JP2017087453A - Resin molding die and resin molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for enhancing a molding quality.SOLUTION: A resin molding die (210) includes a pair of an upper die (11) and a lower die (12) which have cavity (13) and can be opened and closed. The resin molding die (210) includes: a base (18) which is provided on the upper die (11), and is relatively moved so as to approach the lower die (12) in a mold closed state and separate from the lower die in a mold opened state; and a plurality of plungers (17) which are provided on the base (18) and are aligned around the cavity (13) in plan view.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a technique effective when applied to a resin molding die and a resin molding method.

  Japanese Patent Application Laid-Open No. 2004-179345 (hereinafter referred to as “Patent Document 1”) describes a technique related to an excess resin absorption mechanism that absorbs excess resin when the amount of resin consumption in the cavity changes in compression molding. (See particularly paragraphs [0059] to [0061] and FIG. 10 of the specification).

  Japanese Patent Laid-Open No. 2012-166432 (hereinafter referred to as “Patent Document 2”) describes a pot provided on the bottom surface of a cavity recess that opens at a parting surface, and a relative relative to a mold clamping operation within the pot. A technique relating to a resin molding die having a plunger provided so as to reciprocate is described (in particular, refer to claim 1).

  Japanese Patent Application Laid-Open No. 2002-283388 (hereinafter referred to as “Patent Document 3”) describes a technique in which resin is supplied from the outer edge of a semiconductor wafer by a supply rod that is lifted by driving means (particularly, the specification thereof). Paragraph [0060]). Patent Document 3 describes a technique in which an electrode is exposed by polishing the surface of a resin (particularly, refer to paragraph [0080] of the specification).

  Japanese Patent Application Laid-Open No. 2003-45906 (hereinafter referred to as “Patent Document 4”) discloses a technique in which a plunger in a pot provided at the bottom of a recess serving as a cavity rises and the surface of a semiconductor wafer is resin-sealed. In particular (see paragraphs [0012] and [0023] of the specification). Patent Document 4 describes a technique in which the surface of a semiconductor wafer on which a conductive post is formed is resin-sealed and the tip of the conductive post is exposed by polishing (particularly, paragraphs [0019], [ 0036]).

JP 2004-179345 A JP 2012-166432 A JP 2002-283388 A JP 2003-45906 A

  In a general compression molding method, the resin molding die is closed and the resin in the cavity is filled and compressed to be molded. The compression molding method is used, for example, when a component mounted on a large substrate such as a wafer level package (WLP: Wafer Level Package) is sealed with resin (for example, see Patent Documents 1 and 2). By the way, when the mounted component on the substrate is entirely sealed with resin, it is necessary to polish the exposed surface of the mounted component (see, for example, Patent Documents 3 and 4). Here, if the resin remains on the surface of the mounted component, the connectivity with a connecting member such as a solder ball, a heat sink, or a shield plate is lowered. For this reason, quality will deteriorate as a molded article.

  An object of the present invention is to provide a technique capable of improving molding quality. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  A resin molding die according to one solution of the present invention is a resin molding die including a pair of molds having a cavity that can be opened and closed. The resin molding die is provided in one of the molds with respect to the other mold. A base that is moved close to the mold in a closed state and moved relatively away from the mold in an opened state, and a plurality of resin pressing portions that are provided on the base and are arranged around the cavity in a plan view. Features.

  The resin molding method according to one solution of the present invention is: (a) a resin molding die including a pair of molds having a cavity that can be opened and closed, provided in one mold, and the other mold A base that moves closer to the mold in a closed state and is moved relatively away from the mold in an opened state, and a plurality of resin pressing portions that are provided on the base and are arranged around the cavity in plan view, A step of preparing the resin molding die provided with: (b) in a state where the mold is opened, at a position facing the cavity piece constituting the cavity provided in the resin molding die in a plan view. A step of setting a workpiece having the mounting component facing the mounting component; (c) a step of setting a resin at a position facing the resin pressing portion in a plan view with the mold opened; and (d) mold closing. Shi A step of clamping the mold with a clamper around the cavity piece provided in the resin mold, and (e) a step of closing the mold further than the step (d), and abutting the cavity piece on the mounting component; (F) The step of closing the mold further than the step (e), pressing the resin with the resin pressing portion, and filling the cavity with the resin is included.

  According to this, compared with the case where resin is pressed (injected) into the cavity from one place around the cavity in plan view, the distance through which the resin flows in the cavity can be shortened. If the distance that the resin flows becomes long, there will be variations in the timing of curing between the one that flows first and the one that flows later, and the filler contained in the resin will segregate and voids (bubbles) will be inherent. There is a fear. Therefore, by pressing (injecting) the resin into the cavity from a plurality of locations around the cavity, the distance that the resin flows in the cavity can be shortened, and the segregation of filler and the generation of bubbles can be prevented. That is, the molding quality can be improved.

  In addition, when resin molding is performed on a workpiece having a mounting component, the mounting component is applied (pressed) with the cavity piece to prevent the resin from adhering to the surface, and then the resin is pressed by the resin pressing portion. Can start to do. Thereby, it is possible to prevent the occurrence of resin burrs (molding defects) on the surface of the mounted component. That is, the molding quality can be improved.

  Further, in the resin molding die according to the one solving means, in a plan view, apart from the cavity, arranged around the cavity, a plurality of insertion portions into which the plurality of resin pressing portions are respectively inserted, and the one or the other It is more preferable to further include a plurality of runner gates that are provided on the parting surface of the mold and narrow toward the cavity from positions facing the plurality of insertion portions in plan view. According to this, even if the molding resin remains on the runner gate, the thickness of the molding resin is thin, and it is easy to break and to be easily removed.

  The resin mold according to the one solution may further include a plurality of insertion portions that are in contact with the cavity in a plan view and are arranged around the cavity and into which the plurality of resin pressing portions are respectively inserted. preferable. According to this, compared with the case where resin is pressed (injected) into the cavity from a location away from the cavity, the injection timing can be changed so as to accelerate the injection into the cavity. Moreover, generation | occurrence | production of an unnecessary molding resin can be suppressed. Here, it is more preferable to further include a runner gate provided on the resin pressing surface of the resin pressing portion and narrowing toward the cavity. According to this, even if the molding resin remains in the insertion portion, the molding resin is thin and easily broken and easily removed.

  Further, the resin molding die according to the one solving means further includes a resin setting portion provided at a position facing the resin pressing portion in a plan view and recessed in the parting surface of the one or the other die. It is more preferable. According to this, resin can be easily set to the resin setting part. In addition, since the resin is positioned at the resin setting portion, for example, the resin can be prevented from moving or spreading to the workpiece set before pressing the resin.

  In the resin molding die according to the one solving means, it is more preferable that an elastic member is further provided, and the resin pressing portion is provided on the base via the elastic member. Moreover, in the resin molding die according to the one solving means, it is more preferable that the resin pressing portion is provided fixed to the base. According to this, it is not necessary to provide, for example, a drive mechanism for driving the resin pressing portion in addition to the mechanism for opening and closing the mold, and the structure becomes simple and the resin can be molded.

  Further, in the resin molding die according to the one solution means, provided in the overflow cavity provided around the cavity apart from the cavity in a plan view, and in the parting surface of the one or the other die, in a plan view. And a runner heading from the position facing the overflow cavity to the cavity. According to this, even when the air that becomes a void is involved and the resin flows in the cavity, the resin containing the air can be pushed out to the overflow cavity, and the filling property of the resin in the cavity can be improved. it can.

  In the resin molding die according to the one solving means, it is more preferable to further include a film that covers at least one parting surface of the one or the other die. According to this, when resin molding is performed on a workpiece having mounted parts, the molded workpiece can be easily released from the resin molding die.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the resin molding die according to the solving means of the present invention, the molding quality can be improved.

It is a typical sectional view of a resin mold concerning Embodiment 1 of the present invention. FIG. 2 is a schematic cross-sectional view of a resin mold during operation following FIG. 1. FIG. 3 is a schematic cross-sectional view of a resin mold during operation following FIG. 2. FIG. 4 is a schematic cross-sectional view of the resin mold during operation following FIG. 3. FIG. 2 is a schematic plan view of an upper parting surface of a resin mold shown in FIG. 1. FIG. 2 is a schematic plan view of a lower parting surface of a resin mold shown in FIG. 1. FIG. 2 is a schematic cross-sectional view of a resin molding die for processing a workpiece W different from that in FIG. 1. It is a typical top view of the parting surface of the upper model of the resin mold concerning Embodiment 2 of the present invention. It is a typical top view of the parting surface of the lower mold of the resin mold concerning Embodiment 2 of the present invention. It is a typical sectional view of a resin mold concerning Embodiment 3 of the present invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 4 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 5 of this invention. FIG. 13 is a schematic plan view of an upper parting surface of the resin mold shown in FIG. 12. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 6 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 7 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 8 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 9 of this invention. It is typical sectional drawing of the resin molding metal mold | die which concerns on Embodiment 10 of this invention.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A resin molding die 210 (resin molding die mechanism) according to the present embodiment will be described with reference to FIGS. 1 to 4 are cross-sectional views schematically showing the resin molding die 210 in operation. FIG. 5 is a plan view schematically showing a parting surface 11 a (also referred to as a clamp surface or a mold surface) of the upper mold 11. FIG. 6 is a plan view schematically showing a parting surface 12a (also referred to as a clamp surface or a mold surface) of the lower mold 12. As shown in FIG. Note that FIG. 4 shows a molded product 100 (work W after molding) molded by a resin molding die 210.

  The resin molding die 210 includes a pair of dies (upper die 11 and lower die 12) having cavities 13 (hereinafter also referred to as cavity recesses 13), which are separated and can be opened and closed. In the present embodiment, one mold is the upper mold 11 and the other mold is the lower mold 12. In the resin mold 210, a known mold opening / closing mechanism (press mechanism) (not shown) is used. With this mold opening / closing mechanism, for example, the upper mold 11 may be a fixed mold and the lower mold 12 may be a movable mold so that the mold can be opened / closed, or the upper mold 11 may be a movable mold and the lower mold 12 may be a fixed mold. 11 and the lower mold 12 may be movable. The resin molding die 210 may be manually opened and closed without using the mold opening and closing mechanism.

  In the resin molding die 210, the cavity recess 13 is provided (formed) in the upper die 11. The cavity recess 13 is provided so as to be recessed from the parting surface 11 a of the upper mold 11, and the mold is closed to constitute the cavity 13. The resin molding die 210 includes a release film F (hereinafter also simply referred to as “film”) that covers the parting surface 11 a of the upper mold 11 including the inner surface of the cavity recess 13. By providing the film F, the molded workpiece W can be easily released from the resin molding die 210.

  Moreover, the resin molding die 210 is provided with a known decompression mechanism, and the cavity recess 13 can be degassed by this decompression mechanism. For example, the decompression mechanism includes an air vent groove (not shown) that communicates the cavity recess 13 and the outside with the lower end surface of the clamper 15 (parting surface 11a of the upper mold 11), and a decompression mechanism that is connected to the air vent groove on the outside side. A device (for example, a vacuum pump).

  Further, the resin molding die 210 is provided with a set portion 14 on which the workpiece W is set (arranged) on the lower die 12. The set part 14 is provided on the parting surface 12a of the lower mold 12, and is configured to suck and hold the workpiece W from a suction path (not shown). In the setting unit 14, the workpiece W is set so as to face the cavity recess 13. Further, in the resin molding die 210, a plurality of resins in which a plurality of resins R (tablet resin in the present embodiment) are set (arranged) on the parting surface 12 a of the lower mold 12 side by side around the set portion 14. A set unit 29 is provided. In addition, the setting part 14 and the resin setting part 29 may be provided as a recessed part recessed from the parting surface 12a of the lower mold | type 12 so that the workpiece | work W and the resin R may be accommodated, respectively.

  The workpiece W includes a substrate 101 and a plurality of mounting components 102. The substrate 101 has a circular shape in plan view. The work W is a plate-like body having a circular shape in plan view as a whole, and can be said to have a plurality of mounting components 102. A plurality of mounting components 102 are surface-mounted (mounted) in a matrix form on the substrate 101 (see FIG. 6). The mounting component 102 has a surface of a board surface 102a on the side to be mounted and an opposite surface 102b. In addition, according to the planar view shape (refer FIG. 6) of the workpiece | work W, the planar view shape (refer FIG. 5) of the cavity recessed part 13 is circular shape.

  Here, the planar view shape of the workpiece | work W (board | substrate 101) is not restricted circularly, For example, a rectangular shape may be sufficient. The substrate 101 may be, for example, a wafer or a wiring substrate, or may be a simple plate carrier on which a semiconductor chip typified by an eWLB (embedded Wafer Level Ball Grid Array) is temporarily mounted. The mounting component 102 may be, for example, an active component or a passive component such as a semiconductor chip or an electronic component, or may be a wiring pattern or a wiring block body that requires an exposed terminal such as a lead frame. Good.

  The resin molding die 210 includes a heater (not shown) and can be heated to a predetermined temperature (for example, 180 ° C.). In the resin molding die 210, the cavity recess 13 is closed (the cavity 13 is formed) by the upper mold 11 and the lower mold 12, and the resin R filled and compressed in the cavity recess 13 is heated in a pressurized state. A process of forming (manufacturing) the molded product 100 (see FIG. 4) by curing is performed.

  Next, the upper mold 11 of the resin molding die 210 will be specifically described. The upper die 11 has a clamper 15, a cavity piece 16, a plunger 17 (resin pressing part), and a base 18 (the upper die 11 has a reference numeral 18 a and the lower die 12 has a reference numeral 18 b. In some cases, these mold blocks are assembled. In the present embodiment, the clamper 15, the cavity piece 16, and the base 18 (base 18a) are each composed of a plate-shaped mold block, and the plunger 17 is composed of a cylindrical mold block.

  The clamper 15 is provided with a circular through hole 15a formed in the thickness direction (mold opening / closing direction) at the center of the upper mold 11 in plan view (parting surface view). A cavity piece 16 is inserted into the through hole 15 a and is provided on the base 18 via a spring member 21. The plunger 17 may be directly fixed to the base 18 as will be described later. Further, the clamper 15 is provided with a plurality of circular through holes 15b formed in the thickness direction (mold opening / closing direction) in a plan view (parting surface view) of the upper mold 11. A plurality of plungers 17 are inserted into each of the plurality of through holes 15 b and are provided on the base 18 via spring members 19. Thus, the through hole 15b is also an insertion portion into which the plunger 17 is inserted. The through holes 15b have a smaller diameter than the through holes 15a in a plan view, and are arranged at equal intervals around the cavity pieces 16 away from the cavity pieces 16 (through holes 15a).

  Further, the clamper 15 has a plurality of runner gates 28 (resin passages) narrowing from the plurality of through holes 15 b toward the cavity recesses 13 (through holes 15 a) on the end surface constituting the parting surface 11 a of the upper mold 11. Formed and provided. The plunger 17 presses (injects) the resin R into the cavity recess 13 through the runner gate 28. That is, in the resin molding die 210, the plurality of plungers 17, the plurality of through holes 15 b, and the periphery of the cavity recess 13 are arranged so that the resin R flows from the outer peripheral portion of the cavity recess 13 toward the center portion in plan view. A plurality of runner gates 28 are provided. Although the runner gate 28 is provided in the upper mold, the runner gate 28 may be provided in the lower mold 12 by providing a cull (not shown) in the lower mold 12. In this case, it is possible to perform mold release after molding by providing a known ejector mechanism for mold release.

  According to this, compared to the case where the resin R is injected from one place around the cavity recess 13 into the cavity recess 13, the distance through which the resin R flows in the cavity recess 13 can be shortened. When the distance through which the resin R flows becomes long, the timing of curing varies between the first flow and the second flow, and the filler contained in the resin R segregates or voids (bubbles) exist. There is a risk that. Therefore, by injecting the resin R into the cavity recess 13 from a plurality of locations around the cavity recess 13, the distance in which the resin R flows in the cavity recess 13 can be shortened, and segregation of filler and generation of bubbles can be prevented. .

  Thus, the clamper 15, the cavity piece 16, and the plunger 17 are assembled to the base 18 via the respective spring members. In other words, the clamper 15, the cavity piece 16, and the plunger 17 are held on the base 18 via respective spring members. Here, when the mold of the resin molding die 210 is opened and closed, the upper die 11 (one die) is relatively separated from or approaches the lower die 12 (the other die). For this reason, in this embodiment, the base 18 is moved relative to the lower mold 12 so as to approach the lower mold 12 in the mold closed state and leave in the mold open state.

  The cavity piece 16 is provided on the lower mold 12 side of the base 18. The cavity piece 16 constitutes the back (bottom) of the cavity recess 13. That is, the end surface of the cavity piece 16 on the lower mold 12 side becomes the inner bottom surface of the cavity recess 13 having a circular shape in plan view. In this embodiment, the cavity piece 16 hits the mounting component 102 in a mold-closed state (see FIG. 3). The cavity piece 16 is provided on the lower mold 12 side of the base 18 via a spring member 21 (first elastic member). For this reason, the cavity piece 16 is suspended from the base 18 by the spring member 21.

  The clamper 15 is provided on the lower mold 12 side of the base 18. The clamper 15 surrounds the cavity piece 16 and constitutes a side portion of the cavity recess 13. That is, the inner wall surface of the through hole 15 a of the clamper 15 becomes the inner surface of the cavity recess 13. The clamper 15 hits the lower mold 12 in a closed state (see FIG. 2). The clamper 15 is provided on the lower mold 12 side of the base 18 via a spring member 20 (second elastic member, indicated by a broken line in FIG. 5). For this reason, the cavity piece 16 is suspended from the base 18 by the spring member 20. In the present embodiment, in order to prevent resin leakage when pressing the resin R with the plunger 17, as shown in FIG. 5, a plurality of spring members 20 are provided around the plunger 17 (resin setting portion 29) in plan view. Provided. Specifically, a plurality of spring members 20 are provided along the outer edge portion of the upper end surface (end surface on the base 18 side) of the clamper 15.

  In this way, the clamper 15 is provided on the lower mold 12 side of the base 18 so as to be movable (movable forward and backward) relative to the cavity piece 16 in the mold opening / closing direction. For example, after the clamper 15 hits the lower mold 12 by mold closing (see FIG. 2), when the mold is further closed, the spring member 20 is urged with the clamper 15 hitting the lower mold 12. Then, the cavity piece 16 approaches the lower mold 12 and hits the mounting component 102 (see FIG. 3).

  The plunger 17 is provided on the lower mold 12 side of the base 18. The plunger 17 presses (injects) the resin R into the cavity recess 13 in a mold-closed state. The plunger 17 is provided on the lower mold 12 side of the base 18 via a spring member 19 (third elastic member). For this reason, the plunger 17 is suspended from the base 18 by the spring member 19.

  In this way, the plunger 17 is provided on the lower mold 12 side of the base 18 so as to be movable relative to the cavity piece 16 and the clamper 15 in the mold opening / closing direction (movable forward and backward). Accordingly, for example, after the cavity piece 16 hits the mounting component 102 by closing the mold (see FIG. 3), when the mold is further closed, the spring member 20 is urged with the clamper 15 hitting the lower mold 12. In addition, the spring member 21 is biased in a state where the cavity piece 16 hits the mounting component 102. Then, when the plunger 17 approaches the lower mold 12, begins to press the resin R, and further closes the mold, the spring member 19 is biased (see FIG. 4). That is, in this embodiment, as the mold is closed, the lower surface of the clamper 15 contacts the upper surface of the lower mold 12, the lower surface of the cavity piece 16 contacts the upper surface of the mounting component 102, and the plunger 17 presses the resin R.

  As described above, according to the resin molding die 210, the operation of the plunger 17 does not use a complicated mechanism (for example, a separate drive actuator such as a hydraulic cylinder or a motor), but has a simple structure associated with opening and closing the die. Can be provided. As will be described later, according to the resin molding die 210, the mounting component 102 is applied (pressed) with the cavity piece 16 to prevent the resin R from adhering to the surface thereof, and then the resin R is applied with the plunger 17. Thus, it is possible to prevent the occurrence of resin burrs (molding defects). That is, the molding quality can be improved.

  Next, the operation of the resin molding die 210 as a compression molding according to the present embodiment (process of the resin molding method) will be described. First, as shown in FIG. 1, a resin molding die 210 having the above-described pair of molds (upper die 11 and lower die 12) that can be opened and closed is prepared.

  Next, in a state where the resin molding die 210 is opened, the workpiece W (molded product) before molding is set (supplied) at a position facing (opposing) the cavity piece 16 in the mold opening / closing direction. Specifically, the work W is transported to the parting surface 12a of the lower mold 12 by a loader (not shown), and the work W (more specifically, the mounted component 102 is directed toward the cavity piece 16 side). The substrate 101) in the state is set. The workpiece W is sucked and held by a known suction device (for example, a vacuum pump) using a suction path (not shown) formed in the lower mold 12 and set in the set unit 14.

  Further, in a state where the resin molding die 210 is opened, the resin R is set (supplied) at a position facing (opposing) the plunger 17 in the mold opening / closing direction. Specifically, a tablet-shaped resin R (tablet resin) is conveyed to the inside of the mold by a loader (not shown), and the resin R is set in each of the plurality of resin setting portions 29.

  In the state where the resin molding die 210 is opened, the film F is set so as to cover the parting surface 11 a of the upper mold 11 including the inner surface of the cavity recess 13. Specifically, the upper mold 11 is provided such that the film F is drawn out from a feeding roll wound up in a roll shape, passes through the parting surface 11a of the upper mold 11 and is wound onto the winding roll. It is done. This film F is, for example, known using a gap between the inner wall surface of the through hole 15a of the clamper 15 and the outer side surface of the cavity piece 16, or a gap between the inner wall surface of the through hole 15b of the clamper 15 and the outer side surface of the plunger 17. The suction device (for example, a vacuum pump) is attached to the parting surface 11 a of the upper mold 11 including the inner surface of the cavity recess 13. The film F has a heat resistance that can withstand the heating temperature of the resin molding die 210, is easily peeled off from the parting surface 11a of the upper mold 11, and is a film material having flexibility and extensibility. . As the film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used.

  Subsequently, the mold closing operation is started, and as shown in FIG. 2, the resin molding die 210 is closed (the upper mold 11 and the lower mold 12 are brought closer to each other), and the lower side is moved through the film F. The clamper 15 is applied to the mold 12 (that is, the mold is clamped). At this time, the distance between the base 18 of the upper mold 11 and the lower mold 12 is reduced. Thereby, the opening part of the cavity recessed part 13 is obstruct | occluded by the parting surface 12a of the lower mold | type 12. FIG. In this embodiment, since the size of the workpiece W (substrate 101) in plan view is smaller than the size of the cavity recess 13 in plan view, the workpiece W is housed in the cavity recess 13. On the other hand, here, the plunger 17 is prevented from hitting (not contacting) the resin R. The space of the cavity recess 13 begins to be depressurized via an air vent groove (not shown) formed in the lower end surface of the clamper 15. As shown in FIG. 7, when the size of the workpiece W (substrate 101) in plan view is larger than the size of the cavity recess 13 in plan view, the substrate 101 set in the lower mold 12 is clamped by the clamper 15. It is also possible to be sandwiched. In this case, the clamper 15 needs a step having a thickness of the substrate 101. The necessity of this step is the same in other embodiments.

  Subsequently, the resin molding die 210 is further closed, and the cavity piece 16 is applied to the mounting component 102 as shown in FIG. At this time, the distance between the base 18 of the upper mold 11 and the lower mold 12 is further reduced. Thereby, the mounting component 102 of the workpiece W set on the set portion 14 (parting surface 12a of the lower mold 12) is clamped (pressed) by the cavity piece 16 via the film F. Further, the spring member 20 is urged (compressed) while the clamper 15 is in contact with the lower mold 12. As described above, the cavity piece 16 is also a component pressing portion that presses the mounting component 102 in the mold closing operation. And the depth (height) of the cavity recessed part 13 becomes shallow (lower), and becomes the molding thickness of the molded product 100. On the other hand, here, the plunger 17 is prevented from hitting (not contacting) the resin R. However, the plunger 17 may be applied to the resin R as long as the resin R does not flow to the mounting component 102 (work W) side.

  Subsequently, the resin molding die 210 was further closed, and the plunger 17 started to press (inject) the resin R through the runner gate 28 against the cavity recess 13 and was closed as shown in FIG. In the state, the cavity recess 13 is filled with molten resin R. At this time, the distance between the base 18 of the upper mold 11 and the lower mold 12 is further reduced. As a result, the resin R is also filled between the plurality of mounted components 102. Further, when the clamper 15 hits the lower mold 12 and the cavity piece 16 contacts the mounting component 102, the spring members 20 and 21 are urged (compressed), and further, when the mold is closed, the spring member 19 is attached. Be forced.

  Here, clamping the mounting component 102 with the cavity piece 16 via the film F prevents the resin R from adhering to the opposite surface 102b of the mounting component 102 because the mounting component 102 bites into the film F to some extent. Can do. Further, the film F attached to the parting surface 11a of the upper mold 11 may be a non-adhesive film, but the surface opposite to the parting surface 11a (the lower mold 12 side) is slightly adhered. If it has a property (slightly adhesive film), it is possible to press the mounting component 102 with the cavity piece 16 while adhering to the mounting component 102. According to this, it is possible to further prevent the resin R from adhering to the opposite surface 102 b of the mounting component 102. Further, by providing the film F, for example, the occurrence of a resin burr caused by the resin R entering the gap between the clamper 15 and the cavity piece 16 or the gap between the clamper 15 and the plunger 17 can be prevented. It is possible to prevent the piece 16 from becoming difficult to move.

  Next, after the resin R filled in the cavity recess 13 is thermally cured in a pressure-holding state, the mold W opened and released from the mold is further thermally cured (post-cure). Thus, the molded product 100 in which the opposite surface 102b (front surface) of the mounting component 102 is exposed and the other surfaces (the substrate surface 102a and the side surfaces) are covered (sealed) with the resin molded portion 103 (resin R). Almost complete. Further, when unnecessary molding resin remains in the through hole 15b (insertion portion) into which the plunger 17 is inserted or the runner gate 28, the molding resin corresponding to the runner gate 28 is thin and easily broken. Unnecessary molding resin can be removed.

  As described above, in the resin molding die 210, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, for example, it is possible to start pressing the resin R while clamping the mounting component 102 by preventing the mounting component 102 from being damaged. Thereby, it is possible to prevent a resin burr (molding defect) from occurring on the opposite surface 102b of the mounting component 102. Therefore, according to the resin molding die 210, the manufacturing yield can be improved and the molding quality of the molded product 100 can be improved. Moreover, since the process of removing the resin burrs is not necessary, the manufacturing cost can be reduced.

(Embodiment 2)
In the first embodiment, the resin molding die 210 in which a plurality of through holes 15b (insertion portions) of the clamper 15 into which the plunger 17 is inserted is arranged at equal intervals on the entire circumference of the cavity recess 13 has been described. The difference from this will be described with reference to FIGS. 8 and 9 as the resin molding die 210A according to the present embodiment. FIG. 8 is a plan view schematically showing the parting surface 11a of the upper mold 11 in the resin mold 210A. FIG. 9 is a plan view schematically showing the parting surface 12a of the lower mold 12 in the resin mold 210A. In FIG. 8, the spring member 20 (see FIG. 5) is not shown.

  In the resin molding die 210A, a plurality of through holes 15b are arranged in one region around the cavity recess 13, and a plurality of overflow cavities 15c (recesses for excess resin) are arranged in another region where there is no through hole 15b. In the present embodiment, the clamper 15 of the resin mold 210A is provided with a plurality of overflow cavities 15c arranged around the cavity recess 13 and spaced apart from the cavity recess 13 in plan view (parting surface view). The overflow cavity 15c may be provided between the through holes 15b (same as in the first embodiment) or may be provided in the lower mold 12.

  The overflow cavity 15 c is provided so as to be recessed from the end surface constituting the parting surface 11 a of the upper mold 11, and the mold is closed so as to be closed by the parting surface 12 a of the lower mold 12, thereby configuring the cavity 13. For this reason, the resin setting part 29 is not provided in the position of the parting surface 12a of the lower mold 12 facing the overflow cavity 15c in the mold opening / closing direction. In addition, the clamper 15 is provided with a plurality of runners 50 (resin passages) each directed from the cavity recess 13 (through hole 15a) to the plurality of overflow cavities 15c on the end surface constituting the parting surface 11a of the upper die 11.

  According to such a resin molding die 210A, even when air that becomes a void is involved and the resin R flows through the cavity recess 13, the resin R containing the air can be pushed out to the overflow cavity 15c. Therefore, the resin filling property in the cavity recess 13 can be improved.

  Further, in the resin molding die 210A, a region where a plurality of through holes 15b (insertion portions) into which the plunger 17 is inserted and a region where a plurality of overflow cavities 15c are combined sandwich the cavity recess 13 in plan view. It is divided into positions. According to this, since the flow of the resin R from the plunger 17 (through hole 15b) to the cavity recess 13 and to the overflow cavity 15c becomes smooth, the filling property of the resin in the cavity recess 13 can be further improved. .

  Also in such a resin molding die 210A, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 3)
In the first embodiment, the resin mold 210 in which the film F is covered only on the parting surface 11a of the upper mold 11 has been described. The difference from this will be described as the resin molding die 210B according to the present embodiment, with reference to FIG. FIG. 10 is a schematic cross-sectional view of the resin molding die 210B.

  In the resin molding die 210B, both the parting surface 11a of the upper mold 11 and the parting surface 12a of the lower mold 12 are covered with the film F. In the present embodiment, since the parting surface 12a of the lower mold 12 of the resin molding die 210B is covered with the film F, the workpiece W is set on the setting unit 14 via the film F. Similarly, the resin R is set on the resin setting portion 29 through the film F. According to the resin molding die 210B in which both the upper die 11 and the lower die 12 are covered with the film F, when resin molding is performed on the workpiece W having the mounting component 102, the molded workpiece W is replaced with the resin molding die. The mold 210 can be easily released from the mold. Further, resin leakage from the parting line of the resin molding die 210B (the boundary between the parting surface 11a of the upper mold 11 and the parting surface 12a of the lower mold 12) can be prevented.

  Further, in the resin molding die 210B, a concave portion that is recessed from the parting surface 12a of the lower die 12 is provided as a resin setting portion 29 at a position facing (opposing) the plunger 17 in the mold opening / closing direction. According to this, the resin R can be easily set in the resin setting portion 29 (concave portion). Further, since the resin R is positioned by the resin setting portion 29, for example, before the resin R is pressed, the resin R moves or spreads toward the workpiece W set on the parting surface 12a of the lower mold 12. Can be prevented. Further, since the resin setting portion 29 is a concave portion, the runner gate 28 can be provided on the parting surface 12a of the lower die 12 so as to communicate with the resin setting portion 29 instead of the upper die 11 (clamper 15).

  Also in such a resin molding die 210B, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 4)
In the first embodiment, the resin molding die 210 in which the plunger 17 is provided on the lower mold 12 side of the base 18 via the spring member 19 has been described. The difference from this will be described as the resin molding die 210C according to this embodiment, with reference to FIG. FIG. 11 is a schematic cross-sectional view of a resin molding die 210C.

  In the resin molding die 210 </ b> C, the plunger 17 is fixed to the base 18. In the present embodiment, in the resin molding die 210C, the plunger 17 (resin pressing portion) is provided fixed to the lower mold 12 side of the base 18 by, for example, a bolt (not shown). Even in such a resin molding die 210C, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 5)
In the first embodiment, the resin molding die 210 in which the through hole 15b (insertion portion) into which the plunger 17 is inserted is provided away from the cavity piece 16 so that the resin R flows through the runner gate 28 is provided. explained. A difference from this will be described as a resin molding die 210D according to the present embodiment, and will be described with reference to FIGS. FIG. 12 is a schematic cross-sectional view of a resin molding die 210D. FIG. 13 is a schematic plan view of the parting surface 11a of the upper mold 11 in the resin mold 210D.

  In the resin molding die 210D, the through hole 15b (insertion portion) is provided in contact with the cavity piece 16 (cavity recess 13). In the present embodiment, the clamper 15 of the resin molding die 210D is arranged around the cavity recess 13 in a plan view (parting surface view), and a through hole 15b (insertion portion) into which the plunger 17 (resin pressing portion) is inserted. Are provided in direct contact with the cavity piece 16 (cavity recess 13). According to such a resin molding die 210D, the injection timing is set so as to accelerate the injection into the cavity recess 13 as compared with the case where the resin R is pressed (injected) into the cavity recess 13 from a position away from the cavity recess 13. Can be changed. Moreover, generation | occurrence | production of an unnecessary molding resin can be suppressed.

  A runner gate 28 that narrows toward the cavity recess 13 is provided on the resin pressing surface of the plunger 17 (the end surface on the lower mold 12 side). In the present embodiment, the lower end surface of the plunger 17 is formed in a tapered shape so that the cavity recess 13 side forms an acute angle. According to this, even when the molding resin remains in the through-hole 15b (insertion portion), the molding resin corresponding to the taper shape is thin and easily broken, and the remaining molding resin can be easily removed. Become.

  Also in such a resin molding die 210D, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 6)
In the first embodiment, the resin mold 210 in which the upper mold 11 is provided with the cavity recess 13 and the plunger 17 has been described. The difference from this will be described as a resin molding die 210E according to this embodiment, with reference to FIG. FIG. 14 is a schematic cross-sectional view of a resin molding die 210E.

  In the resin molding die 210E, a cavity recess 13 is provided in the upper mold 11, and a plurality of plungers 17 (resin pressing parts) arranged around the cavity recess 13 (cavity 13) in plan view are provided in the lower mold 12. Specifically, the upper mold 11 includes a base 18 a, a cavity piece 16, and a clamper 15. The lower mold 12 includes a base 18b and a lower mold plate 52. In the first embodiment, the base 18 exists on the upper mold 11 side. However, in the present embodiment, the base 18a exists on the upper mold 11 side, and the base 18b also exists on the lower mold 12 side. In the lower mold 12, the lower mold plate 52 is provided on the upper mold 12 side of the base 18 b via the spring member 54.

  The lower mold plate 52 is provided with a plurality of through holes 52a (insertion portions) into which the plungers 17 are inserted outside the cavity recesses 13 in plan view. The through hole 52a is formed in the thickness direction of the lower mold plate 52 (mold opening / closing direction). A plurality of plungers 17 are inserted into each of the plurality of through holes 52 a and are provided on the base 18 b via the spring members 19. A tapered runner gate 28 that narrows toward the cavity recess 13 is provided on the upper end surface (the end surface on the upper mold 11 side) of the plunger 17 of the lower mold 12.

  In such a resin molding die 210E, the set portion 14 on which the workpiece W is set serves as the upper end surface of the lower mold plate 52 (the end surface on the upper mold 11 side). Further, the resin setting portion 29 in which the resin R is set serves as a through hole 52 a (insertion portion) formed in the lower mold plate 52. For this reason, the resin R can be easily set in the resin setting portion 29 (concave portion). Further, since the resin R is positioned by the resin setting portion 29, for example, before pressing the resin R, the resin R is moved to the work W side set on the upper end surface of the lower mold plate 52 (parting surface 12a of the lower mold 12). Can be prevented from moving or spreading.

  Also in such a resin molding die 210E, the plunger 17 is provided on the base 18b so as to be movable relative to the lower mold plate 52 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 7)
In the first embodiment, the resin mold 210 in which the cavity recess 13 is provided in the upper mold 11 has been described. The difference from this will be described as the resin molding die 210F according to the present embodiment, with reference to FIG. FIG. 15 is a schematic cross-sectional view of a resin molding die 210F.

  In the resin mold 210F, the cavity recess 13 is provided in the lower mold 12. In the present embodiment, in the resin molding die 210F, the lower mold 12 includes a base 18, a cavity piece 16, a clamper 15, and a plunger 17 (resin pressing portion). In the first embodiment, the base 18 exists on the upper mold 11 side, but in the present embodiment, the base 18 exists on the lower mold 12 side. In the lower mold 12, the clamper 15 is provided with a plurality of through-holes 15 b (insertion portions) into which the plunger 17 is inserted and arranged around the cavity piece 16 away from the cavity piece 16. A plurality of runner gates 28 that narrow from the plurality of through holes 15 b toward the cavity recesses 13 are provided on the upper end surface (the end surface on the upper mold 11 side) of the clamper 15 of the lower mold 12. In addition, although the runner gate 28 is provided in the lower mold | type 12, you may provide a cull (not shown) in the upper mold | type 11, and you may use it as an upper mold | type runner gate.

  In such a resin molding die 210F, the set portion 14 on which the workpiece W is set serves as the upper end surface (end surface on the upper mold 11 side) of the cavity piece 16 of the lower mold 12. Further, the resin setting portion 29 in which the resin R is set becomes a through hole 15b (insertion portion) formed in the clamper 15 of the lower mold 12. Further, since the resin R is positioned by the resin setting portion 29, for example, before the resin R is pressed, the resin R moves or spreads toward the workpiece W set on the parting surface 12a of the lower mold 12. Can be prevented.

  Also in such a resin molding die 210F, the plunger 17 is provided on the base 18 so as to be movable relative to the clamper 15 and the cavity piece 16 in the mold opening / closing direction. For this reason, as in the first embodiment, for example, the resin R can be started to be pressed while the mounting component 102 is clamped. Thereby, it is possible to prevent the occurrence of a resin burr (molding defect) on the opposite surface 102b of the mounting component 102 and expose the opposite surface 102b.

(Embodiment 8)
In the seventh embodiment, the resin mold 210 </ b> F in which the lower mold 12 is provided with the cavity recess 13 and the cavity recess 13 is provided with the set portion 14 has been described. The difference from this will be described as the resin molding die 210G according to the present embodiment, with reference to FIG. FIG. 16 is a schematic cross-sectional view of a resin molding die 210G.

  In the resin molding die 210G, the set part 14 is provided on the upper mold 11. In the present embodiment, the film F is provided so as to cover the parting surface 11 a of the upper mold 11. However, the work W can be adhered to the film F and set on the setting unit 14. Instead of using the film F, the workpiece W may be sucked and held by a known suction device (for example, a vacuum pump) using a suction path provided on the parting surface 11a of the upper mold 11.

  Here, in the resin molding die 210 </ b> G on the left side of the alternate long and short dash line in FIG. 16, the plunger 17 is provided on the base 18 via the spring member 19. The through hole 15b into which the plunger 17 is inserted becomes a resin setting portion 29, and a tablet resin is set as the resin R. On the other hand, in the resin molding die 210G on the right side of the alternate long and short dash line in FIG. 16, the plunger 17 is fixed to the base 18. The plurality of plungers 17 may all be configured to be movable via the spring member 19, may be configured to be all fixed, or may have a configuration in which a part is the spring member 19 and the other part is fixed.

  Further, the through hole 15b into which the plunger 17 is inserted becomes a resin setting portion 29, and a granular resin is set as the resin R. The shape of the resin R is not limited to a tablet shape or a granule shape, and may be a liquid or a powder shape. Further, it may be a sheet-like resin having holes in the shape of mounted components.

(Embodiment 9)
With respect to the resin molding die 210H according to the present embodiment, differences from the eighth embodiment will be described with reference to FIG. FIG. 17 is a schematic cross-sectional view of a resin molding die 210H.

  In the resin mold 210H, in the lower mold 12, the clamper 15 is provided with a plurality of through-holes 15b (insertion portions) that are arranged around the cavity piece 16 and into which the plunger 17 is inserted in contact with the cavity piece 16. A tapered runner gate 28 that narrows toward the cavity recess 13 is provided on the upper end surface (the end surface on the upper mold 11 side) of the plunger 17 of the lower mold 12. As with the lower mold 12, the upper mold 11 may or may not have the film F (not shown in FIG. 17).

(Embodiment 10)
The resin molding die 210I according to the present embodiment will be described with respect to differences from the sixth embodiment with reference to FIG. FIG. 18 is a schematic cross-sectional view of a resin molding die 210I.

  In the resin molding die 210I, the clamper 15 of the upper die 11 is fixed to the base 18a via the fixing block 56 instead of the spring member. Further, a runner gate 28 is provided at a position facing the plunger 17 of the lower die 12 on the lower end surface of the clamper 15 of the upper die 11 (parting surface 11a of the upper die 11). The lower mold 12 is provided with an ejector pin mechanism (not shown) for releasing the molding resin remaining on the runner gate 28 after the resin molding from the lower mold 12. A stopper 58 is provided on the upper surface of the base 18b of the lower mold 12 so that the lower mold plate 52 is locked at a certain position when the mold is closed. In addition, like the upper mold | type 11, although the film F may exist in the lower mold | type 12, it is not necessary (it shall not be in FIG. 18).

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  For example, in the first embodiment, the case where the mounting component is mounted on the substrate as the work has been described. For example, the mounting component may be flip-chip mounted on the substrate via bumps. Even in such a case, a so-called mold underfill in which the space between the substrate and the mounting component (bumps) is filled with resin can be performed.

  For example, in the first embodiment, the case has been described in which the cavity piece is applied to the opposite surface (surface) of the mounting component and resin-molded to expose the opposite surface. Not limited to this, so that the cavity piece does not fall below a certain distance from the base, for example, by providing a stopper mechanism for the jaw that hits the upper surface of the clamper at the top of the cavity piece, resin molding without hitting the cavity piece against the opposite surface of the mounted part You can also In other words, the entire mounted component including the opposite surface can be sealed. In this case, the opposite surface of the mounting component is covered with resin.

210 Resin Mold 11 Upper Mold 12 Lower Mold 13 Cavity (Cavity Recess)
17 Plunger (resin pressing part)
18 base

Claims (10)

A resin mold having a pair of molds that can be opened and closed with a cavity,
A base that is provided in one mold and is moved relative to the other mold so as to approach the mold in a closed state and leave in a mold-open state;
A plurality of resin pressing portions provided on the base and arranged around the cavity in a plan view;
A resin molding die comprising: In the resin molding die according to claim 1,
A plurality of insertion portions that are arranged around the cavity apart from the cavity in plan view, and the plurality of resin pressing portions are respectively inserted;
A plurality of runner gates provided on a parting surface of the one or the other mold, and narrowed toward the cavity from positions opposed to the plurality of insertion portions in plan view;
A resin molding die further comprising: In the resin molding die according to claim 1,
A resin molding die, further comprising a plurality of insertion portions arranged in contact with the cavity in plan view and arranged around the cavity, into which the plurality of resin pressing portions are respectively inserted. In the resin molding die according to claim 3,
A resin molding die, further comprising a runner gate provided on a resin pressing surface of the resin pressing portion and narrowing toward the cavity. In the resin mold as described in any one of Claims 1-4,
A resin molding die, further comprising a resin setting portion provided at a position facing the resin pressing portion in a plan view and recessed in a parting surface of the one or the other die. In the resin mold as described in any one of Claims 1-5,
An elastic member;
The resin molding die, wherein the resin pressing portion is provided on the base via the elastic member. In the resin mold as described in any one of Claims 1-5,
The resin molding die, wherein the resin pressing portion is fixed to the base. In the resin mold as described in any one of Claims 1-7,
An overflow cavity provided around the cavity away from the cavity in plan view;
A runner which is provided on a parting surface of the one or the other mold and faces the cavity from a position facing the overflow cavity in a plan view;
A resin molding die further comprising: In the resin mold as described in any one of Claims 1-8,
A resin-molding die, further comprising a film that covers at least one parting surface of the one or the other die. (A) A resin mold having a pair of molds having a cavity and capable of opening and closing, provided on one mold, approaching the other mold in a closed state, Preparing the resin molding die comprising: a base that is relatively moved so as to leave in a state; and a plurality of resin pressing portions that are provided on the base and are arranged around the cavity in plan view;
(B) In a state where the mold is opened, a workpiece having the mounting component is set with the mounting component facing the cavity piece side at a position facing the cavity piece constituting the cavity of the resin molding die in plan view. And a process of
(C) setting the resin at a position facing the resin pressing portion in plan view with the mold opened;
(D) a step of closing the mold and clamping the mold with a clamper around the cavity piece provided in the resin molding mold;
(E) a step of closing the mold further than the step (d) and applying the cavity piece to the mounting component;
(F) The step of closing the mold further than the step (e), pressing the resin with the resin pressing portion, and filling the cavity with the resin;
A resin molding method comprising:

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