JP2501668Y2 - Surface mount electrical components - Google Patents
Surface mount electrical componentsInfo
- Publication number
- JP2501668Y2 JP2501668Y2 JP1989062312U JP6231289U JP2501668Y2 JP 2501668 Y2 JP2501668 Y2 JP 2501668Y2 JP 1989062312 U JP1989062312 U JP 1989062312U JP 6231289 U JP6231289 U JP 6231289U JP 2501668 Y2 JP2501668 Y2 JP 2501668Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- solder
- lead
- electric component
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Description
【考案の詳細な説明】 （産業上の利用分野） 本考案は、印刷配線基板の回路上に載置され、載置後
に回路と半田付けにより電気接続される表面実装用電気
部品に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to an electric component for surface mounting, which is placed on a circuit of a printed wiring board and electrically connected to the circuit by soldering after the placement.
（従来の技術） 従来、かかる表面実装用電気部品（以下、特別の場合
を除き電気部品という。）は、電気素子が取り付けられ
たリードフレームを、該リードフレームの一部を露出さ
せて合成樹脂でモールドして封止して構成される。(Prior Art) Conventionally, such a surface-mounting electric component (hereinafter, referred to as an electric component unless a special case) is a synthetic resin obtained by exposing a part of the lead frame to which an electric element is attached. It is molded and sealed with.
そして、この電気部品を印刷配線基板上に実装する際
には、該印刷配線基板上の回路で電気部品のリードフレ
ームの露出部が載置される部位に、予め半田ペーストを
シルク印刷技術における半田マスクを用いて塗布するよ
うにしている。この後、塗布された半田ペースト上に前
記電気部品のリードフレームの露出部を載置して、当該
載置部分を加熱することで半田ペーストを溶融せしめて
電気部品と印刷配線基板上の回路とを電気接続するよう
にしている。Then, when mounting this electric component on the printed wiring board, solder paste is preliminarily applied to the portion of the circuit on the printed wiring substrate where the exposed portion of the lead frame of the electric component is placed by soldering in the silk printing technique. It is applied using a mask. After that, the exposed portion of the lead frame of the electrical component is placed on the applied solder paste, and the solder paste is melted by heating the placement portion, and the electrical component and the circuit on the printed wiring board Is to be electrically connected.
なお、上述した電気部品を印刷配線基板上に直接実装
する方法は、最近の装置の小型化に対応して、高密度な
実装を図ることを目的としてなされる技術である。The above-described method of directly mounting the electric component on the printed wiring board is a technique aimed at achieving high-density mounting in response to recent downsizing of the device.
（考案が解決しようとする課題） しかしながら、上述した従来の電気部品の印刷配線基
板への実装方法では、印刷配線基板の回路の一部に予め
半田ペートスを半田マスクを用いて塗布するようにして
いるので、各種の印刷配線基板の各種の回路毎に、各種
の半田マスクを製作しなければならなく、さらに、印刷
配線基板の一枚一枚に半田ペートスを塗布する工程が必
要となり、従来行なわれていたいわゆるスルーホール方
式に比べてコストが高くなるという欠点がある。(Problems to be Solved by the Invention) However, in the above-described conventional method of mounting an electric component on a printed wiring board, solder paste is applied in advance to a part of the circuit of the printed wiring board by using a solder mask. Therefore, it is necessary to manufacture various solder masks for each circuit of each printed wiring board, and it is necessary to apply a solder paste to each printed wiring board. There is a drawback that the cost is higher than that of the so-called through-hole method.
本考案は、上記欠点を解消することを課題とするもの
であって、各種の印刷配線基板毎に各種の半田マスクを
製作する必要がなく、半田ペートスの塗布工程を省略す
ることができ、もって、印刷配線基板への電気部品の実
装コストを低減することができる表面実装用電気部品を
提供することを目的とする。The present invention is intended to solve the above-mentioned drawbacks, and it is not necessary to manufacture various solder masks for each printed wiring board, and the solder paste application step can be omitted. An object of the present invention is to provide a surface mounting electric component that can reduce the mounting cost of the electric component on the printed wiring board.
（課題を解決するための手段） 上記課題は、電気素子が取り付けられたリードフレー
ムを、該リードフレームの一部を露出させて合成樹脂で
モールドして封止してなる表面実装用電気部品におい
て、前記合成樹脂のモールド部から露出するリードフレ
ームの少なくとも一部に、前記合成樹脂のモールド温度
よりも高い溶融点を有する薄板状の半田を、該半田の溶
融点以下の温度でかつ前記モールど温度よりも高い温度
で接着性能が喪失する接着剤により接着することにより
解決することができる。(Means for Solving the Problem) The above-mentioned problem is related to a surface mounting electric component in which a lead frame to which an electric element is attached is exposed by molding a part of the lead frame and molded and sealed with a synthetic resin. A thin plate-like solder having a melting point higher than the molding temperature of the synthetic resin is provided on at least a part of the lead frame exposed from the molding portion of the synthetic resin at a temperature equal to or lower than the melting point of the solder and the mold or the like. The problem can be solved by bonding with an adhesive that loses its adhesive performance at a temperature higher than the temperature.
（作用） 本考案によれば、表面実装用電気部品のリードフレー
ムに接着された薄板状の半田部品を、印刷配線基板の回
路の所定位置に載置し、前記半田部分を加熱して半田を
溶融して電気部品のリードフレームと印刷配線基板の回
路とを電気接続する。(Operation) According to the present invention, the thin plate solder component adhered to the lead frame of the surface mounting electric component is placed at a predetermined position of the circuit of the printed wiring board, and the solder portion is heated to solder the solder. It melts and electrically connects the lead frame of the electric component and the circuit of the printed wiring board.
本考案によれば、薄板状の半田は、合成樹脂のモール
ド温度よりも高い溶融点を有しており、かつ、モールド
温度よりも高い温度で接着性能を表失する接着剤によっ
てリードフレームに接着されているので、リードフレー
ムを合成樹脂でモールドして封止する際にも、薄板状の
半田は溶融することなくかつ離脱することなく確実にリ
ードフレームに保持することができる。According to the present invention, the thin plate-shaped solder has a melting point higher than the mold temperature of the synthetic resin, and is bonded to the lead frame by an adhesive that loses its adhesive performance at a temperature higher than the mold temperature. Therefore, even when the lead frame is molded and sealed with the synthetic resin, the thin plate-like solder can be securely held on the lead frame without being melted and separated.
また、本考案によれば、薄板状の半田をリードフレー
ムに接着している接着剤が半田の溶融点以下の温度で接
着性能を喪失するので、半田の溶融前に接着が外れ、確
実に溶融半田によりリードフレームと印刷配線基板の回
路とを電気接続することができる。Further, according to the present invention, since the adhesive agent that adheres the thin plate-shaped solder to the lead frame loses its adhesive performance at a temperature equal to or lower than the melting point of the solder, the adhesion is removed before the solder is melted, and the solder is reliably melted. The lead frame and the circuit of the printed wiring board can be electrically connected by soldering.
さらに、各電気部品のリードフレーム毎に薄板状の半
田が接着されているので、各種の印刷配線基板であって
も単に載置して加熱すればよいので、従来のように各種
の印刷配線基板毎に各種の半田マスクを製作する必要が
なくなりペースト状の半田を塗布する工程を設けなくて
もよくなり、コストの低減を図ることができる。Further, since the thin plate-shaped solder is adhered to each lead frame of each electric component, various printed wiring boards can be simply placed and heated. Since it is not necessary to manufacture various solder masks for each time, there is no need to provide a step of applying paste solder, and the cost can be reduced.
（実施例） 以下に、図面を参照して本考案の一実施例について説
明する。(Embodiment) An embodiment of the present invention will be described below with reference to the drawings.
第２図はリードフレーム１の平面図、正面図及び側面
図を示す。リードフレーム１は、本考案の電気素子とし
てのICチップ17が取り付けられるタブ部11と、該タブ部
11上のICチップ17と、接続ワイヤ19によって電気接続さ
れるワイヤボンディング部12と、該ワイヤボンディング
部12と接続されるダイバ部14と、該ダイバ部14に接続さ
れるリード部15と、該リード部15を取り囲んで各リード
部15を接続する枠部16とを備えて構成される。FIG. 2 shows a plan view, a front view and a side view of the lead frame 1. The lead frame 1 includes a tab portion 11 to which an IC chip 17 as an electric element of the present invention is attached, and the tab portion 11.
The IC chip 17 on 11, the wire bonding portion 12 electrically connected by the connecting wire 19, the diver portion 14 connected to the wire bonding portion 12, the lead portion 15 connected to the diver portion 14, And a frame portion 16 surrounding the lead portions 15 and connecting the lead portions 15 to each other.
前記リードフレーム１のワイヤボンディング部12の表
面には、接続ワイヤ19のボンディング性のよいアルミニ
ウム又はアルミニウム合金等の材料がメッキ等の処理に
より被着されている。リードフレーム１のワイヤボンデ
ィング部12以外の部分には半田付け性のよい錫又は錫と
鉛の合金等の材料が上述と同様にメッキ等の処理により
被着されている。なお18はボンディングパッドである。On the surface of the wire bonding portion 12 of the lead frame 1, a material such as aluminum or an aluminum alloy having a good bonding property for the connecting wire 19 is applied by a treatment such as plating. A material such as tin or an alloy of tin and lead having good solderability is applied to the portion of the lead frame 1 other than the wire bonding portion 12 by a treatment such as plating as described above. 18 is a bonding pad.
前記リードフレーム１のリード部15及び枠部16の裏面
には、薄板状の半田13が接着剤により接着されている。
この半田13の厚さは、リードフレーム１のリード部15の
板厚と略同一寸法に形成されている。また、この半田13
の材料は錫40％、鉛60％の合金からなり、この半田13の
溶融点が略180℃となるように設定されている。さら
に、前記接着剤は温度140℃〜160℃でその接着性能が喪
失する特性を有するものである。A thin plate-shaped solder 13 is adhered to the back surfaces of the lead portion 15 and the frame portion 16 of the lead frame 1 with an adhesive.
The thickness of the solder 13 is approximately the same as the thickness of the lead portion 15 of the lead frame 1. Also, this solder 13
The material is made of an alloy of 40% tin and 60% lead, and the melting point of the solder 13 is set to about 180 ° C. Further, the adhesive has a property that its adhesive performance is lost at a temperature of 140 ° C to 160 ° C.
リードフレーム１には、その周縁部のリード部15と枠
部16とを露出した状態でその中央部のタブ部11とワイヤ
ボンディング部12との周囲に合成樹脂がモールドされIC
チップ17を封止する容器10が形成される。この合成樹脂
のモールドは前記接着剤性能の喪失温度よりも低温すな
わち140℃以下の温度においてなされるものである。リ
ードフレーム１のリード部15及び枠部16は、モールド後
に第３図に示すようにプレス加工等により切断され折り
曲げられる。In the lead frame 1, a synthetic resin is molded around the tab portion 11 and the wire bonding portion 12 in the central portion of the lead frame 1 with the lead portion 15 and the frame portion 16 in the peripheral portion thereof exposed.
A container 10 for sealing the chip 17 is formed. This synthetic resin mold is made at a temperature lower than the loss temperature of the adhesive performance, that is, at a temperature of 140 ° C. or less. After molding, the lead portion 15 and the frame portion 16 of the lead frame 1 are cut and bent by pressing or the like as shown in FIG.
第４図〜第６図に本考案の他の実施例を示す。このも
のは、本考案をタンタルコンデンサに適用した例を示
す。第４図に示すように、リードフレーム20には、リー
ド部24と、該リード部24をはしご状に連結する枠部25と
が形成されている。枠部25とリード部24の一部には、上
述した実施例と同様な材料からなる薄板状の半田23が、
同様に上述した実施例と同様な特性を有する接着剤によ
り接着されている。なお、リードフレーム20の表面には
半田付性の良好な金属の被膜が被着されている。4 to 6 show another embodiment of the present invention. This shows an example in which the present invention is applied to a tantalum capacitor. As shown in FIG. 4, the lead frame 20 is provided with a lead portion 24 and a frame portion 25 that connects the lead portion 24 in a ladder shape. In a part of the frame portion 25 and the lead portion 24, a thin plate-like solder 23 made of the same material as that of the above-mentioned embodiment,
Similarly, they are adhered by an adhesive having the same characteristics as those in the above-mentioned embodiments. The surface of the lead frame 20 is coated with a metal coating having good solderability.
リードフレーム20の対向するリード部24の一方には、
本考案の電気素子としてのタンタルコンデンサ素子21の
導電性接着剤27によって接着されており、この後リード
フレーム20を雰囲気温度が120℃〜130℃に保たれた硬化
炉内に入れることによって前記接着剤27を硬化させる。
また、対向するリード部24の他方には、タンタルコンデ
ンサ素子21から突出する端子28がスポット溶接部26によ
って取り付けられている。前述した実施例と同様に第５
図及び第６図に示すように、リードフレーム20にはリー
ド部24の一部を露出させて合成樹脂がモールドされタン
タルコンデンサ素子21を封止する容器22が形成させてあ
る。このモールド温度は前述の実施例と同様に、140℃
以下の温度となっている。On one of the opposing lead portions 24 of the lead frame 20,
The tantalum capacitor element 21 as an electric element of the present invention is adhered by a conductive adhesive 27, and then the lead frame 20 is placed in a curing oven whose ambient temperature is maintained at 120 ° C to 130 ° C to perform the adhesion. The agent 27 is cured.
A terminal 28 protruding from the tantalum capacitor element 21 is attached to the other of the opposing lead portions 24 by a spot welding portion 26. The same as the fifth embodiment described above.
As shown in FIG. 6 and FIG. 6, the lead frame 20 is provided with a container 22 in which a part of the lead portion 24 is exposed and a synthetic resin is molded to seal the tantalum capacitor element 21. The mold temperature is 140 ° C. as in the previous embodiment.
The temperature is as follows.
本実施例によれば、内部リードフレーム1,20の半田付
部分に板状半田13,23を接着し樹脂封止成形するように
してあるので、電子部品を印刷配線基板等に実装する場
合に部品実装面の回路パターンにあらかじめ半田を付着
させるために各種の半田マスクを製作する必要がない。
さらに、半田ペートスを塗布する工程がなくなる。した
がって電子部品を実装するための組立コストが安くな
る。According to the present embodiment, the plate-shaped solder 13 and 23 are adhered to the soldered portions of the internal lead frames 1 and 20 and resin-sealed, so that when electronic components are mounted on a printed wiring board or the like. It is not necessary to manufacture various solder masks in order to attach solder to the circuit pattern on the component mounting surface in advance.
Further, the step of applying the solder paste is eliminated. Therefore, the assembly cost for mounting the electronic component is reduced.
（考案の効果） 以上に説明したように、本考案によれば、各種の印刷
配線基板毎に各種の半田マスクを製作する必要がなく、
半田ペートスの塗布工程を省略することができ、もっ
て、印刷配線基板への電気部品の実装コストを低減する
ことができる。(Effect of the Invention) As described above, according to the present invention, it is not necessary to manufacture various solder masks for each printed wiring board.
The step of applying the solder paste can be omitted, so that the mounting cost of the electric component on the printed wiring board can be reduced.
第１図は本考案の表面実装用電気部品の外観を示す斜視
図、第２図は第１図の実施例に使用されるリードフレー
ムの平面図並びに正面図及び側面図、第３図は第１図の
実施例の内部構造を示す断面図、第４図は本考案の他の
実施例の表面実装用電気部品に使用されるリードフレー
ムの平面図並びに正面図及び側面図、第５図は第４図の
リードフレームが使用された表面実装用電気部品の内部
構造を示す断面図、第６図は第５図の表面実装用電気部
品の外観を示す斜視図である。 1,20……リードフレーム、12……ボンディング部、13,2
3……半田、14……ダイバ部、15,24……リード部、16,2
5……枠部、17……ICチップ、21……タンタルコンデン
サ素子。FIG. 1 is a perspective view showing the appearance of a surface mount electric component of the present invention, FIG. 2 is a plan view and a front view and a side view of a lead frame used in the embodiment of FIG. 1, and FIG. 1 is a cross-sectional view showing the internal structure of the embodiment shown in FIG. 1, FIG. 4 is a plan view, a front view and a side view of a lead frame used for an electric component for surface mounting according to another embodiment of the present invention, and FIG. FIG. 4 is a cross-sectional view showing the internal structure of the surface mounting electric component using the lead frame of FIG. 4, and FIG. 6 is a perspective view showing the appearance of the surface mounting electric component of FIG. 1,20 …… Lead frame, 12 …… Bonding part, 13,2
3 …… Solder, 14 …… Diver part, 15,24 …… Lead part, 16,2
5 …… Frame, 17 …… IC chip, 21 …… Tantalum capacitor element.
Claims (1)
を、該リードフレームの一部を露出させて合成樹脂でモ
ールドして封止してなる表面実装用電気部品において、
前記合成樹脂のモールド部から露出するリードフレーム
の少なくとも一部に、前記合成樹脂のモールド温度より
も高い溶融点を有する薄板状の半田を、該半田の溶融点
以下の温度でかつ前記モールド温度よりも高い温度で接
着性能が喪失する接着剤により接着してあることを特徴
とする表面実装用電気部品。1. A surface mounting electric component comprising a lead frame electrically connected to an electric element, wherein a part of the lead frame is exposed and molded by a synthetic resin and sealed.
At least a part of the lead frame exposed from the mold portion of the synthetic resin, a thin plate-like solder having a melting point higher than the mold temperature of the synthetic resin, at a temperature below the melting point of the solder and from the mold temperature. An electric component for surface mounting, characterized in that it is adhered by an adhesive that loses its adhesiveness at high temperatures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062312U JP2501668Y2 (en) | 1989-05-29 | 1989-05-29 | Surface mount electrical components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062312U JP2501668Y2 (en) | 1989-05-29 | 1989-05-29 | Surface mount electrical components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH032655U JPH032655U (en) | 1991-01-11 |
| JP2501668Y2 true JP2501668Y2 (en) | 1996-06-19 |
Family
ID=31591345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989062312U Expired - Lifetime JP2501668Y2 (en) | 1989-05-29 | 1989-05-29 | Surface mount electrical components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501668Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5784575U (en) * | 1980-11-10 | 1982-05-25 | ||
| JP4836738B2 (en) | 2006-10-04 | 2011-12-14 | 三洋電機株式会社 | Manufacturing method of solid electrolytic capacitor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6367261U (en) * | 1986-10-23 | 1988-05-06 | ||
| JPS6452249U (en) * | 1987-09-28 | 1989-03-31 |
-
1989
- 1989-05-29 JP JP1989062312U patent/JP2501668Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH032655U (en) | 1991-01-11 |
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