JPH0214193A - Ic card and manufacture thereof - Google Patents
Ic card and manufacture thereofInfo
- Publication number
- JPH0214193A JPH0214193A JP63164591A JP16459188A JPH0214193A JP H0214193 A JPH0214193 A JP H0214193A JP 63164591 A JP63164591 A JP 63164591A JP 16459188 A JP16459188 A JP 16459188A JP H0214193 A JPH0214193 A JP H0214193A
- Authority
- JP
- Japan
- Prior art keywords
- card
- injection molding
- mold
- resin
- mounting board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 238000001746 injection moulding Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 13
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 13
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000002265 prevention Effects 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 239000010432 diamond Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 abstract description 3
- 239000007767 bonding agent Substances 0.000 abstract 3
- 230000015556 catabolic process Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 8
- 238000000465 moulding Methods 0.000 description 5
- 230000006355 external stress Effects 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013523 data management Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
- B29C2045/14532—Joining articles or parts of a single article injecting between two sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
この発明は、成形時に実装基板に搭載された電子部品を
破損することなく、またソリの生じないＩＣカードとそ
の製造方法に関するものである。The present invention relates to an IC card that does not damage electronic components mounted on a mounting board during molding and that does not cause warping, and a method for manufacturing the same.
ＩＣカードとは、クレジットカードや１艮行カードなど
、ストライプ状の磁気記録層に所有者コードや特定暗号
情報などが磁気記録されたいわゆる磁気カードに代わる
ものとして、カード本体に外部からの入力信号に応して
動作し、あらかしめ組み込まれた識別情報を出力するＣ
ＰＵやＲＡＭなどで構成されたＩＣモジュールを内蔵し
たもの、あるいはフロッピーディスクに代わってファイ
ル管理やデータ管理・ゲームソフトなど外部記憶装置と
して使用されるもの、あるいはプログラムカードとして
ＩＣチップをプリント回路基板に実装してパンケージ化
されたものなどがある。その外観はカード状であり、接
点を露出したものあるいは電！ｆｆ誘導などでデータの
人出力を行う無接点のものもある。
このようなＩＣカードの製造方法は、第６図に示すよう
に、カード基板３１の凹部３２にＩＣモジュール３３を
収納し、絶縁基板３４を接着剤によりカード基板３１に
接着して該カード基板３１の表裏両面を外装フィルム３
５で覆うという方法であった。
この方法では、気密性を保ちＩＣモジュールの飛び出し
を防止するために、カード基板の凹部３２とＩＣモジュ
ール３３および絶縁基板３４のサイズを非常に精度よく
仕上げる必要がある。しかし、その製造は非常に困難で
あるため、通常は凹部３２のＩｃモジュール３３との空
隙部に接着剤を充填したりしている。しかし、充填する
接着剤が少なすぎると、Ｉｃモジュール３３にガタが生
じたり、気密性が悪くなったり、ＩＣモジュールが飛び
出したりし、また接着剤が多すぎてはみ出したりして適
量に管理するのが非常に困難であるとともに、耐久性や
気密性の点でも決し℃満足の得られるものではなかった
。
このような問題点を解決する方法として、近年第７〜８
図に示すように、射出成形法を利用する製造方法がある
。ＩＣモジュール４０やＩＣなどの部品が搭載されたプ
リント基板３７を真空吸引や金型内に設けられたガイド
ピン３９などで金型３６内に固定し、次いで熱可塑性樹
脂を金型３６内に射出してカード化する方法が考案され
ている。An IC card is an alternative to a so-called magnetic card, such as a credit card or a credit card, in which the owner code and specific cryptographic information are magnetically recorded on a striped magnetic recording layer. C that operates according to the information and outputs the roughly incorporated identification information.
A device with a built-in IC module composed of PU or RAM, or a device used as an external storage device for file management, data management, game software, etc. in place of a floppy disk, or a program card with an IC chip mounted on a printed circuit board. There are some that have been implemented and panpackaged. Its appearance is card-like, with exposed contacts or electrical contacts. There are also non-contact types that perform human output of data such as ff guidance. As shown in FIG. 6, the method for manufacturing such an IC card involves storing an IC module 33 in a recess 32 of a card substrate 31, bonding an insulating substrate 34 to the card substrate 31 with an adhesive, and attaching the card substrate 31 to the card substrate 31. Exterior film 3 on both the front and back sides of
The method was to cover it with 5. In this method, in order to maintain airtightness and prevent the IC module from popping out, it is necessary to finish the recess 32 of the card substrate, the IC module 33, and the insulating substrate 34 with great precision. However, since it is very difficult to manufacture, the gap between the recess 32 and the Ic module 33 is usually filled with an adhesive. However, if too little adhesive is filled, the IC module 33 may become loose, the airtightness may deteriorate, or the IC module may pop out. Also, too much adhesive may protrude, making it difficult to manage the appropriate amount. It is extremely difficult to do so, and it has never been possible to obtain satisfactory temperatures in terms of durability and airtightness. In recent years, as a method to solve these problems, the 7th and 8th
As shown in the figure, there is a manufacturing method using injection molding. The printed circuit board 37 on which components such as the IC module 40 and IC are mounted is fixed in the mold 36 using vacuum suction or guide pins 39 provided in the mold, and then thermoplastic resin is injected into the mold 36. A method has been devised to convert them into cards.
しかし、射出成形法もまた次のような欠点を有している
。すなわち、ＩＣなどの部品が実装されたプリント基板
と射出成形された熱可塑性樹脂との収縮率の差によりＩ
Ｃカードにソリが発生することである。
また、ＩＣカードに熱や外力がかかった時、成形樹脂を
通じて、密封された電子部品に直接負荷がかかり、ハン
ダ剥がれや、回路断線、電子部品破損などの問題があっ
た。また成形時の溶融樹脂の圧力で実装された電子部品
が破損されるなどの問題もあった。
この発明の目的は以上のような問題点を解決し、実装基
板に搭載された電子部品が破損されることなく射出成形
でき、ソリを生じないＩＣカードの製造方法と外的応力
に強い信鯨性の高いＩＣカードを提供することにある。However, the injection molding method also has the following drawbacks. In other words, I
This is the occurrence of warpage on the C card. Furthermore, when heat or external force is applied to the IC card, the load is applied directly to the sealed electronic components through the molded resin, causing problems such as solder peeling, circuit breakage, and damage to the electronic components. There was also the problem that mounted electronic components were damaged by the pressure of the molten resin during molding. The purpose of this invention is to solve the above-mentioned problems, and to provide a method for manufacturing an IC card that can be injection molded without damaging the electronic components mounted on the mounting board, and that does not cause warping, and a method for manufacturing an IC card that is resistant to external stress. Our goal is to provide highly functional IC cards.
この発明は、以上の目的を達成するために、次のように
構成した。すなわちこの発明のＩｃカードは、電子部品
が搭載された実装基板と歪防止板との間に、熱可塑性接
着剤を介して射出成形樹脂からなるカード基材が射出成
形法にて実装基板と歪防止板と一体化されて形成される
ように構成した。
また、この発明のＩｃカードの製造方法は、電子部品が
搭載された実装基板の射出成形樹脂と接する面に熱可塑
性接着剤を塗布し、この実装基板を金型内の片面に設置
し、また歪防止板の射出成形樹脂と接する面に熱可塑性
接着剤を塗布し、この歪防止板を金型内の他方の面に設
置し、金型内に射出成形樹脂を射出成形してカード基材
を形成し、カード基材と実装基板と歪防止板とを一体化
するように構成した。
図面を参照しながらこの発明をさらに詳細に説明する。
第１図はこの発明のＩＣカードの製造方法の一実施例を
示す断面図である。１は金型、２は実装基板、３は歪防
止板、４は射出成形樹脂、５はカード基材、６は熱可塑
性接着剤である。
実装基板２としては、電子部品が表面実装されたプリン
ト基板を用いる。
歪防止板３としては、実装基板２の基板の線膨張係数と
近値し、曲げ強度が大きいものを用いる。
その材質としては、ガラス−エポキシ板や祇−フェノー
ル板、また銅張積Ｊ！板などを使用する。
実装基板２と歪防止板３には射出成形樹脂４によく密着
するように、あらかじめ熱可塑性の接着剤ｆ６を塗布す
る。熱可塑性樹脂剤６は、ウレタン樹脂などの弾性を有
するものが望ましい、これは、射出成形時の溶融樹脂が
、電子部品に及ぼす熱圧を緩和するためと、カード化し
た後に外的応力が直接電子部品にかかるのを防ぐためで
ある。
次に、上記した実装基板２を金型ｌの片面に設置する。
その方法としては、金型ｌに位置決め用ビンを立てたり
、真空吸引により金型ｌに固定すればよい、また、離形
性を有するキャリヤーフィルムに実装基板２を固定した
状態で設置してもよい。
また、歪防止板３も実装基板２と同様に真空吸引などに
より金型１の他方の面に設置する。
次いで、金型ｌの型締めに続いて射出成形樹脂４を射出
してカード基材５を形成する。
射出成形樹脂４は、通常の射出成形用の熱可塑性樹脂で
よい、射出成形後、射出成形樹脂４は収縮するが、実装
基板２と歪防止板３にサンドイッチされ、両側からつっ
ばられるため、ソリは発生しない、また、歪防止板３に
碁盤目状のスリットやダイヤカントを入れることにより
、射出成形時にゲートから流れ込む射出成形樹脂４の圧
力を分散させることができる。さらに、その凹凸に射出
成形樹脂が食い込み、歪防止板３と射出成形樹脂４の密
着力がより強固になる。
さらに、成形品の両面に化粧用ラミネートフィルム２６
を貼り付け、ＩＣカード２７を得る（第４〜５図参照）
。In order to achieve the above object, the present invention is configured as follows. That is, in the IC card of the present invention, a card base material made of injection molded resin is placed between a mounting board on which electronic components are mounted and a distortion prevention plate through a thermoplastic adhesive. It is configured to be formed integrally with the prevention plate. In addition, the method for manufacturing an IC card of the present invention includes applying a thermoplastic adhesive to the surface of a mounting board on which electronic components is mounted that will be in contact with the injection molding resin, and placing the mounting board on one side of the mold. A thermoplastic adhesive is applied to the surface of the distortion prevention plate that will be in contact with the injection molding resin, this distortion prevention plate is installed on the other surface in the mold, and the injection molding resin is injected into the mold to form the card base material. was formed, and the card base material, the mounting board, and the distortion prevention plate were configured to be integrated. The invention will be explained in more detail with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of the method for manufacturing an IC card of the present invention. 1 is a mold, 2 is a mounting board, 3 is a distortion prevention plate, 4 is an injection molded resin, 5 is a card base material, and 6 is a thermoplastic adhesive. As the mounting board 2, a printed board on which electronic components are surface mounted is used. As the strain prevention plate 3, one having a coefficient of linear expansion close to that of the substrate of the mounting board 2 and a large bending strength is used. Its materials include glass-epoxy board, phenolic board, and copper-clad J! Use a board etc. A thermoplastic adhesive f6 is applied in advance to the mounting board 2 and the distortion prevention plate 3 so as to adhere well to the injection molding resin 4. The thermoplastic resin agent 6 is preferably one with elasticity, such as urethane resin. This is because the molten resin during injection molding relieves the heat pressure exerted on the electronic components, and also because the external stress is not directly applied to the electronic components after they are made into cards. This is to prevent it from getting on electronic parts. Next, the above-mentioned mounting board 2 is placed on one side of the mold l. This can be done by setting a positioning bottle on the mold l, or by fixing it to the mold l by vacuum suction, or by installing the mounting board 2 fixed on a carrier film with mold release properties. good. Further, like the mounting board 2, the distortion prevention plate 3 is also installed on the other surface of the mold 1 by vacuum suction or the like. Next, after the mold 1 is clamped, the injection molding resin 4 is injected to form the card base material 5. The injection molding resin 4 may be a normal thermoplastic resin for injection molding. Although the injection molding resin 4 contracts after injection molding, it is sandwiched between the mounting board 2 and the distortion prevention plate 3 and is stretched from both sides. Warpage does not occur, and by providing the distortion prevention plate 3 with slits or diamonds in a checkerboard pattern, the pressure of the injection molding resin 4 flowing from the gate during injection molding can be dispersed. Furthermore, the injection molded resin bites into the unevenness, and the adhesion between the distortion prevention plate 3 and the injection molded resin 4 becomes stronger. Furthermore, a decorative laminating film 26 is applied to both sides of the molded product.
Paste it to obtain an IC card 27 (see Figures 4 and 5).
.
電子部品が表面実装されたプリント基板にあらかじめ弾
性を有するウレタン樹脂系の接着剤をコーチインクし、
続いてこの実装基板を金型の片面に設置した。
金型には実装基板を位置決めするためと成形時の樹脂圧
で位置ズレを起こさないためのビンを設けた。また、電
子部品を表面実装する際に発生した実装基板のソリを補
正し、金型に完全に密着設置できるように真空唆引孔を
設けた。
また、碁盤目状のスリットを射出成形樹脂と接する面に
有する歪防止仮に、あらかじめ上記したウレタン系接着
剤をコーティングし、続いてこの歪防止仮を金型内の実
装基板を設置した面と反対面に真空吸引により設置した
。
その後、金型を閉じＡＢＳ樹脂を下記の条件で射出して
カード基材を形成した。
射出成形機 ６オンスノズル温度
２４０”Ｃ金型温度
４０’Ｃ射出速度
６０％射出圧力 ３５０ｋ
ｇ７ｃｍ’冷却固化後金型を開き、成形品を取り出し、
成形品の表裏面に加飾されたラベルを貼り、接触端子を
持たないｔｍ誘導型のＩＣカードを得た。
このＩＣカードは、歪防止板をインサートし、射出成形
により電子部品が搭載された実装基板を封止しているの
で、成形時の溶融樹脂の圧力を分散し電子部品の破損が
なく、ソリのないものであった。また、気密性、電気特
性にも優れ、外的応力にも強い信頼性の高いものであっ
た。Coach ink an elastic urethane resin adhesive onto the printed circuit board on which electronic components are surface-mounted.
Next, this mounting board was placed on one side of the mold. The mold was equipped with a bin to position the mounting board and to prevent it from shifting due to resin pressure during molding. In addition, we have created a vacuum guide hole to correct the warping of the mounting board that occurs when surface mounting electronic components, and to allow it to be installed in perfect contact with the mold. In addition, a distortion prevention temporary having checkerboard-shaped slits on the surface that contacts the injection molded resin is coated with the above-mentioned urethane adhesive in advance, and then this distortion prevention temporary is coated on the side of the mold opposite to the surface on which the mounting board is installed. It was placed on the surface by vacuum suction. Thereafter, the mold was closed and ABS resin was injected under the following conditions to form a card base material. Injection molding machine 6oz nozzle temperature
240”C mold temperature
40'C injection speed
60% injection pressure 350k
g7cm' After cooling and solidifying, open the mold and take out the molded product.
A TM induction type IC card without contact terminals was obtained by pasting decorated labels on the front and back surfaces of the molded product. This IC card inserts a distortion prevention plate and seals the mounting board on which electronic components are mounted by injection molding, which disperses the pressure of molten resin during molding, prevents damage to electronic components, and prevents warping. It was something that didn't exist. It also had excellent airtightness and electrical properties, and was highly reliable and resistant to external stress.
この発明は、ＩＣカードにおけるカード基材となる射出
成形樹脂プラスチック基体を射出成形する際、実装基板
を金型内の片面に設置し、かつ金型内の反対側の面に歪
防止板を設置し、金型内に熱可塑性樹脂を射出成形して
実装基板と歪防止板と一体化したものであるので、成形
時の溶融樹脂の熱圧で破損されることなく、ソリの無い
ものである。また、気密性、電気特性にも優れ、外的応
力にも強い信鯨性の高いＩＣカードとなる。また、その
製造方法も容易である。This invention involves installing a mounting board on one side of the mold and installing a distortion prevention plate on the opposite side of the mold when injection molding an injection molded resin plastic base that becomes a card base material in an IC card. However, since the thermoplastic resin is injection molded into the mold and integrated with the mounting board and the distortion prevention plate, it will not be damaged by the heat pressure of the molten resin during molding and will not warp. . In addition, the IC card has excellent airtightness and electrical properties, and is resistant to external stress and has high reliability. Moreover, the manufacturing method thereof is also easy.
第１・２・４図はこの発明のＩＣカードの一実施例を示
す断面図である。第３・５図はこの発明によって製造さ
れたＩＣカードの一実施例を示す断面図である。第６〜
８図は従来のＩＣカードの製造方法の一実施例を示す断
面図である。
■・・・金型、２・・・実装基板、３・・・歪防止板、
４・・・射出成形樹脂、５・・・カード基材、６・・・
熱可塑性接着剤。
特許出願人 日本写真印刷株式会社
韮 樽
コ弦 ４１− 檄
翠薯遂堵幼
埒揖傷−環
第
図
第
冊
第
図
第
区
第
図1, 2, and 4 are cross-sectional views showing one embodiment of the IC card of the present invention. 3 and 5 are cross-sectional views showing one embodiment of an IC card manufactured according to the present invention. 6th~
FIG. 8 is a sectional view showing an example of a conventional IC card manufacturing method. ■... Mold, 2... Mounting board, 3... Distortion prevention plate,
4... Injection molding resin, 5... Card base material, 6...
Thermoplastic adhesive. Patent Applicant: Nissha Printing Co., Ltd. Taruko Gen 41- 檄翠薯讯とよ埒叏取- 眄子囯 vol.
Claims (1)
３）との間に、熱可塑性接着剤（６）を介して射出成形
樹脂（４）からなるカード基材（５）が射出成形法にて
実装基板（２）と歪防止板（３）と一体化されて形成さ
れていることを特徴とするＩＣカード。 ２、歪防止板（３）が、射出成形樹脂（４）と接する面
に碁盤目状のスリットあるいはダイヤカット形状の凹凸
を有するものである請求項１記載のＩＣカード。 ３、熱可塑性接着剤（６）が、弾性を有するものである
請求項１記載のＩＣカード。 ４、電子部品が搭載された実装基板（２）の射出成形樹
脂（４）と接する面に熱可塑性接着剤（６）を塗布し、
この実装基板（２）を金型（１）内の片面に設置し、ま
た歪防止板（３）の射出成形樹脂（４）と接する面に熱
可塑性接着剤（６）を塗布し、この歪防止板（３）を金
型（１）内の他方の面に設置し、金型（１）内に射出成
形樹脂（４）を射出成形してカード基材（５）を形成し
、カード基材（５）と実装基板（２）と歪防止板（３）
とを一体化することを特徴とするＩＣカードの製造方法
。[Claims] 1. A mounting board (2) on which electronic components are mounted and a distortion prevention plate (
3), a card base material (5) made of injection molded resin (4) is inserted between the mounting board (2) and the anti-distortion plate (3) by injection molding via a thermoplastic adhesive (6). An IC card characterized by being formed in an integrated manner. 2. The IC card according to claim 1, wherein the distortion prevention plate (3) has checkerboard-shaped slits or diamond cut-shaped irregularities on the surface in contact with the injection molded resin (4). 3. The IC card according to claim 1, wherein the thermoplastic adhesive (6) has elasticity. 4. Apply thermoplastic adhesive (6) to the surface of the mounting board (2) on which electronic components are mounted that will be in contact with the injection molded resin (4),
This mounting board (2) is placed on one side inside the mold (1), and a thermoplastic adhesive (6) is applied to the surface of the distortion prevention plate (3) that will be in contact with the injection molded resin (4). A prevention plate (3) is installed on the other side of the mold (1), and an injection molding resin (4) is injected into the mold (1) to form a card base material (5). material (5), mounting board (2), and distortion prevention plate (3)
A method for manufacturing an IC card, characterized by integrating the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63164591A JPH0214193A (en) | 1988-06-30 | 1988-06-30 | Ic card and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63164591A JPH0214193A (en) | 1988-06-30 | 1988-06-30 | Ic card and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0214193A true JPH0214193A (en) | 1990-01-18 |
Family
ID=15796092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63164591A Pending JPH0214193A (en) | 1988-06-30 | 1988-06-30 | Ic card and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0214193A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2684803A1 (en) * | 1991-12-04 | 1993-06-11 | Gemplus Card Int | Package with reinforced structure for an integrated circuit, and card comprising such a package |
| WO1997042655A1 (en) * | 1996-05-06 | 1997-11-13 | Siemens Aktiengesellschaft | Carrier with at least one integrated printed circuit and process for producing the same |
| JP2002288619A (en) * | 2001-03-26 | 2002-10-04 | Hitachi Cable Ltd | Manufacturing method for ic card |
| JP2009059287A (en) * | 2007-09-03 | 2009-03-19 | Mitsubishi Electric Corp | Method for manufacturing rfid tag |
| JP2017204494A (en) * | 2016-05-09 | 2017-11-16 | オリンパス株式会社 | Electronic substrate for medical equipment |
| US20180341789A1 (en) * | 2017-05-23 | 2018-11-29 | Fiteq, Inc. | Process for Pick and Place of Electronic Components in a Vacuum |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6086850A (en) * | 1983-10-18 | 1985-05-16 | Dainippon Printing Co Ltd | Ic card |
| JPS61222715A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
| JPS61222713A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
-
1988
- 1988-06-30 JP JP63164591A patent/JPH0214193A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6086850A (en) * | 1983-10-18 | 1985-05-16 | Dainippon Printing Co Ltd | Ic card |
| JPS61222715A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
| JPS61222713A (en) * | 1985-03-28 | 1986-10-03 | Mitsubishi Electric Corp | Manufacture of resin molded body |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2684803A1 (en) * | 1991-12-04 | 1993-06-11 | Gemplus Card Int | Package with reinforced structure for an integrated circuit, and card comprising such a package |
| WO1997042655A1 (en) * | 1996-05-06 | 1997-11-13 | Siemens Aktiengesellschaft | Carrier with at least one integrated printed circuit and process for producing the same |
| JP2002288619A (en) * | 2001-03-26 | 2002-10-04 | Hitachi Cable Ltd | Manufacturing method for ic card |
| JP4706117B2 (en) * | 2001-03-26 | 2011-06-22 | 凸版印刷株式会社 | IC card manufacturing method |
| JP2009059287A (en) * | 2007-09-03 | 2009-03-19 | Mitsubishi Electric Corp | Method for manufacturing rfid tag |
| JP2017204494A (en) * | 2016-05-09 | 2017-11-16 | オリンパス株式会社 | Electronic substrate for medical equipment |
| US20180341789A1 (en) * | 2017-05-23 | 2018-11-29 | Fiteq, Inc. | Process for Pick and Place of Electronic Components in a Vacuum |
| US11537758B2 (en) * | 2017-05-23 | 2022-12-27 | Fiteq, Inc. | Process for pick and place of electronic components in a vacuum |
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