JP2833589B2 - Resin sealing molding apparatus and resin sealing method for semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing molding apparatus and a resin sealing method for a semiconductor device.

[0002]

2. Description of the Related Art Heretofore, as a resin sealing molding device for a semiconductor device, a device using a cylindrical tablet resin has been known. FIG. 24 schematically shows the configuration of this known resin encapsulation / molding apparatus.

The role and operation of each component will be described below. First, the tablet feeder 31 and the tablet loader 32 are shown in FIGS.

A tablet resin is manually supplied to the tablet feeder 31 from outside the resin encapsulation / molding apparatus. The tablet feeder 31 has a vibrator 34 and moves the tablet resin by vibration. The tablet resin is transported to a position near the tablet loader 32 by the rectilinear feeder 33. The tablet resin at the tip of the linear feeder 33 is supplied to the tablet loader 32 by a claw having an opening / closing function (not shown). FIG. 27 shows the tablet loader 32.
This will be described with reference to FIG.

[0005] The tablet loader 32 has a tablet loader pot 35 which is a charging section for tablet resin,
A pusher hole 36 necessary for pushing up the tablet resin in the tablet loader pot 35 from below with a pusher 39 is provided. The tablet loader pot 35 is provided at an equal pitch with the pot 22 shown in FIG. 34 which is a charging portion of the tablet resin provided in the resin sealing mold.

[0006] The tablet loader 32 conveys the tablet resin supplied from the tablet feeder 31 to a place where the supply hand 19 waits. FIG. 29 shows the supply hand 19. Claw chuck 20 and tablet holding unit 3
7 is provided by the supply hand 19. FIG. 29 shows the supply hand 1
9 is a front view showing the features of the shape of FIG. 9, and FIG. 30 is a side view. The supply hand 19, which is not shown in FIG. 24, is waiting above the lead frame arrangement section 3 to supply the tablet resin and the lead frame to the resin sealing mold.

The supply hand 19 has a claw chuck 20 for holding a lead frame and a tablet holding section 37 for holding tablet resin. Subsequently, FIG.
The operation of the supply hand 19 for holding the lead frame and the tablet resin will be described with reference to FIGS.

FIG. 31 shows a state in which the tablet loader 32 into which the tablet resin 38 has been introduced has moved to a place where the supply hand 19 waits. FIG. 32 shows a state in which the tablet resin 38 is supplied to the supply hand 19. Tablet resin 38 in tablet loader 32
Is pushed up from below by a pusher 39 via a pusher hole 36. The tablet resin 38 pushed up by the pusher 39 is inserted into the tablet holding portion 37 attached to the supply hand 19.
The tablet resin 3 in the tablet holding unit 37 is held by a nail or the like (not shown) attached to the tablet holding unit 37.
8 is retained.

After holding the tablet resin 38, the supply hand 19 moves onto the lead frame arrangement section 3 to perform a lead frame holding operation. The opening and closing operation of the chuck jaws 20 attached to the supply hand 19 causes the lead frame 25 arranged in the lead frame
9 is retained. The supply hand 19 is a tablet resin 38
FIG. 33 shows a state in which the lead frame 25 is held.

After the supply hand 19 holds the tablet resin 38 and the lead frame 25, the supply hand 19
b, and supplies the tablet resin 38 and the lead frame 25 to the resin-sealed mold lower mold 7b.
FIG. 34 shows the resin mold lower mold 7b. The resin-sealed mold lower mold 7b is provided with a cavity for resin-sealing the semiconductor element. Since this is a cavity in the lower mold,
Called lower cavity 26b. In addition, a runner 28 that allows the molten resin to flow into the cavity is provided. Then, a resin sealing mold pot 22 which is an input portion of the tablet resin 38 and a chuck jaw 40 serving as a jaw of the chuck jaws 20 attached to the supply hand 19 are provided in the resin sealing mold lower mold 7b. Is provided.

In the cross section AA in FIG. 34, the lead frame 25 is placed on the resin mold
FIG. 35 shows a state in which is supplied. Resin sealing mold lower mold 7b
Supply hand 19 in chuck jaws 40 provided in
Is opened, and the lead frame 25 is mounted on the resin mold lower mold 7b. Further, the tablet resin 38 is also supplied from the tablet holding portion 37 attached to the supply hand 19 to the resin sealing mold pot 22 by an opening operation of a tablet resin holding claw (not shown).

FIG. 36 shows a state of the upper mold 7a and the lower mold 7b when the lead frame 25 and the tablet resin 38 are supplied onto the lower mold 7b.

FIG. 37 shows the state of the upper mold 7a and the lower mold 7b of the resin-sealed mold after resin-sealing. After the lead frame 25 and the tablet resin 38 are supplied to the resin-molded lower mold 7b, the resin-molded upper molds 7a and 7b perform a mold clamping operation. After the tablet resin 38 charged into the resin-sealed mold pot 22 is given sufficient heat to melt and flow, the plunger 29 moves up. By the upward movement of the plunger 29, the tablet resin 38 melts and flows, passes through the cull 27 provided in the resin mold upper mold 7a, and passes through the runner 28 provided in the resin mold lower mold 7b. It flows into the upper cavity 26a and the lower cavity 26b. After the filling of the resin into the upper and lower cavities is completed, the sealing resin is cured within a predetermined time.

After the sealing resin is sufficiently cured, the upper mold 7a and the upper mold 7b perform a mold opening operation. The resin-sealed product is taken out of the resin-sealed mold lower mold 7b by a storage take-out hand (not shown) and transported to the separation unit 8.

The product from which the resin cured in the runner 28 and the cull 27 has been removed in the separating section 8 is stored in the product storage magazine 9 by a transport means (not shown).

The resin encapsulation molding apparatus is a cleaner 4 for removing thin burrs and the like of the resin adhering to the resin encapsulation mold.
1 and a dust collector 42 for sucking and collecting light burrs of resin.

The above is the configuration of the conventional resin sealing molding apparatus and a series of operations relating to resin sealing. FIG.
The outline of the production flow of the tablet resin 38 used in the prior art is shown below.

The raw materials of the tablet resin 38 are a resin, a filler, a coloring matter, a curing agent and the like. Mixing is a process of uniformly mixing the raw materials. Kneading is a process in which the mixed raw materials are heated and kneaded by a mechanism such as a screw.

The cooling is a step of performing air cooling while stretching the kneaded raw material with a roller or the like. The pulverization is a step of pulverizing the raw material after cooling with a pulverizer using a roller or the like. Tableting is a process in which the raw material after pulverization is compacted by a mold to form a tablet.

FIG. 39 shows the appearance of the tablet resin.
Diameter from φ9mm to φ60mm, length from 10mm to 40m
m is the size of the commonly used tablet resin.

Next, as a conventional example, JP-A-2-192742 using a powdery or granular resin will be described with reference to FIGS. 40 (a) (b) and 41 (a) (b). .

FIG. 40 shows an embodiment of Japanese Patent Application Laid-Open No. 2-192742. The lead frame 25 on which the semiconductor element 24 is mounted is connected to the upper mold 7a and the lower mold 7 of the resin mold.
FIG. 40 (a) shows a state in which the mold is clamped at b and a powdery or granular resin is injected from the resin input port 43 provided in the resin sealing upper mold 7a. After the powdery or granular resin charged into the resin-sealing mold is sufficiently heated by the resin-sealing mold and reaches the state shown in FIG. 40 (b), JP-A-2-192742 discloses Have been described.

As another embodiment, FIG.
(A) The resin mold shown in FIG. 41 (b) is shown in FIG. 41 in which the resin inlet 43 is enlarged and a plunger 44 for pressing a powdery or granular resin is added. (A) and (b).

The effect of Japanese Patent Application Laid-Open No. 2-192742 is that a resin flow path is used. After resin sealing, there is no residual resin in a runner portion including a cull portion which is discarded as unnecessary material, thereby improving the yield of resin used. It is to make it.

[0025]

The first problem is that the use of the conventional tablet resin results in a waste of the required amount of resin, resulting in a high material cost.

The reason is that there is a limit to the kind of tablet resin that can be supplied by the resin maker, and there is not always a tablet resin suitable for the required amount of resin. In other words, if the required resin amount is 0.5
As for g, if the minimum amount of tablet resin that can be supplied by the resin maker is 1.5 g, 1 g is wasted. This 1 g must be absorbed by increasing the size of the runner and the cull, that is, by expanding the design of the discarded portion.

The second problem is disclosed in Japanese Patent Laid-Open No. 2-192742.
It is very difficult to satisfy the required molding dimensions, and there is a problem of causing poor package appearance.

The reason is that since the powdery or granular resin is directly charged into the cavity which is the resin sealing portion, the accuracy of the amount of the charged resin has a great influence on the package dimensions, particularly the variation in the thickness. For example, with a resin amount accuracy of about ± 0.1 g, a ± 0.5 mm thickness variation occurs for a □ 10 mm and 2.7 mm thick package. Generally, package thickness is ± 0.05
Since the precision of mm is required, the resin amount precision is ± 0.01 g when calculated backward. It is very difficult to control the amount of resin with an accuracy of ± 0.01 g.
This is not possible with a granular resin having a maximum weight of about 0.2 g.

The third problem is also described in Japanese Patent Laid-Open No. 2-192742.
This occurs when a powdery resin is used.
That is a problem that the operation rate of the resin sealing molding device is reduced to cause a failure.

The reason is that a powder resin having a particle diameter of 200 μm or more and less than 500 μm has a high possibility of entering the sliding mechanism of the conveying means and causing a malfunction. Further, the powder having a particle diameter of less than 200 μm is surely introduced into the sliding mechanism of the conveying means to cause a malfunction.

[0031]

A resin sealing molding apparatus for a semiconductor device has a mechanism (1 and 2 in FIG. 1) for measuring the weight of granular resin required for resin sealing.

Further, the granule resin is transported into a pot, which is a resin charging section provided in a resin-sealing mold, by a transport means (2 in FIG. 1).
3 and FIG. 10).

The granular resin to be used is conventionally sieved with a crushed resin containing fine powder produced after crushing in the process of manufacturing a tablet resin, and is □ in mesh size.
A resin that passes through a 3 mm mesh but does not pass through a square of 0.5 mm. At this time, fine powder of less than 500 μm has been removed. Alternatively, a granular resin cut or formed while cooling the resin after the resin kneading, which is a conventional process of manufacturing a tablet resin, is used. (FIG. 23) The resin sealing molding apparatus having a mechanism for measuring the required weight of the granular resin allows the required amount of the granular resin to be used for the production-compatible product without excess or deficiency. It is possible to prevent the use of an excessive amount of resin due to the tablet resin mentioned above as a problem. Further, the resin sealing is performed by transporting and feeding the granular resin into a pot, which is a resin input section provided in the resin sealing mold, using a transport unit, so that the cavity as the resin sealing section is used. , The molten resin flows through a cull or a runner which is a resin flow path.

That is, the variation in the accuracy of the amount of resin charged into the pot of the resin-sealing mold can be absorbed by the cull and the runner. Therefore, it is possible to prevent a package appearance defect, which is a second problem caused by directly charging a resin as a resin sealing portion with a resin and performing resin sealing.

Further, the granular resin used has a high possibility of entering the sliding mechanism of the conveying means of the resin sealing molding apparatus.
The third problem is the operation rate of the resin encapsulation molding apparatus, which does not include powder resin having a particle diameter of 200 μm or more and less than 500 μm, and does not include powder resin having a particle diameter of less than 200 μm which reliably enters the sliding mechanism. Deterioration and breakdown can be prevented.

[0036]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a resin molding apparatus according to the present invention will be described. FIG. 1 is a plan view showing the configuration of the resin sealing molding apparatus of the present invention.

The resin-sealing molding apparatus of the present invention measures the weight of the granular resin, and divides the weight required for resin sealing into the resin case 2.
And a granular resin metering / supplying unit 1 provided with a mechanism for supplying the granular resin. The resin case 2 is provided with pots having a number, a size, and a pitch corresponding to the pots, which are resin input portions of the resin sealing mold to be used.

Further, a lead frame arrangement section 3 for positioning the lead frame is provided on the upper surface of the lower mold of the resin-sealed mold so that the lead frame on which the semiconductor element is mounted can be installed. A press section 6 having a lead frame pusher 5 for sending a lead frame from a lead frame supply tray 4 containing a frame to the lead frame arrangement section 3 and mounting a resin sealing mold for resin sealing of a semiconductor element. And a product storage magazine 9 for storing a product after resin sealing, and a separating unit 8 for separating and removing unnecessary runners after resin sealing. It has a cleaner 41 for removing thin burrs of the resin adhering to the surface of the resin sealing mold, and has a dust collector 42 for collecting the thin burrs. Furthermore, it has a supply hand (not shown) for transporting the lead frame and the granular resin, and a storage hand for transporting the resin-sealed product. The above is the outline of the configuration of the resin sealing molding apparatus of the present invention.

Further, the configuration of the granular resin measuring / supplying unit 1, the resin case 2, and the supply hand 19, which are features of the resin sealing and molding apparatus of the present invention, will be described.

First, the configuration of the granular resin metering / supplying unit 1 will be described with reference to FIG. A feeder 12 for feeding the granular resin to a hopper 11 into which the granular resin is charged and stored by a manual or automatic conveying means, and applying a vibration to the granular resin dropped from the hopper 11 to measure the weight of the granular resin; And an arm 14 that falls into the chute 10 that supplies the required amount of granular resin supplied to the measuring section 13 to the resin case 2.

Next, the configuration of the resin case 2 will be described with reference to FIGS. The resin case 2 is, as shown in FIG.
It has a resin casing 15 which is a charging section of the granular resin supplied from the chute 10 of the granular resin measuring and supplying section 1,
A slide shutter 17 which is a mechanism for pouring the granular resin from the resin case 2 shown in FIG. 4 into a pot of the resin-sealed mold lower mold 7b and a slide claw 16 for moving the slide shutter 17 are provided. FIG. 5 is a side view of the resin case 2 and shows a sliding portion 18 which is a movable portion of the slide claw 16.
Having.

Next, the configuration of the supply hand 19 will be described with reference to FIGS.
1 will be described. FIG. 9 is a front view of the supply hand 19. Grasping lead frames with semiconductor elements
It has a chuck claw 20 for holding. FIG. 11 is a plan view of the supply hand 19. It has a resin case insertion holding portion 21 for grasping and holding the resin case 2.

Next, the operation of the embodiment of the resin sealing molding apparatus of the present invention will be described with reference to FIG. 2A. As described above, the granular resin is charged and stored in the hopper 11 of the granular resin measuring / supplying unit 1 by manual or automatic conveyance means. The granular resin in the hopper 11 is fed by its own weight to the feeder 1
2 fall on.

The feeder 12 supplies the granular resin to the measuring section 13 by vibrating. The measuring section 13 is provided with a strain gauge (not shown). The weight of the granular resin is measured by the measuring unit 13 by a change in the resistance value of the strain gauge according to the weight of the granular resin. After measuring the predetermined required resin amount by the measuring unit 13, the feeder 12 stops operating. Next, as the arm 14 moves downward, the granular resin in the measuring section 13 falls into the chute 10.

The granular resin dropped and passed through the chute 10 is put into the resin casing 15 of the resin case 2 waiting below the outlet of the chute 10. The above operation of the granular resin measuring / supplying unit 1 is sequentially repeated in response to the step operation of the resin case 2 so that the resin can be charged into all the resin casings 15 provided on the resin case 2. The step operation of the resin case 2 is an operation of moving a distance corresponding to a pitch interval of the resin casing 15 and uses a servomotor or the like as a driving source. After the required weight of the granular resin is charged into all the resin case spots 15 of the resin case 2, the resin case 2
9 moves below the waiting position.

The operation of the granular resin metering / supplying unit 1 and the resin case 2 proceed almost simultaneously, and the lead frame arranging unit 3
The operation of supplying the lead frame to is performed. The operation of supplying the lead frame is the same as that of the above-described conventional embodiment. The lead frame is sent out from the lead frame supply tray 4 to the lead frame arrangement section 3 by the lead frame pusher 5.

The lead frame arranging section 3 shown in FIG. 1 can arrange two lead frames. The first sheet is sent out into the lead frame arranging section 3, and after the position is determined, the lead frame arranging section 3 is arranged. Unit 3 performs a reversing operation, and
The second arrangement is performed.

Next, the operation of supplying the lead frame and the granular resin to the resin-molding lower mold 7b will be described. In FIG. 1, a supply hand 19 (not shown) is waiting above the lead frame arrangement unit 3, and as described above,
Has moved below the standby position of the supply hand 19, the supply hand 19 performs the operation of grasping and holding the resin case 2.

When the supply hand 19 moves downward, or the resin case 2 is attached to the resin case insertion holding portion 21 of the supply hand 19 by a raising mechanism of the resin case 2 (not shown). The state shown in FIG. 14 is obtained. 10a is a front view, FIG. 11 is a plan view,
FIG. 14 is a side view. The resin case 2 is grasped and held by the supply hand 19 by a chucking mechanism or the like (not shown).

The supply hand 19 grasps the resin case 2
After the holding, the operation of grasping and holding the lead frames arranged in the lead frame arrangement unit 3 is performed. FIG. 15 shows that the supply hand 19 grasps the resin case 2 and the lead frame 25.
It is in the state of being held. The grasping and holding of the supply hand 19 with respect to the lead frame 25 is performed by the opening and closing operation of the chuck claw 20 attached to the supply hand 19.

After the supply hand 19 grasps and holds the lead frame 25 and the resin case 2, it moves onto the resin-molded lower mold 7b.

The supply method of the lead frame 25 by the supply hand 19 to the resin-molded lower mold 7b is the same as that of the prior art, and the description thereof will be omitted.

The supply of the granular resin is performed by a mechanism such as an air cylinder (not shown) provided in the supply hand 19.
This is performed by operating a slide claw 16 provided in the resin case 2. FIG. 5 is a side view of the resin case 2 as described above. When the granular resin is dropped from the resin case spot 15 of the resin case 2, the slide claw 16 is operated as shown in FIG. FIG. 7 shows a sectional view of the resin case 2 corresponding to FIG. Similarly, FIG. 8 is a sectional view corresponding to FIG.

FIGS. 16 and 17 show how the granular resin is charged from the resin case 2 into the resin mold pot 22.
After the supply of the lead frame 25 and the granular resin to the resin-molded lower mold 7b, the supply hand 19 returns to the position above the lead frame arrangement section 3 and returns the resin case 2 to its original position. The resin case 2 returns to the position below the chute 10 again and repeats, and receives the supply of the granular resin from the granular resin measuring and supplying unit 1.

Next, the resin sealing operation will be described. FIG. 18 shows a state where the supply operation of the supply hand 19 to the lead frame 25 and the resin-sealed mold lower mold 7b of the granular resin is completed.

After the state shown in FIG. 18, the upper mold 7a and the lower mold 7b of the resin-sealing mold are clamped, and after a predetermined time, the granular resin 23 in the resin-sealing mold pot 22 is removed. Is
The resin sealing mold is brought into a molten state by heat. Thereafter, the molten resin flows by the raising / pressing operation of the plunger 29, flows through the cull 27 and the runner 28, and
6a and into the lower cavity 26b. Molten resin,
FIG. 19 shows a state where the inflow into the upper cavity 26a and the lower cavity 26b is completed.

After the state shown in FIG. 19 is maintained until the molten resin is sufficiently cured, the upper mold 7a and the lower mold 7b of the resin-sealing mold are opened, and are respectively provided on the upper mold 7a and the lower mold 7b (not shown). The package as a product after resin sealing is released from the upper mold 7a and the lower mold 7b by the ejector pins. After release, the storage hand for taking out the product (not shown)
It is sent to the separation unit 8, where the unnecessary cull and runner are separated and removed, and stored in the storage magazine 9. The operations of the cleaner 41 and the dust collector 42 are the same as those in the related art, and a description thereof will be omitted.

The above is the description of the operation of the resin encapsulation / molding apparatus of the present invention.

Next, an embodiment of the resin molding apparatus of the present invention will be described. First, the granular resin measuring / supplying unit 1 will be described. As described above, the configuration of the granular resin measuring / supplying unit 1 includes the hopper 11, the feeder 12, the measuring unit 13, the arm 14, and the chute 10 shown in FIG.

Since the inner surface of the hopper 11 is in contact with the granular resin, a smooth mirror surface is desired.
As for the material, stainless steel is most desirable in consideration of wear resistance and ease of processing. It is desirable that the chute 10 also has the same surface condition and material as the hopper 11 described above. Also shoot 1
At 0, if the angle with respect to the horizontal direction is θ with respect to the portion forming the inclined surface, θ is preferably 40 ° or more. The grounds will be described.

A plate having the same material and surface condition as the chute 10 is placed horizontally, and □ with mesh size is placed on the plate.
10 g of the finely powdered granular resin that has passed through the 3 mm mesh but not through the □ 0.5 mm mesh is placed on the plate, and the plate is tilted at about 2 ° per second. An experiment was conducted on the falling weight of the granular resin depending on the angle of the plate.

The number of trials was 10, and the average data is shown in FIG. 2B. The horizontal axis represents the angle of the plate, and the vertical axis represents the total weight of the falling resin. The drop starts at an angle of 35 °, 38 °
All the granular resin falls between about 40 °. 40 °
As described above, the state is such that the granular resin does not always remain on the plate. The experimental conditions were room temperature 26 ° C, indoor humidity 60%, plate temperature 2
5 ° C.

The granular resin measured in the required amount by the measuring section 13 is dropped into the chute 10 by the lowering operation of the arm 14, so that the granular resin has already fallen on the inclined surface of the chute 10. Contact.
That is, it is possible to drop sufficiently at an angle smaller than 40 ° obtained in the experiment, but if the inclination angle of the chute 10 is set to 40 ° or more, the granular resin can be surely dropped.

Further, depending on the design of the apparatus, the shape of the hopper 11 or the chute 10 is restricted, or depending on the granular shape and the water absorption of the granular resin and the environmental conditions, the granular resin may be in the hopper 11 or the chute 10. There is also a concern that it will be clogged.
In such a case, it is desirable to add a mechanism for applying vibration or a mechanism for knocking to the hopper 11 or the chute 10.

Next, an embodiment of the resin case 2 will be described. As shown in FIG. 3, the resin case 2 is provided with a resin case spot 15.

The inner surface of the resin casing 15 preferably has a mirror surface. When the diameter of the resin casing 15 is 13 mm or more, the granular resin can fall without clogging. However, when the diameter is 11 mm or more and less than 13 mm, the frequency of occurrence of clogging increases,
If it is less than 1 mm, it will not be jammed and fall.

Therefore, the diameter of the resin casing 15 is φ13
If it is less than mm, a mechanism for forcibly dropping the granular resin in the resin casing 15 is essential. of course,
In the case of a diameter of 13 mm or more, a mechanism for extruding the granular resin may be additionally provided. The mechanism for extruding the granular resin is preferably an air cylinder or the like, and is desirably attached to the upper part of the supply hand 19.

An air cylinder 46 is added and the resin case 2
FIG. 10 is a front sectional view of the supply hand 19 in a state where
b.

The above is an embodiment of each configuration of the granular resin measuring / supplying unit 1, the resin case 2, and the supply hand 19, which are the features of the resin sealing and molding apparatus of the present invention.

Next, an embodiment of the granular resin according to the present invention will be described with reference to FIGS. 20 and 22. FIG. 20 shows a production flow of the granular resin. FIG. 22 shows the shape of the granular resin.

As shown in FIG. 20, the granular resin
The fine resin is removed by sieving the resin containing the fine powder after the pulverization, which is an intermediate step in the tablet resin production flow shown in FIG. The shape is □ 3m as shown in FIG.
It passes through m meshes and does not pass through a 0.5 mm mesh, and is non-uniform.

Next, a second embodiment of the granular resin will be described. As shown in FIG. 21, the production flow is obtained by eliminating the pulverizing step which is further shortened from the production flow of the granular resin of the first embodiment.

By setting the diameter of the discharge port of a kneader having a screw in the cylinder, the diameter of the granular resin can be set. Further, the length of the granular resin can be set by cutting the kneaded resin coming out of the discharge port of the kneader into a set length. That is, unlike the granular resin of the first embodiment, a uniform cylindrical shape can be obtained. The shape is shown in FIG. The size of this granular resin is diameter φ
A diameter of 2 to 3 mm and a length of 2 to 3 mm are desirable. Compared with the granular resin of the first embodiment, the uniform shape has the advantage of stabilizing the measurement accuracy and the advantage of cost reduction by shortening the manufacturing flow. Also, since there is no pulverizing step, there is no generation of fine powder.

The embodiments and examples of the granular resin according to the present invention have been described above.

[0075]

The first effect is that material waste is not generated with respect to the amount of resin required for resin sealing, so that material costs can be reduced.

[0076] The reason is that the granular resin obtained by removing fine powder of less than 500 µm from the resin produced after the pulverization in the conventional tablet resin manufacturing process or the kneaded resin in the conventional tablet resin manufacturing process is cut while cooling. Alternatively, a resin sealing molding device having a mechanism for measuring a required weight of the generated granular resin is used.

The second effect is that, in the case of using a granular resin, it is possible to prevent a deficiency in the dimensional accuracy of the product package after resin sealing.

The reason is that the resin flow path provided in the resin-sealing mold is provided by using a resin-sealing molding apparatus having a means for transporting the granular resin to a pot, which is a resin charging portion of the resin-sealing mold. This is because resin sealing is performed through the cull portion and the runner portion, and the accuracy of the supply amount of the granular resin can be absorbed by the cull portion.

The third effect is that, as described in the first effect, since the granular resin used does not contain fine powder having a particle size of less than 500 μm, the fine powder enters the sliding mechanism of the conveying means of the resin sealing and molding apparatus. And the resin sealing molding apparatus can be operated stably.

[Brief description of the drawings]

FIG. 1 is a plan view of a resin sealing molding apparatus according to the present invention.

FIG. 2 is a configuration diagram of a granular resin measuring / supplying unit, and a graph showing a relationship between a plate angle and a total weight of falling resin.

FIG. 3 is a plan view of a resin case.

FIG. 4 is a front view of a resin case.

FIG. 5 is a side view of the resin case (slide shutter closed).

FIG. 6 is a side view of the resin case (slide shutter opened).

FIG. 7 is a sectional view of the resin case (slide shutter closed).

FIG. 8 is a sectional view of the resin case (slide shutter opened).

FIG. 9 is a front view of a supply hand.

FIG. 10 is a front view of a supply hand (resin case holding state) and a cross-sectional front view of the supply hand (resin case holding and air cylinder added).

FIG. 11 is a plan view of a supply hand.

FIG. 12 is a plan view of a supply hand (with a resin case held).

FIG. 13 is a side view of the supply hand.

FIG. 14 is a side view of the supply hand (with the resin case held).

FIG. 15 is a front view of a supply hand chucking a lead frame.

FIG. 16 is a sectional view showing a state of the granular resin in the resin case before the granular resin is put into the resin sealing mold.

FIG. 17 is a cross-sectional view showing a state in which the granular resin is charged into the resin sealing mold.

FIG. 18 is a cross-sectional view illustrating a state of a resin sealing mold before resin sealing.

FIG. 19 is a sectional view showing a state of a resin-sealing mold after resin-sealing.

FIG. 20 is a production flow chart of a granular resin for removing fine powder by sieving after pulverization.

FIG. 21 is a production flowchart of a granular resin obtained by cutting during cooling.

FIG. 22 is a plan view showing the shape of the granular resin obtained in FIG.

FIG. 23 is a plan view showing the shape of the granular resin obtained in FIG. 21.

FIG. 24 is a plan view of a conventional resin molding apparatus.

FIG. 25 is a plan view of a tablet feeder unit and a tablet loader according to the related art.

26 is a side view of FIG. 25.

FIG. 27 is a plan view of a prior art tablet loader.

FIG. 28 is a front sectional view of FIG. 27;

FIG. 29 is a front view of a conventional supply hand.

FIG. 30 is a side view of FIG. 29;

FIG. 31 is a front cross-sectional view before supplying a tablet resin from a tablet loader to a supply hand according to the related art.

FIG. 32 is a front sectional view showing a state in which tablet resin is being supplied from a tablet loader to a conventional supply hand.

FIG. 33 is a front sectional view showing a state in which the supply hand of the related art holds the lead frame and the tablet resin.

FIG. 34 is a plan view of a resin-molded lower mold.

35 is a cross-sectional view showing a state where the lead frame is mounted on the lower mold of the resin-sealed mold in the cross section AA in FIG. 34;

FIG. 36 is a cross-sectional view illustrating a state of a resin sealing mold before resin sealing when using a tablet resin in a conventional technique.

FIG. 37 is a cross-sectional view illustrating a state of a resin-sealed mold after resin-sealing.

FIG. 38 is a flowchart showing a manufacturing process of a tablet resin.

FIG. 39 is a perspective view showing the shape of a tablet resin.

FIG. 40 is a cross-sectional view showing a state in which powder resin according to the related art is charged into a cavity of a resin sealing mold, and a cross-sectional view showing a state in which powder resin is molded from the state of FIG.

FIG. 41 is a cross-sectional view showing a state before a powder resin according to the prior art is charged into a cavity of a resin sealing mold and before being pressed by a plunger, and is formed by being pressed by a plunger from the state of FIG. Sectional view

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 granule resin measuring / supplying unit 2 resin case 10 chute 11 hopper 12 feeder 13 measuring unit 14 arm 16 slide claw 17 slide shutter 19 supply hand 31 tablet feeder 32 tablet loader 46 air cylinder

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ identification symbol FI // B29L 31:34 (58) Investigated field (Int.Cl. ⁶ , DB name) H01L 21/56 H01L 23/28-23 / 30 B29C 45/02 B29C 45/14 B29C 45/76 B29C 45/26

Claims (5)

(57) [Claims] 1. A resin sealing molding device for a semiconductor device, which melts and flows a granular resin and seals it with a resin sealing mold as an apparatus for sealing a semiconductor element with a resin, requires a granular resin for resin sealing. A resin sealing molding device for a semiconductor device, comprising a mechanism for measuring and supplying a weight. 2. A resin encapsulation and molding apparatus for a semiconductor device which melts and flows a granular resin and seals it with a resin encapsulating mold as an apparatus for encapsulating a semiconductor element with a resin. A resin-sealing molding apparatus for a semiconductor device, wherein a resin is conveyed and injected into a cylindrical pot, which is a charging portion of a resin provided in a resin-sealing mold, using a conveying means. 3. The resin sealing method for a semiconductor device according to claim 1 or 2, wherein the granular resin is melted and flown and sealed with a resin sealing mold. A resin sealing method for a semiconductor device, comprising using a sealing molding device. 4. A resin sealing method for a semiconductor device in which a granular resin is melted and flown and sealed with a resin sealing mold as a resin sealing method for a semiconductor element. 5m
a granular resin having a size not passing through an m-mesh,
4. The resin sealing method for a semiconductor device according to claim 3, wherein a granular resin from which fine powder of less than 00 μm is removed is used. 5. A resin sealing method for a semiconductor device in which a granular resin is melted and flown and sealed with a resin sealing mold as a resin sealing method for a semiconductor element. 5. The resin sealing method for a semiconductor device according to claim 3, wherein the resin after the resin kneading process is cut or produced while cooling the resin, and the granular resin according to claim 4 is used.