TW201604974A - Resin molding apparatus and resin molding method - Google Patents

Abstract

The present invention provides a resin molding apparatus and a resin molding method. In the resin molding apparatus, resin particles are stably supplied to a mold cavity. A resin material accommodating frame has: a through hole; a peripheral edge portion formed around the through hole; an adsorption slot provided on the lower surface of the peripheral edge portion; a projecting portion formed on the lower surface side of the peripheral edge portion; and a lifting member to ascend or descend along the inner side of the peripheral edge portion. The resin material accommodating frame and a release film adsorbed onto the lower surface of the peripheral edge portion are integrated to constitute a resin material supplying mechanism. Due to its own weight the lifting member may fall in the resin material supplying mechanism, and contact the projecting portion and stop thereafter. Accordingly, the release film may be pressed from the lower surface of the resin material accommodating frame. By making the lower surface of the lifting member closely contact the release film, the outward movement of the resin material from the resin material accommodating unit is terminated. In this way, the resin material can be prevented from entering the space between the lower surface of the resin material accommodating frame and the upper surface of the release film.

Description

Resin forming device and resin forming method

The present invention relates to a resin sealing of a wafer-shaped electronic component (hereinafter referred to as "wafer" as appropriate) such as a transistor, an integrated circuit (IC), and a light emitting diode (LED). A resin molding apparatus and a resin molding method used in the case and the like.

Conventionally, an IC such as a transfer molding method, a compression molding method, or an injection molding method is used to bond an IC mounted on a substrate made of a lead frame or a printed circuit board by a resin. The electronic components are sealed. In recent years, as the size of the substrate has increased and the thickness of the substrate has progressed, the necessity of resin sealing using a compression molding method has been increasing.

The resin sealing using the compression molding method was carried out in the following manner. In the resin molding apparatus, the pellet resin is supplied to a cavity formed in the lower mold and covered with the release film, and heated to be melted to form a molten resin. Next, the upper mold and the lower mold are clamped, and the wafer mounted on the substrate is immersed in the molten resin. A predetermined resin pressure is applied to the molten resin by the cavity bottom member to cure the molten resin to form a cured resin. Thus, the wafer mounted on the substrate is resin-sealed by the hardening resin.

However, in the case where the granular resin is supplied to the cavity, there is a certain distance between the resin material supply mechanism and the cavity, and the cavity is also in a tendency to become large, so The powder adhering to the particulate resin during the application of the particulate resin is easily scattered. Therefore, the particulate resin or the powder adhering to the particulate resin scatters and adheres to the parting surface of the lower mold. In the case of mold clamping, the scattered powder remains as a foreign matter (cured material) such as resin slag on the parting surface. It is necessary to remove the foreign matter remaining on the parting surface, but it is not possible to simply remove the foreign matter remaining as a cured product by cleaning or the like. Therefore, it is important to supply a predetermined amount of the particulate resin to the cavity without scattering the powder adhering to the particulate resin from the resin material supply mechanism.

As a resin sealing and molding apparatus of an electronic component, a resin sealing molding apparatus is proposed (for example, refer to paragraph [0008] of Patent Document 1 and FIG. 3): a resin sealing molding apparatus of the electronic component 10, using the electronic component 10 The metal mold for resin sealing molding is placed in the cavity 6 formed on at least the lower mold 2 in the metal mold in a state where the substrate 9 on which the electronic component 10 is mounted is attached and fixed at a predetermined position of the upper mold 1 in the mold. The resin material 14 supplied from the resin material supply mechanism 7 is heated and melted, and the mold is clamped, whereby the electronic member 10 is impregnated and contained in the resin material 14 (15) after heating and melting, the resin of the electronic member 10 The seal forming apparatus is characterized in that, in the mold opening of the mold, the resin material supply mechanism 7 includes a barrier 22 for supplying the resin material 14 into the cavity 6 without scattering the resin material 14 to the outside of the cavity 6, and The resin material 14 is diffusedly supplied to the nest 23 in the cavity 6, whereby the resin material 14 is uniformly and completely supplied into the cavity 6.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2006-120880

However, the resin sealing and molding apparatus disclosed in Patent Document 1 causes the following problems. As shown in FIG. 3 of the patent document 1, the resin material supply mechanism 7 is provided with a resin storage space portion 19 for accommodating the particulate resin 14 and a frame portion 20 which penetrates in the vertical direction and an opening and closing portion. 21, the bottom surface of the space portion 19 is formed and mounted on the bottom surface of the frame portion 20 that is reciprocable in the horizontal direction. Further, a barrier 22 for supplying the particulate resin 14 into the cavity 6 without diffusing the particulate resin 14 to the outside of the cavity 6 and diffusingly supplying the particulate resin 14 into the cavity 6 are provided in the resin material supply mechanism 7. Nested 23.

In the resin material supply mechanism 7, in order to supply the granular resin 14 to the cavity 6, it is necessary to open the opening and closing portion 21. Therefore, it is necessary to provide an opening and closing mechanism that slides the opening and closing portion 21 to perform control. Further, a barrier 22 is provided in order to prevent scattering of the particulate resin 14, and a nest 23 is provided in order to uniformly supply the particulate resin 14. Therefore, the structure of the resin material supply mechanism 7 for supplying the particulate resin 14 is complicated and expensive.

The present invention has been made to solve the above problems, and an object of the invention is to provide a resin molding apparatus and a resin molding method in which a pellet resin can be stably supplied into a cavity by using a simple resin material supply mechanism without using a resin molding apparatus. The particulate resin scatters.

In order to solve the above problems, a resin molding apparatus according to the present invention includes: an upper mold; a lower mold disposed opposite to the upper mold; a cavity provided to the lower mold; and a supply mechanism for supplying a resin material to the cavity And a mold clamping mechanism that molds a molding die having at least the upper mold and the lower mold, wherein the resin molding apparatus includes a resin storage frame that is provided in the supply mechanism and is viewed in a plan view a through hole; an adsorption mechanism that adsorbs the release film to a lower surface of the resin receiving frame to cover at least a lower surface of the resin receiving frame including the through hole; and a lifting member that is vertically movable An inner side surface of the resin receiving frame; and an input mechanism in a state where the lower surface of the elevating member is in contact with the release film, a space surrounded by the lifting member and the release film in an inner side of the resin receiving frame is inserted into the resin material; and a holding mechanism for holding the lifting member in the resin receiving frame by The lifting member is pressed down from the lower surface of the resin receiving frame to the release film of the lower surface of the resin receiving frame, and has at least the resin receiving frame, the release film, and the resin The supply mechanism of the material is transported above the lower mold, and the resin material and the release film are supplied from the supply by stopping the adsorption of the release film to the lower surface of the resin containing frame. The mechanism is supplied to the cavity together.

The resin molding apparatus according to the present invention has the following aspect: the holding mechanism has a projecting portion provided on an inner side surface of the resin containing frame, and the lifting member is located above the projecting portion The lifting is performed, and the lowering of the lifting member is blocked by the protruding portion.

The resin molding apparatus according to the present invention has the following aspect: the holding mechanism has a locking member suspended from above in an inner side surface of the resin containing frame, and the lifting member has a lower portion mounted on the locking member The locking portion of the lifting member is blocked by the locking member.

The resin molding apparatus according to the present invention has a state in which the resin material is any one of a granular, granular, powder, paste, or liquid resin at normal temperature.

The resin molding apparatus according to the present invention has the following aspects: The lifting member is formed of a material having wear resistance.

A resin molding apparatus according to the present invention includes: a supply module that supplies the resin material to the supply mechanism; and at least one molding module that has the molding die and the mold clamping mechanism, The supply module and the one forming module are detachable, and the one forming module is detachable with respect to other forming modules.

In order to solve the above problems, the resin molding method according to the present invention includes the step of supplying a resin material to a cavity provided in the lower mold using a molding die having at least an upper mold and a lower mold disposed opposite to the upper mold. And a step of clamping the molding die, the resin molding method further comprising: a step of disposing a resin receiving frame having a through hole in a plan view on the release film; and forming the release film a step of adsorbing to the lower surface of the resin receiving frame; and accommodating the resin in a state where the lower surface of the elevating member that is provided on the inner side surface of the resin receiving frame is lifted and brought into contact with the release film a step of inserting the space surrounded by the lifting member and the release film in the inner side of the frame into the resin material; and lowering the lifting member relative to the resin receiving frame, thereby at least a step of pressing the release film from the lower surface of the resin receiving frame to the inner side of the resin receiving frame; and holding the lifting member on the inner side of the resin receiving frame; and Major accommodating the resin block, together with the release film and conveying said resin material to said step above the lower mold, In the supplying step, the resin material and the release film are collectively supplied into the cavity by stopping the adsorption of the release film to the lower surface of the resin containing frame.

The resin molding method according to the present invention has a state in which the lowering of the elevating member is prevented by the projecting portion provided on the inner side surface of the resin containing frame.

The resin molding method according to the present invention has the following aspect: in the holding step, the lifting is prevented by a locking member suspended from an inner side surface of the resin containing frame and mounted on the lifting member The decline of the components.

The resin molding method according to the present invention has a state in which the resin material is any one of a granular, granular, powder, paste or liquid resin at normal temperature.

The resin molding method according to the present invention has a state in which the lifting member is formed of a material having wear resistance.

The resin molding method according to the present invention has the following aspects: further comprising: preparing a supply module for supplying the resin material; and preparing at least one molding module having the molding die and the mold clamping mechanism In the step, the supply module and the one forming module are detachable, and the one forming module is detachable with respect to other forming modules.

According to the present invention, in the resin housing frame having the through hole for the resin molding apparatus, an adsorption mechanism is provided to adsorb the release film to the lower surface of the resin containing frame, and the lifting member is raised and lowered along the inner side surface of the resin containing frame; And holding mechanism to hold the lifting member in the resin receiving frame in. The supply mechanism for supplying the resin material is configured by integrating the resin container frame and the release film adsorbed to the lower surface of the resin container frame. In a state where the release film is pressed down from the lower surface of the resin containing frame by the lifting member, the supply mechanism is housed in a space surrounded by the lifting member and the release film. The resin material is transported into the cavity. Thereby, the resin material and the release film can be supplied together into the cavity without scattering the resin material.

1‧‧‧Resin material containment frame (resin containment frame)

1A‧‧‧Resin material supply mechanism (supply organization)

2‧‧‧through holes

2A‧‧‧Resin material storage department (space)

3‧‧‧The Peripheral Department

4‧‧‧Adsorption tank (adsorption mechanism)

5‧‧‧Outreach (maintaining agency)

6‧‧‧ Lifting members

6a, 6b‧‧‧ convex

7‧‧‧Resin material transport agency

7a, 7b‧‧‧ Keeping Department

8‧‧‧X-Y Workbench

9‧‧‧ release film

10‧‧‧Resin materials

10A‧‧‧ molten resin (resin material)

11‧‧‧Down mold (forming die)

12‧‧‧ cavity

13‧‧‧Upper mold (forming die)

14‧‧‧ cavity bottom member

15‧‧‧chip

16‧‧‧ Sealed front substrate

17‧‧‧ Sealing members

18‧‧‧ hardened resin

19‧‧‧Outreach

20‧‧‧Springs (elastic members, holding mechanisms)

21‧‧‧Resin forming device

22‧‧‧Substrate supply and storage module

23A, 23B, 23C‧‧‧ Forming modules

24‧‧‧Resin material supply module (supply module)

25‧‧‧ Sealed front substrate supply unit

26‧‧‧Sealed substrate

27‧‧‧Seaned substrate storage unit

28‧‧‧Substrate Placement Department

29‧‧‧Substrate transport agency

30‧‧‧Clamping mechanism

31‧‧‧ Release film supply mechanism

32‧‧‧ Cleaning institutions

33‧‧‧Resin input organization (input organization)

D‧‧‧established distance

S1, P1, C1, M1‧‧‧ established location

(a) to (d) of FIG. 1 are schematic cross-sectional views showing a process of accommodating a resin material in a resin material storage frame in the first embodiment of the resin molding apparatus according to the present invention.

(a) to (c) of FIG. 2 are schematic cross-sectional views showing a process of supplying a resin material into a cavity using the resin material housing frame shown in FIG. 1 .

(a) to (b) of FIG. 3 are schematic cross-sectional views showing a process of resin-sealing a wafer mounted on a substrate.

(a) to (d) of FIG. 4 are schematic cross-sectional views showing a process of accommodating a resin material in a resin material storage frame in the second embodiment of the resin molding apparatus according to the present invention.

FIG. 5 is a plan view showing a schematic configuration of the apparatus in the third embodiment of the resin molding apparatus according to the present invention.

As shown in FIG. 1, the resin material containment frame 1 is provided with the following parts. In other words, the resin material container frame 1 is provided with a through hole 2 having an opening along the upper and lower sides, a peripheral edge portion 3 formed around the through hole 2, and an adsorption groove 4 provided on the lower surface of the peripheral edge portion 3; Formed on the lower surface side of the peripheral edge portion 3 and protruding toward the inner side; and the elevation member 6 along the inner side of the peripheral edge portion 3 Face lift. A release film 9 is adsorbed on the lower surface of the peripheral portion 3. The resin material supply frame 1A is formed by integrating the resin material container frame 1 and the release film 9 adsorbed to the lower surface of the peripheral edge portion 3. The space surrounded by the upper surface of the release film 9 and the inner side surface of the elevation member 6 constitutes the resin material storage portion 2A. The elevating member 6 falls due to its own weight in the resin material supply mechanism 1A, and comes into contact with the extension portion 5 to stop. Thereby, the release film 9 and the resin material 10 are pressed down from the lower surface of the resin material container frame 1 by a predetermined distance d. By bringing the lower surface of the elevating member 6 into close contact with the release film 9, the cut resin material 10 is moved outward from the resin material accommodating portion 2A. Therefore, it is possible to prevent the resin material 10 from entering between the lower surface of the resin material containing frame 1 and the upper surface of the release film 9.

(Example 1)

A resin material storage frame used in the first embodiment of the resin molding apparatus according to the present invention will be described with reference to Figs. 1 to 3 . Any of the figures in the present application file are appropriately omitted or exaggerated for easy understanding to be exemplarily drawn. The same reference numerals are used for the same components, and the description is omitted as appropriate.

The resin material storage frame 1 included in the resin molding apparatus shown in FIG. 1 includes a through hole 2 having an opening along the upper and lower sides, a peripheral edge portion 3 formed around the through hole 2, and an adsorption groove 4 provided under the peripheral edge portion 3. The surface portion; the projecting portion 5 is formed on the lower surface side of the peripheral edge portion 3 and protrudes inward; and the elevating member 6 is raised and lowered along the inner side surface of the peripheral edge portion 3.

The elevating member 6 is formed in an inverted L shape. The elevating member 6 has a convex portion 6a extending in the horizontal direction and a convex portion 6b extending in the vertical direction. The elevating member 6 is dropped by its own weight, and is stopped by the lower surface of the convex portion 6a of the elevating member 6 being in contact with the upper surface of the projecting portion 5 formed on the peripheral edge portion 3. The projecting portion 5 formed on the lower surface side of the peripheral portion 3 serves to prevent lifting The action of the member 6 falling due to its own weight. That is, the extension portion 5 has a function as a holding mechanism that stops the falling of the elevating member 6. In a state where the elevating member 6 is stopped, the lower surface of the convex portion 6b of the elevating member 6 is located below the lower surface of the peripheral edge portion 3 at a predetermined distance d. The predetermined distance d is set to about 0.5 mm to 2 mm depending on the amount of resin supplied and the hardness of the release film.

The peripheral portion 3 is formed of, for example, a metal that is easily processed such as aluminum. Preferably, the elevating member 6 is formed of a material having wear resistance such as a metal material such as stainless steel or chrome steel or a ceramic material so that the abrasion of the bottom surface of the convex portion 6b is not accelerated. Further, synthetic rubber may be embedded in the lower surface side of the peripheral portion 3, and the adsorption groove 4 may be formed on the synthetic rubber. By embedding the synthetic rubber, the adhesion of the lower surface of the peripheral portion 3 can be improved. As the synthetic rubber, a ruthenium rubber or a fluororubber having heat resistance is preferably used.

The material transport mechanism 7 is a transport mechanism that moves the resin material accommodation frame 1. As shown in Fig. 1 (a), the material conveying mechanism 7 has a holding portion 7a that sandwiches and holds the resin material holding frame 1 from the lateral direction, and a holding portion 7b that is connected to the holding portion 7a and can be raised and lowered. As will be described later, the holding portion 7a and the holding portion 7b provided in the material conveying mechanism 7 can hold and hold the peripheral portion of the release film that is adsorbed to the lower surface of the peripheral edge portion 3 from above and below. When the resin material accommodation frame 1 is moved by the resin material conveying mechanism 7, the lower surface of the convex portion 6a of the elevation member 6 comes into contact with the upper surface of the extension portion 5, whereby the elevation member 6 is stopped. The lower surface of the convex portion 6b of the elevating member 6 is lowered by a predetermined distance d from the lower surface of the peripheral edge portion 3.

The operation of accommodating the resin material using the resin material housing frame 1 will be described with reference to (a) to (d) of Fig. 1 . As shown in Fig. 1(a), first, the long release film 9 supplied from a release film supply mechanism (not shown) is placed on the X-Y table 8, so that wrinkles or slack are not generated. After covering the release film 9, the release film 9 is sucked by an adsorption mechanism (not shown) Attached to the X-Y workbench 8. The release film 9 is cut to retain only the necessary portion of the release film 9 after adsorption. In (a) of FIG. 1, the release film 9 is cut to be slightly larger than the X-Y table 8.

Next, using the resin material conveying mechanism 7, the resin material containing frame 1 is moved to the upper side of the X-Y table 8 and stopped. The period in which the resin material accommodation frame 1 is moved and the state in which the resin material accommodation frame 1 is stopped are in a state in which the lower surface of the convex portion 6a of the elevation member 6 comes into contact with the upper surface of the extension portion 5 and is stopped. The lower surface of the convex portion 6b of the elevating member 6 is lowered by a predetermined distance d from the lower surface of the peripheral edge portion 3.

Next, as shown in FIG. 1(b), the resin material accommodating frame 1 is lowered, and the resin material accommodating frame 1 is placed on the release film 9 adsorbed on the X-Y table 8. In this process, the lower surface of the convex portion 6b of the elevating member 6 which is lowered by a predetermined distance d from the lower surface of the peripheral portion 3 is first brought into contact with the release film 9. Further, by lowering the resin material accommodation frame 1, the elevation member 6 is lifted by the reaction from the X-Y table 8 and is lifted along the inner side surface of the peripheral edge portion 3. Further, the lower surface of the peripheral edge portion 3 is brought into contact with the release film 9 by lowering the resin material accommodation frame 1. In this state, the elevating member 6 is lifted from the surface of the release film 9 by a predetermined distance d. The lower surface of the elevating member 6 and the lower surface of the peripheral edge portion 3 are in contact with the release film 9, and the resin material receiving frame 1 is placed on the release film 9.

In a state where the resin material container frame 1 is placed on the release film 9, the opening below the through hole 2 is closed by the release film 9. Thereby, the resin material accommodating frame 1 and the release film 9 are integrated, and the through hole 2 functions as the resin material accommodating portion 2A in which the resin material is accommodated. Specifically, the through hole 2 which is surrounded by the elevating member 6 on the release film 9 is referred to as a resin material accommodating portion 2A.

Next, as shown in FIG. 1(c), a resin material injection mechanism (not shown) A predetermined amount of the resin material 10 is introduced into the resin material accommodating portion 2A. As the resin material 10, a resin in a granular form, a powder form, a granular form, or a paste form, or a resin (liquid resin) which is liquid at normal temperature can be used. When the liquid resin is used, the liquid resin is discharged to the resin material accommodating portion 2A by the dispenser. In the present embodiment, a case where a particulate resin (particle resin) is used as the resin material 10 will be described.

Next, as shown in FIG. 1(d), the adsorption of the release film 9 by the X-Y table 8 is released. Thereafter, the release film 9 is sucked by the adsorption groove 4 provided in the resin material containing frame 1, and the release film 9 is adsorbed to the lower surface of the peripheral portion 3. The holding portion 7b provided in the resin material conveying mechanism 7 is raised, and the peripheral portion of the release film 9 is held by the holding portion 7a and the holding portion 7b and held. In this state, the resin material housing frame 1 and the release film 9 are integrated. In this way, the structural elements in which the resin material accommodating frame 1 and the release film 9 are integrated are used as the resin material supply mechanism 1A.

Then, the resin material supply mechanism 1 is used to hold the resin material supply mechanism 1A to which the resin material 10 is supplied, that is, the resin material storage frame 1, the release film 9 and the resin material 10 are held together. The resin material transport mechanism 7 has a function of sandwiching and holding the resin material accommodation frame 1 from the lateral direction by the holding portion 7a, and a function of holding and holding the peripheral portion of the release film 9 from the upper and lower sides by the holding portion 7a and the holding portion 7b.

Next, the resin material supply mechanism 1A lifts the resin material supply mechanism 1A from the X-Y table 8. By lifting the resin material supply mechanism 1A, the elevating member 6 falls along the inner side surface of the peripheral edge portion 3 due to its own weight. The elevating member 6 is dropped until the lower surface of the convex portion 6a comes into contact with the upper surface of the projecting portion 5, thereby stopping. In this state, the release film 9 and the resin material 10 accommodated in the release film 9 are pressed downward by a predetermined distance d due to the weight of the elevating member 6. Keeping The resin material 10 is conveyed in a state in which the resin material 10 is housed in the resin material accommodating portion 2A which is a region surrounded by the lift member 6 and is surrounded by the lift member 6. In this manner, the resin material 10 can be cut from the resin material accommodating portion 2A toward the outside (the peripheral edge portion 3) by the elevating member 6. In other words, in a state where the lower surface of the elevating member 6 is in close contact with the release film 9, the resin material 10 can be prevented from entering between the lower surface of the peripheral edge portion 3 and the upper surface of the release film 9. Therefore, the resin material 10 accommodated in the resin material accommodating portion 2A can be transported in a stable state by the resin material transport mechanism 7 without attaching the resin material 10 to the lower surface of the peripheral edge portion 3.

The operation of supplying the resin material 10 to the cavity will be described with reference to Fig. 2 . First, as shown in FIG. 2(a), the resin material supply mechanism 7 is moved to a predetermined position of the lower mold 11 by the resin material conveying mechanism 7, and stopped. In this state, the release film 9 and the resin material 10 are pressed downward by a predetermined distance d due to the weight of the elevating member 6. A cavity 12 to which the resin material 10 and the release film 9 are to be supplied is disposed in the lower mold 11. The cavity 12 is formed to be slightly larger than the resin material accommodating portion 2A in plan view. Specifically, it is preferable that the cavity 12 is formed in a size such that the convex portion 6b of the elevating member 6 can be inserted into the cavity 12. In other words, the resin material housing frame 1 is formed such that the convex portion 6b of the lifting and lowering member 6 can be inserted into the cavity 12.

Next, as shown in FIG. 2(b), the resin material supply mechanism 1A is lowered by the resin material conveying mechanism 7. The release film 9 and the resin material 10 are collectively supplied into the cavity 12 by lowering the resin material supply mechanism 1A. The release film 9, the resin material 10, and the elevating member 6 are inserted into the cavity 12 in a state where the lower surface of the resin material supply mechanism 1A, that is, the lower surface of the release film 9, is brought into contact with the parting surface of the lower mold 11. . In this state, the resin material 10 is inserted until the parting surface from the lower mold 11 is positioned below the predetermined distance d. Since the resin material 10 and the release film 9 are collectively inserted into the cavity 12 by the resin material transport mechanism 7, the resin material can be prevented. The material 10 is scattered from the resin material accommodating portion 2A to the outside. Therefore, it is possible to stably supply the resin material 10 of a predetermined amount into the cavity 12.

Next, the adsorption of the suction release film 9 by the adsorption groove 4 of the peripheral portion 3 is released. The release film 9 inserted into the cavity 12 receives heat from a heater (not shown) built in the lower mold 11. The release film 9 is softened and elongated by being heated. The release film 9 is adsorbed by an adsorption hole (not shown) provided in the cavity 12 and the lower mold 11 in a state where the release film 9 is softened. Thus, the release film 9 is adsorbed to correspond to the shape of the cavity 12 without wrinkles or slack. Further, the resin material 10 and the release film 9 are supplied together into the cavity 12.

Then, as shown in FIG. 2(c), after the resin material 10 and the release film 9 are collectively supplied to the cavity 12, the resin material container frame 1 is lifted from the lower mold 11 by the resin material transport mechanism 7. Since the resin material 10 and the release film 9 are supplied into the cavity 12, only the resin material housing frame 1 is held by the resin material conveying mechanism 7. In this state, the lower surface of the convex portion 6b of the elevating member 6 is lowered by a predetermined distance d from the lower surface of the peripheral portion 3. In this manner, the resin material 10 and the release film 9 can be stably supplied into the cavity 12 from the resin material supply mechanism 1A.

Further, in FIGS. 1 and 2, the projecting portion 5 is provided on the lower surface side of the peripheral edge portion 3. The present invention is not limited thereto, and the projecting portion 5 may be provided between the upper surface side and the lower surface side of the peripheral edge portion 3. It suffices that the extension portion 5 has a function of preventing the falling of the elevating member 6.

The structure of the molding die and the operation of the resin sealing in the resin molding apparatus will be described with reference to Fig. 3 . As shown in FIG. 3(a), in the resin molding apparatus, the upper mold 13 is provided opposite to the lower mold 11. The upper mold 13 and the lower mold 11 constitute a forming mold. A cavity bottom member 14 for pressing the molten resin 10A heated and melted in the cavity 12 is provided in the lower mold 11. The sealed front substrate 16 on which the wafer 15 is mounted is attached or fixed by the clip on the upper mold 13. In the parting surface of the upper mold 13 A sealing member 17 for cutting the cavity 12 from the outside air when the mold is closed is provided between the parting faces of the lower mold 11.

First, as shown in FIG. 3(a), in a state where the mold is opened, the sealed front substrate 16 is transported to a predetermined position of the upper mold 13 by a substrate supply mechanism (not shown), and is fixed to the upper mold 13. . The resin material supply mechanism 1A (see FIG. 2) transports the resin material supply mechanism 1A to a predetermined position of the lower mold 11, and supplies the resin material 10 and the release film 9 to the cavity 12 provided in the lower mold 11. The molten resin 10A is produced by heating the resin material 10 supplied to the lower mold 11.

Next, as shown in Fig. 3(b), the upper mold 13 and the lower mold 11 are clamped by a mold clamping mechanism (not shown). The wafer 15 mounted on the sealing front substrate 16 is immersed in the molten resin 10A in the cavity 12 by mold clamping. The cavity bottom member 14 is moved upward by a drive mechanism (not shown) to pressurize the molten resin 10A. Next, the cured resin 18 is formed by heating the molten resin 10A. In this state, the wafer 15 mounted on the sealing front substrate 16 is resin-sealed by the hardening resin 18. After the resin sealing is completed, the upper mold 13 and the lower mold 11 are opened. After the mold is opened, the sealed substrate is taken out. In this way, the resin seal is completed.

Further, in the process of clamping the upper mold 13 and the lower mold 11, it is preferable to draw the inside of the cavity 12 by using a vacuuming mechanism (not shown) to reduce the pressure. In this manner, the air remaining in the cavity 12 and the air bubbles and the like contained in the molten resin 10A are discharged to the outside of the forming mold.

According to the present embodiment, the lifting member 6 that moves up and down along the inner side surface of the peripheral edge portion 3 is provided in the resin material housing frame 1. The elevating member 6 falls due to its own weight and comes into contact with the extension portion 5 to stop. The projecting portion 5 has a function as a holding mechanism that stops the falling of the elevating member 6. The resin material supply mechanism 1A is configured by integrating the resin material housing frame 1 and the release film 9. In the resin material supply mechanism 1A, the release film 9 and the resin material 10 are removed from the tree by the elevating member 6 falling The lower surface of the fat material containing frame 1 is pressed down by a predetermined distance d. By bringing the lower surface of the elevating member 6 into close contact with the release film 9, the resin material 10 can be cut from the resin material accommodating portion 2A toward the outside. That is, it is possible to prevent the resin material 10 from entering between the lower surface of the resin material containing frame 1 and the upper surface of the release film 9. Therefore, the resin material 10 accommodated in the resin material accommodating portion 2A can be transported in a stable state by the resin material transport mechanism 7.

Further, since the resin material 10 can be prevented from entering between the lower surface of the resin material containing frame 1 and the upper surface of the release film 9, the resin material 10 does not adhere to the lower surface of the resin material containing frame 1. Therefore, the resin material 10 adhering to the lower surface of the resin material container frame 1 does not adhere to the cured material. Since the cured product is not adhered, it is easy to automatically clean the resin material containing frame 1 using, for example, a brush or the like. Therefore, the time required for maintenance can be reduced, and the operability and productivity in the resin molding apparatus can be improved.

Further, according to the present embodiment, the resin material transporting mechanism 7 is placed in the resin material accommodating portion 2A (the circumscribing by the elevating member 6) in a state where the lower surface of the elevating member 6 is in close contact with the release film 9. The resin material 10 of the hole 2) and the release film 9 are supplied together into the cavity 12. Therefore, the resin material 10 can be supplied into the cavity 12 without scattering the resin material 10 from the resin material accommodating portion 2A to the outside. Since a predetermined amount of the resin material 10 can be stably supplied into the cavity 12, the quality of the product can be improved.

Further, according to the present embodiment, the falling of the elevating member 6 is stopped by the projecting portion 5 provided in the resin material housing frame 1. Therefore, it is not necessary to provide a control mechanism for controlling the operation of the elevating member 6, and the resin material accommodating portion 2A can be formed with a very simple structure. When the lower surface of the elevating member 6 is brought into close contact with the release film 9 by the falling of the elevating member 6, the resin material 10 can be prevented from entering between the lower surface of the resin material containing frame 1 and the upper surface of the release film 9. therefore, The resin material supply mechanism 1A can have a simple structure, and the structure of the resin molding apparatus can also be simplified, so that the cost can be reduced.

(Example 2)

The resin material container frame 1 used in the second embodiment of the resin molding apparatus according to the present invention will be described with reference to Fig. 4 . The difference from Embodiment 1 is that a locking member is used as a holding mechanism for stopping the falling of the lifting member 6.

As shown in FIG. 4, the resin material container frame 1 is provided with an overhanging portion 19 formed on the upper surface side of the peripheral edge portion 3 and protruding inward. The lower surface of the projecting portion 19 and the upper surface of the elevating member 6 are connected by, for example, a spring 20 or the like as an elastic locking member. The elevating member 6 falls due to its own weight, and the drop is prevented by the spring 20 after falling to some extent. Therefore, the spring 20 has a function as a holding mechanism that stops the falling of the elevating member 6.

Similarly to the first embodiment, in a state where the elevating member 6 is stopped, the lower surface of the convex portion 6b of the elevating member 6 is located below the lower surface of the peripheral portion 3 at a predetermined distance d. Further, the projecting portion 19 may be provided between the upper surface side and the lower surface side, and may not be provided on the upper surface side of the peripheral edge portion 3. The material of the peripheral portion 3 and the elevating member 6 is the same as that of the first embodiment.

The operation of accommodating the resin material 10 using the resin material housing frame 1 will be described with reference to (a) to (d) of FIG. 4 . First, as shown in (a) of FIG. 4, the release film 9 is adsorbed onto the X-Y table 8. The release film 9 is cut, leaving only the necessary portion of the release film 9. The resin material housing frame 1 is moved above the X-Y table 8 by using the resin material conveying mechanism 7. In this state, the lower surface of the convex portion 6b of the elevating member 6 is positioned below the lower surface of the peripheral portion 3 by a predetermined distance d, and the elevating member 6 is held by the spring 20.

Next, as shown in FIG. 4(b), the resin material containing frame 1 is lowered and placed on the X-Y table 8. Similarly to the first embodiment, the lower surface of the elevating member 6 which is dropped from the lower surface of the peripheral portion 3 by a predetermined distance d and is stopped is in contact with the release film 9. Further, by lowering the resin material accommodation frame 1, the elevation member 6 is lifted by the reaction from the X-Y table 8 and is lifted along the inner side surface of the peripheral edge portion 3. Further, the lower surface of the peripheral edge portion 3 is brought into contact with the release film 9 by lowering the resin material accommodation frame 1. In this state, the elevating member 6 is lifted from the surface of the release film 9 by a predetermined distance d. The lower surface of the elevating member 6 and the lower surface of the peripheral edge portion 3 are in contact with the release film 9, and the resin material receiving frame 1 is placed on the release film 9.

Next, as shown in FIG. 4(c), a predetermined amount of the resin material 10 is introduced into the resin material accommodating portion 2A from a resin injection mechanism (not shown).

Then, as shown in FIG. 4(d), after the XY table 8 is released from the release film 9, the release film 9 is sucked by the adsorption tank 4 provided in the resin material storage frame 1, thereby separating The film 9 is adsorbed to the lower surface of the peripheral portion 3. The resin material supply mechanism 1A is held by using the resin material transport mechanism 7. The resin material supply mechanism 1A is lifted from the X-Y table 8 by the resin material conveying mechanism 7. By lifting the resin material supply mechanism 1A, the elevation member 6 falls along the inner side surface of the peripheral edge portion 3 due to its own weight. The lifting member 6 is held by the spring 20 at a time when the predetermined distance d is dropped. In this state, the release film 9 and the resin material 10 are pressed downward by a predetermined distance d due to the weight of the elevating member 6. The resin material 10 can be cut from the resin material accommodating portion 2A toward the outside by the elevating member 6. Therefore, it is possible to prevent the resin material 10 from entering between the lower surface of the peripheral portion 3 and the upper surface of the release film 9.

The operation of supplying the release film 9 and the resin material 10 together into the cavity 12 by the resin material transport mechanism 7 and the operation from the mold clamping to the resin sealing are the same as in the first embodiment, because This is omitted.

According to the present embodiment, the resin material container frame 1 is provided with the elevation member 6 that ascends and descends along the inner side surface of the resin material container frame 1. When the elevating member 6 is dropped by the predetermined distance d, the elevating member 6 is stopped by the holding mechanism such as the spring 20. The release film 9 and the resin material 10 are pressed down from the lower surface of the resin material container frame 1 by a predetermined distance d by the falling of the lifting member 6. By bringing the lower surface of the elevating member 6 into close contact with the release film 9, the resin material 10 can be cut from the resin material accommodating portion 2A toward the outside. Therefore, the resin material 10 accommodated in the resin material accommodating portion 2A can be transported in a stable state by the resin material transport mechanism 7.

According to the present embodiment, the spring 20 as the elastic locking member is used as the holding mechanism for stopping the falling of the elevating member 6. Not limited to this, for example, a hook or the like as a locking member can be used. The holding means may be any mechanism that stops the falling of the elevating member 6. Since the operation and effect are the same as those in the first embodiment, the description thereof is omitted.

(Example 3)

A third embodiment of the resin molding apparatus according to the present invention will be described with reference to Fig. 5 . The resin molding apparatus 21 shown in FIG. 5 includes a substrate supply storage module 22 as a component, three molding modules 23A, 23B, and 23C, and a resin material supply module 24. The substrate supply storage module 22, the molding modules 23A, 23B, and 23C and the resin material supply module 24, which are constituent elements, can be detachably attached to each other and can be exchanged. For example, in a state in which the substrate supply storage module 22 and the molding module 23A are mounted, the molding module 23B can be attached to the molding module 23A, and the resin material supply module 24 can be attached to the molding module 23B.

The substrate supply and storage module 22 is provided with a pre-sealed substrate supply unit 25, The sealed front substrate 16 is supplied; the sealed substrate receiving portion 27 houses the sealed substrate 26; the substrate mounting portion 28 is used to transfer the sealed front substrate 16 and the sealed substrate 26; and the substrate transport mechanism 29 transports the sealed front substrate 16 and The rear substrate 26 is sealed. The substrate mounting portion 28 moves in the Y direction in the substrate supply and storage module 22 . The substrate transport mechanism 29 moves in the X direction and the Y direction in the substrate supply and storage module 22 and each of the molding modules 23A, 23B, and 23C. The predetermined position S1 is a position in which the substrate conveyance mechanism 29 is in an inoperative state and is in a standby state.

Each of the molding modules 23A, 23B, and 23C is provided with a lower mold 11 that can be raised and lowered and an upper mold 13 that is disposed to face the lower mold 11 (see FIG. 3). The upper mold 13 and the lower mold 11 constitute a forming mold. Each of the forming modules 23A, 23B, and 23C has a mold clamping mechanism 30 (a circular portion indicated by a chain double-dashed line) for clamping and opening the upper mold 13 and the lower mold 11. The cavity 12 to which the release film 9 and the resin material 10 are to be supplied is disposed in the lower mold 11. The lower mold 11 and the upper mold 13 can be closed and opened by relative movement.

The resin material supply module 24 is provided with an XY table 8 , a release film supply mechanism 31 for supplying a release film (see FIG. 1 ) to the XY table, and a cleaning mechanism 32 for cleaning the resin material container frame 1 . The resin material transport mechanism 7 transports the resin material storage frame 1 and the resin material supply mechanism 1A, and the resin material supply mechanism 33, and the resin material 10 is introduced into the resin material storage portion 2A (see FIG. 1). The X-Y table 8 moves in the X direction and the Y direction in the resin material supply module 24. The resin material conveying mechanism 7 moves in the X direction and the Y direction in the resin material supply module 24 and each of the molding modules 23A, 23B, and 23. The predetermined position M1 is a position in which the resin material conveying mechanism 7 is in an inoperative state and is in a standby state.

The operation of resin sealing using the resin molding device 21 will be described with reference to Fig. 5 . First, in the substrate supply and storage module 22, the substrate is supplied from the pre-sealed substrate supply unit 25 to the substrate. The placement portion 28 sends out the sealed front substrate 16. Next, the substrate transport mechanism 29 is moved in the -Y direction from the predetermined position S1, and the sealed front substrate 16 is received from the substrate mounting portion 28. The substrate transport mechanism 29 is returned to the predetermined position S1. Next, for example, the substrate transport mechanism 29 is moved in the +X direction to a predetermined position P1 in the forming module 23B. Next, in the molding module 23B, the substrate conveyance mechanism 29 is moved in the -Y direction to stop at the predetermined position C1 on the lower mold 11. Next, the substrate transport mechanism 29 is moved upward to fix the sealed front substrate 16 to the upper mold 13 (see FIG. 3). The substrate transport mechanism 29 is returned to the predetermined position S1 in the substrate supply storage module 22.

Next, in the resin material supply module 24, the release film 9 (see FIG. 1) supplied from the release film supply mechanism 31 to the X-Y table 8 is cut into a predetermined size. Next, the resin material conveying mechanism 7 is moved in the -Y direction from the predetermined position M1 to receive the resin material containing frame 1 cleaned by the cleaning mechanism 32. Next, the resin material conveying mechanism 7 is moved in the -Y direction, and the resin material containing frame 1 is placed on the release film 9 adsorbed to the X-Y table 8. The resin material conveying mechanism 7 is returned to the original position M1. Then, the X-Y table 8 is moved in the +X direction, and the resin material accommodating portion 2A (see FIG. 1) is stopped at a predetermined position below the resin material feeding mechanism 33. Then, by moving the X-Y table 8 in the X direction and the Y direction, a predetermined amount of the resin material 10 is supplied from the resin material feeding mechanism 33 to the resin material accommodating portion 2A (see FIG. 1). Return the X-Y table 8 to its original position.

Then, the resin material conveying mechanism 7 is moved in the -Y direction from the predetermined position M1, and the resin material supply mechanism 1A (see FIG. 1) placed on the X-Y table 8 is received. The resin material conveying mechanism 7 is returned to the original position M1. Next, the resin material conveying mechanism 7 is moved in the -X direction to the predetermined position P1 of the forming module 23B. Next, in the forming module 23B, the resin material conveying mechanism 7 is moved in the -Y direction and stopped at a predetermined position on the lower mold 11. C1. Next, the resin material conveying mechanism 7 is lowered, whereby the resin material 10 and the release film 9 are supplied into the cavity 12. The resin material conveying mechanism 7 is returned to the original position M1.

Next, in the forming module 23B, the lower mold 11 is moved upward by the mold clamping mechanism 30 to mold the upper mold 13 and the lower mold 11. After the lapse of the predetermined time, the upper mold 13 and the lower mold 11 are opened. Next, the substrate transport mechanism 29 is moved from the predetermined position S1 of the substrate supply and storage module 22 to the predetermined position C1 on the lower mold 11, and the sealed substrate 26 is received. Then, the substrate transport mechanism 29 is moved to the upper side of the substrate mounting portion 28 via the predetermined position S1, and the pre-sealed substrate 26 is transferred to the substrate mounting portion 28. The sealed substrate 26 is housed in the sealed substrate storage portion 27 from the substrate mounting portion 28 . In this way, the resin seal is completed.

In the present embodiment, at least one forming module (specifically, three forming modules 23A, 23B, 23C) is arranged in the X direction between the substrate supply and storage module 22 and the resin material supply module 24. . Further, the substrate supply storage module 22 and the resin material supply module 24 may be one module, and one molding module 23A may be detachably coupled to the module in the X direction. Further, another molding module 23B may be detachably coupled to the molding module 23A. Thereby, the molding modules 23A, 23B, ... can be increased or decreased. Therefore, the structure of the resin molding apparatus 21 can be optimized in accordance with the production method and the production amount, and the productivity can be improved.

Further, in the present embodiment, a resin molding apparatus and a resin molding method used for resin sealing a semiconductor wafer have been described. The resin-sealed article may be a semiconductor wafer such as an IC or a transistor, or may be a passive component wafer. The present invention can be applied to resin sealing of one or a plurality of wafers mounted on a substrate such as a lead frame, a printed substrate, or a ceramic substrate by a curing resin.

Further, the present invention is not limited to the case where the electronic component is resin-sealed, and the optical member such as a lens, a reflector (reflector), a light guide plate, or an optical module, and other resin products may be applied by resin molding.

The present invention is not limited to the above-described embodiments, and may be modified arbitrarily or appropriately combined as needed, or may be selectively employed, without departing from the spirit of the invention.

1‧‧‧Resin material containment frame (resin containment frame)

1A‧‧‧Resin material supply mechanism (supply organization)

2‧‧‧through holes

2A‧‧‧Resin material storage department (space)

3‧‧‧The Peripheral Department

4‧‧‧Adsorption tank (adsorption mechanism)

5‧‧‧Outreach (maintaining agency)

6‧‧‧ Lifting members

6a, 6b‧‧‧ convex

7‧‧‧Resin material transport agency

7a, 7b‧‧‧ Keeping Department

8‧‧‧X-Y Workbench

9‧‧‧ release film

10‧‧‧Resin materials

Claims (12)

A resin molding apparatus comprising: an upper mold; a lower mold disposed opposite to the upper mold; a cavity disposed in the lower mold; a supply mechanism supplying a resin material to the cavity; and a mold clamping mechanism, at least The mold having the upper mold and the lower mold is clamped, and is characterized in that: a resin storage frame is provided in the supply mechanism and has a through hole in a plan view; and an adsorption mechanism that adsorbs the release film to the release film a lower surface of the resin receiving frame covering at least a lower surface of the resin receiving frame including the through hole; and a lifting member that is vertically movable on an inner side surface of the resin receiving frame; and an input mechanism The resin material is supplied to a space surrounded by the elevating member and the release film in the inner side of the resin containing frame in a state where the lower surface of the elevating member is in contact with the release film; and the holding mechanism Holding the lifting member in the resin receiving frame, the lifting member is pressed down from the lower surface of the resin receiving frame to the release film of the lower surface of the resin receiving frame, The supply mechanism having at least the resin receiving frame, the release film, and the resin material is transported above the lower mold by stopping the release film toward the lower surface of the resin receiving frame Adsorption, the resin material and the release film are supplied together from the supply mechanism into the cavity. The resin molding apparatus according to claim 1, wherein the holding mechanism has a projecting portion provided on an inner side surface of the resin receiving frame, and the lifting member is located above the protruding portion The lifting is performed, and the lowering of the lifting member is blocked by the protruding portion. The resin molding apparatus according to claim 1, wherein the holding mechanism has a locking member suspended from above in an inner side surface of the resin containing frame, and the lifting member has a locking member mounted on the locking member In the lower locking portion, the lowering of the lifting member is blocked by the locking member. The resin molding apparatus according to any one of claims 1 to 3, wherein the resin material is any one of a granular, granular, powder, paste or liquid resin at normal temperature. The resin molding apparatus according to any one of claims 1 to 3, wherein the lifting member is formed of a material having abrasion resistance. The resin molding apparatus according to any one of claims 1 to 3, further comprising: a supply module for supplying the resin material to the supply mechanism; and having the forming die and the mold clamping At least one forming module of the mechanism, the supply module and the one forming module are detachable, and the one forming module is detachable with respect to other forming modules. A resin molding method comprising: a step of supplying a resin material to a cavity provided in the lower mold using a molding die having at least an upper mold and a lower mold disposed opposite to the upper mold; and performing the forming mold a step of clamping a mold; further comprising: a step of disposing a resin receiving frame having a through hole in a plan view on the release film; and a step of adsorbing the release film to a lower surface of the resin receiving frame; In a state in which the lower surface of the elevating member that is provided on the inner side surface of the resin containing frame is lifted and brought into contact with the release film, the elevating member and the inner side in the inner side of the resin containing frame are a step of inserting a space surrounded by the film into the resin material; and lowering the lifting member relative to the resin receiving frame to at least inside the lifting member from a lower surface of the resin receiving frame a step of pressing the release film; holding the lifting member on an inner side surface of the resin receiving frame; and transporting at least the resin receiving frame, the release film and the resin material a step of above the lower mold, in the step of supplying, by stopping the adsorption of the release film to the lower surface of the resin receiving frame, the resin material and the release film are And supplied to the cavity. The resin molding method according to claim 7, wherein in the holding step, the lowering of the elevating member is prevented by the projecting portion provided on the inner side surface of the resin containing frame. The resin molding method of claim 7, wherein in the maintaining step, the locking member is suspended by an inner side surface of the resin containing frame and mounted on the lifting member The lowering of the lifting member. The resin molding method according to any one of claims 7 to 9, wherein the resin material is any one of a granular, granular, powder, paste or liquid resin at room temperature. The resin molding method according to any one of claims 7 to 9, wherein the lifting member is formed of a material having wear resistance. The resin forming method according to any one of claims 7 to 9, which comprises: a step of preparing a supply module for supplying the resin material; and a step of preparing at least one forming module having the forming die and the clamping mechanism; the supply module and the one forming module capable of For loading and unloading, the one forming module can be loaded and unloaded relative to other forming modules.