JPH04303695A - Production of ic card - Google Patents
Production of ic cardInfo
- Publication number
- JPH04303695A JPH04303695A JP3093773A JP9377391A JPH04303695A JP H04303695 A JPH04303695 A JP H04303695A JP 3093773 A JP3093773 A JP 3093773A JP 9377391 A JP9377391 A JP 9377391A JP H04303695 A JPH04303695 A JP H04303695A
- Authority
- JP
- Japan
- Prior art keywords
- card
- adhesive
- uneven surface
- mounting board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 17
- 239000011347 resin Substances 0.000 abstract description 17
- 238000001746 injection moulding Methods 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 9
- 239000011111 cardboard Substances 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004974 Thermotropic liquid crystal Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、気密性に優れたＩＣカ
ードの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card with excellent airtightness.
【０００２】0002
【従来の技術】従来、ＩＣカードには、カード本体にＣ
ＰＵやＲＡＭなどで構成されたＩＣモジュールを内蔵し
たもの、あるいはＩＣなどの電子部品が実装されたプリ
ント回路基板を内蔵したものなどがある。とくに、屋外
や工場などでは、環境の影響によりＩＣカードに内蔵さ
れたＩＣモジュールや電子部品が痛みやすいため、これ
らがカード内に密封された気密型のＩＣカードがある。[Prior Art] Conventionally, an IC card has a C.
There are those that have built-in IC modules made up of PU, RAM, etc., and those that have built-in printed circuit boards on which electronic components such as ICs are mounted. In particular, the IC module and electronic components built into an IC card are easily damaged due to the influence of the environment outdoors or in a factory, so there are airtight IC cards in which these components are sealed inside the card.
【０００３】気密型ＩＣカード６の製造方法としては、
カード基板１上にＣＰＵやメモリなどの電子部品２を実
装した実装基板３を薄型のケース９内に配置し（図２ａ
参照）、ケース９と実装基板３との間の空隙７に充填樹
脂８を注入する方法があった（図２ｂ参照）。[0003] As a method for manufacturing the airtight IC card 6,
A mounting board 3, in which electronic components 2 such as a CPU and memory are mounted on a card board 1, is placed inside a thin case 9 (Fig. 2a).
), there was a method of injecting filling resin 8 into the gap 7 between the case 9 and the mounting board 3 (see FIG. 2b).
【０００４】0004
【発明が解決しようとする課題】しかし、上記の製造方
法は、充填樹脂８を注入すると電子部品２が障害物とな
るので注入した充填樹脂８の流れが妨げられ、充填樹脂
８が空隙７を完全に埋めることできないことがあった。
この状態では、空気の排出部が塞がれて空気溜まりが生
じた状態となっているので、ＩＣカード６の強度や耐環
境性が劣る。充填樹脂８の充填不足は電子部品２が多い
ほど起こりやすい。[Problems to be Solved by the Invention] However, in the above manufacturing method, when the filling resin 8 is injected, the electronic component 2 becomes an obstacle, so the flow of the injected filling resin 8 is obstructed, and the filling resin 8 fills the void 7. There were some things that I couldn't completely fill. In this state, the air discharge portion is blocked and an air pocket is generated, so that the strength and environmental resistance of the IC card 6 are poor. The more electronic components 2 there are, the more likely it is that the filling resin 8 will be insufficiently filled.
【０００５】また逆に、充填樹脂８を過充填した場合、
充填樹脂８の圧力でＩＣカード６が膨張したり電子部品
２を圧迫することにより電子部品２の機能に障害を与え
る。Conversely, if the filled resin 8 is overfilled,
The IC card 6 expands due to the pressure of the filling resin 8 and presses the electronic component 2, thereby impairing the function of the electronic component 2.
【０００６】さらに、充填樹脂８は、ケース９内に充填
樹脂８を充填するため樹脂量が多く、実装基板３が電子
部品２を実装することにより凹凸面を有するので厚さが
一定でなく、また注入方向に添って配向性を有している
。したがって、樹脂硬化の際の樹脂収縮量が大きく、し
かも樹脂収縮量が均一でなく、収縮方向も偏っているた
めにカードに反りが発生する。Furthermore, since the filling resin 8 is filled into the case 9, the amount of resin is large, and the mounting board 3 has an uneven surface due to mounting the electronic component 2, so the thickness is not constant. It also has orientation along the injection direction. Therefore, the amount of resin shrinkage during resin curing is large, the amount of resin shrinkage is not uniform, and the direction of the shrinkage is uneven, causing warpage in the card.
【０００７】本発明は、上記の問題を解決することにあ
って、強度や耐環境性にすぐれ、反りがなく、充分にな
気密性を有するＩＣカードを得ることを目的とする。SUMMARY OF THE INVENTION The present invention aims to solve the above-mentioned problems by providing an IC card that has excellent strength and environmental resistance, is free from warping, and has sufficient airtightness.
【０００８】[0008]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明のＩＣカードの製造方法は、カード基板上
に電子部品を実装することにより凹凸面を有する実装基
板とこの実装基板の凹凸面と逆の凹凸面を有するカバー
成形品との少なくとも一方の凹凸面に接着剤を塗布した
後、両方の凹凸面を互いに密着するように嵌め合わせ、
両方の凹凸面を接着させるように構成した。[Means for Solving the Problems] In order to achieve the above object, the method for manufacturing an IC card of the present invention includes a mounting board having an uneven surface and a mounting board having an uneven surface by mounting electronic components on a card board. After applying an adhesive to at least one uneven surface of the uneven surface and a cover molded product having an opposite uneven surface, fitting both uneven surfaces so that they are in close contact with each other,
The structure was such that both uneven surfaces were bonded together.
【０００９】 以下、図１を参照しながら本発明のＩ
Ｃカードの製造方法の実施例を説明する。図１は本発明
のＩＣカードの製造方法を示す断面図である。１はカー
ド基板、２は電子部品、３は実装基板、４はカバー成形
品、５は接着剤、６はＩＣカードをそれぞれ示す。Hereinafter, with reference to FIG. 1, I
An example of a method for manufacturing a C card will be described. FIG. 1 is a sectional view showing the method for manufacturing an IC card of the present invention. 1 is a card board, 2 is an electronic component, 3 is a mounting board, 4 is a cover molded product, 5 is an adhesive, and 6 is an IC card.
【００１０】実装基板３は、カード基板１上に電子部品
２が実装されたものが用いられる（図１ａ参照）。また
、カバー成形品４との貼り合わせの際に空気が抜けやす
いように、実装基板３に貫通孔を開けておいてもよい。
また、実装基板３の裏面に基板保護のためのシートを設
けてもよいし、防水絶縁塗料をコーティングしてもよい
。The mounting board 3 used is a card board 1 on which electronic components 2 are mounted (see FIG. 1a). Moreover, a through hole may be made in the mounting board 3 so that air can easily escape when bonding with the cover molded product 4. Further, a sheet for protecting the board may be provided on the back surface of the mounting board 3, or a waterproof insulating paint may be coated.
【００１１】カバー成形品４は、熱可塑性樹脂、熱硬化
樹脂、金属などを用いて、実装基板３の凹凸面と逆の凹
凸面を有するように成形する（図１ｂ参照）。とくに、
細かい凹凸や薄肉部を有するカバー成形品４を射出成形
によって成形する場合は、射出成形時に樹脂を射出成形
用の金型の隅々まで充填することができるように流動性
のよいサーモトロピック液晶樹脂を用いるのがよい。ま
た、実装基板３の凹凸面に接着剤５が塗布される場合に
は、カバー成形品４凹凸面を梨地状にして空気が抜けや
すいようにしてもよい。また、接着剤５の厚みが一定に
なるようにするために、カバー成形品４の凹凸面に均一
な高さの突起を設けてもよい。[0011] The cover molded product 4 is molded using thermoplastic resin, thermosetting resin, metal, or the like so that it has an uneven surface that is opposite to the uneven surface of the mounting board 3 (see FIG. 1b). especially,
When molding the cover molded product 4 with fine irregularities and thin parts by injection molding, a thermotropic liquid crystal resin with good fluidity is used so that the resin can be filled into every corner of the injection mold during injection molding. It is better to use Further, when the adhesive 5 is applied to the uneven surface of the mounting board 3, the uneven surface of the cover molded product 4 may be made into a matte finish so that air can escape easily. Further, in order to make the thickness of the adhesive 5 constant, protrusions of uniform height may be provided on the uneven surface of the cover molded product 4.
【００１２】以上のような実装基板３およびカバー成形
品４を用いてＩＣカード６を製造するには、まず実装基
板３とカバー成形品４の少なくとも一方の凹凸面に接着
剤５を塗布する（図１ｃ参照）。接着剤５としては、エ
ポキシ樹脂、アクリル樹脂、シリコーン、フッ素ゴム、
ポリエステルなどを用いるとよい。接着剤５を塗布する
には、たとえば、ディスペンサーやスプレーなどによっ
て塗布する方法がある。To manufacture an IC card 6 using the mounting board 3 and the cover molded product 4 as described above, first, an adhesive 5 is applied to the uneven surface of at least one of the mounting board 3 and the cover molded product 4 ( (see Figure 1c). As the adhesive 5, epoxy resin, acrylic resin, silicone, fluororubber,
It is recommended to use polyester or the like. The adhesive 5 can be applied using, for example, a dispenser or spray.
【００１３】続いて、実装基板３とカバー成形品４の凹
凸面を互いに密着するように嵌め合わせ、両方の凹凸面
を接着してＩＣカード６を完成させる（図１ｄ参照）。[0013] Subsequently, the uneven surfaces of the mounting board 3 and the cover molded product 4 are fitted together so that they are in close contact with each other, and both uneven surfaces are adhered to complete the IC card 6 (see FIG. 1d).
【００１４】[0014]
【実施例】射出成形法により実装基板３の凹凸面と逆の
凹凸面を有するようにＡＢＳ樹脂を成形しカバー成形品
４とする。次に、このカバー成形品４の凹凸面にエポキ
シ樹脂を接着剤５としてディスペンサーにより塗布する
。その後、接着剤５が塗布されたカバー成形品４の凹凸
面と接着剤５が塗布されていない実装基板３の凹凸面と
を互いに密着するように嵌め合わせ、両方の凹凸面を接
着しＩＣカード６を作製した。EXAMPLE A cover molded product 4 is made by molding ABS resin by injection molding to have an uneven surface opposite to that of the mounting board 3. Next, an epoxy resin is applied as an adhesive 5 to the uneven surface of the cover molded product 4 using a dispenser. Thereafter, the uneven surface of the cover molded product 4 coated with the adhesive 5 and the uneven surface of the mounting board 3 not coated with the adhesive 5 are fitted so as to be in close contact with each other, and both uneven surfaces are bonded to form an IC card. 6 was produced.
【００１５】このようにして得られたＩＣカード６は、
外観が美しいカード形状をしており、電子部品２の故障
がなく、強度や耐環境性に優れたものであった。[0015] The IC card 6 thus obtained is as follows:
It had a card shape with a beautiful appearance, had no failures in the electronic component 2, and had excellent strength and environmental resistance.
【００１６】[0016]
【発明の効果】本発明のＩＣカードの製造方法は、カー
ド基板上に電子部品を実装することにより凹凸面を有す
る実装基板とこの実装基板の凹凸面と逆の凹凸面を有す
るカバー成形品との少なくとも一方の凹凸面に接着剤を
塗布した後、両方の凹凸面を互いに密着するように嵌め
合わせ、両方の凹凸面を接着させるように構成した。Effects of the Invention The method for manufacturing an IC card of the present invention includes a mounting board having an uneven surface by mounting electronic components on a card substrate, and a cover molded product having an uneven surface opposite to the uneven surface of the mounting board. After applying an adhesive to at least one of the uneven surfaces, both uneven surfaces were fitted together so as to be in close contact with each other, and both uneven surfaces were bonded together.
【００１７】したがって、本発明のＩＣカードの製造方
法によると、電子部品を破損させることがなく、外観の
美しいＩＣカードが製造できる。また、高い気密性を得
られるため強度や耐環境性に優れたＩＣカードが製造で
きる。Therefore, according to the method for manufacturing an IC card of the present invention, an IC card with a beautiful appearance can be manufactured without damaging electronic components. Furthermore, since high airtightness can be obtained, IC cards with excellent strength and environmental resistance can be manufactured.
【図１】本発明のＩＣカードの製造方法を示す断面図で
ある。FIG. 1 is a sectional view showing the method for manufacturing an IC card of the present invention.
【図２】従来のＩＣカードの製造方法を示す断面図であ
る。FIG. 2 is a cross-sectional view showing a conventional IC card manufacturing method.
１ カード基板 ２ 電子部品 ３ 実装基板 ４ カバー成形品 ５ 接着剤 ６ ＩＣカード ７ 空隙 ８ 充填樹脂 ９ ケース 1 Card board 2 Electronic parts 3 Mounting board 4 Cover molded product 5 Adhesive 6 IC card 7 Voids 8 Filled resin 9 Case
Claims (1)
とにより凹凸面を有する実装基板とこの実装基板の凹凸
面と逆の凹凸面を有するカバー成形品との少なくとも一
方の凹凸面に接着剤を塗布した後、両方の凹凸面を互い
に密着するように嵌め合わせ、両方の凹凸面を接着して
気密型ＩＣカードを得ることを特徴とするＩＣカードの
製造方法。Claim 1: Applying an adhesive to at least one of the uneven surfaces of a mounting board that has an uneven surface by mounting electronic components on a card substrate and a cover molded product that has an uneven surface that is opposite to the uneven surface of this mounting board. After coating, the two uneven surfaces are fitted together so as to be in close contact with each other, and both uneven surfaces are adhered to obtain an airtight IC card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3093773A JPH04303695A (en) | 1991-03-29 | 1991-03-29 | Production of ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3093773A JPH04303695A (en) | 1991-03-29 | 1991-03-29 | Production of ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04303695A true JPH04303695A (en) | 1992-10-27 |
Family
ID=14091745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3093773A Pending JPH04303695A (en) | 1991-03-29 | 1991-03-29 | Production of ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04303695A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100810441B1 (en) * | 2006-02-03 | 2008-03-07 | 비아이 이엠티 주식회사 | Injection Mold for Multi Media Card Case |
| JP2013127772A (en) * | 2011-11-16 | 2013-06-27 | Sharp Corp | Optical pointing device and electronic device including the same |
| JP6145807B1 (en) * | 2016-07-27 | 2017-06-14 | 株式会社マーケテック | Equipment with built-in electronic equipment |
| JP6175699B1 (en) * | 2017-02-22 | 2017-08-09 | 株式会社マーケテック | Equipment with built-in electronic equipment |
-
1991
- 1991-03-29 JP JP3093773A patent/JPH04303695A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100810441B1 (en) * | 2006-02-03 | 2008-03-07 | 비아이 이엠티 주식회사 | Injection Mold for Multi Media Card Case |
| JP2013127772A (en) * | 2011-11-16 | 2013-06-27 | Sharp Corp | Optical pointing device and electronic device including the same |
| JP6145807B1 (en) * | 2016-07-27 | 2017-06-14 | 株式会社マーケテック | Equipment with built-in electronic equipment |
| JP6175699B1 (en) * | 2017-02-22 | 2017-08-09 | 株式会社マーケテック | Equipment with built-in electronic equipment |
| JP2018019060A (en) * | 2017-02-22 | 2018-02-01 | 株式会社マーケテック | Object with build-in electronic apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20000711 |