JP2798861B2 - Hybrid integrated circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly, to a silicon gel-filled hybrid integrated circuit device.

[0002]

2. Description of the Related Art As shown in FIG. 8, a conventional hybrid integrated circuit device has a substantially box-shaped case material (60) and external leads (8).
0), a first insulating metal substrate (70) on which the integrated circuit element (82) and the like are fixed and mounted, and a second insulating metal substrate (90) mainly used for improving insulation.

[0003] The case material (60) has a wall (62) which comes into contact with the peripheral portion of the first insulating metal substrate (70). As shown in FIG. 10, a silicon gel introduction hole (64) is formed in one of the walls (62) formed in the direction in which the external lead is led out. Also, usually, the case material (60)
A step is formed at an end in the longitudinal direction, and a hole for a screw for connecting the hybrid integrated circuit device to a heat sink (not shown) is formed in the step. This case material (60) is obtained by injection molding, for example, fiberglass rain hose PET (FRPET).

First and second insulated metal substrates (70)
(90) is approximately 2 mm in consideration of heat radiation characteristics and workability.
Thick aluminum is used and its surface is anodized to improve insulation. First insulating metal substrate (7
0) is a rectangle, and when the hybrid integrated circuit device is substantially completed, the hybrid integrated circuit device substrate is divided into several units and several tens of units, and is divided into unit hybrid integrated circuit device sizes and pressed. The second insulating metal substrate (90) has substantially the same planar shape as the case material (60), and an adhesive layer (92) for bonding the second insulating metal substrate (90) to the first insulating metal substrate (70) is provided with a heat sink (not shown). And the first insulating metal substrate (70).

An external lead pad (74), a die bond pad (76), a wire bonding pad (78), and a conductive path (not shown) are made of a thermosetting insulating resin having an adhesive property such as a polyimide resin and having a thickness of about 35 μm. After the clad material with the copper foil is hot-pressed on the first insulating metal substrate (70) at a temperature of 150 ° C. to 170 ° C. and a pressure of 50 to 100 kg per square centimeter, the copper foil is subjected to a predetermined pattern by photo-etching or the like. Formed. The thermosetting insulating resin is completely cured in this hot pressing step to form an insulating layer (72) having a thickness of about 35 μm.

Chip components are used for semiconductor elements such as the integrated circuit element (82) and other circuit elements, and the integrated circuit element (82) is formed of a die bond pad (70) on a first insulating metal substrate (70) using silver paste or the like. 76), chip capacitors or chip resistors, external leads (8
The odd-shaped parts such as 0) are fixed to predetermined pads by soldering. These circuit elements and components are provided with predetermined pads (74) (7).
6) After temporarily attaching to the solder paste screen-printed on (78), it is completely fixed by reflow. The peripheral portion of the first insulated metal substrate (70) is heat-pressed (125 ° C., 8 ° C.) to the wall (62) of the case material (60) using an epoxy impregnated polyester nonwoven fabric as an adhesive sheet.
Time), and the mounted circuit element is sealed.

[0007]

SUMMARY OF THE INVENTION The present invention is directed to an external lead (80) which may require reliability, and which may occur in silicon gel filled hybrid integrated circuit devices where special heat cycle tests are performed. This is made in the process of elucidating the cause of the separation of the pad (74). That is, according to the research of the inventor, when the hybrid integrated circuit device sealed with the resin case material (60) is subjected to the heat cycle test, as shown by the arrow in FIG. 8, the end of the case material (60) is directed upward. It was known to bend. In addition, the thermosetting resin (96) and the first
It is also known that this curvature is small when the bonding with the insulating metal substrate (70) is complete.

The adhesive strength between the thermosetting resin (96) such as epoxy resin and the case material (60) filled in the area where the external leads (80) are fixed is extremely high, while the silicone gel (94) and other materials are used. When the silicon gel (94) adheres to the fixing portion of the external lead (80) due to the low adhesive strength of the material of the external lead (80), the thermosetting resin (96) and the external lead (80) was lifted from the first insulating metal substrate (70), and it was clarified that the pad (74) was eventually separated.

The reason why the silicon gel (94) adheres to the fixing portion of the external lead (80) is that in the conventional hybrid integrated circuit device, silicon in a sol state is injected from the fixing portion of the external lead (80). This is because the silicon sol that wets the outer wall of the injection pipe adheres to the fixing portion of the external lead (80). In addition, since the silicon sol to be injected has high fluidity, as shown in FIG. 8, the electrode pattern for the external lead (80) penetrates, and the fixing portion of the external lead (80) is wetted with the silicon sol. This is because the silicon sol scattered when the silicon sol is injected at a high pressure adheres to the fixing portion of the external lead (80).

Further, in the hybrid integrated circuit device having the conventional structure, since a pair of external leads are led out from opposite surfaces, it is impossible to simultaneously fill and cure a thermosetting resin for reinforcing the external lead fixing portion. There is a problem that it is possible and the manufacturing process is complicated. The present invention has been made in view of the above-described problems, and a first object of the present invention is to provide a highly reliable silicon gel-filled type which does not cause pad peeling even when a severe heat cycle is applied. A second object is to provide a hybrid integrated circuit device capable of simultaneously filling and curing a thermosetting resin for reinforcing an external lead fixing portion. .

[0011]

Means for Solving the Problems The above-mentioned problems are solved,
In order to achieve the object, a hybrid integrated circuit device according to the present invention includes an integrated circuit board having a plurality of integrated circuit elements and external lead terminals fixed and mounted on a circuit pattern formed on an insulated metal substrate, and an integrated circuit element mounting area. A substantially frame-shaped resin case material having at least a wall for dividing an external lead terminal fixing region, a silicon gel and a first thermosetting resin sequentially laminated in an integrated circuit element mounting space, and an external lead. A second thermosetting resin to be filled in the space of the terminal lead-out side, and a protruding portion that is disposed on a side surface in the wall at a corner portion to prevent the silicon gel from rising,
It is characterized in that a space is formed in the separated area of the corner portion, and a stopper is provided in the corner portion to prevent silicon gel from rising in the corner portion.

Further, a hybrid integrated circuit device according to the present invention provides an integrated circuit board having a plurality of integrated circuit elements and external lead terminals fixed and mounted on a circuit pattern formed on an insulated metal substrate; A substantially frame-like shape having at least a wall divided from the external lead terminal fixing region and arranged near the external lead terminal fixing pad, and an opening for filling the silicone gel and the thermosetting resin formed in the same direction. A resin case material, a silicon gel and a first thermosetting resin sequentially laminated in an integrated circuit element mounting space, and a second thermosetting resin filled in a space of an external lead terminal lead-out side. In addition, a protrusion is provided on a side surface in the wall to prevent the silicon gel from rising, and a plurality of holes are provided in the protrusion.

[0013]

In the hybrid integrated circuit device configured as described above, the external lead fixing region of the silicon sol injection pipe is formed by forming a wall dividing the integrated circuit element mounting region and the external lead fixing region in the case material. Thus, the problem that the silicon sol on the outer wall of the silicon sol injection pipe adheres to the external lead fixing region and the problem that the scattered silicon sol adheres to the external lead fixing region can be solved.

Further, a wall is formed in the case material to divide the integrated circuit element mounting area and the external lead fixing area, and an opening for filling the silicon gel and the thermosetting resin is formed in a single direction. In addition, the problem of contamination of the external lead fixing portion due to scattering of the silicon sol or the like can be solved, and the injection of the silicon sol and the filling of the thermosetting resin can be performed on a single jig.

Further, the thermosetting resin can be simultaneously filled into the outer lead fixing region of the case material having the opening for filling the silicone gel and the thermosetting resin in a single direction and the upper portion of the silicon gel, The problem of contamination of the external lead fixing part due to scattering of silicon sol is solved,
Thermosetting resin filling can be completed in one go. Further, since the stopper is provided on the side surface of the case member so as to form a space at the projecting portion and the corner portion, it is possible to prevent the silicon gel from rising at the side surface and the corner portion of the wall member. At the same time, when the thermosetting resin is filled on the silicon gel, it is possible to prevent the formation of an air (bubble) layer at the corner of the wall.

Further, since a plurality of holes are provided in the protruding portion formed on the side surface inside the wall of the case material, it is possible to prevent the silicon gel from climbing on the side surface of the wall and to obtain a thermosetting resin. When the resin is filled on the silicone gel, it is possible to prevent the formation of an air (bubble) layer below the protrusion.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid integrated circuit device according to the present invention will be described below with reference to the embodiments shown in FIGS. Referring to FIGS. 1 and 2, an embodiment illustrating a hybrid integrated circuit device in a dual in-line package includes a pair of walls (14) in a frame (12), the walls (14) providing an insulating metal. The area on the substrate (30) is integrated with the integrated circuit element mounting area (1).
6) and a first insulating metal substrate (30) for fixing and mounting a semiconductor material such as an integrated circuit element (46), an external lead (44) and the like, which is divided into a case material (10) divided into an external lead fixing area (18). ), A second insulating metal substrate (50) mainly used for improving insulation, and an integrated circuit element mounting area (1).
The silicone gel (56) filled in 6) and the thermosetting resin (58) filled in the upper portion of the silicone gel (56) and the external lead fixing area (18).

The silicon gel (56) filled for the purpose of improving the weather resistance and the like is formed in a sol state by an unillustrated pump or the like in a predetermined area of the integrated circuit element mounting region (16) formed by the pair of walls (14). And then heat-treated after injection to gel. According to this embodiment, at this time, the reason why the area of the integrated circuit element mounting area (16) is large, and the reason why the integrated circuit element mounting area (16) and the external lead fixing area (1) are large.
8) Because of the formation of the separation wall (14) between the silicon sol injection pipe and the outer lead fixing area (18) of the silicon sol injection pipe is prevented from approaching, and the silicon sol on the outer wall of the silicon sol injection pipe is reduced. The problem of adhesion to the external lead fixing region (18) and the problem of scattering silicon sol adhering to the external lead fixing region (18) do not occur.

Then, a thermosetting resin (58) is filled in the upper portion of the silicon gel (56) and the pair of external lead fixing regions (18), and heat-treated to complete the structure of FIG.
This embodiment will be described in more detail with reference to FIGS. FIG. 3 is a perspective view of the case member (10), and FIG. 4 is a plan view. The case member (10) is formed in a substantially frame shape as shown in FIGS. This case material is formed by injection molding using, for example, an insulating resin material such as fiberglass rain hose PET (FR-PET) and polyphenylene sulfide (PPS).

The case material (10) is a wall (14) for dividing an external lead fixing area and an integrated circuit element mounting area.
Is provided. And the inner surface of the wall (14),
That is, the first and second protrusions (1) and (2) are provided on the side surface on the integrated circuit element mounting region side, and the stopper (3) is provided on the corner portion.
Is provided. Here, the important thing is that the wall (1)
4) The first projection (1) formed in the wall (14)
Not be formed at the corners of Providing a plurality of holes (4) in the first protrusion (1). The stopper (3) is provided in a part of the space area of the corner where the first protrusion (1) is not provided. More specifically, the first protrusion (1) is provided on the wall (1) as shown in FIGS.
4) It is provided intermittently on the side surface except the corner part.
The first protrusion (1) is not formed at the corner of the wall (1) as described above, and the corner of the wall (14) at the position where the first protrusion (1) extends is provided. Will form a space. A stopper (3) is provided in the space of the corner where the first protrusion (1) is not formed. The stopper (3) is provided at a corner of the corner while leaving a space at the corner.

By the way, the first protrusion (1) prevents the silicon sol from climbing on the inner surface of the wall (14) due to surface tension when the silicon sol is filled, and the first thermosetting resin. This is for improving the adhesion of (58A). That is, after the silicon sol is heat-treated and gelled,
An epoxy resin is filled on the silicon gel to form a first thermosetting resin (58A). At this time, if there is no first protrusion (1), the silicon sol goes up on the inner surface of the wall, In a normal state, the first thermosetting resin (58
A) is in an adhesive state, for example, -40 ° C. to + 150 ° C.
When the thermal shock test of (1) was performed, the first thermosetting resin (58A) was expanded into the wall (14),
A problem of peeling off from the case material (10) occurs.

By providing the first protrusion (1) on the wall (14), the rising of the silicon sol can be prevented, and the adhesion between the thermosetting resin and the case material can be improved.
The thermosetting resin and the case material do not separate at the time of thermal shock. The stopper (3) prevents the silicon sol from climbing over the corner of the wall (14) by surface tension when the wall (14) is filled with the silicon sol as described above, The adhesiveness of the resin (58A) is improved. In order to prevent the silicon sol from rising at the corners of the wall (14), the first protrusion (1) described above is used.
Can be prevented by forming it in the corner portion.

However, when the first protrusion (1) is provided at the corner, when the thermosetting resin (58A) is filled on the silicon gel, the corner provided with the first protrusion (1) is formed. An air layer (bubbles) is generated in the portion, and the resin (58A) enters so as to crush the air layer (bubbles) during the step of heat-treating the thermosetting resin (58A), and a concave is formed on the surface of the resin (58A). There is a defect that causes appearance failure. For the above-mentioned reason, the first protrusion (1) is not provided at the corner of the wall (14).

As described above, the stopper (3) is formed with the space remaining in the space of the corner where the first protrusion (1) is not formed.
The rising of the silicon sol in the corner portion 4) can be prevented by the stopper 3 and the thermosetting resin 58
A) No air layer (bubbles) is generated at the corners during filling.
The plurality of holes (4) provided in the first protrusion (1) are also provided for the same reason as described above. That is, the thermosetting resin (58A) such as an epoxy resin is filled in the wall (14) filled with the silicon gel, and an air layer (bubbles) is formed below the first protrusion (1). The hole (4) is provided in the first protruding portion (1) in order to perform air bleeding easily.

FIG. 5 is a perspective view of a first insulated metal substrate (30) conforming to the present embodiment.
For 0), aluminum having a thickness of about 2 mm is used in consideration of heat radiation characteristics and workability, and its surface is anodized to improve insulation. When the hybrid integrated circuit device is substantially completed, the insulated metal substrate (30) is divided and pressed from the hybrid integrated circuit board of several units to several tens of units to the size of the unit hybrid integrated circuit device.

The external lead pad (38), the wire bonding pad (40), the die bond pad (42) and the conductive path (not shown) are made of a thermosetting insulating resin such as a polyimide resin having an adhesive property and having a thickness of about 35 μm. After the clad material with the copper foil is hot-pressed on the first insulating metal substrate (30) at a temperature of 150 ° C. to 170 ° C. and a pressure of 50 to 100 kg per square centimeter, the copper foil is subjected to a predetermined pattern by photo-etching or the like. Formed. The thermosetting insulating resin is completely cured in this hot pressing step to form an insulating layer having a thickness of about 35 μm (reference numeral 32 in FIG. 2).
reference).

Chip components are used for semiconductor elements such as the integrated circuit element (46) and other circuit elements, and the integrated circuit element (46) is fixed to the die bond pad (42) with a silver paste or the like, and a chip capacitor or An odd-shaped component such as a chip resistor is fixed to a predetermined pad by soldering.
These circuit elements are temporarily attached to a solder paste screen-printed on predetermined pads (40) (42), and then reflowed to be completely fixed.

Finally, the external lead terminals (44) are fixed to the fixing pads (38) by soldering. This external lead terminal (44) has about 3
A soldering iron heated to 00 to 350 ° C. is pressed for several seconds to melt the solder previously formed on the pad (38), and the lead terminal (44) is fixed on the pad (38) by soldering.

FIG. 6 is a perspective view of a second insulating metal substrate (50) mainly used for improving insulation. Second
The insulated metal substrate (50) is the first insulated metal substrate (30)
And a hole (5) at a position corresponding to the hole (22) for the screw to be coupled to the heat sink of the case material (10).
4) is formed. The second insulating metal substrate (50) is joined to the frame (12) of the case material (10) by a silicone resin (see reference numeral (52) in FIG. 2). Then, the silicone resin used for this bonding improves the insulation performance between the first insulating metal substrate (30) and the heat sink (not shown).

The first insulating metal substrate (30) is placed on the second insulating metal substrate (50), and as shown in FIG. 7, the case material (1) is arranged such that the external lead terminals (44) are directed upward.
0) and the two substrates (30) and (50) are bonded and integrated with an adhesive, and then the integrated circuit element mounting area (1) in the wall (14).
6) Inject a silicon sol in an optimal amount set in advance and heat-treat to form a silicon gel (56). Then, a thermosetting resin such as an epoxy resin is filled on the silicon gel (56) and the external lead fixing region, and heat-treated to complete a silicon gel-filled hybrid integrated circuit device. When the silicon sol is injected, the first protrusion (1) and the stopper (3) are provided in the wall (14) as described above.
The silicon sol does not enter the side surfaces and corners of the wall due to the formation of the sol. Further, even when the thermosetting resin is filled on the silicon gel in the wall, the first protruding portion (1) has a hole (4), and the corner portion has a space, so that the first protruding portion (1) is formed. No air layer (bubbles) is generated on the lower surface and the corners of the device.

In this embodiment, the first protrusion (1)
A second protrusion (2) is provided on the upper part of the base, and the second protrusion (2) and the first thermosetting resin (58A) are engaged with each other to expand and contract the silicone gel generated at the time of thermal shock. -Prevents peeling of the first thermosetting resin (58A) due to expansion.
The second protrusion (2) is formed in a region that does not overlap with the first protrusion (1), and has a triangular shape in order to improve the engagement state with the first thermosetting resin (58A). What is necessary is just to form.

[0032]

As described in detail above, according to the present invention,
A wall that divides the integrated circuit element mounting area and the external lead fixing area is formed in the case material, so there is little risk of approaching the external lead fixing area of the silicon sol injection pipe, and the silicon sol on the silicon sol injection pipe outer wall is fixed to the external lead. The problem of adhesion to the area and the problem of scattering silicon sol adhering to the external lead fixing area do not occur. As a result, it is possible to provide a highly reliable silicon gel-filled hybrid integrated circuit device that does not cause pad separation even when a severe heat cycle is applied.

Further, according to the present invention, the thermosetting resin is provided on the outer lead fixing region of the case material in which the opening for filling the silicone gel and the thermosetting resin is formed in a single direction and on the upper portion of the silicon gel. Simultaneous filling is possible, and the problem of contamination of the external lead fixing portion due to scattering of silicon sol or the like can be solved, and filling of the thermosetting resin can be completed in a single operation.

Further, according to the present invention, the stopper is provided on the side surface of the case material inside the wall so as to form a projecting portion and a space at the corner, so that the silicon gel on the side surface of the wall and the corner can be formed. It is possible to prevent rising. As a result, since the silicon gel does not adhere to the inner surface of the wall, the thermosetting resin can be prevented from peeling off from the case material at the time of thermal shock, and a highly reliable hybrid integrated circuit device can be provided.

Further, according to the present invention, a plurality of holes are formed in the protrusion formed on the side surface inside the wall of the case material, and a space is provided in the corner, so that the thermosetting resin can be coated on the silicon gel. When filling the space, it is possible to prevent the formation of an air (bubble) layer below the protrusions and at the corners of the wall. As a result, no depression occurs in the thermosetting resin, and the occurrence of external defects can be significantly suppressed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a perspective view of a case member.

FIG. 4 is a plan view of FIG. 3;

FIG. 5 is a perspective view of a first insulating metal substrate.

FIG. 6 is a perspective view showing a second insulating metal substrate.

FIG. 7 is a perspective view in which a case material and a first metal substrate are integrated.

FIG. 8 is a sectional view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st projecting part 2 2nd projecting part 3 stopper 10 case material 12 frame 16 integrated circuit element mounting area 18 external lead fixing area 30 first insulating metal substrate 32 insulating layer 38 external lead pad 40 wire bonding pad 42 Die bond pad 44 External lead terminal 46 Integrated circuit element 50 Second insulating metal substrate 52 Insulating layer 56 Silicon gel 57 Silicon adhesive 58A First thermosetting resin 58B Second thermosetting resin

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-74655 (JP, A) JP-A-61-48945 (JP, A) JP-A-4-1213460 (JP, A) JP-A-6-746 13500 (JP, A) JP-A-6-163745 (JP, A) JP-A-53-122650 (JP, U) JP-A-56-65659 (JP, U) JP-A 1-171038 (JP, U) (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/28 H05K 3/28

Claims (2)

(57) [Claims] An integrated circuit board on which a plurality of integrated circuit elements and external lead terminals are fixed and mounted on a circuit pattern formed on an insulated metal substrate, and a wall dividing an integrated circuit element mounting area and an external lead terminal fixing area. A resin case material of a substantially frame body including at least a body, a silicon gel and a first thermosetting resin sequentially stacked in the integrated circuit element mounting space, and a space filled in a space of an external lead terminal lead-out side. 2
A thermosetting resin, and a protrusion is provided on a side surface of the wall at a corner portion to prevent the silicon gel from rising, forming a space in a separation region of the corner portion, and A hybrid integrated circuit device, wherein a stopper for preventing the silicon gel from rising in the corner portion is provided in the corner portion. 2. An integrated circuit board on which a plurality of integrated circuit elements and external lead terminals are fixed and mounted on a circuit pattern formed on an insulating metal substrate, and an integrated circuit element mounting area and an external lead terminal fixing area are divided into a plurality of parts. A substantially frame-shaped resin case material having at least a wall disposed in the vicinity of an external lead terminal fixing pad and having openings in the same direction for filling with a silicone gel and a thermosetting resin; A silicon gel and a first thermosetting resin sequentially laminated in the element mounting space, and a second thermosetting resin filled in a space of an external lead terminal lead-out side; A hybrid integrated circuit device, comprising: a projection for preventing silicon gel from rising; and a plurality of holes provided in the projection.