TWI797372B - Molding mold and resin molding device equipped with same - Google Patents

Abstract

[subject] Provided is a molding die that can widen a molding area on a workpiece as much as possible while easily venting air and preventing molding resin from leaking to unnecessary parts. [solution] The clamping portion 2d is recessed with an air channel 2j connected to the recessed portion 2g of the mold cavity and used as a passage for air or molding resin. The blocking pin 2k for opening and closing the air channel 2j straddles the outer peripheral end surface of the workpiece W and the clamping surface of the mold. The boundary is configured so that it can move forward and backward in the air channel 2j.

Description

Molding mold and resin molding device equipped with same

The present invention relates to a molding die and a resin molding device equipped with the same.

In recent years, with the advancement of workpiece thinning, the mold cavity filled with molding resin has also become thinner. On the other hand, the resin molding area (workpiece specification) also tends to expand. Furthermore, from the viewpoint of increasing the speed of semiconductor devices, there are more and more flip-chip connection type products in which terminals of a semiconductor wafer (hereinafter referred to as wafer) are connected to a substrate by bumps instead of wires. Therefore, it is necessary to underfill molding the narrow gap between the wafer and the substrate. Furthermore, based on the need to dissipate the heat generated by the wafer, there is also a need to expose the surface of the wafer and perform resin molding. In one example, heat dissipation can be achieved by bonding a heat sink on the exposed surface. Further, in terms of the goal of reducing manufacturing costs, it is possible to invert the substrate on a strip substrate type with a workpiece size of, for example, 100×300mm or less, or even a larger round semiconductor wafer on which a wiring pattern is formed. Examples of connecting chips by mounting chips, etc. In addition, since there are many semiconductor manufacturing methods, here is an example, the so-called eWLB (embedded Wafer Level Ball Grid Array, embedded wafer level ball grid array), etc., which stick thermoplastic tape on the semiconductor Wafer-shaped round bracket, stick the chip on the tape, peel off the bracket and tape after molding, and then connect the rewiring layer to the terminal side of the chip. At this time, it is required to expose the back side of the wafer and perform resin molding. That is, the workpiece is a circular carrier, and resin molding for exposing the wafer is required in order to improve the heat dissipation of the wafer. In addition, in the future, from the demand for further cost reduction, it is conceivable that there will be a requirement to implement wafer exposure molding with a quadrangular bulk workpiece that is larger than a circular workpiece.

In the case of resin molding the workpiece in which the above-mentioned wafer is flip-chip connected to the carrier through the heat-peelable tape, since the molding resin needs to be injected into the thin and narrow part, it is easy to apply Transfer molding of resin pressure, but prone to unfilled areas or voids of resin. In order not to cause underfilling of the molding resin or voids, it is necessary to efficiently discharge air components discharged from the concave portion of the cavity or the molding resin. Therefore, it is considered to increase the suction force by enlarging the air channel connected to the concave part of the mold cavity, but when the air channel is enlarged, resin leakage becomes easy to occur. Therefore, it is necessary to make it easy to discharge air and not to leak the molding resin.

Therefore, in order to easily discharge the air from the molding die and prevent the molding resin from leaking to unnecessary parts, it is proposed to provide a movable pin (blocking pin) on the air hole provided on the workpiece (substrate) or on the mold. Molding mold (refer to Patent Document 1: Japanese Patent Application Laid-Open No. 2012-192532, Patent Document 2: Japanese Patent Application Laid-Open No. 2017-209904). [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-192532 [Patent Document 2] Japanese Patent Laid-Open No. 2017-209904

However, when the movable pin is arranged on the mold, since the resin flow path of the molding resin is formed across the end of the workpiece (for example, the outer peripheral surface of the semiconductor wafer or the carrier), the chamfered outer peripheral surface of the workpiece There is a risk of leakage from the gap with the mold surface. Moreover, when the movable pin is arranged on the workpiece (semiconductor wafer or carrier), because the wafer is even arranged near the outer peripheral end portion of the workpiece, it becomes a mold provided with a cavity concave portion on the outer periphery of the semiconductor wafer. Clamping near the end makes it impossible to arrange the movable pin on the workpiece.

The disclosures applied to the following embodiments are developed to solve the above-mentioned problems, and the purpose is to provide a method that can widen the molding area on the workpiece as much as possible while easily exhausting air and preventing the molding resin from leaking to other places. A molding die for a necessary part is provided, and a resin molding device is provided that improves resin filling performance and improves molding quality by having the molding die.

The disclosures applied to the several embodiments described below have at least the following configurations. That is, a molding die in which a workpiece is clamped between a first die and a second die and a molding resin is pressure-fed toward a concave portion of a cavity formed in any one of the first die and the second die. The characteristics of the mold are, The mold cavity spacer forming the bottom of the mold cavity concave portion, and the pinching portion arranged around the mold cavity spacer and forming the side portion of the mold cavity concave portion are arranged so as to be relatively movable, An air channel connected to the recessed portion of the mold cavity and used as a passage for air or molded resin or both is concavely engraved on the clamping portion, and the blocking pin for opening and closing the air channel is arranged across the boundary between the outer peripheral end surface of the workpiece and the clamping surface of the mold. It can move forward and backward in the aforementioned air channel.

In this way, when the blocking pin is configured to straddle the boundary between the clamping surface of the mold and the outer peripheral end surface of the workpiece and move forward and backward in the air channel, the molding area formed on the workpiece can be widened as much as possible. Also, by opening the shutoff pin, the air is discharged from the concave portion of the cavity through the air channel while filling the molded resin into the concave portion of the cavity, and when the molded resin overflows from the concave portion of the cavity, the blocking pin is closed, Prevents mold resin from leaking to unnecessary parts.

Preferably, a suction hole is connected to the air channel, and the air in the concave portion of the mold cavity is sucked through the suction hole to reduce the pressure.

Thereby, when the molding mold is closed, a decompression space can be formed in the concave portion of the cavity to perform resin molding, and air can be easily discharged from the molding mold.

The center of the blocking pin may be arranged on an arc line of the circular workpiece shape, and may be provided so as to be movable relative to the clamping portion.

In this way, since the center of the blocking pin is arranged along the contour line of the workpiece, the blocking pin is arranged so as to straddle the boundary between the workpiece and the clamping surface of the clamping part and move relative to the clamping part, so that the distance on the workpiece can be increased as much as possible. The molding area can also prevent the leakage of molding resin to the gap between the end surface of the workpiece and the molding die.

The release sheet can also be adsorbed and held on the mold clamping surface including the aforementioned mold cavity concave portion and the aforementioned air channel.

In this way, the maintenance of the mold is simplified by using the film, and since the film is elastically deformed by the push of the blocking pin to press the boundary between the outer peripheral end surface of the workpiece and the pinching surface of the pinching portion, resin leakage can be reliably prevented.

Another molding die is characterized in that it includes a movable spacer that is connected to the concave portion of the cavity formed in either the first die or the second die so as to become air or molding resin or both. The bridging part arranged overlappingly with the end of the workpiece in the way of the moving passage is supported to move upward so that it will be separated from the clamping surface of the mold when the mold is opened. The movable spacer is separated from the clamping surface of the mold when the mold is opened Separation, the movable spacer is pressed down by the action of closing the mold, and the end of the workpiece is clamped and held by the aforementioned bridging part, forming a resin flow path or ventilation pathway. In this way, the movable spacer is arranged in the moving passage of air or molding resin connected to the concave part of the mold cavity, and even if a variety of mold layouts are used, the molding area on the workpiece can be maximized and the air can be easily discharged And prevent the molding resin from leaking to unnecessary parts. In this case, the movable spacer may be any one of a barrel spacer, a gate spacer, and a vent spacer formed so that the bridging portion is connected to the concave portion of the mold cavity.

In addition, the cartridge spacer formed with at least one cartridge hole may be supported so as to be separated from the clamping surface of the mold when the mold is opened, and the cartridge spacer may be provided with a bridging portion arranged to overlap with the end of the workpiece, When the mold is closed, the clamping part is used to press down the cylinder spacer and the end of the workpiece is clamped and clamped by the bridge part, forming a resin between the bridge part and the mold gate or vent hole. flow path or vent path. Thereby, when the molding resin is pressure-fed from the cylinder to the recessed portion of the cavity during transfer molding, the resin passes through the bridging portion, so there is no risk of resin leakage on the end surface of the workpiece.

The resin molding apparatus provided with any one of the above-mentioned molding dies is characterized in that the shut-off pin separates the air channel from the The open position is switched to the closed position for transfer molding. Or, it is characterized in that: according to the height position of the mold, the blocking pin switches the air channel from the open position to the closed position for transfer molding or compression molding. Thereby, the molding resin can be filled while applying resin pressure under the low and wide molding area without holes or under the unfilled area. Since the resin filling performance is improved and resin leakage does not occur, the molding quality can be improved.

It is possible to provide a molding die that can widen the molding area on the workpiece as much as possible while easily exhausting air and preventing the molding resin from leaking to unnecessary parts. In addition, it is possible to provide a resin molding apparatus that improves molding quality by improving resin fillability by including the above molding die.

Hereinafter, preferred embodiments of the molding die of the present invention and a resin molding apparatus equipped with the same will be described in detail with reference to the drawings. In addition, a molding die refers to an upper die and a lower die respectively supported on a die base, except for a die opening and closing mechanism (pressurizing device). Furthermore, when the resin molding device is called, it means that it is equipped with at least a molding die and a mold opening and closing mechanism for opening and closing the mold (for example, an electric motor, a screw shaft or a pressurizing device such as a toggle link mechanism, not shown). The device, moreover, due to automation, is equipped with devices such as a resin conveying device, a workpiece conveying device, and a molded workpiece unloading device. In the case of transfer molding, a transfer mechanism for actuating a plunger inserted into a cylinder, a decompression mechanism for forming a decompression space in the mold when the mold is closed, and the like are provided. Hereinafter, the description will focus on the configuration of the molding die. In addition, the workpiece W assumes a case where a semiconductor wafer-shaped circular body on which a chip is mounted is molded with resin, but is not particularly limited to a circular shape, and may be square or rectangular. In one example, the molding die is described in which the lower die is a movable die and the upper die is a fixed die, but the upper die may be a movable die and the lower die may be a fixed die, or both may be movable dies.

First, an example of a molding die for transfer molding will be described with reference to FIG. 1A and FIGS. 5A and 5B. The molding die 1 is to use the workpiece W and the molding resin R1 (such as a resin ingot, but not limited to the resin ingot) carried in by a workpiece conveying device not shown in the figure to utilize an upper mold 2 (first mold) and a lower mold. 3 (the second mold) pinches and performs resin molding, and carries out the molded workpiece W and unnecessary resin R2 by a workpiece conveying device not shown.

First, the structure of the upper die 2 will be described. In FIG. 1A , the upper module 2b is suspended and supported in a ring shape along its outer peripheral edge. As shown in FIG. 5A , an upper mold locking block 2 c for positioning with the lower mold 3 protrudes from the lower end surface of the upper module 2 b. Specifically, upper die locking blocks 2c (convex blocks) are respectively arranged on the center line passing through the center of the upper die cavity recess 2g (workpiece W) on the two pairs of opposing sides of the upper die 2b forming a rectangular ring. . In addition, the lock block does not have to be arranged on the center line passing through the center of the workpiece W, and it only needs to be provided on at least each side.

Also, as shown in Figure 1A, in the upper mold space surrounded by the upper module 2b, there are rectangular upper mold clamping parts 2d and circular upper mold cavity spacers 2e respectively suspended and supported on the upper mold by coil springs 2f Block 2a. An upper mold cavity concave portion 2g is formed by an upper mold cavity spacer 2e (cavity bottom) and an upper mold holding portion 2d (cavity side) surrounding the cavity spacer 2e (see FIG. 5A ).

On the clamping surface (lower end surface) of the clamping part 2d of the upper mold, the rejecting part 2h of the upper mold and the gate 2i of the upper mold connected thereto are recessed in a manner connected to the concave part 2g of the cavity of the upper mold. Also, on the clamping surface of the upper mold clamping portion 2d, a plurality of upper mold air channels 2j connected to the upper mold cavity concave portion 2g are concavely engraved on the opposite side of the upper mold gate 2i across the upper mold cavity concave portion 2g. The blocking pin 2k is assembled to each upper die air channel 2j in an openable and closable manner. The shutoff pin 2k is assembled in the upper die base 2a in a state of being biased downward by the coil spring 2m, and is inserted into a through hole provided in the upper and lower direction in the upper die clamping portion 2d. Thereby, the front end (lower end surface) of the blocking pin 2k is supported at a position substantially flush with the groove bottom of the upper mold air groove 2j. Also, an upper mold overflow cavity 2n is recessed on the pinching surface of the upper mold pinching portion 2d. The upper mold overflow cavity 2n is connected with a plurality of upper mold air channels 2j. The overflow mold cavity 2n of the upper mold is used to collect the air into the air channel 2j of the upper mold concentratedly.

In addition, the clamping surface of the upper die including the upper die cavity concave portion 2g or the resin flow path connected thereto is covered with a release sheet F which is adsorbed and held by an unillustrated suction hole. This is because the surface of the semiconductor wafer T mounted on the workpiece W must be covered with the release sheet F sucked and held in the recessed portion 2g of the cavity of the upper mold to ensure that the surface of the semiconductor wafer T mounted on the workpiece W is exposed and molded. The release sheet F is a long film stretched continuously between reels, but it may be any single film cut according to the specification of the pinching surface of the upper die. The release sheet F is a material with a thickness of about 50 μm, heat resistance, easy peeling from the mold surface, flexibility and stretchability, such as PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film, and polyester film. Single-layer or multi-layer film with vinylidene chloride as the main component.

Next, the structure of the lower die 3 will be described.

In FIG. 1A , a lower mold base (not shown) supports the lower block 3 a in a ring shape along its outer peripheral edge. The upper end surface of the lower module 3a is provided with a lower mold locking block 3b (two pairs of rectangular blocks or one concave block) for positioning with the upper mold 2 . As shown in FIG. 5B , the recesses 3 c of the lower die locking blocks 3 b are respectively arranged on the center line passing through the center of the workpiece W on two pairs of opposing sides of the lower die 3 a forming a rectangular ring shape. In addition, the locking block does not have to be arranged on the center line passing through the center of the workpiece W, as long as it is arranged at least on each side, and as long as the upper die locking block 2c and the lower die locking block 3b can be engaged and assembled, it is arranged on the opposite side. Any part is fine.

Therefore, the upper die 2 (upper die cavity recess 2g) and the lower die 3 (workpiece W) are aligned and pinched by the engagement of the upper die lock block 2c and the recess 3c of the lower die lock block 3b.

The clamping surface of the lower module 3a is fitted with an annular sealant 3d (O-ring or the like). The lower block 3a abuts against the clamping surface of the facing upper block 2b to seal the mold inner space. The lower block 3a is always floatingly supported by applying potential energy upward with respect to the lower mold base by the coil spring 3r provided on the lower side of the barrel spacer 3e (movable spacer). The cartridge spacer 3e has a cartridge hole 3f for filling the molding resin R1, and the plunger 3g is inserted into the cartridge hole 3f in a liftable manner. Also, on the opposing surface of the barrel spacer 3e that faces the upper mold gate 2i, a bridging portion 3h whose plate thickness becomes thinner as it approaches the outer peripheral end is formed. The bridging portion 3h serves as a protruding portion and is partially overlapped (covered) with the outer peripheral end of the workpiece W to be embedded in the insertion recess 3j, and is formed to pinch the upper surface of the outer peripheral end of the workpiece as will be described later. The upper end of the cartridge spacer 3e is composed of a flat mold separation surface and a bridging portion 3h, and a cartridge hole 3f is formed approximately in the center.

Furthermore, in the mold space surrounded by the lower module 3a, a circular workpiece support block 3i is supported and fixed on the lower mold base. The upper end surface of the workpiece support block 3i is supported so that its height is lower than the upper end surface of the surrounding lower block 3a by a height equivalent to the thickness of the workpiece W. Thereby, the workpiece W can be placed on the embedding recess 3j formed by the workpiece support block 3i and the module 3a surrounding it.

As shown in FIG. 5B , at the upper end portion of the cartridge spacer 3 e , the bridging portion 3 h is overlapped and disposed on the outer peripheral end portion of the workpiece W placed in the fitting recess 3 j . The bridging portion 3h is provided at a position facing the upper mold gate 2i (see FIG. 5A ), and is formed into a wedge shape such that the plate thickness becomes thinner as it approaches the outer peripheral edge portion on the workpiece side. Thereby, since the molding resin R1 is filled in the upper mold cavity concave portion 2g through the bridging portion 3h on the upper end surface of the barrel spacer 3e and the upper mold gate 2i, it is possible to prevent the molding resin R1 from directly Molding is performed by passing over the outer peripheral end of the workpiece W, and resin leakage does not occur regardless of the shape of the end of the workpiece.

Also, as shown in FIG. 5B , the workpiece W is flip-chip-connected wafers T arranged in a plurality of matrices near the end of the circular workpiece. Since the molding area is thin and has a wide area, it is necessary to ensure that the injection of the resin is balanced so that the gaps in the horizontal direction between the wafers T or the gaps under the wafers T do not generate unfilled areas of the molding resin R1. Therefore, when the filling property of the molding resin R1 is considered, it is desired to ensure that the gate width G (refer to FIG. 5A or FIG. 7 ) connected to the front end side of the cavity can be as wide as possible. When the rectangular cartridge spacer 3e is aligned with the circular workpiece W, the overlapping amount L of the bridging portion 3h (overlapping length of the cartridge spacer 3e from the overlapping end of the workpiece to the outer peripheral end of the workpiece: refer to Fig. 7) Get too big. Therefore, when the upper and lower molds are closed, a resin flow path is formed between the upper end surface of the barrel spacer 3e and the upper mold gate 2i. 5A and FIG. 7, the gate width G section is set as a straight line at the end of the barrel spacer 3e, but in order to form more wafers T, the circular curve of the mold cavity can also be made into a curved concave shape that is extended as it is. In addition, the gate width G is the upper mold gate 2i of a widened shape (gradually developed shape) opened in a direction extending from the upper mold cutout portion 2h.

Furthermore, the bridging portion 3h of the barrel spacer 3e is separated from the clamping surface of the lower die when the mold is opened (refer to FIG. 1A ), and the workpiece W held by a workpiece conveying device not shown is moved under the bridging portion 3h. After being positioned in the embedding recess 3j (see FIG. 2B ), the bridging portion 3h overlaps the outer peripheral end of the workpiece W so that the workpiece W is pinched by the molding die 1 . In this way, the workpiece W is not only formed by the mold, but also positioned by the workpiece conveying device W. This is because the workpiece W is circular. Pads etc. try to push the end of the workpiece toward the barrel side, but the large workpiece W also causes a large amount of movement (overlapping amount L of the bridging portion 3h), which tends to cause positional displacement or rotation of the workpiece W. In addition, by providing the lower die 3 with the positioning pin 3s corresponding to the V-shaped notch for positioning provided on the workpiece W, the function of stopping rotation and positioning can also be realized (see FIG. 5B ).

In FIG. 1A , suction holes 3k for suction-holding the workpiece W placed in the fitting recess 3j are provided at plural locations of the workpiece support block 3i. The suction hole 3k is connected to a suction device not shown. In addition, a movable support pin 3m is provided to pass through the workpiece support block 3i. The support pin 3m is provided so as to be movable between a position where the pin tip protrudes from the bottom of the fitting recess 3j, and a position where the pin tip retracts into the workpiece support block 3i. When the workpiece W held by a workpiece conveying device (not shown) is transferred to the insertion recess 3j, the pin tip portions of the plurality of support pins 3m protrude from the insertion recess 3j, and the workpiece W is transferred to the support pin 3m. . Thereby, when the workpiece W is positioned on the molding die, it will not be damaged by sliding against the die surface. In addition, the support pin 3m may be omitted.

In addition, a suction hole 3n is provided at a position radially inward of the sealing material 3d of the lower block 3a and facing the upper mold overflow cavity 2n. The suction hole 3n is connected to a suction device not shown. Air is sucked through the suction hole 3n in the state where the molding die 1 pinches the sealing material 3d, and the air remaining in the upper mold cavity concave portion 2g is discharged through the upper mold air channel 2j and the upper mold overflow cavity 2n. Resin molding is performed to prevent unfilled areas or voids from occurring.

FIG. 6 shows the layout configuration of the interrupter pin 2k and the external position of the workpiece W. As shown in FIG. In the concave part of the upper mold cavity 2g, the air channel 2j is connected to a plurality of parts (for example, 3 parts), and these are connected to the upper mold overflow cavity 2n. The blocking pin 2k is provided in the clamping portion 2d of the upper mold, and moves forward and backward in each air channel 2j to open and close each air channel 2j respectively.

The blocking pin 2k is arranged across the outer peripheral end of the workpiece W. As shown in FIG. The blocking pin 2k is arranged so that the center (the center of the circle) is located on the arc line WL of the outer shape of the circular workpiece W, and is arranged so as to move relative to the upper die pinching part 2d. Thereby, the molding area on the workpiece W can be enlarged as far as possible near the outer peripheral end of the workpiece and the leakage of the molding resin R1 to the interface (gap) between the outer peripheral end surface of the workpiece W (embedding recess 3j) and the lower module 3a can be prevented. . In another conventional example, there is an example in which a vent pin is arranged in the middle of a vent channel on the workpiece W, but space for the vent pin is required in the workpiece W, and more wafers T cannot be sealed. In addition, although there is an example where the air channel is provided outside the workpiece W and a blocking pin is arranged in the middle of the air channel, since the resin must be taken out of the workpiece, there is a high possibility that the resin will leak between the workpiece embedding recess and the workpiece. Therefore, the blocking pin 2k is arranged to straddle the workpiece W. As shown in FIG.

In addition, the shutoff pin 2k is opened to discharge the air from the upper mold cavity concave portion 2g through the air channel 2j while allowing the molding resin R1 to flow into the upper mold cavity concave portion 2g. 2g starts to overflow in the air channel 2j of the upper mold, and when the upper mold overflows the mold cavity 2n, the shut-off pin 2k is locked so that the molding resin R1 no longer flows out.

A suction hole 3n (see FIG. 5B) is connected to the lower mold 3 facing the upper mold overflow cavity 2n (see FIG. 5A) connected to the upper mold air channel 2j, and the upper mold cavity is sucked from the suction hole 3n. The air in the concave portion 2g is decompressed. Thereby, when the molding die 1 is closed and the sealing material 3d is pinched, that is, the molding resin R1 is filled while maintaining the decompression space formed in the upper mold cavity concave portion 2g, so that it can be easily discharged from the molding die 1. Air.

On the clamping surface of the upper die including the upper die cavity concave portion 2g and the upper die vent groove 2j, the release sheet F is sucked and held by suction holes (not shown). Thereby, the release piece F is elastically deformed by the push of the shutoff pin 2k and presses the interface between the end surface of the workpiece and the molding die, so resin leakage can be reliably prevented, and at the same time, it can be easily released from the resin after molding.

Here, an example of a resin molding operation using a resin molding apparatus will be described with reference to FIGS. 1 to 4 . In addition, after FIG. 1B , illustration of the upper die locking block 2 c and the lower die locking block 3 b is omitted. In the following, where explanation is unnecessary, drawings are omitted. FIG. 1A shows a state where the molding die 1 has been opened. Hostage of Upper Die 2 The surface is supplied with a release sheet F (long film or single film). Furthermore, in the lower mold 3, the cylinder spacer 3e is provided with potential energy upward by the coil spring 3r, and the bridging portion 3h is separated from the lower mold 3a.

FIG. 1B shows the steps of carrying the workpiece W and the molding resin R1 (tablet resin) into the mold opening mold 1 by a workpiece conveying device not shown. The workpiece W and the molded resin R1 are held by the workpiece conveying device, the workpiece W is transferred to the support pin 3m protruding from the fitting recess 3j of the lower die 3, and the molded resin R1 is filled into the cylinder of the cylinder spacer 3e. Inside the hole 3f. In addition, the workpiece W and the molding resin R1 do not use the same conveying device, and may be carried into the molding die 1 by another conveying device.

After the workpiece conveying device (not shown) retreats to the outside of the molding die 1 , the release sheet F is sucked and held on the pinching surface of the upper die 2 as shown in FIG. 2A . Also, the workpiece W is accommodated in the insertion recess 3j and sucked and held by the suction hole 3k by retracting into the workpiece support block 3i through the support pin 3m. Also, air suction is started from the suction hole 3n of the lower die 3 .

As shown in Figure 2B, the mold closing action is carried out. When the upper module 2b and the lower module 3a sandwich the sealing material 3d, the upper mold cavity is formed through the suction hole 3n, the upper mold overflow mold cavity 2n and the upper mold air channel 2j. A decompression space is formed in the concave portion 2g. Also, the workpiece W is clamped by the upper mold holding portion 2d to clamp the semiconductor wafer, and the surface of the wafer T is pushed to the upper mold cavity spacer 2e via the release sheet F. In addition, the cylinder spacer 3e is pressed down by the upper die clamping portion 2d and pinched so that the bridging portion 3h overlaps with the peripheral end of the workpiece W supplied to the insertion recess 3j so as to partially overlap with the upper end of the workpiece.

As shown in FIG. 3A , the plunger 3g is raised to press the molded resin R1 melted in the cylinder hole 3f into the upper mold cavity concave portion 2g through the upper mold rejecting portion 2h and the upper mold gate 2i. At this time, the molding resin R1 passes through the upper mold gate 2i and the frame The resin flow path formed between the bridge parts 3h is pressured into the cavity recessed part 2g of the upper die, and since the bridge parts 3h are interposed, there is no resin leakage at the interface (gap) between the workpiece W and the lower die 3a. When the molding die 1 is further clamped, the final resin pressure will be reached. As shown in FIG. 3B, the front end of the blocking pin 2k protrudes relatively from the pinching part 2d of the upper die to block the air channel 2j of the upper die so that the molding resin R1 is kept heated. Pressurized state is maintained under pressure and hardened.

In this way, according to the height position of the plunger 3g that press-feeds the molding resin R1 filled in the barrel spacer 3e to the concave portion 2g of the upper mold cavity, the blocking pin 2k switches the air channel 2j from the open position to the closed position. In addition, the position of the shutoff pin 2k can also be switched by the clamping height of the mold in addition to the height position of the plunger 3g. Thereby, the molding resin can be filled without creating holes or unfilled areas by applying resin pressure to the low and wide molding area, and the molding quality can be improved because the resin filling property is improved without resin leakage.

Upon completion of the resin molding, the molding die 1 is opened as shown in FIG. 4A. The barrel spacer 3e is moved upward by the potential energy of the coil spring 3r, and the bridging portion 3h is separated from the workpiece W. As shown in FIG. Since the workpiece W is kept sucked and held by the fitting recess 3j, the unnecessary resin R2 (molded product removal portion) on the cartridge spacer 3e is separated from the molded workpiece W (seal portion) by breaking the gate. The release sheet F is sucked and held on the clamping surface of the upper mold 2 . In addition, since the height position of the plunger 3g does not change, the useless resin R2 is ejected from the tip of the plunger simultaneously with the upward movement of the cartridge spacer 3e. Furthermore, the useless resin R2 on the cartridge spacer 3e can also be used, and the plunger 3g moves upward to push the useless resin R2 from bottom to top to demould.

As shown in FIG. 4B , the support pin 3m is raised by releasing the suction of the suction hole 3k of the fitting recess 3j, and the workpiece W is pushed up from the fitting recess 3j while being supported by the tip of the pin. In this state, the work is held by a workpiece conveying device not shown in the figure. W is sucked and held from the cylinder spacer 3e (molded product removal part) and carried out to the outside of the molding die 1. In addition, the workpiece W and the useless resin R2 may be discharged from the mold at the same time, or may be discharged by separate devices. At this time, it is preferable to lower the cleaning brush (not shown) provided on the workpiece conveying device to the clamping surface of the lower mold, rotate the brush, and perform air suction (dust collection) while rubbing the lower mold surface to remove resin residue. retreat. Also, the release sheet F sucked and held by the nip surface of the upper die 2 is desucked, peeled off, and replaced with a new release sheet F.

In addition, the workpiece W carried out from the molding die 1 by the workpiece conveying device and the useless resin R2 are collected separately. In addition, the removal of the workpiece W and the useless resin R2 can also be performed by another conveying device.

In the above-mentioned embodiments, it is assumed that the workpiece W is in the shape of a circular semiconductor wafer, but it is not limited to a circular shape, and may also be a strip-shaped substrate or a large-sized (square or rectangular) substrate. Furthermore, the barrels included in the lower die 3 are provided at one location with respect to the barrel spacer, but a plurality of barrels may be arranged with respect to one barrel spacer, and may be arranged in plural rows. Furthermore, the cylinder spacer 3e is only shown at one location, but a plurality of cylinder spacers may be provided with respect to the workpiece W. As shown in FIG.

Also, in the above-mentioned embodiment, the upper die 2 is provided with the upper die cavity recess 2g, the shutoff pin 2k, etc., and the lower die 3 is provided with the cartridge spacer 3e, the embedding recess 3j, etc. As shown in FIG. 8, the configuration of the upper mold 2 and the lower mold 3 may be reversed. FIG. 8 is the structure in which the upper mold 2 and the lower mold 3 shown in FIG. 1A are reversed, so the symbols are used and the symbol "'" is given to indicate those who are inverted up and down.

The upper mold 3 ' is provided with a barrel spacer 3e ' , an embedded recess 3j ' , an adsorption hole 3k ' , a support pin 3m ' , etc., and a lower mold cavity recess 2g' and a lower mold air channel 2j are provided on the lower mold 2'' , lower mold overflow cavity 2n ' , blocking pin 2k ' , etc.

Fig. 9A is a cross-sectional explanatory view of a resin molding device in which a movable spacer is used instead of the barrel spacer 3e, and the barrel 3t is fixed and equipped with a movable gate spacer 3u (movable spacer) in another embodiment. . Components that are the same as those in the above-mentioned embodiment are denoted by the same reference numerals, and since the structure of the upper die 2 is the same, the description will focus on the structure of the lower die 3 . The lower block 3a of the lower die 3 is assembled with a cylindrical fixed cartridge 3t and inserted with a plunger 3g. In addition, a lower gate spacer 3u is provided between the cylinder 3t and the embedding recess 3j, which can be raised and lowered. The lower mold gate spacer 3u is connected and supported on the upper end of the lifting rod 3v passing through the lower module 3a. When the mold is opened, potential energy is applied upward to the lower mold gate spacer 3u by a coil spring (not shown) or the like. On the upper surface of the lower mold gate spacer 3u, a resin flow path is formed between the opposing upper mold cutout portion 2h and the upper mold gate 2i. In particular, on the surface facing the upper mold gate 2i, a bridge portion 3u1 is formed in an overhanging manner on the upper end portion of the workpiece W placed in the fitting recess 3j. Both ends of the bridging portion 3u1 form a wedge shape, and the closer to the outer peripheral end connected to the upper mold cavity concave portion 2g and the outer peripheral end connected to the barrel 3t, the thinner the plate thickness is.

FIG. 9B is a cross-sectional explanatory view of the resin molding device, which further includes a lower mold bridge vent spacer 3w connected to the concave portion of the cavity of the upper mold and the air channel of the upper mold as a movable spacer in FIG. 9A . The lower block 3a of the lower die 3 is assembled with a cylindrical fixed cartridge 3t and inserted with a plunger 3g. The gate spacer 3u of the lower mold is liftably arranged between the barrel 3t of the lower module 3a and the embedding recess 3j. The lower mold gate spacer 3u is connected and supported on the upper end of the lifting rod 3v passing through the lower module 3a. When the mold is opened, the lower mold gate spacer 3u is provided with potential energy upward by a coil spring not shown or the like.

On the upper surface of the lower mold gate spacer 3u, a resin flow path is formed between the opposing upper mold cutout portion 2h and the upper mold gate 2i. In particular, on the surface facing the upper die gate 2i, a bridge portion 3u1 is formed in an overhanging manner on the upper end portion of the workpiece W placed in the fitting recess 3j. Both ends of the bridging portion 3u1 are wedge-shaped so that the plate thickness becomes thinner as it approaches the outer peripheral end connected to the upper mold cavity recess 2g and the outer peripheral end connected to the barrel 3t.

Furthermore, the upper mold bridge air channel 2p connected with the upper mold cavity concave portion 2g and the upper mold air channel 2j is concavely engraved on the upper mold clamping portion 2d. The lower mold bridge ventilation spacer 3w (movable spacer) is located at the position facing the lower module 3a with the upper mold bridge ventilation channel 2p in a liftable manner. The ventilation spacer 3w of the lower mold bridge is connected and supported on the upper end of the lifting rod 3v passing through the lower module 3a. When the mold is opened, the lower mold bridge ventilation spacer 3w is provided with potential energy upward by a coil spring not shown in the figure. On the top of the lower mold bridge ventilation spacer 3w, a ventilation passage is formed between the facing upper mold bridge ventilation grooves 2p. In particular, at the upper end of the workpiece W placed in the fitting recess 3j, a bridging portion 3w1 is formed so as to overhang and overlap. Both ends of the bridging portion 3w1 are wedge-shaped so that the plate thickness becomes thinner as it gets closer to the outer peripheral end connected to the upper die cavity concave portion 2g and closer to the upper die overflow cavity 2n side end.

In this way, in the configuration in which the lower die gate spacer 3u and the lower die bridge vent spacer 3w are disposed on both sides of the embedding recess 3j, the workpiece conveying device (not shown) slides in a direction perpendicular to the paper surface of FIG. 9B and carries the workpiece W. Positioning with the embedding recess 3j and transfer of the workpiece W.

The resin molding apparatus described above is the mold 1 for transfer molding, but may be a resin molding apparatus including the mold 1 for compression molding.

The resin molding apparatus shown in FIG. 10 is a structure in which the structure of the lower mold 3 is converted into the structure of the upper mold 2 in the structure of the molding die 1 of FIG. 9B. That is, the structure of the upper mold 2 ″ in FIG. The configuration of the lower mold 3 in FIG. 9B is reversed, and the symbol """ is assigned to the symbol. The structure of the lower mold 3 " is different from the structure surrounded by the lower mold base 3a " and the lower module 3b " . Hereinafter, the different structures will be described.

Lower mold 3 " is tied on lower mold base 3a " and has lower module 3b " along its outer peripheral edge part with annular support. The upper end face of lower module 3b " protrudes and is provided with the lower mold locking block (not shown in the figure) of upper mold 2 " positioning usefulness Show). In addition, in the lower mold space surrounded by the lower module 3b", the ring-shaped lower mold holding part 3d" is floatingly supported by the lower mold base 3a" via the coil spring 3f". In addition, the lower mold cavity spacer 3e" surrounded by the lower mold clamping part 3d" is supported and fixed on the lower mold base 3a". By the lower mold cavity spacer 3e" (the bottom of the mold cavity) and the lower mold clamped around it The lower mold cavity concave portion 3x is formed on the lower mold cavity portion 3d″ (cavity side portion).

The clamping surface (upper end surface) of the clamping part 3d " of the lower mold is engraved with a lower mold bridge air channel 3p " connected with the concave part 3x of the cavity of the lower mold. The lower mold bridge air channel 3p" is connected with a plurality of lower mold air channels 3j". Each lower mold air channel 3j'' is openably and closably assembled with a blocking pin 3k''. The blocking pin 3k" is assembled in the lower mold base 3a" in the state of imparting potential energy upwards by the coil spring 3m". In this way, the front end (upper end surface) of the blocking pin 3k" can be supported in the air channel of the lower mold The position where the bottom of the groove 3j" is roughly flush with the plane. It is better to hold the release piece F on the clamping surface of the lower mold including the concave part 3x of the lower mold cavity. In addition, use the blocking pin 3k" to switch the position of the lower mold air groove 3j". The opening and closing position is carried out through the clamping height of the mould.

The workpiece W is sucked and held in the insertion recessed portion 2j" of the upper die 2". The workpiece conveying device not shown in the figure is superimposed on the mode of the upper mold bridge ventilation spacer 2w " respectively overlapping on the outer peripheral end of the workpiece W and carried in toward the vertical direction of the paper surface of Fig. 10. In addition, on the upper mold bridge ventilation spacer 2w " two There is a push-pull bridging part 2w1" at the end. In the workpiece conveying device, because resin residues may adhere to the surface of the upper die bridge ventilation spacer 2w", although a clearing mechanism may not be provided, it is better to set it.

In addition, molding resin R1 is not limited to solid resin (tablet-shaped resin), For example, granular resin, powdery resin, liquid resin, etc. can also be supplied.

1: Molding mold

2, 3 ' , 2 " : upper mold

2a: upper mold seat

2a ' , 3a " : lower mold base

2b, 2b ' , 3a ' , 2a " : upper module

2c, 2b " : upper mold locking block

2d: upper die clamping part

2d ' : lower mold clamping part

2e: upper mold cavity spacer

2e ' : Lower mold cavity spacer

2f, 2m, 2f ' , 2f " , 3f " , 3r, 3m " : coil spring

2g: The concave part of the upper mold cavity

2g ' : the concave part of the cavity of the lower mold

2h: Upper mold rejection department

2i: Upper mold gate

2j: upper mold air channel

2j ' : lower mold air channel

2k, 2k ' , 3k " : Interrupt pin

2n: upper mold overflow cavity

2n ' : overflow cavity of lower mold

2p: Upper mold bridge air channel

2w″: upper mold bridge ventilation spacer 3, 2´, 3″: Lower mold 3a, 2b´, 3b″: lower module 3b: Lower mold locking block 3c: concave part 3d, 3d´, 2d″: sealing material 3d″: lower die clamping part 3e, 3e´: barrel septum 3e″: Lower mold cavity spacer 3f: barrel hole 3g, 3g´: plunger 3h, 3u1, 2w1″, 3w1: Bridge Department 3i, 3i´, 2i″: workpiece support block 3j, 3j´, 2j″: embedded recess 3j″: lower mold air channel 3k, 3k´, 2k″: adsorption holes 3m, 3m´, 2m″: support pin 3n, 3n´: suction hole 3p″: Lower mold bridge air channel 3s: positioning pin 3t: Barrel 3u: Lower mold gate spacer 3v, 2v″: lifting rod 3w: lower mold bridge ventilation spacer

3x: The concave part of the lower mold cavity

F: Release sheet

R1: molded resin

R2: useless resin

W: Workpiece

Fig. 1 is a cross-sectional explanatory view centering on a molding die of a resin molding apparatus using transfer molding. FIG. 2 is an explanatory diagram of a resin molding step following FIG. 1 . FIG. 3 is an explanatory diagram of a resin molding step following FIG. 2 . FIG. 4 is an explanatory diagram of a resin molding step following FIG. 3 . Fig. 5A is a plan view of the upper die, and Fig. 5B is a plan view of the lower die. Fig. 6 is an explanatory diagram showing enlarged layout configurations of blocking pins and workpiece outline positions. 7A and B are a plan view and a cross-sectional view showing the overlapping arrangement of the barrel spacer and the outer peripheral end of the workpiece. Fig. 8 is a cross-sectional explanatory view of another example of a resin molding apparatus. 9A is a cross-sectional explanatory view of a resin molding device in which gates are provided as movable spacers, and FIG. 9B is a cross-sectional explanatory view of a resin molding device in which vent holes and gates are provided as movable spacers. Fig. 10 is a cross-sectional view of a resin molding apparatus for compression molding in which a vent hole is provided as a movable spacer.

1: Molding mold

2: upper mold

2a: upper mold seat

2b: Upper module

2d: upper die clamping part

2e: upper mold cavity spacer

2f, 2m: coil spring

2g: The concave part of the upper mold cavity

2h: Upper mold rejection department

2i: Upper mold gate

2j: upper mold air channel

2k: Interrupt pin

2n: upper mold overflow cavity

3: Lower mold

3a: Lower module

3d: sealing material

3e: barrel septum

3g: plunger

3h: Bridge Department

3i: Work piece support block

3j: embedded recess

3k: adsorption hole

3m: support pin

3n: suction hole

F: Release sheet

R1: molded resin

T: semiconductor wafer

W: Workpiece

Claims (9)

A molding die, which clamps a workpiece with a first die and a second die and press-feeds a molding resin toward a concave portion of a mold cavity formed in any one of the first die and the second die, and is characterized in that: The mold cavity spacer at the bottom of the mold cavity recess, and the clamping part arranged around the mold cavity spacer and forming the side part of the mold cavity concave part are arranged to be relatively movable, and the clamping part is concavely engraved with a groove connected to the aforementioned mold cavity spacer. In the air channel that serves as a passage for air, molded resin, or both, the concave part of the mold cavity is arranged at a position where the blocking pin of the first mold or the second mold is flush with the groove bottom of the air channel. At a position straddling the boundary between the outer peripheral end surface of the workpiece and the clamping surface of the mold, when the mold is clamped, the blocking pin switches the air channel from an open position to a closed position. The molding die according to claim 1, wherein a suction hole is connected to the air channel, and the air in the concave portion of the mold cavity is sucked through the suction hole to decompress. A molding die according to claim 1 or 2, wherein a single or plural blocking pins are provided on the circular arc of the circular shape of the workpiece, and are arranged to be movable relative to the clamping portion. The molding mold according to claim 1 or 2, wherein a release sheet is adsorbed and held on the mold clamping surface containing the concave portion of the cavity and the air channel. The molding die according to claim 1, which is provided with a movable spacer, and the movable spacer is connected to the concave portion of the cavity formed in either the first mold or the second mold to become air or molding resin or both. The way of moving path and the end of workpiece The bridging part is overlapped and supported to move upward so that it will be separated from the clamping surface of the mold when the mold is opened. The movable spacer is separated from the clamping surface of the mold when the mold is opened. The spacer is pressed down and the end of the workpiece is clamped and held by the bridge, forming a resin flow path between the bridge and the gate of the mold or forming a ventilator between the bridge and the breathable spacer path. The molding die according to claim 5, wherein the movable spacer is any one of a barrel spacer, a gate spacer, and a vent spacer formed in such a way that the bridging portion is connected to the concave portion of the mold cavity. The molding die as claimed in claim 5 or 6, wherein the barrel spacer formed with at least one barrel hole is supported so as to be separated from the clamping surface of the mold when the mold is opened, and the aforementioned barrel spacer is provided with a joint with the aforementioned workpiece end. The bridging part is arranged overlappingly. When the mold is closed, the aforementioned clamping part is used to press down the aforementioned barrel spacer and the end of the aforementioned workpiece is clamped and pinched by the aforementioned bridging part. Resin flow paths or vent passages are formed between ports or vent holes. A resin molding device, comprising the molding die according to any one of claims 1 to 7, and shutting off the A pin switches the vent channel from an open position to a closed position for transfer molding. A resin molding device having the molding mold according to any one of Claims 1 to 7, wherein the shutoff pin switches the air channel from an open position to a closed position for transfer molding or compression according to the height position of the mold take shape.

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