TWI527167B - Resin sealing device and resin sealing method - Google Patents
Resin sealing device and resin sealing method Download PDFInfo
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- TWI527167B TWI527167B TW102135651A TW102135651A TWI527167B TW I527167 B TWI527167 B TW I527167B TW 102135651 A TW102135651 A TW 102135651A TW 102135651 A TW102135651 A TW 102135651A TW I527167 B TWI527167 B TW I527167B
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- resin
- forming die
- forming
- resin material
- die
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- 229920005989 resin Polymers 0.000 title claims description 433
- 239000011347 resin Substances 0.000 title claims description 433
- 238000007789 sealing Methods 0.000 title claims description 124
- 238000000034 method Methods 0.000 title claims description 28
- 239000000463 material Substances 0.000 claims description 159
- 239000000758 substrate Substances 0.000 claims description 61
- 230000007246 mechanism Effects 0.000 claims description 45
- 238000000465 moulding Methods 0.000 claims description 45
- 230000007723 transport mechanism Effects 0.000 claims description 30
- 239000002826 coolant Substances 0.000 claims description 29
- 239000012530 fluid Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 19
- 239000011810 insulating material Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 10
- 230000032258 transport Effects 0.000 claims description 9
- 239000008187 granular material Substances 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229920006351 engineering plastic Polymers 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000005340 laminated glass Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
本發明係有關一種藉由使用樹脂材料成形而成的硬化樹脂，將安裝在基板上的IC、電晶體、電容器等電子元件樹脂密封的電子元件的樹脂密封裝置及樹脂密封方法。 The present invention relates to a resin sealing device and a resin sealing method for an electronic component in which an electronic component such as an IC, a transistor, or a capacitor mounted on a substrate is sealed by a resin which is formed by using a resin material.
一直以來，使用傳遞模塑法、壓縮模塑法、注射模塑法等樹脂成形技術，藉由硬化樹脂對由引線框或印刷基板等構成的基板上安裝的IC等電子元件進行樹脂密封。此外，由於IC等電子元件的多數為晶片狀，因此下面將這種電子元件適當地稱作“晶片元件”。另外，下面將安裝在由引線框或印刷基板等構成的基板上的晶片元件，包括基板，適當地稱作“基板安裝元件”，進一步，將樹脂密封前的基板安裝元件適當地稱作“密封前基板安裝元件”，並將樹脂密封後的基板安裝元件適當地稱作“密封後基板安裝元件”。 Conventionally, an electronic component such as an IC mounted on a substrate made of a lead frame or a printed circuit board or the like is resin-sealed by a resin molding technique such as a transfer molding method, a compression molding method, or an injection molding method. Further, since many of electronic components such as ICs are wafer-shaped, such electronic components are hereinafter referred to as "wafer components" as appropriate. In addition, a wafer component mounted on a substrate composed of a lead frame or a printed substrate or the like, including a substrate, is hereinafter referred to as a "substrate mounting component" as appropriate, and further, the substrate mounting component before resin sealing is appropriately referred to as "sealing" The front substrate mounting component" and the resin-sealed substrate mounting component are appropriately referred to as "sealed substrate mounting components".
例如，使用傳遞模塑法的樹脂密封裝置一般具備如下的基本結構。該樹脂密封裝置具備材料裝填部、樹脂成形部和材料運送機構等。在材料裝填部中裝填有密封前基板安裝元件和樹脂塊。樹脂塊由熱硬化性樹脂構成，加工後成為晶片元件密封用的樹脂材料。樹脂成形部具備藉由樹脂材料將安裝在密封前基板安裝元件上的晶片元件樹脂密封的成形模。材料運送機構將密封前基板安裝元件和樹脂塊運送至樹脂成形部。 For example, a resin sealing device using a transfer molding method generally has the following basic structure. This resin sealing device includes a material filling portion, a resin molding portion, a material conveying mechanism, and the like. The material loading portion is filled with a sealed front substrate mounting member and a resin block. The resin block is made of a thermosetting resin, and is processed into a resin material for sealing a wafer element. The resin molded portion includes a molding die that resin-seases the wafer element mounted on the pre-sealed substrate mounting member with a resin material. The material transport mechanism transports the sealed front substrate mounting member and the resin block to the resin forming portion.
使用這種樹脂密封裝置，將基板安裝元件(具體來講，晶片元件)樹脂密封的步驟如下方式進行。首先，藉由加熱機構將樹脂成形部中的成形模(上模及下模)加熱至成形溫度(例如，180℃左右)，並將上模和下模開模。接著，使用材料運送機構，將材料填裝部的密封前基板安裝元件搬入至下模的分型面中的規定位置。為了優化與硬化樹脂的粘接性，密封前基板安裝元件一般預熱至100℃至120℃。接著，使用材料運送機構，將樹脂塊供給到下模中設置的料筒的內部。接著，使下模向上移動，將上模與下模合模。此時，晶片元件與其周邊的引線框收容在設置於上模與下模的至少一個中的型腔的內部。接著，藉由使用柱塞按壓料筒內的樹脂塊並使其溶融，從而生成流動性樹脂(溶融樹脂)。進一步按壓流動性樹脂，藉由樹脂通道注入到型腔內。此外，藉由以硬化所需要的所需時間加熱流動性樹脂，從而使流動性樹脂硬化以形成硬化樹脂。由此，型腔內的晶片元件與其周邊的引線框被密封在對應於型腔的形狀而成形的硬化樹脂(密封樹脂)內。接著，經過硬化所需要的所需時間後，將上模與下模開模，使密封後基板安裝元件脫模。 The step of resin-sealing the substrate mounting member (specifically, the wafer member) using such a resin sealing device is carried out as follows. First, the forming mold (upper mold and lower mold) in the resin molded portion is heated to a forming temperature (for example, about 180 ° C) by a heating mechanism, and the upper mold and the lower mold are opened. Next, the sealed substrate mounting member of the material filling portion is carried into a predetermined position in the parting surface of the lower mold by using the material conveying mechanism. In order to optimize the adhesion to the hardened resin, the sealed front substrate mounting member is generally preheated to 100 ° C to 120 ° C. Next, the resin block is supplied to the inside of the cylinder provided in the lower mold using the material conveying mechanism. Next, the lower mold is moved upward to mold the upper mold and the lower mold. At this time, the wafer element and the lead frame around it are housed inside the cavity provided in at least one of the upper mold and the lower mold. Next, the resin block in the cylinder is pressed and melted by using a plunger to form a fluid resin (melted resin). The fluid resin is further pressed and injected into the cavity through the resin channel. Further, the fluid resin is cured by heating the fluid resin for a required time required for hardening to form a hardened resin. Thereby, the wafer element in the cavity and the lead frame in the periphery thereof are sealed in a hardened resin (sealing resin) formed in accordance with the shape of the cavity. Next, after the required time required for hardening, the upper mold and the lower mold are opened, and the sealed substrate mounting member is released.
但是，由於作為樹脂塊使用熱硬化性樹脂，因此一般最好在20℃至30℃的規定溫度下保管並維持。若未在規定溫度下保管，則樹脂塊劣化並變質，成為成形不良或運送不良的主要原因。由於密封前基板安裝元件或上模及下模被加熱並被維持在高溫狀態下，因此由於來自密封前基板安裝元件或上模及下模的輻射熱等，樹脂塊易於升溫。因此，需要嚴格進行樹脂塊的保管場所的溫度管理。這被記載在例如，專利文獻1的段落[0005]至[0006]中。 However, since a thermosetting resin is used as the resin block, it is generally preferable to store and maintain it at a predetermined temperature of 20 ° C to 30 ° C. If it is not stored at a predetermined temperature, the resin block deteriorates and deteriorates, which causes a molding failure or a transportation failure. Since the front substrate mounting member or the upper mold and the lower mold are heated and maintained at a high temperature state before sealing, the resin block is liable to heat up due to radiant heat or the like from the front substrate mounting member or the upper mold and the lower mold. Therefore, it is necessary to strictly control the temperature of the storage place of the resin block. This is described, for example, in paragraphs [0005] to [0006] of Patent Document 1.
另外，在專利文獻1的段落[0007]中，作為對樹脂塊進行溫度管理的樹脂模裝置(樹脂密封裝置)，提出有如下樹脂模裝置，其特徵在於，裝備有“被配置在由分隔壁包圍周圍的腔室內，收容保管複數個樹脂塊以能夠供給到工作臺上的塊供給機構”、“將收容塊供給機構的腔室內的溫度維持在規定溫度以下的冷卻機構”和“用於控制所述冷卻機構的冷卻動作的控制機構”。 Further, in the paragraph [0007] of the patent document 1, as a resin mold device (resin sealing device) for temperature management of a resin block, there is proposed a resin mold device characterized in that it is equipped with "disposed on a partition wall" In the surrounding chamber, a block supply mechanism for storing and storing a plurality of resin blocks to be supplied to the table, and a cooling mechanism for maintaining the temperature in the chamber of the storage block supply mechanism at a predetermined temperature or lower and "for control" a control mechanism for the cooling operation of the cooling mechanism.
專利文獻1：日本特開平9-141685號公報 Patent Document 1: Japanese Patent Laid-Open No. Hei 9-141685
然而，在上述現有結構中，發生如下的問題。在由分隔壁包圍周圍的腔室中，藉由對裝填在送料器中的樹脂塊吹拂由冷卻劑冷卻的空氣，從而能夠以將腔室內的溫度維持在常溫的方式進行溫度管理。然而，從由分隔壁包圍的腔室一旦將樹脂塊搬出至外部的階段開始，樹脂塊承受來自上模及下模或密封前基板安裝元件的輻射熱的影響。因此，在從保管有樹脂塊的腔室搬出樹脂塊，並使用材料運送機構，將樹脂塊向設置於下模中的料筒內供給的期間，承受來自上模及下模或密封前引線框的輻射熱的影響，樹脂塊升溫，從而劣化或變質，具有引起產品的品質或成品率降低的可能性。 However, in the above-described conventional structure, the following problems occur. In the chamber surrounded by the partition wall, by cooling the air cooled by the coolant to the resin block loaded in the feeder, temperature management can be performed to maintain the temperature in the chamber at a normal temperature. However, from the stage in which the chamber surrounded by the partition wall carries out the resin block to the outside, the resin block is subjected to the radiant heat from the upper mold and the lower mold or the front substrate mounting member. Therefore, the resin block is carried out from the chamber in which the resin block is stored, and the resin block is supplied from the upper mold and the lower mold or the sealed front lead frame while the resin block is supplied into the cylinder provided in the lower mold by using the material transport mechanism. The influence of the radiant heat, the temperature of the resin block is deteriorated or deteriorated, and there is a possibility that the quality of the product or the yield is lowered.
另外，如果樹脂塊升溫，則劣化的樹脂塊的粉末或碎片等粘著在材料運送機構或下模料筒內等的樹脂塊收容部中，從而有時成為妨礙樹脂塊的裝填或運送的原因。因此，清潔運送機構或上模及下模等的次數或時間增加，具有使樹脂密封裝置總體的運轉率降低的可能性。 In addition, when the resin block is heated, the powder or chips of the deteriorated resin block adhere to the resin block accommodating portion such as the material transport mechanism or the lower mold cylinder, which may hinder the loading or transport of the resin block. . Therefore, the number or time of cleaning the transport mechanism, the upper mold, the lower mold, and the like increases, and there is a possibility that the operation rate of the entire resin sealing device is lowered.
另外，如果樹脂塊成為30℃以上的高溫則固化反應加速， 樹脂塊硬化而變得難以流動。由此，在樹脂密封時發生空隙或發生導線偏移，具有產品的品質或成品率降低的可能性。 In addition, if the resin block becomes a high temperature of 30 ° C or higher, the curing reaction is accelerated. The resin block hardens and becomes difficult to flow. As a result, voids or wire deflection occur during resin sealing, which may result in a decrease in product quality or yield.
另外，最近的樹脂密封裝置以具備複數個成形密封樹脂的成形模組的結構為主流，但運送密封前基板安裝元件或樹脂塊的運送機構大多被各成形模組共用。然而，由於根據各成形模組運送時間不同，因此樹脂塊承受來自上模及下模或密封前引線框的輻射熱的影響，根據成形模組而不同。由此，根據各成形模樹脂塊的狀態不同，可能發生產品的品質或成品率根據成形模組而不同(不均勻)的問題。 Further, in the recent resin sealing apparatus, a configuration of a molding module including a plurality of molding sealing resins is mainly used, but a conveying mechanism for transporting a substrate mounting member or a resin block before sealing is often shared by each molding module. However, since the transfer time of each molding module is different, the resin block is affected by the radiant heat from the upper mold and the lower mold or the lead frame before sealing, and is different depending on the molding module. Therefore, depending on the state of each of the molding die resin blocks, there is a possibility that the quality or yield of the product differs depending on the forming module (unevenness).
本發明解決上述現有問題，目的在於提供一種在樹脂密封裝置中，保管樹脂塊期間或運送樹脂塊直到供給至成形模期間中的任一期間中，均防止輻射熱對樹脂塊的影響的樹脂密封裝置及樹脂密封方法。 The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a resin sealing device which prevents the influence of radiant heat on a resin block during any of a period in which a resin block is stored or a resin block is conveyed until it is supplied to a molding die in a resin sealing device. And resin sealing method.
為了解決上述問題，本發明之樹脂密封裝置具備：第一成形模；第二成形模，與所述第一成形模相對設置；型腔，設置於所述第一成形模和所述第二成形模的至少任一個中；加熱機構，設置於所述第一成形模和所述第二成形模的至少任一個中；及運送機構，將樹脂材料運送至所述第一成形模與所述第二成形模之間；所述樹脂密封裝置在安裝於基板上的晶片元件收納在所述第一成形模與所述第二成形模之間的狀態下，將所述第一、第二成形模合模，使由所述樹脂材料生成的流動性樹脂在所述型腔內硬化以形成硬化樹脂，並藉由所述硬化樹脂將所述晶片元件樹脂密封； 所述樹脂密封裝置的特徵在於，所述運送機構具備收容所述樹脂材料的收容部，並且由絕熱性材料構成所述收容部。 In order to solve the above problems, the resin sealing device of the present invention comprises: a first forming die; a second forming die disposed opposite to the first forming die; a cavity disposed in the first forming die and the second forming At least one of the molds; a heating mechanism disposed in at least one of the first forming die and the second forming die; and a transport mechanism for transporting the resin material to the first forming die and the first Between the two forming dies; the resin sealing device inserts the first and second forming dies in a state where the wafer component mounted on the substrate is housed between the first forming die and the second forming die Forming a mold, wherein a fluid resin generated from the resin material is hardened in the cavity to form a hardened resin, and the wafer component is resin-sealed by the hardening resin; In the resin sealing device, the conveying mechanism includes a housing portion that accommodates the resin material, and the housing portion is made of a heat insulating material.
另外，本發明之樹脂密封裝置，具備：第一成形模；第二成形模，與所述第一成形模相對設置；型腔，設置於所述第一成形模和所述第二成形模的至少任一個中；加熱機構，設置於所述第一成形模和所述第二成形模的至少任一個中；及運送機構，將樹脂材料運送至所述第一成形模與所述第二成形模之間；所述樹脂密封裝置在安裝於基板上的晶片元件收納在所述第一成形模與所述第二成形模之間的狀態下，將所述第一、第二成形模合模，使由所述樹脂材料生成的流動性樹脂在所述型腔內硬化以形成硬化樹脂，並藉由所述硬化樹脂將所述晶片元件樹脂密封；所述樹脂密封裝置的特徵在於，具備：收容部，設置於所述運送機構中並收容所述樹脂材料；連通道，設置於所述收容部所具有的壁的內部；及供給機構，對所述連通道供給冷卻用介質。 Further, the resin sealing device of the present invention comprises: a first forming die; a second forming die disposed opposite to the first forming die; and a cavity provided in the first forming die and the second forming die At least one of; a heating mechanism disposed in at least one of the first forming die and the second forming die; and a transport mechanism for transporting the resin material to the first forming die and the second forming Between the dies; the resin sealing device inserts the first and second forming dies in a state where the wafer component mounted on the substrate is housed between the first forming die and the second forming die a fluid resin formed of the resin material is hardened in the cavity to form a hardened resin, and the wafer element is resin-sealed by the hardening resin; the resin sealing device is characterized by comprising: The accommodating portion is provided in the transport mechanism and houses the resin material; the connecting passage is provided inside the wall of the accommodating portion; and the supply mechanism supplies the cooling medium to the connecting passage.
另外，本發明之樹脂密封裝置，具備：第一成形模；第二成形模，與所述第一成形模相對設置；型腔，設置於所述第一成形模和所述第二成形模的至少任一個中； 加熱機構，設置於所述第一成形模和所述第二成形模的至少任一個中；及運送機構，將樹脂材料運送至所述第一成形模與所述第二成形模之間；所述樹脂密封裝置在安裝於基板上的晶片元件收納在所述第一成形模與所述第二成形模之間的狀態下，將所述第一、第二成形模合模，使由所述樹脂材料生成的流動性樹脂在所述型腔內硬化以形成硬化樹脂，並藉由所述硬化樹脂將所述晶片元件樹脂密封；所述樹脂密封裝置的特徵在於，具備：收容部，設置於所述運送機構中並收容所述樹脂材料；及蓋，包圍所述收容部，並且由絕熱性材料構成所述蓋。 Further, the resin sealing device of the present invention comprises: a first forming die; a second forming die disposed opposite to the first forming die; and a cavity provided in the first forming die and the second forming die At least one of them; a heating mechanism disposed in at least one of the first forming die and the second forming die; and a transport mechanism for transporting the resin material between the first forming die and the second forming die; The resin sealing device molds the first and second molding dies in a state in which a wafer component mounted on a substrate is housed between the first molding die and the second molding die, thereby a fluid resin formed of a resin material is cured in the cavity to form a cured resin, and the wafer element is resin-sealed by the hardening resin; the resin sealing device is characterized in that: the resin sealing device is provided with a housing portion The transport mechanism houses the resin material; and a cover that surrounds the accommodating portion and is made of a heat insulating material.
另外，本發明之樹脂密封裝置，具備：第一成形模；第二成形模，與所述第一成形模相對設置；型腔，設置於所述第一成形模和所述第二成形模的至少任一個中；加熱機構，設置於所述第一成形模和所述第二成形模的至少任一個中；及運送機構，將樹脂材料運送至所述第一成形模與所述第二成形模之間；所述樹脂密封裝置在安裝於基板上的晶片元件收納在所述第一成形模與所述第二成形模之間的狀態下，將所述第一、第二成形模合模，使由所述樹脂材料生成的流動性樹脂在所述型腔內硬化以形成硬化樹脂，並藉由所述硬化樹脂將所述晶片元件樹脂密封， 所述樹脂密封裝置的特徵在於，具備：收容部，設置於所述運送機構中並收容所述樹脂材料；蓋，包圍所述收容部；連通道，設置于所述蓋所具有的壁的內部；及供給機構，對所述連通道供給冷卻用介質。 Further, the resin sealing device of the present invention comprises: a first forming die; a second forming die disposed opposite to the first forming die; and a cavity provided in the first forming die and the second forming die At least one of; a heating mechanism disposed in at least one of the first forming die and the second forming die; and a transport mechanism for transporting the resin material to the first forming die and the second forming Between the dies; the resin sealing device inserts the first and second forming dies in a state where the wafer component mounted on the substrate is housed between the first forming die and the second forming die Passing a fluid resin generated from the resin material in the cavity to form a hardening resin, and sealing the wafer element resin by the hardening resin, The resin sealing device includes: a housing portion that is provided in the transport mechanism and houses the resin material; a cover that surrounds the housing portion; and a connecting passage that is provided inside a wall of the cover And a supply mechanism that supplies the cooling medium to the connecting passage.
另外，本發明之樹脂密封裝置的特徵在於，分別在上述樹脂密封裝置中進一步具備保管所述樹脂材料的保管機構；所述運送機構將由所述保管機構保管的所述樹脂材料運送至所述第一成形模與所述第二成形模之間；替代成將所述收容部設置於所述運送機構，將所述收容部設置於所述保管機構和所述運送機構的至少任一個中。 Further, in the resin sealing device of the present invention, the resin sealing device further includes a storage mechanism for storing the resin material, and the transport mechanism transports the resin material stored in the storage mechanism to the first Between a forming die and the second forming die; instead of providing the accommodating portion in the transport mechanism, the accommodating portion is provided in at least one of the storage mechanism and the transport mechanism.
另外，本發明之樹脂密封裝置的特徵在於，在上述的樹脂密封裝置中，所述樹脂材料為塊狀、片狀、粒狀、顆粒狀、粉末狀或在常溫下液狀的任一種。 Further, in the resin sealing device of the present invention, the resin material is in the form of a block, a sheet, a pellet, a pellet, a powder, or a liquid at a normal temperature.
另外，本發明之樹脂密封裝置的特徵在於，在上述的樹脂密封裝置中，在收容部收容有複數個塊狀的所述樹脂材料。 Further, in the resin sealing device of the present invention, in the resin sealing device described above, a plurality of block-shaped resin materials are accommodated in the housing portion.
另外，本發明之樹脂密封裝置的特徵在於，在上述的樹脂密封裝置中，具有：成形模組，至少具有成形模組和合模機構，所述成形模組至少具有所述第一成形模及所述第二成形模，所述合模機構將所述成形模組合模；及接收模組，至少具有接收所述樹脂材料和所述基板中的至少任一個的功能； 所述成形模組設置有複數個；複數個所述成形模組中的一個成形模組與所述接收模組能夠裝卸；複數個所述成形模組彼此能夠相互裝卸。 Further, the resin sealing device of the present invention is characterized in that the resin sealing device has a molding module having at least a molding module and a mold clamping mechanism, and the molding module has at least the first molding die and the a second forming die, the clamping mechanism combining the forming die; and a receiving module having at least a function of receiving at least one of the resin material and the substrate; The forming module is provided with a plurality of modules; one of the plurality of forming modules and the receiving module are detachable; and the plurality of forming modules are detachable from each other.
為了解決上述問題，本發明之樹脂密封方法，包括：準備相對設置且至少在任一個中具有型腔的第一、第二成形模的步驟；加熱所述第一成形模和所述第二成形模的至少任一個的步驟；將樹脂材料運送至所述第一成形模與所述第二成形模之間的步驟；在安裝於基板上的晶片元件收納在所述第一成形模與所述第二成形模之間的狀態下，將所述第一、第二成形模合模的步驟；使由所述樹脂材料生成的流動性樹脂在所述型腔內硬化以形成硬化樹脂的步驟；及藉由所述硬化樹脂將所述晶片元件樹脂密封的步驟；所述樹脂密封方法的特徵在於，在運送所述樹脂材料的步驟中，準備由絕熱性材料構成的收容部，並將運送的所述樹脂材料收容在所述收容部中。 In order to solve the above problems, the resin sealing method of the present invention comprises the steps of: preparing first and second forming dies which are disposed opposite each other and having a cavity in at least one of them; heating the first forming die and the second forming die a step of transporting a resin material between the first forming die and the second forming die; storing the wafer component mounted on the substrate in the first forming die and the first a step of clamping the first and second molding dies in a state between two molding dies; and a step of hardening a fluid resin generated from the resin material in the cavity to form a hardening resin; a step of sealing the wafer element resin by the hardening resin; the resin sealing method is characterized in that, in the step of transporting the resin material, a housing portion made of a heat insulating material is prepared, and the transporting portion is prepared The resin material is housed in the housing portion.
另外，本發明之樹脂密封方法，包括：準備相對設置且至少在任一個中具有型腔的第一、第二成形模的步驟；加熱所述第一成形模和所述第二成形模的至少任一個的步驟；將樹脂材料運送至所述第一成形模與所述第二成形模之間的步驟；在安裝於基板上的晶片元件收納在所述第一成形模與所述第二成形模之間的狀態下，將所述第一、第二成形模合模的步驟；使由所述樹脂材料生成的流動性樹脂在所述型腔內硬化以形成硬化樹 脂的步驟；及藉由所述硬化樹脂將所述晶片元件樹脂密封的步驟；所述樹脂密封方法的特徵在於，在運送所述樹脂材料的步驟中，準備在壁內部具有連通道的收容部，並在對所述連通道供給冷卻用介質的狀態下，將運送的所述樹脂材料收容在所述收容部中。 Further, the resin sealing method of the present invention comprises: a step of preparing first and second forming dies which are disposed opposite each other and having a cavity in at least one of them; heating at least any of the first forming die and the second forming die a step of transporting a resin material between the first forming die and the second forming die; storing the wafer member mounted on the substrate in the first forming die and the second forming die a step of clamping the first and second forming dies in a state of between; causing a fluid resin generated from the resin material to harden in the cavity to form a hardening tree And a step of sealing the wafer element resin by the hardening resin; the resin sealing method is characterized in that, in the step of transporting the resin material, a housing portion having a connecting passage inside the wall is prepared And the conveyed resin material is accommodated in the accommodating portion in a state where the cooling medium is supplied to the connecting passage.
另外，本發明之樹脂密封方法，包括：準備相對設置且至少在任一個中具有型腔的第一、第二成形模的步驟；加熱所述第一成形模和所述第二成形模的至少任一個的步驟；將樹脂材料運送至所述第一成形模與所述第二成形模之間的步驟；在安裝於基板上的晶片元件收納在所述第一成形模與所述第二成形模之間的狀態下，將所述第一、第二成形模合模的步驟；使由所述樹脂材料生成的流動性樹脂在所述型腔內硬化以形成硬化樹脂的步驟；及藉由所述硬化樹脂將所述晶片元件樹脂密封的步驟；所述樹脂密封方法的特徵在於，在運送所述樹脂材料的步驟中，準備被由絕熱性材料構成的蓋包圍的收容部，並將運送的所述樹脂材料收容在所述收容部中。 Further, the resin sealing method of the present invention comprises: a step of preparing first and second forming dies which are disposed opposite each other and having a cavity in at least one of them; heating at least any of the first forming die and the second forming die a step of transporting a resin material between the first forming die and the second forming die; storing the wafer member mounted on the substrate in the first forming die and the second forming die a step of clamping the first and second molding dies, and a step of hardening the fluid resin formed of the resin material in the cavity to form a hardening resin; and a step of sealing the wafer element resin by a hardening resin; the resin sealing method is characterized in that, in the step of transporting the resin material, a housing portion surrounded by a cover made of a heat insulating material is prepared and transported The resin material is housed in the housing portion.
另外，本發明之樹脂密封方法，包括：準備相對設置且至少在任一個中具有型腔的第一、第二成形模的步驟；加熱所述第一成形模和所述第二成形模的至少任一個的步驟；將樹脂材料運送至所述第一成形模與所述第二成形模之間的步驟；在安裝於基板上的晶片元件收納在所述第一成形模與所述第二成形模 之間的狀態下，將所述第一、第二成形模合模的步驟；使由所述樹脂材料生成的流動性樹脂在所述型腔內硬化以形成硬化樹脂的步驟；及藉由所述硬化樹脂將所述晶片元件樹脂密封的步驟；所述樹脂密封方法的特徵在於，在運送所述樹脂材料的步驟中，準備被在壁內部具有連通道的蓋包圍的收納部，並在對所述連通道供給冷卻用介質的狀態下，將運送的所述樹脂材料收容在所述收容部中。 Further, the resin sealing method of the present invention comprises: a step of preparing first and second forming dies which are disposed opposite each other and having a cavity in at least one of them; heating at least any of the first forming die and the second forming die a step of transporting a resin material between the first forming die and the second forming die; storing the wafer member mounted on the substrate in the first forming die and the second forming die a step of clamping the first and second molding dies, and a step of hardening the fluid resin formed of the resin material in the cavity to form a hardening resin; and a step of sealing the wafer element resin by a hardening resin; the resin sealing method is characterized in that, in the step of transporting the resin material, a receiving portion surrounded by a cover having a connecting passage inside the wall is prepared, and The resin material to be transported is accommodated in the accommodating portion in a state where the continuous passage is supplied with the cooling medium.
另外，本發明之樹脂密封方法的特徵在於，分別在上述的樹脂密封方法中，進一步包括保管所述樹脂材料的步驟；在運送所述樹脂材料的步驟中，將由保管所述樹脂材料的步驟保管的所述樹脂材料運送至所述第一成形模與所述第二成形模之間；替代在運送所述樹脂材料的步驟中準備所述收容部，在保管所述樹脂材料的步驟與運送所述樹脂材料的步驟中的至少任一步驟中準備所述收容部，並將運送或保管的所述樹脂材料收納在所述收納部中。 Further, in the resin sealing method of the present invention, the resin sealing method further includes a step of storing the resin material, and in the step of transporting the resin material, storing the resin material in a step of storing the resin material The resin material is transported between the first forming die and the second forming die; instead of preparing the receiving portion in the step of transporting the resin material, the step of transporting the resin material and the transporting station The accommodating portion is prepared in at least one of the steps of the resin material, and the resin material that is transported or stored is housed in the accommodating portion.
另外，本發明之樹脂密封方法的特徵在於，在上述的樹脂密封方法中，所述樹脂材料為塊狀、片狀、粒狀、顆粒狀、粉末狀或在常溫下液狀的任一種。 Further, in the resin sealing method of the present invention, in the resin sealing method, the resin material is in the form of a block, a sheet, a pellet, a pellet, a powder, or a liquid at a normal temperature.
另外，本發明之樹脂密封方法的特徵在於，在上述的樹脂密封方法中，將複數個塊狀的所述樹脂材料收容在所述收容部中。 Further, in the resin sealing method of the present invention, in the resin sealing method described above, a plurality of block-shaped resin materials are housed in the accommodating portion.
根據本發明，在樹脂密封裝置中，在運送樹脂材料的運送機構或保管樹脂材料的保管機構中具備收容樹脂材料的收容部，進一步，藉由由絕熱性材料構成該收容部，或在該收容部的壁的內部設置連通道並對 該連通道供給冷卻用介質，從而能夠排除樹脂材料承受來自第一成形模或第二成形模的輻射熱的影響。 According to the invention, in the resin sealing device, the storage means for transporting the resin material or the storage means for storing the resin material is provided with the accommodating portion for accommodating the resin material, and further, the accommodating portion is formed of a heat insulating material or the accommodating portion The interior of the wall of the section is connected to the channel and The connecting passage supplies the cooling medium, so that the influence of the radiant heat from the first forming die or the second forming die can be excluded from the resin material.
另外，在樹脂密封裝置中，在運送樹脂材料的運送機構或保管樹脂材料的保管機構中具備收容樹脂材料的收容部和包圍該收容部的蓋，進一步，藉由以絕熱性材料構成該蓋，或在該蓋的壁的內部設置連通道，並對該連通道供給冷卻用介質，從而能夠排除樹脂材料承受來自第一成形模或第二成形模的輻射熱的影響。 Further, in the resin sealing device, the storage means for transporting the resin material or the storage means for storing the resin material includes a housing portion for accommodating the resin material and a cover surrounding the housing portion, and further, the cover is formed of a heat insulating material. Or, a connecting passage is provided inside the wall of the cover, and a cooling medium is supplied to the connecting passage, so that the influence of the radiant heat from the first forming die or the second forming die can be excluded from the resin material.
1‧‧‧樹脂密封裝置 1‧‧‧Resin sealing device
2‧‧‧接收及輸出模組 2‧‧‧ Receive and output modules
2A‧‧‧接收模組 2A‧‧‧ receiving module
2B‧‧‧輸出模組 2B‧‧‧Output Module
3A、3B、3C‧‧‧成形模組 3A, 3B, 3C‧‧‧ forming modules
4‧‧‧引線框供給單元 4‧‧‧ lead frame supply unit
5‧‧‧引線框排列單元 5‧‧‧ lead frame arrangement unit
6‧‧‧樹脂塊供給單元(保管機構) 6‧‧‧Resin block supply unit (keeping organization)
7‧‧‧材料搬出單元(保管機構) 7‧‧‧Material removal unit (custodian)
8‧‧‧引線框收容單元 8‧‧‧ lead frame storage unit
9‧‧‧控制器 9‧‧‧ Controller
10‧‧‧壓制單元 10‧‧‧Compact unit
11‧‧‧下模(第一成形模、第二成形模) 11‧‧‧ Lower die (first forming die, second forming die)
12‧‧‧裝載器(運送機構) 12‧‧‧Loader (transportation agency)
13‧‧‧卸載器 13‧‧‧ Unloader
14‧‧‧料筒 14‧‧‧Bowl
15‧‧‧樹脂密封前基板安裝元件 15‧‧‧Resin sealed front substrate mounting components
15a‧‧‧引線框 15a‧‧‧ lead frame
15b‧‧‧晶片元件 15b‧‧‧ Wafer components
15c‧‧‧導線 15c‧‧‧ wire
16‧‧‧樹脂塊 16‧‧‧ resin block
17‧‧‧上部固定盤 17‧‧‧Upper fixed plate
18‧‧‧上模(第二成形模、第一成形模) 18‧‧‧Upper mold (second forming die, first forming die)
19‧‧‧可動盤 19‧‧‧ movable plate
20‧‧‧加熱器 20‧‧‧heater
23‧‧‧合模機構 23‧‧‧Molding mechanism
24‧‧‧柱塞 24‧‧‧Plunger
25‧‧‧樹脂通道 25‧‧‧Resin channel
26‧‧‧型腔 26‧‧‧ cavity
27‧‧‧加熱器 27‧‧‧heater
28‧‧‧夾具 28‧‧‧Clamp
29‧‧‧收容部 29‧‧‧ Housing Department
30‧‧‧擋板 30‧‧‧Baffle
31‧‧‧壁 31‧‧‧ wall
32‧‧‧連通道 32‧‧‧Connected channel
33‧‧‧冷卻用介質供給部 33‧‧‧Condition supply unit for cooling
34‧‧‧空氣供給口 34‧‧‧Air supply port
35‧‧‧空氣排氣口 35‧‧‧Air vents
36‧‧‧收容部 36‧‧‧The Department of Housing
37‧‧‧蓋 37‧‧‧ Cover
38‧‧‧壁 38‧‧‧ wall
39‧‧‧連通道 39‧‧‧Connected channel
40‧‧‧冷卻用介質供給部 40‧‧‧Condition supply unit for cooling
41‧‧‧空氣供給口 41‧‧‧Air supply port
圖1係本發明之樹脂密封裝置的概要俯視圖。 Fig. 1 is a schematic plan view of a resin sealing device of the present invention.
圖2係表示圖1所示的樹脂密封裝置的壓制單元的主要部分的部分剖面圖。 Fig. 2 is a partial cross-sectional view showing a main part of a press unit of the resin sealing device shown in Fig. 1.
圖3係表示本發明之樹脂密封裝置的實施例1中的收容樹脂塊的收容部的局部剖面圖。 Fig. 3 is a partial cross-sectional view showing a housing portion for housing a resin block in the first embodiment of the resin sealing device of the present invention.
圖4的(a)係表示圖3所示的收容部的側面剖面圖，圖4的(b)是圖4的(a)的A-A剖面圖。 Fig. 4 (a) is a side cross-sectional view showing the accommodating portion shown in Fig. 3, and Fig. 4 (b) is a cross-sectional view taken along line A-A of Fig. 4 (a).
圖5係表示本發明之樹脂密封裝置的實施例2中的收容樹脂塊的收容部的局部剖面圖。 Fig. 5 is a partial cross-sectional view showing a housing portion in which a resin block is housed in a second embodiment of the resin sealing device of the present invention.
圖6的(a)至(d)係表示本發明之樹脂密封裝置的各實施例中的接收及輸出模組和成形模組的結構的概要圖。 Fig. 6 (a) to (d) are schematic views showing the structures of a receiving and outputting module and a forming module in each embodiment of the resin sealing device of the present invention.
本實施方式的樹脂密封裝置1為藉由硬化樹脂(密封樹脂) 將安裝在引線框、印刷基板等基板上的IC等晶片元件樹脂密封的裝置。樹脂密封裝置1具備運送樹脂塊16的裝載器12、保管樹脂塊16的樹脂塊供給單元6和材料搬出單元7。樹脂塊供給單元6與材料搬出單元7構成本發明的保管機構的一例，裝載器12構成本發明的運送機構的一例。這些裝載器12、樹脂塊供給單元6和材料搬出單元7中的至少一個具備收納部29或收納部36。收納部29、36由絕熱性材料構成。在圖3至圖5中圖示有在裝載器12中設置收納部29、36的結構，但還可以在樹脂塊供給單元6或材料搬出單元7中設置同樣的收納部29、36。 The resin sealing device 1 of the present embodiment is made of a hardened resin (sealing resin) An apparatus for sealing a wafer element such as an IC mounted on a substrate such as a lead frame or a printed substrate. The resin sealing device 1 includes a loader 12 that transports the resin block 16 , a resin block supply unit 6 that stores the resin block 16 , and a material carry-out unit 7 . The resin block supply unit 6 and the material carry-out unit 7 constitute an example of the storage mechanism of the present invention, and the loader 12 constitutes an example of the transport mechanism of the present invention. At least one of the loader 12, the resin block supply unit 6, and the material unloading unit 7 includes a housing portion 29 or a housing portion 36. The accommodating portions 29 and 36 are made of a heat insulating material. Although the configuration in which the accommodating portions 29 and 36 are provided in the loader 12 is illustrated in FIGS. 3 to 5, the same accommodating portions 29 and 36 may be provided in the resin block supply unit 6 or the material unloading unit 7.
在圖3所示的收容部29的結構中，在收納部29所具有的壁31的內部設置有連通道32。連通道32是用於被供給冷卻用介質以使冷卻用介質在其內部流通的通道。 In the configuration of the accommodating portion 29 shown in FIG. 3, a connecting passage 32 is provided inside the wall 31 of the accommodating portion 29. The connecting passage 32 is a passage for supplying a cooling medium to allow the cooling medium to flow therein.
圖5所示的收容部36設置有包圍收納部36的蓋37。此外，蓋37可由絕熱性材料構成。 The housing portion 36 shown in FIG. 5 is provided with a cover 37 that surrounds the housing portion 36. Further, the cover 37 may be composed of a heat insulating material.
在圖5所示的收容部36的結構中，在蓋37所具有的壁38的內部設置有連通道39。連通道39是用於被供給冷卻用介質以使冷卻用介質在其內部流通的通道。 In the configuration of the accommodating portion 36 shown in FIG. 5, a connecting passage 39 is provided inside the wall 38 of the cover 37. The connecting passage 39 is a passage for supplying a cooling medium to allow the cooling medium to flow therein.
(實施例1) (Example 1)
參照圖1至圖4，對本發明之樹脂密封裝置的實施例1進行說明。本申請檔中的任一張圖為了易於理解均進行適當省略或誇張而被示意性地描繪。對相同的結構要素使用相同的附圖標記，並適當省略說明。 Embodiment 1 of the resin sealing device of the present invention will be described with reference to Figs. 1 to 4 . Any one of the drawings in the present application is schematically depicted in order to facilitate understanding and to appropriately omit or exaggerate. The same reference numerals are used for the same components, and the description is omitted as appropriate.
在圖1中，樹脂密封裝置1由接收及輸出模組2和成形模組3A、3B、3C構成。在接收及輸出模組2中設置有引線框供給單元4、引線 框排列單元5、樹脂塊供給單元6、材料搬出單元7、引線框收容單元8和控制器9。在成形模組3A、3B、3C中分別配置有壓制單元10。在各壓制單元10中設置有能夠升降的下模11和在下模11的上方相對配置且被固定的上模18(參照圖2)。裝載器12和卸載器13以能夠在接收及輸出模組2與各壓制單元10之間移動的方式設置。至少上模18和下模11為第一、第二成形模，這些上下模18、11構成成形模組(參照圖2)。 In Fig. 1, a resin sealing device 1 is composed of a receiving and outputting module 2 and forming modules 3A, 3B, and 3C. A lead frame supply unit 4 and leads are disposed in the receiving and output module 2 The frame arranging unit 5, the resin block supply unit 6, the material unloading unit 7, the lead frame accommodating unit 8, and the controller 9. The pressing unit 10 is disposed in each of the forming modules 3A, 3B, and 3C. Each of the press units 10 is provided with a lower mold 11 that can be raised and lowered, and an upper mold 18 that is disposed opposite to the upper mold 11 and that is fixed (see FIG. 2). The loader 12 and the unloader 13 are disposed in such a manner as to be movable between the receiving and outputting module 2 and each of the pressing units 10. At least the upper mold 18 and the lower mold 11 are first and second molding dies, and the upper and lower dies 18 and 11 constitute a forming module (see Fig. 2).
上模18具有樹脂通道25和連通至樹脂通道25的型腔26。此外，在本實施例中，在上模18中設置有樹脂通道25和型腔26，但本發明並不限定於該結構。樹脂通道25和型腔26可以設置於上模18和下模11的至少任一個中。在下模11中設置有複數個料筒14。裝載器12例如以能夠在材料搬出單元7與壓制單元10之間進行往復移動的方式設置。在上模18和下模11中分別嵌入有加熱器等加熱機構20(參照圖2)。此外，在本實施例中，在下模11中設置有加熱機構20，但本發明並不限定於該結構。加熱機構20可以設置於上模18和下模11的至少任一個中。上模18和下模11藉由加熱機構20一般加熱至180℃左右。包括裝載器12、卸載器13和成形模組的各單元中的動作，均藉由控制器9自動地控制。 The upper mold 18 has a resin passage 25 and a cavity 26 that communicates with the resin passage 25. Further, in the present embodiment, the resin passage 25 and the cavity 26 are provided in the upper mold 18, but the present invention is not limited to this configuration. The resin passage 25 and the cavity 26 may be disposed in at least one of the upper mold 18 and the lower mold 11. A plurality of cartridges 14 are disposed in the lower mold 11. The loader 12 is provided, for example, so as to be reciprocable between the material unloading unit 7 and the press unit 10. A heating mechanism 20 such as a heater is attached to each of the upper mold 18 and the lower mold 11 (see Fig. 2). Further, in the present embodiment, the heating mechanism 20 is provided in the lower mold 11, but the present invention is not limited to this configuration. The heating mechanism 20 may be disposed in at least one of the upper mold 18 and the lower mold 11. The upper mold 18 and the lower mold 11 are generally heated to about 180 ° C by the heating mechanism 20. The actions in each unit including the loader 12, the unloader 13, and the forming module are automatically controlled by the controller 9.
如圖2所示，密封前基板安裝元件15具有作為基板的一例的引線框15a和安裝在引線框15a上的晶片元件15b。晶片元件15b的端子和引線框15a的端子藉由導線15c被電連接。 As shown in FIG. 2, the pre-sealed substrate mounting component 15 has a lead frame 15a as an example of a substrate and a wafer element 15b mounted on the lead frame 15a. The terminal of the wafer element 15b and the terminal of the lead frame 15a are electrically connected by a wire 15c.
下面，說明樹脂密封裝置1的動作。首先，引線框供給單元4將從樹脂密封裝置1的外部接收的密封前基板安裝元件15送出到引線框排列單元5。引線框排列單元5將接收的密封前基板安裝元件15向規定的 方向排列，並將其送出到材料搬出單元7。同時，樹脂塊供給單元6將從樹脂密封裝置1的外部接收的作為樹脂材料的樹脂塊16中的需要的個數(在圖1中為四個)送出到材料搬出單元7。 Next, the operation of the resin sealing device 1 will be described. First, the lead frame supply unit 4 feeds the sealed front substrate mounting member 15 received from the outside of the resin sealing device 1 to the lead frame arranging unit 5. The lead frame arranging unit 5 directs the received sealed front substrate mounting component 15 to a prescribed The directions are aligned and sent out to the material carry-out unit 7. At the same time, the resin block supply unit 6 sends the required number (four in FIG. 1) of the resin block 16 as a resin material received from the outside of the resin sealing device 1 to the material carrying-out unit 7.
接著，在材料搬出單元7中，由引線框排列單元5排列的密封前基板安裝元件15(在圖1中為兩個)和四個樹脂塊16移交給裝載器12。 Next, in the material carrying-out unit 7, the sealed front substrate mounting members 15 (two in FIG. 1) and the four resin blocks 16 arranged by the lead frame arranging unit 5 are transferred to the loader 12.
接著，裝載器12將分別從材料搬出單元7接收的兩個密封前基板安裝元件15和四個樹脂塊16同時向壓制單元10運送。裝載器12分別將密封前基板安裝元件15供給至下模11的規定位置，將樹脂塊16供給至設置於下模11中的料筒14的內部。 Next, the loader 12 simultaneously conveys the two sealed front substrate mounting members 15 and the four resin blocks 16 respectively received from the material unloading unit 7 to the pressing unit 10. The loader 12 supplies the sealed front substrate mounting member 15 to a predetermined position of the lower mold 11, and supplies the resin block 16 to the inside of the cylinder 14 provided in the lower mold 11.
圖2係表示圖1所示的樹脂密封裝置1的壓制單元10的局部剖面圖。在上部固定盤17的下表面固定有上模18，在可動盤19的上表面固定有下模11。在上模18和下模11中內裝有作為加熱機構的加熱器20。上模18和下模11藉由加熱器20一般加熱至180℃左右。在下模11的規定區域上安裝有密封前基板安裝元件15。密封前基板安裝元件15具有引線框15a和安裝在引線框15a上的晶片元件15b，並且晶片元件15b的端子與引線框15a的端子藉由導線15c被電連接。 Fig. 2 is a partial cross-sectional view showing the pressing unit 10 of the resin sealing device 1 shown in Fig. 1. The upper mold 18 is fixed to the lower surface of the upper fixed plate 17, and the lower mold 11 is fixed to the upper surface of the movable plate 19. A heater 20 as a heating means is housed in the upper mold 18 and the lower mold 11. The upper mold 18 and the lower mold 11 are generally heated to about 180 ° C by the heater 20. A sealed front substrate mounting member 15 is mounted on a predetermined region of the lower mold 11. The pre-sealed substrate mounting component 15 has a lead frame 15a and a wafer component 15b mounted on the lead frame 15a, and the terminals of the wafer component 15b and the terminals of the lead frame 15a are electrically connected by a wire 15c.
下面，對樹脂密封裝置1的合模動作進行說明。使用合模機構23使固定於可動盤19的上表面的下模11向上移動，並將上模18與下模11合模。加熱供給至各料筒14內的樹脂塊16的同時，藉由柱塞24按壓樹脂塊16。在各料筒14內，加熱樹脂塊16並使其溶融而生成流動性樹脂，接著藉由柱塞24按壓流動性樹脂。由此，藉由樹脂通道25將流動性樹脂注入到型腔26的內部。接著，藉由以硬化所需要的所需時間加熱流動性樹脂， 從而使流動性樹脂硬化以生成硬化樹脂。由此，型腔26內的晶片元件15b與其周邊的引線框15a密封在對應於型腔26的形狀而成形的硬化樹脂(密封樹脂)內。 Next, the mold clamping operation of the resin sealing device 1 will be described. The lower mold 11 fixed to the upper surface of the movable disk 19 is moved upward by the mold clamping mechanism 23, and the upper mold 18 and the lower mold 11 are clamped. The resin block 16 is pressed by the plunger 24 while heating the resin block 16 supplied to each of the cylinders 14. In each of the cylinders 14, the resin block 16 is heated and melted to form a fluid resin, and then the fluid resin is pressed by the plunger 24. Thereby, the fluid resin is injected into the inside of the cavity 26 by the resin passage 25. Next, by heating the fluid resin for the required time required for hardening, Thereby, the fluid resin is hardened to form a hardening resin. Thereby, the wafer element 15b in the cavity 26 and the lead frame 15a in the periphery thereof are sealed in a hardened resin (sealing resin) formed in accordance with the shape of the cavity 26.
接著，經過硬化所需要的所需時間後，將上模18與下模11開模，並使密封後基板安裝元件(未圖示)脫模。 Next, after the required time required for the hardening, the upper mold 18 and the lower mold 11 are opened, and the sealed substrate mounting member (not shown) is released.
接著，使用圖1所示的卸載器13，將在壓制單元10被樹脂密封的密封後安裝元件收容在引線框收容單元8中。 Next, the post-sealing mounting member in which the press unit 10 is resin-sealed is housed in the lead frame housing unit 8 by using the unloader 13 shown in FIG.
圖3表示本發明中的收容樹脂塊16的收容部29的局部剖面圖。參照圖3，對將密封前基板安裝元件15和樹脂塊16收容在裝載器12中並運送的情況進行說明。由於裝載器12在運送密封前基板安裝元件15的期間進行預熱，因此具備內裝有加熱器27的夾具28。在裝載器12中設置有分別收容各樹脂塊16的收容部29和在收容部29的下方處設置為能夠開閉的擋板30。在收容部29所具有的壁31的內部形成有連通道32。 Fig. 3 is a partial cross-sectional view showing the accommodating portion 29 in which the resin block 16 is housed in the present invention. A case where the sealed front substrate mounting member 15 and the resin block 16 are housed in the loader 12 and transported will be described with reference to Fig. 3 . Since the loader 12 is preheated while the pre-sealed substrate mounting member 15 is being transported, it has a jig 28 in which the heater 27 is housed. The loader 12 is provided with a housing portion 29 that accommodates each of the resin blocks 16 and a shutter 30 that is opened and closed below the housing portion 29. A connecting passage 32 is formed inside the wall 31 of the accommodating portion 29.
藉由從冷卻用介質供給部33對連通道22供給冷卻用介質(氣體或液體)並使其流動，從而經由收容部29冷卻樹脂塊16。在使用氣體(例如，空氣)作為冷卻用介質的情況下，從空氣供給口34供給空氣，並從空氣排出口35(參照圖4)排出空氣。按照需要，還可以經由空氣排出口35在連通道31中進行吸引。 The cooling medium (gas or liquid) is supplied to the connecting passage 22 from the cooling medium supply unit 33 and flows, whereby the resin block 16 is cooled via the accommodating portion 29. When a gas (for example, air) is used as the cooling medium, air is supplied from the air supply port 34, and the air is discharged from the air discharge port 35 (see FIG. 4). The suction can also be performed in the connecting passage 31 via the air discharge port 35 as needed.
圖4(a)、(b)是分別表示圖3所示的收容部29的側面剖面圖及俯視剖面圖。圖4(a)、(b)表示在裝載器12中收容複數個(在圖4例中為八個)樹脂塊16並進行運送的例。在收容部29所具有的壁31的內部，以包圍複數個樹脂塊16的方式形成連通道32。藉由對該連通道32供 給冷卻用介質(氣體或液體)並使其移動，從而有效地冷卻所有的樹脂塊16。在使用氣體(例如，空氣)作為冷卻用介質的情況下，從空氣供給口34供給的空氣，藉由以包圍複數個樹脂塊16的周圍的方式形成的連通道32，從兩處空氣排出口35向收容部29的外部排出。 4(a) and 4(b) are a side cross-sectional view and a plan cross-sectional view, respectively, showing the accommodating portion 29 shown in Fig. 3. 4(a) and 4(b) show an example in which a plurality of (eight in the example of FIG. 4) resin blocks 16 are accommodated in the loader 12 and transported. The connecting passage 32 is formed inside the wall 31 of the accommodating portion 29 so as to surround the plurality of resin blocks 16. By providing the connection channel 32 The cooling medium (gas or liquid) is supplied and moved to effectively cool all the resin blocks 16. In the case where a gas (for example, air) is used as the medium for cooling, the air supplied from the air supply port 34 is discharged from the two air passages by the connecting passage 32 formed to surround the periphery of the plurality of resin blocks 16. 35 is discharged to the outside of the accommodating portion 29.
優選地，對於供給至連通道32的空氣的流量、速度等，按照樹脂密封裝置總體的結構、所設置的成形模組的個數、收容樹脂塊的個數等進行最優化。由此，能夠管理並穩定地維持樹脂塊16的溫度。在圖4(a)、(b)中表示了空氣供給口34為一處、空氣排出口35為兩處的情況。不限於此，根據收容的樹脂塊16的個數，可增加空氣供給口34與空氣排出口35的個數，以有效地冷卻樹脂塊16。 Preferably, the flow rate, the speed, and the like of the air supplied to the connecting passage 32 are optimized in accordance with the overall structure of the resin sealing device, the number of the formed molding modules, the number of the resin blocks to be housed, and the like. Thereby, the temperature of the resin block 16 can be managed and stably maintained. 4(a) and 4(b) show a case where the air supply port 34 is one place and the air discharge port 35 is two places. Not limited to this, the number of the air supply port 34 and the air discharge port 35 can be increased in accordance with the number of the resin blocks 16 accommodated to effectively cool the resin block 16.
下面，參照圖1至圖4，說明使用裝載器12進行的密封前基板安裝元件15和樹脂塊16的運送步驟。在使用裝載器12進行的運送步驟中，為了減少處理工時以提高樹脂密封裝置1的處理能力，一般同時運送密封前基板安裝元件15和樹脂塊16。裝載器12保持密封前基板安裝元件15和樹脂塊16，並運送至下模11的上方的規定位置。裝載器12移動至規定位置後，藉由打開擋板30，將處於冷卻狀態的樹脂塊16向料筒14內供給。 Next, a transport step of sealing the front substrate mounting member 15 and the resin block 16 using the loader 12 will be described with reference to Figs. 1 to 4 . In the transporting step using the loader 12, in order to reduce the processing time to improve the processing ability of the resin sealing device 1, the sealed front substrate mounting member 15 and the resin block 16 are generally simultaneously conveyed. The loader 12 holds the front substrate mounting member 15 and the resin block 16 sealed, and is transported to a predetermined position above the lower mold 11. After the loader 12 is moved to the predetermined position, the resin block 16 in the cooled state is supplied into the cylinder 14 by opening the shutter 30.
但是，由於如果樹脂塊16成為高溫則易於產生劣化或變質，因此最好一般在20℃至30℃下保管並維持。另一方面，為了優化成形時引線框15a與硬化樹脂間的粘著性，藉由內裝有加熱器27的夾具28，一般將密封前基板安裝元件15預熱至100℃至120℃。因此，根據現有技術，在藉由裝載器12運送樹脂塊16的期間，具有承受來自夾具28與加熱至180 ℃左右的上模18及下模11的輻射熱導致樹脂塊16升溫的重大問題點。 However, since the resin block 16 is likely to be deteriorated or deteriorated when it is heated to a high temperature, it is preferably stored and maintained at 20 to 30 °C. On the other hand, in order to optimize the adhesion between the lead frame 15a and the hardened resin during molding, the sealed front substrate mounting member 15 is generally preheated to 100 ° C to 120 ° C by the jig 28 in which the heater 27 is housed. Therefore, according to the prior art, during transport of the resin block 16 by the loader 12, it has withstood from the clamp 28 and heated to 180 The radiant heat of the upper mold 18 and the lower mold 11 around °C causes a significant problem of temperature rise of the resin block 16.
在本實施例中，藉由對在分別收容各樹脂塊16的收容部29所具有的壁31的內部形成的連通道32，供給冷卻用介質並使其流動，從而冷卻各樹脂塊16。由此，能夠充分排除由內裝加熱器27的夾具28和加熱至180℃左右的上模18及下模11輻射的輻射熱對樹脂塊16產生的影響。因此，根據本實施例，穩定地冷卻樹脂塊16，從而能夠將溫度維持恒溫並進行管理，以能夠防止樹脂塊16的劣化或變質。 In the present embodiment, the cooling medium is supplied and flowed through the connecting passage 32 formed inside the wall 31 of the accommodating portion 29 in which the respective resin blocks 16 are accommodated, thereby cooling the respective resin blocks 16. Thereby, the influence of the radiant heat radiated by the jig 28 incorporating the heater 27 and the upper mold 18 and the lower mold 11 heated to about 180 ° C on the resin block 16 can be sufficiently eliminated. Therefore, according to the present embodiment, the resin block 16 is stably cooled, so that the temperature can be maintained at a constant temperature and managed so that deterioration or deterioration of the resin block 16 can be prevented.
(實施例2) (Example 2)
圖5係表示本發明之樹脂密封裝置的實施例2，具體來講，係表示在實施例2的樹脂密封裝置中，收容樹脂塊16的收容部36的局部剖面圖。參照圖5，對將樹脂塊16收容在裝載器12中並進行運送的情況進行說明。在本實施例中，進一步設置包圍裝載器12的收容部36的蓋37。蓋37一般由鐵、不銹鋼、鋁等形成。在蓋37所具有的壁38的內部形成有連通道39。來自冷卻用介質供給部40的冷卻用介質被供給到連通道39並在連通道39內流動，由此冷卻樹脂塊16。 Fig. 5 shows a second embodiment of the resin sealing device of the present invention, and specifically shows a partial cross-sectional view of the accommodating portion 36 in which the resin block 16 is housed in the resin sealing device of the second embodiment. A case where the resin block 16 is housed in the loader 12 and transported will be described with reference to Fig. 5 . In the present embodiment, a cover 37 that surrounds the housing portion 36 of the loader 12 is further provided. The cover 37 is generally formed of iron, stainless steel, aluminum, or the like. A connecting passage 39 is formed inside the wall 38 of the cover 37. The cooling medium from the cooling medium supply unit 40 is supplied to the connecting passage 39 and flows in the connecting passage 39, thereby cooling the resin block 16.
裝載器12保持密封前基板安裝元件15和樹脂塊16，並運送至下模11的規定位置(參照圖1)。在現有技術中，在藉由裝載器12運送樹脂塊16的期間，具有承受來自內裝有加熱器27的夾具28和加熱至180℃左右的上模18及下模11(參照圖2)的輻射熱導致樹脂塊16升溫的重大問題點。 The loader 12 holds the front substrate mounting member 15 and the resin block 16 sealed and transports them to a predetermined position of the lower mold 11 (refer to FIG. 1). In the prior art, while the resin block 16 is being transported by the loader 12, it has the upper mold 18 and the lower mold 11 (refer to FIG. 2) which are received from the jig 28 in which the heater 27 is housed and heated to about 180 °C. The radiant heat causes a major problem in the temperature rise of the resin block 16.
根據本實施例，在蓋37所具有的壁38的內部形成連通道39，並藉由對該連通道39供給冷卻用介質並使其流動，從而經由收容部36 冷卻各樹脂塊16。由此，能夠防止由內裝有加熱器27的夾具28和加熱至180℃左右的上模18及下模11輻射的輻射熱對樹脂塊16產生的影響。因此，根據本實施例，穩定地冷卻樹脂塊16，從而能夠將溫度維持恒溫，以能夠防止樹脂塊16的劣化或變質。 According to the present embodiment, the connecting passage 39 is formed inside the wall 38 of the cover 37, and the cooling medium is supplied to the connecting passage 39 and flows, thereby passing through the accommodating portion 36. Each of the resin blocks 16 is cooled. Thereby, it is possible to prevent the influence of the radiant heat radiated from the jig 28 in which the heater 27 is housed and the upper mold 18 and the lower mold 11 heated to about 180 °C on the resin block 16. Therefore, according to the present embodiment, the resin block 16 is stably cooled, so that the temperature can be kept constant, so that deterioration or deterioration of the resin block 16 can be prevented.
此外，作為本實施例中的冷卻用介質，能夠使用與實施例1相同的氣體或液體。在使用空氣作為冷卻用介質的情況下，從空氣供給口40供給空氣，並從空氣排出口(未圖示)排出。 Further, as the cooling medium in the present embodiment, the same gas or liquid as in the first embodiment can be used. When air is used as the cooling medium, air is supplied from the air supply port 40 and discharged from the air discharge port (not shown).
另外，還可以使用如耐熱環氧玻璃層壓板、超級工程塑料、陶瓷等具有高絕熱性的材料(絕熱性材料)構成蓋37。由此，能夠進一步提高絕熱效果。在該變形例中，在所要求的絕熱性能比較低的情況下，還可以不設置圖5所示的連通道39。 Further, it is also possible to constitute the lid 37 using a material having high heat insulating properties (heat insulating material) such as a heat-resistant epoxy glass laminate, a super engineering plastic, or a ceramic. Thereby, the heat insulating effect can be further improved. In this modification, in the case where the required heat insulating performance is relatively low, the connecting passage 39 shown in Fig. 5 may not be provided.
本實施例之發明的特徵在於，在裝載器12裝備有包圍收容有樹脂塊16的收容部36的蓋37。該蓋37具有使收容在裝載器12中的樹脂塊16絕熱的效果。蓋37一般由鐵、不銹鋼、鋁等形成。不限於此，若由耐熱環氧玻璃層壓板、超級工程塑料、陶瓷等絕熱效果高的材料形成，則能夠進一步提高絕熱效果。藉由裝備蓋37，能夠防止由內裝有加熱器27的夾具28和加熱至180℃左右的上模18及下模11輻射的輻射熱對樹脂塊16產生的影響。 The invention of the present embodiment is characterized in that the loader 12 is provided with a cover 37 that surrounds the accommodating portion 36 in which the resin block 16 is housed. This cover 37 has an effect of insulating the resin block 16 housed in the loader 12. The cover 37 is generally formed of iron, stainless steel, aluminum, or the like. The present invention is not limited thereto, and if it is formed of a material having a high heat insulating effect such as a heat-resistant epoxy glass laminate, a super engineering plastic, or a ceramic, the heat insulating effect can be further improved. By equipping the cover 37, it is possible to prevent the influence of the radiant heat radiated from the jig 28 in which the heater 27 is housed and the upper mold 18 and the lower mold 11 heated to about 180 °C on the resin block 16.
此外，在到目前為止說明的各實施例中，作為冷卻用介質可以是氣體或液體的任一介質，只要是具有冷卻效果的氣體或液體均能夠使用。若使用氟利昂等氣體作為冷卻用介質，則能夠得到較高的冷卻效果。另一方面，從成本或操作性的觀點出發，最好使用如空氣或水便宜且易於 處理的介質。 Further, in each of the embodiments described so far, the medium for cooling may be any medium of a gas or a liquid, and any gas or liquid having a cooling effect can be used. When a gas such as Freon is used as the medium for cooling, a high cooling effect can be obtained. On the other hand, from the viewpoint of cost or operability, it is preferable to use air or water, which is cheap and easy. Processed media.
另外，在各實施例中，使用液體作為冷卻用介質的情況下，優選在圖1所示的成形模組3A、3B、3C的外側(例如，在接收及輸出模組2中)設置冷卻器。對收容部29的連通道32(參照圖3)或蓋37的連通道39(參照圖5)供給藉由冷卻器冷卻的液體，並從收容部29或蓋37的排出口經由管道使液體環流至冷卻器。由此，能夠使固定量的液體循環使用作為冷卻用介質。 Further, in the respective embodiments, when a liquid is used as the cooling medium, it is preferable to provide a cooler outside the forming modules 3A, 3B, 3C shown in FIG. 1 (for example, in the receiving and output module 2). . The liquid that is cooled by the cooler is supplied to the connecting passage 32 (see FIG. 3) of the accommodating portion 29 or the connecting passage 39 (see FIG. 5) of the cover 37, and the liquid is circulated through the pipe from the discharge port of the accommodating portion 29 or the cover 37. To the cooler. Thereby, a fixed amount of liquid can be recycled as a medium for cooling.
另外，在各實施例中，表示了利用裝載器12運送樹脂塊16的例。不限於此，在設置於排列樹脂塊16以暫時保管(暫時放置)並搬出的部分(例如，材料搬出單元7)的收容部中，也能夠藉由採用本發明得到相同的冷卻效果。此外，在設置於暫時保管(暫時放置)由外部對樹脂密封裝置1供給的樹脂材料的部分(例如，樹脂平板供給單元6)的收容部中，也能夠採用本發明。本發明對保管或運送樹脂材料時使用收容部的樹脂密封裝置的全部，均取得相同的效果。此外，在從樹脂密封裝置1的外部對裝載器12(運送機構)直接供給樹脂塊16(樹脂材料)的結構，即沒有保管機構的結構中，也能夠同樣地實施本發明。 Further, in each of the embodiments, an example in which the resin block 16 is transported by the loader 12 is shown. The present invention is not limited to this, and the same cooling effect can be obtained by using the present invention in the accommodating portion provided in the portion (for example, the material carrying-out unit 7) in which the arranging resin block 16 is temporarily stored (temporarily placed) and carried out. In addition, the present invention can also be applied to a housing portion that is temporarily stored (temporarily placed) in a portion (for example, the resin flat plate supply unit 6) that supplies the resin material to the resin sealing device 1 from the outside. The present invention achieves the same effects in all of the resin sealing devices using the accommodating portion when storing or transporting the resin material. In addition, the present invention can be similarly applied to the configuration in which the resin block 16 (resin material) is directly supplied to the loader 12 (transport mechanism) from the outside of the resin sealing device 1, that is, in the configuration without the storage mechanism.
另外，各實施例中的收容各樹脂塊16的收容部29、36的部件一般由鐵、不銹鋼、鋁等構成。在由如耐熱環氧玻璃層壓板、超級工程塑料、陶瓷等具有高絕熱性的材料(絕熱性材料)構成該部件的情況下，能夠進一步提高絕熱效果。在該情況下，根據所要求的絕熱性能，還可以不設置圖3所示的連通道32或圖5所示的連通道39。 Further, the members of the accommodating portions 29 and 36 accommodating the respective resin blocks 16 in the respective embodiments are generally made of iron, stainless steel, aluminum or the like. In the case where the member is composed of a material having high heat insulating properties (heat insulating material) such as a heat-resistant epoxy glass laminate, a super engineering plastic, or a ceramic, the heat insulating effect can be further improved. In this case, depending on the required thermal insulation performance, the connecting passage 32 shown in Fig. 3 or the connecting passage 39 shown in Fig. 5 may not be provided.
另外，各實施例中的收容部29、36還可以以集中收容複數 個樹脂平板16的方式構成。 In addition, the accommodating portions 29 and 36 in the embodiments can also be used for centralized storage. The resin plate 16 is constructed in such a manner.
另外，作為分別在圖3及圖5所示的連通道32、39的結構，根據連通道32、39的內徑、排氣能力等能夠想到各種結構。無論在何種結構中，均能夠得到防止樹脂塊16的升溫的本發明的效果。 Further, as the configuration of the connecting passages 32, 39 shown in Figs. 3 and 5, respectively, various configurations are conceivable depending on the inner diameter of the connecting passages 32, 39, the exhausting ability, and the like. The effect of the present invention which prevents the temperature rise of the resin block 16 can be obtained regardless of the structure.
另外，分別在圖3及圖5所示的實施例中，對連通道32、39供給冷卻用介質並使其流動。作為變形例，還可以藉由從吸引口吸引連通道32、39的內部而使連通道32、39為真空狀態後，堵塞吸引口。根據該變形例，成為真空狀態的連通道32、39取得絕熱效果。因此，分別具有成為真空狀態的連通道32、39的收容部29、蓋37作為絕熱性材料發揮作用。 Further, in the embodiments shown in Figs. 3 and 5, respectively, the cooling medium is supplied to the connecting passages 32, 39 and flows. As a modification, the suction passages may be blocked by sucking the inside of the connecting passages 32 and 39 from the suction port and bringing the connecting passages 32 and 39 into a vacuum state. According to this modification, the connecting passages 32 and 39 which are in a vacuum state have a heat insulating effect. Therefore, the accommodating portion 29 and the lid 37 each having the connecting passages 32 and 39 in a vacuum state function as a heat insulating material.
另外，在各實施例中，表示了使用樹脂塊作為樹脂材料的情況。不限於此，作為樹脂材料，還可以使用片狀、粒狀、顆粒狀或粉末狀的樹脂材料、換言之固體狀的樹脂材料。另外，還可以使用在常溫下為液狀的樹脂材料(液狀樹脂)。在使用粉末狀等的樹脂材料或液狀樹脂作為樹脂材料的情況下，能夠使用託盤狀的容器作為收容部。能夠將收容收容有粉末狀等的樹脂材料的容器(託盤等)的收容部或收容充填有液狀樹脂的容器(注射器)為本發明的對象。在使用液狀樹脂作為樹脂材料的情況下，作為樹脂材料的液狀樹脂其本身相當於由樹脂材料生成的流動性樹脂。 Further, in each of the examples, the case where a resin block was used as the resin material was shown. Not limited to this, as the resin material, a resin material in the form of a sheet, a granule, a granule or a powder, in other words, a solid resin material may be used. Further, a resin material (liquid resin) which is liquid at normal temperature can also be used. When a resin material such as a powder or a liquid resin is used as the resin material, a tray-shaped container can be used as the storage portion. It is an object of the present invention to accommodate a container (a tray or the like) in which a resin material such as a powder or the like is accommodated, or a container (syringe) in which a liquid resin is accommodated. When a liquid resin is used as the resin material, the liquid resin as the resin material itself corresponds to a fluid resin produced from a resin material.
另外，在各實施例中，表示了使用裝載器12將密封前基板安裝元件15和樹脂塊16同時運送至下模11的情況。不限於此，即使在使用各自的運送機構，分別將密封前基板安裝元件15和樹脂塊16運送至下模11的情況下，本發明也防止樹脂塊16的升溫，並取得將溫度保持恒溫的效果。 Further, in each of the embodiments, the case where the pre-sealed substrate mounting member 15 and the resin block 16 are simultaneously transported to the lower mold 11 by the loader 12 is shown. Without being limited thereto, even in the case where the respective front substrate mounting member 15 and the resin block 16 are respectively transported to the lower mold 11 by using the respective transport mechanisms, the present invention also prevents the temperature rise of the resin block 16 and maintains the temperature constant. effect.
下面，參照圖6(a)至(d)，對各實施例中的接收及輸出模組和成形模組的結構進行說明。圖6(a)至(d)係表示各實施例中的接收及輸出模組和成形模組的結構的概要圖。 Next, the configuration of the receiving and outputting module and the forming module in each embodiment will be described with reference to Figs. 6(a) to 6(d). 6(a) to 6(d) are schematic diagrams showing the configurations of the receiving and outputting modules and the forming modules in the respective embodiments.
如圖6(a)所示，在第一結構中，接收及輸出模組2和成形模組3A可相互裝卸，並且成形模組3A、3B、3C中相鄰的成形模組彼此為可相互裝卸的結構。 As shown in FIG. 6(a), in the first structure, the receiving and outputting module 2 and the forming module 3A are detachable from each other, and adjacent forming modules of the forming modules 3A, 3B, and 3C are mutually mutually Loading and unloading structure.
如圖6(b)所示，在第二結構中，接收及輸出模組2與成形模組3A為一體的母機和成形模組3B可相互裝卸，並且成形模組3B、3C為可相互裝卸的結構。 As shown in FIG. 6(b), in the second structure, the parent machine and the forming module 3B, which are integrated with the forming module 3A, are detachable from each other, and the forming modules 3B and 3C are detachable from each other. Structure.
在第三結構中，採用圖6(c)所示的結構。其結構的前提在於，圖1所示的接收及輸出模組2被分離為接收模組2A和輸出模組2B，具體來講，是例如，接收模組2A和成形模組3A可相互裝卸，成形模組3A、3B、3C中相鄰的成形模組彼此可相互裝卸，並且成形模組3C和輸出模組2B可相互裝卸的結構。在接收模組2A和輸出模組2B分離的結構中，特別是在使用粉末狀等樹脂材料的情況下，作為起因於樹脂材料的粉塵對策，將接收樹脂材料的模組和接收密封前引線框的模組分離後，能夠將這些分開配置。 In the third structure, the structure shown in Fig. 6(c) is employed. The premise of the structure is that the receiving and output module 2 shown in FIG. 1 is separated into a receiving module 2A and an output module 2B. Specifically, for example, the receiving module 2A and the forming module 3A can be detached from each other. The adjacent forming modules of the forming modules 3A, 3B, and 3C are detachable from each other, and the forming module 3C and the output module 2B are detachable from each other. In the structure in which the receiving module 2A and the output module 2B are separated, in particular, when a resin material such as a powder is used, as a countermeasure against dust of the resin material, the module for receiving the resin material and the lead frame before receiving the sealing are received. After the modules are separated, these can be configured separately.
在第四結構中，採用圖6(d)所示的結構。其結構的前提在於，圖1所示的接收及輸出模組2被分離為接收模組2A和輸出模組2B，具體來講，是接收模組2A與成形模組3A成為一體的模組和成形模組3B可相互裝卸，成形模組3B和3C可相互裝卸，並且成形模組3C和輸出模組2B可相互裝卸的結構。 In the fourth structure, the structure shown in Fig. 6(d) is employed. The premise of the structure is that the receiving and output module 2 shown in FIG. 1 is separated into a receiving module 2A and an output module 2B, specifically, a module in which the receiving module 2A and the forming module 3A are integrated. The forming modules 3B are detachable from each other, the forming modules 3B and 3C are detachable from each other, and the forming module 3C and the output module 2B are detachable from each other.
藉由採用第一至第四的結構，可得到如下的作用效果。即、能夠按照需要將成形模組3B、3C(至少為一個即可)安裝在樹脂密封裝置1中或按照需要從樹脂密封裝置1拆卸。因此，使用樹脂密封裝置1的電子器件(IC等完成品)廠商能夠按照市場的動向或需要的增減等，易於調整電子器件的生產能力。另外，電子器件廠商能夠從選址在電子器件的需要減少的區域的工廠的樹脂密封裝置適當拆卸成形模組，並將該成形模組安裝(增設)在選址在電子器件的需要增加的區域的工廠的樹脂密封裝置中。 By adopting the first to fourth configurations, the following effects can be obtained. That is, the molding modules 3B and 3C (at least one of them) can be attached to the resin sealing device 1 as needed or detached from the resin sealing device 1 as needed. Therefore, the manufacturer of the electronic device (Complete Product such as IC) using the resin sealing device 1 can easily adjust the productivity of the electronic device in accordance with the market trend or the increase or decrease of the demand. In addition, the electronic device manufacturer can appropriately disassemble the forming module from the resin sealing device of the factory located in the area where the electronic device needs to be reduced, and install (add) the forming module in the area where the electronic device needs to be added. The resin seal of the factory.
根據本發明，在樹脂密封裝置1中，在運送作為樹脂材料的樹脂塊16的裝載器12或保管樹脂塊16的材料搬出單元7中設置樹脂塊16的收容部29、36，在第一結構中，由絕熱性材料構成收容部29，在第二結構中，在收容部29的壁31的內部設置連通道32，並對連通道32供給冷卻用介質，在第三結構中，由絕熱性材料構成包圍收容部36的蓋37，在第四結構中，在包圍收容部36的蓋37的壁38的內部設置連通道39，並對連通道39供給冷卻用介質。 According to the present invention, in the resin sealing device 1, the accommodating portions 29, 36 of the resin block 16 are provided in the material carrying unit 7 that transports the resin block 16 as the resin material or the material carrying unit 7 that stores the resin block 16, in the first structure. The accommodating portion 29 is made of a heat insulating material. In the second structure, the connecting passage 32 is provided inside the wall 31 of the accommodating portion 29, and the cooling medium is supplied to the connecting passage 32. In the third structure, the heat insulating property is provided. The material constitutes a lid 37 that surrounds the accommodating portion 36. In the fourth configuration, a connecting passage 39 is provided inside the wall 38 of the lid 37 surrounding the accommodating portion 36, and a cooling medium is supplied to the connecting passage 39.
由此，在本發明中，能夠防止由樹脂材料承受來自外部的輻射熱引起的影響，因此，藉由防止樹脂材料的升溫，且在穩定的樹脂溫度下維持並進行管理，從而能夠提高產品的品質、成品率。 Therefore, in the present invention, it is possible to prevent the resin material from being affected by the radiant heat from the outside. Therefore, by preventing the temperature rise of the resin material and maintaining and managing the resin at a stable resin temperature, the quality of the product can be improved. ,Yield.
另外，藉由防止樹脂材料的升溫，能夠防止劣化的樹脂材料的粉末或碎片等粘接在材料運送機構或樹脂材料的保管、收容部，導致樹脂材料的裝填或運送時發生故障。因此，減少清潔運送機構或樹脂材料的保管、收容部等的次數或時間，能夠穩定地維持樹脂密封裝置的運轉。 In addition, by preventing the temperature rise of the resin material, it is possible to prevent the powder or chips of the deteriorated resin material from being adhered to the material transport mechanism or the storage or storage portion of the resin material, and the resin material may be broken during loading or transportation. Therefore, the number or time of storage of the cleaning conveyance mechanism or the resin material, the storage portion, and the like can be reduced, and the operation of the resin sealing device can be stably maintained.
另外，在具有複數個成形模組的樹脂密封裝置中，能夠防止樹脂材料的升溫。由此，即使根據各成形模組樹脂材料的運送時間不同的情況下，能夠減低樹脂材料承受來自周圍的輻射熱的影響，進一步能夠使其影響在各成形模組中均等。因此，在各成形模組中，能夠均勻地管理並維持樹脂材料的狀態，從而維持穩定的品質，並且能夠達到高成品率。 Further, in the resin sealing device having a plurality of molding modules, the temperature rise of the resin material can be prevented. Thereby, even if the conveyance time of the resin material of each molding module differs, the influence of the radiant heat from the surroundings can be reduced, and the influence can be equalized in each molding module. Therefore, in each of the forming modules, the state of the resin material can be uniformly managed and maintained, thereby maintaining stable quality and achieving high yield.
如到目前為止說明的那樣，根據本發明，藉由簡便的結構防止樹脂材料的升溫，並能夠將樹脂材料保持在穩定的溫度。因此，本發明對提高產品的品質、提高成品率或提高裝置的運轉率也有巨大貢獻，並在工業上也具有非常高的價值。 As described so far, according to the present invention, the temperature rise of the resin material is prevented by a simple structure, and the resin material can be maintained at a stable temperature. Therefore, the present invention has a great contribution to improving the quality of the product, improving the yield, or improving the operation rate of the device, and is also of high industrial value.
另外，本發明並不限定於上述的各實施例，在不脫離本發明的主旨的範圍內，能夠按照需要，任意並且適當組合而進行變更，或選擇性採用。 In addition, the present invention is not limited to the above-described embodiments, and may be modified arbitrarily and appropriately, or selectively used, as needed within the scope of the gist of the invention.
12‧‧‧裝載器(運送機構) 12‧‧‧Loader (transportation agency)
15a‧‧‧引線框 15a‧‧‧ lead frame
15b‧‧‧晶片元件 15b‧‧‧ Wafer components
15c‧‧‧導線 15c‧‧‧ wire
16‧‧‧樹脂塊 16‧‧‧ resin block
27‧‧‧加熱器 27‧‧‧heater
28‧‧‧夾具 28‧‧‧Clamp
29‧‧‧收容部 29‧‧‧ Housing Department
30‧‧‧擋板 30‧‧‧Baffle
31‧‧‧壁 31‧‧‧ wall
32‧‧‧連通道 32‧‧‧Connected channel
33‧‧‧冷卻用介質供給部 33‧‧‧Condition supply unit for cooling
34‧‧‧空氣供給口 34‧‧‧Air supply port
Claims (15)
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| JP2013001303A JP5985402B2 (en) | 2013-01-08 | 2013-01-08 | Resin sealing device and resin sealing method |
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| TW201436124A TW201436124A (en) | 2014-09-16 |
| TWI527167B true TWI527167B (en) | 2016-03-21 |
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| KR (1) | KR101587694B1 (en) |
| CN (1) | CN103915352B (en) |
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| JP6430342B2 (en) * | 2015-08-11 | 2018-11-28 | Ｔｏｗａ株式会社 | Resin molding apparatus, resin molding method, and mold |
| CN107466160B (en) | 2016-06-06 | 2022-04-29 | 宁波舜宇光电信息有限公司 | Equipment and method for manufacturing molded circuit board of camera module |
| CN107466159B (en) * | 2016-06-06 | 2022-07-19 | 宁波舜宇光电信息有限公司 | Molded circuit board of camera module and manufacturing equipment and manufacturing method thereof |
| JP6923423B2 (en) * | 2017-11-21 | 2021-08-18 | Ｔｏｗａ株式会社 | Manufacturing method of transport equipment, resin molding equipment and resin molded products |
| JP7416392B2 (en) | 2019-02-27 | 2024-01-17 | 株式会社ショウワ | Index cleaning device |
| JP7121763B2 (en) * | 2020-02-14 | 2022-08-18 | アピックヤマダ株式会社 | RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD |
| JP7360368B2 (en) * | 2020-08-18 | 2023-10-12 | Ｔｏｗａ株式会社 | Resin molding equipment and method for manufacturing resin molded products |
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| JP3423766B2 (en) * | 1994-03-11 | 2003-07-07 | Ｔｏｗａ株式会社 | Resin encapsulation molding method and mold device for electronic components |
| JP3575893B2 (en) * | 1995-11-27 | 2004-10-13 | アピックヤマダ株式会社 | Resin molding device with temperature control mechanism for resin tablet |
| JP2002127186A (en) * | 2000-10-25 | 2002-05-08 | Matsushita Electric Works Ltd | Material feeding device for transfer molding device |
| CN102171801B (en) * | 2008-09-30 | 2013-10-16 | 东和株式会社 | Resin sealing compression molding method for electronic component and device therefor |
| JP5697919B2 (en) * | 2010-07-29 | 2015-04-08 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
| JP5776092B2 (en) * | 2011-01-11 | 2015-09-09 | アピックヤマダ株式会社 | Compression molding method, compression molding apparatus, and resin supply handler |
| JP5682033B2 (en) * | 2011-03-14 | 2015-03-11 | アピックヤマダ株式会社 | Resin sealing device |
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| KR101587694B1 (en) | 2016-01-21 |
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