JPS6230012A - Manufacture of resin molding - Google Patents

Abstract

PURPOSE:To provide an easier process of resin molding and better reliability for the products by setting a basic plate with the movable positioning pins inserted into the through-holes in the specified position inside the mold and pushing down the pins just before the completion of injection molding to achieve an integrated molding. CONSTITUTION:PCB2 with IC module is placed in the specified position of lower mold 12 with the movable pin 15 inserted into the through hole 2a of PCB2. Since the movable pin 15 is pressed by the specified pressure with the spring 16, the printing base plate with IC module (PCB)2 is stationed in the specified position in the mold during the initial period of injection molding. Just before the completion of injection molding, the pressure inside the mold is raised up to actuate the spring 16 and push the movable pins 15 down to the same level of the surface of lower mold 12 until the pins hit the stoppers 17 and stop. Thus the resin is filled into the through holes 2a of PCB2 in which the movable pins 15 was inserted before being pushed down to achieve an integrated molding of PCB2 with IC module.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a resin molded body having a substrate on one side of a resin base.

[Conventional technology]

Hereinafter, an IC card will be explained as an example of the resin molded body. Here, IC cards are used in place of conventional cash cards with magnetic stripes, etc., and have memory ICs, CPUs, and other semiconductor pieces built into the base of the card, and are more sophisticated than conventional cards with magnetic stripes. In addition to being able to have a large storage capacity of several digits or more, it can also be provided with arbitrary arithmetic functions.

FIG. 2 is a cross-sectional configuration diagram showing the main parts of such an IC card. In the figure, 6 is a card base made of resin such as vinyl chloride, and 2 is a print housed in this card base 6. Board (hereinafter referred to as PCB), 10 is this P
'This is an IC module fixed on the CBZ, which includes IC chips such as memory IC and CPU. Wiring 3. and a precoat part 4 for fixing the ICC chip and the wiring 3 on the resin. Below, this IC module 10
and PCB2 to which this is fixed to a PC with an IC module.
It is written as B2. Further, 5a and 5b are laminated films formed on both sides of the card base 6, and 7 is a contact portion with a card reader.

Next, a conventional method for manufacturing the above-mentioned IC card will be explained with reference to FIG. First, as shown in FIG. 3fa), IC' chips 1 and the like are mounted on a PCBZ, and these are precoated with epoxy resin or the like to form an IC module 10. On the other hand, as shown in FIG. 3('b), a card base 6 has a recess 6a in which the IC module attached PCB 2 is housed.
is formed by injection molding. Then, the IC module 10 is fitted into the recess 6a of the card base 6, and the two are pressed and bonded together to form an IC card as shown in FIG.

[Problem that the invention seeks to solve]

However, in the conventional IC card manufacturing method as described above, in order to improve the accuracy of the card thickness, it is necessary to
It is necessary to finish each of the PCB 2 and the base 6 with high precision so that no gaps or uneven surfaces occur at the fitting portion between the PCB 2 and the base 6, and manufacturing thereof is difficult. In particular, it is very difficult to form the precoat portion 4 of the IC module 10 into a desired shape and size, and therefore, there is a problem in that it is not possible to obtain a highly accurate IC card using conventional manufacturing methods.

Furthermore, in the conventional manufacturing method, PCB2 with IC module
and the card base 6 are bonded together using an adhesive sheet, which has low adhesive strength and poor durability. Also, if there is a gap in the mating part when both sides are glued together, water etc. may enter through there and the bonded part may peel off.
There was a problem that the reliability of the card was low.

This invention has been made in view of the above points, and it is possible to manufacture resin molded products such as IC cards much more easily than before, and to obtain highly reliable resin molded products. The purpose is to provide a manufacturing method for.

[Means for solving problems]

The method for manufacturing a resin molded article according to the present invention includes providing a movable pin for positioning in a mold, inserting the movable pin into a through hole of a substrate to set the substrate at a predetermined position in the mold, and In this method, resin is injected into the mold, and when the mold is almost filled with the resin, the movable pin is retracted and the substrate is integrally molded with the resin.

[Effect]

In this invention, when injection molding a resin substrate such as a card substrate in an IC card, the substrate is installed in the mold and molded integrally, so there is no need to finish both with high precision as in the past. Moreover, the resin base and the substrate are firmly bonded without an adhesive process, and furthermore, when installing the substrate in the mold, positioning is performed using movable pins in the mold and through holes in the substrate, so it is easy to do. The board is set with high precision.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a method for manufacturing a resin molded body according to an embodiment of the present invention. In the method of this embodiment, when a card base is injection molded in the production of an IC card, an IC is placed in the mold.
A PCB with a module is installed in advance, and the cough PCB is integrally molded.

Here, an apparatus for realizing the manufacturing method of this embodiment will be briefly explained using FIG. 1.

1), 11.12 is an upper mold and a lower mold in which recesses 11a and 12a are formed in the center of each mold, and when the molds 11.12 are brought together, both recesses A space having the same shape as the card base 13 is formed by 11a and 12a. The lower mold 12 is provided with a plurality of positioning movable pins 15 that can be freely retracted and retracted from the position where the IC module attached PCB 2 is placed. It protrudes into the mold by approximately the same amount as the thickness of PCB2. Further, a through hole 2a through which the movable pin 15 is inserted is formed in the PCB 2. Note that 14 is an injection port through which resin for molding the card base is injected, and 17 is a stopper for the movable pin 15.

Next, the manufacturing method of this example will be explained in detail according to FIGS.

First, as shown in FIG. 1(a),
The CB2 is placed at a predetermined position on the lower mold 12 so that the movable pin 15 enters the through hole 2a of the PCB2. In this state, as shown in Fig. 1), the upper mold 11 and the lower mold 1
2 are molded together, and resin is injected into the mold from the injection port 14 using a plunger (not shown), and the PCB 2 with the IC module is integrally molded with the resin.

At this time, since the movable pin 15 is pressed by a predetermined pressure by the spring 16, it remains in the position shown in FIG. The IC module (-fPcB2) is fixed at a predetermined position in the mold.Just before the injection molding is completed, the mold is almost filled with resin, so the pressure inside the mold increases. The movable pin 15 is moved back against the spring force of the spring 16 to a position where it is flush with the surface of the lower mold 12 corresponding to the surface of the card, as shown in FIG. Therefore, the through hole 2a of the PCB 2, into which the movable pin 15 was inserted, is also filled with resin, and as a result, the PCB with the IC module
2 is integrally molded. Here, just before the injection molding is completed,
Since the mold is filled with resin, the PCB 2 will not move even if the movable pin 15 is moved back, and the PCB
2 will be integrally molded with high precision.

After a predetermined period of time, the mold is separated and the integrally molded card base 13 is taken out, and a decorative laminate film 5a, as shown in FIG.
Attach 5b.

According to this embodiment, the PCB with IC module
2 into a mold and molded into a card in one shot by injection molding, it is possible to firmly bond the two without the gluing process of conventional manufacturing methods, significantly improving the reliability of the card. . Moreover, according to such integral molding, even if there is a dimensional error in the IC module 10, the dimensional error can be covered by the resin, so that the IC module 10 can be
There is no need to make the dimensions of the module and card base 13 (mold) highly accurate; it is only necessary to manage the thickness of the IC module so that it is within the thickness of the card base 13.

Since there is no need for precision in the dimensions of the recoat section 4, its manufacture is much easier than in the past, and costs can be significantly reduced.

Furthermore, in this embodiment, since the lower mold 12 is provided with the movable pin 15, this and the hole 2a of the PCB 2 are used to make the cough Pc.
B2 can be set into the mold easily and with high precision, and external contact terminals and the like will not be displaced.

Furthermore, this movable pin 15 eventually retreats to the mold surface position, and the resin also fills the through hole 2a of the PCB 2, so that its anchor effect connects the PCB 2 and the card base 13.
The adhesive strength between the card and the card will be greater, and the reliability of the card will also be dramatically improved.

In the above embodiment, as a means for retracting the movable pin, a predetermined pressure is applied to the movable pin so that the movable pin is automatically retracted when the pressure inside the mold increases. The means for doing so is not limited to the structure of the above embodiment. That is, for example, the pressure of the plunger that injects the resin may be measured and the movable pin may be moved back when the pressure reaches a predetermined value.Also, the elapsed time from the start of resin injection may be measured. The movable pin may be moved back at a time when the resin is considered to be almost full.

Further, in the above embodiment, the present invention was applied to a method for manufacturing an IC card, but the present invention is applicable to all methods for manufacturing a resin molded body having a substrate on one side of a resin base. be.

〔Effect of the invention〕

As described above, according to the present invention, in the method for manufacturing a resin molded body having a substrate on one surface of a resin base, a movable pin for positioning the substrate is inserted into a through hole of the substrate at a predetermined position in the mold. and install the substrate, inject resin into this mold,
Immediately before the completion of the injection molding, the movable pin is retracted and the substrate is integrally molded with the resin, which makes manufacturing much easier than in the past, and makes the resin molded product easier to manufacture. Reliability can be significantly improved, and the board can be easily set with high precision.

[Brief explanation of drawings]

FIG. 1(a) or C1 is an I according to an embodiment of the present invention.
FIG. 2 is a diagram for explaining the manufacturing method of a C card, and FIG. 3(a) is a cross-sectional configuration diagram of a general IC card. ('0) is a diagram for explaining a conventional IC card manufacturing method. 2... Printed circuit board (PCB), 2a... Through hole, 10... IC module, 11... Upper mold, 12
. . . Lower mold, 13. Card base, 15. Movable bottle, 16. Spring. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] (1) A method for manufacturing a resin molded body having a substrate on one side of a resin base, the substrate having a plurality of positioning through holes, and a positioning movable pin placed at a predetermined position in a mold. The movable pin is inserted into the through hole and installed, and the resin is injected into the mold. When the mold is almost filled with resin, the movable pin is retracted to the mold surface position and the resin is injected into the through hole of the board. A method for manufacturing a resin molded body, characterized in that the substrate is integrally molded with the resin.