JP5648501B2 - Manufacturing method of resin molding - Google Patents

Description

  The present invention relates to a method for producing a resin molded article in which a resin layer including a plurality of concave portions or convex portions arranged in a matrix on a substrate is formed.

  Conventionally, in the field of manufacturing optical lenses, an optical lens having high heat resistance can be obtained by forming a lens portion made of a curable resin (such as a thermosetting resin or a photocurable resin) on a glass substrate. There are technologies that can be used.

  As a method for manufacturing an optical lens to which this technology is applied, a so-called “wafer lens” in which a plurality of resin lens portions are provided on a glass substrate or a plurality of lens portions are formed integrally with a resin. There is a method of obtaining a plurality of optical lenses by cutting a glass substrate for each lens part after the manufacturing process.

  As a method for manufacturing a wafer lens, for example, there are the following methods.

  First, a resin material is interposed between a master mold made of metal or the like and the resin is cured to form a resin replica on the substrate. By repeating this process, a plurality of replicas are formed. An intermediate mold made of resin is prepared. Next, a resin transfer mold is prepared by applying and curing a resin material to the intermediate mold. Then, after filling the transfer mold with a resin material and pressing the glass substrate, the resin material is cured to form a plurality of resin lens portions on the glass substrate. Further, by separating the lens part and the glass substrate from the transfer mold, one wafer lens having a plurality of lens parts formed on the glass substrate is manufactured.

JP 2010-103212 A

  Here, as a method of applying the resin material to the mold, there is a technique using a dispensing apparatus that quantitatively discharges the resin material to the mold.

  However, when using a dispensing apparatus, the resin material may not spread in a desired shape when the mold and the substrate are pressed, depending on the discharge position and discharge amount of the resin material, and the shape of the mold.

  For example, as shown in FIG. 20A, when only one point of the resin material A is arranged at the center of the mold F with respect to the mold F having the square surface f, when a substrate (not shown) is pressed there, FIG. 20C (the arrow in FIG. 20B indicates the spreading direction of the resin material A). Therefore, the molded product A ′ obtained by curing the resin material A may protrude from the mold F as shown in FIG. 20D.

  Further, as shown in FIG. 21A, with respect to the mold F having a square surface f, the resin material A is placed at one position at the center of the mold F, and a perpendicular line connecting the center of the mold F and each side (dotted line in FIG. When a plurality of parts are arranged on the upper side, they are spread as shown in FIGS. 21B to 21C (the arrows in FIG. 21B indicate the spreading direction of the resin material A). Accordingly, the molded product A ′ obtained by curing the resin material A is protruded from the mold F as shown in FIG. 21D (A ″ in FIG. 21D) or bubbles (A ″ ″ in FIG. 21D) are generated. There is a fear.

  As the master mold, the one having only one lens portion is used in the above-mentioned Patent Document 1, but in order to form more lens portions in a short time, a plurality of lens portions are formed in a matrix. It is also conceivable to produce an intermediate mold by repeatedly performing molding using a master mold. When using a master mold in which such a plurality of lens portions are formed in a matrix, the amount of the resin material to be disposed on the master mold also increases, and there are more problems of protrusion of the resin material and generation of bubbles as described above. Become prominent. Thus, there is a problem that a desired resin molded product cannot be obtained in a state where the resin material protrudes from the mold or bubbles are generated.

  Therefore, in order to solve the above problems, an object of the present invention is to provide a method for producing a resin molded product capable of preventing the protrusion of a resin material and the generation of bubbles.

In order to solve the above-mentioned problems, the invention described in claim 1 is a method for producing a resin molded article in which a resin layer including a plurality of concave portions or convex portions arranged in a matrix on a substrate is formed. In the first arrangement step, the surface and the surface of the mold are overlapped with the center of the surface of the mold having a rectangular surface including a plurality of protrusions or recesses arranged in a matrix corresponding to the recesses or protrusions of the resin molding. A resin material having fluidity is disposed in droplets on at least one of the substrates opposed to each other. In the second arrangement step, the resin material is arranged in droplets on at least one of the surface and the substrate facing the surface so as to overlap with a plurality of points symmetrical with respect to the center of the surface on the diagonal of the surface. . In the pressing step, the mold and the substrate in which the resin material is arranged in at least one of the first and second arrangement steps are relatively pressed with the resin material interposed therebetween. In the curing step, the resin material is cured into a cured resin in a state where the mold and the substrate are relatively pressed. In the mold release step, the cured resin is released from the mold.
In order to solve the above-mentioned problem, the invention according to claim 2 is the method for producing a resin molded product according to claim 1, wherein the drop-shaped resin is arranged in the first arrangement step and the second arrangement step. The pitch between the materials is substantially constant.
In order to solve the above-mentioned problem, the invention according to claim 3 is the method for producing a resin molded product according to claim 1 or 2, and is arranged at one place in the first placement step and the second placement step. The amount of the drop-shaped resin material is substantially constant.
In order to solve the above-mentioned problem, the invention according to claim 4 is the method for producing a resin molded product according to claim 1 or 2, wherein the amount of the drop-shaped resin material arranged in the first arrangement step. And the amount of the drop-shaped resin material arranged at each location in the second arrangement step is different.
In order to solve the above problem, the invention according to claim 5 is the method for producing a resin molded product according to claim 4, wherein the amount of the drop-shaped resin material arranged in the first arrangement step is: It is 1-6 times the quantity of the drop-shaped resin material arrange | positioned at each location at a 2nd arrangement | positioning step.
Moreover, in order to solve the said subject, invention of Claim 6 is a manufacturing method of the resin molding in any one of Claim 1 to 5, Comprising: It arrange | positions at a 1st arrangement | positioning step and a 2nd arrangement | positioning step. The total amount of resin material to be applied is substantially equal to the volume of the gap between the mold and the substrate formed in the pressing step.
Moreover, in order to solve the said subject, invention of Claim 7 is a manufacturing method of the resin molding in any one of Claim 1 to 6, Comprising: In a 1st arrangement | positioning step and a said 2nd arrangement | positioning step The plurality of droplet-shaped resin materials arranged on at least one of the surface and the substrate is a surface when viewed from a direction perpendicular to the substrate when the surface is opposed to the pressing position on the substrate in the pressing step. The distances between the droplet-shaped resin material at the position overlapping the center of the liquid droplets and the plurality of other droplet-shaped resin materials are substantially equal.
Moreover, in order to solve the said subject, invention of Claim 8 is a manufacturing method of the resin molding in any one of Claim 1-7, Comprising: 1st arrangement | positioning step and / or 2nd arrangement | positioning step The point at which at least one pair of two adjacent resins among the droplet-shaped resin materials arranged at the first crossing by pressing by the pressing step is on the axis perpendicular to the surface passing through the apex of the concave portion or convex portion. And in a different position.
Moreover, in order to solve the said subject, invention of Claim 9 is a manufacturing method of the resin molding in any one of Claim 1-7, Comprising: The recessed part or convex part of a surface is provided in a board | substrate. A counterbore is provided in the surrounding position.
Moreover, in order to solve the said subject, invention of Claim 10 is a manufacturing method of the resin molding in any one of Claim 1-9, Comprising: A 2nd arrangement | positioning step is performed after a 1st arrangement | positioning step. .
In order to solve the above-mentioned problem, the invention according to claim 11 is the method for producing a resin molded product according to claim 1, wherein the resin molded product is a plurality of resin lenses arranged in a matrix. 1 is a wafer lens mold for molding a wafer lens including a portion.

  According to the present invention, a resin material is applied to at least one of a mold having a surface and a substrate opposed to the mold so as to overlap with the center of the surface and on a diagonal line of the surface. Place it in a place. Thereby, even if it presses a type | mold and a board | substrate relatively via a resin material, possibility that a resin material will protrude from a type | mold or a bubble will be made low. Therefore, it is possible to obtain a resin molded product having the desired shape.

It is a figure which shows an example of the wafer lens manufactured by the manufacturing method which concerns on embodiment. It is a perspective view which shows the master type | mold which concerns on embodiment. It is a side view which shows the intermediate mold | type which concerns on embodiment. It is a figure which shows typically the mode of manufacture of the intermediate mold | type which concerns on embodiment. It is a side view which shows the transfer type | mold which concerns on embodiment. It is a flowchart which shows the process of shape | molding an intermediate mold from the master type | mold which concerns on embodiment. It is drawing supplementing description of the flowchart of FIG. It is drawing supplementing description of the flowchart of FIG. It is drawing supplementing description of the flowchart of FIG. It is drawing supplementing description of the flowchart of FIG. It is drawing supplementing description of the flowchart of FIG. It is a flowchart which shows the process of shape | molding a transfer type | mold from the intermediate type | mold which concerns on embodiment. It is drawing which supplements description of the flowchart of FIG. It is a flowchart which shows the process of shape | molding a wafer lens from the transfer type | mold which concerns on embodiment. It is drawing which supplements description of the flowchart of FIG. It is a flowchart which shows the arrangement | positioning process of the resin material which concerns on this embodiment. It is drawing supplementing description of the flowchart of FIG. It is drawing supplementing description of the flowchart of FIG. It is drawing supplementing description of the flowchart of FIG. It is drawing supplementing description of the flowchart of FIG. It is drawing supplementing description of the flowchart of FIG. It is drawing supplementing description of the flowchart of FIG. It is a figure which shows an example of the arrangement | positioning method of the resin material in the modification 1. It is a figure which shows an example of the arrangement | positioning method of the resin material in the modification 2. It is a figure which shows an example of the arrangement | positioning method of the resin material in the modification 2. It is a figure which shows an example of the board | substrate and type | mold in the modification 3. It is a figure which shows an example of the board | substrate and type | mold in the modification 3. It is a figure which shows an example of the board | substrate and type | mold in the modification 3. It is a figure which shows an example of the conventional resin molding. It is a figure which shows an example of the conventional resin molding. It is a figure which shows an example of the conventional resin molding. It is a figure which shows an example of the conventional resin molding. It is a figure which shows an example of the conventional resin molding. It is a figure which shows an example of the conventional resin molding. It is a figure which shows an example of the conventional resin molding. It is a figure which shows an example of the conventional resin molding.

<Embodiment>
A method for producing a wafer lens mold according to this embodiment as an embodiment of a method for producing a resin molded product of the present invention will be described with reference to FIGS. The wafer lens mold is an example of a “resin molded product”.

<Configuration of Wafer Lens 1>
First, the configuration of a wafer lens 1 produced using a wafer lens mold produced by the production method according to the present embodiment will be described with reference to FIG.

  The wafer lens 1 has a circular translucent substrate 2 and a plurality of lens portions 3. The plurality of lens portions 3 are arranged in a matrix on the front surface and the back surface of the substrate 2 so that the optical axes coincide with each other on the front surface side and the back surface side. By dicing the substrate 2 for each lens unit 3, a plurality of individual wafer lenses can be obtained.

  The substrate 2 may be made of a light-transmitting material, and glass is preferably used. The substrate 2 is not limited to a circular shape but may be a square shape.

  The lens unit 3 is made of resin 3A. As this resin 3A, a curable resin can be used. As the curable resin, a photocurable resin or a thermosetting resin is used. These curable resins generally include a polymerizable composition such as a polymerizable monomer and a polymerization initiator, and a resin material having fluidity in an uncured state by light irradiation or heating. It is obtained by polymerizing and curing.

  A fine structure such as a diffraction groove or a step may be provided on the surface of the optical surface of the lens unit 3. The lens unit 3 may be formed only on one surface of the substrate 2.

<Configuration of wafer lens mold>
The configuration of the wafer lens molding die used in the present embodiment will be described with reference to FIGS.

  In manufacturing the wafer lens 1, in the present embodiment, as a mold for molding a wafer lens, a master mold 10, a sub master mold 20 (hereinafter sometimes referred to as “intermediate mold 20”), and a sub sub master mold 30 (hereinafter referred to as “transfer”). Mold 30 ”). The master mold 10, the intermediate mold 20, and the transfer mold 30 may be collectively referred to as “mold (wafer lens molding mold)”.

<Configuration of master mold 10>
As shown in FIG. 2, the master mold 10 in the present embodiment has a rectangular parallelepiped base portion 11. The base part 11 has a square surface 12. A plurality of recesses 13 are formed on the surface 12 in a matrix. The concave portion 13 is a portion corresponding to a convex portion 23 (described later) of the intermediate mold 20 and is recessed from the surface 12 in a substantially hemispherical shape. The concave portion 13 has a shape corresponding to the lens shape finally obtained, and is precisely processed using a known processing apparatus.

  The surface 12 may be a rectangle and is not limited to a square. Moreover, the surface 12 in which the recessed part 13 is arrange | positioned should just be a rectangle, and the base part 11 may be cylindrical. The material of the master mold 10 (base part 11) is metal, ceramic, glass, resin, or the like. In particular, it is preferable to use a metal master mold from the viewpoint of workability and accuracy.

<Configuration of intermediate mold 20>
As shown in FIG. 3, the intermediate mold 20 in the present embodiment has a molding part 21 and a substrate 24. A plurality of convex portions 23 are formed on the surface 22 of the molding portion 21. As shown in FIG. 4, the intermediate mold 20 is manufactured by repeatedly forming on the substrate 24 using the master mold 10, and a large number of convex portions 23 are arranged in a matrix. The convex portion 23 corresponds to a concave portion 33 (described later) of the transfer mold 30 and protrudes from the surface 22 in a substantially hemispherical shape. The molding part 21 is formed of a resin 21A. As the resin 21A, a photocurable resin or a thermosetting resin is used. The substrate 24 is a flat plate having a certain thickness, and supplements the strength of the molded part 21.

  The substrate 24 may be circular as shown in FIG. 4 or rectangular. As the material of the substrate 24, metal, ceramic, glass, resin, or the like is used. It is preferable to use a glass substrate that is easy to obtain an accurate thickness and excellent in strength even if it is thin. When a light-transmitting material such as glass is used as the substrate, if the resin material used when producing the transfer mold 30 is a photocurable material, the curing can proceed by irradiating light from the substrate side. .

<Configuration of transfer mold 30>
As shown in FIG. 5, the transfer mold 30 in the present embodiment includes a molding part 31 and a substrate 34. The molding part 31 is molded using the intermediate mold 20, and a plurality of recesses 33 are formed in a matrix on the surface 32. The concave portion 33 is a portion corresponding to the lens portion 3 and is recessed from the surface 32 in a substantially hemispherical shape. The molding part 31 is formed of a resin 31A. As the resin 31A, a photocurable resin or a thermosetting resin is used. The substrate 34 is a flat plate having a certain thickness, and supplements the strength of the molded part 31.

  The shape and material of the substrate 34 are the same as those of the substrate 24 described above.

  By using the master mold 10, the intermediate mold 20, and the transfer mold 30, a convex lens is formed on the substrate of the wafer lens 1 as the lens unit 3.

  As the lens unit 3, a concave lens can be formed instead of the convex lens. In this case, a convex portion is provided on the surface 12 of the master mold 10. The surface 22 of the intermediate mold 20 is provided with a recess. Further, a convex portion is provided on the surface 32 of the transfer mold 30. Other configurations are the same as the above-described “configuration of the master mold 10”, “configuration of the intermediate mold 20”, and “configuration of the transfer mold 30”.

<Wafer lens manufacturing process>
Next, the manufacturing process of the wafer lens 1 will be described with reference to FIGS. In the present embodiment, the manufacturing process of the wafer lens 1 can be divided into “intermediate mold manufacturing process”, “transfer mold manufacturing process”, and “wafer lens manufacturing process”. Hereinafter, each process will be described. The wafer lens 1, the intermediate mold 20, and the transfer mold 30 are substantially the same in manufacturing method except that the unevenness is reversed.

<Intermediate mold manufacturing process>
6 and 7A to 7E show a method of forming the intermediate die 20 from the master die 10. 7A to 7E are cross-sectional views in the CC direction of FIG.

  First, a desired master mold 10 is selected (S10, see FIG. 7A). In the present embodiment, it is assumed that the master die 10 (base portion 11) is made of metal. On the surface 12 of the base portion 11, a plurality of concave portions 13 corresponding to the convex portions 23 of the intermediate mold 20 are provided in a matrix. A flat portion 15 is formed in the peripheral portion of each concave portion 13 of the surface 12.

  Next, the discharge port 40 of the dispensing apparatus is disposed above the master mold 10 selected in S10. Then, the uncured resin material 21A ′ having fluidity is discharged from the discharge port 40 onto the surface 12 of the master mold 10 (see S11 and FIG. 7B). The resin material 21A ′ forms the molding portion 21 of the intermediate mold 20 after being cured. In the present embodiment, a photocurable resin material is used as the resin material 21A ′. Details of this discharge will be described later.

  Next, the manufacturing apparatus (not shown) raises the master mold 10 in which the resin material 21A ′ is disposed in S11 toward the substrate 24, and presses the resin material 21A ′ against the substrate 24 (S12, see FIG. 7C). ). The substrate 24 is sucked and fixed above the master mold 10 by a vacuum chuck device (not shown) or the like. In the present embodiment, the substrate 24 is formed of a material that can transmit light (for example, glass). It is desirable that the substrate 24 is pressed by the manufacturing apparatus so that a uniform pressure is applied to the entire substrate 24.

  Next, in a state where the substrate 24 and the master mold 10 are pressed in S12, the light source 41 irradiates the resin material 21A ′ from the substrate 24 side (see S13, FIG. 7D). As described above, the resin material 21A ′ is a photocurable resin material, and the substrate 24 is formed of a material that can transmit light. Therefore, the light from the light source 41 passes through the substrate 24 and reaches the resin material 21A ′, and a polymerization reaction is generated by the light, whereby the resin material 21A ′ is cured to become the resin 21A.

  After the resin material 21A ′ is cured in S13, the manufacturing apparatus peels off the resin 21A bonded to the substrate 24 from the master mold 10 (S14, see FIG. 7E). Then, the processing from S11 to S14 is performed at another position of the substrate 24 (a position different from the position where the convex portion 23 was previously formed). In this way, the processing from S11 to S14 is repeated until there is no empty space in which the convex portion 23 can be formed on the substrate 24 (in the case of Y in S15). When there is no space for forming the convex portion 23 on the substrate 24, all molding is completed (in the case of N in S15), and the intermediate portion in which the molded portion 21 made of resin having the plurality of convex portions 23 is formed on the substrate 24. The mold 20 is completed (S14, see FIG. 7E).

  Further, it is desirable to apply a release agent to the flat portion 15 in advance to improve the releasability between the resin material 21A ′ discharged in S11 and the master die 10. In this way, when the release layer is provided on the master mold by application of a release agent or the like, the discharged resin material tends to become droplets even when the viscosity of the resin material is small. It can be said that the significance of applying the method is higher. When a release agent is used, an OH group (hydroxyl group) is raised by performing surface modification processing such as UV ozone cleaning and oxygen plasma ashing on the flat portion 15. Then, a material (for example, a material having a silane coupling structure) in which a hydrolyzable functional group is bonded to the terminal is applied to the flat portion 15. Then, dehydration condensation or hydrogen bonding occurs between the functional group and the OH group present on the surface of the flat portion 15, and the release agent is fixed to the surface of the flat portion 15.

<Transfer mold manufacturing process>
8 and 9 show a method of forming the transfer mold 30 from the intermediate mold 20 obtained in S14.

  First, the substrate 34 is disposed below the intermediate mold 20 obtained in S14 so as to face the molding portion 22 of the intermediate mold (S20). It is assumed that an uncured resin material 31A ′ having fluidity is applied on the substrate 34 in advance. The cured resin 31 </ b> A forms the molding part 31 of the transfer mold 30. In the present embodiment, a photocurable resin material is used as the resin material 31A ′. On the surface 22 of the intermediate mold 20, a plurality of convex portions 23 corresponding to the concave portions 33 of the transfer mold 30 are provided in a matrix. A flat portion 25 is formed in the periphery of each convex portion 23 of the surface 22.

  Next, the manufacturing apparatus (not shown) presses the substrate 34 against the surface 22 (intermediate mold 20) on which the resin material 31A 'is applied in S20 (S21). In the present embodiment, the substrate 34 is formed of a material that can transmit light (for example, glass). The substrate 34 is preferably pressed by the manufacturing apparatus so that a uniform pressure is applied to the entire substrate 34. The intermediate mold 20 is sucked and fixed above the substrate 34 by a vacuum chuck device (not shown) or the like.

  Next, in a state where the substrate 34 and the intermediate mold 20 are pressed in S21, the light source 41 emits light from the substrate 34 side (see S22, FIG. 9). As described above, the resin material 31A ′ is a photocurable resin material, and the substrate 34 is formed of a material that can transmit light. Therefore, the light from the light source 41 passes through the substrate 34 and reaches the resin material 31A ′, and a polymerization reaction is generated by the light, whereby the resin material 31A ′ is cured to become the resin 31A.

  After the resin material 31 </ b> A ′ is cured in S <b> 22, the manufacturing apparatus peels the resin 31 </ b> A bonded to the substrate 34 from the intermediate mold 20. As a result, the transfer mold 30 is completed (S23).

  Further, it is desirable to improve the releasability between the resin 31 </ b> A and the intermediate mold 20 by, for example, applying a release agent to the flat portion 25 in advance. When a release agent is applied, it is desirable to further perform a surface modification process on the flat portion 25.

<Wafer lens manufacturing process>
10 and 11 show a method of molding the wafer lens 1 from the transfer mold 30. FIG.

  First, the substrate 2 is placed above the transfer mold 30 obtained in S23. It is assumed that an uncured resin material 3A ′ having fluidity is previously applied to the surface 32 of the transfer mold 30 (S30). The resin material 3A ′ forms the lens portion 3 after being cured. In the present embodiment, a photocurable resin material is used as the resin material 3A ′. On the surface 32 of the transfer mold 30, a plurality of concave portions 33 corresponding to the lens portions 3 are provided in a matrix. A flat portion 35 is formed in the periphery of each recess 33 on the surface 32.

  Next, the manufacturing apparatus (not shown) raises the transfer mold 30 with the resin material 3A ′ applied in S30 against the substrate 2, and presses the resin material 3A ′ against the substrate 2 (S31). In the present embodiment, the substrate 2 is formed of a material that can transmit light (for example, glass). It is desirable that the substrate 2 is pressed by a manufacturing apparatus so that a uniform pressure is applied to the entire substrate 2. The substrate 2 is sucked and fixed above the transfer mold 30 by a vacuum chuck device (not shown) or the like.

  Next, in a state where the substrate 2 and the transfer mold 30 are pressed in S31, the light source 41 emits light from the substrate 2 side (S32, see FIG. 11). As described above, the resin material 3A ′ is a photocurable resin material, and the substrate 2 is formed of a material that can transmit light. Therefore, the light from the light source 41 passes through the substrate 2 and reaches the resin material 3A ′, and a polymerization reaction is caused by the light, whereby the resin material 3A ′ is cured to become the resin 3A.

  After the resin material 3 </ b> A ′ is cured in S <b> 32, the manufacturing apparatus peels the resin 3 </ b> A bonded to the substrate 2 from the transfer mold 30. As a result, the lens unit 3 is completed (S33, see FIG. 11). Thus, the wafer lens 1 having the plurality of lens portions 3 formed on the substrate 2 is completed (S34).

  In addition, it is desirable to improve the releasability between the resin 3 </ b> A and the transfer mold 30 by applying a release agent to the flat portion 35 in advance. When applying a release agent, it is desirable to further perform a surface modification treatment of the flat portion 35.

<Method of arranging resin material>
Next, a resin material arranging method according to the present embodiment will be described with reference to FIGS. Here, the case where resin material 21A 'is arrange | positioned with respect to the master type | mold 10 is described.

  13A to 13E are views showing the surface 12 of the master mold 10 where the recess 13 is provided. In the present embodiment, a case where five resin materials 21A ′ are arranged on the surface 12 will be described. Further, in the present embodiment, description will be made using a configuration in which 4 × 4 concave portions 13 are arranged on the surface 12 (arranged in a matrix of 4 rows and 4 columns).

  In this embodiment, “resin arrangement pitch (p)” refers to the distance between the centers of the resin materials 21A ′ arranged (see FIG. 13B). The “molding resin thickness” refers to the distance (R shown in FIG. 7D) from the surface 12 of the master mold 10 to the substrate 24 after the pressing step. The “total amount” refers to the total amount of all the resin materials 21 </ b> A ′ arranged on the master mold 10. Further, the “volume of the gap between the mold and the substrate” means a space (a space surrounded by a surface formed by each side of the master mold 10 (surface 12) and each side of the substrate 24 at a position opposite to each side. The volume of the gap between the mold and the substrate. Specifically, when the surface of the substrate 24 is flat, the value is calculated by the area of the surface 12 x the thickness of the molded resin. The diagonal lines connecting the vertices of the surface 12 are L1 and L2 (see FIG. 13A).

  Here, the resin material arranging step in the present embodiment will be described with reference to FIG. FIG. 12 describes the step S11 of FIG. 6 in detail. In the present embodiment, the dispensing device is driven based on a predetermined program. Alternatively, the operator may operate manually.

  First, a predetermined amount of the resin material 21A ′ is discharged to the center P1 of the surface 12 from the discharge port 40 of the dispensing apparatus to the master mold 10 selected in S10 (S110, first arrangement step, see FIG. 13A). The discharged resin material 21A ′ has a certain degree of viscosity and remains in the form of droplets in the vicinity of the discharged position (center P1) due to the presence of the release layer formed on the master mold 10.

  Next, a predetermined amount of the resin material 21A ′ is discharged from the discharge port 40 of the dispensing apparatus to a plurality of locations (P2 to P5) on the diagonal lines L1 and L2 of the surface 12 (S111, second arrangement step, see FIG. 13B). In this way, as shown in FIG. 13B, a position overlapping with the center of the surface 12 of the master mold 10 (indicated by reference numeral P1) and a position overlapping with a plurality of locations on the diagonal of the surface 12 (indicated by reference numerals P2 to P5). Drop-shaped resin materials are arranged at intervals. In other words, the resin material is disposed at the center of the surface 12 and at each intermediate position from the center toward the four corners, but at other positions, for example, at positions overlapping with the perpendiculars from the center of the surface 12 toward the four sides. No resin material is placed. Here, the center of the drop-shaped resin material in the central portion P1 substantially coincides with the center of the surface 12, and the centers of the drop-shaped resin materials in the peripheral portions P2 to P5 are substantially on the diagonal line of the surface 12, respectively. Moreover, it arrange | positions so that the resin arrangement | positioning pitch of drop-shaped resin material P1 and P2-P5 may become substantially equal. In addition, when S111 is executed after S110, there is an advantage that even if each resin comes into contact before pressing for some reason, there is an advantage that it is relatively difficult to generate bubbles, but S110 and S111 may be in the reverse order, Further, S110 may be executed in the middle of S111.

  In this state where the resin material 21A ′ is arranged at five places, the master mold 10 (surface 12) is raised toward the substrate 24, and the resin material 21A ′ is pressed against the substrate 24 (S12). Then, the resin material 21A ′ spreads on the surface 12 as shown in FIGS. 13C to 13D. Then, as shown in FIG. 13E, the resin material 21A ′ does not protrude from the surface 12 and no bubbles are generated.

  In this way, by disposing the resin material 21A ′ at the position P1 that overlaps the center of the surface 12 and the plurality of locations P2 to P5 on the diagonal lines L1 and L2 of the surface 12, the protrusion of the resin material and the generation of bubbles can be suppressed. Although the detailed reason is unknown, the presence of resin in the central part prevents the space from remaining due to the resin material in the peripheral part, and the resin exists at positions that are farthest from the central part toward the four corners. By doing so, the resin material can be surely spread to the end including the four corners, the resin material is spread so as to be spread from the central portion of the surface 12 to the peripheral portion, It is presumed that, after reaching the edge, the volume of the resin material is small, so that it tends to spread along the edge of the surface 12.

  As an example of the present embodiment, the total amount of the resin material 21A ′ is 34.3 mg (6.86 mg per point) with respect to the surface 12 having a side of 13.2 mm square, and the molded resin thickness is 160 μm. The resin arrangement pitch is 6.2 mm.

  Further, as shown in FIG. 14, nine resin materials 21A ′ are arranged on the surface 12, that is, two or more droplet resin materials are arranged between the central portion and the corner on the diagonal line of the surface 12. It is also possible to form the state of the resin material 21A as shown in FIG. 13E. In this case, the size of each droplet-shaped resin material is made small so that the total amount of the resin does not change greatly. When the number of the resin materials is increased and the number of resin materials is increased in this way, the number of times the resin material is arranged increases, but it becomes easier to control how the resin material spreads during pressing. Therefore, even when the size of the concave portion or convex portion corresponding to the lens portion is small or the number is large, bubbles are not easily generated.

  In this case, for example, the total amount of the resin material 21A ′ is 37.2 mg (4.13 mg per point), the resin thickness to be molded is 100 μm, and the resin arrangement pitch is 17.4 mm square on the surface 12. 3.39 mm.

  In the present embodiment, the dispensing apparatus is driven to discharge the resin material 21A ′ to a position where the resin arrangement pitch p is substantially constant between the resins (distance P2 to P5 with respect to P1).

  Further, in the present embodiment, the dispensing apparatus is driven so that the discharge amount of the resin material 21A ′ in S110 and the discharge amount of the resin material 21A ′ arranged in one place in S111 are constant. The amount of resin at one point is desirably 0.1 mg or more and 50 mg or less. If the amount of resin at one point is less than 0.1 mg, the number of times the resin is discharged becomes inefficient and it becomes difficult to accurately control the discharge position, and it is impossible to discharge onto the master mold, There is a possibility that the resin may not be arranged at a position where no occurrence occurs. Also, if the amount of resin at one point exceeds 50 mg, the shape of the resin after discharge becomes unstable, or the resin material tends to protrude from the mold when the resin material is discharged to the end of the mold. Tend to be difficult.

  In this way, it is predicted how the resin material 21A ′ spreads on the surface 12 by maintaining a substantially constant resin arrangement pitch or by making the discharge amount in the first arrangement step and the second arrangement step constant. It becomes easy to do. In addition, the discharge position of the dispensing apparatus can be easily set. Accordingly, it is possible to improve workability when manufacturing the wafer lens 1 and the like.

  Further, in the present embodiment, the total amount of the resin material 21A ′ discharged in S110 (first arrangement step) and S111 (second arrangement step) is the gap between the master mold 10 and the substrate 24 formed in the pressing step. Desirably substantially equal to the volume.

  In this case, for example, the total amount of the resin material 21A ′ is obtained in advance by simulation or the like. And based on the said value, it becomes realizable by adjusting the discharge amount of a resin material, or adjusting the pressure at the time of a manufacturing apparatus pressing.

  Thus, by making the total amount of the resin material substantially equal to the volume of the gap between the mold and the substrate, the resin material is prevented from protruding from the substrate when pressed (or the resin material does not spread to every corner of the substrate). Wafer lens and wafer lens mold can be manufactured.

  In the present embodiment, the example in which the resin material 21A ′ is discharged onto the master mold 10 has been described, but the present invention is not limited to this. For example, a resin material may be disposed on the substrate 24 at a position facing the master mold 10, or may be disposed on both the master mold 10 and the substrate 24. Further, when a wafer lens is manufactured directly from a mold without using an intermediate mold, the resin material constituting the lens portion is arranged on at least one of the mold and the substrate in the above-described procedure, thereby having an expected shape. A wafer lens can be produced. Furthermore, in this embodiment, although the case where the resin material was arrange | positioned to the type | mold which has a recessed part in the surface was demonstrated, it is not restricted to this. For example, the same process can be applied to a mold having a convex portion on the surface.

  It should be noted that, when the resin material is arranged on the substrate 24 or the resin material is arranged on both the surface 12 of the master die 10 and the substrate 24 before pressing the master die 10 and the substrate facing each other, the pressing step When the surface 12 is opposed to the pressing position on the substrate 24, the resin material in a position overlapping the center of the surface 12 when viewed from the direction perpendicular to the substrate 24, and a plurality of other resin materials And the distances (resin arrangement pitch) may be substantially equal.

<Modification 1>
In the present embodiment, the configuration in which the discharge amount of the resin material is constant in the first arrangement step and the second arrangement step has been described, but the present invention is not limited thereto.

  For example, it is possible to set the discharge amount of the resin material in the first arrangement step to be larger than the discharge amount of the resin material discharged to each location in the second arrangement step (see FIG. 15). The discharge amount is changed by the dispensing device based on a predetermined program (or an operation input by the operator). By changing the discharge amount of the resin material in this way, the spreading method of the resin can be changed to some extent, and fine adjustment is facilitated when the resin is likely to protrude or run out. In addition, the number of resin discharges can be reduced, leading to improved work efficiency.

  The discharge amount of the resin material discharged in the first arrangement step is 0.8 to 6 times, more preferably 1 to 3 times the discharge amount of the resin material discharged to each location in the second arrangement step. It is desirable that If the former exceeds 6 times the latter, it is difficult to set the optimum pitch and the protrusion tends to occur, and if the former is less than 0.8 times the latter, a space is easily formed in the center and bubbles are likely to be generated. Become.

<Modification 2>
The position on the surface 12 on which the droplet-shaped resin material is arranged is not limited by the positions of the plurality of recesses included in the surface 12 of the master mold 10, but when the pressure by the pressing step is weak or the aspect of the recesses When the ratio (ratio of the height h (longitudinal direction with respect to the surface 12) to the diameter r (horizontal direction with respect to the surface 12) of the recess 13 is high, see FIG. 16A), the resin material 21A ′ tends not to be filled into the recess 13. Therefore, the resin material may be arranged in consideration of the position of the recess.

  16A and 16B are views showing a state where the resin materials 21A ′ intersect on the master mold 10. FIG. 16A and 16B are CC cross-sections of the master mold 10 of FIG. 2 (in FIGS. 16A and 16B, left and right portions are omitted by wavy lines). When the resin material 21A ′ arranged as shown in FIG. 16A is pressed, it comes into contact with another resin material 21A ′ as shown in FIG. 16B. Here, Q is a point where the resin materials 21A ′ first contact each other. The lowest point of the recess 13 is S.

  Here, when the point Q is located on the axis of the lowest point S of the recess 13, the resin material 21 </ b> A ′ is filled in the recess 13 when the pressing force is small or the aspect ratio of the recess is large as described above. It will be difficult.

  Therefore, as shown in FIG. 16B, the point Q where two adjacent resin materials 21A ′ first intersect with each other by pressing passes through the lowest point S of the concave portion 13 of the master mold 10 and the surface 22 of the master mold 10. It is preferable that the position is different from that on the vertical axis. For this purpose, it is desirable to adjust the pitch and resin amount at which the resin material 21A ′ is discharged by the dispensing device. For example, the pitch is narrowed by increasing the number of resins. Alternatively, the number of dropped resins is reduced to widen the resin arrangement pitch, and the position of the point at which adjacent drop-shaped resin materials first meet by pressing is changed. Alternatively, the resin arrangement pitch is changed by slightly increasing / decreasing the amount of resin while maintaining the number of resins. By using such a method, the resin material 21A ′ discharged in S110 and the resin material 21A ′ discharged in S111 (or the resin material 21A ′ discharged in S111) are pressed against the substrate 24 by the pressing step. When being pressed, the point Q where the resin materials 21A ′ first meet each other can be adjusted to be different from the position on the axis that passes through the lowest point S of the recess 23 and is perpendicular to the surface 12.

  Therefore, regardless of the pressure of the pressing step and the aspect ratio of the concave portion, it is possible to manufacture the wafer lens and the wafer lens mold while suppressing the generation of bubbles.

<Modification 3>
In the embodiment, the substrate is described as being flat, but the present invention is not limited to this. For example, for the purpose of facilitating the work of peeling the resin from the mold or reducing the thickness of the resin portion, a mold having a step and a substrate having a counterbore are used. It is also possible. In the present modification, the manufacturing process of the intermediate mold 20 will be described as an example. The master mold 10 according to this modification will be described on the assumption that a convex portion (not shown) is formed on the surface 12 instead of the concave portion 13.

  As shown in FIG. 17, the surface 12 of the master mold 10 is divided into a portion (surface 12a) where the convex portion is formed by the step 10a and a portion other than that (surface 12b). A counterbore 24 c is provided at a position corresponding to the convex portion of the master mold 10 on the substrate 24. In this modification, the upper surface of the substrate 24 is 24a, and the bottom surface of the spot facing portion 24c is 24b.

  By providing such a step 10a, when the surface 12a is pressed toward the bottom surface 24b, it becomes easy to bring the top surface 24a and the surface 12a of the substrate 24 close to each other. Further, the facing portion between the counterbore 24c and the step 10a is used as a buffer space, which can contribute to reliable resin filling between the upper surface 24a of the substrate 24 and the master-type surface 12a.

  However, in the configuration in which the counterbore portion 24c is provided on the substrate 24 in this way, the volume of the space of the facing portion between the counterbore portion 24c and the step 10a is small, so that the protrusion D of the resin material as shown in FIG. A shortage E of the resin material as shown in FIG. 19 is likely to occur, which may cause inconvenience during the subsequent production of the intermediate mold or transfer mold. Further, since the molding of the substrate and the mold is complicated, bubbles are easily generated. Therefore, by using the arrangement method of the resin material described in the embodiment, even when such a spot facing to the substrate or a step to the master mold is provided, the protrusion of the resin material and the generation of bubbles are prevented. Can be achieved.

<Modification 4>
The arrangement method of the resin material described in the embodiment has been described with respect to the case where the resin material is arranged in a mold, but is not limited thereto. Even when the resin material is arranged on the substrate instead of the mold, it is possible to prevent the resin material from protruding and the generation of bubbles by using the above arrangement method.

  That is, as the first arrangement step, the resin material is discharged so as to overlap the center of the range in which the mold is pressed against the substrate on which the mold having the surface where the concave or convex portions are arranged in a matrix is pressed. Next, as a second arrangement step, a plurality of resin materials are discharged at positions on the substrate that overlap with the diagonal line connecting the vertices of the surface. Then, by performing the pressing step for pressing the mold against the substrate on which the resin is disposed, the curing step, and the releasing step, it is possible to prevent the resin material from protruding and the generation of bubbles. .

<Modification 5>
In the above-described embodiment, the surface 12 of the master mold 10 is a square, but is not limited thereto, and may be a rectangle. However, if the difference between the length of the long side and the length of the short side becomes too large, the resin material easily protrudes in the pressing step. Therefore, at least the short side length is 50% or more of the long side length, More preferably, it is 70% or more, more preferably 80% or more. When the length of the short side is 50% to 70% of the length of the long side, by adjusting the position of the resin material to be arranged on the diagonal line, specifically, it can be brought closer to the center of the surface 12 Further, it is possible to prevent the resin from protruding from the short side.

<Other variations>
The manufacturing method in this invention is not restricted to what was demonstrated by embodiment. For example, the present invention is applicable even when the transfer mold manufacturing process is not sandwiched or when both the intermediate mold manufacturing process and the transfer mold process are not sandwiched. In any case, by using the resin material arrangement method described in the embodiment, it is possible to prevent the resin material from protruding and the generation of bubbles.

DESCRIPTION OF SYMBOLS 1 Wafer lens 2, 24, 34 Board | substrate 3 Lens part 3A, 21A, 31A Resin 10 Master type | mold 11, 21, 31 Molding part 12, 22, 32 Surface 13, 33 Recessed part 14 Base part 15, 25, 35 Flat part 20 Middle Mold 23 Convex 30 Transfer mold 40 Dispense outlet 41 Light source

Claims (11)

A method for producing a resin molded article in which a resin layer including a plurality of concave portions or convex portions arranged in a matrix on a substrate is formed,
The surface and the surface thereof are opposed to each other so as to overlap the center of the surface of the mold having a rectangular surface including a plurality of protrusions or recesses arranged in a matrix corresponding to the recesses or protrusions of the resin molding. A first disposing step of disposing a resin material having fluidity on at least one of the substrates; and
The resin material is disposed in droplets on at least one of the surface and the substrate opposed to the surface so as to overlap a plurality of points symmetrical to the center of the surface on the diagonal of the surface . A placement step;
A pressing step of relatively pressing the mold and the substrate on which the resin material is arranged in at least one of the first and second arranging steps with the resin material interposed therebetween;
A curing step in which the resin material is cured to be a cured resin in a state where the mold and the substrate are relatively pressed;
A mold release step of releasing the cured resin from the mold;
The manufacturing method of the resin molding characterized by having.   The method for producing a resin molded product according to claim 1, wherein a pitch between the droplet-shaped resin materials arranged in the first arrangement step and the second arrangement step is substantially constant.   3. The resin molded product according to claim 1 or 2, wherein the amount of the droplet-shaped resin material arranged at one place in the first arrangement step and the second arrangement step is substantially constant. Method.   The amount of the drop-like resin material arranged in the first arrangement step is different from the amount of the drop-like resin material arranged in each place in the second arrangement step. 2. A method for producing a resin molded product according to 2.   The amount of the drop-shaped resin material arranged in the first arrangement step is 1 to 6 times the amount of the drop-like resin material arranged in each place in the second arrangement step. The manufacturing method of the resin molding of Claim 4.   The total amount of the resin material arranged in the first arrangement step and the second arrangement step is substantially equal to a volume of a gap between the mold and the substrate formed in the pressing step. Item 6. A method for producing a resin molded product according to any one of Items 1 to 5.   In the first arrangement step and the second arrangement step, the plurality of droplet-shaped resin materials arranged on at least one of the surface and the substrate are opposed to the pressing position on the substrate in the pressing step. Each of the droplet-shaped resin material at a position overlapping the center of the surface when viewed from a direction perpendicular to the substrate and the other plurality of droplet-shaped resin materials. The method for producing a resin molded product according to claim 1, wherein the distances are substantially equal.   The point at which at least one pair of two adjacent resins among the droplet-shaped resin materials arranged in the first arrangement step and / or the second arrangement step first intersect with each other by the pressing by the pressing step is as described above. The method for producing a resin molded product according to any one of claims 1 to 7, wherein the resin molded product is located at a position different from an axis perpendicular to the surface passing through the top of the concave portion or the convex portion.   The method of manufacturing a resin molded product according to any one of claims 1 to 7, wherein a counterbore portion is provided on the substrate at a position surrounding the concave portion or the convex portion of the surface.   The method for producing a resin molded product according to claim 1, wherein the second arranging step is performed after the first arranging step.   The method for producing a resin molded product according to claim 1, wherein the resin molded product is a wafer lens mold for molding a wafer lens including a plurality of resin lens portions arranged in a matrix.