KR101515716B1 - Apparatus for manufacturing semiconductor packages - Google Patents

Apparatus for manufacturing semiconductor packages Download PDF

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Publication number
KR101515716B1
KR101515716B1 KR1020130143409A KR20130143409A KR101515716B1 KR 101515716 B1 KR101515716 B1 KR 101515716B1 KR 1020130143409 A KR1020130143409 A KR 1020130143409A KR 20130143409 A KR20130143409 A KR 20130143409A KR 101515716 B1 KR101515716 B1 KR 101515716B1
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KR
South Korea
Prior art keywords
semiconductor
molding
module
support jig
substrate
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KR1020130143409A
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Korean (ko)
Inventor
이수영
Original Assignee
세메스 주식회사
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Priority to KR1020130143409A priority Critical patent/KR101515716B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14672—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame moulding with different depths of the upper and lower mould cavity

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

An apparatus for manufacturing semiconductor packages, the apparatus comprising: a support jig for supporting a substrate on which semiconductor chips are mounted; and a molding process for the semiconductor chips on the substrate supported by the support jig, A method of manufacturing a semiconductor device, comprising: a molding module for manufacturing a semiconductor strip including a molded semiconductor mold; a semiconductor strip disposed on one side of the molding module and supported by the support jig, And a transfer module for transferring the support jig on which the substrate or semiconductor strip is supported to the molding module and the cutting module.

Figure R1020130143409

Description

[0001] Apparatus for manufacturing semiconductor packages [0002]

Embodiments of the present invention relate to a semiconductor package manufacturing apparatus. And more particularly, to an apparatus for manufacturing semiconductor packages by performing a molding process for semiconductor chips mounted on a substrate and a cutting process for individualizing the semiconductor strips produced by the molding process.

In general, a molding process for molding semiconductor packages is performed by disposing a substrate such as a lead frame or a printed circuit board on which semiconductor chips are mounted in a mold and injecting a molding resin such as epoxy resin into a cavity of the mold Lt; / RTI > The apparatus for performing the molding process includes a transfer molding method of injecting a molten resin or a liquid resin into the cavity, a method of supplying a molding resin, a molten resin or a liquid resin in powder form into the cavity, And a compression molding type device for compressing and molding the molding resin between the lower molds.

As an example of the transfer molding apparatus, Korean Patent Laid-Open Nos. 10-2001-0041616 and 10-2006-0042228 disclose transfer molding apparatuses including upper and lower molds for molding semiconductor elements.

As described above, the semiconductor strips fabricated by the molding process can be individualized through the cutting process and can be manufactured as a plurality of semiconductor packages, and can be classified into good and defective products through the inspection process.

Examples of the apparatus for performing the cutting and sorting process on the semiconductor strip as described above are disclosed in Korean Patent Laid-Open Nos. 10-2008-0074530 and 10-2009-0030430.

Meanwhile, the semiconductor strip manufactured through the molding process as described above can be transferred to the cutting and sorting apparatus after the unnecessary mold portion is removed through a degate process, A separate transfer device for transferring the substrate and transferring the semiconductor strip, and the like are required.

It is an object of the present invention to provide a semiconductor package manufacturing apparatus which can reduce the time and cost required for manufacturing semiconductor packages by integrating a molding process and a cutting process for a substrate on which semiconductor chips are mounted.

According to an aspect of the present invention, there is provided a semiconductor package manufacturing apparatus including a support jig for supporting a substrate on which semiconductor chips are mounted, and a molding process for the semiconductor chips on the substrate supported by the support jig A molding module for manufacturing a semiconductor strip including the substrate and the semiconductor mold formed on the substrate; and a semiconductor module, which is disposed on one side of the molding module and cuts the semiconductor strip supported by the support jig, A cutting module for individualizing into semiconductor packages each including semiconductor chips and a transfer module for transferring the support jig on which the substrate or semiconductor strip is supported to the molding module and the cutting module.

According to embodiments of the present invention, the support jig may have a plurality of vacuum holes for holding the substrate or the semiconductor strip.

According to embodiments of the present invention, the molding module includes: a lower master die on which the support jig is placed; an upper mold disposed on the lower master die and having a mold cavity for molding the semiconductor chips; And an upper master die to which the upper master die is mounted.

According to embodiments of the present invention, the upper mold may be provided with a resin injection port for injecting a molding resin into the mold cavity, and the upper mold may be provided with a resin injection port for supplying the molding resin through the resin injection port Port blocks can be mounted.

According to embodiments of the present invention, the upper mold may be resiliently mounted to the upper master die using first elastic members.

According to embodiments of the present invention, the upper mold may include a plurality of air vents connected to the mold cavity. In particular, the upper master die may be provided with opening / closing members protruding from the air vents through the upper mold to open / close the air vents, and the opening / closing members may be mounted on the upper master die, When the pressure is applied, the air vent may be protruded inward to block the air vents.

According to embodiments of the present invention, the molding process for the semiconductor chips may be performed at a first clamp pressure at which the air vents are opened, and after the molding resin is filled in the mold cavity, A second clamp pressure higher than the first clamp pressure may be applied to the upper master die.

According to embodiments of the present invention, the opening and closing members can be resiliently mounted to the upper master die using second elastic members.

According to embodiments of the present invention, the transfer module may include a transfer chamber connected to the molding module and the cutting module, and a transfer robot disposed in the transfer chamber for transferring the support jig.

According to embodiments of the present invention, the cutting module may include a chuck table on which the support jig supporting the semiconductor strip is placed, and a blade unit for cutting the semiconductor strip on the chuck table.

According to embodiments of the present invention, a plurality of channels through which the blade of the blade unit is inserted may be provided on the upper surface of the support jig.

According to the embodiments of the present invention, it is possible to further include a sorting module for sorting the semiconductor packages individualized by the blade unit into good and defective packages.

According to the embodiments of the present invention as described above, the semiconductor chips mounted on the substrate, the cutting process for the semiconductor strip manufactured by the molding process, and the semiconductor packages Can be performed in one apparatus. Therefore, the time and cost can be greatly reduced as compared with a conventional method of manufacturing a semiconductor package by using a molding apparatus, a digging apparatus, and a cutting and sorting apparatus.

Particularly, the manufacturing time and cost of the semiconductor packages can be greatly reduced because a substrate and a device for transferring the semiconductor strip between the conventional gate devices and devices are unnecessary.

FIG. 1 is a schematic diagram for explaining a semiconductor package manufacturing apparatus according to an embodiment of the present invention.
2 is a schematic cross-sectional view for explaining the support jig and the molding module shown in Fig.
3 is a schematic cross-sectional view for explaining the operation of the opening and closing members shown in Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in the shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

FIG. 1 is a schematic diagram for explaining a semiconductor package manufacturing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a semiconductor package manufacturing apparatus 10 according to an embodiment of the present invention sequentially performs a molding process and a cutting process on a substrate 30 on which semiconductor chips 40 are mounted through a bonding process Can be used. A plurality of semiconductor chips 40 may be mounted on a substrate 30 such as a lead frame or a printed circuit board through a bonding process and the substrate 30 on which the semiconductor chips 40 are mounted, May be fabricated from a plurality of semiconductor packages 70 by the semiconductor package manufacturing apparatus 10 according to an embodiment of the present invention.

As another example, a plurality of semiconductor chips may be directly bonded onto a wafer, and a semiconductor package manufacturing apparatus according to another embodiment of the present invention may perform a molding process and a cutting process at a wafer level.

According to an embodiment of the present invention, the semiconductor package manufacturing apparatus 10 includes a support jig 20 for supporting a substrate 30 on which the semiconductor chips 40 are mounted, A cutting module 200 for performing a cutting process on the semiconductor strip 60 manufactured by the molding module 100 and a cutting module 200 for performing a cutting process on the semiconductor strip 60 manufactured by the molding module 100. The molding module 100, (300) for transferring the substrate (30) or the support jig (20) supported by the semiconductor strip (60) between the substrate (200)

Specifically, the molding module 100 performs a molding process on the semiconductor chips 40 on the substrate 30 supported by the support jig 20 to mold the substrate 30 and the substrate 30, The semiconductor strip 60 including the semiconductor mold formed using the resin 50 (see Fig. 2) can be manufactured. The cutting module 200 may be disposed on one side of the molding module 100 and may cut the semiconductor strip 60 supported by the support jig 20 so that the semiconductor strip 60 is bonded to the semiconductor chips 40 The semiconductor packages 70 can be individually formed.

The transfer module 300 may be connected to the molding module 100 and the cutting module 200. The transfer module 300 may transfer the support jig 20 supporting the substrate 30 to the molding module 100, The support jig 20 supported by the semiconductor strip 60 manufactured by the molding module 100 can be transferred to the cutting module 200.

According to an embodiment of the present invention, the semiconductor package manufacturing apparatus 10 includes a sorting module 400 for inspecting individual semiconductor packages 70 by the cutting module 200 and sorting them into good and defective products ).

2 is a schematic cross-sectional view for explaining the support jig and the molding module shown in Fig.

Referring to FIG. 2, the support jig 20 supports the substrate 30 and can grip the substrate 30 using vacuum pressure. For example, a plurality of vacuum holes 22 for holding the substrate 30 may be provided on the upper surface of the support jig 20. Inside the support jig 20, And a vacuum chamber 24 connected to the vacuum chamber 22. A connection portion 26 for connecting the vacuum chamber 24 to a vacuum system (not shown) including a vacuum pump may be provided on the lower surface of the support jig 20. As an example, the connecting portion 26 may have the form of a through hole, though not shown in detail, and may otherwise have the form of a check valve.

According to an embodiment of the present invention, the upper surface of the support jig 20 may be provided with a plurality of channels 28 for cutting the semiconductor strip 60 in the cutting module 200 . The channels 28 may be used to provide a space in which the blades of the cutting module 200 are inserted, and may be disposed between the vacuum holes 22, respectively.

The molding module 100 includes a lower master die 102 on which the support jig 20 supporting the substrate 30 is placed, an upper mold 110 disposed on the upper portion of the lower master die 102, Die 104 may be included.

Although not shown in detail, the lower master die 102 is loaded with the support jig 20 transferred by the transfer module 300 onto the lower master die 102 and the lower master die 102, And lift pins (not shown) for unloading from the apparatus. At this time, the support jig 20 can be used as a lower mold in the molding process.

Meanwhile, the lower master die 102 may be provided with a vacuum pipe 106 connected to the connection unit 26. As the support jig 20 is loaded on the lower master die 102, the connection portion 26 and the vacuum pipe 106 can be connected to each other, and the vacuum pressure supplied through the vacuum pipe 106 The substrate 30 can be vacuum-adsorbed on the support jig 20 stably.

The upper mold 110 may have a mold cavity 112 for molding the semiconductor chips 40 on the substrate 30. Particularly, the upper mold 110 may be provided with a resin injection port 114 for injecting the molding resin 50 into the mold cavity 112. The resin injection port 114 may be formed at a central portion of the mold cavity 112. The resin injection port 112 may be formed at an upper portion of the upper mold 110, The port block 130 may be provided with a port block 130. [

The port block 130 may include a port connected to the resin injection port 114 to supply the molding resin 50. A plunger 132 for injecting the molding resin 50 May be disposed. In one example, a solid state resin tablet may be supplied in the port, and after the resin tablet is melted in the port, the molten molding resin is injected by the plunger 132 into the resin injection port 114 The mold cavity 112 may be formed of a resin. Although not shown, the port block 130 may include a heater for melting the resin tablet, a driving unit for moving the plunger 132, and the like.

In the meantime, although one resin injection port 114 is used, a plurality of resin injection ports may be provided in the upper mold 110, and the resin injection ports 114 and the A corresponding plurality of ports may be provided.

According to an embodiment of the present invention, the upper mold 110 may be provided with a plurality of air vents 116 for discharging air inside the mold cavity 112. The air vents 116 may be formed at edge portions of the upper mold 110 so as to have a trench shape connected to the mold cavity 112.

The resin injection port 114 is disposed at a central portion of the mold cavity 112 and the air vents 116 are disposed at both side edge portions of the upper mold 110. However, The injection port may be disposed at one edge of the upper mold 110 and may be connected to one side of the mold cavity 112 and the air vents may be disposed at the other edge of the upper mold 110. Therefore, the scope of the present invention is not limited by the number and arrangement of the resin injection ports 114 and the air vents 116.

According to an embodiment of the present invention, the upper mold 110 may be resiliently mounted to the upper master die 104. As an example, a plurality of first elastic members 118 may be disposed between the upper mold 110 and the upper master die 104, and coil springs may be used as the first elastic members 118 .

The upper mold 110 may be coupled to the support jig 20 after the support jig 20 is loaded on the lower master die 102. At this time, And the semiconductor chips 40 may be placed in the mold cavity 112. The edge portions of the substrate 30 can be prevented from being damaged by the first elastic members 118 when the upper mold 110 and the support jig 20 are coupled.

According to an embodiment of the present invention, the molding module 100 may include opening and closing members 120 for opening and closing the air vents 116. The opening and closing members 120 may be mounted on the upper master die 104 so as to protrude into the air vents 116 through the upper mold 110. In particular, the opening and closing members 120 may protrude into the air vents 116 to block the air vents 116 when a predetermined clamp pressure is applied to the upper master die 104.

3 is a schematic cross-sectional view for explaining the operation of the opening and closing members shown in Fig.

2 and 3, the molding process for the semiconductor chips 40 may be performed at a first clamp pressure at which the air vents 116 are opened, A second clamp pressure higher than the first clamp pressure may be applied to the upper master die 104 to block the air vents 116 after the resin 50 is sufficiently filled.

Specifically, a first clamp pressure may be applied to the upper master die 104 to a degree that the opening and closing members 120 do not protrude to the inside of the air vents 116. In this state, The injection of the molding resin 50 into the buttress 112 can be performed. After completion of the molding process, that is, after the molding resin 50 is sufficiently filled in the mold cavity 112, a predetermined second clamp pressure may be applied to the upper master die 104. In this case, the position of the upper mold 110 is not changed, and the opening / closing members 120 mounted on the upper master die 104 are pressed by the upper master die 104, 116 so that the air vents 116 can be shut off.

Since the air vents 116 can be blocked by the opening and closing members 120 at the time of completion of the molding process as described above, the molding resin 50 can leak through the air vents 116 Can be prevented. Particularly, since the air vents 116 can be cut off as described above, the area of the air vents 116 can be sufficiently ensured, so that air can be supplied from the mold cavity 112 during the molding process, The discharge can be easily performed. As a result, voids and the like in the molding process of the semiconductor chips 40 can be sufficiently reduced.

The completion time of the molding process may be preset based on a time required for the molding resin 50 to be sufficiently filled in the mold cavity 112, And applying the second clamp pressure to the upper master die 104 at the completion time.

According to an embodiment of the present invention, the opening and closing members 120 may be resiliently mounted to the upper master die 104. As an example, the second elastic members 122 may be disposed between the opening and closing members 120 and the upper master die 104, and a coil spring may be used as the second elastic member 122 . Accordingly, even if the opening and closing members 122 are protruded to the inside of the air vents 116 by the application of the second clamp pressure and are brought into close contact with the edges of the substrate 30, the second elastic members 122 The damage of the edge portion of the substrate 30 can be sufficiently prevented.

1, after the molding process for the semiconductor chips 40 is completed, the substrate 30 and the semiconductor mold formed by the molding resin 50 are placed on the support member 20, The semiconductor strip 60 may be completed and then the support jig 20 may be transferred to the cutting module 200 by the transport module 300. [

In the meantime, when the connection portion 26 has a check valve shape, vacuum pressure can be maintained in the vacuum chamber 24 even after the support jig 20 is unloaded from the lower master die 102, The holding state of the semiconductor strip 60 can be stably maintained during the transfer of the support jig 20.

The transfer module 300 may include a transfer robot 310 for transferring the support jig 20. For example, the transfer robot 310 may have a rectangular coordinate type robot, and the support jig 20 supporting the substrate 30 may be transferred to the molding module 100, The supporting jig 20 can be transferred from the molding module 100 to the cutting module 200. In addition, the individual semiconductor packages 70 may be transferred from the cutting module 200 to the sorting module 400.

The transfer module 300 may include the molding module 100 and the transfer chamber 302 connected to the cutting module 200. Meanwhile, a loader 350 for providing the substrate 30 may be disposed on one side of the transfer chamber 302. The loader 350 includes a load port 352 in which a cassette 32 accommodating a plurality of substrates 30 is disposed and a load port 352 disposed adjacent to the load port 352 and supporting the support jig 20 And a stage 354 for the < / RTI > Although not shown, the loader 350 further includes a substrate transferring unit (not shown) for transferring the substrate 30 from the cassette 352 to the support jig 20 located on the stage 354 . As an example, the substrate transferring part may include a picker for vacuum-sucking the substrate 30 and a driving part for moving the picker.

The cutting module 200 may include a chuck table 210 for supporting the support jig 20 on which the semiconductor strip 60 is supported and a blade unit 220 for cutting the semiconductor strip 60 have. Although not shown in detail, the chuck table 210 may be configured to be movable in the horizontal direction, and may be configured to be rotatable.

Although not shown, the chuck table 210 is provided with a vacuum pipe (not shown) connected to the connection portion 26 of the support jig 20 and lift pins (not shown) for loading and unloading the support jig 20 ), And the vacuum pipe may be connected to a vacuum system (not shown) including a vacuum pump or the like. When the support jig 20 is loaded on the chuck table 210, the connection portion 26 of the support jig 20 can be connected to the vacuum system through the vacuum piping, The semiconductor strip 60 can be stably held on the support jig 20 while the cutting process using the semiconductor strip 60 is performed.

The semiconductor packages 70 customized by the cutting module 200 may be transmitted to the classification module 400 as described above. More specifically, the transfer robot 310 may move the support jig 20 supporting the individualized semiconductor packages 70 to a position adjacent to the classification module 400, The semiconductor packages 70 can be received from the support jig 20.

According to an embodiment of the present invention, the classification module 400 includes a first package transfer unit 410 for transferring the semiconductor packages 70, a package for cleaning and drying the semiconductor package 70, A pallet table 430 for supporting the cleaned semiconductor packages 70 and semiconductor packages 70 on the pallet table 430 are connected to the good and defective trays 402 and 404 A first inspection unit 450 for inspecting the semiconductor packages 70 on the pallet table 430 and a second inspection unit 450 for inspecting the semiconductor packages 70 on the pallet table 430. The second package transfer unit 440, And a second inspection unit 460 for inspecting the semiconductor packages 70 that are transported by the second inspection unit.

The first package transfer unit 410 may include a package picker for simultaneously picking up the semiconductor packages 70 on the support jig 20 and a drive unit for moving the package picker. The semiconductor packages 70 picked up by the package picker may be cleaned and dried by the package cleaning unit 420 and then placed on the pallet table 430.

For example, the package picker may move the semiconductor packages 70 in the X-axis direction extending in the horizontal direction, and the pallet table 430 may be positioned under the movement path of the package picker. In addition, the pallet table 430 may be movable in the Y-axis direction perpendicular to the X-axis direction.

The first inspection unit 450 may be disposed above the movement path of the pallet table 430 and the upper surface of the semiconductor packages 70 may be inspected using a camera can do.

The second package transfer unit 440 may include a plurality of pickers for picking up the semiconductor packages 70 and a driver for moving the pickers in the X axis direction. The second inspection unit 460 may be positioned under the path of movement of the pickers and may inspect the lower surface of the semiconductor packages 70 picked up by the pickers.

The pickers can sort the semiconductor packages 70 into the good tray 402 and the reject tray 404 according to the result of inspection by the first and second inspection units 450 and 460. At this time, the good article tray 402 and the defective article tray 404 can be moved in the Y-axis direction.

Although the components of the classification module 400 have been described above as examples, the components of the classification module 400 can be modified in various forms. Therefore, the scope of the present invention is limited by the detailed configuration of the classification module 400 It will not be.

The semiconductor strip 60 such as the dummy portion of the semiconductor strip 60 and / or the edge portion of the substrate 30 when the semiconductor packages 70 are individualized by the cutting module 200, May be removed from the support jig 20 after the individualized semiconductor packages 70 are picked up from the support jig 20 by the first package transfer unit 410. [

Although not shown, the transfer module 300 may include a jig cleaning unit (not shown) for cleaning and drying the support jig 20. As an example, the jig cleaning unit may spray compressed air and cleaning liquid onto the support jig 20 to remove residues on the support jig 20, and then the support jig 20 is heated It can be dried using air.

The support jig 20 thus cleaned and dried can be transferred onto the stage 354 of the loader 350 by the transfer robot 310.

According to the embodiments of the present invention as described above, the molding process for the semiconductor chips 40 mounted on the substrate 30, the cutting process for the semiconductor strip 60 manufactured by the molding process, Since the classification process for the individual semiconductor packages 70 by the cutting process can be performed in one apparatus, compared with the conventional molding apparatus, the degating apparatus, and the method for manufacturing the semiconductor package using the cutting and sorting apparatus So that the time and cost can be greatly reduced.

Particularly, the manufacturing time and cost of the semiconductor packages 70 can be greatly reduced because a substrate and a device for transferring the semiconductor strip between the conventional degating apparatuses and devices are unnecessary.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: semiconductor package manufacturing apparatus 20: support jig
22: Vacuum hole 24: Vacuum chamber
26: connection 28: channel
30: substrate 40: semiconductor chip
50: molding resin 60: semiconductor strip
70: Semiconductor package 100: Molding module
102: lower master die 104: upper master die
110: upper mold 112: mold cavity
114: resin inlet 116: air vent
120: opening / closing member 130: port block
200: cutting module 210: chuck table
220: blade unit 300: conveying module
302: transfer chamber 310: transfer robot
350: Loader 400: Classification module

Claims (12)

A support jig supporting a substrate on which semiconductor chips are mounted;
A molding module for performing a molding process for the semiconductor chips on the substrate supported by the support jig to manufacture a semiconductor strip including the semiconductor mold formed on the substrate and the substrate;
A cutting module disposed on one side of the molding module and cutting the semiconductor strip supported by the support jig to separate the semiconductor strip into semiconductor packages each including the semiconductor chips; And
And a transfer module for transferring the support jig supporting the substrate or semiconductor strip to the molding module and the cutting module,
The transfer module includes:
A transfer chamber connected to the molding module and the cutting module; And
And a transfer robot disposed in the transfer chamber for transferring the support jig. 2. The semiconductor package manufacturing apparatus according to claim 1, wherein the support jig has a plurality of vacuum holes for holding the substrate or the semiconductor strip. The molding module according to claim 1,
A lower master die on which the support jig is placed;
An upper mold disposed above the lower master die and having a mold cavity for molding the semiconductor chips; And
And an upper master die on which the upper mold is mounted. The mold of claim 3, wherein the upper mold is provided with a resin injection port for injecting the molding resin into the mold cavity, and a port block for supplying the molding resin through the resin injection port is mounted on the upper mold Wherein the semiconductor package is a semiconductor package. The apparatus of claim 3, wherein the upper mold is resiliently mounted to the upper master die using first elastic members. The method of claim 5, wherein the upper mold comprises a plurality of air vents connected to the mold cavity,
Wherein the upper master die is equipped with opening and closing members so as to be able to protrude into the air vents through the upper mold for opening and closing the air vents,
Wherein the opening / closing members protrude to the inside of the air vents when the predetermined clamp pressure is applied to the upper master die to block the air vents. The method of claim 6, wherein the molding process for the semiconductor chips is performed at a first clamp pressure at which the air vents are opened, and after the molding resin is filled in the mold cavity, And a second clamp pressure higher than the pressure is applied to the upper master die. The apparatus as claimed in claim 6, wherein the opening / closing members are resiliently mounted to the upper master die using second elastic members. delete 2. The apparatus of claim 1,
A chuck table on which the support jig supporting the semiconductor strip is placed; And
And a blade unit for cutting the semiconductor strip on the chuck table. 11. The apparatus of claim 10, wherein a plurality of channels for inserting blades of the blade unit are provided on an upper surface of the support jig. 11. The semiconductor package manufacturing apparatus according to claim 10, further comprising a sorting module for sorting the semiconductor packages individualized by the blade unit into good and defective packages.
KR1020130143409A 2013-11-25 2013-11-25 Apparatus for manufacturing semiconductor packages KR101515716B1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050007144A (en) * 2003-07-10 2005-01-17 가부시끼가이샤 르네사스 테크놀로지 Method of manufaturing semiconductor device and semidonductor device manufacturing apparatus used in it
KR100833282B1 (en) * 2006-08-24 2008-05-28 세크론 주식회사 Sawing sorter device, and process for Manufacturing Semiconductor using the same
KR100921567B1 (en) * 2007-09-03 2009-10-12 주식회사 엘티에스 Rfid tag in-line manufacturing system and method using a laser

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050007144A (en) * 2003-07-10 2005-01-17 가부시끼가이샤 르네사스 테크놀로지 Method of manufaturing semiconductor device and semidonductor device manufacturing apparatus used in it
KR100833282B1 (en) * 2006-08-24 2008-05-28 세크론 주식회사 Sawing sorter device, and process for Manufacturing Semiconductor using the same
KR100921567B1 (en) * 2007-09-03 2009-10-12 주식회사 엘티에스 Rfid tag in-line manufacturing system and method using a laser

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