JP3172393B2 - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE: To realize reduction in dead space and improvement in mounting efficiency of a substrate, by providing an outer lead support member which has a protrusion having a recess facing the periphery of the substrate. CONSTITUTION: An outer lead 21 is integrally molded by a support member 22, and a recess 26 is provided on the lower side of a right end surface 25 of a protrusion 24 of the exposed outer lead 21. Therefore, an element may be mounted in a space formed by the recess 26 and the surface of a substrate 10, so that improvement in element mounting efficiency of the substrate and reduction in the size of the substrate and the entire device can be realized. Also, by integrally supporting the outer lead 21, the strength of the outer lead can be improved. Even though a support pole is not provided on the support member, and even though the protruding portion is made longer, the support member is not inclined and perfect wire bonding can be performed. Thus, failure in adhesion and bonding between the support member and the substrate can be prevented, so as to improve yield.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device in which external leads and wiring on a substrate are connected by metal wires in order to support various types of connectors.

[0002]

2. Description of the Related Art In a conventional hybrid integrated circuit device, as shown in FIG. 5, a desired wiring pattern 2 is provided on a substrate 1 composed of a ceramic, a printed substrate, a metal substrate whose surface is insulated, and the like. A plurality of circuit elements 3 are provided in the pattern 2. The wiring pattern includes wiring, electrodes or lands integrated with the wiring, island-like lands, and pads to which external leads are fixed. Further, external leads 4 are fixed to the pads by soldering,
The circuit element 2 and the like are hermetically sealed by the sealing means 5.

In this structure, since the external lead 4 is soldered to the pad, there is a problem that the external lead is separated from the pad portion due to an external force applied to the external lead 4. For this reason, for example, as shown in FIG. 6 of JP-A-2-165694, an external lead 4 integrally molded with a support member 6 made of resin is used. Figure 8 here
The portion indicated by is the portion corresponding to the pad fixing portion 9 shown in FIG.

However, since the external lead 4 is inserted into, for example, a socket, its size is defined. In particular, in the case of a hybrid integrated circuit device for a car or the like, the size of the external lead varies depending on the manufacturer, and the thickness of the external lead differs depending on the width and the current capacity of the external lead. Therefore, it is necessary to prepare pads having different intervals, sizes, and the like on the substrate for each model in accordance with the various external leads, which is irrational and increases the cost. In addition, since the external leads are soldered, the solder scatters during soldering, causing a short circuit, a defect due to a flux, or a need to clean the flux.

For this reason, as shown in FIG. 3, for example, the external lead 4 is supported by a support member 6, and the fixing portion 9 of the external lead is formed by projecting the support member 6 in a cross section when viewed in cross section. The one that was placed on the upper surface 11 of the part 10 and the electrical connection area of the lead was exposed was adopted. For example, as shown in FIGS. 3 and 4, if the bonding pads 12 are arranged, the external leads 4 are connected by the thin metal wires 13 regardless of the size of the external leads 4. Since the connection was made by wire bonding without changing the pattern of the substrate, there was a feature that the inconvenience due to solder and flux was eliminated.

[0006]

However, the lower surface 14 of the protruding portion 10 of the support member 6 is mounted on the substrate 1 as shown in FIG.
The distance from the fixing portion of the external lead 4 to the fixing portion 9 of the upper surface 11 (the portion indicated by the arrow A) is required to be about 4 mm or more, although it depends on the size of the external lead 4. Also, due to the wire bonding apparatus, the distance from the bonding area of the external lead to the bonding portion of the bonding pad 12 (portion indicated by arrow B) needs to be at least about 4.5 mm, and the E portion is a dead space. Therefore, there is a problem that the size of the substrate is rather large when assembling the same circuit substrate.

Further, the right end of the protruding portion in FIG. 3 is indicated by a dashed line in FIG. 4, but nothing is provided between the dashed line and the bonding pad 12, so that the substrate size is further increased. However, there is a problem that mounting efficiency deteriorates when considered in total.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problem. First, a bonding region of an external lead extends toward the inside of a substrate and corresponds to a lower layer of the extended portion. This problem is solved by providing an external lead support member provided with a recess toward the periphery of the substrate so that the element can be mounted on the substrate.

Second, the external lead is integrally supported, and the bonding area extends inward above the substrate.
A C-shaped external lead support member provided with a recess toward the periphery of the substrate so that an element can be mounted on the substrate corresponding to the lower layer of the extension portion; This problem can be solved by providing a bonding area of an external lead or a conductive pad provided at an arbitrary distance by an element provided in a layer below the portion.

Third, the problem can be solved by providing a support on the support member. Fourth, the bonding area of the external lead extends toward the inside of the substrate, and the bonding area with the substrate is larger than that of the extending area so that the element can be mounted on the substrate corresponding to the lower layer of the extending part. The problem is solved by providing an external lead support member having a short portion.

[0011]

First, by providing an external lead support member provided with a recess toward the periphery of the substrate, a bonding area having a sufficient area for bonding is provided on the upper surface of the convex portion, and the convex portion of the convex portion is provided. Since the element can be mounted on the lower layer of the lower surface, the dead space can be reduced.

Second, since the external leads are integrally supported together with the first operation, the strength of the external leads can be improved. Third, by providing the support member with a support, even if the protruding portion becomes long, the wire bonding can be completely performed without tilting the support member. 4th
In addition, by providing an external lead supporting member having a shorter length of the bonding portion with the substrate than the extending region, the upper surface of the convex portion has sufficient bonding for the bonding, similarly to the first operation. Since a bonding region having a large area is provided and an element can be mounted below the lower surface of the projection, a reduction in dead space can be realized.

As shown in FIG. 7, when the protruding portion is inclined, as the protruding portion becomes longer, the base portion becomes thicker,
The strength is increased as compared with FIG.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. First, the insulated first substrate 10
In FIG. 2, a wiring pattern 11 is formed on the surface, and a land 12 is provided on a part of the wiring pattern as shown in FIG. A semiconductor chip 13 is soldered to this land, and a resistance or the like is fixed to the conductive path 11 serving as a wiring by printing, and a component is fixed by soldering.

Here, the first substrate 10 may be a ceramic substrate, an insulating resin substrate, for example, a printed substrate or a metal substrate whose surface is insulated. Here, a metal substrate 10 in which aluminum oxide is generated by anodizing the surface of an Al substrate
The wiring pattern 11 is made of copper foil and is attached by hot pressing via a resin layer such as polyimide.

The semiconductor chip 13 is, of course, a diode, a transistor chip, and an LSI chip. In addition, components such as a resistor 14, a transformer, and a capacitor are mounted as necessary. The wiring pattern 11 includes a wiring 15 and an electrode integrated with the wiring (for example, a portion 16 to which a chip resistor is connected).
And bonding pad 17), land 1 integrated with wiring
8. Pads 19 (indicated by hatching in the drawing) which are integrated with the wiring but used for connection to external leads, lands 13 and the like.

Further, a thin metal wire is wire-bonded to the chip and the conductive path 11 as necessary to achieve a predetermined circuit. Pads 19 (areas hatched by oblique lines) are provided near at least one side of the first substrate 10 for connection with external leads 21 extending from the circuit.
Are provided. Although this arrangement is a feature of the present invention, it will be described later for convenience of explanation.

The external lead 21 is fixed by an external lead supporting member 22, and at least a connection region is exposed for connection with the pad 19. Here, as is clear from FIG. 1, the external leads are integrally molded with the support member 22, and only the bonding area is exposed. Since the external lead 21 is integrally molded, even if an external force is applied to the external lead 21, the external lead is firmly fixed.
The bonding portion of the wire does not peel. Further, the support member 22 may not be integrally formed, but may be formed by a step (the surface 23) of the support member 22.
The external leads may be bonded and fixed to the upper surface of the projection 24).

The point here is, as described with reference to FIG. 3, as long as the booked area is simply exposed.
The feature of the present invention is that the recess 2 is formed below the right end face 25 of the projection 24.
6 is provided. As described in the section of the problem to be solved by the invention, the bonding area for connecting the external lead 21 and the substrate 10 needs to be at least about 4 mm long, and accordingly, the supporting member 22 The protruding length also increases. However, since the recess 26 is provided, the space formed by the recess 26 and the surface of the substrate 10 includes:
Since elements (wiring, printed resistance, etc. are also possible) can be mounted, the efficiency of mounting elements on the substrate can be improved, and the size of the substrate and the entire device can be reduced as compared with the structure of FIG.

In FIG. 2, the region directed downward from the position indicated by the arrow D is the conventional type, that is, the portion indicated by the chain line shown in FIG. The dashed line indicated by the arrow E indicates the right side of the joint between the support member 22 and the substrate 10. That is, between the arrows D and E, the various types of wiring patterns described above are provided, and depending on the height of the recess, a tall element such as a chip resistor or a semiconductor chip can be mounted.

As a second feature, the arrangement of the pad 19 indicated by oblique lines will be described below. The position of the pad 12 described with reference to FIG. 4 is arranged at a predetermined distance from the bonding portion of the external lead 4 for performing bonding. Therefore, they are arranged on a straight line. When this structure is applied to FIG. 1 or FIG. 2, the pad arranged on the straight line between the arrows D and E becomes an obstacle, and it becomes difficult to arrange various types of wiring patterns. There is a problem that worsens.

Accordingly, the present application is to prevent the position of the pad from being a fixed distance due to the wiring pattern provided between the arrows D and E or due to the wiring pattern on the right side of the arrow D. That is, by searching for an empty space and providing the pad 19 in the area of the wiring pattern provided on the left and right sides of the area D, deterioration of the mounting efficiency in the case shown in FIG. 4 can be prevented. Also, since the bonding machine is computer-controlled recently, there is no problem since the distance between the bonding area of the external lead and the pad can be arbitrarily selected. It is also possible to directly bond to a semiconductor element such as a transistor.

If it is necessary to lengthen the upper surface of the projection due to the specifications of the external lead, the bonding surface between the support member and the substrate may be peeled off by the pressing force of the bonding, or the ultrasonic output may be properly applied to the bonding surface during bonding. It may not be transmitted. In this case, this problem can be solved by providing a support between the lower surface of the protrusion 24 of the support member and the substrate. This support may be formed integrally with the support member, or may be integrated with the substrate. Further, they may be formed separately.
Although it depends on the width of each external lead, at least one lead is sufficient.

FIG. 7 shows a second embodiment. This embodiment has a surface that connects the upper corner of the convex portion 24 of the previous embodiment to the right side of the bonding surface with the substrate and that is inclined diagonally downward and to the left. Since the wiring pattern is provided in the space formed here since the shape is different but has a recess, the mounting efficiency can be improved. In both embodiments, finally, a sealing space for sealing the substrate surface with resin is formed by the support member 22 and a frame material or a case material (not shown here) surrounding the periphery of the substrate. In FIG. 7, it is difficult to mount an element having a height at the left end because it is inclined obliquely to the lower left, but it is possible to take out bubbles taken into the resin when the resin is injected.

For example, silicon gel is injected from above,
Subsequently, a resin such as epoxy is injected and completed. Silicone gel prevents distortion of fine metal wires and the like connected to a semiconductor chip and the like and improves moisture resistance, and is not necessarily required to be injected.

[0026]

As is clear from the above description, the first
In addition, by providing an external lead supporting member having a convex portion provided with a recess toward the periphery of the substrate, a bonding area having a sufficient area for bonding is provided on the upper surface of the convex portion, and the lower surface of the convex portion is provided. Since the element can be mounted in the lower layer, the dead space can be reduced. Therefore, depending on the size of the external leads, the same substrate can be developed in many types without changing the design of the pattern provided on the substrate, and the overall size of the device can be suppressed from being increased without deteriorating the mounting efficiency of the substrate.

Second, since the external leads are integrally supported together with the first effect, the strength of the external leads can be improved. Further, the portion to which the other end of the wire connected to the external lead is connected, that is, the position of the pad, arbitrarily sets the length of the wire, that is, the distance between the bonding region of the external lead and the pad. That is, the pad is provided at an appropriate position (vacant space) due to the wiring pattern of the recessed portion or the wiring pattern provided on the right side thereof, so that the mounting position is restricted due to the restriction of the pad position. I will not let you.

Third, by providing the support member with a support, the wire bonding can be completely performed without the support member being inclined even when the protruding portion becomes long. Therefore, poor adhesion and poor bonding between the support member and the substrate can be prevented, which leads to an improvement in yield. Fourth, by providing an external lead supporting member provided with a shorter bonding portion with the substrate than the extension region, the upper surface of the projection is bonded to the upper surface of the projection in the same manner as in the first operation. Since a bonding region having a sufficient area is provided and an element can be mounted below the lower surface of the projection, a reduction in dead space can be realized.

As shown in FIG. 7, when the protruding portion is inclined, as the protruding portion becomes longer, the base portion becomes thicker,
The strength is increased as compared with FIG. In addition, when the resin is sealed, air bubbles taken in can be removed, and particularly in the case of a device in which a large current flows and generates heat, bursting of the air bubbles and the like can be prevented.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a first embodiment of the present invention.

FIG. 2 is a plan view corresponding to FIG.

FIG. 3 is a cross-sectional view of a conventional hybrid integrated circuit device.

FIG. 4 is a plan view corresponding to FIG.

FIG. 5 is an assembly diagram of a conventional hybrid integrated circuit device.

FIG. 6 is a view of a conventional support member in which external leads are integrally formed.

FIG. 7 is a diagram illustrating a second embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 10 first substrate 11 wiring pattern 12 land 13 semiconductor chip 14 resistor 15 wiring 17 bonding pad 18 land 19 pad 21 external lead 22 external lead support member 26 recess

Claims (4)

(57) [Claims] 1. A substrate having at least a surface having an insulating property; a wiring pattern provided on the substrate; a semiconductor element electrically connected to a land formed integrally with or separate from the wiring pattern; An external lead to which an input / output signal of a circuit constituted by a pattern or the semiconductor element is applied, and a bonding region of the external lead extends toward the inside of the substrate, and corresponds to a lower layer corresponding to the extended portion. An external lead support member provided with a recess toward the periphery of the substrate so that an element can be mounted on the substrate; connecting means for connecting a conductive pad provided on the substrate to a bonding area of the external lead; and at least the substrate A hybrid integrated circuit device having sealing means for protecting a surface and a bonding portion. 2. A substrate having at least a surface having an insulating property; a wiring pattern provided on the substrate; a semiconductor element electrically connected to a land integrated with or separate from the wiring pattern; An external lead to which an input / output signal of a circuit constituted by the pattern or the semiconductor element is applied; and an external lead which is integrally supported, and a bonding region extends inward above the substrate, and As the element can be mounted on the substrate corresponding to the lower layer of the part,
An external lead support member having a U-shape provided with a recess toward the periphery of the substrate; and an element provided on the substrate and provided below the extending portion, the bonding area of the external lead or an arbitrary distance. A hybrid integrated circuit device, comprising: a conductive pad provided on a substrate; connecting means for connecting the bonding area between the conductive pad and the external lead; and sealing means for protecting at least the substrate surface and the bonding portion. . 3. The hybrid integrated circuit device according to claim 1, wherein a pillar is provided in the recess of said substrate support member. 4. A substrate having at least a surface having an insulating property; a wiring pattern provided on the substrate; a semiconductor element electrically connected to a land formed integrally with or separate from the wiring pattern; An external lead to which an input / output signal of a circuit constituted by a pattern or the semiconductor element is applied, and a bonding region of the external lead extends toward the inside of the substrate, and corresponds to a lower layer corresponding to the extended portion. An external lead supporting member provided with a shorter bonding portion with the substrate than the extending region so that an element can be mounted on the substrate; and a bonding region between the conductive pad provided on the substrate and the external lead. And a sealing means for protecting at least the substrate surface and the bonding portion.