JPS61205139A - Mold release material for multilayer printed wiring - Google Patents
Mold release material for multilayer printed wiringInfo
- Publication number
- JPS61205139A JPS61205139A JP60046128A JP4612885A JPS61205139A JP S61205139 A JPS61205139 A JP S61205139A JP 60046128 A JP60046128 A JP 60046128A JP 4612885 A JP4612885 A JP 4612885A JP S61205139 A JPS61205139 A JP S61205139A
- Authority
- JP
- Japan
- Prior art keywords
- mold release
- printed wiring
- multilayer printed
- release material
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は多層印刷配線板の積層作業に用いる多層印刷
配線用離型材に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a release material for multilayer printed wiring used in the lamination work of multilayer printed wiring boards.
従来、多層印刷配線用の離型材として三酢酸セルローズ
フィルムやシリコン処理紙等が知られている＠
これら離型材の用途について説明する。第２図に示す様
にプレス熱板（７）の間に銅箔（６）と絶縁接着シート
であるブリブレツブ（４）を重ね合せその局外側に離型
材（３）を介して平面板（６）ではさみ込み加圧、加熱
すると第８図に示す様にブリブレツブ（４）が溶融流出
し硬化する。この時に平面板（６）と外層銅箔（６）の
間にある離型材（３りが平面板（６）と溶融流出したブ
リブレツブ（４］との接着をはばみ銅箔（６）とブリブ
レツブ（旬の一体成型された多層印刷配線板を取り除す
ことが出来る。この様に溶融流出したブリプレラグ（４
）と平面板（６）が固着することを防止する為に、離型
材（３）を用いる。従来はこの離型材（３）にシリコン
処理紙や三酢酸セルローズフィルム、テフロンフィルム
等が用いられていた。Conventionally, cellulose triacetate film, silicone-treated paper, etc. have been known as release materials for multilayer printed wiring. The uses of these release materials will be explained below. As shown in Fig. 2, a copper foil (6) and an insulating adhesive sheet (4) are stacked between press hot plates (7), and a flat plate (6) is placed on the outer side of the plate with a release material (3) interposed therebetween. ) and pressurized and heated, the bristles (4) melt and flow out as shown in FIG. 8 and harden. At this time, the mold release material (3) between the flat plate (6) and the outer copper foil (6) prevents the adhesion between the flat plate (6) and the melted blobs (4). It is possible to remove the multi-layer printed wiring board that has been molded in one piece.
) and the flat plate (6) from sticking together, a mold release material (3) is used. Conventionally, silicon-treated paper, cellulose triacetate film, Teflon film, etc. have been used as the mold release material (3).
従来の多層印刷配線用離型材は以上の様に紙やプラスチ
ックシートで構成されているので、耐熱性が劣り離型時
に破れたり、また紙及びプラスチックシートの収縮によ
り多層印刷配線板の成型面にシワや梨地状態の表面にな
ったり、さらに紙及ぴプラスチックシートのもつクッシ
ョンにより多層印刷配線板の平面度が損われ後続の写真
製版工程に著るしいフォトレジストの断線や浮きを生じ
不良率が高かったり、熱電導率が悪い１こめ、プレス時
間が長くかかる等の問題点があった。Conventional mold release materials for multilayer printed circuits are made of paper and plastic sheets as described above, so they have poor heat resistance and may tear during mold release, and shrinkage of the paper and plastic sheets may cause damage to the molding surface of the multilayer printed circuit board. The surface may become wrinkled or matte, and the flatness of the multilayer printed wiring board may be impaired by the cushioning of the paper or plastic sheet, resulting in severe disconnection or lifting of the photoresist during the subsequent photolithography process, resulting in a high defect rate. There were problems such as being expensive, having poor thermal conductivity, and requiring a long press time.
この発明は上記のような問題点を解消するため昏こ成さ
れたもので、耐熱性、熱伝導性、及び平滑性に優れる多
層印刷配線用離型材を得ることを目的とする。This invention was developed to solve the above-mentioned problems, and an object thereof is to obtain a mold release material for multilayer printed wiring that has excellent heat resistance, thermal conductivity, and smoothness.
〔問題点を解決するための手段）
この発明に係る多層印刷配線用離型材は金属箔の表面に
離型剤を塗布したものである。[Means for Solving the Problems] The mold release material for multilayer printed wiring according to the present invention is one in which a mold release agent is applied to the surface of metal foil.
Ｌ作用〕
この発明における多層印刷配線用離型材は、金属箔１こ
より耐熱性、熱伝導性、及び平滑性が保たれる。L effect] The mold release material for multilayer printed wiring according to the present invention maintains heat resistance, thermal conductivity, and smoothness from a single piece of metal foil.
〔発明の実施例」
る。第１図において（１）は０．０８ ｍｍ −ＱｅＥ
ｔ ｍｍ厚アルミニュームの金属箔、（２）は金属箔（
１］の表面に塗布されたシリコンの離型剤である。[Embodiments of the invention] In Figure 1, (1) is 0.08 mm -QeE
t mm thick aluminum metal foil, (2) metal foil (
1] is a silicone mold release agent applied to the surface of the product.
この金属箔（１）の表面に離型剤（２）が塗布された離
型材を先１こ説明した第２図及び第８図の離型材（３）
として使用する。その際に、外層銅箔（５）に離型剤（
２）が又平面板（６）に金属箔が接触するように離型材
を配置する。The mold release material (3) shown in FIG. 2 and FIG.
Use as. At that time, apply a mold release agent (
2) Arrange the mold release material so that the metal foil comes into contact with the flat plate (6).
多層印刷配線板の積層作業は従来と同様に、プレス熱板
（７）間にブリブレツブ（４）と銅箔（５）の積層材料
を投入し、ブリプレラグ（４）の硬化に必要な圧力、温
度、時間を加え硬化積層板を作り、平面板（６）と離型
材を解体して多層印刷配線板を得る。Lamination work for multilayer printed wiring boards is carried out in the same way as in the past, by inserting the laminated materials of brittle lugs (4) and copper foil (5) between press hot plates (7), and applying the pressure and temperature necessary to harden the brittle lugs (4). , a hardened laminate is made by adding time, and the flat plate (6) and the mold release material are disassembled to obtain a multilayer printed wiring board.
なお上記実施例では金、寓箔にアルミニウム、離型剤に
シリコンを用いたが、金属箔として鉄箔、錫箔等の箔を
用い、離型剤１こテフロンやポリビニフルアルコール等
の離型剤を用いても良く、上記実施例と同様の効果を奏
する。In the above example, gold, aluminum was used as the metal foil, and silicon was used as the mold release agent, but iron foil, tin foil, or other foil was used as the metal foil, and a mold release agent such as Teflon or polyvinyl alcohol was used as the metal foil. Agents may also be used, and the same effects as in the above embodiments can be achieved.
また、離型剤（２）を金属箔（１）の片面に塗布した場
合を示したが、金属箔（１）の両面に塗布しても良い。Moreover, although the case where the mold release agent (2) is applied to one side of the metal foil (1) is shown, it may be applied to both sides of the metal foil (1).
ＱＡ ｍｍ ″（ｋ４ ｍｍ が藺品イ巴としでｆｉ
１１／Ｊ−（”のつ【刀）。QA mm ″(K4 mm is a product.
11/J-(”Notsu [sword).
この数値に限られるものではない。It is not limited to this value.
この実施例によれば、離型材を従来の紙又はプラスチッ
クシートから金属箔をこ代えるように構成しｔコので、
多層印刷配線板の成型表面精度が極めて良くなり、耐熱
性に優れるから高温硬化樹脂積層に利用でき、さらに熱
伝導性に優れるから積層時間が短縮された。又、使用後
は有価金属として回収できる等の付加価値があり、精度
の高い多層印刷配線板を効果的ｉこ安価に製造するのに
実用上極めて便利なものである。According to this embodiment, the mold release material is constructed to replace the conventional paper or plastic sheet with metal foil.
The molding surface precision of multilayer printed wiring boards has become extremely good, and because it has excellent heat resistance, it can be used for laminating high-temperature curing resins.Furthermore, because it has excellent thermal conductivity, the lamination time has been shortened. Furthermore, it has added value such as being able to be recovered as a valuable metal after use, and is extremely convenient in practice for producing highly accurate multilayer printed wiring boards effectively and at low cost.
以上のように、この発明によれば多層印刷配線用離型材
を金属箔の表面に離型剤を塗布して構成したので、耐熱
性、熱伝導性、及び平滑性に優れるものが得られる効果
がある。As described above, according to the present invention, since the mold release material for multilayer printed wiring is constructed by applying the mold release agent to the surface of metal foil, it is possible to obtain a mold release material with excellent heat resistance, thermal conductivity, and smoothness. There is.
第１図はこの発明の一実施例による多層印刷配線用離型
材を示す断面図、第２図は多層印刷配線板の積層プレス
工程を示す断面図、第８図は積層完了時のブリブレツブ
流出部を示す拡大断面図である。
図において＆（１）は金属箔、（２）は離型剤である。
図中、同一符号は同一、又は相当部分を示す。FIG. 1 is a sectional view showing a mold release material for multilayer printed wiring according to an embodiment of the present invention, FIG. 2 is a sectional view showing the lamination pressing process of a multilayer printed wiring board, and FIG. FIG. In the figure, &(1) is a metal foil, and (2) is a mold release agent. In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (3)
る多層印刷配線用離型材。(1) A mold release material for multilayer printed wiring, characterized in that a mold release agent is applied to the surface of metal foil.
特徴とする特許請求の範囲第１項記載の多層印刷配線用
離型材。(2) The mold release material for multilayer printed wiring according to claim 1, wherein the metal foil is aluminum, iron, or tin.
アルコールであることを特徴とする特許請求の範囲第１
項記載の多層印刷配線用離型材。(3) Claim 1, characterized in that the mold release agent is silicone, Teflon, or polyvinyl alcohol.
Mold release material for multilayer printed wiring as described in .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60046128A JPS61205139A (en) | 1985-03-08 | 1985-03-08 | Mold release material for multilayer printed wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60046128A JPS61205139A (en) | 1985-03-08 | 1985-03-08 | Mold release material for multilayer printed wiring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61205139A true JPS61205139A (en) | 1986-09-11 |
Family
ID=12738343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60046128A Pending JPS61205139A (en) | 1985-03-08 | 1985-03-08 | Mold release material for multilayer printed wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61205139A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01243491A (en) * | 1988-03-24 | 1989-09-28 | Hitachi Chem Co Ltd | Manufacture of single face copper clad laminated plate |
| JPH02155725A (en) * | 1988-12-09 | 1990-06-14 | Nippon Mining Co Ltd | High molecular film laminated metal foil |
| JP2005059543A (en) * | 2003-08-20 | 2005-03-10 | Toyo Aluminium Kk | Mold releasing material and method of manufacturing circuit board structure using it |
| WO2012108070A1 (en) * | 2011-02-10 | 2012-08-16 | フリージア・マクロス株式会社 | Metal foil with carrier and method for producing laminated substrate using same |
| JP2013034012A (en) * | 2012-11-06 | 2013-02-14 | Freesia Makurosu Kk | Metal foil with carrier |
-
1985
- 1985-03-08 JP JP60046128A patent/JPS61205139A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01243491A (en) * | 1988-03-24 | 1989-09-28 | Hitachi Chem Co Ltd | Manufacture of single face copper clad laminated plate |
| JPH02155725A (en) * | 1988-12-09 | 1990-06-14 | Nippon Mining Co Ltd | High molecular film laminated metal foil |
| JP2005059543A (en) * | 2003-08-20 | 2005-03-10 | Toyo Aluminium Kk | Mold releasing material and method of manufacturing circuit board structure using it |
| WO2012108070A1 (en) * | 2011-02-10 | 2012-08-16 | フリージア・マクロス株式会社 | Metal foil with carrier and method for producing laminated substrate using same |
| JP2012169350A (en) * | 2011-02-10 | 2012-09-06 | Freesia Makurosu Kk | Metal foil with carrier and manufacturing method of multilayer substrate using the same |
| CN103384597A (en) * | 2011-02-10 | 2013-11-06 | 福利家麦克罗斯株式会社 | Metal foil with carrier and method for producing laminated substrate using same |
| JP2013034012A (en) * | 2012-11-06 | 2013-02-14 | Freesia Makurosu Kk | Metal foil with carrier |
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