JPS6333319B2 - - Google Patents
Info
- Publication number
- JPS6333319B2 JPS6333319B2 JP54140858A JP14085879A JPS6333319B2 JP S6333319 B2 JPS6333319 B2 JP S6333319B2 JP 54140858 A JP54140858 A JP 54140858A JP 14085879 A JP14085879 A JP 14085879A JP S6333319 B2 JPS6333319 B2 JP S6333319B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- leadless
- component
- circuit board
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 14
- 238000000605 extraction Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000007650 screen-printing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- -1 resistors Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明はチツプコンデンサ、チツプ抵抗または
チツプインダクタ等のように、表面に取出電極を
有するリードレスタイプの電子部品を回路基板上
に半田付けする方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for soldering leadless type electronic components, such as chip capacitors, chip resistors, chip inductors, etc., having lead-out electrodes on the surface onto a circuit board.
最近、超薄形ラジオ、超薄型電卓、超小型トラ
ンシーバ、水晶発振腕時計等に見られる如く、電
子機器の超薄型化、超小型化および高密度実装化
が進むにつれて、小型リードレスタイプのチツプ
状電子部品を、回路基板の導電パターンに直接半
田装着する回路モジユールの組立が急速に普及し
つつある。 Recently, as electronic devices have become ultra-thin, ultra-miniature, and highly packaged, as seen in ultra-thin radios, ultra-thin calculators, ultra-compact transceivers, crystal oscillation watches, etc., small leadless types have become increasingly popular. Circuit module assembly in which chip-shaped electronic components are directly soldered to conductive patterns on a circuit board is rapidly becoming popular.
チツプ状のリードレス部品は、一般に第１図に
示すように、基体１の相対向両面に取出電極２，
３を付与した構造となつている。このリードレス
部品を他のデイスクリート部品と共に回路基板に
実装する場合、従来は第２図a1に示すようにガラ
スエポキシ等の基板４に貼り合わせた銅箔を必要
なパターンでエツチングして導電パターン５を形
成し、その表面に半田レジスト６を塗布してプリ
ント回路基板を構成すると共に、このプリント回
路基板上のリードレス部品を取り付ける位置に、
予め熱硬化性のエポキシ接着剤等の接着剤７をマ
イクロデイスペンサ法もしくはスクリーン印刷法
等により必要量だけ塗布し、次に第２図a2に示す
ように、自動装着機等を用いて接着剤７上にリー
ドレス部品９を載せ、100〜150℃程度の温度条件
下で、0.5〜１時間程度キユアさせ、電子部品９
をプリント回路基板上に仮固定する。次に第２図
a3に示すように、他のリード付部品１０を所定位
置にインサートした後、たとえばリードレス部品
９の取付面側を下にして半田デイツプを行ない、
リードレス部品９の取出電極２，３およびリード
付部品１０のリード端末を、銅箔である導電パタ
ーン５上に半田１１で本固定していた。 Chip-shaped leadless components generally have lead-out electrodes 2, on opposite surfaces of a base 1, as shown in FIG.
It has a structure with a rating of 3. When mounting this leadless component on a circuit board together with other discrete components, conventionally, as shown in Figure 2a1 , a copper foil bonded to a substrate 4 made of glass epoxy or the like is etched in the necessary pattern to make it conductive. A pattern 5 is formed, a solder resist 6 is applied to the surface of the pattern 5, and a printed circuit board is constructed.
Apply the required amount of adhesive 7 such as thermosetting epoxy adhesive in advance using a microdispenser method or screen printing method, and then adhere using an automatic placement machine, etc., as shown in Figure 2a2 . The electronic component 9 is placed on the leadless component 7 and cured for approximately 0.5 to 1 hour at a temperature of approximately 100 to 150°C.
Temporarily fix it on the printed circuit board. Next, Figure 2
As shown in a 3 , after inserting another leaded component 10 in a predetermined position, for example, solder dip the leadless component 9 with its mounting surface facing down.
The extraction electrodes 2 and 3 of the leadless component 9 and the lead terminals of the leaded component 10 were permanently fixed onto a conductive pattern 5 made of copper foil with solder 11.
上述のように、従来はリードレス部品を接着剤
で仮固定する方法を採用していたから、次のよう
な欠点があつた。 As mentioned above, the conventional method of temporarily fixing leadless components with adhesive has resulted in the following drawbacks.
(a) 接着剤の塗布、硬化工程が必要であるため生
産性が悪く、コスト高になる。(a) Since adhesive application and curing steps are required, productivity is low and costs are high.
(b) 接着剤の熱硬化工程で、銅箔面が酸化され、
半田の濡れ性が悪くなり、作業性の低下および
信頼性の低下を招く。(b) During the heat curing process of the adhesive, the copper foil surface is oxidized,
Solder wettability deteriorates, leading to decreased workability and reliability.
(c) 接着剤塗布法として一般的に用いられている
マイクロデイスペンサ法は、塗布箇所分だけの
本数が必要であり、設備費が高くなるうえに、
多本数になれば個々のマイクロデイスペンサに
おける接着剤塗布量がそれだけバラツキを生じ
易く、個々の電子部品の接着力、高さ等が浮動
し、最悪の場合には接着できない電子部品を生
じることもある。特に自動装着機を使用して多
数個のチツプ状電子部品を同時に接着すると
き、この欠点は一層出やすく、自動装着におけ
る信頼性低下の原因になる。(c) The microdispenser method, which is commonly used as an adhesive application method, requires as many dispensers as the number of adhesive application points, which increases equipment costs.
If there are a large number of microdispensers, the amount of adhesive applied by each microdispenser is likely to vary accordingly, and the adhesive strength and height of individual electronic components will fluctuate, and in the worst case, some electronic components may not be able to be bonded. be. In particular, when a large number of chip-shaped electronic components are bonded simultaneously using an automatic mounting machine, this drawback is more likely to occur and becomes a cause of reduced reliability in automatic mounting.
(d) マイクロデイスペンサ法によればスペース的
に一度に塗布し得る個数に限界があるため、何
回にも分けて塗布する必要があり、必然的に工
数増大によるコストアツプを招き、また設備費
も高くなる。(d) According to the micro-dispenser method, there is a limit to the number of particles that can be applied at one time due to space limitations, so it is necessary to apply the particles in several parts, which inevitably increases costs due to increased man-hours and equipment costs. It also becomes more expensive.
(e) また、マイクロデイスペンサ法の代りにスク
リーン印刷法を用いた場合は、一工程で多数個
所に適量の接着剤を塗布できる利点はあるが、
その反面、スクリーン印刷法が一工程で目づま
りを起すため、一工程毎にスクリーン印刷版を
交換しなければならない。このため生産性が上
らず、またスクリーン印刷版の使用量が多くな
り、設備費が高くつくという欠点を生じる。(e) Also, if screen printing is used instead of the microdispenser method, it has the advantage of being able to apply the appropriate amount of adhesive to multiple locations in one process;
On the other hand, the screen printing method causes clogging in one step, so the screen printing plate must be replaced after each step. This results in disadvantages such as low productivity, increased usage of screen printing plates, and high equipment costs.
本発明は上述する従来の欠点を除去し、回路基
板への半田付け作業性が良好で、生産コストおよ
び設備費を低く抑えることができ、しかも取付後
の信頼性の高い電子部品の半田付方法を提供する
ことを目的とする。 The present invention eliminates the above-mentioned conventional drawbacks, has good soldering workability to circuit boards, can keep production costs and equipment costs low, and has a highly reliable method for soldering electronic components after mounting. The purpose is to provide
上記目的を達成するため、本発明に係る電子部
品の半田付方法は、表面に取出電極を有するリー
ドレス部品を、他のリード付部品と共に回路基板
に半田付けする場合に、前記リードレス部品の前
記取出電極または前記回路基板の一面に形成され
た導電パターンの少なくとも一方に半田を付着さ
せておき、前記回路基板の前記一面を上にして前
記導電パターン上に前記リードレス部品を配置
し、かつ、加熱することにより、前記取出電極を
前記半田で前記導電パターンに仮固定した後、前
記リード付部品のリード端部を前記回路基板の一
面側から他面に導いて仮固定し、次に、前記回路
基板の前記一面側に、前記仮固定に用いた半田よ
り低融点の半田による半田デイツプを施して、前
記リードレス部品の前記取出電極およびリード付
部品のリード端部を、導電パターンに同時に本固
定することを特徴とする。 In order to achieve the above object, a method for soldering electronic components according to the present invention provides a method for soldering electronic components when a leadless component having an extraction electrode on the surface is soldered to a circuit board together with other leaded components. Solder is attached to at least one of the lead-out electrode or a conductive pattern formed on one surface of the circuit board, and the leadless component is placed on the conductive pattern with the one surface of the circuit board facing upward, and , After temporarily fixing the extraction electrode to the conductive pattern with the solder by heating, leading the lead end of the leaded component from one side of the circuit board to the other side and temporarily fixing it, then, A solder dip is applied to the one surface side of the circuit board using a solder having a lower melting point than the solder used for the temporary fixing, and the lead electrode of the leadless component and the lead end of the leaded component are attached to the conductive pattern at the same time. It is characterized by being fixed.
以下実施例たる添付図面を参照し、本発明の内
容を具体的に説明する。第３図a1，a2，b1，b2お
よびc1〜c3は本発明に係る電子部品の半田付方法
を説明する図である。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically described below with reference to the accompanying drawings, which are examples. FIG. 3 a 1 , a 2 , b 1 , b 2 and c 1 to c 3 are diagrams for explaining the method of soldering electronic components according to the present invention.
まず、第３図a1，a2に示すように、相対向する
両側面に取出電極２，３を設けたチツプ状のリー
ドレス部品９の、前記取出電極２，３上に、半田
１３，１４をコーテイングする。この半田１３，
１４は、たとえば融点が450度程度の高融点の半
田を使用する。このような高融点の半田は、一般
的にSn−Pb系半田に、Cd、Zn、Ag等の金属を、
２種或は３種組み合せることにより、容易に得る
ことができる。 First, as shown in FIGS. 3 a 1 and a 2 , solder 13, Coat 14. This solder 13,
No. 14 uses high melting point solder, for example, about 450 degrees. Such high melting point solder is generally made by adding metals such as Cd, Zn, and Ag to Sn-Pb solder.
They can be easily obtained by combining two or three types.
一方、このリードレス部品９を取り付ける回路
基板は、第３図b1，b2に示すように、ガラスエポ
キシ等の基板４に張り合わせた銅箔を必要なパタ
ーンでエツチングして導体パターン５を形成する
と共に、この回路基板上のリードレス部品を取り
付ける導体パターン５の表面に、予め前述の半田
１３，１４と同程度の融点を有する高融点の半田
１５，１６を、たとえばスクリーン印刷法等によ
り印刷形成しておく。 On the other hand, the circuit board to which this leadless component 9 is attached is made by etching a copper foil laminated to a substrate 4 made of glass epoxy or the like in a necessary pattern to form a conductor pattern 5 , as shown in Fig. 3 b 1 and b 2. At the same time, high melting point solders 15 and 16 having a melting point similar to that of the solders 13 and 14 described above are printed in advance on the surface of the conductor pattern 5 on which leadless components are attached on this circuit board by, for example, screen printing. Form it.
次に第３図c1に示すように、自動装着機等を用
いてリードレス部品９を、取出電極２，３上の半
田１３，１４が、導体パターン５上の半田１５，
１６の上に位置するようにして回路基板４上に載
せ、両者の接合部を半田１３〜１６の融点以上の
温度で加熱する。これにより半田１３〜１６が溶
着され、リードレス部品９が回路基板４上に仮固
定される。この時点では、リード付部品は挿着さ
れていないので、リード付部品に対して、リード
レス部品の仮固定時の熱が加わることがない。こ
のため、リードレス部品仮固定時の熱によるリー
ド付部品の熱的劣化を回避できる。 Then, as shown in FIG .
It is placed on the circuit board 4 so as to be located above the solder 16, and the joint between the two is heated at a temperature higher than the melting point of the solders 13 to 16. As a result, the solders 13 to 16 are welded, and the leadless component 9 is temporarily fixed onto the circuit board 4. At this point, the leaded component has not been inserted, so that no heat is applied to the leaded component during the temporary fixing of the leadless component. Therefore, it is possible to avoid thermal deterioration of the leaded component due to heat during temporary fixing of the leadless component.
次に第３図c2に示すように、コンデンサ、抵
抗、半導体等のリード付部品１７を所定位置に挿
入し、リード端部を折曲げて仮固定した後、リー
ドレス部品９を取付た面を下にして半田デイツプ
を行なう。この場合の半田は、融点が前記仮固定
に用いた融点より低いもの、たとえば融点が260
度程度のものを使用する。したがつて半田デイツ
プの工程で、仮固定用の半田１３〜１６が溶解す
ることがなく、第３図c3に示すように、リードレ
ス部品９およびリード付部品１７が半田１８によ
つて同時に本固定される。半田デイツプに使用さ
れる低融点の半田は、たとえばSn−Pb系半田に
Bi、Cd、In等の金属を２種以上組合わせること
により容易に得ることができる。 Next, as shown in Fig. 3c2 , the leaded parts 17 such as capacitors, resistors, semiconductors, etc. are inserted into the predetermined positions, the lead ends are bent and temporarily fixed, and then the surface on which the leadless parts 9 are attached is inserted. Solder dip with the side facing down. In this case, the solder has a melting point lower than that used for temporary fixing, for example, a melting point of 260
Use only a degree. Therefore, during the solder dip process, the solders 13 to 16 for temporary fixing do not melt, and the leadless component 9 and the leaded component 17 are simultaneously bonded by the solder 18, as shown in FIG . This is fixed. The low melting point solder used for solder dips is, for example, Sn-Pb solder.
It can be easily obtained by combining two or more metals such as Bi, Cd, and In.
上述のように、リードレス部品９及びリード付
部品１７を半田デイツプにより同時に本固定する
ので、本固定作業時間が少なくて済み、作業能率
が向上する。また、本固定が半田デイツプ工程で
あるので、通炉による加熱溶融に比較して、本工
固定において、熱の加わる時間が少なくて済む利
点が得られる。 As described above, since the leadless component 9 and the leaded component 17 are permanently fixed at the same time using the solder dip, the time required for the main fixing work is reduced, and work efficiency is improved. Further, since the main fixing is a solder dip process, compared to heating and melting by passing through a furnace, the main fixing has the advantage of requiring less time for applying heat.
上記実施例では、リードレス部品９と、回路基
板４の導体パターン５との両者に仮固定用の高融
点半田をコーテイングしているが、いずれか一方
は省略することも可能である。また本発明は、回
路基板に挿着するタイプのリードレス部品の半田
付けにあたつても、適用が可能である。 In the above embodiment, both the leadless component 9 and the conductor pattern 5 of the circuit board 4 are coated with high melting point solder for temporary fixing, but either one may be omitted. The present invention can also be applied to soldering leadless components of the type that are inserted into circuit boards.
本発明に係る電子部品の半田付方法によれば、
次のような効果が得られる。 According to the method for soldering electronic components according to the present invention,
The following effects can be obtained.
(イ) リードレス部品の取出電極または回路基板の
一面に形成された導電パターンの少なくとも一
方に半田を付着させておき、回路基板の一面を
上にして導電パターン上にリードレス部品を配
置し、かつ、加熱することにより、取出電極を
半田で導電パターンに仮固定する構成であるか
ら、リードレス部品の仮固定の工程が時間的に
短縮され、生産性が向上し、コストダウンが達
成される。(a) Solder is attached to at least one of the lead-out electrode of the leadless component or a conductive pattern formed on one side of the circuit board, and the leadless component is placed on the conductive pattern with one side of the circuit board facing upward; Moreover, since the lead-out electrode is temporarily fixed to the conductive pattern with solder by heating, the process of temporarily fixing leadless components is shortened in time, productivity is improved, and cost reductions are achieved. .
(ロ) リードレス部品を始めから半田付けする構成
で、導体パターンを構成する銅箔の表面酸化な
どを生じる余地がなく、半田付作業性および信
頼性が向上する。(b) With a configuration in which leadless components are soldered from the beginning, there is no possibility of surface oxidation of the copper foil that constitutes the conductor pattern, improving soldering workability and reliability.
(ハ) リードレス部品を仮固定した後に、リード付
部品のリード端部を回路基板の一面側から他面
に導いて仮固定する構成であるので、リード付
部品に対して、リードレス部品の仮固定時の熱
が加わることがない。このため、リードレス部
品仮固定時の熱によるリード付部品の熱的劣化
を回避することができる。(c) After temporarily fixing the leadless components, the lead ends of the leaded components are guided from one side of the circuit board to the other side and temporarily fixed. No heat is applied during temporary fixing. Therefore, it is possible to avoid thermal deterioration of the leaded component due to heat during temporary fixing of the leadless component.
(ニ) リードレス部品及びリード付部品を仮固定し
た後、仮固定に用いる半田より低融点の半田を
用いて、リードレス部品及びリード付部品の本
固定を行なうので、仮固定用半田を溶解させる
ことなく本固定を施すことができる。このた
め、リードレス部品に位置ずれを生じさせるこ
となく、機械的、電気的接続の信頼性の高い半
田付を行なうことができる。(d) After temporarily fixing the leadless and leaded parts, the leadless and leaded parts are permanently fixed using solder with a lower melting point than the solder used for temporary fixing, so the temporary fixing solder must be melted. Final fixation can be performed without having to do so. Therefore, it is possible to perform soldering with high reliability of mechanical and electrical connection without causing positional shift in the leadless component.
(ホ) リードレス部品およびリード付部品を、同時
に本固定するので、本固定作業時間が少なくて
済み、作業能率が向上する。また、本固定が半
田デイツプ工程であるので、通炉による加熱溶
融に比較して、加わる熱が時間的にも量的にも
少なくて済み、リードレス部品及びリード付部
品の熱的劣化を回避できる。(E) Since the leadless parts and the leaded parts are permanently fixed at the same time, the time required for the main fixing work is reduced, and work efficiency is improved. In addition, since the final fixing is a solder dip process, compared to heating and melting by passing through a furnace, the amount of heat applied is less in terms of time and quantity, avoiding thermal deterioration of leadless parts and leaded parts. can.
(ヘ) 仮固定、本固定を共に半田で行なうので、両
者の馳みが良く、電気的、機械的接続の信頼性
が向上する。(f) Since both the temporary fixing and the final fixing are done with solder, the bond between the two is good and the reliability of the electrical and mechanical connections is improved.
(ト) マイクロデイスペンサが不要となり、生産性
が向上し、設備費が安価になる。(g) A microdispenser is no longer required, productivity is improved, and equipment costs are reduced.
第１図はリードレス部品の一例における斜視
図、第２図a1〜a3は従来の半田付方法を説明する
図、第３図a1，a2，b1，b2，c1，c2，c3は本発明
に係る電子部品の半田付方法を説明する図であ
る。
２，３……取出電極、４……回路基板、５……
導電パターン、９……リードレス部品、１３，１
４……半田、１５，１６……半田、１７……リー
ド付部品、１８……半田。
Fig. 1 is a perspective view of an example of a leadless component, Fig. 2 a 1 to a 3 are diagrams explaining a conventional soldering method, Fig. 3 a 1 , a 2 , b 1 , b 2 , c 1 , c 2 and c 3 are diagrams illustrating the method of soldering electronic components according to the present invention. 2, 3...Takeout electrode, 4...Circuit board, 5...
Conductive pattern, 9... Leadless component, 13, 1
4...Solder, 15, 16...Solder, 17...Leaded parts, 18...Solder.
Claims (1)
他のリード付部品と共に回路基板に半田付けする
場合に、前記リードレス部品の前記取出電極また
は前記回路基板の一面に形成された導電パターン
の少なくとも一方に半田を付着させておき、前記
回路基板の前記一面を上にして前記導電パターン
上に前記リードレス部品を配置し、かつ、加熱す
ることにより、前記取出電極を前記半田で前記導
電パターンに仮固定した後、前記リード付部品の
リード端部を前記回路基板の一面側から他面に導
いて仮固定し、次に、前記回路基板の前記一面側
に、前記仮固定に用いた半田より低融点の半田に
よる半田デイツプを施して、前記リードレス部品
の前記取出電極およびリード付部品のリード端部
を、導電パターンに同時に本固定することを特徴
とする電子部品の半田付方法。1. Leadless parts with extraction electrodes on the surface,
When soldering to a circuit board together with other leaded components, solder is applied to at least one of the lead-out electrode of the leadless component or the conductive pattern formed on one surface of the circuit board, and The leadless component is placed on the conductive pattern with the one side facing up, and the lead-out electrode is temporarily fixed to the conductive pattern with the solder by heating, and then the lead end of the leaded component is are guided from one side of the circuit board to the other side and temporarily fixed. Next, a solder dip is applied to the first side of the circuit board using a solder having a lower melting point than the solder used for the temporary fixing, and the leads are then temporarily fixed. A method for soldering electronic components, characterized in that the extraction electrode of the lead-less component and the lead end of the lead-equipped component are permanently fixed to the conductive pattern at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14085879A JPS5664495A (en) | 1979-10-31 | 1979-10-31 | Method of soldering electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14085879A JPS5664495A (en) | 1979-10-31 | 1979-10-31 | Method of soldering electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5664495A JPS5664495A (en) | 1981-06-01 |
| JPS6333319B2 true JPS6333319B2 (en) | 1988-07-05 |
Family
ID=15278369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14085879A Granted JPS5664495A (en) | 1979-10-31 | 1979-10-31 | Method of soldering electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5664495A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017142A (en) * | 2012-07-10 | 2014-01-30 | Toshiba Toko Meter Systems Co Ltd | Spring terminal |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4954950B2 (en) * | 2008-07-09 | 2012-06-20 | 東洋機械金属株式会社 | Repair method for electronic parts using solder |
| JP6481458B2 (en) * | 2015-03-27 | 2019-03-13 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5476975A (en) * | 1977-11-30 | 1979-06-20 | Sanyo Electric Co | Soldering method |
-
1979
- 1979-10-31 JP JP14085879A patent/JPS5664495A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5476975A (en) * | 1977-11-30 | 1979-06-20 | Sanyo Electric Co | Soldering method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017142A (en) * | 2012-07-10 | 2014-01-30 | Toshiba Toko Meter Systems Co Ltd | Spring terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5664495A (en) | 1981-06-01 |
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