JPS61222713A - Manufacture of resin molded body - Google Patents

Abstract

PURPOSE:To easily manufacture a resin molded body having boards strongly integrated with resin substrate on both sides of the resin substrate by a method wherein resin is injected in a mold after the boards are set in the respective upper and lower halves of the mold. CONSTITUTION:Taking an IC card as an example, firstly, IC modules 10 are mounted on printed circuit boards (PCB) 21 and 22, which are, after that, respectively set in the halves 11 and 12 of a mold. Secondly, resin is injected in order to form a card substrate 13 and at the same time to strongly make said substrate and both PCB's 21 and 22 into an integral body. Finally, decorative laminate 5a and 5b are pasted on both the sides of PCB's. As compared with the case that the substrate and the boards are bonded with bonding agent, no gap develops at the fitted part and much stronger integration is realized. The above-mentioned manufacture is suitable for the manufacture of IC cards and the like.

Description

[Detailed description of the invention] [Industrial application field].

The present invention relates to a method for manufacturing a resin molded body having substrates on both sides of a resin base.

[Conventional technology]

Hereinafter, an IC card will be explained as an example of the resin molded body. Here, an IC card is used in place of a conventional cash card with a magnetic stripe, etc., and has a memory IC, CPU, and other semiconductor pieces built into the base of the card, and has a conventional magnetic stripe. In addition to being able to have a storage capacity several orders of magnitude higher than that of an attached card, it can also be provided with arbitrary arithmetic functions.

Figure 2 is a cross-sectional diagram of such an IC card.
In the figure, 6 is a card base formed by molding resin such as vinyl chloride, 21.22 is a printed circuit board (hereinafter referred to as PCB) arranged on both sides of this card base 6, and 10 is a printed circuit board (hereinafter referred to as PCB) disposed on both sides of this card base 6. This is the IG module that is fixed to the IC chip 1 such as the memory IJIc and the CPU.
．． Wiring 3. and a precoat section 4 for sealing the IC chip 1 and the wiring 3 with resin. Hereinafter, this IC module 10 and the PCB 21.22 to which it is fixed will be referred to as an IC module attached PCB 21.22.

5a and 5b are laminate films formed on the outer surface of this PCB21.22(7).

Next, a conventional method for manufacturing the above-mentioned IC card will be explained with reference to FIG. First, as shown in FIG. 3(a), the PCB 21
．． The IC chip 1 and the like are mounted on 22 and precoated with epoxy resin or the like to form the IC module 10. On the other hand, as shown in Figure 3), the above I
A card base 6 having recesses 6a and 6b in which the C module 10 is housed is formed by injection molding. Then, the IC module 10 is fitted into the recesses 6a and 6b of the card base 6, and the PCBs 21 and 22 are adhered to both sides of the base 6 to form an IC card as shown in FIG.

[Problem that the invention seeks to solve]

However, in the conventional IC card manufacturing method as described above, the IC module 10 and the base 6 are separated in such a way that there is no gap between the mating parts of the two, and there are no irregularities on the surface.
It is necessary to finish each of these with high precision, and manufacturing is difficult. In particular, it is very difficult to manufacture the precoat portion 4 of the IC module 10 into a desired shape, and therefore there is a problem in that it is not possible to obtain highly accurate IC cards using conventional manufacturing methods.

Furthermore, in the conventional manufacturing method, PCB with IC module
2L, 22 and the card base 6 are bonded together using an adhesive sheet, which has low adhesive strength and poor durability. Further, when the two are bonded together, if a gap is created in the fitting portion, water or the like may enter through the gap and the bonded portion may peel off, resulting in a problem that the reliability of the card is low.

This invention has been made in view of the above points, and it is possible to manufacture resin molded products such as IC cards much more easily than before, and to obtain highly reliable resin molded products. The purpose is to provide a manufacturing method for.

[Means for solving problems]

The method for manufacturing a mountain fat molded body according to the present invention is described above.

A substrate is placed on each of the surfaces of the lower mold, and a resin is injected into the mold to integrally mold the substrate with the resin.

[Effect]

In this invention, when injection molding a resin base, a fixed board such as an IC module is placed in the mold, so the board is integrally molded, and the step of bonding the resin base and the board is required. In addition to being omitted, it is no longer necessary to finish the shape of the fitting part of both to a high degree of precision as in the past.
Moreover, the adhesive strength between the two is increased.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a method for manufacturing a resin molded article according to an embodiment of the present invention, and the method of this embodiment is as follows. In the production of IC cards having printed circuit boards on both sides of the base, when the card base is injection molded, a PCB with an IC module is installed on each of the lower mold surfaces, and the PCBs are integrally molded. This is how it was done.

Here, an apparatus for realizing the manufacturing method of this embodiment will be briefly explained using FIG. 1.

In FIG. 1(a), 11 and 12 are the recesses 11, respectively.
a, 12a are formed in the upper mold and the lower mold, and when the two molds 11, 12 are brought together, both the recesses 11a,
12a forms a space having the same shape as the card base 13 (see FIG. 1(b)). Both of the molds 11 and 12 have holes 11b and 1 for adsorbing the PCB.
2b are provided, and these suction holes 11b, 1
2b is connected to a vacuum pump (not shown). Note that 14 is an injection port into which resin for card base molding is injected.

Next, the method for manufacturing the IC card of this embodiment is shown in FIG.
(This will be explained in more detail according to C1.

First, as shown in FIG. 1(a), an IC module 10
The fixed PCBs 21 and 22 are placed in the upper mold 11, respectively.
．． The PCBs 21 and 22 are placed in the lower mold 12, and the vacuum pump is operated to suction and fix the PCBs 21 and 22 through the suction holes 11b and 12b. In this state, as shown in Figure 1), the upper mold 1
1 and a lower mold 12, resin is injected into the mold from the injection port 14 using a plunger (not shown), and the PCB 21, 22 with the IC module 10 is integrally molded with the resin. That is, the PCB 21, 22 with the rc module and the card base 13 are integrally molded in one shot.

After a predetermined period of time, the mold is separated and the integrally molded blown card base 13 is taken out, and a decorative laminate film 5a, as shown in FIG.
Attach 5b.

According to this embodiment, the PCBs 21 and 22 are set in a mold and made into a card by injection molding in one shot, so the process of bonding the PCB and card board in the conventional manufacturing method is omitted. can do. Moreover, according to such integral molding, even if there is a dimensional error in the IC module 10, it can be covered by the resin, and therefore, the dimensions of the IC module 10 and the canid base 13 (mold) can be adjusted with high precision as in the conventional case. There is no need to completely control the thickness of the IC module 10, and it is only necessary to manage the thickness of the IC module 10 so that it is within the thickness of the card base 13.In particular, since the dimensions of the pre-coated portion 4 of the IC module 10 do not require precision, the manufacturing process is faster than before. This becomes extremely easy, and a significant cost reduction can be achieved.

In addition, with this manufacturing method, the adhesive strength between the PCB 21, 22 and the base 6 is greater than that of conventional adhesive sheets, and there is no formation of a dark area at the fitting part of the two, and there is no unevenness on the surface. The reliability of the card is significantly improved compared to conventional cards.

In addition, in the conventional device, if the shape of the IC module 10 differs, it is necessary to change the shape of the card base 13, that is, the mold, but in this embodiment, all IC cards are common as long as the shape of the entire IC card is not changed. It can be manufactured using a mold.

Furthermore, in this embodiment, the PCB 2 is provided on both sides of the card base 13.
1.22 is integrally molded, so the card base 13 and PCB
Even if there is a difference in the coefficient of thermal expansion with 21.22,
After molding, "warpage" does not occur due to thermal expansion and contraction, and an IC card with high precision can be obtained for a long period of time.

In addition, although the above embodiment describes the case where the present invention is applied to a method for manufacturing an IC card, the present invention can be applied to all methods for manufacturing a resin molded body having substrates on both sides of a resin base. be.

〔Effect of the invention〕

As described above, according to the present invention, in the method for manufacturing a resin molded article having substrates on both sides within a resin base, a substrate is installed in each of the upper mold and the lower mold, and the substrate is placed inside the mold. The resin is injected into the resin and the substrate is integrally molded with the resin.This makes manufacturing much easier than in the past, and increases the adhesive strength between the base and the substrate. This has the effect of significantly improving reliability.

[BRIEF DESCRIPTION OF THE DRAWINGS] Figure 1+8) or C) is an I according to an embodiment of the present invention.
FIG. 2 is a diagram for explaining the manufacturing method of a C card, and FIG. 3(a) is a cross-sectional configuration diagram of a general IC card. (bl is a diagram for explaining the conventional IC card manufacturing method. 10... IC module, 11... Upper mold, 12...
...Lower mold, 13...Card base, 21.22...
Printed circuit board (PCB). Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] (1) A method for producing a resin molded body having substrates on both sides of a resin base, the substrates being placed on each of the upper and lower mold surfaces, and resin being injected into the mold. A method for manufacturing a resin molded body, comprising integrally molding the substrate with the resin.