JP5930394B2 - Resin molding equipment - Google Patents

Description

  The present invention relates to a technique effective when applied to a resin molding apparatus.

  Japanese Patent Application Laid-Open No. 2004-31855 (Patent Document 1) describes a technique for resin sealing molding using a lower mold elastic member that slides a lower mold main block elastically in the vertical direction according to the thickness of a substrate. Has been.

JP 2004-31855 A (paragraphs [0021]-[0027] in the specification)

  For example, in transfer molding resin mold equipment, when clamping multiple workpieces in a lower mold and an upper mold at once, if the workpiece thickness is different, a high clamping force is applied to a thick workpiece and a low clamping force is applied to a thin workpiece. The clamping force for each workpiece will vary. If transfer molding is performed with variations in clamping force, the molten resin leaks from the resin path (for example, runners, gates, cavities, etc.) of the mold, and flash flashing may occur, or the workpiece may be damaged. Therefore, the molding quality may be reduced. In particular, in a light emitting / receiving element (semiconductor device) such as an LED (Light Emitting Diode) or a light receiving sensor, a mold resin such as a transparent silicone resin is used as a lens material. As a result, flash flash tends to occur. For this reason, it is important to adjust the clamping state corresponding to the thickness variation of each workpiece, and to securely clamp each workpiece and to perform resin molding. Here, in adjusting the thickness variation of each workpiece, for example, it is conceivable to use the technique described in Patent Document 1.

  However, in the technique of Patent Document 1, when the molten resin is pushed by the plunger and injected and filled from the pot into the cavity of the lower mold main block, for example, between the pot and the lower mold main block (gap between the boundaries) It is conceivable that the molten resin gets into Since this molten resin that has entered hardens after a predetermined time has elapsed, there is a risk that the lower main block will not slide in the vertical direction. If the lower mold main block does not slide in accordance with the thickness of the substrate, as described above, flash flash occurs and the molding quality is deteriorated. Even if the thickness can be adjusted without causing resin leakage, the adjustment range is considered to be narrow.

  An object of the present invention is to provide a technique capable of resin molding with high molding quality. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A resin mold apparatus according to an embodiment of the present invention includes a mold provided with a pot, on which a workpiece is placed, and the other mold provided with a cull and a cavity recess facing the one mold. And a film covering the parting surface of the other mold including the cull and the cavity recess, and the mold resin loaded in the pot is moved through the cull by a plunger. It pumps to the said cavity recessed part, and resin molding is performed.

  Here, the other mold includes a cavity piece having the cavity recess, a chase that supports the cavity piece, and a cavity elastic member that supports the cavity piece to be movable with respect to the chase. . Then, the resin molding apparatus abuts the cavity piece on the workpiece when the mold mold clamps the workpiece, and compresses the cavity elastic member by a further mold clamping operation, thereby varying the thickness of the workpiece. A thickness adjustment mechanism that absorbs water is provided.

  According to this, it is possible to reliably clamp even a workpiece having a relatively large variation in thickness. As described above, the improvement of the clamp balance accuracy can reduce the flash flash and can also reduce the breakage of the workpiece. Further, since the parting surface of the other mold is covered with the film, it is possible to prevent the mold resin from entering the boundary between the movable cavity piece and the chase. Therefore, resin molding can be performed with high molding quality.

  Further, as a resin molding apparatus according to another embodiment of the present invention, the other mold includes an air vent piece provided in the cavity piece, and an air vent elasticity for movably supporting the air vent piece with respect to the cavity piece. And a member. The resin mold apparatus has a movable air vent mechanism that abuts the air vent piece against the work when the mold mold clamps the work and compresses the air vent elastic member by a clamping operation to move the air vent piece. It has.

  According to this, the movable air vent mechanism operates separately from the thickness adjusting mechanism, and air venting can be performed reliably, and resin molding can be performed with high molding quality.

  Moreover, as a resin mold apparatus in another embodiment of the present invention, the one mold is an insert block that constitutes a bottom portion of a work housing recess for housing the work, a liner block that supports the insert block, An insert block and a chase for supporting the liner block in an overlapping manner are provided. Here, the cavity piece is provided facing the insert block above the bottom region.

  According to this, the cavity piece can be surely brought into contact with the work so as to cover the whole work, and the thickness variation of the work can be absorbed.

Further, as a resin mold apparatus according to another embodiment of the present invention , a cull is provided at a position facing the pot in the other mold, and a plurality of the workpieces are provided on both sides of the pot in the one mold. The cavity piece is provided on both sides of the cull corresponding to the plurality of workpieces placed on the one mold.

  According to this, many molded products with high molding quality can be obtained at a time. In particular, even when a low-viscosity mold resin, a ceramic substrate, or the like is used for a light emitting / receiving element such as an LED, a plurality of resin molds can be simultaneously formed.

  In another embodiment of the present invention, as the resin molding apparatus, the molding resin is used as a lens material for a light emitting / receiving element, and the cavity recess has a hemispherical shape.

  According to this, for example, in a light emitting / receiving element such as an LED or a light receiving sensor, a high-quality resin lens can be provided.

Further, as a resin molding apparatus according to another embodiment of the present invention, a plunger that slides in the pot and pumps the mold resin into the cavity recess is provided, and the plunger is provided along an outer periphery of a tip of the plunger. A concave groove is provided, and the plunger is provided in the concave groove, and has an inner ring that becomes an elastic body at a molding temperature of the mold resin , and a plurality of outer rings provided on an outer periphery of the inner ring, The outer ring has a cutout portion cut out in a radial direction of the outer ring, and the plurality of outer rings are overlapped in the axial direction of the plunger while shifting the cutout portions.

  According to this, generation | occurrence | production of the resin leak in the clearance gap between a pot and a plunger can be prevented reliably.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the resin mold apparatus in one embodiment of the present invention, resin mold molding can be performed with high molding quality.

It is sectional drawing of the principal part of the resin mold apparatus in one Embodiment of this invention. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is sectional drawing of the principal part of the resin mold apparatus in operation | movement following FIG. It is a top view which shows the state of the workpiece | work before and after resin molding. It is an assembly drawing of the plunger used for a resin mold apparatus. It is explanatory drawing of the state which assembled the plunger.

  In the following embodiments according to the present invention, a plurality of sections will be described when necessary. However, in principle, they are not irrelevant to each other, and one of them is a modification of some or all of the other, details, etc. There is a relationship. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted.

  In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

  Briefly, the resin molding apparatus according to the embodiment of the present invention is configured to include at least one press unit between the supply unit and the storage unit. A supply part is comprised by the well-known mechanism which supplies the workpiece | work and mold resin which are to-be-molded articles to a press part using a loader (conveyance apparatus). In addition, the storage unit is configured by a known mechanism that takes out and stores a work, which is a molded product formed by resin molding, from the press unit using an unloader (conveyance device). Below, the press part characteristic in the resin mold apparatus in this embodiment is demonstrated in detail with reference to drawings.

  FIG. 1 is a cross-sectional view of a press part that is a main part of a resin molding apparatus 10 in the present embodiment. As shown in FIG. 1, the resin mold apparatus 10 includes a mold 11, a plunger 12 that moves forward and backward in a pot 33, and a film 13. These are relationships in which the pot 33, the plunger 12 and the film 13 are provided in the mold 11.

  As this plunger 12, what was provided with the 1st holder 120, the 2nd holder 121, the inner ring 122, and the some outer ring 123 can be utilized as shown in FIGS. The first holder 120 includes a flange portion 120a formed to have the same outer diameter as the inner diameter of the pot 33, and a tapered portion that is connected to the lower surface of the flange portion 120a and whose extension side is reduced in diameter, and extends in a cylindrical shape. The cylindrical body part 120b formed in this manner and the rod part 120c formed to extend from the cylindrical body part 120b so as to have a smaller diameter than the cylindrical body part 120b are integrally formed. A knock pin hole 120d is formed through the rod portion 120c in the radial direction.

  The second holder 121 is for interposing the inner ring 122 and the outer ring 123 between the first holder 120 and assembling the plunger 12 by combining the first holder 120, the outer ring 123 and the second holder 121. is there. The second holder 121 is provided with an insertion hole 121a into which the rod portion 120c of the first holder 120 is inserted, and a knock pin through hole 121b in an arrangement where the hole position coincides with the knock pin hole 120d provided in the first holder 120. Yes. The second holder 121 is pressed from the surface opposite to the first holder 120 side, so that the mold resin 21 can be pressed by the end surface of the first holder 120.

  The inner ring 122 has a through hole 122 a and is formed to have the same inner diameter as the outer diameter of the cylindrical body part 120 b provided in the first holder 120. The inner ring 122 is formed using a material that has a larger linear expansion coefficient than the outer ring 123 at the molding temperature of the mold resin 21 and becomes an elastic body. Specifically, a resin material such as plastic or rubber having a larger thermal expansion coefficient than the metal material forming the pot of the resin mold is used for the inner ring 122. This is because when the plunger 12 configured by combining the first holder 120 and the second holder 121 is mounted in the pot 33 with the inner ring 122 and the outer ring 123 being sandwiched, the inner ring is formed by a mold. 122 is heated and thermally expanded, whereby the outer ring 123 is pressed in the outer circumferential direction, whereby the clearance between the outer ring 123 and the inner circumferential surface of the pot 33 can be eliminated. Further, since the gap in the plunger 12 is filled, the mold resin 21 can be prevented from entering the plunger 12.

  The outer ring 123 is formed in a cylindrical shape having the same outer diameter as the inner diameter of the pot 33. Further, as shown in the figure, the outer ring 123 is formed to be narrower than the inner ring 122 so as to have the same width as the inner ring 122 when all of them are combined. As an example, when two outer rings 123 are used as shown in FIG. 7, the width of the two outer rings 123 is equal to the width of the inner ring 122. A through hole 123 b provided through the outer ring 123 in the axial direction is formed with the same inner diameter as the outer diameter of the inner ring 122. The outer ring 123 has a notch portion 123a that is notched in the radial direction, and is formed in a ring shape that is partially cut away. The outer ring 123 does not necessarily need to be provided with the notch 123 a, and an arbitrary shape that can reliably increase the outer diameter of the outer ring 123 by the expansion of the inner ring 122 and can be brought into close contact with the pot 33 is adopted. be able to. For example, as the widened portion for widening the width of the outer ring 123 in the circumferential direction, the width in the length direction of the plunger 12 is narrowed for a predetermined angle of the outer ring 123 and the shape of the outer ring 123 is folded between A bent shape such as a meandering shape can also be used. In this case, when the inner ring 122 is expanded, the widened portion is pulled from both ends thereof, so that the bent portion is straightened and the width is expanded, thereby reliably increasing the outer diameter of the outer ring 123. Is possible.

  The outer ring 123 is heated by a mold and extends to expand the width of the cutout portion 123a (widen), so that the outer diameter is increased and the material can be in close contact with the pot 33. Need to use. Further, it is preferable to use a material with a small amount of wear even when sliding in the pot 33. For this reason, arbitrary materials, such as steel materials, can be used, for example.

  By using such a material, the seal structure of the plunger 12 can extremely reduce the rate of breakage compared to the case of molding using a resin, for example, and the risk of poor sliding of the plunger 12 is reduced. . Further, since the outer ring 123 can be sufficiently expanded in diameter by the notch portion 123a, the gap between the plunger 12 and the pot 33 is reliably sealed. Thereby, the occurrence of resin leakage in the gap between the pot 33 and the plunger 12 can be reliably prevented, and the adhesion of dirt on the inner periphery of the pot 33 is reduced, thereby reducing the maintenance man-hours.

  FIG. 8 shows a state where the plunger 12 is assembled by combining the first holder 120 and the second holder 121 in a state where the inner ring 122 is inserted into the outer ring 123. In this state, with the knock pin hole 120d and the knock pin through hole 121b being aligned, the first holder 120 is prevented from being detached from the second holder 121 by a knock pin (not shown) and is integrally combined. Accordingly, the first groove 120 and the second groove 121 are provided along the outer periphery of the distal end of the plunger (the groove formed by the cylindrical body 120b having a reduced diameter between the flange 120a and the second holder 121). The groove) has a structure in which a seal structure constituted by the inner ring 122 and the outer ring 123 is fitted.

  In this case, the two outer rings 123 assembled to the plunger 12 are provided on the outer side of the inner ring 122 in a state where the respective notches 123a are shifted and overlapped in the axial direction of the plunger 12. In other words, each notch part 123a is provided outside the inner ring 122 in a state where it is not connected. In this way, by inserting the inner ring 122 and the two outer rings 123 between the first holder 120 (flange portion 120a) and the second holder 121, a plurality of notches are formed in the resin process described later. It is possible to prevent the resin from leaking through the portion 123a. Specifically, the two outer rings 123 are pressed against the second holder 121 by the pressure of the mold resin 21, and in this state, the notch of the first outer ring 123 disposed on the side of the cull 22 is provided. Even if the mold resin 21 enters from the portion 123a, it is stopped by the wall surface of the second outer ring 123, so that further entry is reliably prevented.

  The mold 11 has a lower mold 14 as one mold on which the workpiece W is placed, and an upper mold 15 as the other mold facing the one mold, and is constituted by these. . As shown in FIG. 1, when the mold 11 is opened, a workpiece W (molded product) is supplied by a loader (not shown) before resin molding, and the workpiece W (molding) is performed by an unloader (not shown) after resin molding. Product) is taken out. Further, when the mold 11 is closed, the workpiece W is clamped and the mold resin 21 is injected and filled therein (in FIG. 1, the upper mold 15 provided with a cavity recess 20A constituting the cavity is shown. Is formed).

  In this embodiment, the resin mold apparatus 10 is used in the process of sealing the LED die as a molded product. Specifically, the resin mold apparatus 10 is applied to resin sealing of an LED including a resin lens that requires high molding quality. In the manufacture of the LED, a curable resin such as a thermosetting resin such as silicone, epoxy, urethane, or acrylic is used as the lens material for the light emitting / receiving element as the mold resin 21, and a transparent silicone resin is particularly preferably used. It is done. The shape of the cavity recess 20A may be a shape in which various lens shapes such as a Fresnel lens and a wrench killer lens are dug in addition to the hemispherical convex lens as shown in FIG. 1 according to the product form. It is possible.

  The workpiece W includes a ceramic substrate 30 as a substrate in the present embodiment and a plurality of semiconductor chips 31 (LED dies) mounted thereon. In the resin molding apparatus 10, it is possible to mold a plurality of such semiconductor chips 31 together. In the present embodiment, the thickness of the ceramic substrate 30 clamped by the mold 11 is the thickness of the workpiece W.

  FIG. 6 shows a planar state of the workpiece W before and after resin mold molding. The upper side divided by the double wavy line in FIG. 6 shows the state before molding, and the lower side shows the state after molding (mold part 27, resin path 28). A plurality of semiconductor chips 31 are mounted in a matrix on the ceramic substrate 30. In this case, one semiconductor chip 31 may be mounted in one cavity recess 20A as shown in the figure, or a plurality of semiconductor chips 31 may be mounted together. Further, the ceramic substrate 30 is provided with terminals 29 (which serve as an anode terminal and a cathode terminal of the LED chip) that are electrically connected to the respective semiconductor chips 31. In FIG. 6, a dicing line DL along a region to be an individual product (LED) is indicated by a broken line.

  As shown in FIG. 1, the lower mold 14 of the mold 11 includes a lower chase 32 serving as a base, a cylindrical pot 33 loaded with a mold resin 21, and an insert block on which a workpiece W is placed. 34 and a liner block 35 that supports the insert block 34.

  The lower die chase 32 is formed with a through hole 32A at the center, and the pot 33 is fitted into the through hole 32A and assembled. The upper end surface of the pot 33 is flush with the upper surface of the lower die chase 32 (which constitutes the parting surface 14A of the lower die 14).

  In addition, the lower chase 32 is formed with a recessed hole 32B on the upper surface on both sides of the central portion (pot 33), and these are fixed in the order of the liner block 35 and the insert block 34 from the bottom of each recessed hole 32B. It is assembled (supported by overlapping). The upper surface of the insert block 34 is lower and lower than the upper surface of the lower chase 32. The lower mold 14 is provided with a workpiece receiving recess 40 for receiving the workpiece W with the lower portion as a depth. That is, the insert block 34 constitutes the bottom of the workpiece housing recess 40, and the workpiece W is placed on the insert block 34.

  The depth of the work accommodating recess 40 can be adjusted by the thickness of the liner block 35. For example, the liner block 35 can be replaced depending on the thickness of the workpiece W. As described above, the resin mold apparatus 10 includes the liner adjustment mechanism 102 in the lower mold 14. In the lower mold chase 32, the insert block 34 and the liner block 35 are stacked and supported, and the liner block 35 is used for raising the workpiece receiving recess 40.

  In the lower mold 14 configured as described above, the lower mold chase 32 is placed on a movable platen (not shown) that moves up and down via a drive transmission mechanism (for example, a toggle link mechanism) driven by a drive source (electric motor). Has become a movable type. For this reason, it is possible to perform mold opening / closing with the upper mold 15 as a fixed mold relative to the movable lower mold 14.

  The upper mold 15 of the mold 11 includes a cavity piece 25 having a cavity recess 20A and a resin passage 28 communicating therewith, an upper mold chase 23 for inserting and supporting the cavity piece 25, and an upper mold chase 23. And a cavity elastic member 24 that movably supports the cavity piece 25. The cavity recess 20A formed in the cavity piece 25 accommodates the semiconductor chip 31 as shown in FIG. 3 when the mold 11 is closed. The cavity piece 25 is also formed with a recess for preventing contact with the terminal 29 when the mold is closed.

  The upper chase 23 is provided with a cull 22 and a runner gate 26 extending in communication therewith at the center thereof. The cull 22 is provided at a position facing the pot 33 on the lower mold 14 side (tip portion of the plunger 12).

  Further, the upper chase 23 is formed with stepped concave holes 23A on the upper surfaces on both sides of the central portion, and the cavity elastic member 24, the cover block 41, and the cavity piece 25 are arranged in this order from the bottom of each concave hole 23A. Is assembled. In the concave hole 23A, a step is formed with a wide hole portion on the opening side and a small hole portion on the bottom side. The cavity elastic member 24 is disposed in the small hole portion of the recessed hole 23A. A cavity piece 25 that is urged and assembled to the upper chase 23 by the cavity elastic member 24 is disposed in the wide hole portion of the recessed hole 23A.

  As described above, in the lower mold 14, a plurality of workpieces W are placed on both sides of the pot 33 (plunger 12). Corresponding to the plurality of workpieces W placed on the lower mold 14, cavity pieces 25 are provided on both sides of the cull 22. According to this, many molded products can be obtained by a single press process (molding process). In particular, as in this embodiment, even when a low-viscosity mold resin 21, ceramic substrate 30, or the like is used for a light emitting / receiving element such as an LED, a plurality of resin molds can be simultaneously formed.

  In the present embodiment, a coil spring is used as the cavity elastic member 24. The cavity piece 25 is floating supported (suspended) by the cavity elastic member 24 via the cover block 41 with respect to the bottom of the recessed hole 23A. The elastic force of the cavity elastic member 24 is not affected by the load of the cavity piece 25 and is sufficiently smaller than the clamping force of the mold 11.

  With such a configuration, the resin molding apparatus 10 causes the cavity piece 25 to abut against the workpiece W when clamping the workpiece W by clamping the mold 11, and the cavity elastic member 24 is moved by further clamping operation. A thickness adjusting mechanism 100 that compresses and absorbs and adjusts variations in the thickness of the workpiece W is provided. According to the thickness adjusting mechanism 100, the cavity piece 25 is displaced in the movable direction (vertical direction in FIG. 1) of the cavity piece 25 with respect to the work W fixed by the lower mold 14, so that the thickness of the workpiece W is increased. Variations can be absorbed.

  Therefore, when the mold 11 clamps the workpiece W, it can be reliably clamped even on the workpiece W having a large variation in thickness. Thus, by improving the clamp balance accuracy, flash flash can be reduced, and breakage of the work W having low toughness such as a ceramic substrate can be reduced.

  In addition, since the thickness adjusting mechanism 100 is provided in the upper mold 15 of the mold 11, the thickness adjusting mechanism 100 is not limited in the lower mold 14. For this reason, as described above, the liner adjusting mechanism 102 can be mounted on the lower mold 14. The lower mold 14 can also be equipped with an alignment mechanism that can position the workpiece W at a predetermined position of the workpiece accommodating recess 40, a seal deaeration mechanism that degass the lower mold chase 32 using an O-ring, for example. . The alignment mechanism is effective when positioning with a guide pin is difficult as in the ceramic substrate 30.

  Further, the lower mold 14 is provided with an insert block 34 that constitutes a bottom portion of the workpiece accommodating recess 40 that accommodates the workpiece W. The cavity piece 25 of the upper die 15 is provided opposite to the insert block 34 above the area of the bottom of the work receiving recess 40. According to this, the cavity piece 25 can be contact | abutted reliably to the workpiece | work W so that the whole workpiece | work W may be covered, and the thickness variation of the workpiece | work W can be absorbed.

  In the present embodiment, the upper mold 15 includes an air vent piece 42 provided in the cavity piece 25 and an air vent elastic member 43 that supports the air vent piece 42 so as to be movable with respect to the cavity piece 25. Then, the resin mold apparatus 10 moves the air vent piece 42 by moving the air vent piece 42 by abutting the air vent piece 42 on the work W when the mold 11 clamps the work W, and compressing the air vent elastic member 43 by the mold clamping operation. A mechanism 101 is provided.

  In the state shown in FIG. 1 (the state in which the mold is opened), the convex air vent piece 42 is urged by the air vent elastic member 43 at the head portion, and the tip portion protrudes from the lower surface of the cavity piece 25. An air vent groove connected to an air vent (not shown) extending from the cavity is formed at the tip of the air vent piece 42. In addition, in FIG. 6, although the plane of the workpiece | work W is shown, the position of the air vent piece 42 is also shown collectively.

  For this reason, when the mold 11 clamps the workpiece W, the movable air vent mechanism 101 operates separately from the thickness adjusting mechanism 100, and an appropriate air flow path can be ensured regardless of the thickness of the workpiece W to be clamped. it can. For example, when two workpieces W are molded together on both sides of the pot 33 as in the present embodiment, when the air vent groove is formed by engraving in the cavity piece 25, the cavity elastic member 24 is used according to the thickness of the substrate. The applied clamping force also changes, which may result in insufficient air vents and voids, or flash flash. However, the air vent piece 42 is biased by the air vent elastic member 43 so that the depth of the air vent is not defined corresponding to the clamping force by the cavity elastic member 24 that changes depending on the thickness of the substrate. The air vent elastic member 43 can be set to an arbitrary air vent depth.

  Then, when the plunger 12 is operated and the mold resin 21 is pumped to fill and fill the cavity (cavity recess 20), the air in the cavity recess 20A can be discharged to the outside. Thus, according to the movable air vent mechanism 101, an appropriate air vent becomes possible. For this reason, the flash in the outer peripheral part of the mold part 27 can also be prevented, suppressing generation | occurrence | production of the void by insufficient air vent in the mold part 27 (refer FIG. 6). Therefore, it is possible to mold the lens with high molding quality without voids while preventing contamination of the terminal 29 due to flash, and it is possible to perform resin molding with high molding quality.

  The plunger 12 used for such resin molding is provided on the lower mold 14 side facing the cull 22. The plunger 12 moves up and down (advances and retreats) in the pot 33 by a known transfer drive mechanism. In the resin mold apparatus 10, the plunger 12 is operated to inject and fill the mold resin 21 from the pot 33 into the cavity (cavity recess 20A) through the cull 22 and the runner gate 26, and then heat cure.

  For example, a multi-plunger in which a plurality of plungers 12 are provided on a support block (not shown) corresponding to the plurality of pots 33 can be used. The support portion of each plunger 12 is provided with an elastic member (not shown), and each plunger 12 is slightly displaced by the elasticity of the elastic member to release an excessive pressing force and adapt to variations in the amount of resin during holding. Can be done.

  In the present embodiment, the mold resin 21 pressure-fed by the plunger 12 to the cavity recess 20 </ b> A flows along the film 13 on the parting surface 15 </ b> A side of the upper mold 15. The film 13 is stretched so as to cover the parting surface 15A of the upper mold 15 including the cull 22, the runner gate 26, and the cavity recess 20A.

  As the film 23, a film material having heat resistance that can withstand the heating temperature of the mold 11 and easily peeling from the parting surface 15A and having flexibility and extensibility is used. For example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinyl chloride, etc. are suitably used for the film 23. The film thickness may be sufficiently smaller than the depth of the cull 22, the cull 22, the runner gate 26, and the cavity recess 20A.

  The film 13 has a long shape, and is drawn out from a feeding roll wound up in a roll shape, passes through the parting surface 15A, and is wound up on the winding roll. The film 13 is adsorbed and held by a known suction mechanism using a gap between the upper chase 23 and the cavity piece 25 and a vent hole (not shown) formed in the cavity piece 25 that communicates with the parting surface 15A. The cover block 41 on the cavity piece 25 is provided to cover the groove formed on the upper surface side of the cavity piece 25 constituting the vent hole. Note that the cover block 41 is not necessary if a vent hole can be provided inside the cavity piece 25.

  Thus, since the parting surface 15A of the upper mold 15 is covered with the film 13, it is possible to prevent the mold resin 21 from entering the boundary between the upper mold chase 23 and the cavity piece 25 movable relative thereto. . Further, even when there are minute irregularities or the substrate thickness has a small inclination, the gap can be filled, so that flash flash can be prevented from occurring. Therefore, resin molding can be performed with high molding quality. Further, since the mold resin 21 can be prevented from adhering to the movable cavity piece 25, the molding process can be continuously performed, and the maintenance frequency can be reduced. Further, by using the film 23, it is possible to easily release the workpiece W after molding without providing an ejector pin in the mold 11.

  Next, the operation of the resin mold apparatus 10 for resin molding will be described with reference to the drawings. 1-5 is sectional drawing of the principal part of the resin mold apparatus 10 in operation | movement.

  First, the tablet-shaped mold resin 21 is supplied to the pot 33 with the mold 11 being opened. The state of the mold resin 21 is not limited to the tablet shape, but may be liquid, granular, or powder. In addition, the workpiece W is loaded and placed (supplied) in each of the workpiece receiving recesses 40 provided on both sides of the pot 33 of the lower mold 14.

  In the opened state shown in FIG. 1, the lower surface of the cavity piece 25 movable in the vertical direction by the thickness adjusting mechanism 100 protrudes downward from the lower surface of the upper die chase 23. Since the right and left cavity elastic members 24 shown in FIG. 1 have the same length and characteristics, the lower surfaces of the right and left cavity pieces 25 are also the same. Further, the front end surface of the air vent piece 42 that is movable in the vertical direction by the movable air vent mechanism 101 protrudes below the lower surface of the cavity piece 25.

  In FIG. 1, each workpiece W shows a state in which the right workpiece W is thin and the left workpiece W is thick. Further, the surface of the right workpiece W is flush with the parting surface 14A of the lower mold 14, and the surface of the left workpiece W protrudes higher than the parting surface 14A.

  Subsequently, as shown in FIG. 2, the film 13 is sucked and held on the parting surface 15 </ b> A of the upper mold 15 by a suction mechanism (not shown). The film 13 covers the parting surface 15A of the upper mold 15 including the cull 22, the runner gate 26, and the cavity recess 20A.

  Subsequently, as shown in FIG. 3, when the lower mold 14 is raised, the surface of the left work W and the lower surface of the left cavity piece 25 come into contact with each other through the film 13, and the mold 11 By this, the work W on the left side starts to be clamped. At this time, on the left side, the cavity 20 is formed by the cavity recess 20A of the cavity piece 25 and the workpiece W.

  Subsequently, as shown in FIG. 4, when the lower die 14 is further raised, the surface of the right workpiece W and the lower surface of the right cavity piece 25 come into contact with each other via the film 13, and the mold die 11 starts clamping the right workpiece W. At this time, on the right side, the cavity 20 is formed by the cavity recess 20A of the cavity piece 25 and the workpiece W. Further, since the thicknesses of the right and left workpieces W are different, the left cavity elastic member 24 in contact with the workpiece is compressed by the difference in thickness of the workpiece W.

  Thus, even if there is a variation in the thickness of the ceramic substrate 30 constituting the workpiece W, the clamp state caused by this variation can be adjusted by the cavity elastic member 24 of the thickness adjusting mechanism 100. Therefore, the thickness adjusting mechanism 100 can sufficiently handle a workpiece W having a somewhat large variation in thickness as compared with a lead frame, for example, a ceramic substrate. Actually, since the cavity piece 25 is brought into contact with the workpiece W via the film 13, the thickness adjusting function can be improved by the elasticity of the film 13 to be compressed.

  When the lower die 14 is further raised to maintain a predetermined clamping force, the left and right cavity elastic members 24 are compressed. As described above, according to the resin mold apparatus 10 provided with the thickness adjusting mechanism 100 that absorbs and adjusts the thickness variation, the flash W or the workpiece W is damaged by reliably clamping the workpiece W with the thickness variation. Can be prevented.

  Subsequently, as shown in FIG. 5, in a state where the workpiece W is clamped by the mold 11, a resin path 28 (see FIG. 6) communicating with the cavity 20 through the cull 22 and the runner gate 26 is formed. . At this time, the plunger 12 is operated, the molten mold resin 21 is pumped, and the cavity 20 is injected and filled.

  Here, since each workpiece W can be reliably clamped, it is ensured that the molten mold resin 21 leaks from a large number of cavities 20 and resin paths 28 formed in the mold 11 and a flash beam is generated. Can be prevented. Therefore, resin molding can be performed with high molding quality.

  As described above, the present invention has been specifically described based on the embodiment. However, the following is a brief description of typical features and actions and effects obtained thereby.

  A resin mold apparatus 10 according to an embodiment of the present invention includes a mold 11, a plunger 12, and a film 13. The mold 11 has a lower mold 14 (one mold) on which the workpiece W is placed and an upper mold 15 (the other mold) provided with a cavity recess 20A facing the lower mold 14. The plunger 12 is provided on the lower mold 14 side so as to face the cull 22. The plunger 12 pumps the mold resin 21 to the cavity recess 20 </ b> A through a cull 22 provided on the upper mold 15. The film 13 covers the parting surface 15A of the upper mold 15 including the cull 22 and the cavity recess 20A.

  The upper die 15 has a cavity piece 25 having a cavity recess 20A, an upper die chase 23 for inserting and supporting the cavity piece 25, and a cavity elasticity for supporting the cavity piece 25 movably with respect to the upper die chase 23. Member 24. Then, the resin mold apparatus 10 abuts the cavity piece 25 on the workpiece W when the mold 11 clamps the workpiece W, and compresses the cavity elastic member 24 by further clamping operation, thereby varying the thickness of the workpiece W. A thickness adjustment mechanism 100 that absorbs and adjusts is provided.

  According to this, it can clamp reliably also to the workpiece | work W with large dispersion | variation in thickness. In addition, since the parting surface 15A of the upper mold 15 is covered with the film 13, it is possible to prevent the mold resin 21 from entering the boundary between the movable cavity piece 25 and the upper mold chase 23. Therefore, resin molding can be performed with high molding quality.

  Furthermore, it goes without saying that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

  For example, in the above-described embodiment, the case where one mold of the mold is a lower mold and the other mold is an upper mold has been described. However, the present invention is not limited thereto, and one mold may be an upper mold and the other mold may be a lower mold. In this case, the plunger and the pot are provided on the upper mold side, and the film covers the parting surface of the lower mold including the cull and the cavity recess.

  Further, for example, in the above-described embodiment, the case where the cavity pieces are assembled on both sides of the cull has been described. Not only this but the case where a cavity piece is assembled | attached only to the one side of a cull may be sufficient.

  Further, for example, in the above-described embodiment, a case where the molded product is applied to a light emitting / receiving element such as an LED or a light receiving sensor and a lens material for the light emitting / receiving element (for example, a transparent silicone resin) is used as the molded resin is described. did. However, the present invention is not limited to this, and a reflector material for a light emitting / receiving element (for example, a silicone resin containing a filler such as silica, alumina and titanium oxide) may be used. In addition, as a molded product, it is applied to a semiconductor package other than the light emitting / receiving element (for example, a rectangular shape), and a mold resin suitable for each is used (for example, a filler-containing epoxy resin such as silica). Also good. In particular, the present invention can be applied to a low-viscosity resin having a small filler content such as a transparent silicone resin, and can be resin-molded with high molding quality.

  For example, in the above-described embodiment, the case where the movable air vent mechanism is provided has been described. However, the present invention is not limited to this, and the movable air vent mechanism may not be provided. For example, an air vent groove fixed to the cavity piece may be provided (formed) and a fixed air vent mechanism may be provided.

  Further, for example, in the above-described embodiment, a case has been described in which the shape of the plane of the bottom region of the workpiece accommodating recess matches the shape of the plane (opposing surface) of the cavity piece facing this. Not only this but the plane of a cavity piece may be a case where it is smaller than the plane of the bottom part field of a work accommodation crevice.

  For example, in the above-described embodiment, the case where a coil spring is used as the cavity elastic member has been described. Not only this but the disc spring laminated | stacked as a cavity elastic member can also be used.

  For example, in the above-described embodiment, the case where the upper mold of the mold is a fixed mold and the lower mold is a movable mold has been described. However, the present invention is not limited to this, and the upper mold may be a movable mold and the lower mold may be a fixed mold.

  For example, in the above-described embodiment, the case where the present invention is applied to a workpiece in which a semiconductor chip is mounted on a ceramic substrate has been described. The substrate is not limited to this, and the substrate is a resin substrate such as a metal substrate such as aluminum, a multilayer wiring substrate (organic substrate), a lead frame, a wafer, a carrier on which electronic components such as a semiconductor element and a wiring member are mounted. I just need it. Moreover, as an electronic component, a transient voltage suppression (TVS) diode, a chip capacitor, or the like may be mounted.

DESCRIPTION OF SYMBOLS 10 Resin mold apparatus 11 Mold die 12 Plunger 13 Film 14 Lower mold 15 Upper mold 15A Parting surface 20A Cavity recessed part 21 Mold resin 22 Cal 23 Upper mold chase 24 Cavity elastic member 25 Cavity piece 33 Pot 100 Thickness adjustment mechanism

Claims (5)

A mold having a pot and a mold to which a workpiece is supplied, and another mold having a cavity recess facing the one mold;
A film covering the parting surface of the other mold including the cavity recess,
A resin molding apparatus for performing resin molding by pressure-feeding the mold resin loaded in the pot to the cavity recess,
The other mold is provided in the cavity piece, a cavity piece having the cavity recess, a chase for supporting the cavity piece, a cavity elastic member for movably supporting the cavity piece with respect to the chase, and the cavity piece. An air vent piece, and an air vent elastic member that movably supports the air vent piece with respect to the cavity piece ,
The molding die, the said cavity pieces when clamping the workpiece in contact with the workpiece, the thickness adjusting mechanism by further clamping operation by compressing the cavity resilient member to absorb the variations in thickness of the workpiece and A resin mold comprising: a movable air vent mechanism that abuts the air vent piece against the work when clamping the work, and compresses the air vent elastic member by a clamping operation to move the air vent piece. apparatus. A mold having a pot and a mold to which a workpiece is supplied, and another mold having a cavity recess facing the one mold;
A film covering the parting surface of the other mold including the cavity recess,
A resin molding apparatus for performing resin molding by pressure-feeding the mold resin loaded in the pot to the cavity recess,
The other mold includes a cavity piece having the cavity recess, a chase that supports the cavity piece, and a cavity elastic member that movably supports the cavity piece with respect to the chase,
A thickness adjusting mechanism that abuts the cavity piece on the work when the mold mold clamps the work and compresses the cavity elastic member by a further mold clamping operation to absorb variations in the thickness of the work. ,
The one mold includes an insert block that constitutes a bottom portion of a work receiving recess for receiving the work, a liner block that supports the insert block, and a chase that supports the insert block and the liner block in an overlapping manner. Prepared,
The resin molding apparatus , wherein the cavity piece is provided to face the insert block above the bottom region . In the resin mold device according to claim 1 or 2 ,
In the other mold, a cull is provided at a position facing the pot,
In the one mold, a plurality of the workpieces are placed on both sides of the pot,
A resin molding apparatus, wherein the cavity piece is provided on both sides of the cull corresponding to the plurality of workpieces placed on the one mold. In the resin mold apparatus as described in any one of Claims 1-3 ,
The mold resin is used as a lens material for a light emitting / receiving element,
A resin mold apparatus, wherein the cavity recess has a hemispherical shape. In the resin mold apparatus as described in any one of Claims 1-4 ,
A plunger that slides in the pot and pumps the mold resin into the cavity recess;
The plunger is provided with a groove along the outer periphery of the tip of the plunger,
The plunger has an inner ring that is provided in the concave groove and becomes an elastic body at a molding temperature of the mold resin , and a plurality of outer rings that are provided on the outer periphery of the inner ring,
The outer ring has a notch cut out in a radial direction of the outer ring;
The plurality of outer rings are overlapped in the axial direction of the plunger with the respective cutout portions being shifted.

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