JP2015046573A - Attachment jig and method for manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an attachment jig excellent in transportability and capable of precisely attaching a resin sheet on an electronic component, and a method for easily manufacturing an electronic device using the attachment jig.SOLUTION: A sealing jig 1 includes: a base plate 7 configured such that a sealing sheet 3 is placed thereon; a spacer 5 configured to be placed on the base plate 7 so as to expose the sealing sheet 3 upwards and having a thickness thinner than that of the sealing sheet 3; a spring 8 configured to leave a separating interval above the sealing sheet 3 and to support an optical semiconductor component 2; and an upper plate 6 configured to face the base plate 7 in the vertical direction and to be placed above the optical semiconductor component 2.

Description

  The present invention relates to a bonding jig and a method for manufacturing an electronic device, more specifically, a bonding jig for bonding a resin sheet to an electronic component, and an electronic device in which a resin sheet is bonded to an electronic component using the bonding jig. The present invention relates to a device manufacturing method.

  Conventionally, it is known to manufacture an electronic device such as an optical semiconductor device by attaching a resin sheet such as a sealing sheet to an electronic component such as an optical semiconductor element.

  For example, the sealing sheet is disposed opposite to the substrate on which the light emitting diode is mounted, and then pressed by a flat plate press so that the sealing sheet is attached to the substrate so as to seal the light emitting diode. A method has been proposed (see, for example, Patent Document 1 below).

JP2013-21284A

  However, in the press method such as the method proposed in Patent Document 1, it is important to accurately adjust the distance between the sealing sheet and the substrate. That is, when the distance between the sealing sheet and the substrate is long at the time of pressing, there arises a problem that the light emitting diode cannot be reliably sealed with the sealing sheet. On the other hand, when the distance between the sealing sheet and the substrate is short, there is a problem that the light emitting diode mounted on the substrate penetrates the sealing sheet.

  In the press method, after the sealing sheet and the substrate are set on a jig, the jig is transported to a press machine. If the sealing sheet and the light-emitting diode mounted on the substrate are in contact with each other during transportation, the light-emitting diode components (for example, bonding wires) may be overloaded and damaged due to shaking during transportation. is there.

  An object of the present invention is to provide a bonding jig that is excellent in transportability and can accurately bond a resin sheet to an electronic component, and a manufacturing method that can easily manufacture an electronic device using the same. There is.

  The adhering jig of the present invention is an adhering jig for adhering a resin sheet to an electronic component, and a lower plate configured so that the resin sheet is placed thereon, and the resin sheet upward. The electronic component is configured to be placed on the lower plate so as to be exposed, and has an intermediate plate having a thickness smaller than the thickness of the resin sheet, and is spaced upward from the resin sheet. And an upper plate configured to be placed on the electronic component so as to face the lower plate in the vertical direction.

  According to this sticking jig, the intermediate plate having a thickness smaller than the thickness of the resin sheet is provided. Therefore, the distance between the resin sheet and the electronic component can be regulated by regulating the movement of the upper plate by the intermediate plate during pressing. As a result, the resin sheet can be accurately attached to the electronic component.

  Moreover, according to this sticking jig, since the elastic member configured to support the electronic component is provided so as to be spaced upward with respect to the resin sheet, the resin sheet and the electronic component are used as the jig. When set, the resin sheet and the electronic component are arranged at intervals in the vertical direction by the elastic member. Therefore, even if the jig | tool which set the resin sheet and the electronic component is conveyed, it can prevent that an electronic component contacts a resin sheet and can prevent damage to an electronic component. As a result, it is excellent in transportability.

  In addition, since the support member configured so that the elastic member supports the electronic component is an elastic member, when a pressing force from the upper plate is applied to the elastic member during pressing, the elastic member is compressed. Therefore, it can be simply pressed after removal without removing the support member.

  Further, the sticking jig of the present invention is provided on the lower plate, and is provided on the lower plate with a first positioning member that positions the resin sheet with respect to the lower plate, and with respect to the lower plate, It is preferable to include a second positioning member that positions the intermediate plate and a third positioning member that is provided on the lower plate and positions the electronic component with respect to the lower plate.

  According to this sticking jig, each of the resin sheet, the intermediate plate, and the electronic component can be set at an accurate position on the lower plate. Therefore, the resin sheet can be accurately attached to the electronic component.

  In the sticking jig of the present invention, the surface of the lower plate is partitioned with a resin sheet region on which the resin sheet is placed and an intermediate plate region on which the intermediate plate is installed, The elastic member is preferably provided on the lower plate at a distance from the resin sheet region and the intermediate plate region.

  According to this sticking jig, the elastic member can be prevented from contacting the intermediate plate and the resin sheet. Therefore, the elastic member can reliably support the electronic component.

  The electronic device manufacturing method of the present invention is an electronic device manufacturing method in which a resin sheet is bonded to an electronic component, and the preparation step of setting the resin sheet and the electronic component on a bonding jig; After the preparation step, the bonding step of pressing the bonding jig, and the preparation step includes a step of placing the resin sheet on a lower plate, and the resin so as to expose the resin sheet upward. A step of placing an intermediate plate having a thickness smaller than the thickness of the sheet on the lower plate; a step of supporting the electronic component by an elastic member so as to be spaced upward with respect to the resin sheet; Placing the upper plate on the electronic component so as to face the lower plate in the vertical direction, and in the attaching step, against the elastic force of the elastic member, By pressing the upper plate to movement is restricted by the intermediate plate, it is characterized by contacting the electronic component in the resin sheet.

  According to this manufacturing method, the intermediate plate having a thickness smaller than the thickness of the resin sheet is placed on the lower plate so that the resin sheet is exposed upward. Therefore, the distance between the resin sheet and the electronic component can be regulated by regulating the movement of the upper plate by the intermediate plate during pressing. As a result, the resin sheet can be accurately attached to the electronic component.

  Further, according to this manufacturing method, since the electronic component is supported by the elastic member so that the space is spaced upward with respect to the resin sheet, when the resin sheet and the electronic component are set on the jig, the resin sheet and The electronic component is arranged with an interval in the vertical direction by the elastic member. Therefore, even if the jig | tool which set the resin sheet and the electronic component is conveyed, it can prevent that an electronic component contacts a resin sheet and can prevent damage to an electronic component. As a result, it is excellent in transportability.

  Moreover, since the sticking step is a step of pressing the upper plate against the elastic force of the elastic member, it can be easily pressed without removing the elastic member as the support member after transportation.

  According to the sticking jig of the present invention, it is excellent in the transportability of the jig after the resin sheet and the electronic component are set in the jig, and the resin sheet can be accurately stuck to the electronic component. .

  In addition, according to the manufacturing method of the present invention, it is possible to prevent damage to the electronic component during transportation, and it is possible to manufacture the electronic device accurately and simply.

FIG. 1 shows a plan view of one part of a sealing jig (part in which an intermediate plate is set on a lower plate) which is an embodiment of a sticking jig of the present invention. 2A and 2B are partially enlarged views of process diagrams of an optical semiconductor device manufacturing method which is an embodiment of the electronic device manufacturing method of the present invention. FIG. 2A is a process of preparing a lower plate. 2B is a cross-sectional view taken along line XX in FIG. 2A. 3A and 3B are partial enlarged views of the process diagram of the method for manufacturing the optical semiconductor device, following FIGS. 2A and 2B. FIG. 3A is a plan view of the process of placing the resin sheet on the lower plate. 3B is a cross-sectional view taken along line XX of FIG. 3A. 4A and 4B are enlarged views of a part of the process diagram of the method for manufacturing the optical semiconductor device, following FIGS. 3A and 3B. FIG. 4A is a plan view of the process of placing the intermediate plate on the lower plate. 4B is a cross-sectional view taken along line XX of FIG. 4A. 5A and 5B are enlarged views of a part of the process diagram of the manufacturing method of the optical semiconductor device, following FIGS. 4A and 4B. FIG. 5A is a plan view of the process of supporting the optical semiconductor component with a spring. 5B shows a cross-sectional view taken along line XX in FIG. 5A. 6A and 6B are partially enlarged views of the process diagram of the manufacturing method of the optical semiconductor device, following FIGS. 5A and 5B. FIG. 6A is a process of placing the upper plate on the optical semiconductor component. FIG. 6B is a sectional view taken along line XX in FIG. 6A. FIG. 7 is a partial enlarged view of the process diagram of the manufacturing method of the optical semiconductor device, following FIG. 6B, and shows a cross-sectional view of the process of pressing until the optical semiconductor component contacts the intermediate plate. FIG. 8 is a modification of the sealing jig of the present invention (the intermediate plate is a plurality of flat-plate-shaped intermediate plates), which is a part of the sealing jig (the intermediate plate is set on the lower plate) FIG. FIG. 9 is a modification of the sealing jig of the present invention (each positioning member has a truncated cone shape), and is a cross section of one part of the sealing jig (a part in which a resin sheet is set on the lower plate). The figure is shown.

  With reference to FIGS. 1-7, the sealing jig 1 which is one Embodiment of the sticking jig | tool of this invention is demonstrated.

  In the following description, when referring to the direction of the sealing jig, the state where the sealing jig is placed horizontally is used as a reference. That is, the paper thickness direction in FIG. 1 is the “vertical direction” (first direction), the front side of the paper thickness is the upper side, and the back side of the paper thickness direction is the lower side. 1 is the “left-right direction” (second direction, a direction orthogonal to the first direction), the left direction on the paper is the left side, and the right direction on the paper in FIG. 1 is the right side. 1 is the “front-rear direction” (the direction orthogonal to the third direction, the first direction, and the second direction), and the upper side of FIG. 1 is the front side and the lower side of FIG. 1 is the rear side. It is. For the drawings other than FIG. 1, the direction of FIG. In FIG. 6A, for convenience, only the electronic components are indicated by broken lines, and the resin sheet and the intermediate plate are omitted.

  The sealing jig 1 is a sealing jig for sealing an optical semiconductor component 2 (see FIG. 6B) as an electronic component with a sealing sheet 3 (see FIG. 6B) as a resin sheet.

  As shown in FIGS. 1 and 6B, a sealing jig 1 includes a base member 4, a spacer 5 as an intermediate plate configured to be placed on the upper surface (upper surface) of the base member 4, and a spacer 5 and an upper plate 6 configured to be opposed to each other.

(1) Base Member As shown in FIGS. 1, 2A and 2B, the base member 4 includes a base plate 7 as a lower plate, guide pins 16, 17, 18 and a spring 8 as an elastic member. Yes.

  The base plate 7 is made of a metal such as stainless steel and is formed in a flat plate shape having a substantially rectangular shape in plan view extending in the left-right direction and the front-rear direction. The base plate 7 is partitioned into a plurality of blocks 11 on the front, rear, left, and right sides corresponding to one opening 10 (described later) of the spacer 5. The blocks 11 are aligned and arranged in two rows in the front-rear direction and three rows in the left-right direction.

  Each block 11 includes a spacer region 12 as an intermediate plate region that overlaps a frame portion 23 (described later) of the spacer 5 and a resin sheet that overlaps the sealing sheet 3 in the opening 10 as indicated by a virtual line in FIG. 2A. A sealing sheet region 13 as a region is partitioned.

  The spacer region 12 is partitioned into a substantially rectangular frame shape in plan view.

  The sealing sheet region 13 is partitioned into a substantially rectangular shape in plan view extending in the front-rear direction, and a plurality (three rows) of the sealing sheet region 13 are arranged in parallel in the opening 10 at intervals in the left-right direction. A margin region 14 is defined between the sealing sheet region 13 at both ends in the left-right direction and the spacer region 12 adjacent thereto in the left-right direction.

  The base plate 7 is formed with small diameter grooves 15a and 15c and a large diameter groove 15b corresponding to the guide pins 16, 17 and 18, and a large diameter groove 15d corresponding to the spring 8.

  As shown in FIGS. 2A and 2B, the guide pins 16, 17, and 18 are respectively a first guide pin 16 as a first positioning member, a second guide pin 17 as a second positioning member, and a third positioning member. It is classified into a third guide pin 18 as a member.

  The first guide pin 16 is made of a metal such as stainless steel and is formed in a substantially cylindrical shape extending in the vertical direction. The first guide pin 16 is erected with respect to the base plate 7 by the lower end of the first guide pin 16 being fitted into the narrow groove 15 a of the base plate 7. One first guide pin 16 is arranged at the center in the left-right direction at the front end portion and the rear end portion of each sealing sheet region 13. The first guide pin 16 is inserted through a sheet through hole 19 of the sealing sheet 3 described later and a first through hole 20a of the upper plate 6. Accordingly, the first guide pins 16 position the sealing sheet 3 with respect to the base plate 7.

  The second guide pin 17 is made of a metal such as stainless steel and is formed in a substantially cylindrical shape having a larger diameter than the first guide pin 16 extending in the vertical direction. The lower end of the second guide pin 17 is erected with respect to the base plate 7 by being fitted into the large diameter groove 15 b of the base plate 7. In each block 11, one second guide pin 17 is disposed at each of the four corners so as to overlap a frame portion 23 (described later) of the spacer 5. The second guide pin 17 is inserted through a spacer through hole 21 of the spacer 5 described later and a second through hole 20b of the upper plate 6. As a result, the second guide pin 17 positions the spacer 5 with respect to the base plate 7.

  The third guide pin 18 is made of a metal such as stainless steel and is formed in a substantially cylindrical shape having the same diameter as the first guide pin 16 extending in the vertical direction. The lower end of the third guide pin 18 is erected with respect to the base plate 7 by being fitted into the small diameter groove 15 c of the base plate 7. The third guide pins 18 are arranged on the right side or the left side with respect to the center in the left-right direction at the front end portion and the rear end portion of each sealing sheet region 13. Specifically, one is each arrange | positioned at the right front end part of each sealing sheet area | region 13, and a left rear end part. The third guide pin 18 engages with a notch 22 (described later) of the optical semiconductor component 2 described later, and is inserted through the through hole 20 of the upper plate 6. As a result, the third guide pin 18 positions the optical semiconductor component 2 with respect to the base plate 7.

  The spring 8 is composed of a compression coil spring that expands and contracts in the vertical direction, and its lower end is erected with respect to the base plate 7 by being fitted into the large-diameter groove 15 d of the base plate 7. One spring 8 is arranged at each of the four corners in the opening 10 in each block 11. Specifically, two are arranged at intervals in the front-rear direction in each margin region 14, and are arranged on a line connecting the first guide pins 16 arranged diagonally. That is, the spring 8 is provided at a position that does not overlap the sealing sheet region 13 and the spacer region 12.

  The spring 8 contracts, for example, less than 1.0 MPa, preferably less than 0.5 MPa, for example, less than 50%, preferably less than 10%, but at higher loads, the spring 8 contracts, more than 10%, preferably And a spring constant that contracts by 50% or more. If the spring constant is within the above range, the optical semiconductor component 2 can be supported so as to be separated from the sealing sheet 3 and can be easily compressed by a pressing step (described later).

  The vertical length of the spring 8 (no load) exposed from the surface of the base plate 7 is formed to be longer than the thickness of the sealing sheet 3.

  As a result, the spring 8 supports the optical semiconductor component 2 with an interval upward from the sealing sheet 3.

(2) Spacer As shown in FIG. 1, FIG. 4A and FIG. 4B, the spacer 5 is formed in a substantially flat plate shape made of metal such as stainless steel, and includes a frame portion 23 and a partition portion 24.

  The frame part 23 includes an outer frame part 25 and an intermediate frame part 26.

  The outer frame portion 25 is formed in a substantially frame shape in plan view, and has two front and rear outer frame portions 25a that are spaced apart in the left-right direction, and two left and right outer frames that connect the front and rear ends of the two front and rear outer frame portions 25a. Part 25b.

  The middle frame portion 26 is disposed between the two front and rear outer frame portions 25a so as to be substantially equally divided in the left-right direction, extends in the front-rear direction, and is spanned between the two left and right outer frame portions 25b. Between the plural (two) front and rear middle frame portions 26a and the two left and right outer frame portions 25b, the two front and rear outer frames are arranged so as to be substantially equally divided in the front and rear direction and extend in the left and right directions. And at least one left and right middle frame portion 26b (one) provided between the portions 25a. The front and rear middle frame part 26a and the left and right middle frame part 26b partition the inside of the outer frame part 25 into a grid pattern, and thereby a plurality (six) of openings 10 are formed. The plurality of openings 10 are aligned in the outer frame portion 25 so that there are two rows in the front-rear direction and three rows in the left-right direction. Corresponding to each opening 10, a block 11 including each opening 10 is partitioned.

  The partition portion 24 is formed in a rectangular shape in plan view that is long in the front-rear direction. A plurality of (four) partition portions 24 are provided in each opening 10, and ¼ of the longitudinal length of the opening 10 from the left and right outer frame portions 25 b and the left and right middle frame portions 26 b toward the opening 10. It protrudes to a certain length and is arranged in parallel with an interval in the left-right direction. The partition part 24a protruding from the left and right outer frame part 25b and the partition part 24b protruding from the left and right middle frame part 26b are opposed to each other in the front-rear direction. The partition portion 24 is disposed between the sealing sheet regions 13 adjacent to each other. That is, in each opening 10, a plurality (two) of partition portions 24 project inward from the front side and project inward from the rear side with a space therebetween in the left-right direction.

  The spacer 5 is formed with a plurality of spacer through holes 21 penetrating in the thickness direction in the frame portion 23.

  The plurality of spacer through holes 21 are arranged corresponding to the second guide pins 17, and are formed so that the second guide pins 17 are inserted when the spacers 5 are set on the base plate 7.

  The thickness of the spacer 5 is formed to be thinner than the thickness of the sealing sheet 3. Specifically, the spacer 5 is formed to be thinner than the sealing sheet 3, for example, about 10% or less, preferably about 5% or less of the thickness of the sealing sheet 3.

(3) Upper Plate As shown in FIGS. 6A and 6B, the upper plate 6 is made of a metal such as stainless steel and is formed in a flat plate shape having a substantially rectangular shape in plan view extending in the left-right direction and the front-rear direction. The upper plate 6 is formed in the same size and the same shape as the base plate 7 in plan view.

  The upper plate 6 is formed with a plurality of first through holes 20a, a plurality of second through holes 20b, and a plurality of third through holes 20c. The plurality of first through holes 20a, the plurality of second through holes 20b, and the plurality of third through holes 20c each penetrate the upper plate 6 in the thickness direction.

  The plurality of first through holes 20 a are arranged corresponding to the first guide pins 16 and are formed so that the first guide pins 16 are inserted when the upper plate 6 is set on the base member 4. Yes.

  The plurality of second through holes 20b are arranged corresponding to the second guide pins 17, and are formed so that the second guide pins 17 are inserted when the upper plate 6 is set on the base member 4. Yes.

  The plurality of third through holes 20c are arranged corresponding to the third guide pins 18, and are formed so that the third guide pins 18 are inserted when the upper plate 6 is set on the base member 4. Yes.

  The thickness of the upper plate 6 is such that when the upper plate 6 is placed on the optical semiconductor component 2 and a pressing process (described later) is performed, the first guide pin 16, the second guide pin 17 and the third guide pin 18 The plate 6 is formed so as not to protrude from the upper surface. Specifically, the upper plate 6 is thicker than the base plate 7, and the upper plate 6 is formed to be thicker than the base plate 7, for example, about 5% or more, preferably about 10% or more of the thickness of the base plate 7. ing.

  Next, a method for manufacturing the optical semiconductor device 30 using the sealing jig 1 will be described with reference to FIGS. This method is a method for manufacturing the optical semiconductor device 30 by sealing the optical semiconductor component 2 with the sealing sheet 3. This method includes a preparation step of setting the sealing sheet 3 and the optical semiconductor component 2 on the sealing jig 1 and a sticking step of pressing the sealing jig 1 after the preparation step.

[Preparation process]
In the preparation step, the step of preparing the base member 4, the step of placing the sealing sheet 3 on the base member 4, and the spacer 5 are placed on the base member 4 so as to expose the sealing sheet 3 upward. The upper plate 6 is placed on the optical semiconductor so as to face the base member 4 in the vertical direction, the step, the step of supporting the optical semiconductor component 2 by the spring 8 so as to be spaced upward from the sealing sheet 3. Placing on the component 2.

  First, in the preparation step, a base member 4 is prepared as shown in FIGS. 2A and 2B.

  The base member 4 is prepared by fitting guide pins 16, 17, and 18 into the small diameter grooves 15 a and 15 c and the large diameter groove 15 b of the base plate 7 and fitting the spring 8 into the large diameter groove 15 d.

  Next, as shown in FIGS. 3A and 3B, the sealing sheet 3 is placed on the base member 4.

  The sealing sheet 3 includes a release sheet 31 and a plurality (four) of sealing resin layers 32 laminated on the upper surface of the release sheet 31.

  The release sheet 31 is formed in a substantially rectangular sheet shape in plan view extending in the front-rear direction.

  A plurality (two) of sheet through holes 19 and a plurality (two) of sheet openings 33 are formed in the release sheet 31.

  The sheet through hole 19 is provided so as to correspond to the first guide pin 16 and is formed as a pair of front and rear so that the first guide pin 16 is inserted, specifically, the center of the sealing sheet 3 in the left-right direction. One is formed at each of the front end portion and the rear end portion.

  The sheet opening 33 is formed in a rectangular shape in plan view. One sheet opening 33 is formed at each of the right front end and the left rear end of the sealing sheet 3 so as not to come into contact with the third guide pins 18 when the sealing sheet 3 is placed on the base member 4. Has been. Specifically, the length of each side of the seat opening 33 is larger than the diameter of the third guide pin 18.

  The release sheet 31 is formed of a resin film such as a polyethylene terephthalate film, a polystyrene film, a polypropylene film, a polycarbonate film, an acrylic film, a silicone resin film, a styrene resin film, or a fluororesin film. Note that the surface of the release sheet 31 may be subjected to a release treatment.

  The thickness of the release sheet 31 is, for example, 20 μm or more, preferably 30 μm or more, and for example, 100 μm or less, preferably 50 μm or less.

  The sealing resin layer 32 is formed in a substantially circular sheet shape in plan view. A plurality (four) of the sealing resin layers 32 are laminated on the upper surface of the release sheet 31 with a space in the front-rear direction between the pair of front and rear sheet through holes 19.

  The sealing resin layer 32 is formed from a sealing resin composition containing a sealing resin.

  Examples of the sealing resin include thermoplastic resins that are plasticized by heating, for example, thermosetting resins that are cured by heating, for example, active energy rays that are cured by irradiation with active energy rays (for example, ultraviolet rays and electron beams). Examples thereof include curable resins.

  Examples of the thermoplastic resin include vinyl acetate resin, ethylene / vinyl acetate copolymer (EVA), vinyl chloride resin, EVA / vinyl chloride resin copolymer, and the like.

  Examples of the thermosetting resin and active energy ray curable resin include silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin. As these sealing resin, Preferably, a thermosetting resin is mentioned, More preferably, a silicone resin is mentioned.

  Examples of the sealing resin composition containing a silicone resin as the sealing resin include thermosetting silicone resin compositions such as a two-stage curable silicone resin composition and a one-stage curable silicone resin composition. .

  The two-stage curable silicone resin composition has a two-stage reaction mechanism. It is B-staged (semi-cured) by the first-stage reaction, and C-stage (final-cured) by the second-stage reaction. It is a thermosetting silicone resin composition.

  The B stage is a state between the A stage in which the sealing resin composition is soluble in the solvent and the final cured C stage, and the curing and gelation progresses slightly, and the solvent swells in the solvent. Is not completely dissolved and is softened by heating but not melted.

  Examples of the two-stage curable silicone resin composition include a condensation reaction / addition reaction curable silicone resin composition.

  In addition, a phosphor and a filler can be contained in the sealing resin composition at an appropriate ratio, if necessary.

  Examples of the phosphor include a yellow phosphor that can convert blue light into yellow light. As such a phosphor, for example, a phosphor in which a metal atom such as cerium (Ce) or europium (Eu) is doped in a composite metal oxide, a metal sulfide, or the like can be given.

Specifically, examples of the phosphor include Y ₃ Al ₅ O ₁₂ : Ce (YAG (yttrium, aluminum, garnet): Ce).

  The sealing resin layer 32 is preferably a B stage, and has a hardness such that the compression elastic modulus is, for example, 0.025 MPa or more, and, for example, 0.15 MPa or less.

  The sealing resin layer 32 is formed to have a larger diameter than the optical semiconductor element 35 (described later) when projected in the vertical direction, and the diameter is, for example, 1 mm or more and 100 mm or less.

  Moreover, the thickness of the sealing resin layer 32 is, for example, 100 μm or more, and, for example, 1000 μm or less, preferably, 800 μm or less.

  The thickness of the sealing sheet 3 (that is, the distance from the lower surface of the release sheet 31 to the upper surface of the sealing resin layer 32) is larger than the thickness of the spacer 5, and the difference L1 between these thicknesses is, for example, 1 μm or more, preferably Is 50 μm or more, and for example, 500 μm or less, preferably 100 μm or less.

  Specifically, the sealing sheet 3 is placed on the sealing sheet region 13 such that the release sheet 31 is on the lower side. At this time, the sealing sheet 3 is placed so that the first guide pins 16 are inserted into the sheet through holes 19. Thereby, the sealing sheet 3 is positioned with respect to the base plate 7 by the first guide pins 16. The third guide pin 18 penetrates the sheet opening 33 in the thickness direction with play without contacting the edge of the sheet opening 33.

  Next, as shown in FIGS. 4A and 4B, the spacer 5 is placed on the base member 4 so that the sealing sheet 3 is exposed upward. Specifically, the spacer 5 is placed on the spacer region 12 of the base member 4. At this time, the spacer 5 is placed on the spacer region 12 so that the second guide pin 17 is inserted into the spacer through hole 21. Thereby, the spacer 5 is positioned with respect to the base plate 7 by the second guide pin 17. Therefore, the sealing sheet 3 is exposed upward from the opening 10 of the spacer 5. Specifically, in each block 11, a plurality (three) of the sealing sheets 3 arranged at intervals in the left-right direction are arranged in the opening 10 so as to be partitioned by the partition portion 24.

  Next, as shown in FIGS. 5A and 5B, the optical semiconductor component 2 is supported by the spring 8 so as to be spaced upward from the sealing sheet 3 (supporting step).

  The optical semiconductor component 2 includes a circuit board 34 and a plurality (12 pieces) of optical semiconductor elements 35 supported on the surface (lower surface) of the circuit board 34.

  The circuit board 34 has a substantially flat plate shape having a substantially rectangular shape in plan view. For example, the circuit board 34 is formed on the optical semiconductor device 30 such as a ceramic substrate such as alumina, a resin substrate such as polyimide, and a metal core substrate using a metal plate for the core. It consists of a commonly used substrate.

  A cutout 22 is formed in the circuit board 34. The notches 22 are provided corresponding to the third guide pins 18, and are formed at a plurality (three) of the front end edge and the rear end edge at intervals from each other. The notch 22 is formed in a substantially semi-arc shape in plan view so that the inner part of the third guide pin 18 contacts.

  The circuit board 34 has, on its surface (lower surface), a pair of external electrodes 36 connected to an external power source (not shown), wiring 37, and internal electrodes (see FIG. 5) electrically connected to the optical semiconductor element 35. (Not shown).

  In the circuit board 34, a plurality (four) of the conductor patterns 38 are arranged in parallel at intervals in the vertical direction, and a plurality (three) of the conductor patterns 38 are arranged in parallel at intervals in the horizontal direction. That is, a total of 12 are arranged and arranged.

  The optical semiconductor element 35 is formed in a substantially disk shape in plan view having a smaller diameter than the sealing resin layer 32, and on the upper surface of the circuit board 34, a plurality (four) of the optical semiconductor elements 35 are arranged in parallel at intervals in the front-rear direction. Further, a plurality (three) are arranged in parallel at intervals in the left-right direction, that is, a total of twelve are arranged. The optical semiconductor element 35 is disposed corresponding to each conductor pattern 38, and specifically, each optical semiconductor element 35 is disposed so as to be interposed between a pair of corresponding external electrodes 36.

  Such an optical semiconductor element 35 is connected to an internal electrode (not shown) by wire bonding (not shown) or is flip-chip mounted (not shown) so that the internal electrode (not shown) is connected. Light is emitted when electric power is supplied from (not shown).

  The thickness of the optical semiconductor element 35 is the same as or smaller than the thickness difference L1 between the sealing sheet 3 and the spacer 5, for example, 1 μm or more, preferably 50 μm or more, and for example, 200 μm or less, preferably 100 μm. It is as follows.

  The optical semiconductor element 35 is, for example, a light emitting diode, and specifically, an optical semiconductor element that can emit blue light (particularly, a blue light emitting diode element).

  In the supporting step, specifically, in each block 11, the four corners of the circuit board 34 are placed on the upper ends of the springs 8 so that the optical semiconductor element 35 faces downward. At this time, the optical semiconductor component 2 is placed so that the notch 22 of the circuit board 34 is in contact with the inside of the third guide pin 18. Thus, the optical semiconductor component 2 is positioned with respect to the base plate 7 and the optical semiconductor component 2 and the sealing sheet 3 are opposed in the vertical direction without the optical semiconductor element 35 being in contact with the sealing resin layer 32. Can be arranged.

  In addition, due to this positioning, when projected in the vertical direction, the semiconductor element 35 overlaps with the sealing resin layer 32 concentrically, and the pair of external electrodes 36 are disposed outside the sealing resin layer 32 at the sealing resin layer 32. 32 are arranged so as to sandwich it.

  Further, when projected in the vertical direction, both ends in the left-right direction of the circuit board 34 overlap with the pair of front and rear outer frame parts 25 a of the spacer 5, and both ends in the front-rear direction of the circuit board 34 overlap with the partition part 24.

  Next, as shown in FIGS. 6A and 6B, the upper plate 6 is placed on the optical semiconductor component 2.

  At this time, the first guide pin 16, the second guide pin 17, and the third guide pin 18 are arranged on the upper surface of the circuit board 34 so as to be inserted into the through holes 20 (20a, 20b, 20c) of the upper plate 6. The plate 6 is placed. Thereby, the upper plate 6 is positioned with respect to the base plate 7. When the upper plate 6 is placed on the optical semiconductor component 2, the spring 8 is slightly compressed by the weight of the upper plate 6, that is, the distance L2 between the optical semiconductor element 35 and the sealing resin layer 32 is Although slightly adjacent, the optical semiconductor element 35 does not come into contact with the sealing resin layer 32, and the optical semiconductor component 2 is disposed to face the sealing sheet 3. The distance L2 between the optical semiconductor element 35 and the sealing resin layer 32 is, for example, 0.5 mm or more, preferably 1 mm or more, and, for example, 4 mm or less, preferably 2 mm or less.

  Thereby, the sealing sheet 3 and the optical semiconductor component 2 are set on the sealing jig 1.

[Attaching process]
The sticking step includes a pressing step of pressing the upper plate 6 against the elastic force of the spring 8 until the movement of the upper plate 6 is regulated by the spacer 5.

  Specifically, as shown in FIG. 6B, a sealing jig is horizontally placed on the upper surface of the lower plate 40 of the parallel plate press (the phantom line in FIG. 6B), and then, as shown in FIG. The upper plate 41 (imaginary line in FIG. 7) of the parallel plate press is pressed against the upper plate 6 from above to below.

  At this time, the upper plate 6 is pushed downward until the optical semiconductor component 2 contacts the spacer 5, specifically, until the lower surface of the circuit board 34 contacts the upper surface of the spacer 5. Thereby, the sealing resin layer 32 comes into contact with the optical semiconductor component 2, that is, the surface (lower surface and side surface) of the optical semiconductor element 35 and the lower surface of the circuit board 34. In other words, the optical semiconductor element 35 is sealed with the sealing resin layer 32.

  As a condition during pressing, the temperature is, for example, room temperature. For example, it can be carried out under vacuum or reduced pressure, for example, 5 hPa or less, preferably 3 hPa or less.

  The pressing pressure is, for example, 0.1 MPa or more, preferably 0.2 MPa or more, and for example, 1.0 MPa or less, preferably 0.8 MPa or less.

  The pressing time is, for example, 0.1 minutes or more, preferably 0.4 minutes or more, and for example, 2 minutes or less, preferably 1 minute or less.

  Thereby, the optical semiconductor device 30 in which the sealing sheet 3 is laminated on the optical semiconductor component 2, that is, the optical semiconductor element 35 is sealed in the sealing resin layer 32 and peeled off on the surface of the sealing resin layer 32. The optical semiconductor device 30 in which the sheets 31 are stacked is manufactured.

  Next, the press is released, the optical semiconductor device 30 is recovered from the sealing jig 1, and when the sealing resin layer 32 contains a thermosetting resin, a step of heat curing the optical semiconductor device 30 is performed. .

  Specifically, the heating temperature is, for example, 80 ° C. or more, preferably 100 ° C. or more, and for example, 200 ° C. or less, preferably 180 ° C. or less. The heating time is, for example, 0.1 hour or more, preferably 1 hour or more, and for example, 20 hours or less, preferably 10 hours or less.

[Function and effect]
And according to this manufacturing method of the sealing jig 1 and the optical semiconductor device 30 using the same, when the sealing sheet 3 and the optical semiconductor component 2 are set in the sealing jig, as shown in FIG. 6B. The optical semiconductor component 2 is supported by the spring 8 so that the interval L2 is spaced upward from the sealing sheet 3. Therefore, the sealing sheet 3 and the optical semiconductor component 2 are arrange | positioned at intervals in the up-down direction. As a result, even if the sealing jig 1 on which the sealing sheet 3 and the optical semiconductor component 2 are set is transported, the optical semiconductor element 35 supported by the optical semiconductor component 2 remains on the surface of the release sheet 31 of the sealing sheet 3. It is possible to prevent the optical semiconductor element 35 from being damaged. Therefore, it is excellent in transportability.

  Further, as shown in FIG. 7, according to the sealing jig 1, the spacer 5 having a thickness smaller than the thickness of the sealing sheet 3 is provided. Therefore, the distance between the sealing sheet 3 and the optical semiconductor component 2 can be regulated by bringing the optical semiconductor component 2 into contact with the spacer 5 during pressing. As a result, the optical semiconductor element 35 can be accurately sealed with the sealing sheet 3.

  In addition, since the member configured to support the optical semiconductor component 2 is the spring 8, if a pressing force is applied from the upper plate 6 during pressing, the spring 8 is easily compressed. Therefore, it can be simply pressed without removing the spring 8 after transportation.

  The sealing jig 1 is provided on the base plate 7, and is provided on the base plate 7 with the first guide pins 16 that position the sealing sheet 3 with respect to the base plate 7, and positions the spacer 5 with respect to the base plate 7. A second guide pin and a third guide pin 18 provided on the base plate 7 for positioning the optical semiconductor component 2 with respect to the base plate 7 are provided.

  Therefore, each of the sealing sheet 3, the spacer 5, and the optical semiconductor component 2 can be set at an accurate position with respect to the base plate 7. Therefore, the optical semiconductor element 35 can be accurately sealed with the sealing sheet 3.

  Further, in the sealing jig 1, a sealing sheet region 13 where the sealing sheet 3 is placed and a spacer region 12 where the spacer 5 is installed are partitioned on the surface of the base plate 7, and the spring 8. Is provided in the margin region 14 at a distance from the sealing sheet region 13 and the spacer region 12.

  Therefore, the spring 8 can be prevented from contacting the spacer 5 and the sealing sheet 3. Therefore, the spring 8 can reliably support the optical semiconductor component 2.

(Modification)
A modification of the sealing jig 1 will be described with reference to FIGS. In addition, in a modification, the same code | symbol is attached | subjected to the member similar to above-described embodiment, and the description is abbreviate | omitted.

  In the embodiment shown in FIG. 1 to FIG. 7, the spacer 5 has a substantially rectangular frame shape in plan view and includes a frame portion 23 and a partition portion 24. For example, as shown in FIG. A plurality of flat band-shaped spacers 5 may be provided.

  That is, in the embodiment of FIG. 8, the spacer 5 includes a first spacer 51 and a second spacer 52.

  The first spacer 51 has a substantially flat band shape that is substantially rectangular in a plan view, and is formed to have a thickness that is smaller than the thickness of the sealing sheet 3. The first spacer 51 is formed with a plurality (two) of spacer through holes 21 penetrating in the thickness direction.

  One spacer through hole 21 of the first spacer 51 is provided at each of both end portions of the first spacer 51 in the left-right direction, that is, a total of two are provided.

  The second spacer 52 has a substantially flat band shape having a substantially rectangular shape in plan view, and is formed to have a thickness smaller than the thickness of the sealing sheet 3. The second spacer 52 is formed with a plurality (two) of spacer through holes 21 penetrating in the thickness direction.

  One spacer through hole 21 of the second spacer 52 is provided at each of both end portions of the second spacer 52 in the left-right direction, that is, a total of two are provided.

  One second guide pin 17 is disposed at each of the four corners of the base plate 7 so as to overlap the spacer 5. The second guide pin 17 is inserted into the spacer through hole 21 of the spacer 5 and the second through hole 20 b of the upper plate 6.

  According to the sealing jig 1, the effects similar to those of the embodiment of FIG.

  Furthermore, according to the embodiment of FIG. 8, the spacer 5 does not include the middle frame portion 26 and the partition portion 24, and the area portion (that is, the spacer region 12) on which the spacer 5 is placed on the base plate 7 is reduced. The sealing sheet area | region 13 can be increased or the freedom degree of the shape of the sealing sheet area | region 13 can be improved.

  In the embodiment shown in FIGS. 1 to 7, the first guide pin 16, the second guide pin 17, and the third guide pin 18 are formed in a substantially cylindrical shape extending in the vertical direction. Thus, the 1st guide pin 16, the 2nd guide pin 17, and the 3rd guide pin 18 can also be formed in the approximate truncated cone shape extended in the up-and-down direction.

  That is, in the embodiment of FIG. 9, the first guide pin 16, the second guide pin 17, and the third guide pin 18 are formed in a substantially trapezoidal shape in sectional view that is reduced in diameter toward the upper side.

  According to the embodiment of FIG. 9, after sealing the optical semiconductor element 35 with the sealing sheet 3, the sealing sheet 3, the spacer 5, and the upper plate 6 can be easily detached from the base plate 7.

  In the embodiment shown in FIGS. 1 to 7, the upper surface of the spacer 5 is formed flat. For example, although not shown, the inner side (opening 10) and the outer side of the spacer 5 communicate with the upper surface of the spacer 5. Grooves can also be formed. A plurality of grooves can be formed, or can be formed in a radial shape. Such a groove can be used as a vent. That is, when the sealing resin layer 32 is excessively present, the material of the sealing resin layer 32 that leaks from the sealing sheet region 13 at the time of pressing can be excluded to the outside of the spacer 5 through the groove.

  In the embodiment shown in FIGS. 1 to 7, the movement of the upper plate 6 is regulated by the spacer 5 by the circuit board 34 coming into contact with the spacer 5. The movement of the upper plate 6 can also be regulated by the spacer 5 by contacting with.

  In this embodiment, a circuit board 34 that does not come into contact with the spacer 5 during pressing, that is, a circuit board 34 that does not overlap with the spacer 5 when projected in the vertical direction is used as the circuit board 34. And the preparatory process and the support process similar to the embodiment shown in FIGS. 1 to 7 are performed, and then the upper plate 6 is moved until the lower surface of the upper plate 6 contacts the upper surface of the spacer 5 in the attaching step. Press down.

  Also in this embodiment, since the distance between the sealing sheet 3 and the optical semiconductor component 2 can be regulated by the upper plate 6 coming into contact with the spacer 5 at the time of pressing, the optical semiconductor element 35 is formed by the sealing sheet 3. It can seal correctly. Therefore, this embodiment has the same effect as the embodiment of FIGS.

DESCRIPTION OF SYMBOLS 1 Sealing jig 2 Optical semiconductor component 3 Sealing sheet 5 Spacer 6 Upper plate 7 Base plate 8 Spring 12 Spacer area 13 Sealing sheet area 16 First guide pin
17 Second guide pin 18 Third guide pin

Claims (4)

An attaching jig for attaching a resin sheet to an electronic component,
A lower plate configured such that a resin sheet is placed thereon;
An intermediate plate configured to be placed on the lower plate so as to expose the resin sheet upward, and having a thickness smaller than the thickness of the resin sheet;
An elastic member configured to support the electronic component so as to be spaced upward from the resin sheet;
An adhering jig comprising: an upper plate configured to be placed on the electronic component so as to face the lower plate in the vertical direction. A first positioning member provided on the lower plate for positioning the resin sheet with respect to the lower plate;
A second positioning member provided on the lower plate for positioning the intermediate plate with respect to the lower plate;
The sticking jig according to claim 1, further comprising: a third positioning member that is provided on the lower plate and positions the electronic component with respect to the lower plate. On the surface of the lower plate, a resin sheet region on which the resin sheet is placed and an intermediate plate region on which the intermediate plate is installed are partitioned,
The sticking jig according to claim 1, wherein the elastic member is provided on the lower plate at a distance from the resin sheet region and the intermediate plate region. An electronic device manufacturing method in which a resin sheet is attached to an electronic component,
A preparation step of setting the resin sheet and the electronic component on a sticking jig;
After the preparatory process, comprising a sticking process to press the sticking jig,
The preparation step includes
Placing the resin sheet on the lower plate;
Placing an intermediate plate having a thickness smaller than the thickness of the resin sheet on the lower plate so as to expose the resin sheet upward;
A step of supporting the electronic component by an elastic member so that the space is spaced upward with respect to the resin sheet;
Placing the upper plate on the electronic component so as to face the lower plate in the vertical direction,
In the adhering step, the electronic component is brought into contact with the resin sheet by pressing the upper plate until the movement of the upper plate is regulated by the intermediate plate against the elastic force of the elastic member. A method of manufacturing an electronic device.

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