JPH03169097A - Manufacture of ceramic multilayer board - Google Patents

Abstract

PURPOSE:In the formation of the counterbored part of a ceramic multilayer board, to form a counterbored part excellent in dimension accuracy by placing a plate material at the counterbored part so that the surface may be a little higher than the surface of a laminate and packaging it in vacuum with a film, and then laminating it. CONSTITUTION:Ceramic sheets 2, which have openings 3 and where circuits are made, are laminated, and ceramic sheets 10, which are the same shapes and the same kinds as the opening 3 of the ceramic laminate 2, and a film 11 fitted with a mold lubricant are placed in the opening 3. At that time, the board materials of the ceramic sheets 10 and the film 11 placed in the opening 3 are placed so that the upsides may be a little higher than the upsides of the ceramic sheets 2. Then, this laminate structure is packaged in vacuum with a film 7, and is laminated by giving temperature and pressure uniformly by a medium 8, and after lamination the board material placed in the opening 3 is removed, thus a counterbored part 3a is made. Hereby, a counterbored part 3a excellent in dimension accuracy can be made cheaply.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method of manufacturing a ceramic multilayer substrate used for electronic devices, etc., and particularly relates to a method of forming a counterbore on the substrate. [Prior Art] FIG. 3 is a diagram for explaining a method of forming a counterbore in a conventional ceramic multilayer substrate.

Figure 3(a). 3(b) shows a method of forming a counterbore using a mold, and FIG. 3(c) shows a method of forming a counterbore without using a mold.

First, a method for forming a counterbore using a mold will be explained. A ceramic sheet 2 having an opening 3 is laminated on a ceramic sheet 1 to form a laminate 4. Note that at this time, circuits are formed on each of the ceramic sheets 1 and 2.

Next, an upper mold 5 and a lower mold 6 having the same shape as the opening of the laminate 4 are inserted into the laminate 4 as shown in FIG.
The ceramic sheets 1 and 2 are laminated using a hot press, and the ceramic sheets 1 and 2 are pressed together.

In addition, as shown in FIG. 3(c), when a mold is not used, the laminate 4 is vacuum packaged with a film 7,
This is laminated by applying temperature and pressure with a medium 8 such as water or an inert gas, and the counterbore portion is formed.

[Problems to be Solved by the Invention] However, in the above-mentioned method for forming a counterbore using a mold, if the shape of the counterbore becomes a step structure with a 6-male shape as shown in FIG. However, since it was necessary to create a complex shape to accommodate this, there was a problem that machining the mold became difficult. Furthermore, each time the shape of the counterbore part of the board is changed,
Another problem is that the mold must be remanufactured each time, resulting in extremely high costs.

In addition, in the method of forming a counterbore using a film instead of a mold, rounding of the counterbore and corner 9 of the board occurs as shown in Figure 4(b), resulting in the formation of a counterbore with good dimensional accuracy. The problem was that it was difficult to do so.

The present invention has been made in order to eliminate the above-mentioned problems of the prior art, and its purpose is to provide a method for manufacturing a ceramic multilayer substrate that can form counterbore portions with good dimensional accuracy at low cost. .

[Means for Solving the Problems] The present invention involves laminating circuit-shaped ceramic sheets having openings, and laminating ceramic sheets of the same type and shape as the openings of the ceramic sheets with a mold release agent. A film is placed in the opening, or a mold of the same shape as the counterbore is placed to form a plate material, which is then vacuum packaged with the film.

At this time, plate materials such as ceramic sheets, films, and molds placed in the openings are placed so that their upper surfaces are slightly higher than the top surfaces of the ceramic sheets having the openings.

This laminate structure is then vacuum packaged with a film.
Laminate by applying temperature and pressure evenly using a medium such as water or inert gas. After lamination, the plate placed in the opening is removed to form a counterbore. [Function] A board with the same shape as the counterbore is placed in the counterbore so that it is slightly higher than the surface of the laminate, and after vacuum packaging with a film, the board is finally removed to be laminated. No rounding occurs at the corners of the rear counterbore.

[Example] Hereinafter, an example of the present invention will be described in detail with reference to the drawings shown in FIGS. 1 and 2.

FIG. 1 shows a first embodiment of the present invention. First, a ceramic sheet 1 having a circuit shape and a ceramic sheet 2 having an opening 3 are stacked together to form a laminate 4. A ceramic sheet 10 having the same shape and the same type as the opening 3 of this laminate 4 and a film l1 with a release agent having the same shape are placed in such a way that the film 11 with a release agent is placed downward. Place it facing the ceramic sheet 1 so that it looks like this.

The thickness of the laminated plate material of the ceramic sheet 10 and the release agent-applied film 11 is such that its upper surface is slightly higher than the upper surface of the laminate 4.

Next, as shown in FIG. 1(b), the entire surface of the laminate 4 is vacuum packaged using a film 7, and the laminate is laminated by applying temperature and pressure using a medium 8 such as water or an inert gas to form a crimped body 4a. Then, from the laminated crimped body 4a, the ceramic sheet lO and the release agent attached film 11 are removed.
and remove the counterbore portion 3a.

Since the ceramic sheet 10 is pressure-bonded to the ceramic sheet 2 via the film 1 with a release agent, it can be easily removed. Furthermore, since the ceramic sheet IO is higher than the surface of the laminate 4a by the thickness of the film 11, the corner 9a is rounded, but the counterbore corner of the crimped body 4a is not bent.

FIG. 2 is a diagram showing another embodiment of the present invention, in which ceramic sheets 2 and 2 with different opening shapes are placed on a ceramic sheet 1.
A is shown in the case where the laminates 4 are laminated and the laminate 4 is formed. It has the same shape as each opening corresponding to the opening 3 of this laminate 4, and the same external shape as the ceramic sheet 11 which has the same type of opening as the ceramic sheets 10, 10a and the ceramic sheet IO. A film with a release agent 12
are stacked as shown in FIG. 2(a) to form a laminate as shown in FIG. 2(b). After vacuum packaging with film 7, temperature and temperature are increased by medium 8 as in the case of FIG. Pressure is applied to laminate, and the crimped body 4a is shaped. After lamination is completed, the ceramic sheets 10 and 10a
and film 11 and lla with release agent, and film 12
is removed to form a counterbore.

FIG. 2(c) shows still another embodiment of the present invention, in which molds 13 and 13a having the same shape as the shape of the counterbore are created instead of the ceramic sheet, This figure shows how to form a counterbore by embedding the ceramic sheet in the ceramic sheet and laminating it in the same way as in the case of a ceramic sheet.

Note that 1 is placed on the opening to form the counterbore! The thickness T of the plate material to be placed is T ) n X t where t is the thickness of the ceramic sheet and n is the number of laminated ceramic sheets with openings.
The surface of the plate material is made to be slightly higher than the surface of the product R't body so as to maintain the following relationship.

[Effects of the Invention] As described above in detail based on the embodiments, in the present invention, in shaping the counterbore portion of a ceramic multilayer substrate, the plate material is placed in the counterbore portion so that its surface is slightly higher than the surface of the laminate. Since the parts are placed so as to be placed and vacuum packaged with a film, and then laminated using a medium, there is no slump in the countersunk corners during lamination. Therefore, a counterbore with good dimensional accuracy can be formed. Furthermore, since a plate material such as a ceramic sheet or a mold is placed on the counterbore, there is no need to remanufacture the entire mold even if the counterbore position is changed.

Furthermore, when using a ceramic sheet, there is an advantage that it can easily accommodate changes in the counterbore.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a first embodiment of the present invention, FIG. 2 is a diagram showing another embodiment of the present invention, FIG. 3 is a diagram illustrating a conventional method for forming a counterbore in a multilayer board, Figure 4 is a diagram explaining the problems of the conventional technology. E...Ceramic sheet, 2...Ceramic sheet with opening, 3
...Opening, 4...Laminated body, 4a...
...Crimped body, 7...Film, 8...
... Medium, 10 ... Ceramic sheet, 11.
... Film with mold release agent, 12 ... Film with mold release agent, 13.13a ... Mold.

Claims (3)

[Claims] (1) A second ceramic sheet having an opening on the first ceramic sheet.
A method for manufacturing a ceramic multilayer board, in which a multilayer board is formed by laminating ceramic sheets and pressing the first and second ceramic sheets together by heating or applying pressure, wherein a plate material having the same shape as the opening is The plate material is placed so that the upper surface thereof is slightly higher than the upper surface of the second ceramic sheet to form a laminated structure, the surface of this laminated structure is vacuum packaged with a film and then pressure bonded, and then the plate material is removed. A method for manufacturing a featured ceramic multilayer board. (2) A laminate in which a film with a release material is laminated on the back surface of a ceramic sheet of the same type as the second ceramic sheet is used as the plate material, and the release material is attached to the second ceramic sheet in the opening.
2. The method of manufacturing a ceramic multilayer substrate according to claim 1, wherein the ceramic multilayer substrate is disposed so as to face the ceramic sheet. (3) The method for manufacturing a ceramic multilayer substrate according to claim (1), characterized in that a mold is used as the plate material.