shows an example of the resin material conveyance mechanism which concerns on this invention. It is a side view schematic explanatory view showing an example of the resin material conveyance mechanism concerning the present invention. It is a plane view schematic explanatory drawing of a robot cylinder and a distribution stage. It is a front view schematic explanatory view which shows the positional relationship of a pusher, a distribution stage, a rotation unit, and a tablet carrier. It is a side view outline explanatory view showing the method of conveyance of the resin tablet to a distribution stage by a robot cylinder, (a) is a schematic diagram showing the initial state of conveyance, and (b) is a state where conveyance is completed. FIG. (A) is a schematic front view showing a state where a resin tablet is arranged on a distribution stage, (b) is a schematic front view showing a state where a resin tablet is held by a rotating unit, and (c) [Fig. 8] is a schematic front view illustrating a state in which the rotation unit has delivered the resin tablet to the tablet carrier.

Hereinafter, modes for carrying out the present invention (hereinafter, referred to as “embodiments”) will be described with reference to the drawings.
In the present embodiment, with reference to FIG. 1, the position of the tablet carrier 8 with respect to the tablet pusher 52 is “front” or “front”, and the position of the tablet pusher 52 with respect to the tablet carrier 8 is “rear” or “rear”. ". Further, the position of the parts feeder 4 with respect to the tablet pusher 52 is "right" or "rightward", and the position of the tablet pusher 52 with respect to the parts feeder 4 is "left" or "leftward". Further, with reference to FIG. 2, the position of the distribution stage 51 with respect to the robot cylinder 6 is “down” or “down”, and the position of the robot cylinder 6 with respect to the distribution stage 51 is “up” or “upper”. Regarding the posture of the substantially cylindrical resin tablet 2, the direction in which the center line of the resin tablet 2 is substantially parallel to the horizontal direction is “lateral”, and the direction in which the center line of the resin tablet 2 is substantially parallel to the vertical direction is Set to "portrait".

  In the material supply unit that constitutes the resin sealing device of the semiconductor package, the resin material transport mechanism that transports the resin tablet that is the resin material is configured using an example of the resin material transport mechanism to which the present invention is applied.

  In the present embodiment, as shown in FIGS. 1 and 2, the resin material transport mechanism 1 includes a material feeding unit 3 that serves as a supply source of the resin tablet 2 and a parts feeder 4 that transports the resin tablet 2 while aligning them. , A buffer unit 5 for distributing and transferring the resin tablet 2, a robot cylinder 6 (not shown in FIG. 1) for arranging the resin tablet 2 side by side in the buffer unit 5, a resin tablet 2 received from the buffer unit 5, and a tablet carrier The rotary unit 7 is provided for delivering to the unit 8. The tablet carrier 8 is a device that conveys the resin tablet 2 to a pot (not shown) of a molding die of a resin sealing unit that seals the base material with resin.

  The material feeding unit 3 has a box 31 in which the resin tablets 2 are stored, and a hopper 32 that conveys the resin tablets 2 supplied downward from the box 31 toward the parts feeder 4. The resin tablet 2 is a resin material that seals the base material on which the semiconductor element is mounted, and is formed in a substantially columnar shape. The material feeding section 3 and the parts feeder 4 correspond to the "supplying means" in the claims of the present application.

  The parts feeder 4 applies a rotation and a vibration to the resin tablet 2 supplied from the hopper 32 to convey the resin tablet 2 while aligning the resin tablet 2 in a horizontal posture, and the resin tablet 2 discharged from the rotating unit 41. It has a transport line 42 that transports while arranging them in a line in a horizontal posture.

  A positioning adjustment mechanism 43 (see FIG. 1) is provided at the end 47 of the transfer line 42 of the parts feeder 4 so that the resin tablet 2 can be positioned at the end 47 of the transfer line 42. By adjusting the positioning adjustment mechanism 43, the position of the resin tablet 2 in the front-back direction when the resin tablet 2 is placed on the placement surface 510 of the distribution stage 51 by the robot cylinder 6 described later can be adjusted. ..

  Further, a substantially V-shaped groove portion 44 is formed along the front-rear direction at the position where the resin tablet 2 is arranged at the end portion 47 of the transport line 42.

  Further, a part of the material feeding unit 3 and the entire parts feeder 4 are covered with the supply unit cover 45, and the inside covered with the supply unit cover 45 is a sealed space. Further, a ring blower 46 capable of sucking air in the internal space of the supply unit cover 45 is installed adjacent to the parts feeder 4. Note that, as shown in FIG. 2, the box 31 of the material feeding unit 3 is located outside the supply unit cover 45.

  The ring blower 46 has a suction port 48 provided with a filter (not shown) in the internal space of the supply section cover 45, and sucks dust generated when the resin tablet 2 is conveyed by the parts feeder 4. It is configured to be able to collect.

  Here, as long as the resin tablet 2 is conveyed to a position where it can be received by a holding claw 62 and a holding claw 63 (see FIG. 3) described later, the material charging unit 3 and the part feeder of the present embodiment are not necessarily required. 4 need not be adopted, and for example, a known mechanism such as a belt conveyor that conveys the resin tablet 2 to a predetermined position may be employed.

  Further, it is not always necessary to adopt a structure in which a part of the material feeding unit 3 and the entire parts feeder 4 are covered with the supply unit cover 45 and the dust is sucked by the ring blower 46. However, the ring blower 46 sucks the air containing dust generated from the resin tablet 2 generated by the conveyance of the resin tablet 2 using the parts feeder 4, and the influence of the conveyance failure due to the generation of the dust or the shortening of the life of the equipment is affected. This structure is preferably adopted because it can be reduced.

  The buffer unit 5 is provided next to the transfer line 42 of the parts feeder 4 (see FIG. 1). The buffer unit 5 has a distribution stage 51 on which the resin tablets 2 can be arranged side by side, and a tablet pusher 52 that pushes the resin tablets 2 arranged on the distribution stage 51 toward the rotary unit 7. The buffer unit 5 corresponds to the "distributor transfer unit" in the claims of the present application. The distribution stage 51 corresponds to the “distribution unit” in the claims of the present application. Further, the tablet pusher 52 corresponds to the "transporting means" in the claims of the present application.

  Further, the distribution stage 51 has a substantially V-shaped groove portion 511 formed along the front-rear direction on the arrangement surface 510 which is the upper surface thereof. Further, groove portions 511 are formed on the arrangement surface 510 in accordance with the arrangement of the molding die pots in the resin sealing unit and the number of resins used in the pots. The placement surface 510 is provided at substantially the same height as the transfer line 42 of the parts feeder 4.

  Since the substantially V-shaped groove portion 511 is formed on the arrangement surface 510 along the front-rear direction in this manner, the resin tablet 2 can be fitted in the groove portion 511 and the resin tablet 2 can be stably arranged. it can.

  Further, as described above, the groove 511 is formed on the arrangement surface 510 in accordance with the arrangement of the pots of the molding die and the number of resins used in the pots. Therefore, it becomes possible to arrange the resin tablet 2 in the arrangement 510 and deliver the resin tablet 2 to the rotation unit 7 described later in a state where the resin tablet 2 can be easily delivered to the molding die.

  Further, the tablet pusher 52 is connected to a drive source such as a hydraulic cylinder and moves in the front-back direction (see FIGS. 1 and 4), and the resin tablet 2 provided at the tip of the pusher body 520 moves forward. It has a push portion 521 (see FIG. 4) that pushes it out.

  The robot cylinder 6 is provided with a guide rail 61 provided above the arrangement surface 510 of the distribution stage 51 and the transfer line 42, and a resin connected to the guide rail 61 and transferred to the end portion 47 of the transfer line 42. The tablet 2 has a holding claw 62 and a holding claw 63 that grip and convey the tablet 2 on the arrangement surface 510 of the distribution stage 51 (see FIG. 3). The robot cylinder 6 corresponds to the "grasping and conveying means" in the claims of the present application.

  Further, the guide rail 61 has a length such that the holding claw 62 and the holding claw 63 can move at least between the left end of the distribution stage 51 and the end portion 47 of the transport line 42. Further, the holding claw 62 and the holding claw 63 are arranged so as to be displaced in the front-rear direction. As a result, it is possible to displace the resin tablets 2 in the front-rear direction on the disposition surface 510 without moving each holding claw in the front-rear direction.

  Further, the holding claw 62 and the holding claw 63 are configured to be integrally movable along the guide rail 61 in the horizontal direction and the vertical direction (see FIG. 3).

  More specifically, the holding claw 62 and the holding claw 63 are configured to be movable in the left-right direction from the end portion 47 of the transport line 42 to the left end of the arrangement surface 510 of the distribution stage 51. In addition, the holding claws 62 and 63 hold the lower surface of the grasped resin tablet 2 from the fixed height position where the resin tablet 2 is separated from the end portion 47 of the conveyance line 42 and the arrangement surface 510 in the vertical direction. It is configured to be movable to a height position where it can be placed in the groove portion 44 of the end portion 47 of the line 42 and the groove portion 511 of the arrangement surface 510.

  Further, a chuck portion 620 and a chuck portion 630 capable of opening and closing in the left-right direction and gripping the resin tablet 2 are provided below the holding claws 62 and 63 (see FIGS. 2 and 3). The holding claw 62 and the holding claw 63 are configured such that the opening and closing operations of the chuck section 620 and the chuck section 630 can be driven independently of each other by a predetermined drive mechanism (not shown) such as an air cylinder.

  Therefore, in the holding claw 62 and the holding claw 63, the chuck part 620 and the chuck part 630 can hold and release the resin tablet 2 by independent movements. The chuck part 620 and the chuck part 630 sandwich and lift the resin tablet 2 for conveyance. Therefore, the chuck portions 620 and 630 come into contact with the resin tablet 2, and the resin tablet 2 can be conveyed after reducing the frictional force generated by the contact with the object other than the chuck portions 620 and 630. ..

  Here, the number of holding claws provided in the robot cylinder 6 is not limited to two, and the number of holding claws to be installed can be set as necessary.

  Further, the holding claw 62 and the holding claw 63 are not particularly limited as long as they have a structure capable of gripping and transporting the resin tablet 2, and, for example, suction instead of the chuck part 620 and the chuck part 630. An air chuck that grips the resin tablet 2 with force may be used.

  The rotation unit 7 is provided adjacent to the distribution stage 51. The rotary unit 7 also has a holding arm 72 that is rotatable via a rotary shaft 71 (see FIGS. 4 and 6). The holding arm 72 is formed in a substantially L shape, and a tablet holding portion 73 capable of holding the resin tablet 2 is provided at the tip end portion thereof. The rotary unit 7 corresponds to the "delivery means" in the claims of the present application.

  Further, the tablet holding portion 73 is capable of aligning and holding the resin tablets 2 in accordance with the arrangement of the pots of the molding die in the resin sealing unit and the number used in the pots. This makes it possible to hold the resin tablet 2 by the tablet holding portion 73 and easily deliver the resin tablet 2 to the carrier holding portion 81 of the tablet carrier 8 described later in a state where the resin tablet 2 can be easily delivered to the molding die.

  In this rotation unit 7, the tablet holding part 73 rotates to move the tablet holding part 73 from the position close to the distribution stage 51 (the position where the resin tablet 2 can be received on the placement surface 510) to the carrier of the tablet carrier 8. It moves to a position close to the holding part 81 (a position where the resin tablet 2 can be delivered to the carrier holding part 81).

  The tablet carrier 8 has a carrier holding portion 81 (see FIGS. 4 and 6). The carrier holding portion 81 is located below the tablet holding portion 73 which the holding arm 72 rotates and moves, and receives the resin tablet 2 from the tablet holding portion 73. The tablet carrier 8 that has received the resin tablet 2 moves to the molding die and conveys the resin tablet 2 to the pot. The tablet carrier 8 can adopt a known tablet carrier structure, and a detailed description of the structure will be omitted.

  Hereinafter, a flow of resin material transportation in the embodiment of the resin material transportation mechanism to which the present invention is applied will be described. In addition, the content described below is also an example of a carrying method in the resin material carrying method to which the present invention is applied.

  First, the resin tablet 2 stored in the box 31 of the material feeding unit 3 is supplied toward the lower hopper 32 and is conveyed from the hopper 32 to the parts feeder 4 (see FIGS. 1 and 2).

  The plurality of resin tablets 2 conveyed from the hopper 32 enter the rotating portion 41 of the parts feeder 4 and are sent to the conveying line 42 while being vibrated by the rotating portion 41. At this time, the posture of the resin tablet 2 is adjusted laterally and is supplied to the transport line 42.

  In the transfer line 2 of the parts feeder 4, the resin tablets 2 are arranged in a line in a horizontal posture and sent toward the end portion 47. At the end portion 47, the position in the front-rear direction of the resin tablet 2 is determined at the position set by the positioning adjustment mechanism 43.

  Further, at the end portion 47, the two resin tablets 2 are positioned in the front-rear direction according to the positions of the holding claws 62 and 63 in the front-rear direction (see FIG. 1). Further, since the substantially V-shaped groove portion 44 is formed in the end portion 47, the resin tablet 2 is placed in a stable state without rolling in the left-right direction (see FIGS. 1 and 5).

  Then, when the resin tablet 2 is arranged at the end 47 of the transfer line 42, the holding claws 62 and 63 of the robot cylinder 6 are guided along the guide rail 61 toward the end 47 of the transfer line 42. To move.

  Details of the conveyance of the resin tablet 2 by the holding claws 62 and 63 will be described. Note that, in FIG. 5, the holding claws 63 are omitted and only the holding claws 62 are shown to simplify the drawing.

  The holding claw 62 and the holding claw 63 that have moved above the end portion 47 of the transport line 42 descend to a position where the chuck part 620 and the chuck part 630 can hold the resin tablet 2. Then, the chuck portion 620 and the chuck portion 630 are opened and closed to sandwich the side surface of the resin tablet 2 from the left and right direction. While the resin tablet 2 is held by the chuck portions 620 and 630, the holding claws 62 and the holding claws 63 rise to a certain height and move along the guide rails 61 toward above the distribution stage 51.

  As shown in FIG. 5A, the holding claw 62a moves above the groove 511a at the right end of the arrangement surface 510 of the distribution stage 51, and the holding claw 62a descends to the arrangement surface 510 at the same position. The chuck portion 620a is opened at a position where the lower surface of the resin tablet 2a gripped by the chuck portion 620a contacts the groove portion 511a, and the resin tablet 2a is placed on the groove portion 511a.

  After the resin tablet 2a is arranged, the holding claw 62a rises to a certain height and moves to the end portion 47 of the transport line 42. After that, the holding claw 62 repeatedly grips and conveys the resin tablet 2 with the same movement as described above.

  As described above, by gripping and transporting the resin tablet 2 using the chuck portion 620 of the holding claw 62, the resin tablet 2 can be transported to the distribution stage 51 without exerting a large frictional force. As a result, chipping of the resin tablet 2 and generation of dust are reduced, and it is possible to prevent the resin tablet 2 from being poorly conveyed.

  Further, as shown in FIG. 5B, when the resin tablet 2 is arranged in all the groove portions 511 of the arrangement surface 510, the resin pusher 2 can be transferred to the rotary unit 7 by the tablet pusher 52. ..

  In this way, by disposing the resin tablet 2 on the disposition surface 510 of the distribution stage 51, the resin tablet 2 can be temporarily placed on the disposition surface 510 during the process of transporting the resin tablet 2. That is, it becomes possible to prepare the resin tablets 2 in the same number in order to carry the next process before the distribution stage 51.

  Further, as described above, the groove 511 is formed on the arrangement surface 510 in accordance with the arrangement of the pots of the molding die and the number of resins used in the pots. Therefore, the number of resin tablets 2 to be transported in the next step can be made uniform and temporarily placed, and the efficiency of transporting the resin tablets 2 can be improved.

  Further, the holding claw 63 has the same pitch as the holding claw 62 arranges the resin tablet 2, and the resin tablet 2 is arranged at a position displaced in the front-rear direction and the left-right direction from the resin tablet 2 arranged by the holding claw 62. To go. That is, after the holding claw 62 arranges the resin tablet 2, the holding claw 62 and the holding claw 63 are integrally lifted, moved to the left, and further moved down to the placement surface 510 to chuck the holding claw 63. The part 630 is opened, and the resin tablet 2 is placed on the placement surface 510.

  When the placement of the resin tablets 2 on the placement surface 510 by the holding claws 62 and the holding claws 63 is completed, the resin tablets 2 are alternately arranged in two rows in the front-back direction of the placement surface 510 as shown in FIG. 1 or 3. Staggered) will be arranged in a line.

  Here, it is not always necessary that the resin tablets 2 are alternately arranged in two rows in the front-back direction of the arrangement surface 510. For example, the positions of the placement surface 510 in the front-rear direction may be aligned and the resin tablets 2 may be placed in a line. However, a structure is adopted in which the chuck part 620 and the chuck part 630 are independently opened and closed, and when the resin tablets 2 are arranged alternately in two rows, the holding claw 62 is made to carry the one row of the resin tablets 2 to be conveyed. The holding claws 63 can be caused to carry the other row of the resin tablets 2. As described above, the resin claws 2 and the claws 63 that are driven independently are arranged so that the resin tablets 2 are alternately arranged in two rows on the arrangement surface 510, and thus the time required for the arrangement of the resin tablets 2 is increased. Can be shortened.

  Also, the resin tablets 2 are arranged in two rows in the front-rear direction by aligning the left and right directions on the arrangement surface 510 of the resin tablets 2, that is, the resin tablets 2 are arranged in two rows in the front-rear direction on the arrangement surface 510 without being staggered. An open arrangement may be adopted. Such an arrangement is adopted when the amount of the resin tablet 2 used in one pot of the molding die is large, and can be dealt with by the holding claws 62 and 63.

  That is, by adopting a structure in which the chuck portion 620 and the chuck portion 630 are independently opened and closed, the resin tablet 2 can be efficiently transported when the amount of the resin tablet 2 used in one pot is small. it can. Further, even when the amount of the resin tablet 2 used in one pot is large, the holding claw 62 and the holding claw 63 can deal with the problem.

  Further, regarding the holding claws 62 and the holding claws 63, the resin tablets 2 can be arranged on the arrangement surface 510 in accordance with the arrangement of the pots of the molding die and the number used in the pots. Accordingly, the resin tablet 2 can be temporarily placed on the placement surface 510 and placed in a standby state in a state where it can be easily transferred to the molding die, and the efficiency of transporting the resin tablet 2 can be improved.

  Next, with reference to FIGS. 6A to 6C, conveyance by the tablet pusher 52 and the rotation unit 7 will be described. The pusher body 520 of the tablet pusher 52 is driven by detecting the state in which the resin tablets 2 are arranged on the arrangement surface 510 of the distribution stage 51 by the sensor mechanism, and the push portion 521 comes into contact with the rear end surface of the resin tablet 2. Then, the resin tablet 2 is pushed out to the tablet holding portion 73 of the front rotary unit 7 (see FIG. 6B).

  At this time, the resin tablet 2 is pushed by the push portion 521 in a horizontal posture. Further, when the push portion 521 moves forward, first, the resin tablets 2 in the rear row located near the push portion 521 come into contact with the push portion 521, and then the resin tablets 2 in the front row move. It abuts on the push portion 521. In this process, the resin tablets 2 are aligned in one row from the state where they are staggered in two rows in the front-rear direction of the arrangement surface 510 and enter the tablet holding portion 73.

  When the resin tablet 2 enters the tablet holding portion 73, the pushing by the push portion 521 is completed, and the push portion 521 moves backward. Subsequently, the holding arm 72 of the rotation unit 7 rotates about 90 degrees toward the carrier holding portion 81 of the tablet carrier 8 via the rotation shaft 71 (see FIG. 6C).

  In this way, the orientation of the tablet holding portion 73 changes with the rotation of the holding arm 72 by approximately 90 degrees (indicated by the dotted line in FIG. 6C), and the posture of the resin tablet 2 held by the tablet holding portion 73 also changes to the horizontal direction. It changes from the state of to the state of portrait. Then, when the posture of the resin tablets 2 becomes vertical, all the resin tablets 2 drop downward due to their weight, and the resin tablets 2 are held by the carrier holding portion 81 of the tablet carrier 8.

  After that, the tablet carrier 8 moves toward the molding die of the resin sealing unit and delivers the resin tablet 2 to the pot of the molding die. The rotary unit 7 that has delivered the resin tablet 2 to the carrier holding portion 81 rotates again about the rotation shaft 71 toward the distribution stage 51 by 90 degrees, and the tablet holding portion 73 approaches the distribution stage 51. The resin tablet 2 of 1 is ready to be received.

  Further, after the push portion 521 pushes the resin tablet 2 out of the arrangement surface 510 and moves it to the tablet holding portion 72, it is possible to convey the resin tablet 2 to the arrangement surface 510 by the holding claws 62 and 63 described above. Become.

  That is, the tablet carrier 8 conveys the resin tablet 2 to the molding die, and the time when the tablet carrier 8 returns to the rotary unit 7 is used to make the resin tablet 2 to be conveyed next by the holding claws 62 and 63. Can be transported to the arrangement surface 510. Further, before the tablet holding part 81 of the tablet carrier 8 moves to a position where the resin tablet 2 can be received from the tablet holding part 73 of the rotation unit 7, the resin tablet 2 by the holding claw 62 and the holding claw 63. The conveyance to the arrangement surface 510 of is completed.

As a result, the resin tablets 2 can be placed side by side on the placement surface 510, and an extra waiting time does not occur in the step of carrying by the tablet carrier 8, and the efficiency of carrying the resin tablets 2 can be improved.
In the resin material conveying method to which the present invention is applied, the resin material is conveyed in the above flow.

  Here, while the tablet holding part 81 moves from the tablet holding part 73 to a position where it can receive the resin tablet 2, the holding claw 62 and the holding claw 63 convey the resin tablet 2 to the arrangement surface 510. If completed, the timing of carrying the resin tablet 2 by the holding claw 62 and the holding claw 63 is not particularly limited.

As described above, the resin material transfer mechanism according to the present invention can shorten the cycle time of the step of transferring the resin material.
Further, the resin material conveying method according to the present invention is a method that can shorten the cycle time of the step of conveying the resin material.

1 Resin Material Transfer Mechanism 2 Resin Tablet 3 Material Input Section 31 Box 32 Hopper 4 Parts Feeder 41 Rotating Section 42 Transfer Line 43 Positioning Adjustment Mechanism 44 Groove 45 Supply Section Cover 46 Ring Blower 47 (Transfer Line) End 48 Suction Port 5 Buffer part 51 Distribution stage 510 Arrangement surface 511 Groove part 52 Tablet pusher 520 Pusher body 521 Push part 6 Robot cylinder 61 Guide rail 62 Holding claw 620 Chuck part 63 Holding claw 630 Chuck part 7 Rotating unit 71 Rotating shaft 72 Holding arm 73 Tablet holding part 8 Tablet carrier 81 Carrier holding part

Claims (7)

A resin material conveying mechanism that holds the resin material in a predetermined arrangement and continuously conveys the resin material toward a resin sealing unit that seals the base material on which the semiconductor elements are mounted with the resin material. There
Supply means for supplying the resin material to a predetermined position,
A distribution transfer unit having one distribution unit in which a plurality of the resin materials can be arranged and a transfer unit that transfers all the resin materials arranged in the distribution unit at one time ;
A delivery means for receiving the resin material from the distribution transfer section and delivering the resin material toward the resin sealing unit;
While gripping the resin material supplied to the predetermined position, the predetermined arrangement is performed in a predetermined array from the time when the advance resin material is transferred to the delivery means to the time when the resin material is conveyed to the resin sealing unit. In addition, a gripping and conveying means for arranging the next resin material in the distribution portion,
The plurality of resin materials are transferred to the delivery means while maintaining the distance between the resin materials arranged in the distributor in the direction orthogonal to the direction in which the transfer means transfers the resin material. mechanism. The delivery means has a holding portion capable of holding the resin material in accordance with the predetermined arrangement,
The resin material transfer mechanism according to claim 1, wherein the transfer unit pushes out and transfers the resin material arranged in the distribution unit toward the holding unit. The resin material transport mechanism according to claim 1, wherein the distribution portion has a substantially V-shaped groove portion formed along a direction in which the resin material is arranged. The resin material conveying mechanism according to claim 1, 2 or 3, wherein the gripping and conveying means has a holding claw for grasping and conveying the resin material. The resin material transport mechanism according to claim 4, wherein the holding claw has a first holding claw and a second holding claw that can be driven independently of the first holding claw. A resin material conveying mechanism that holds the resin material in a predetermined arrangement and continuously conveys the resin material toward a resin sealing unit that seals the base material on which the semiconductor elements are mounted with the resin material. There
A supply means for supplying the resin material to a predetermined position of the transfer path, the supply path having one transfer path for transferring the resin material in a line ;
A distribution transfer unit having a distribution unit capable of arranging the resin material and a transfer unit arranged to transfer the resin material,
A delivery means for receiving the resin material from the distribution transfer section and delivering the resin material toward the resin sealing unit;
While gripping the resin material supplied to the predetermined position, the predetermined arrangement is performed in the predetermined arrangement after the advance resin material is transferred to the delivery means and then conveyed to the resin sealing unit. In addition, a gripping and conveying means for arranging the next resin material in the distribution portion,
The grasping / conveying means grasps the plurality of resin materials arranged in a direction in which the resin material is conveyed to the predetermined position, and a direction orthogonal to a direction in which the resin material is conveyed to the predetermined position. To place the resin material in the distributor.
Resin material transport mechanism . A resin material transport method for continuously transporting a resin material arranged in a predetermined array, toward a resin sealing unit that seals a base material on which a semiconductor element is mounted with the resin material,
A supply step of supplying the resin material to a predetermined position,
A transfer step of transferring all of the resin materials arranged in one distributing section in which the plurality of resin materials can be arranged to a holding section capable of holding the same resin material at one time ;
A delivery step of delivering the resin material held by the holding portion toward the resin sealing unit;
While holding the resin material supplied to the predetermined position, the predetermined arrangement is performed in a predetermined array during a period from when the preceding resin material is transferred to the holding portion and before being conveyed to the resin sealing unit. In addition, a gripping and conveying step of conveying and arranging the next resin material to the distribution unit,
The plurality of resin materials are transferred to the holding unit while maintaining the distance between the resin materials arranged in the distribution unit in a direction orthogonal to the direction of transferring the resin material toward the holding unit. Material transportation method.

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