TWI483831B - A manufacturing apparatus for sealing a resin sheet for sealing, and a method for producing a resin sheet for sealing - Google Patents

A manufacturing apparatus for sealing a resin sheet for sealing, and a method for producing a resin sheet for sealing Download PDF

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Publication number
TWI483831B
TWI483831B TW102109365A TW102109365A TWI483831B TW I483831 B TWI483831 B TW I483831B TW 102109365 A TW102109365 A TW 102109365A TW 102109365 A TW102109365 A TW 102109365A TW I483831 B TWI483831 B TW I483831B
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Taiwan
Prior art keywords
resin
sealing
pressing
elastic member
plate
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TW102109365A
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Chinese (zh)
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TW201343357A (en
Inventor
Yuya Ida
Hiroki Kitayama
Akio Katsube
Koji Watanabe
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Murata Manufacturing Co
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

密封用樹脂片材之製造裝置及密封用樹脂片材之製造方法Manufacturing apparatus for sealing resin sheet and method for producing resin sheet for sealing

本發明係關於一種用以將搭載於基板上之複數個電子零件絕緣密封之密封用樹脂片材之製造裝置及密封用樹脂片材之製造方法。The present invention relates to a manufacturing apparatus for sealing a resin sheet for insulating and sealing a plurality of electronic components mounted on a substrate, and a method for producing a resin sheet for sealing.

於在基板上搭載有複數個電子零件之電子零件模組中,為了保護電子零件不受濕氣、外部接觸等影響,而以覆蓋電子零件之方式於基板上形成絕緣樹脂層。該絕緣樹脂層係藉由在將電子零件埋設於半硬化狀態之密封用樹脂片材之後,對密封用樹脂片材進行加熱硬化而形成。In an electronic component module in which a plurality of electronic components are mounted on a substrate, an insulating resin layer is formed on the substrate so as to cover the electronic components in order to protect the electronic components from moisture and external contact. This insulating resin layer is formed by embedding an electronic component in a semi-hardened sealing resin sheet and then heat-hardening the sealing resin sheet.

於專利文獻1(日本專利特開2009-29930號公報)中記載有該密封用樹脂片材之製造方法。根據專利文獻1之記載,如圖19所示,藉由塗佈裝置101將液狀之樹脂組合物102塗佈於支持膜103之上表面,將自脫模膜輥104陸續送出之脫模膜105重疊於樹脂組合物102之上表面,利用按壓輥106按壓樹脂組合物102,藉此製造密封用樹脂片材205。A method of producing the resin sheet for sealing is described in the patent document 1 (Japanese Laid-Open Patent Publication No. 2009-29930). According to the description of Patent Document 1, as shown in FIG. 19, the liquid resin composition 102 is applied onto the upper surface of the support film 103 by the coating device 101, and the release film is continuously fed from the release film roll 104. 105 is superposed on the upper surface of the resin composition 102, and the resin composition 102 is pressed by the pressing roller 106, whereby the sealing resin sheet 205 is produced.

[先前技術文獻][Previous Technical Literature] [專利文獻][Patent Literature]

[專利文獻1]日本專利特開2009-29930號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-29930

然而,於專利文獻1中記載之密封用樹脂片材205之製造方法中 存在如下問題:必需塗佈裝置101、脫模膜輥104、按壓輥106等高價之設備,因此密封用樹脂片材205之製造成本變高。However, in the method of manufacturing the sealing resin sheet 205 described in Patent Document 1, There is a problem that expensive equipment such as the coating device 101, the release film roll 104, and the pressing roller 106 is required, and therefore the manufacturing cost of the sealing resin sheet 205 becomes high.

又,於如專利文獻1所記載般於支持膜103之上表面塗佈液狀之樹脂組合物102之方法中,液狀之樹脂組合物10潤濕擴散,因此難以製造厚度較大之密封用樹脂片材205。Further, in the method of applying the liquid resin composition 102 to the upper surface of the support film 103 as described in Patent Document 1, the liquid resin composition 10 is wetted and diffused, so that it is difficult to produce a seal having a large thickness. Resin sheet 205.

又,於專利文獻1中記載之密封用樹脂片材205之製造方法中,不存在於成形途中限制厚度方向者,難以確保密封用樹脂片材205之厚度精度。近年來,要求電子零件模組之低背化以及厚度精度之提昇,若密封用樹脂片材205之厚度精度較低,則無法達成電子零件模組之低背化或厚度精度之提昇。Moreover, in the manufacturing method of the sealing resin sheet 205 of the patent document 1, it is difficult to ensure the thickness precision of the sealing resin sheet 205 in the thickness direction in the middle of shaping|molding. In recent years, in order to reduce the low-profile and thickness accuracy of the electronic component module, if the thickness of the sealing resin sheet 205 is low, the low-profile or thickness precision of the electronic component module cannot be achieved.

本發明所欲解決之課題係減少關於上述密封用樹脂片材205之製造之問題。The problem to be solved by the present invention is to reduce the problem of the production of the above-mentioned sealing resin sheet 205.

本發明之密封用樹脂片材之製造裝置係用以將搭載於基板上之複數個電子零件絕緣密封之密封用樹脂片材之製造裝置,且包括:成形模具,其規定用以自包含絕緣性之樹脂材料之半硬化狀態之樹脂體成形密封用樹脂片材之空間;加熱機構,其用於以低於樹脂體之硬化溫度之溫度對樹脂體進行加熱;真空機構,其用以將成形模具內進行抽真空;及加壓機構,其用以按壓樹脂體而將樹脂材料填充於成形模具內;且成形模具包括:1對按壓板,其用以藉由來自按壓機構之按壓力按壓樹脂體而成形密封用樹脂片材;剛體板,其配置於1對按壓板之間用以設定成形後之密封用樹脂片材之厚度;及彈性構件,其於剛體板之內側以包圍樹脂體之方式配置於1對按壓板之間,厚度大於剛體板之厚度,且可藉由來自按壓板之按壓力而變形。The apparatus for producing a resin sheet for sealing according to the present invention is a manufacturing apparatus for sealing a resin sheet for insulating and sealing a plurality of electronic components mounted on a substrate, and includes a molding die, which is provided for self-contained insulation. a space for forming a resin sheet for sealing a resin body in a semi-hardened state; a heating mechanism for heating the resin body at a temperature lower than a curing temperature of the resin body; and a vacuum mechanism for forming the mold Vacuuming; and a pressing mechanism for pressing the resin body to fill the resin material in the forming mold; and the forming mold includes: a pair of pressing plates for pressing the resin body by pressing force from the pressing mechanism The resin sheet for forming and sealing; the rigid body plate disposed between the pair of pressing plates for setting the thickness of the sealing resin sheet after molding; and the elastic member for enclosing the resin body inside the rigid plate It is disposed between a pair of pressing plates, the thickness is larger than the thickness of the rigid body plate, and can be deformed by the pressing force from the pressing plate.

較佳為,彈性構件具有自樹脂體側之面朝向剛體板之方向被切口之樹脂積存部。Preferably, the elastic member has a resin reservoir portion that is notched from the surface of the resin body toward the rigid plate.

或者,彈性構件具有自樹脂體側之面貫通至剛體板之面之第1樹脂積存部,剛體板具有與第1樹脂積存部連通且於剛體板之內側被切口之第2樹脂積存部。Alternatively, the elastic member has a first resin reservoir that penetrates from the surface of the resin body to the surface of the rigid plate, and the rigid plate has a second resin reservoir that communicates with the first resin reservoir and is notched inside the rigid plate.

或者,剛體板具有沿著內周被切口之壓溝槽。Alternatively, the rigid body plate has a pressure groove that is slit along the inner circumference.

又,按壓板於按壓樹脂體之面上具有凹部,彈性構件係以嵌入至凹部之狀態配置。Further, the pressing plate has a concave portion on the surface on which the resin body is pressed, and the elastic member is disposed in a state of being fitted into the concave portion.

本發明之密封用樹脂片材之製造方法係用以將搭載於基板上之複數個電子零件絕緣密封之密封用樹脂片材之製造方法,且包括:準備步驟,其準備包含絕緣性之樹脂材料之半硬化狀態之樹脂體、用以按壓樹脂體而成形密封用樹脂片材之1對按壓板、用以設定成形後之密封用樹脂片材之厚度之剛體板、及厚度大於剛體板之厚度且可藉由來自按壓板之按壓力而變形之彈性構件;空間形成步驟,其將樹脂體配置於1對按壓板之間,將剛體板配置於1對按壓板之間,且於剛體板之內側以包圍樹脂體之方式將彈性構件配置於1對按壓板之間,藉由該1對按壓板及彈性構件而形成包圍樹脂體之空間;減壓步驟,其將空間內進行抽真空;加熱步驟,其以低於樹脂體之硬化溫度之溫度對樹脂體進行加熱;按壓步驟,其藉由按壓板按壓彈性構件及剛體板,並且藉由按壓板按壓樹脂體;及填充步驟,其藉由按壓並延長樹脂體,而將樹脂材料填充於空間內。The method for producing a resin sheet for sealing according to the present invention is a method for producing a resin sheet for sealing which insulates and seals a plurality of electronic components mounted on a substrate, and includes a preparation step of preparing an insulating resin material a resin body in a semi-hardened state, a pair of pressing plates for pressing the resin body to form a sealing resin sheet, a rigid body plate for setting a thickness of the sealing resin sheet after molding, and a thickness larger than a thickness of the rigid body plate And an elastic member deformed by a pressing force from the pressing plate; a space forming step of disposing the resin body between the pair of pressing plates, disposing the rigid body plate between the pair of pressing plates, and the rigid plate The elastic member is disposed between the pair of pressing plates so as to surround the resin body, and the space surrounding the resin body is formed by the pair of pressing plates and the elastic member; and the vacuuming step is performed to evacuate the space; a step of heating the resin body at a temperature lower than a curing temperature of the resin body; a pressing step of pressing the elastic member and the rigid body plate by the pressing plate, and pressing by pressing the plate Resin body; and a filling step of the resin body and extended by pressing, and the resin material is filled in the space.

較佳為,於按壓步驟中,藉由按壓板之按壓而使彈性構件變形,於填充步驟中,於彈性構件與按壓板之間阻擋樹脂材料。Preferably, in the pressing step, the elastic member is deformed by pressing of the pressing plate, and in the filling step, the resin material is blocked between the elastic member and the pressing plate.

進而較佳為,於準備步驟中,準備用以保護成形後之密封用樹脂片材之主面之1對保護膜,於空間形成步驟中,以自樹脂體之底面通過彈性構件及剛體板之上表面之方式配置一個保護膜,且以與樹脂體之上表面及一個保護膜對向之方式配置另一個保護膜,藉此,藉由一個及另一個保護膜而形成包圍樹脂體之膜內區域,於減壓步驟中, 將膜內區域進行抽真空,於填充步驟中,於保護膜之面方向上延長樹脂體,將樹脂材料填充於膜內區域。Furthermore, in the preparation step, a pair of protective films for protecting the main surface of the resin sheet for sealing after molding are prepared, and in the space forming step, the elastic member and the rigid plate are passed from the bottom surface of the resin body. a protective film is disposed on the upper surface, and another protective film is disposed opposite to the upper surface of the resin body and a protective film, whereby the film surrounding the resin body is formed by one and the other protective film. Area, in the decompression step, The inner region of the film is evacuated, and in the filling step, the resin body is elongated in the direction of the surface of the protective film, and the resin material is filled in the inner region of the film.

又,較佳為彈性構件具有自樹脂體側之面朝向剛體板之方向被切口之樹脂積存部,且於填充步驟中,使樹脂材料進入至樹脂積存部。Moreover, it is preferable that the elastic member has a resin reservoir that is notched from the surface of the resin body toward the rigid plate, and that the resin material enters the resin reservoir in the filling step.

或者,較佳為,彈性構件具有自樹脂體側之面貫通至剛體板側之面之第1樹脂積存部,剛體板具有與第1樹脂積存部連通且於剛體板之內側被切口之第2樹脂積存部,且於填充步驟中,使樹脂材料通過第1樹脂積存部進入至第2樹脂積存部。Alternatively, it is preferable that the elastic member has a first resin reservoir that penetrates from the surface on the resin body side to the surface on the rigid plate side, and the rigid plate has the second resin in communication with the first resin reservoir and is notched to the inside of the rigid plate. In the resin storage portion, the resin material enters the second resin reservoir through the first resin reservoir in the filling step.

或者,較佳為剛體板具有沿著內周被切口之壓溝槽,且於填充步驟中,藉由來自樹脂材料之壓力使彈性構件向壓溝槽側彎曲。Alternatively, it is preferable that the rigid body plate has a pressure groove which is cut along the inner circumference, and in the filling step, the elastic member is bent toward the pressure groove side by the pressure from the resin material.

又,較佳為按壓板於按壓樹脂體之面上具有凹部,彈性構件係以嵌入至凹部之狀態配置。Moreover, it is preferable that the pressing plate has a concave portion on the surface on which the resin body is pressed, and the elastic member is disposed in a state of being fitted into the concave portion.

根據本發明之密封用樹脂片材之製造裝置,無需高價之設備,可廉價地製造膜厚較大之密封用樹脂片材。又,可防止樹脂材料向成形模具之外洩漏,可提昇成形後之密封用樹脂片材之厚度精度。According to the apparatus for producing a resin sheet for sealing of the present invention, it is possible to inexpensively produce a sealing resin sheet having a large film thickness without requiring expensive equipment. Further, it is possible to prevent the resin material from leaking outside the molding die, and it is possible to improve the thickness precision of the sealing resin sheet after molding.

根據本發明之密封用樹脂片材之製造方法,可防止樹脂材料向外洩漏,可提昇密封用樹脂片材之厚度精度。According to the method for producing a resin sheet for sealing of the present invention, the resin material can be prevented from leaking outward, and the thickness precision of the resin sheet for sealing can be improved.

11‧‧‧密封用樹脂片材11‧‧‧Seal sheet for sealing

12A、12B‧‧‧保護膜12A, 12B‧‧‧ Protective film

15‧‧‧樹脂材料15‧‧‧Resin materials

20‧‧‧圓筒模20‧‧‧Cylinder mold

21‧‧‧液狀樹脂21‧‧‧Liquid resin

22‧‧‧樹脂體22‧‧‧ resin body

22B‧‧‧樹脂體22B‧‧‧ resin body

22C‧‧‧樹脂體22C‧‧‧ resin body

30‧‧‧製造裝置30‧‧‧Manufacture of equipment

31‧‧‧受壓板31‧‧‧ under pressure plate

32‧‧‧加壓板32‧‧‧ Pressurized plate

33A、33B‧‧‧加熱機構33A, 33B‧‧‧ heating mechanism

34‧‧‧加壓機構34‧‧‧ Pressurizing mechanism

35‧‧‧底板35‧‧‧floor

36‧‧‧頂板36‧‧‧ top board

37‧‧‧支柱37‧‧‧ pillar

38‧‧‧真空機構38‧‧‧vacuum mechanism

39‧‧‧驅動軸39‧‧‧Drive shaft

40、50、60、70、80‧‧‧成形模具40, 50, 60, 70, 80‧‧‧ forming dies

43、45、81‧‧‧按壓板43, 45, 81‧‧‧ Press plate

44、62、71‧‧‧剛體板44, 62, 71‧‧‧ rigid body board

44D‧‧‧剛體板44D‧‧‧ rigid body board

46‧‧‧空間46‧‧‧ Space

47‧‧‧膜內區域47‧‧‧Intramembrane area

48、51、83‧‧‧彈性構件48, 51, 83‧‧‧ elastic members

50A‧‧‧成形模具50A‧‧‧Forming mould

50C‧‧‧成形模具50C‧‧‧Forming mould

50D‧‧‧成形模具50D‧‧‧forming mould

51A‧‧‧彈性構件51A‧‧‧Flexible components

51C‧‧‧彈性構件51C‧‧‧Flexible components

51D‧‧‧彈性構件51D‧‧‧Flexible components

52‧‧‧樹脂積存部52‧‧‧Resin Storage Department

52A‧‧‧切口52A‧‧‧ incision

52D‧‧‧切口52D‧‧‧ incision

53‧‧‧剩餘部分53‧‧‧ remaining parts

63‧‧‧第1樹脂積存部63‧‧‧1st resin reservoir

64‧‧‧第2樹脂積存部64‧‧‧2nd resin reservoir

65‧‧‧剩餘部分65‧‧‧ remaining

72‧‧‧壓溝槽72‧‧‧pressure trench

73‧‧‧凸出73‧‧‧ protruding

81A‧‧‧按壓板81A‧‧‧ Pressing plate

82‧‧‧凹部82‧‧‧ recess

82A‧‧‧凹部82A‧‧‧ recess

83A‧‧‧彈性構件83A‧‧‧Flexible components

101‧‧‧塗佈裝置101‧‧‧ Coating device

102‧‧‧樹脂組合物102‧‧‧Resin composition

103‧‧‧支持膜103‧‧‧Support film

104‧‧‧脫模膜輥104‧‧‧ release film roll

105‧‧‧脫模膜105‧‧‧ release film

106‧‧‧按壓輥106‧‧‧Press roller

140‧‧‧成形模具140‧‧‧Forming mould

144‧‧‧剛體板144‧‧‧ rigid body board

145‧‧‧按壓板145‧‧‧ Press plate

150‧‧‧間隙150‧‧‧ gap

151‧‧‧樹脂材料151‧‧‧Resin materials

205‧‧‧密封用樹脂片材205‧‧‧Seal sheet for sealing

圖1係自正面觀察密封用樹脂片材11之剖面圖。Fig. 1 is a cross-sectional view of the sealing resin sheet 11 as seen from the front.

圖2係本發明之第1實施形態之密封用樹脂片材11之製造裝置30之概略圖。Fig. 2 is a schematic view showing a manufacturing apparatus 30 for a sealing resin sheet 11 according to the first embodiment of the present invention.

圖3(A)、(B)係表示於圖2中成形途中之樹脂體22之情況之圖。3(A) and 3(B) are views showing the state of the resin body 22 in the middle of molding in Fig. 2 .

圖4(A)、(B)係表示相對於圖3之比較例之圖,且係表示不使用彈性構件而成形密封用樹脂片材11之情形之樹脂體22之情況之圖。4(A) and 4(B) are views showing a state of the resin body 22 in the case where the sealing resin sheet 11 is formed without using an elastic member, as shown in the comparative example of Fig. 3 .

圖5(A)-(E)係依序表示本發明之第1實施形態之密封用樹脂片材11之製造方法中具備之步驟之圖。(A) to (E) are views showing the steps of the method for producing the resin sheet for sealing 11 according to the first embodiment of the present invention.

圖6(A)-(E)係用以說明本發明之第2實施形態者,且係依序表示密封用樹脂片材11之製造步驟之圖。6(A) to 6(E) are views for explaining the steps of manufacturing the sealing resin sheet 11 in order to explain the second embodiment of the present invention.

圖7(A)-(C)係用以說明本發明之第3實施形態者,且係依序表示密封用樹脂片材11之成形前、成形途中及成形後之階段之俯視圖。7(A) to 7(C) are plan views showing the third embodiment of the present invention, and showing the stages before, during, and after the molding of the resin sheet 11 for sealing.

圖8係表示關於圖7所示之成形模具50之第1變化例之圖。Fig. 8 is a view showing a first modification of the molding die 50 shown in Fig. 7.

圖9係表示關於圖7所示之樹脂體22之第2變化例之圖。Fig. 9 is a view showing a second modification of the resin body 22 shown in Fig. 7.

圖10係表示關於圖7所示之成形模具50及樹脂體22之第3變化例之圖。Fig. 10 is a view showing a third modification of the molding die 50 and the resin body 22 shown in Fig. 7 .

圖11係表示關於圖7所示之成形模具50之第4變化例之圖。Fig. 11 is a view showing a fourth modification of the molding die 50 shown in Fig. 7.

圖12(A)、(B)係用以說明本發明之第4實施形態者,且係表示密封用樹脂片材11之成形前之階段之圖。12(A) and (B) are views for explaining the fourth embodiment of the present invention, and showing the stage before the molding of the sealing resin sheet 11.

圖13(A)、(B)係自圖12所示之階段前進而表示密封用樹脂片材11之成形途中之階段之圖。(A) and (B) are diagrams showing the stages in the middle of the molding of the resin sheet 11 for sealing from the stage shown in Fig. 12 .

圖14(A)、(B)係自圖13所示之階段前進而表示密封用樹脂片材11之成形後之階段之圖。(A) and (B) are diagrams showing the stages after the formation of the resin sheet 11 for sealing from the stage shown in Fig. 13 .

圖15(A)、(B)係用以說明本發明之第5實施形態者,且係表示密封用樹脂片材11之成形途中之階段之圖。15(A) and 15(B) are views for explaining the fifth embodiment of the present invention, and showing a stage in the middle of molding of the sealing resin sheet 11.

圖16(A)、(B)係自圖15所示之階段前進而表示密封用樹脂片材11之成形後之階段之圖。16(A) and 16(B) are diagrams showing the stages after the formation of the sealing resin sheet 11 from the stage shown in Fig. 15 .

圖17係用以說明本發明之第6實施形態者,且係表示成形密封用樹脂片材11之成形模具80之圖。FIG. 17 is a view showing a molding die 80 for molding the resin sheet 11 for sealing, which is a sixth embodiment of the present invention.

圖18係表示圖17所示之成形模具80之變化例之圖。Fig. 18 is a view showing a modification of the molding die 80 shown in Fig. 17.

圖19係表示先前技術中之密封用樹脂片材205之製造方法之圖。Fig. 19 is a view showing a method of manufacturing the sealing resin sheet 205 of the prior art.

[第1實施形態][First Embodiment] (密封用樹脂片材)(sealing resin sheet)

於在基板上搭載有複數個電子零件之電子零件模組中,為了將電子零件絕緣密封而使用密封用樹脂片材。如圖1所示,密封用樹脂片材11形成為平板形狀,厚度為0.1mm~3.5mm。密封用樹脂片材11包含半硬化狀態之絕緣性之樹脂材料15(例如環氧樹脂),且為了提高機械強度,例如含有二氧化矽或氧化鋁作為填料。In an electronic component module in which a plurality of electronic components are mounted on a substrate, a sealing resin sheet is used in order to insulate the electronic component. As shown in Fig. 1, the sealing resin sheet 11 is formed into a flat plate shape and has a thickness of 0.1 mm to 3.5 mm. The sealing resin sheet 11 contains an insulating resin material 15 (for example, an epoxy resin) in a semi-hardened state, and contains, for example, cerium oxide or aluminum oxide as a filler in order to improve mechanical strength.

為了保護密封用樹脂片材11之表面而於密封用樹脂片材11之兩主面上安裝保護膜12A、12B。如圖1所示,形成於密封用樹脂片材11之上表面之保護膜12B為平坦,形成於下表面之保護膜12A形成為以沿密封用樹脂片材11之方式向下凸出之形狀。保護膜12A、12B之材料例如為PET(polyethylene terephthalate,聚對苯二甲酸乙二酯)、PTFE(polytetra fluornethylene,聚四氟乙烯)。對保護膜12A、12B之表面實施利用矽酮樹脂等進行之脫模處理,於在電子零件模組之製造過程中使用密封用樹脂片材11之情形時,將保護膜12A、12B剝離而使用。Protective films 12A and 12B are attached to both main surfaces of the sealing resin sheet 11 in order to protect the surface of the sealing resin sheet 11. As shown in FIG. 1, the protective film 12B formed on the upper surface of the sealing resin sheet 11 is flat, and the protective film 12A formed on the lower surface is formed in a shape protruding downward along the sealing resin sheet 11. . The material of the protective films 12A and 12B is, for example, PET (polyethylene terephthalate) or PTFE (polytetrafluoroethylene). The surface of the protective films 12A and 12B is subjected to a release treatment using an oxime resin or the like. When the sealing resin sheet 11 is used in the production process of the electronic component module, the protective films 12A and 12B are peeled off and used. .

(密封用樹脂片材之製造裝置)(Manufacturing device for sealing resin sheet)

如圖2所示,密封用樹脂片材之製造裝置30(以下,稱為製造裝置30)具備用以自樹脂體22成形密封用樹脂片材11之成形模具40。成形模具40包括1對按壓板43、45、側面之剛體板44、及配置於剛體板44之內側之彈性構件48。As shown in FIG. 2, the manufacturing apparatus 30 for sealing resin sheets (hereinafter, it is called the manufacturing apparatus 30) is equipped with the shaping|molding die 40 for shaping the sealing resin sheet 11 from the resin body 22. The molding die 40 includes a pair of pressing plates 43 and 45, a rigid plate 44 on the side surface, and an elastic member 48 disposed on the inner side of the rigid plate 44.

於成形模具40之內部配置樹脂體22。樹脂體22係用以成形密封用樹脂片材11之材料。樹脂體22包含半硬化狀態之絕緣性之樹脂材料15,且含有例如二氧化矽或氧化鋁作為填料。樹脂體22之形狀可使用圓柱、長方體、片狀等各種形狀。The resin body 22 is disposed inside the molding die 40. The resin body 22 is a material for forming the resin sheet 11 for sealing. The resin body 22 contains an insulating resin material 15 in a semi-hardened state, and contains, for example, ceria or alumina as a filler. The shape of the resin body 22 can be various shapes such as a cylinder, a rectangular parallelepiped, and a sheet shape.

1對按壓板43、45係用以按壓樹脂體22者。按壓板43、45形成為 平板形狀,且以夾持樹脂體22之方式分別配置於樹脂體22之上下。按壓板43、45之材質只要為即便按壓亦可維持形狀者即可,例如可使用不鏽鋼或鋁。The pair of pressing plates 43, 45 are used to press the resin body 22. The pressing plates 43, 45 are formed as The flat plate shape is disposed above and below the resin body 22 so as to sandwich the resin body 22. The material of the pressing plates 43 and 45 may be any shape as long as it is pressed, and for example, stainless steel or aluminum can be used.

剛體板44係用以設定所要成形之密封用樹脂片材11之厚度者。剛體板44為殼體,且沿按壓板43、45之外周配置於1對按壓板43、45之間。剛體板44之材質只要為即便被按壓亦可維持形狀者即可,例如可使用不鏽鋼或鋁。The rigid plate 44 is used to set the thickness of the sealing resin sheet 11 to be formed. The rigid body plate 44 is a casing and is disposed between the pair of pressing plates 43 and 45 along the outer circumference of the pressing plates 43 and 45. The material of the rigid plate 44 may be any shape as long as it is pressed, and for example, stainless steel or aluminum can be used.

彈性構件48係用以防止樹脂體22朝向成形模具40之外漏出者。彈性構件48為殼體,其厚度大於剛體板44之厚度,於剛體板44之內側以包圍樹脂體22之方式配置於1對按壓板43、45之間。彈性構件48能夠藉由來自按壓板43、45之按壓力而變形,材質例如使用矽酮樹脂。The elastic member 48 is for preventing the resin body 22 from leaking out of the forming mold 40. The elastic member 48 is a casing having a thickness larger than the thickness of the rigid body plate 44, and is disposed between the pair of pressing plates 43 and 45 so as to surround the resin body 22 on the inner side of the rigid body plate 44. The elastic member 48 can be deformed by the pressing force from the pressing plates 43, 45, and the material is, for example, an fluorenone resin.

以上述所示之位置關係構成成形模具40,藉此,規定由1對按壓板43、45及彈性構件48包圍樹脂體22之空間46。The molding die 40 is configured in the positional relationship described above, whereby the space 46 surrounding the resin body 22 by the pair of pressing plates 43, 45 and the elastic member 48 is defined.

再者,於第1實施形態中製作之密封用樹脂片材11中,必需於表面安裝保護膜12A、12B,因此,於空間46內,以包圍樹脂體22之方式插入1對保護膜12A、12B。具體而言,以自樹脂體22之底面通過彈性構件48及剛體板44之上表面之方式配置一個保護膜12A,且以與樹脂體22之上表面及一個保護膜12A對向之方式使另一個保護膜12B附著於按壓板45。其結果,規定藉由一個及另一個保護膜12A、12B以包裹樹脂體22之方式包圍之膜內區域47。在此狀態下,藉由製造裝置30對成形模具40之內部之空間46及膜內區域47進行減壓,且對樹脂體22進行加熱、按壓。In the sealing resin sheet 11 produced in the first embodiment, it is necessary to surface-attach the protective films 12A and 12B. Therefore, in the space 46, the pair of protective films 12A are inserted so as to surround the resin body 22. 12B. Specifically, a protective film 12A is disposed from the bottom surface of the resin body 22 through the upper surface of the elastic member 48 and the rigid body plate 44, and is opposed to the upper surface of the resin body 22 and a protective film 12A. One protective film 12B is attached to the pressing plate 45. As a result, the in-film region 47 surrounded by the resin film 22 by one and the other of the protective films 12A, 12B is defined. In this state, the space 46 and the inner region 47 of the inside of the molding die 40 are decompressed by the manufacturing apparatus 30, and the resin body 22 is heated and pressed.

製造裝置30包括用以對樹脂體22進行加熱之加熱機構33A、33B。加熱機構33A、33B內置於設置於按壓板45之上側之加壓板32、及設置於按壓板43之下側之受壓板31之各者。藉由該加熱機構33A、33B介隔按壓板43、45而對樹脂體22進行加熱。The manufacturing apparatus 30 includes heating mechanisms 33A, 33B for heating the resin body 22. The heating mechanisms 33A and 33B are built in each of the pressure plate 32 provided on the upper side of the pressing plate 45 and the pressure receiving plate 31 provided on the lower side of the pressing plate 43. The resin body 22 is heated by the heating means 33A, 33B interposing the pressing plates 43, 45.

又,製造裝置30具備用以對空間46及膜內區域47進行減壓之真空機構38。真空機構38以包圍加壓板32及受壓板31之方式設置。真空機構38之內部藉由未圖示之真空源而被抽真空,藉此,空間46及膜內區域47亦成為減壓狀態。Further, the manufacturing apparatus 30 includes a vacuum mechanism 38 for decompressing the space 46 and the in-film region 47. The vacuum mechanism 38 is provided to surround the pressure plate 32 and the pressure receiving plate 31. The inside of the vacuum mechanism 38 is evacuated by a vacuum source (not shown), whereby the space 46 and the in-film region 47 are also in a reduced pressure state.

又,製造裝置30具備用以按壓樹脂體22之加壓機構34。加壓機構34設置於頂板36之中央,頂板36固定於立在下方之基底35上之支柱37。加壓機構34之驅動軸39連接於加壓板32之上側,藉由使該驅動軸39下降而按壓加壓板32及按壓板45。藉此,樹脂體22沿1對保護膜12A、12B之面方向被延長至按壓板43、45之間。其結果,成形模具40所規定之空間46及膜內區域47由樹脂材料15填充,對於樹脂體22之成形結束。Further, the manufacturing apparatus 30 includes a pressurizing mechanism 34 for pressing the resin body 22. The pressurizing mechanism 34 is disposed at the center of the top plate 36, and the top plate 36 is fixed to the post 37 of the base 35 standing below. The drive shaft 39 of the pressurizing mechanism 34 is connected to the upper side of the pressure plate 32, and the pressurizing plate 32 and the pressing plate 45 are pressed by lowering the drive shaft 39. Thereby, the resin body 22 is extended between the pressing plates 43 and 45 along the surface direction of the pair of protective films 12A and 12B. As a result, the space 46 and the in-film region 47 defined by the molding die 40 are filled with the resin material 15, and the molding of the resin body 22 is completed.

圖3(A)及圖3(B)係表示成形模具40內之樹脂體22之情況之圖,將俯視圖表示於(A),將前視圖表示於(B)之部位。再者,圖3(A)係相對於圖3(B)之Z1-Z1剖面,圖3(B)係相對於圖3(A)之Y1-Y1剖面。於圖3(A)中,為了容易理解而將樹脂體22之形狀設為圓柱,又,省略保護膜12A而進行描繪。3(A) and 3(B) are views showing the state of the resin body 22 in the molding die 40, and the plan view is shown in (A) and the front view is shown in (B). Further, Fig. 3(A) is a Z1-Z1 cross section with respect to Fig. 3(B), and Fig. 3(B) is a Y1-Y1 cross section with respect to Fig. 3(A). In FIG. 3(A), the shape of the resin body 22 is a column for easy understanding, and the protective film 12A is omitted and drawn.

於第1實施形態中,彈性構件48之厚度大於剛體板44之厚度。因此,如圖3(B)所示,按壓板45較剛體板44先介隔保護膜12A、12B而抵接於彈性構件48。又,彈性構件48能夠藉由來自按壓板45之按壓力而變形,因此,仿照按壓板45之表面變形。因此,如圖3(A)及圖3(B)所示,於成形途中流動之樹脂材料15於彈性構件48與按壓板45之間被阻擋。其結果,抑制樹脂材料15向成形模具40之外漏出,而成形所需形狀之密封用樹脂片材11。In the first embodiment, the thickness of the elastic member 48 is larger than the thickness of the rigid plate 44. Therefore, as shown in FIG. 3(B), the pressing plate 45 abuts against the elastic member 48 by interposing the protective films 12A and 12B from the rigid body plate 44. Further, the elastic member 48 can be deformed by the pressing force from the pressing plate 45, and therefore, the surface of the pressing plate 45 is deformed. Therefore, as shown in FIGS. 3(A) and 3(B), the resin material 15 flowing during the molding is blocked between the elastic member 48 and the pressing plate 45. As a result, the resin material 15 is prevented from leaking out of the molding die 40, and the sealing resin sheet 11 having a desired shape is formed.

另一方面,圖4(A)及圖4(B)係表示不使用彈性構件48而成形有密封用樹脂片材11之情形時之比較例之圖,將俯視圖表示於(A),將前視圖表示於(B)之部位。再者,圖4(A)係相對於圖4(B)之Z2-Z2剖面, 圖4(B)係相對於圖4(A)之Y2-Y2剖面。於圖4(A)中,為了容易理解,亦將樹脂體22之形狀設為圓柱,又,省略保護膜12A而進行描繪。On the other hand, Fig. 4 (A) and Fig. 4 (B) show a comparative example in the case where the sealing resin sheet 11 is formed without using the elastic member 48, and the plan view is shown in (A), The view is shown in the part of (B). Furthermore, FIG. 4(A) is a Z2-Z2 cross section with respect to FIG. 4(B). Fig. 4(B) is a Y2-Y2 cross section with respect to Fig. 4(A). In FIG. 4(A), for the sake of easy understanding, the shape of the resin body 22 is also a column, and the protective film 12A is omitted and drawn.

於比較例中,不存在彈性構件48,因此難以防止樹脂材料15向成形模具140之外漏出。其原因在於:於在成形途中流動之樹脂材料15到達至剛體板144之4邊中央時,成形模具140未完全閉合。如圖4(A)及圖4(B)所示,於樹脂材料15到達至剛體板144之4邊中央時,在按壓板145與剛體板144之間存在間隙150,若在該狀態下被按壓則樹脂材料15進入至間隙150。其結果,於剛體板144與按壓板145之間介存漏出之樹脂材料151,而難以成形所需之厚度精度之密封用樹脂片材11。In the comparative example, since the elastic member 48 is not present, it is difficult to prevent the resin material 15 from leaking out of the molding die 140. The reason for this is that the molding die 140 is not completely closed when the resin material 15 flowing during the forming reaches the center of the four sides of the rigid plate 144. As shown in FIG. 4(A) and FIG. 4(B), when the resin material 15 reaches the center of the four sides of the rigid plate 144, there is a gap 150 between the pressing plate 145 and the rigid plate 144, and if it is in this state, When pressed, the resin material 15 enters the gap 150. As a result, the leaked resin material 151 is interposed between the rigid plate 144 and the pressing plate 145, and it is difficult to form the sealing resin sheet 11 having the required thickness precision.

再者,於上述中將樹脂體22設為圓柱進行了說明,但並不限定於該形狀。藉由配置樹脂體22之位置或按壓板43、45之初始之平行度,樹脂體22之延長狀態會產生偏差,因此即便樹脂體22之形狀不同亦存在相同之課題。In the above description, the resin body 22 is described as a column, but the shape is not limited thereto. By arranging the position of the resin body 22 or the initial parallelism of the pressing plates 43, 45, the elongation state of the resin body 22 varies, and therefore the same problem arises even if the shape of the resin body 22 is different.

於第1實施形態中,即便樹脂體22之形狀為長方體或片狀之小片,亦可於彈性構件48與按壓板45之間阻擋成形途中之樹脂材料15。藉此,可抑制樹脂材料15向成形模具40之外漏出,可成形所需形狀之密封用樹脂片材11。In the first embodiment, even if the shape of the resin body 22 is a rectangular parallelepiped or a sheet-like piece, the resin material 15 in the middle of molding can be blocked between the elastic member 48 and the pressing plate 45. Thereby, it is possible to suppress leakage of the resin material 15 to the outside of the molding die 40, and it is possible to form the sealing resin sheet 11 having a desired shape.

又,根據第1實施形態,只要準備製造裝置30即可,因此可不使用高價之設備而製造密封用樹脂片材11。又,若使用製造裝置30則亦可藉由剛體板44之設定而製造膜厚相對較大之密封用樹脂片材11。Further, according to the first embodiment, the manufacturing apparatus 30 can be prepared. Therefore, the sealing resin sheet 11 can be produced without using expensive equipment. Further, when the manufacturing apparatus 30 is used, the sealing resin sheet 11 having a relatively large film thickness can be produced by the setting of the rigid plate 44.

(密封用樹脂片材之製造方法)(Method of Manufacturing Resin Sheet for Sealing)

參照圖5(A)至圖5(E)、圖3(A)及圖3(B)對密封用樹脂片材11之製造方法進行說明。A method of manufacturing the resin sheet 11 for sealing will be described with reference to FIGS. 5(A) to 5(E), 3(A) and 3(B).

首先,如圖5(A)所示,準備具有底之圓筒狀之圓筒模20,將液狀樹脂21注入至圓筒模20中,藉由熱處理使之成為半硬化狀態而製作樹 脂體22。所謂半硬化狀態係指硬化反應之中間階段之狀態,亦稱為B階段。為了使液狀樹脂21成為半硬化狀態,於環氧樹脂之情形時,利用40℃~160℃之溫度藉由烘箱進行5分鐘~120分鐘之加熱處理。First, as shown in Fig. 5(A), a cylindrical mold 20 having a bottom is prepared, and the liquid resin 21 is injected into the cylindrical mold 20, and a semi-hardened state is formed by heat treatment to produce a tree. Fat body 22. The semi-hardened state refers to the state of the intermediate stage of the hardening reaction, which is also referred to as the B stage. In order to make the liquid resin 21 semi-hardened, in the case of an epoxy resin, heat treatment is performed in an oven for 5 minutes to 120 minutes at a temperature of 40 ° C to 160 ° C.

樹脂體22可使用於溫度60℃下顯示120Pa‧s~2000Pa‧s之黏度之範圍者。此時之黏度係使用TA Instruments公司製造之AR550在工具尺寸8mm、測定厚度550μm、頻率1Hz、應變0.1%之條件下測定之值。The resin body 22 can be used for a range of a viscosity of from 120 Pa s to 2,000 Pa s at a temperature of 60 ° C. The viscosity at this time is using the AR550 manufactured by TA Instruments in tool size. The value measured under conditions of 8 mm, a thickness of 550 μm, a frequency of 1 Hz, and a strain of 0.1%.

其次,如圖5(B)所示,準備用以成形密封用樹脂片材11之成形模具40。成形模具40包括上下1對之按壓板43、45及側面之剛體板44、及配置於剛體板44之內側之彈性構件48。藉由上述所示之構成,由1對按壓板43、45及彈性構件48形成包圍樹脂體22之空間46。再者,於第1實施形態中,於空間46內插入1對保護膜12A、12B,形成以包裹樹脂體22之方式包圍之膜內區域47。Next, as shown in FIG. 5(B), a molding die 40 for molding the sealing resin sheet 11 is prepared. The molding die 40 includes a pair of upper and lower pressing plates 43 and 45 and a rigid plate 44 on the side surface, and an elastic member 48 disposed on the inner side of the rigid plate 44. With the configuration described above, the space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43, 45 and the elastic member 48. Further, in the first embodiment, the pair of protective films 12A and 12B are inserted into the space 46, and the in-film region 47 surrounded by the resin body 22 is formed.

其次,如圖5(C)所示,使1對按壓板43、45向相互接近之方向移動,使按壓板45與彈性構件48介隔保護膜12A、12B抵接。藉此,樹脂體22流動,且延長至1對按壓板43、45之間。Next, as shown in FIG. 5(C), the pair of pressing plates 43, 45 are moved in the direction in which they approach each other, and the pressing plate 45 and the elastic member 48 are in contact with each other via the protective films 12A and 12B. Thereby, the resin body 22 flows and extends between the pair of pressing plates 43 and 45.

於樹脂體22被延長時,對樹脂體22進行加熱,其加熱溫度係低於樹脂體22之硬化溫度之溫度(例如40℃~160℃)。藉由抽真空對空間46及膜內區域47進行減壓,其壓力為5000Pa以下。When the resin body 22 is elongated, the resin body 22 is heated at a temperature lower than the curing temperature of the resin body 22 (for example, 40 ° C to 160 ° C). The space 46 and the intra-membrane region 47 are decompressed by evacuation, and the pressure is 5000 Pa or less.

如圖5(D)所示,若1對按壓板43、45之移動進而進行,則按壓至經延長之樹脂體22之樹脂材料15上,下側之保護膜12A以沿成形模具40之內壁之方式擴展。藉此,成形模具40規定之空間46及膜內區域47由樹脂材料15填充,對於樹脂體22之成形結束。As shown in FIG. 5(D), when the movement of the pair of pressing plates 43, 45 is further performed, the resin film 15 of the elongated resin body 22 is pressed, and the protective film 12A of the lower side is placed along the molding die 40. The way the wall expands. Thereby, the space 46 and the film inner region 47 defined by the molding die 40 are filled with the resin material 15, and the molding of the resin body 22 is completed.

圖3(A)及圖3(B)係表示成形途中之樹脂材料15之情況之圖,就圖5而言係表示圖5(C)與圖5(D)之間之狀態之圖。如圖3(A)及圖3(B)所示,成形途中之樹脂材料15到達至彈性構件48之內側之4邊中央。然 而,彈性構件48與按壓板45介隔保護膜12A、12B抵接,樹脂材料15於彈性構件48之4邊中央被阻擋。若進而藉由按壓而進行成形,則樹脂材料15朝向彈性構件48之內側之4角流動。藉此,樹脂材料15成形為長方形狀。3(A) and 3(B) are views showing the state of the resin material 15 in the middle of molding, and FIG. 5 is a view showing a state between FIG. 5(C) and FIG. 5(D). As shown in FIGS. 3(A) and 3(B), the resin material 15 in the middle of molding reaches the center of the four sides of the inner side of the elastic member 48. Of course On the other hand, the elastic member 48 abuts against the pressing plate 45 via the protective films 12A and 12B, and the resin material 15 is blocked at the center of the four sides of the elastic member 48. When the molding is further performed by pressing, the resin material 15 flows toward the four corners of the inner side of the elastic member 48. Thereby, the resin material 15 is formed into a rectangular shape.

於圖5(D)中表示之步驟之後,利用按壓板43、45產生之按壓力被解除且對由按壓板43、45及彈性構件48包圍之空間46進行大氣開放。藉此,製作如圖5(E)所示之兩面附著有保護膜12A、12B之密封用樹脂片材11。再者,成形時之加熱溫度低於樹脂材料15之硬化溫度,因此,密封用樹脂片材11保持半硬化狀態。After the step shown in FIG. 5(D), the pressing force generated by the pressing plates 43 and 45 is released, and the space 46 surrounded by the pressing plates 43, 45 and the elastic member 48 is opened to the atmosphere. Thereby, the sealing resin sheet 11 in which the protective films 12A and 12B are adhered to both surfaces as shown in FIG. 5(E) is produced. Further, since the heating temperature at the time of molding is lower than the curing temperature of the resin material 15, the sealing resin sheet 11 is maintained in a semi-hardened state.

根據第1實施形態,彈性構件48之厚度大於剛體板44之厚度,因此,成形途中之樹脂材料15於彈性構件48與按壓板45之間被阻擋。其結果,抑制樹脂材料15向成形模具40之外漏出,而成形所需形狀之密封用樹脂片材11。According to the first embodiment, since the thickness of the elastic member 48 is larger than the thickness of the rigid plate 44, the resin material 15 in the middle of molding is blocked between the elastic member 48 and the pressing plate 45. As a result, the resin material 15 is prevented from leaking out of the molding die 40, and the sealing resin sheet 11 having a desired shape is formed.

[第2實施形態][Second Embodiment]

第2實施形態係不使用第1實施形態中表示之保護膜12A、12B(參照圖5)而直接於按壓板43、45之間配置樹脂體22而製造密封用樹脂片材11之實施形態。再者,對於與第1實施形態共用之構成省略詳細之說明。In the second embodiment, the resin sheet 22 is placed between the pressing plates 43 and 45 without using the protective films 12A and 12B (see FIG. 5) shown in the first embodiment, and the sealing resin sheet 11 is produced. In addition, detailed description of the configuration common to the first embodiment will be omitted.

如圖6(A)所示,準備具有底之圓筒狀之圓筒模20,將液狀樹脂21注入至圓筒模20中,藉由熱處理使之成為半硬化狀態而製作樹脂體22。As shown in Fig. 6(A), a cylindrical mold 20 having a bottom is prepared, and the liquid resin 21 is injected into the cylindrical mold 20, and the resin body 22 is produced in a semi-hardened state by heat treatment.

如圖6(B)所示,準備用以成形密封用樹脂片材11之成形模具40。成形模具40包括上下1對之按壓板43、45及側面之剛體板44、及配置於剛體板44之內側之彈性構件48。彈性構件48之材質為矽酮樹脂。對按壓板43、45實施利用矽酮樹脂等進行之脫模處理。As shown in FIG. 6(B), a molding die 40 for molding the sealing resin sheet 11 is prepared. The molding die 40 includes a pair of upper and lower pressing plates 43 and 45 and a rigid plate 44 on the side surface, and an elastic member 48 disposed on the inner side of the rigid plate 44. The material of the elastic member 48 is an fluorenone resin. The pressing plates 43 and 45 are subjected to a release treatment using an fluorenone resin or the like.

藉由上述所示之構成,藉由1對按壓板43、45及彈性構件48形成 包圍樹脂體22之空間46。再者,樹脂體22被延長時之加熱溫度係低於樹脂體22之硬化溫度之溫度,空間46被抽真空。With the above-described configuration, the pair of pressing plates 43, 45 and the elastic member 48 are formed. A space 46 surrounding the resin body 22. Further, when the resin body 22 is extended, the heating temperature is lower than the curing temperature of the resin body 22, and the space 46 is evacuated.

如圖6(C)所示,使1對按壓板43、45向相互接近之方向移動,樹脂體22被延長至1對按壓板43、45之間。此時,流動之樹脂材料15於彈性構件48與按壓板45之間被阻擋。隨著樹脂體22之延長,如圖6(D)所示,成形模具40規定之空間46由樹脂材料15填充,對於樹脂體22之成形結束。As shown in FIG. 6(C), the pair of pressing plates 43, 45 are moved in the direction in which they approach each other, and the resin body 22 is extended between the pair of pressing plates 43, 45. At this time, the flowing resin material 15 is blocked between the elastic member 48 and the pressing plate 45. As the resin body 22 is extended, as shown in FIG. 6(D), the space 46 defined by the molding die 40 is filled with the resin material 15, and the formation of the resin body 22 is completed.

於圖6(D)所示之步驟之後,利用按壓板43、45產生之按壓力被解除,且對由按壓板43、45及剛體板44包圍之空間46進行大氣開放。藉此,製作如圖6(E)所示之密封用樹脂片材11。After the step shown in FIG. 6(D), the pressing force generated by the pressing plates 43, 45 is released, and the space 46 surrounded by the pressing plates 43, 45 and the rigid plate 44 is opened to the atmosphere. Thereby, the sealing resin sheet 11 shown in FIG. 6(E) was produced.

根據第2實施形態,可不使用保護膜12A、12B而製造密封用樹脂片材11。因此,可更廉價地製造密封用樹脂片材11。According to the second embodiment, the sealing resin sheet 11 can be produced without using the protective films 12A and 12B. Therefore, the resin sheet for sealing 11 can be manufactured more cheaply.

[第3實施形態][Third embodiment]

第3實施形態係對第1實施形態中表示之彈性構件設置有積存剩餘之樹脂材料15之功能之實施形態。再者,對與第1實施形態共用之構成省略詳細之說明。The third embodiment is an embodiment in which the elastic member shown in the first embodiment is provided with a function of accumulating the remaining resin material 15. In addition, the detailed description of the configuration common to the first embodiment will be omitted.

圖7(A)至圖7(C)係依序表示成形模具50內之樹脂體22之情況的俯視圖。再者,為了容易理解,將樹脂體22之形狀設為圓柱,又,省略保護膜12A進行描述。7(A) to 7(C) are plan views showing the state of the resin body 22 in the molding die 50 in order. In addition, for the sake of easy understanding, the shape of the resin body 22 is a column, and the protective film 12A is omitted for description.

如圖7(A)所示,成形模具50包括上下1對之按壓板43、45(按壓板45省略圖示)、配置於按壓板43之外周之剛體板44、及配置於剛體板44之內側之彈性構件51。As shown in FIG. 7(A), the molding die 50 includes a pair of upper and lower pressing plates 43 and 45 (not shown in the pressing plate 45), a rigid plate 44 disposed on the outer periphery of the pressing plate 43, and a rigid plate 44. The elastic member 51 on the inner side.

於第3實施形態中,4角柱之4個彈性構件51以包圍樹脂體22之方式分別空出間隙而配置。換言之,於成為殼體形狀之彈性構件51之4個角上,自樹脂體22側之面朝向剛體板44之方向形成有切口。該切口成為用以積存剩餘之樹脂材料15之樹脂積存部52。藉由樹脂積存部52 可擴大能夠投入至成形模具50內之樹脂量之容許寬度。In the third embodiment, the four elastic members 51 of the four-corner column are disposed so as to surround the resin body 22 with a gap therebetween. In other words, at four corners of the elastic member 51 which is a casing shape, a slit is formed in a direction from the surface of the resin body 22 toward the rigid plate 44. This slit serves as a resin reservoir 52 for accumulating the remaining resin material 15. By the resin reservoir 52 The allowable width of the amount of resin that can be put into the forming mold 50 can be expanded.

如圖7(B)所示,藉由按壓步驟而被延長之樹脂體22之樹脂材料15到達至彈性構件51之內側之4邊中央,且藉由彈性構件51被阻擋。被阻擋之樹脂材料15朝向彈性構件51之4個角流動。As shown in Fig. 7(B), the resin material 15 of the resin body 22 which is extended by the pressing step reaches the center of the four sides of the inner side of the elastic member 51, and is blocked by the elastic member 51. The blocked resin material 15 flows toward the four corners of the elastic member 51.

如圖7(C)所示,若進行成形模具50之按壓、填充步驟,則成形模具50規定之空間46及膜內區域47由樹脂材料15填充,剩餘之樹脂材料15進入至存在於彈性構件51之4個角之樹脂積存部52。藉此,成形4個角具有樹脂材料15之剩餘部分53之密封用樹脂片材11。再者,所製作之密封用樹脂片材11於藉由切割而除去剩餘部分53之後,用於電子零件模組之製造。As shown in Fig. 7(C), when the pressing and filling steps of the molding die 50 are performed, the space 46 and the film inner region 47 defined by the molding die 50 are filled with the resin material 15, and the remaining resin material 15 enters into the elastic member. A resin reservoir 52 of four corners of 51. Thereby, the sealing resin sheet 11 having the remaining portions 53 of the resin material 15 at four corners is formed. Further, the sealing resin sheet 11 produced is used for the manufacture of an electronic component module after removing the remaining portion 53 by cutting.

通常,於成形密封用樹脂片材11時,必需於成形模具50內充分填充樹脂材料15,將所投入之樹脂體22之體積設定為大於成形模具50內之容積。因此,於成形時產生剩餘之樹脂材料15。假如不存在剩餘之樹脂材料15之去處,則樹脂材料15亦可能向成形模具50之外漏出。In general, when forming the resin sheet 11 for sealing, it is necessary to sufficiently fill the resin material 15 in the molding die 50, and to set the volume of the resin body 22 to be larger than the volume in the molding die 50. Therefore, the remaining resin material 15 is generated at the time of molding. If the remaining resin material 15 does not exist, the resin material 15 may also leak out of the forming mold 50.

於第3實施形態中,將剩餘之樹脂材料15積存於樹脂積存部52中,因此可額外收納相當於樹脂積存部52之體積之樹脂材料15。因此,即便於樹脂體22之體積大於成形模具50內之容積之情形時,亦可無問題地成形密封用樹脂片材11。In the third embodiment, since the remaining resin material 15 is stored in the resin reservoir portion 52, the resin material 15 corresponding to the volume of the resin reservoir portion 52 can be additionally accommodated. Therefore, even when the volume of the resin body 22 is larger than the volume in the molding die 50, the resin sheet for sealing 11 can be formed without any problem.

再者,對於第3實施形態,可任意地變更彈性構件51之切口之位置、切口之數量、及樹脂體22之形狀等。圖8至圖11係分別表示其等之代表性之變化例之圖。Further, in the third embodiment, the position of the slit of the elastic member 51, the number of slits, the shape of the resin body 22, and the like can be arbitrarily changed. 8 to 11 are views each showing a representative variation of the equations.

圖8係表示關於成形模具50之第1變化例之圖。如圖8所示,成形模具50A之彈性構件51A係整體構成為一體之殼體。於彈性構件51A之內側的4個角上,具有將彈性構件51A之一部分切口之切口52A。該切口52A成為用以積存樹脂材料15之樹脂積存部52。FIG. 8 is a view showing a first modification of the molding die 50. As shown in Fig. 8, the elastic member 51A of the molding die 50A is integrally formed as an integral casing. At four corners of the inner side of the elastic member 51A, there is a slit 52A which cuts a part of the elastic member 51A. This slit 52A serves as a resin reservoir 52 for storing the resin material 15.

圖9係表示關於樹脂體22之第2變化例之圖。如圖9所示,樹脂體 22B之形狀為長方體。於此情形時,形成於彈性構件51之各者之間的間隙亦成為樹脂積存部52。Fig. 9 is a view showing a second modification of the resin body 22. As shown in Figure 9, the resin body The shape of 22B is a rectangular parallelepiped. In this case, the gap formed between each of the elastic members 51 also becomes the resin reservoir 52.

圖10係表示關於成形模具50及樹脂體22之第3變化例之圖。如圖10所示,於成形模具50C之彈性構件51C之4邊中央設置有切口52C。該切口52C成為用以積存樹脂材料15之樹脂積存部52。樹脂體22C之形狀為星形,於被按壓之情形時,首先於彈性構件51C之4個角中填充樹脂材料15,之後,朝向4邊中央之切口52C填充樹脂材料15。FIG. 10 is a view showing a third modification of the molding die 50 and the resin body 22. As shown in Fig. 10, a slit 52C is provided at the center of the four sides of the elastic member 51C of the molding die 50C. This slit 52C serves as a resin reservoir 52 for storing the resin material 15. The shape of the resin body 22C is a star shape, and in the case of being pressed, the resin material 15 is first filled in the four corners of the elastic member 51C, and then the resin material 15 is filled into the slit 52C at the center of the four sides.

圖11係表示關於成形模具50之第4變化例之圖。如圖11所示,成形模具50D之彈性構件51D及剛體板44D為環狀。彈性構件51D係每角度90°具有切口52D。該切口52D成為用以積存樹脂材料15之樹脂積存部52。Fig. 11 is a view showing a fourth modification of the molding die 50. As shown in Fig. 11, the elastic member 51D and the rigid plate 44D of the molding die 50D are annular. The elastic member 51D has a slit 52D at an angle of 90°. This slit 52D serves as a resin reservoir 52 for storing the resin material 15.

[第4實施形態][Fourth embodiment]

第4實施形態係對第1實施形態中表示之彈性構件及剛體板之兩者設置有積存剩餘之樹脂材料15之功能之實施形態。再者,對與第1實施形態共用之構成省略詳細之說明。In the fourth embodiment, an embodiment in which the remaining resin material 15 is accumulated is provided for both the elastic member and the rigid plate shown in the first embodiment. In addition, the detailed description of the configuration common to the first embodiment will be omitted.

圖12至圖14係依序表示成形模具60內之樹脂體22之情況之圖,分別將俯視圖表示於(A),將前視圖表示於(B)之部位。再者,圖12(A)係相對於圖12(B)之Z3-Z3剖面,圖12(B)係相對於圖12(A)之Y3-Y3剖面。於圖12(A)中,為了容易理解,將樹脂體22之形狀設為圓柱,又,省略保護膜12A進行描繪。以下,圖13、圖14亦相同。12 to 14 are views showing a state in which the resin body 22 in the molding die 60 is sequentially shown, and a plan view is shown in (A) and a front view is shown in (B). Further, Fig. 12(A) is a cross section of Z3-Z3 with respect to Fig. 12(B), and Fig. 12(B) is a cross section of Y3-Y3 with respect to Fig. 12(A). In FIG. 12(A), for the sake of easy understanding, the shape of the resin body 22 is a column, and the protective film 12A is omitted for drawing. Hereinafter, FIG. 13 and FIG. 14 are also the same.

如圖12(A)及圖12(B)所示,成形模具60包括上下1對之按壓板43、45、配置於按壓板43之外周之剛體板62、及配置於剛體板62之內側之彈性構件51。藉由上述所示之構成,藉由1對按壓板43、45及彈性構件51而形成包圍樹脂體22之空間46。再者,於第4實施形態中,亦於空間46內插入1對保護膜12A、12B,形成以包裹樹脂體22之方式包圍之膜內區域47。As shown in FIGS. 12(A) and 12(B), the molding die 60 includes a pair of upper and lower pressing plates 43 and 45, a rigid body plate 62 disposed on the outer periphery of the pressing plate 43, and an inner side of the rigid plate 62. The elastic member 51. According to the configuration described above, the space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43, 45 and the elastic member 51. Further, in the fourth embodiment, a pair of protective films 12A and 12B are also inserted into the space 46, and an in-film region 47 surrounded by the resin body 22 is formed.

於第4實施形態中,4角柱之4個彈性構件51以包圍樹脂體22之方式分別空出間隙而配置。換言之,於成為殼體形狀之彈性構件51之4個角,形成有自樹脂體22側之面朝向剛體板62之面貫通之切口。該切口成為用以積存剩餘之樹脂材料15之第1樹脂積存部63。In the fourth embodiment, the four elastic members 51 of the four-cornered column are disposed so as to surround the resin body 22 with a gap therebetween. In other words, at four corners of the elastic member 51 which is a casing shape, a slit penetrating from the surface of the resin body 22 toward the surface of the rigid plate 62 is formed. This slit serves as a first resin reservoir 63 for storing the remaining resin material 15.

進而,於第4實施形態中,沿剛體板62之內側形成有切口。該切口與第1樹脂積存部63連通,成為用以積存樹脂材料15之第2樹脂積存部64。藉由第1及第2樹脂積存部63、64可進而擴大能夠投入至成形模具60內之樹脂量之容許寬度。Further, in the fourth embodiment, a slit is formed along the inner side of the rigid plate 62. This slit communicates with the first resin reservoir 63 and serves as a second resin reservoir 64 for storing the resin material 15. The first and second resin reservoirs 63 and 64 can further increase the allowable width of the amount of resin that can be supplied into the molding die 60.

如圖13(A)及圖13(B)所示,藉由按壓步驟而被延長之樹脂體22之樹脂材料15到達至彈性構件51之內側之4邊中央,且藉由彈性構件51而被阻擋。被阻擋之樹脂材料15朝向彈性構件51之4個角流動。As shown in FIG. 13(A) and FIG. 13(B), the resin material 15 of the resin body 22 which is extended by the pressing step reaches the center of the four sides of the inner side of the elastic member 51, and is elastically deformed by the elastic member 51. Block. The blocked resin material 15 flows toward the four corners of the elastic member 51.

如圖14(A)及圖14(B)所示,若進行成形模具60之按壓、填充步驟,則樹脂材料15進入至彈性構件51之第1樹脂積存部63,進而通過第1樹脂積存部63而進入至第2樹脂積存部64之一部分。藉此,成形如圖14(A)所示之4個角具有樹脂材料15之剩餘部分65之密封用樹脂片材11。再者,所製作之密封用樹脂片材11於藉由切割而除去剩餘部分65之後,用於電子零件模組之製造。As shown in FIG. 14(A) and FIG. 14(B), when the pressing and filling steps of the molding die 60 are performed, the resin material 15 enters the first resin reservoir 63 of the elastic member 51, and further passes through the first resin reservoir. 63 enters a part of the second resin reservoir 64. Thereby, the sealing resin sheet 11 having the remaining portion 65 of the resin material 15 at four corners as shown in FIG. 14(A) is formed. Further, the sealing resin sheet 11 produced is used for the manufacture of an electronic component module after removing the remaining portion 65 by cutting.

於第4實施形態中,將剩餘之樹脂材料15積存於第1及第2樹脂積存部63、64中,因此,可進而額外收納相當於第1及第2樹脂積存部63、64之體積之樹脂材料15。因此,即便於樹脂體22之體積大於成形模具60內之容積之情形時,亦可無問題地成形密封用樹脂片材11。In the fourth embodiment, the remaining resin material 15 is stored in the first and second resin reservoirs 63 and 64. Therefore, the volume corresponding to the first and second resin reservoirs 63 and 64 can be additionally accommodated. Resin material 15. Therefore, even when the volume of the resin body 22 is larger than the volume in the molding die 60, the sealing resin sheet 11 can be formed without any problem.

[第5實施形態][Fifth Embodiment]

第5實施形態係如下實施形態:藉由使第1實施形態中表示之彈性構件彎曲,可收納剩餘之樹脂材料15。再者,對與第1實施形態共用之構成省略詳細之說明。The fifth embodiment is an embodiment in which the remaining resin material 15 can be accommodated by bending the elastic member shown in the first embodiment. In addition, the detailed description of the configuration common to the first embodiment will be omitted.

圖15及圖16係表示成形模具70內之樹脂體22之情況之圖,分別 將俯視圖表示於(A),將前視圖表示於(B)之部位。再者,圖15(A)係相對於圖15(B)之Z6-Z6剖面,圖15(B)係相對於圖15(A)之Y6-Y6剖面。於圖15(A)中,為了容易理解,將樹脂體22之形狀設為圓柱,又,省略保護膜12A進行描繪。以下,圖16亦相同。15 and FIG. 16 are views showing the state of the resin body 22 in the molding die 70, respectively. The top view is shown in (A), and the front view is shown in the part of (B). Further, Fig. 15(A) is a cross section of Z6-Z6 with respect to Fig. 15(B), and Fig. 15(B) is a cross section of Y6-Y6 with respect to Fig. 15(A). In FIG. 15(A), for the sake of easy understanding, the shape of the resin body 22 is a column, and the protective film 12A is omitted for drawing. Hereinafter, FIG. 16 is also the same.

如圖15(A)及圖15(B)所示,成形模具70包括上下1對之按壓板43、45、配置於按壓板43之外周之剛體板71、及配置於剛體板71之內側之彈性構件48。藉由上述所示之構成,由1對按壓板43、45及彈性構件48形成包圍樹脂體22之空間46。再者,於第5實施形態中,亦於空間46內插入1對保護膜12A、12B,形成以包裹樹脂體22之方式包圍之膜內區域47。As shown in FIGS. 15(A) and 15(B), the molding die 70 includes a pair of upper and lower pressing plates 43 and 45, a rigid plate 71 disposed on the outer periphery of the pressing plate 43, and an inner side of the rigid plate 71. Elastic member 48. With the configuration described above, the space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43, 45 and the elastic member 48. Further, in the fifth embodiment, a pair of protective films 12A and 12B are also inserted into the space 46, and an in-film region 47 surrounded by the resin body 22 is formed.

成為密封用樹脂片材11之材料的樹脂體22之體積通常情況下有某種程度之偏差。若因該偏差而使樹脂體22之體積大於成形模具70內之容積,則於成形時產生剩餘之樹脂材料15。The volume of the resin body 22 which becomes a material of the sealing resin sheet 11 usually has a certain degree of variation. When the volume of the resin body 22 is larger than the volume in the molding die 70 due to the deviation, the remaining resin material 15 is generated at the time of molding.

於第5實施形態中,於剛體板71上形成有沿剛體板71之內周被切口之壓溝槽72。藉由存在該壓溝槽72,可容許投入至成形模具70內之樹脂體22之體積的偏差。In the fifth embodiment, the rigid plate 71 is formed with a press groove 72 which is notched along the inner circumference of the rigid plate 71. By the presence of the pressure groove 72, the variation in the volume of the resin body 22 put into the molding die 70 can be tolerated.

如圖16(A)及圖16(B)所示,於密封樹脂片材11之成形後,剩餘之樹脂材料15將彈性構件48向側面擠壓。因此,被擠壓之彈性構件48向剛體板71之壓溝槽72側彎曲,於彈性構件48之4邊上產生向外之凸出73。藉此,可額外收納相當於凸出之部分之體積的樹脂材料15,即便於樹脂體22之體積略微大於成形模具70內之容積之情形時,亦可無問題地成形密封用樹脂片材11。As shown in FIGS. 16(A) and 16(B), after the formation of the sealing resin sheet 11, the remaining resin material 15 presses the elastic member 48 to the side. Therefore, the extruded elastic member 48 is bent toward the pressing groove 72 side of the rigid plate 71, and an outward projection 73 is formed on the four sides of the elastic member 48. By this, the resin material 15 corresponding to the volume of the convex portion can be additionally accommodated, and even when the volume of the resin body 22 is slightly larger than the volume in the molding die 70, the sealing resin sheet 11 can be formed without any problem. .

又,所製作之密封用樹脂片材11之4邊雖向外凸出,但大致為四角形狀,因此,可直接在該狀態下用於電子零件模組之製造。Moreover, although the four sides of the sealing resin sheet 11 produced are outwardly convex, they have a substantially square shape, and therefore can be used for the manufacture of the electronic component module directly in this state.

[第6實施形態][Sixth embodiment]

第6實施形態係於第1實施形態中表示之按壓板中設置有凹部之 實施形態。再者,對與第1實施形態共用之構成省略詳細之說明。In the sixth embodiment, the pressing plate shown in the first embodiment is provided with a concave portion. Implementation form. In addition, the detailed description of the configuration common to the first embodiment will be omitted.

如圖17所示,成形模具80包括上下1對之按壓板81、45及側面之剛體板44、及配置於剛體板44之內側之彈性構件83。As shown in FIG. 17, the molding die 80 includes a pair of upper and lower pressing plates 81 and 45, a rigid plate 44 on the side surface, and an elastic member 83 disposed on the inner side of the rigid plate 44.

第6實施形態係於下側之按壓板81中形成槽狀之凹部82,彈性構件83係以嵌入至凹部82中之狀態配置。假如保持著在平坦之按壓板81上放置有彈性構件83之狀態,則於自按壓板81、45受到按壓力時,彈性構件83可能變形而自初始配置之位置偏移。於第6實施形態中,彈性構件83係以嵌入至按壓板81之凹部82中之狀態配置,藉此可防止如上述之位置偏移。In the sixth embodiment, the groove-shaped recessed portion 82 is formed in the lower pressing plate 81, and the elastic member 83 is placed in the recessed portion 82. If the elastic member 83 is placed on the flat pressing plate 81, the elastic member 83 may be deformed and displaced from the initial position when the pressing members 81 and 45 are pressed. In the sixth embodiment, the elastic member 83 is placed in a state of being fitted into the concave portion 82 of the pressing plate 81, whereby the positional deviation as described above can be prevented.

圖18係使彈性構件之剖面為橢圓形狀之變化例。按壓板81A之凹部82A為楔槽,此處,橢圓形狀之彈性構件83A之下半部分以上以嵌入之狀態配置。藉此,不僅可防止彈性構件83A之位置偏移,亦可防止彈性構件83A自凹部82A脫落。Fig. 18 is a modification example in which the cross section of the elastic member is an elliptical shape. The concave portion 82A of the pressing plate 81A is a wedge groove. Here, the lower half of the elliptical elastic member 83A is disposed in an embedded state. Thereby, not only the positional displacement of the elastic member 83A but also the elastic member 83A can be prevented from falling off from the concave portion 82A.

再者,彈性構件83A之剖面亦可為圓形狀以代替橢圓形狀。若將彈性構件83A之剖面設為圓形狀,則可使用市售之橡膠製造之墊圈。Further, the cross section of the elastic member 83A may be a circular shape instead of the elliptical shape. When the cross section of the elastic member 83A is a circular shape, a gasket made of a commercially available rubber can be used.

12A‧‧‧保護膜12A‧‧‧Protective film

12B‧‧‧保護膜12B‧‧‧Protective film

15‧‧‧樹脂材料15‧‧‧Resin materials

22‧‧‧樹脂體22‧‧‧ resin body

30‧‧‧製造裝置30‧‧‧Manufacture of equipment

31‧‧‧受壓板31‧‧‧ under pressure plate

32‧‧‧加壓板32‧‧‧ Pressurized plate

33A‧‧‧加熱機構33A‧‧‧heating mechanism

33B‧‧‧加熱機構33B‧‧‧heating mechanism

34‧‧‧加壓機構34‧‧‧ Pressurizing mechanism

35‧‧‧底板35‧‧‧floor

36‧‧‧頂板36‧‧‧ top board

37‧‧‧支柱37‧‧‧ pillar

38‧‧‧真空機構38‧‧‧vacuum mechanism

39‧‧‧驅動軸39‧‧‧Drive shaft

40‧‧‧成形模具40‧‧‧Forming mould

43‧‧‧按壓板43‧‧‧ Press plate

44‧‧‧剛體板44‧‧‧ rigid body board

45‧‧‧按壓板45‧‧‧ Press plate

46‧‧‧空間46‧‧‧ Space

47‧‧‧膜內區域47‧‧‧Intramembrane area

48‧‧‧彈性構件48‧‧‧Flexible components

Claims (12)

一種密封用樹脂片材之製造裝置,其特徵在於:其係用以將搭載於基板上之複數個電子零件絕緣密封之密封用樹脂片材之製造裝置,且包括:成形模具,其規定用以自包含絕緣性之樹脂材料之半硬化狀態之樹脂體成形密封用樹脂片材之空間;加熱機構,其用於以低於上述樹脂體之硬化溫度之溫度對上述樹脂體進行加熱;真空機構,其用以將上述成形模具內進行抽真空;及加壓機構,其用以按壓上述樹脂體而將上述樹脂材料填充於上述成形模具內;且上述成形模具包括:1對按壓板,其用以藉由來自上述按壓機構之按壓力按壓上述樹脂體而成形密封用樹脂片材;剛體板,其配置於上述1對按壓板之間,且用以設定成形後之密封用樹脂片材之厚度;及彈性構件,其於上述剛體板之內側以包圍上述樹脂體之方式配置於上述1對按壓板之間,厚度大於上述剛體板之厚度,且能夠藉由來自上述按壓板之按壓力而變形。 A manufacturing apparatus for a resin sheet for sealing, which is a manufacturing apparatus for sealing a resin sheet for insulating and sealing a plurality of electronic components mounted on a substrate, and includes a molding die, which is used for a space for forming a resin sheet for sealing a resin body in a semi-hardened state containing an insulating resin material; and a heating mechanism for heating the resin body at a temperature lower than a curing temperature of the resin body; a vacuum mechanism, And the pressurizing mechanism for pressing the resin body to fill the resin material in the forming mold; and the forming mold comprises: a pair of pressing plates for The resin sheet for sealing is pressed by a pressing force from the pressing mechanism, and a rigid plate is disposed between the pair of pressing plates to set a thickness of the sealing resin sheet after molding; And an elastic member disposed between the pair of pressing plates on the inner side of the rigid body plate so as to surround the resin body, and having a thickness larger than the rigid body The thickness, and is capable of being deformed by the pressing force from the pressing plate. 如請求項1之密封用樹脂片材之製造裝置,其中上述彈性構件具有自上述樹脂體側之面朝向上述剛體板之方向被切口之樹脂積存部。 The apparatus for producing a resin sheet for sealing according to claim 1, wherein the elastic member has a resin reservoir that is notched from the surface of the resin body toward the rigid plate. 如請求項1之密封用樹脂片材之製造裝置,其中上述彈性構件具有自上述樹脂體側之面貫通至上述剛體板之面之第1樹脂積存部, 上述剛體板具有與上述第1樹脂積存部連通,且於上述剛體板之內側被切口之第2樹脂積存部。 The apparatus for producing a resin sheet for sealing according to claim 1, wherein the elastic member has a first resin reservoir that penetrates from a surface of the resin body to a surface of the rigid plate. The rigid body plate has a second resin reservoir that communicates with the first resin reservoir and is notched inside the rigid plate. 如請求項1之密封用樹脂片材之製造裝置,其中上述剛體板具有沿內周被切口之壓溝槽。 The apparatus for producing a resin sheet for sealing according to claim 1, wherein the rigid plate has a groove which is slit along the inner circumference. 如請求項1至4中任一項之密封用樹脂片材之製造裝置,其中上述按壓板於按壓上述樹脂體之面上具有凹部,且上述彈性構件係以嵌入至上述凹部之狀態配置。 The apparatus for producing a resin sheet for sealing according to any one of claims 1 to 4, wherein the pressing plate has a concave portion on a surface on which the resin body is pressed, and the elastic member is disposed in a state of being fitted into the concave portion. 一種密封用樹脂片材之製造方法,其特徵在於:其係用以將搭載於基板上之複數個電子零件絕緣密封之密封用樹脂片材之製造方法,且包括:準備步驟,其準備:半硬化狀態之樹脂體,其包含絕緣性之樹脂材料;1對按壓板,其用以按壓上述樹脂體而成形密封用樹脂片材;剛體板,其用以設定成形後之密封用樹脂片材之厚度;及彈性構件,其厚度大於上述剛體板之厚度,且能夠藉由來自上述按壓板之按壓力而變形;空間形成步驟,其將上述樹脂體配置於上述1對按壓板之間,將上述剛體板配置於上述1對按壓板之間,於上述剛體板之內側以包圍上述樹脂體之方式將上述彈性構件配置於上述1對按壓板之間,且藉由該上述1對按壓板及上述彈性構件而形成包圍上述樹脂體之空間;減壓步驟,其將上述空間內進行抽真空;加熱步驟,其以低於上述樹脂體之硬化溫度之溫度對上述樹脂體進行加熱;按壓步驟,其藉由上述按壓板按壓上述彈性構件及上述剛體板,且藉由上述按壓板按壓上述樹脂體;及填充步驟,其按壓並延長上述樹脂體,藉此將上述樹脂材料 填充於上述空間內。 A method for producing a resin sheet for sealing, which is a method for producing a resin sheet for sealing which insulates and seals a plurality of electronic components mounted on a substrate, and includes a preparation step: preparation: half a resin body in a hardened state, comprising an insulating resin material; a pair of pressing plates for pressing the resin body to form a sealing resin sheet; and a rigid body plate for setting a sealing resin sheet after molding a thickness; and an elastic member having a thickness larger than a thickness of the rigid body plate and deformable by a pressing force from the pressing plate; and a space forming step of disposing the resin body between the pair of pressing plates, The rigid body plate is disposed between the pair of pressing plates, and the elastic member is disposed between the pair of pressing plates so as to surround the resin body inside the rigid plate, and the pair of pressing plates and the The elastic member forms a space surrounding the resin body; a depressurization step of evacuating the space; and a heating step which is lower than the hardness of the resin body The temperature of the temperature is applied to the resin body; and the pressing step is performed by pressing the elastic member and the rigid plate by the pressing plate, and pressing the resin body by the pressing plate; and filling step of pressing and extending the resin body Thereby using the above resin material Filled in the above space. 如請求項6之密封用樹脂片材之製造方法,其中於上述按壓步驟中,藉由上述按壓板之按壓而使上述彈性構件變形,於上述填充步驟中,於上述彈性構件與上述按壓板之間阻擋上述樹脂材料。 The method for producing a resin sheet for sealing according to claim 6, wherein in the pressing step, the elastic member is deformed by pressing of the pressing plate, and in the filling step, the elastic member and the pressing plate are The above resin material is blocked. 如請求項6或7之密封用樹脂片材之製造方法,其中於上述準備步驟中,準備用以保護成形後之密封用樹脂片材之主面之1對保護膜;於上述空間形成步驟中,以自上述樹脂體之底面通過上述彈性構件及上述剛體板之上表面之方式配置一個保護膜,且以與上述樹脂體之上表面及上述一個保護膜對向之方式配置另一個保護膜,藉此,由上述一個及上述另一個保護膜形成包圍上述樹脂體之膜內區域;於上述減壓步驟中,將上述膜內區域進行抽真空;於上述填充步驟中,於上述保護膜之面方向上延長上述樹脂體,將上述樹脂材料填充於上述膜內區域中。 The method for producing a resin sheet for sealing according to claim 6 or 7, wherein in the preparing step, a pair of protective films for protecting a main surface of the resin sheet for sealing after molding are prepared; and in the space forming step And arranging a protective film from the bottom surface of the resin body through the elastic member and the upper surface of the rigid plate, and arranging another protective film so as to face the upper surface of the resin body and the one protective film. Thereby, the inner region surrounding the resin body is formed by the one and the other protective film; in the depressurizing step, the inner region of the film is evacuated; and in the filling step, the surface of the protective film is The resin body is elongated in the direction, and the resin material is filled in the inner region of the film. 如請求項6或7之密封用樹脂片材之製造方法,其中上述彈性構件具有自上述樹脂體側之面朝向上述剛體板之方向被切口之樹脂積存部,且於上述填充步驟中,使上述樹脂材料進入至上述樹脂積存部中。 The method for producing a resin sheet for sealing according to claim 6 or 7, wherein the elastic member has a resin reservoir that is notched from the surface of the resin body toward the rigid plate, and in the filling step, The resin material enters into the above resin reservoir. 如請求項6或7之密封用樹脂片材之製造方法,其中上述彈性構件具有自上述樹脂體側之面貫通至上述剛體板側之面之第1樹脂積存部,且上述剛體板具有與上述第1樹脂積存部連通,且於上述剛體板之內側被切口之第2樹脂積存部,且 於上述填充步驟中,使上述樹脂材料通過上述第1樹脂積存部而進入至上述第2樹脂積存部。 The method for producing a resin sheet for sealing according to claim 6 or 7, wherein the elastic member has a first resin reservoir that penetrates from the surface of the resin body to the surface of the rigid plate side, and the rigid plate has the above-described The first resin reservoir is connected to the second resin reservoir that is notched inside the rigid plate, and In the filling step, the resin material is passed through the first resin reservoir to the second resin reservoir. 如請求項6或7之密封用樹脂片材之製造方法,其中上述剛體板具有沿內周被切口之壓溝槽,且於上述填充步驟中,藉由來自上述樹脂材料之壓力,使上述彈性構件向上述壓溝槽側彎曲。 The method for producing a resin sheet for sealing according to claim 6 or 7, wherein the rigid plate has a groove which is slit along the inner circumference, and in the filling step, the elasticity is made by pressure from the resin material The member is bent toward the side of the pressure groove. 如請求項6或7之密封用樹脂片材之製造方法,其中上述按壓板於按壓上述樹脂體之面上具有凹部,且上述彈性構件係以嵌入至上述凹部之狀態配置。The method for producing a sealing resin sheet according to claim 6 or 7, wherein the pressing plate has a concave portion on a surface on which the resin body is pressed, and the elastic member is disposed in a state of being fitted into the concave portion.
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