JPH0727837B2 - Piezoelectric component manufacturing method - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method of manufacturing a piezoelectric component in which a resin exterior is coated by dip coating or powder coating.

<Prior Art> A tape exterior, which is used as an exterior for various electronic parts, for example, a piezoelectric part such as a ceramic filter in which terminals are attached to terminals, has a low material cost for the exterior resin and is easy to mass-produce in terms of processing Therefore, there is an advantage that the cost of the product can be reduced.

FIGS. 6 and 7 show the outer shape of the conventional piezoelectric component 1 having a dip outer cover, and the outer resin 4 for covering the element 3 to which the terminal 2 is attached has a curved surface.

By the way, in order to take out the above-mentioned piezoelectric component 1 from the carrier tape and automatically and efficiently mount it on the wiring substrate 5, as shown in FIG. 8, it is preferable to adopt an air mount using a suction tube 6. .

<Problems to be Solved by the Invention> However, when the exterior resin 4 is formed of a curved surface, the suction tube 6 has a poor suction property, and the mounting posture on the circuit board 5 becomes unstable. There is a problem that is difficult.

As a means for solving such a problem, the exterior resin 4 may be formed into a rectangular shape when the tape is exteriorly packaged. However, in the piezoelectric component, in order to secure a vibration space, after applying a wax on the vibration electrode of the element, , Dip it into the epoxy resin that has the property of absorbing wax, and attach the resin,
Since the process of forming the vibration space by absorbing the wax into the resin simultaneously with the subsequent heat curing, it is very difficult to form the square shape due to the amount of the melted material in the epoxy resin and the entrained air.

The present invention has been made in view of the above points, and it is possible to accurately form flat surfaces on both surfaces of the exterior resin, and the suction property by the suction tube and the stability at the time of mounting on the circuit board are improved. It is an object of the present invention to provide a method of manufacturing a piezoelectric component that is improved and can be air-mounted.

<Means for Solving the Problems> In order to solve the above problems, according to the present invention, a terminal is attached to an electronic component element and a cavity forming material such as wax is applied onto a vibrating electrode. After that, the exterior resin is applied, and in the state where the exterior resin is semi-cured, the exterior resin is pressed from both sides by pressing members to form parallel flat surfaces, and then the exterior resin is heat-cured to form a cavity forming material in the resin. Is absorbed to form a vibration space.

<Function> An electronic part element is coated with exterior resin by dip coating or powder coating, and when the exterior resin is semi-cured, pressure is applied from both sides by pressing members to form flat surfaces on both sides of the exterior resin. By heating and curing the exterior resin, a piezoelectric component of the exterior resin having two flat surfaces can be obtained.

<Embodiment> An embodiment of the present invention will now be described with reference to FIGS.
It will be described with reference to the drawings.

First, as shown in FIG. 1, the element 12 with the terminal 11 attached
The exterior resin 13 is formed by applying a molten resin to the outside of the.

As a method of applying the exterior resin 13, dip coating in which a molten epoxy resin is dipped or powder coating of resin can be adopted, and the element 12 is precoated with wax on its vibrating electrode.

With the exterior resin 13 applied to the element 12 being semi-cured, as shown in FIG. 2, the exterior resin 13 is pressed from the wide surfaces on both sides by a pair of pressing members 14, 14 and flattened parallel to both sides of the exterior resin 13. Form faces 15, 15.

When the flat surfaces 15 and 15 are molded, immediately after the exterior resin 13 is applied, it is too soft and loses its shape after molding, and the adhesiveness to the pressing members 14 and 14 is large, resulting in poor workability.

Further, if the curing proceeds too much, the moldability of the flat surfaces 15, 15 is poor.

In addition, in order to improve the releasability of the pressing members 14 and 14 from the exterior resin 13, it is preferable to apply tetrafluoroethylene resin to the molding surface.

As shown in FIG. 3, after molding the flat surfaces 15 and 15, the exterior resin
13 is heat-cured and the wax is absorbed in the exterior resin 13 to secure a vibration space.

After hardening the exterior resin 13, as shown in FIG. 4, the terminal 11 is bent and processed so that the flat surface 15 on one side and the terminal 11 are substantially flush with each other, so that the piezoelectric component 16 can be easily mounted on the circuit board. To do.

FIG. 5 shows a state in which the completed piezoelectric component 16 is taken out from the carrier tape and air-mounted on the circuit board 17. Since the flat surfaces 15 and 15 are formed in parallel on both surfaces of the exterior resin 13, The suction pipe 18 can surely suck the piezoelectric component 16, and the mounting state on the circuit board 17 is stabilized, so that the piezoelectric component 16 can be automatically mounted by air suction.

<Effect> As described above, according to the present invention, the exterior resin applied to the element is pressed in a semi-cured state to form flat surfaces on both sides. Therefore, the exterior is formed by dip coating or powder coating. A flat surface can be easily formed on the exterior of the piezoelectric component, and the piezoelectric component can be reliably mounted on the circuit board by air suction and can be stably mounted on the circuit board.

[Brief description of drawings]

1 to 4 are process drawings showing the manufacturing sequence of the manufacturing method according to the present invention, FIG. 5 is an explanatory view showing a mounting state of a completed piezoelectric component on a circuit board, and FIG. 6 is a conventional drawing. FIG. 7 is a side view showing the piezoelectric component, FIG. 7 is a front view showing the same, and FIG. 8 is an explanatory view showing a mounting state on the circuit board of the same. 11 …… Terminal, 12 …… Element 13 …… External resin, 14 …… Pressing member 15 …… Flat surface, 16 …… Piezoelectric component 17 …… Circuit board, 18 …… Suction tube

Claims (1)

[Claims] 1. An electronic component element, after mounting a terminal and applying a cavity forming material such as wax onto a vibrating electrode, and then applying an exterior resin, and the exterior resin being semi-cured. Is pressed from both sides with a pressing member to form parallel flat surfaces, and thereafter the exterior resin is heat-cured to absorb the cavity forming material in the resin to form a vibration space. Production method.