JPH0740572B2 - Resin coating method for electronic parts - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a resin packaging method for electronic components, and more particularly to an improved resin packaging for enabling the height dimension of electronic components after resin packaging to be reduced. Regarding the method.

[Conventional technology]

2. Description of the Related Art Conventionally, in the manufacture of electronic components, a method has been adopted in which the durability and insulating properties of the components are improved by covering the connection parts of the electronic component body and terminals with a resin. A resin bath dipping method, a so-called dribbling method, has conventionally been used as a method for performing this resin coating. As shown in FIG. Dipping the resin bath 13 a certain number of times, and the exterior resin attached by this
In this method, 14 parts are naturally dried and then baked and cured.

[Problems to be solved by the invention]

However, in the electronic component 10 resin-coated by the above-mentioned conventional method, when mounted on the substrate 15 as shown in FIG. 3, the height H from the upper surface of the substrate 15 to the top surface portion tends to be higher than the design dimension. There is a problem. This is because the lower part of the exterior resin attached during the immersion in the resin bath hangs down due to its own weight, and is dried and baked and cured with the hang-down part 14a still existing. A method of adjusting the viscosity of the resin bath 13 can be considered to reduce the amount of sagging, but it is difficult to obtain a sufficient effect because there is a tradeoff with the adhesiveness of the resin during immersion.

Therefore, an object of the present invention is to substantially completely correct the sagging of the exterior resin by a mechanical method to reduce the mounting height for recent electronic components, that is, to provide a so-called low-profile electronic component. The point is to provide a resin coating method.

[Means for solving problems]

According to the present invention, a plurality of electronic component bodies connected by a frame and a connecting portion between the plurality of electronic component bodies and terminals are immersed in a resin bath a predetermined number of times, and the exterior resin portion adhered by the immersion is naturally removed. In a resin packaging method for electronic parts, which is dried and baked and cured, the top surface portion of the exterior resin adhered by the above dipping when mounted on the substrate is pressed substantially perpendicularly to the molding plate, and the pressure molding is performed. In, the distance between the board mounting stopper formed on the terminal and the molding plate is set to a dimension corresponding to the height of the top surface portion from the board surface at the time of board mounting, and natural drying after the press molding, It is characterized by being baked and cured.

Here, the timing of the press molding in the present invention is preferably a so-called raw-drying time when the electronic component is pulled out from the resin bath and a thin film is formed on the outer surface of the exterior resin. Further, the press molding can be realized by various methods, and for example, the hanging portion of the exterior resin may be pressed against a molding plate having a flat surface.

[Action]

In the resin packaging method for an electronic component according to the present invention, since the sagging portion of the packaging resin is mechanically pressure-molded, the sag is surely corrected, and the mounting height is as designed, resulting in a low electronic component. The height can be realized.

〔Example〕

 Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a process chart for explaining a resin coating method for an electronic component according to an embodiment of the present invention.

The method of the present embodiment is an example of the case where the piezoelectric ceramic oscillator is covered with a resin. In the figure, the piezoelectric ceramic oscillator 1 includes a material plate on the frame 2 at a predetermined interval in a pre-process of the resin covering. It is configured by punching into a shape in which 3 is arranged by a pressing device, and connecting a piezoelectric oscillation element 4 as an electronic component element body between the ends of the terminals 3, 3. Reference numeral 7 denotes a molding plate which is a feature of this embodiment, and is disposed, for example, in the vicinity of the resin bath 5, and has a flattened upper surface 7a for preventing adhesion of exterior resin. Surface treatment, for example, Teflon (registered trademark) treatment is applied.

In the method of this embodiment, first, the piezoelectric ceramic oscillator 1
Piezoelectric oscillation element 4 and element holding portion of terminal 3
When the portion 3a is immersed in the resin bath 5 a predetermined number of times, for example, 3 to 4 times and then pulled out from the resin bath 5, the piezoelectric oscillation element 4 and the element holding portion 3a portion are covered with the exterior resin 6. Then, for example, after a lapse of about 20 minutes, a thin film is formed on the outer surface of the exterior resin 6 and becomes dry. At this time, a hanging portion 6a is formed under the exterior resin 6 as in the case of the conventional method (see FIG. 1 (a)).

Next, the hanging portion 6a of the exterior resin 6 of each piezoelectric ceramic oscillator 1 is pressed against the molding plate 7 together with the frame 2 in the state where the thin film is formed and the surface is dry. Of course, the frame 2 may be fixed and the molding plate 7 may be raised. In this press molding, the distance H from the substrate mounting stopper 3b formed on the terminal 3 to the molding plate 7 is adjusted to be the designed mounting height of the piezoelectric ceramic oscillator 1. As a result, the hanging portion 6a of the exterior resin 6 is press-molded upward, and the height to the top surface is adjusted to the design value (see FIGS. 1 (b) and (c)). .

After the outer resin 6 is press-molded, it is naturally left to dry and then baked and cured as in the conventional method.

As described above, in this embodiment, the piezoelectric ceramic oscillator 1
After the resin is pulled up from the resin bath 5, the exterior resin 6 part is press-molded by the molding plate, so the sagging of the exterior resin can be corrected and the mounting height as designed can be secured, and the height of electronic parts can be reduced. Can be realized. Incidentally, in this embodiment, the mounting height could be reduced by about 1 mm as compared with the case of the conventional method.

In addition, since the method of this embodiment is a method of mechanically pressing the exterior resin 6 portion with the molding plate 7, for example, the sagging portion 6a can be corrected more easily and surely than the method of adjusting the viscosity of the resin bath. In addition, since the device has a simple structure, there is an advantage that it can be realized at low cost.

In the above embodiments, the piezoelectric ceramic oscillator has been described as an example, but the present invention can of course be applied to other electronic components.

〔The invention's effect〕

As described above, according to the resin exterior packaging method of the electronic component of the present invention, since the hanging portion of the exterior resin is press-molded, the predetermined mounting height can be easily and reliably realized, and the low profile of the electronic component can be achieved. There is an effect that it is possible to meet the demand for the realization.

[Brief description of drawings]

FIGS. 1 (a), (b), and (c) are process drawings for explaining an embodiment of the present invention, and FIGS. 2 and 3 are structures for explaining problems in the conventional method. It is a figure. In the figure, 1 is a piezoelectric ceramic oscillator (electronic component),
Reference numeral 3 is a terminal, 3a is a holding portion, 4 is a piezoelectric oscillation element (electronic component element body), 5 is a resin bath, and 6 is an exterior resin.

Claims (1)

[Claims] 1. A plurality of electronic component bodies connected by a frame and a connecting portion between the plurality of electronic component bodies and terminals are immersed in a resin bath a predetermined number of times, and the exterior resin portion adhered by the immersion is removed. In a resin exterior packaging method for electronic components, which is naturally dried and then baked and cured, the top surface portion of the exterior resin attached by dipping is placed substantially perpendicular to the molding plate when the substrate is mounted, and In molding,
The distance between the board mounting stopper formed on the terminal and the molding plate is set to a dimension corresponding to the height of the top surface portion from the board surface when the board is mounted, and after the press molding, it is naturally dried and baked to cure. A resin coating method for electronic parts, characterized in that