JPH07263473A - Semiconductor molding machine - Google Patents

Abstract

PURPOSE:To provide technique which can prevent occurrence of a void, a wire flow at the time of molding a semiconductor. CONSTITUTION:A semiconductor molding machine has molds 15 for molding a semiconductor, conveying means 14, 16 for conveying the semiconductor before and after molding, and resin storing means 12 for storing resin to be molded, and comprises means 11 for regulating a temperature of the resin in the means 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique effectively applied to a semiconductor molding device.

[0002]

2. Description of the Related Art In general, a semiconductor molding apparatus includes a mold for molding a semiconductor, a loader section for conveying the semiconductor device to the mold, a resin storage section for storing resin to be molded, and a semiconductor device after molding. And a cleaning unit for cleaning the mold. The mold has a high temperature, and a heat insulating material is provided around the mold so as not to transfer heat to other parts.

However, in the conventional semiconductor molding apparatus, although the heat insulating material is provided around the mold, the resin storing section actually receives heat from the mold and the resin being stored is stored for about 24 hours. It hardens and becomes unusable.

For this reason, the resin cannot be stored for a long time, and the time is controlled such that the resin is used up within the time until the resin becomes unusable (12 to 24 hours after the resin is charged).

[0005]

DISCLOSURE OF THE INVENTION The present inventors have found the following problems as a result of examining the above prior art.

In the conventional semiconductor molding apparatus, the temperature of the resin storage section becomes about 30 to 35 ° C. due to the heat from the mold, and the resin during storage becomes unusable for about 24 hours. Molding was carried out within 12 to 24 hours after the injection, but during the molding time of 12 to 24 hours, the fluidity of the resin decreased due to the heat from the mold. There is a problem that voids, wire flow, etc. occur.

An object of the present invention is to provide a technique capable of preventing the occurrence of voids and wire flow during semiconductor molding. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

In a semiconductor molding apparatus provided with a mold for molding a semiconductor, a carrying means for carrying the semiconductor before and after the molding, and a resin storing means for storing the resin to be molded, the resin in the resin storing means is stored. The apparatus body is provided with a means for adjusting the temperature.

[0010]

According to the above-mentioned means, in the semiconductor molding apparatus provided with the mold for molding the semiconductor, the carrying means for carrying the semiconductor before and after the molding, and the resin storing means for storing the resin to be molded, By providing the apparatus main body with means for adjusting the temperature of the resin in the resin storage means, the temperature of the resin can be adjusted so as to suppress the deterioration (curing, deterioration of fluidity) of the resin due to heat from the mold. Therefore, it is possible to prevent the occurrence of voids and wire flow during semiconductor molding.

The structure of the present invention will be described below together with embodiments.

In all the drawings for explaining the embodiments, those having the same function are designated by the same reference numerals and their repeated description will be omitted.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is for explaining the structure of a semiconductor mold device which is an embodiment of the present invention.

FIG. 1A shows the outer shape of the semiconductor mold device of this embodiment, and FIG. 1B shows the outer shape thereof.
The structure of each part in the semiconductor mold device of (a) is shown, and it is shown from the top of the semiconductor mold device in order to clarify the arrangement structure.

In FIG. 1, 10 is a semiconductor mold device, 11 is an electronic cooler, 12 is a resin storage unit, 13 is a cleaner unit, 14 is a loader unit, 15 is a mold, and 16 is an unloader unit. Yes, electronic cooler 1
1, the resin storage unit 12 and the cleaner unit 13 are shown in FIG.
(A) loader unit 14, mold 15, unloader unit 1
It is provided in a hidden position behind the 6.

As shown in FIG. 1, the semiconductor molding apparatus of this embodiment includes a mold 15 for molding a semiconductor, a loader section 14 for carrying the semiconductor to the mold 15, and an unloader for carrying the semiconductor after molding. A portion 16, a cleaner portion 13 for cleaning the mold 15, a resin storage portion 12 for storing a resin (resin) for molding a semiconductor,
It is composed of an electronic cooler 11 for adjusting the resin in the resin storage section to a predetermined temperature.

The mold 15 is kept at 170 to 180 ° C., and a heat insulating material is provided around it to prevent heat from being transmitted to other parts as much as possible.

Next, the electronic cooler 11 used in this embodiment will be described.

FIG. 2 illustrates the structure of the electronic cooler 11 of this embodiment.

In FIG. 2, 21 is a cooling fin, 22 is an intake fin, 23 is a cooling side case, 24 is an electronic cooling element, 25 is a heat radiating side case, 26 is a filter, 27 is a heat radiating fan, 28 is dehumidified water, and 29. Indicates a radiation fin, respectively.

In the electronic cooler 11 shown in FIG. 2, when an electric current is applied to one in which two different kinds of metals or semiconductors are connected, in addition to Joule heat due to collision between electrons (or holes) and lattice vibration, It is a spot air conditioner that utilizes the Peltier effect of generating and absorbing heat.
The resin in the resin storage unit 12 is cooled and maintained at a predetermined temperature by the electronic cooling element 24 which is formed by alternately connecting mold semiconductors.

On the cooling side of the electronic cooling element 24, the intake fan 22 for sucking the hot and humid air in the semiconductor mold device of this embodiment, and the cooling in which the air in the sucked hot and humid air passes are cooled. The fins 21 and the cooling side case are provided, and the heat radiation side is the heat radiation fins 29 on the heat generation side of the electronic cooling element, the heat radiation fan 27 for radiating the heat radiation fins 29, and dust in the air (outside air). It is composed of a filter 26 for collecting dust and a heat radiation side case 25.

The temperature adjustment of the resin in the resin storage unit 12 is not limited to the electronic cooler 11 of this embodiment, and the installation location is not limited to the housing of the semiconductor mold device.
It does not matter if it is outside the housing.

In the operation, when a direct current is passed through the electronic cooling element 24, as described above, a heat absorbing effect appears on the cooling fin 21 side of the electronic cooling element and a heat generating effect appears on the heat radiating fin 29.

On the heat absorbing side of the electronic cooling element, the hot and humid air in the semiconductor mold device 10 sucked by the intake fan 22 is cooled by the cooling fins 21 and sent back, and the dew point in the cooled air is also taken. The water in the state is removed, and the water (dehumidified water 28) is sent to the heat generating side.

On the other hand, on the heat generating side of the electronic cooling element,
The dehumidified water 28 is evaporated by utilizing the heat generated by the heat dissipation fins 29 by the electronic cooling element, and is sent out of the semiconductor mold device 10 by the heat dissipation fan 27.

As described above, the electronic cooler 11 described above cools the resin storage unit 12 so that the resin temperature does not condense around 20 ° C. The temperature adjustment at this time is performed by the electronic cooling element 24.
It is performed by the electric current that flows in.

The above-mentioned resin temperature is obtained as a result (not shown) of the resin deterioration speed due to the difference in the temperature of the resin storage section, and is obtained, and the electronic cooler 11 of this embodiment is used. Compared with the case where the resin is not installed (the temperature of the resin storage is 30 ° C), the deterioration speed of the physical properties of the resin is
It has been found that it becomes 5 to 1/6 or less.

The resin temperature is not limited to about 20.degree. C., but the environment in which the semiconductor molding apparatus 10 is used (atmospheric pressure, temperature, humidity, etc.) and the type of resin (containing catalyst, its It is adjusted according to the quantity).

Finally, FIG. 3 shows the relationship between the resin leaving time and the fluidity (minimum melt viscosity number η) in the semiconductor mold device 10 used in this example.

In FIG. 3, the horizontal axis represents the resin standing time, the vertical axis represents the minimum melt viscosity number, and Δ represents the time when the electronic cooler 10 is not installed and □.
Indicates a value when the electronic cooler 10 is installed.

As shown in FIG. 3, the resin when the electronic cooler 10 is not installed exceeds the allowable range (indicated by the broken line) that can be actually used after 24 hours, but the electronic cooler of this embodiment is used. It can be seen that the resin at the time of 10 installation is within the allowable range up to about 100 hours.

Therefore, in a semiconductor molding apparatus provided with a die for molding a semiconductor, a transport means for transporting the semiconductor before and after the molding, and a resin storage means for storing the resin to be molded, the inside of the resin storage means is provided. By providing the device body with a means to adjust the temperature of the resin, the resin temperature can be adjusted so as to suppress the deterioration of the resin due to the heat from the mold, preventing the occurrence of voids and wire flow during semiconductor molding. It becomes possible to do.

Further, since the resin temperature can be adjusted, a large amount of resin can be stored in the housing, which improves the throughput, and in the conventional semiconductor mold device provided to suppress the heat conduction of the mold as much as possible. The space (including partitions) can be reduced, and the device can be downsized.

In this embodiment, the semiconductor mold is taken as an example, but the present invention is also effective for an apparatus for making a mold using a mold or the like.

As described above, the inventions made by the present inventor are
Although the specific description has been given based on the above-described embodiments, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.

[0037]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

Since the temperature of the resin can be adjusted so as to suppress the deterioration of the resin due to the heat from the mold, it is possible to prevent the occurrence of voids and wire flow during semiconductor molding.

Further, since the resin temperature can be adjusted, a large amount of resin can be stored in the housing, which improves the throughput, and in the conventional semiconductor mold device provided to suppress the heat conduction of the mold as much as possible. The space (including partitions) can be reduced, and the device can be downsized.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a configuration of a semiconductor mold device that is an embodiment of the present invention.

FIG. 2 is a diagram for explaining the configuration of the electronic cooler of the present embodiment.

FIG. 3 is a diagram showing a relationship between resin leaving time and fluidity (minimum melt viscosity number η) in the semiconductor mold device used in this example.

[Explanation of Codes] 10 ... Semiconductor mold device, 11 ... Electronic cooler, 12 ...
Resin storage section, 13 ... Cleaner section, 14 ... Loader section,
15 ... Mold, 16 ... Unloader section, 21 ... Cooling fin,
22 ... Intake fins, 23 ... Cooling side case, 24 ... Electronic cooling element, 25 ... Radiating side case, 26 ... Filter, 27 ...
Radiating fan, 28 ... Dehumidifying water, 29 ... Radiating fin.

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display area // B29L 31:34

Claims (1)

[Claims] 1. A semiconductor molding apparatus comprising: a mold for molding a semiconductor; a carrying means for carrying a semiconductor before and after molding; and a resin storing means for storing a resin to be molded. A semiconductor mold device, characterized in that a device body is provided with means for adjusting a temperature of a resin.