JPH04351546A - Cushioning material - Google Patents

Cushioning material

Info

Publication number
JPH04351546A
JPH04351546A JP15263191A JP15263191A JPH04351546A JP H04351546 A JPH04351546 A JP H04351546A JP 15263191 A JP15263191 A JP 15263191A JP 15263191 A JP15263191 A JP 15263191A JP H04351546 A JPH04351546 A JP H04351546A
Authority
JP
Japan
Prior art keywords
cushioning material
fpc
propylene resin
coverlay film
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP15263191A
Other languages
Japanese (ja)
Inventor
Hirofumi Sakurai
桜井 洋文
Nobuyuki Aoki
信之 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP15263191A priority Critical patent/JPH04351546A/en
Publication of JPH04351546A publication Critical patent/JPH04351546A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To improve workability and quality of a product by improving a cushioning material used at a process for hot contact bonding of a coverlay film on the surface of the following laminate after a circuit is formed on a copper-clad laminate to be used as a base of a flexible printed circuit(FPC). CONSTITUTION:A cushioning material is prepd. by laminating integrally a propylene resin sheet 1 on both upper and lower faces of a kraft paper 2 as an intermediate layer. In addition, an FPC wherein an adhesive material of a coverlay film is embedded in a circuit without gap and which has no dimensional failure and excellent quality can be prepd. The workability is remarkably improved as a hardly processable propylene resin sheet is not independently handled. The cushioning material and the FPC can be easily separated after thermocompression.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】この発明は、フレキシブルプリン
トサーキット(以下「FPC」と略記)を製造する際の
カバーレイフィルム熱圧着工程に用いられるクッション
材に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cushioning material used in a coverlay film thermocompression bonding process when manufacturing a flexible printed circuit (hereinafter abbreviated as "FPC").

【0002】0002

【従来の技術】FPCの製造に際して、通常、ベースと
なる銅張積層板(以下「CCL」と略記)に回路形成後
、その表面に絶縁および回路の保護の目的でカバーレイ
フィルムを貼り合わせることが行なわれている。このカ
バーレイフィルムとしては厚さ25〜125μm程度の
ポリイミドフィルムあるいはポリエステルフィルムに、
接着剤が厚さ10〜35μm程度塗布されたものが用い
られる。そしてCCLに貼り合わされたカバーレイフィ
ルムの接着剤が回路の隙間部分に完全に埋め込まれた密
着状態となるとともに、この接着剤を硬化させるために
、上記カバーレイフィルムの貼り合わせは熱プレス機を
使用し、140〜180℃程度の温度条件で加圧して行
われる。
[Prior Art] When manufacturing FPC, usually after forming a circuit on a base copper clad laminate (hereinafter abbreviated as "CCL"), a coverlay film is attached to the surface for the purpose of insulation and protection of the circuit. is being carried out. This coverlay film is made of polyimide film or polyester film with a thickness of about 25 to 125 μm.
An adhesive coated with a thickness of about 10 to 35 μm is used. Then, the adhesive of the coverlay film bonded to the CCL is completely embedded in the gap between the circuits, and in order to harden the adhesive, the coverlay film is bonded using a heat press machine. The process is carried out under pressure at a temperature of about 140 to 180°C.

【0003】この熱圧着工程において、FPCには回路
の凹凸やカバーレイフィルムの貼付がなされてないラン
ド部および端子部があるため、カバーレイフィルムを回
路の凹凸部分に隙間なく密着させ、かつランド部および
端子部での接着剤の染み出しを防止する目的でクッショ
ン材が使用されている。このクッション材は、まずCC
Lの表面回路をカバーレイフィルムで被覆し、次いで作
用面として鏡面板を備えた熱プレス用熱板によって、C
CLに熱および圧力を作用させる際に、鏡面板とカバー
レイフィルムとの間に介在せしめて使用するものである
[0003] In this thermocompression bonding process, since the FPC has irregularities of the circuit and land parts and terminal parts to which the coverlay film is not attached, the coverlay film is closely attached to the irregularities of the circuit without any gaps, and the lands are Cushioning material is used to prevent adhesive from seeping out at the parts and terminals. First of all, this cushion material is made of CC
The surface circuit of L is covered with a coverlay film, and then the C
When applying heat and pressure to CL, it is used by interposing it between the mirror plate and the coverlay film.

【0004】そしてこのクッション材として、従来はシ
リコーンゴムシート、塩化ビニルシート、EVA(エチ
レン−酢酸ビニル共重合体)シート等と、カバーレイフ
ィルムとの離型を目的とする25〜50μmの厚さのポ
リプロピレンフィルム等の離型フィルムが併用されてい
た。
[0004] Conventionally, this cushioning material has been made of silicone rubber sheets, vinyl chloride sheets, EVA (ethylene-vinyl acetate copolymer) sheets, etc., with a thickness of 25 to 50 μm for the purpose of releasing the coverlay film from the mold. Release films such as polypropylene films were also used.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、シリコ
ーンゴムシート、塩化ビニルシート、EVAシート等の
シート、離型フィルム等を組み合わせて用いると、(1
)離型フィルムの取り扱いが困難で、作業性が悪い、(
2)熱圧着後に離型フィルムをFPCから剥すのが困難
である、(3)両面FPCの熱圧着を行った場合に、そ
のFPCの上面および下面に使用したクッション材の離
型フィルムが相互に融着し、それらを剥すのが困難であ
る、(4)シートと離型フィルムの熱的特性の違いから
、これらの組合せによっては、離型フィルム中の添加物
やオリゴマー等の成分がFPC表面に残渣として付着し
たり、熱圧着工程でしわが生じたりする、(5)塩化ビ
ニルシートやEVAシート等の樹脂を使用した場合、こ
のシートが熱圧着工程中に溶融して流れ、熱プレス機の
鏡面板を汚し製品不良の原因となるとともに、その汚れ
を除去するために作業性が悪化する、等の問題があった
[Problems to be Solved by the Invention] However, when sheets such as silicone rubber sheets, vinyl chloride sheets, EVA sheets, and release films are used in combination, (1
) Difficult to handle the release film, poor workability, (
2) It is difficult to peel off the release film from the FPC after thermocompression bonding. (3) When thermocompression bonding is performed on double-sided FPC, the release films of the cushioning material used on the top and bottom surfaces of the FPC may overlap each other. (4) Due to the difference in thermal properties between the sheet and the release film, depending on the combination of these, components such as additives and oligomers in the release film may adhere to the FPC surface. (5) If a resin such as a vinyl chloride sheet or EVA sheet is used, the sheet may melt and flow during the thermocompression bonding process, causing wrinkles to form during the thermocompression bonding process. There were problems such as staining the mirror plate of the mirror and causing product defects, and the workability of removing the stain worsened.

【0006】本発明は前記事情に鑑みてなされたもので
、カバーレイフィルムを熱圧着する工程において作業性
を向上せしめ、かつ得られる製品の品質を向上させるよ
うにしたクッション材の提供を目的とする。
The present invention was made in view of the above circumstances, and aims to provide a cushioning material that improves workability in the process of thermocompression bonding a coverlay film and improves the quality of the resulting product. do.

【0007】[0007]

【課題を解決するための手段】この発明のクッション材
は、クラフト紙を中間層として、その上面および下面に
単層あるいは複数層からなるプロピレン系樹脂シートを
、接着剤層を介して一体に積層してなることを前記課題
の解決手段とした。
[Means for Solving the Problems] The cushioning material of the present invention uses kraft paper as an intermediate layer, and propylene resin sheets consisting of a single layer or multiple layers are laminated together on the upper and lower surfaces of the intermediate layer through an adhesive layer. This is the solution to the above problem.

【0008】以下、この発明を詳しく説明する。図1は
本発明のクッション材の一実施例を示したものである。 本発明のクッション材は、クラフト紙2を中間層として
、その上面および下面にプロピレン系樹脂シート1を接
着剤3を介して積層一体化したものである。
[0008] This invention will be explained in detail below. FIG. 1 shows an embodiment of the cushioning material of the present invention. The cushioning material of the present invention has a kraft paper 2 as an intermediate layer, and propylene resin sheets 1 are integrally laminated on the upper and lower surfaces of the kraft paper 2 via an adhesive 3.

【0009】上記プロピレン系樹脂シート1は厚さが9
0〜200μmに形成されたもので、このものは一回の
製膜で形成することも、あるいは薄く製膜されたものを
熱融着あるいは接着剤3を用いて複数層に積層して形成
することもできる。ここで用いられる接着剤3としては
、エポキシ系、ウレタン系、アクリル系のいずれも使用
することができる。また接着剤3は2〜10μm程度の
厚さに塗布される。
The above propylene resin sheet 1 has a thickness of 9 mm.
It is formed to a thickness of 0 to 200 μm, and can be formed by one film formation, or by laminating thin films into multiple layers using heat fusion or adhesive 3. You can also do that. As the adhesive 3 used here, any of epoxy, urethane, and acrylic adhesives can be used. Further, the adhesive 3 is applied to a thickness of about 2 to 10 μm.

【0010】プロピレン系樹脂シート1の形成に用いら
れるプロピレン系樹脂としては、プロピレンと他のオレ
フィンなどとのコポリマーでもよいが、プロピレンホモ
ポリマーの方がより好ましい。また、プロピレン系樹脂
中に塩素などのハロゲン元素を微量に含むものでは、加
熱によって腐食性のガスが発生し、それによってCCL
の銅が腐食されることがあるので、これを防止するため
にプロピレン系樹脂としては特開昭59−209644
号公報に開示されているようなハロゲン捕捉剤を含有す
るものを用いるのが好ましい。さらにFPCの熱圧着工
程でプロピレン系樹脂シート1が熱収縮し、その結果F
PCの寸法不良が発生するのを防ぐために、上記プロピ
レン系樹脂の製膜は、なるべく延伸することなくできる
だけ無延伸に近い状態で行われるのが好ましい。また同
様の理由でプロピレン系樹脂シート1がクラフト紙2に
積層一体化される際にもなるべく延伸することなくでき
るだけ無延伸の状態で接着されるのが好ましい。
The propylene resin used to form the propylene resin sheet 1 may be a copolymer of propylene and another olefin, but a propylene homopolymer is more preferred. In addition, when propylene resin contains trace amounts of halogen elements such as chlorine, corrosive gas is generated when heated, resulting in CCL
Copper may be corroded, so in order to prevent this, the propylene resin used in JP-A-59-209644
It is preferable to use one containing a halogen scavenger as disclosed in Japanese Patent Publication No. Furthermore, the propylene resin sheet 1 undergoes heat shrinkage during the FPC thermocompression bonding process, resulting in FPC
In order to prevent the occurrence of dimensional defects in the PC, it is preferable that the propylene resin film is formed in a state as close to non-stretching as possible, without stretching as much as possible. Further, for the same reason, when the propylene resin sheet 1 is laminated and integrated with the kraft paper 2, it is preferable that the sheet be bonded in a non-stretched state as much as possible without stretching.

【0011】上記クラフト紙2としてはFPCの銅表面
を変色させる恐れのない中性のバージン紙が適しており
、さらにはタール等の有機物バインダーの含有が極力少
ないものが適している。また、厚さは50〜350μm
のものが用いられる。
As the above-mentioned kraft paper 2, a neutral virgin paper that does not cause discoloration of the copper surface of the FPC is suitable, and a paper that contains as little organic binder as possible is suitable. Also, the thickness is 50 to 350 μm
are used.

【0012】また、プロピレン系樹脂シート1とクラフ
ト紙2とを貼り合わせる接着剤3としては、エポキシ、
ウレタン、アクリル系のいずれを用いてもよく、その厚
さは2〜10μmに塗布される。
[0012] Also, as the adhesive 3 for bonding the propylene resin sheet 1 and the kraft paper 2, epoxy,
Either urethane or acrylic may be used, and the coating is applied to a thickness of 2 to 10 μm.

【0013】[0013]

【実施例】厚さ250μmのクラフト紙2の両面に、厚
さ50μmのポリプロピレンシート1を厚さ10μmの
接着材層3を介してそれぞれ接着してクッション材とし
た。このクッション材を用いて、CCLの表面にカバー
レイフィルムを熱圧着した。まず、表面上に回路が形成
されたCCLをカバーレイフィルムで被覆し、その表面
をクッション材で押さえつつ、作用面として鏡面板を備
えた熱プレス用熱板によってCCLに上下両方向から熱
および圧力を作用させた。このようにして得られたFP
Cは、カバーレイフィルムの表面回路埋め込み性が良く
、寸法不良も認められなかった。またFPCや鏡面板上
には、しわや異物の付着は認められなかった。さらに熱
圧着後は、FPCからクッション材を容易に取り除くこ
とができた。
EXAMPLE A cushioning material was prepared by adhering a 50 μm thick polypropylene sheet 1 to both sides of a 250 μm thick kraft paper 2 via a 10 μm thick adhesive layer 3. Using this cushioning material, a coverlay film was thermocompression bonded to the surface of CCL. First, a CCL with a circuit formed on its surface is covered with a coverlay film, and while the surface is pressed with a cushioning material, heat and pressure are applied to the CCL from both the top and bottom using a hot press plate equipped with a mirror plate as an action surface. was activated. FP obtained in this way
In case C, the surface circuit embedding property of the coverlay film was good, and no dimensional defects were observed. Further, no wrinkles or foreign matter were observed on the FPC or the mirror plate. Furthermore, after thermocompression bonding, the cushioning material could be easily removed from the FPC.

【0014】[0014]

【発明の効果】以上説明したようにこの発明のクッショ
ン材は、クラフト紙を中間層として、その上下両面にプ
ロピレン系樹脂シートを接着剤を介して積層一体化した
ものである。したがって、FPCの表面回路の凹凸部分
を、クッション性を有するプロピレン系樹脂シートが埋
め込む作用をするとともに、熱圧着の際に生じるプロピ
レン系樹脂シートの横方向の伸びをクラフト紙が抑制す
るため、接着材の回路埋め込み性が良好で、接着材のし
みだし量が安定し、かつ寸法不良がない品質に優れたF
PCを製造することができる。
As explained above, the cushioning material of the present invention has kraft paper as an intermediate layer, and propylene resin sheets are integrally laminated on both upper and lower surfaces of the intermediate layer through an adhesive. Therefore, the propylene-based resin sheet with cushioning properties acts to fill in the uneven portions of the surface circuit of the FPC, and the kraft paper suppresses the lateral elongation of the propylene-based resin sheet that occurs during thermocompression bonding. Excellent quality F with good circuit embedding properties, stable adhesive seepage amount, and no dimensional defects.
PCs can be manufactured.

【0015】このクッション材はクラフト紙とプロピレ
ン系樹脂シートが一体化されたものであるので、取り扱
いが困難なプロピレン系樹脂シートを単独で扱うことが
なく、作業性が著しく向上する。またクッション材を構
成する樹脂が熱溶融して流れる恐れがなく、作業性が向
上するとともに安定した品質の製品が得られる。
[0015] Since this cushioning material is made by integrating kraft paper and a propylene resin sheet, the propylene resin sheet, which is difficult to handle, does not need to be handled alone, and workability is significantly improved. In addition, there is no risk that the resin constituting the cushioning material will melt and flow, improving workability and producing products of stable quality.

【0016】またこのクッション材を構成するプロピレ
ン系樹脂シートは離型性を有し、それを所要のクッショ
ン性が得られるような適度な厚さに形成して使用するの
で、クラフト紙の剛直性とプロピレン系樹脂シートの弾
力性とにより、熱圧着後はこのクッション材をFPCか
ら容易に剥がすことができる。あるいは同様にして両面
FPCの製造の際にも、熱圧着後はFPCの両面に作用
させたクッション材を容易に剥がすことができる。
In addition, the propylene resin sheet constituting this cushioning material has mold releasability, and is used after being formed to an appropriate thickness to obtain the required cushioning properties, so that the rigidity of the kraft paper can be improved. Due to this and the elasticity of the propylene resin sheet, this cushioning material can be easily peeled off from the FPC after thermocompression bonding. Alternatively, in the same manner, when manufacturing a double-sided FPC, the cushioning material applied to both sides of the FPC can be easily peeled off after thermocompression bonding.

【0017】また、クラフト紙はプロピレン系樹脂シー
トに挟まれているので、その繊維が外部のものに付着す
る恐れがないので、ロール巻き状態で使用しても、カバ
ーレイフィルムを傷つける等の問題もない。さらにクッ
ション材としてのシートと離型フィルム等の熱的特性の
違いに起因して、FPCのしわが発生したり残渣が製品
に付着したりする恐れがない。
In addition, since the kraft paper is sandwiched between propylene resin sheets, there is no risk of its fibers adhering to external objects, so even if it is used in a roll, there will be problems such as damaging the coverlay film. Nor. Furthermore, there is no fear that wrinkles will occur in the FPC or residue will adhere to the product due to differences in thermal properties between the sheet as a cushioning material and the release film.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】  本発明のクッション材の一実施例を示した
断面図である。
FIG. 1 is a sectional view showing an embodiment of the cushioning material of the present invention.

【符号の説明】[Explanation of symbols]

1  プロピレン系樹脂シート 2  クラフト紙 3  接着材 1 Propylene resin sheet 2. Kraft paper 3 Adhesive material

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  フレキシブルプリントサーキットの表
面回路を被覆するカバーレイフィルムを熱圧着する際に
用いられるクッション材であって、クラフト紙を中間層
として、その上面および下面に単層あるいは複数層から
なるプロピレン系樹脂シートを、接着剤層を介して一体
に積層してなることを特徴とするクッション材。
Claim 1: A cushioning material used when thermocompression bonding a coverlay film covering the surface circuit of a flexible printed circuit, comprising a single layer or multiple layers on the upper and lower surfaces of the intermediate layer of kraft paper. A cushioning material made by integrally laminating propylene resin sheets with an adhesive layer interposed therebetween.
JP15263191A 1991-05-28 1991-05-28 Cushioning material Withdrawn JPH04351546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15263191A JPH04351546A (en) 1991-05-28 1991-05-28 Cushioning material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15263191A JPH04351546A (en) 1991-05-28 1991-05-28 Cushioning material

Publications (1)

Publication Number Publication Date
JPH04351546A true JPH04351546A (en) 1992-12-07

Family

ID=15544612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15263191A Withdrawn JPH04351546A (en) 1991-05-28 1991-05-28 Cushioning material

Country Status (1)

Country Link
JP (1) JPH04351546A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06253614A (en) * 1993-03-01 1994-09-13 Sliontec:Kk Method for forming water-soluble thin film on surface of water-soluble or readily water-dispersible paper and seeding nursery sheet prepared by using the same method
JP2010201778A (en) * 2009-03-03 2010-09-16 Fujikura Ltd Cushion film for hot press
CN110395033A (en) * 2019-07-24 2019-11-01 广东东溢新材料科技有限公司 A kind of compound release film, the pure glue film of acrylate and preparation method
CN111511096A (en) * 2020-04-23 2020-08-07 苏州市杰煜电子有限公司 FPC soft board of special buffer material

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06253614A (en) * 1993-03-01 1994-09-13 Sliontec:Kk Method for forming water-soluble thin film on surface of water-soluble or readily water-dispersible paper and seeding nursery sheet prepared by using the same method
JP2010201778A (en) * 2009-03-03 2010-09-16 Fujikura Ltd Cushion film for hot press
CN110395033A (en) * 2019-07-24 2019-11-01 广东东溢新材料科技有限公司 A kind of compound release film, the pure glue film of acrylate and preparation method
CN111511096A (en) * 2020-04-23 2020-08-07 苏州市杰煜电子有限公司 FPC soft board of special buffer material

Similar Documents

Publication Publication Date Title
SK279991B6 (en) Component of printed circuit boards
CN104394643B (en) Non-layered rigid-flex board and preparation method thereof
JP5368054B2 (en) Method for manufacturing flexible circuit board and flexible circuit board
CN113133179A (en) Printed circuit board and manufacturing method thereof
JPH04351546A (en) Cushioning material
US7304248B2 (en) Multi-layer printed circuit board and method for manufacturing the same
JP4201882B2 (en) Laminate production method
CN112584629B (en) Printed circuit board and manufacturing method thereof
JP3796106B2 (en) Release film
TWI393494B (en) Substrate strip with wiring and method for fabricating the same
JP7246994B2 (en) Release film for printed wiring board manufacturing process and use thereof
JPH04201442A (en) Cushioning material
JP2010201778A (en) Cushion film for hot press
JP4201893B2 (en) Laminate production method
JPH04350992A (en) Manufacture of flexible printed circuit
JPH04201441A (en) Cushioning material
JP7124128B2 (en) Printed circuit board manufacturing method and printed circuit board
JPS61205139A (en) Mold release material for multilayer printed wiring
JP7246998B2 (en) Printed circuit board manufacturing method, printed circuit board manufacturing apparatus, and printed circuit board
KR102252762B1 (en) Packing For Pressure Head Of Hot-Press
CN110636709B (en) FPC calendering copper manufacturing process capable of controlling expansion and contraction
JP2003236700A (en) Press ram for laminating press
KR101955685B1 (en) Method for manufacturing flexible printed circuits board and flexible printed circuits board
JPH0434993A (en) Manufacture of multilayer printed wiring board having flexible part
KR100752354B1 (en) Release film for pcb

Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19980806