TW201526306A - Attachment jig and production method of electronic device - Google Patents

Abstract

This attachment jig, for attaching a resin sheet to the surface of an electronic component, comprises a lower plate on which the resin sheet is placed, and is configured such that the resin sheet is placed on the lower plate so as to be exposed upwards. This attachment jig is provided with a middle plate which is less thick than the resin sheet, an elastic member which is configured to support an electronic component and to leave a separating interval above the resin sheet, and an upper plate which is configured so as to be opposite of the lower plate in the vertical direction and to be placed above the electronic component.

Description

Attachment jig and manufacturing method of electronic device

The present invention relates to a method for manufacturing an attachment jig and an electronic device, and more particularly to an applicator for attaching a resin sheet to an electronic component, and a resin sheet using the same A method of manufacturing an electronic device attached to an electronic component.

Conventionally, it has been known to manufacture an electronic device such as an optical semiconductor device by attaching a resin sheet such as a sealing sheet to an electronic component such as an optical semiconductor element.

For example, there has been proposed a method in which a sealing sheet is disposed opposite to a substrate on which a light-emitting diode is mounted, and then pressurized by a flat plate press, thereby sealing the sealing sheet to light-emitting two The polar body is attached to the substrate (see, for example, Patent Document 1 below).

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2013-21284

However, in the pressurization method such as the method proposed in Patent Document 1, it is important to accurately adjust the distance between the sealing sheet and the substrate. That is, when the distance between the sealing sheet and the substrate is too long during pressurization, there is a problem that the sealing sheet cannot be surely sealed with the light emitting diode. On the other hand, if the distance between the sealing sheet and the substrate is short, the light-emitting diode mounted on the substrate penetrates the sealing sheet.

Further, in the pressurization method, after the sealing sheet and the substrate are placed on the jig, the jig is transported to the press machine. When the sealing sheet and the light-emitting diode mounted on the substrate are in contact with each other during transportation, there is a possibility that damage is caused by excessively applying a load to a component (for example, a bonding wire) of the light-emitting diode due to shaking during transportation.

An object of the present invention is to provide a mounting jig having excellent portability and capable of accurately attaching a resin sheet to an electronic component, and a manufacturing method capable of easily manufacturing an electronic device using the bonding jig.

The attachment jig of the present invention is characterized in that it is used for attaching a resin sheet to an electronic component, and comprises: a lower plate configured to mount a resin sheet; and an intermediate plate configured to The resin sheet is placed on the lower plate so as to be exposed upward, and has a thickness thinner than the thickness of the resin sheet; and the elastic member is configured to be supported at intervals above the resin sheet. The electronic component and the upper plate are placed on the electronic component so as to face the lower plate in a vertical direction.

According to the attachment jig, an intermediate plate having a thickness thinner than the thickness of the resin sheet is included. Therefore, the intermediate plate restricts the movement of the upper plate at the time of pressurization, whereby the distance between the resin sheet and the electronic component can be restricted. As a result, the resin sheet can be accurately attached to the electronic component.

Further, according to the attachment jig, the elastic member that supports the electronic component so as to be spaced apart from the resin sheet is provided, and when the resin sheet and the electronic component are placed on the jig, the resin sheet The material and the electronic component are arranged at intervals in the vertical direction by the elastic member. Therefore, even if the jig provided with the resin sheet and the electronic component is conveyed, the electronic component can be prevented from coming into contact with the resin sheet, and the damage of the electronic component can be prevented. As a result, the handling property is excellent.

Further, since the supporting member configured to support the electronic component is an elastic member, if the pressing force from the upper plate is applied to the elastic member at the time of pressurization, the elastic member is compressed. Therefore, it is possible to easily pressurize without removing the support member after transportation.

Further, the attachment jig of the present invention preferably includes a first positioning member provided on the lower plate to position the resin sheet with respect to the lower plate, and a second positioning member provided on the lower plate The intermediate plate is positioned relative to the lower plate; and the third positioning member is disposed on the lower plate to position the electronic component relative to the lower plate.

According to the attachment jig, each of the resin sheet, the intermediate plate, and the electronic component can be placed at an accurate position with respect to the lower plate. Therefore, the resin sheet can be accurately attached to the electronic component.

Further, in the attaching jig of the present invention, it is preferable that a resin sheet region on which the resin sheet is placed and an intermediate plate region in which the intermediate plate is provided are partitioned on a surface of the lower plate, and the elastic member is The resin sheet region and the intermediate plate region are provided on the lower plate at intervals.

According to the attachment jig, the elastic member can be prevented from coming into contact with the intermediate plate and the resin sheet. Therefore, the elastic member can surely support the electronic component.

Moreover, the method of manufacturing an electronic device according to the present invention is characterized in that it is a method of manufacturing an electronic device in which a resin sheet is attached to an electronic component, and includes a preparation step of disposing the resin sheet and the electronic component. And attaching the jig; and attaching the step of pressurizing the attaching jig after the preparing step; the preparing step includes the step of placing the resin sheet on the lower plate; a step of placing the intermediate plate having a thickness thinner than the thickness of the resin sheet on the lower plate in such a manner that the sheet is exposed upward; and elastically spaced apart from the resin sheet a step of supporting the electronic component by the member; and placing the upper plate on the electronic component in a manner opposite to the lower plate in the up-and-down direction; and resisting the elastic force of the elastic member in the attaching step, The upper plate is pressurized until the movement of the upper plate is restricted by the intermediate plate, whereby the electronic component is brought into contact with the resin sheet.

According to this manufacturing method, the resin sheet is exposed upwards to have a tree The intermediate plate of the thickness of the thinner sheet of the grease sheet is placed on the lower plate. Therefore, the intermediate plate restricts the movement of the upper plate at the time of pressurization, whereby the distance between the resin sheet and the electronic component can be restricted. As a result, the resin sheet can be accurately attached to the electronic component.

Moreover, according to the manufacturing method, since the electronic component is supported by the elastic member so as to be spaced apart from the resin sheet, the resin sheet and the electronic component are provided when the resin sheet and the electronic component are placed on the jig. They are arranged at intervals in the vertical direction by the elastic members. Therefore, even if the jig provided with the resin sheet and the electronic component is conveyed, the electronic component can be prevented from coming into contact with the resin sheet, and the damage of the electronic component can be prevented. As a result, the handling property is excellent.

Further, since the attaching step is a step of pressurizing the upper plate against the elastic force of the elastic member, it is possible to easily pressurize without removing the elastic member as the supporting member after the conveyance.

According to the attaching jig of the present invention, the jig of the resin sheet and the electronic component after the jig is excellent in portability, and the resin sheet can be accurately attached to the electronic component.

Moreover, according to the manufacturing method of the present invention, it is possible to prevent damage to electronic components during transportation, and it is possible to manufacture an electronic device accurately and easily.

1‧‧‧ Sealing fixture

2‧‧‧Light semiconductor parts

3‧‧‧Seal sheet

4‧‧‧Base member

5‧‧‧ spacers

6‧‧‧Upper board

7‧‧‧floor

8‧‧‧ Spring

10‧‧‧ openings

11‧‧‧ Block

12‧‧‧ spacer area

13‧‧‧Seal sheet area

14‧‧‧Edge area

15a‧‧‧Small groove

15b‧‧‧Rough path slot

15c‧‧‧small groove

15d‧‧‧Rough path slot

16‧‧‧1st guide

17‧‧‧2nd guide

18‧‧‧3rd sales guide

19‧‧‧Sheet through hole

20a‧‧‧1st through hole

20b‧‧‧2nd through hole

20c‧‧‧3rd through hole

21‧‧‧ spacer through hole

22‧‧‧ nicks

23‧‧‧ Frame Department

24‧‧‧Departure

24a‧‧‧Departure

24b‧‧‧Departure

25‧‧‧Outer frame

25a‧‧‧ Front and rear frame

25b‧‧‧ about the outer frame

26‧‧‧中框部

26a‧‧‧ before and after the frame

26b‧‧‧ about the middle frame

30‧‧‧Optical semiconductor devices

31‧‧‧ peeling sheet

32‧‧‧ sealing resin layer

33‧‧‧Sheet opening

34‧‧‧ circuit board

35‧‧‧Optical semiconductor components

36‧‧‧External electrode

37‧‧‧Wiring

38‧‧‧Conductor pattern

40‧‧‧ parallel plate presser lower plate

41‧‧‧parallel plate presser upper plate

51‧‧‧1st spacer

52‧‧‧2nd spacer

L1‧‧‧Distance between the thickness of the sealing sheet 3 and the spacer 5

L2‧‧‧ Distance between the optical semiconductor component 35 and the sealing resin layer 32

Fig. 1 is a plan view showing a part (a part in which an intermediate plate is provided on a lower plate) of a sealing jig which is one embodiment of the attaching jig of the present invention.

2A and 2B are partial enlarged views of a step-by-step view of a method of manufacturing an optical semiconductor device according to an embodiment of a method of manufacturing an electronic device of the present invention, wherein FIG. 2A shows a plan view of a step of preparing a lower plate, and FIG. 2B shows a step along a step of preparing a lower plate. A cross-sectional view taken along line XX of Fig. 2A.

3A and 3B are partial enlarged views of the steps of the method of manufacturing the optical semiconductor device subsequent to FIGS. 2A and 2B, and FIG. 3A is a plan view showing the step of placing the resin sheet on the lower plate, and FIG. A cross-sectional view taken along line XX of Fig. 3A.

4A and 4B are partial enlarged views of the steps of the method of manufacturing the optical semiconductor device subsequent to FIGS. 3A and 3B, FIG. 4A is a plan view showing the step of placing the intermediate plate on the lower plate, and FIG. 4B is a view along the same. Sectional view of the XX line of 4A.

5A and 5B are partial enlarged views of the steps of the method of manufacturing the optical semiconductor device subsequent to FIGS. 4A and 4B, FIG. 5A is a plan view showing a step of supporting the optical semiconductor component by a spring, and FIG. 5B is a view along FIG. 5A. A section of the XX line.

6A and FIG. 6B are partial enlarged views of the steps of the method of manufacturing the optical semiconductor device subsequent to FIGS. 5A and 5B, and FIG. 6A is a plan view showing the step of placing the upper plate on the optical semiconductor component, and FIG. 6B shows the edge. A cross-sectional view taken along line XX of Fig. 6A.

Fig. 7 is a partially enlarged plan view showing the steps of the method of manufacturing the optical semiconductor device subsequent to Fig. 6B, and showing a cross-sectional view of the step of pressurizing until the photo-semiconductor member contacts the intermediate plate.

Fig. 8 is a plan view showing a modification of the sealing jig of the present invention (the intermediate plate is a plurality of intermediate plates in the shape of a flat strip), and shows a part of a part of the sealing jig (a part in which the intermediate plate is provided on the lower plate).

Fig. 9 is a cross-sectional view showing a modification of the sealing jig of the present invention (each positioning member has a conical ladder shape), and shows a part of the sealing jig (a part in which a resin sheet is provided on the lower plate).

A sealing jig 1 which is an embodiment of the attachment jig of the present invention will be described with reference to Figs. 1 to 7 .

In the following description, when the direction of the jig is sealed, the state in which the sealing jig is horizontally placed is used as a reference. In other words, the paper thickness direction of Fig. 1 is referred to as "up and down direction" (first direction), the paper thickness is near the front side, and the back side in the paper thickness direction is the lower side. Further, the left-right direction of the paper surface of Fig. 1 is referred to as "left-right direction" (second direction; direction orthogonal to the first direction), the left side of the paper surface is the left side, and the right side of the paper surface of Fig. 1 is the right side. Moreover, the up-down direction of the paper of FIG. 1 is set to "front-back direction" (third direction; orthogonal to the first direction and the second direction) Direction), the top side of the paper surface of Fig. 1 is the front side, and the lower side of the paper surface of Fig. 1 is the rear side. The drawings other than those in Fig. 1 are also based on the direction of Fig. 1. Further, in FIG. 6A, for the sake of convenience, only the electronic components are indicated by broken lines, and the resin sheet and the intermediate plate are omitted.

The sealing jig 1 is used to seal a sealing jig of an optical semiconductor component 2 (see FIG. 6B) as an electronic component by a sealing sheet 3 (see FIG. 6B) as a resin sheet.

As shown in FIG. 1 and FIG. 6B, the sealing jig 1 includes: a base member 4; a spacer 5 as an intermediate plate, which is configured to be placed on an upper surface (upper surface) of the base member 4; and an upper plate 6, which It is configured to be disposed above the spacer 5 in the opposite direction.

(1) Base member

As shown in FIGS. 1 , 2A and 2B , the base member 4 includes a bottom plate 7 as a lower plate, guide pins 16 , 17 and 18 , and a spring 8 as an elastic member.

The bottom plate 7 is formed of a metal such as stainless steel, and is formed into a flat plate shape having a substantially rectangular shape in plan view extending in the left-right direction and the front-rear direction. The bottom plate 7 corresponds to one opening 10 (described later) of the spacer 5, and is divided into a plurality of blocks 11 on the front, rear, left and right sides. The blocks 11 are arranged in two rows in the front-rear direction and three rows in the left-right direction.

In each of the blocks 11, as shown by the imaginary line of FIG. 2A, a spacer region 12 as an intermediate plate region is overlapped with the frame portion 23 of the spacer 5 (described later); and as a resin sheet region The sealing sheet region 13 is overlapped with the sealing sheet 3 in the opening 10.

The spacer region 12 is divided into a substantially rectangular frame shape in plan view.

The sealing sheet region 13 is divided into a substantially rectangular shape in plan view extending in the front-rear direction, and a plurality of (three rows) are arranged side by side in the opening 10 at intervals in the left-right direction. Further, an edge region 14 is defined between the sealing sheet region 13 at both end portions in the left-right direction and the spacer region 12 adjacent to the left-right direction and the sealing sheet region 13.

The bottom plate 7 is formed with narrow-diameter grooves 15a and 15c corresponding to the guide pins 16, 17, and 18, and a large-diameter groove 15b, and a large-diameter groove 15d corresponding to the spring 8.

The guide pins 16, 17, and 18 are classified as the first as shown in FIG. 2A and FIG. 2B, respectively. The first guide pin 16 of the positioning member, the second guide pin 17 as the second positioning member, and the third guide pin 18 as the third positioning member.

The first guide pin 16 is made of a metal such as stainless steel, and is formed in a substantially cylindrical shape extending in the vertical direction. The first guide pin 16 is erected with respect to the bottom plate 7 by fitting the lower end thereof to the narrow groove 15a of the bottom plate 7. The first guide pin 16 is disposed in each of the front end portion and the rear end portion of each of the seal sheet regions 13 in the center in the left-right direction. The first guide pin 16 is inserted into the sheet through-hole 19 of the sealing sheet 3 to be described later, and the first through-hole 20a of the upper plate 6. Thereby, the first guide pin 16 positions the sealing sheet 3 with respect to the bottom plate 7.

The second guide pin 17 is made of a metal such as stainless steel, and is formed in a substantially cylindrical shape that extends in the vertical direction and has a larger diameter than the first guide pin 16 . The second guide pin 17 is erected with respect to the bottom plate 7 by fitting the lower end thereof to the large diameter groove 15b of the bottom plate 7. The second guide pin 17 is disposed in each of the blocks 11, and is disposed at four corners so as to overlap the frame portion 23 (described later) of the spacer 5. The second guide pin 17 is inserted into the spacer through hole 21 of the spacer 5 to be described later, and the second through hole 20b of the upper plate 6. Thereby, the second guide pin 17 positions the spacer 5 with respect to the bottom plate 7.

The third guide pin 18 is formed of a metal such as stainless steel, and is formed in a substantially cylindrical shape extending in the vertical direction and having the same diameter as the first guide pin 16 . The third guide pin 18 is erected with respect to the bottom plate 7 by fitting the lower end thereof to the narrow groove 15c of the bottom plate 7. The third guide pin 18 is disposed at the front end portion and the rear end portion of each of the seal sheet regions 13, and is disposed on the right side or the left side with respect to the center in the left-right direction. Specifically, one of the right front end portion and the left rear end portion of each of the sealing sheet regions 13 is disposed. The third guide pin 18 is engaged with a notch portion 22 (described later) of the optical semiconductor component 2 to be described later, and is inserted into the through hole 20 of the upper plate 6. Thereby, the third guide pin 18 positions the optical semiconductor component 2 with respect to the bottom plate 7.

The spring 8 includes a compression coil spring that expands and contracts in the vertical direction, and is erected with respect to the bottom plate 7 by fitting the lower end thereof to the large diameter groove 15d of the bottom plate 7. The spring 8 is attached to each of the blocks 11, and one of the four corners of the opening 10 is disposed. Specifically, two of the edge regions 14 are arranged at intervals in the front-rear direction, and are disposed on a line connecting the first guide pins 16 arranged diagonally. which is, The spring 8 is disposed at a position that does not overlap the sealing sheet region 13 and the spacer region 12.

The spring 8 has a spring constant: for example, under a load of less than 1.0 MPa, preferably less than 0.5 MPa, the shrinkage is, for example, less than 50%, preferably less than 10%, and shrinks under the load above it. 10% or more, preferably 50% or more. When the spring constant is within the above range, the optical semiconductor component 2 can be supported to be spaced apart from the sealing sheet 3, and can be easily compressed by a pressurizing step (described later).

The length of the spring 8 (without load) from the surface of the bottom plate 7 exposed in the upper and lower directions is formed to be longer than the thickness of the sealing sheet 3.

Thereby, the spring 8 supports the optical semiconductor component 2 with respect to the sealing sheet 3 at intervals.

(2) Spacer

As shown in FIG. 1 , FIG. 4A and FIG. 4B , the spacer 5 is formed in a substantially flat plate shape made of a metal such as stainless steel, and includes a frame portion 23 and a partition portion 24 .

The frame portion 23 includes an outer frame portion 25 and a middle frame portion 26 .

The outer frame portion 25 is formed in a substantially frame shape in plan view, and includes two front and rear outer frame portions 25a spaced apart from each other in the left-right direction, and two left and right outer frame portions that connect the front end and the rear end of the two front and rear outer frame portions 25a. 25b.

The middle frame portion 26 includes a plurality of (two) front and rear middle frame portions 26a which are disposed between the two front and rear outer frame portions 25a so as to be substantially equally divided in the left-right direction, and extend in the front-rear direction and are disposed at 2 Between the left and right outer frame portions 25b and at least one of the right and left middle frame portions 26b (one), which are disposed between the two right and left outer frame portions 25b so as to be substantially equally divided in the front-rear direction, and extend in the left-right direction. Moreover, it is placed between the two front and rear outer frame portions 25a. The front and rear middle frame portion 26a and the right and left middle frame portion 26b divide the inside of the outer frame portion 25 into a checkerboard shape, thereby forming a plurality of (six) openings 10. The plurality of openings 10 are arranged in the outer frame portion 25 so as to be arranged in two rows in the front-rear direction and three rows in the left-right direction. Further, corresponding to each of the openings 10, a block 11 including each opening 10 is divided.

The partition portion 24 is formed in a rectangular shape in a plan view that is long in the front-rear direction. The partitioning portion 24 is provided with a plurality of (four) openings 10, and the length from the left and right outer frame portions 25b and the right and left middle frame portions 26b protruding toward the opening 10 in the opening 10 to a length of about 1/4 of the length in the rear direction. They are arranged side by side at intervals in the left-right direction. The partitioning portion 24a that protrudes from the right and left outer frame portions 25b and the partitioning portion 24b that protrudes from the right and left middle frame portions 26b oppose each other in the front-rear direction. The partition portion 24 is disposed between the seal sheet regions 13 adjacent to each other. In other words, in each of the openings 10, a plurality of (two) partition portions 24 that are spaced apart from each other in the left-right direction protrude inward from the front side and protrude inward from the rear side.

Further, in the spacer 5, a plurality of spacer through-holes 21 penetrating in the thickness direction are formed in the frame portion 23.

The plurality of spacer through-holes 21 are disposed corresponding to the second guide pins 17, and are formed such that the second guide pins 17 are inserted when the spacers 5 are placed on the bottom plate 7.

The thickness of the spacer 5 is formed to be thinner than the thickness of the sealing sheet 3. Specifically, the spacer 5 is formed to be thinner than the sealing sheet 3, for example, about 10% or less, preferably about 5% or less, of the thickness of the sealing sheet 3.

(3) Upper board

As shown in FIG. 6A and FIG. 6B, the upper plate 6 is formed of a metal such as stainless steel, and is formed into a flat plate shape having a substantially rectangular shape in plan view extending in the left-right direction and the front-rear direction. The upper plate 6 is formed to have the same size and the same shape as the bottom plate 7 in plan view.

The upper plate 6 is formed with a plurality of first through holes 20a, a plurality of second through holes 20b, and a plurality of third through holes 20c. The plurality of first through holes 20a, the plurality of second through holes 20b, and the plurality of third through holes 20c penetrate the upper plate 6 in the thickness direction.

The plurality of first through holes 20a are disposed corresponding to the first guide pins 16, and are formed to allow the first guide pins 16 to be inserted when the upper plate 6 is placed on the base member 4.

The plurality of second through holes 20b are disposed corresponding to the second guide pins 17, and are formed to allow the second guide pins 17 to be inserted when the upper plate 6 is placed on the base member 4.

The plurality of third through holes 20c are disposed corresponding to the third guide pins 18, and are formed to allow the third guide pins 18 to be inserted when the upper plate 6 is placed on the base member 4.

The thickness of the upper plate 6 is formed to be the thickness of the first guide pin 16, the second guide pin 17, and the third when the upper plate 6 is placed on the optical semiconductor component 2 and subjected to a pressurization step (described later). The guide pin 18 does not protrude from the upper surface of the upper plate 6. Specifically, the thickness of the upper plate 6 is thicker than that of the bottom plate 7, and the upper plate 6 is formed to be thicker than the bottom plate 7, for example, about 5% or more, preferably about 10% or more of the thickness of the bottom plate 7.

Next, a method of manufacturing the optical semiconductor device 30 using the sealing jig 1 will be described with reference to FIGS. 2 to 7. This method is a method of manufacturing the optical semiconductor device 30 by sealing the optical semiconductor component 2 with the sealing sheet 3. This method includes a preparation step of providing the sealing sheet 3 and the optical semiconductor component 2 in the sealing jig 1 and a attaching step of pressurizing the sealing jig 1 after the preparation step.

[Preparation steps]

The preparation step includes the steps of: preparing the base member 4; placing the sealing sheet 3 on the base member 4; and placing the spacer 5 on the base member 4 in such a manner that the sealing sheet 3 is exposed upward; The step of supporting the optical semiconductor component 2 by the spring 8 with respect to the sealing sheet 3 at an interval therebetween; and placing the upper plate 6 on the optical semiconductor component 2 in such a manner as to oppose the base member 4 in the up and down direction The steps.

First, in the preparation step, as shown in FIGS. 2A and 2B, the base member 4 is prepared.

The base member 4 is prepared by fitting the guide pins 16, 17, 18 to the small diameter grooves 15a and 15c and the large diameter groove 15b of the bottom plate 7, and fitting the spring 8 to the large diameter groove 15d.

Next, as shown in FIGS. 3A and 3B, the sealing sheet 3 is placed on the base member 4.

The sealing sheet 3 is provided with a release sheet 31 and a plurality of (four) sealing resin layers 32 laminated on the upper surface of the release sheet 31.

The release sheet 31 is formed into a sheet shape that is substantially rectangular in plan view and extends in the front-rear direction.

In the peeling sheet 31, a plurality of (two) sheet through holes 19 and a plurality of (2) sheets are formed (2) The sheet opening portion 33.

The sheet through-hole 19 is provided so as to correspond to the first guide pin 16, and is formed in a pair of front and rear so that the first guide pin 16 is inserted, specifically, in the center in the left-right direction of the sealing sheet 3. One of the front end portion and the rear end portion is formed.

The sheet opening portion 33 is formed in a rectangular shape in plan view. The sheet opening portion 33 is formed in the right front end portion and the left rear end portion of the sealing sheet 3 so that the sealing sheet 3 is not placed in contact with the third guide pin 18 when the sealing sheet 3 is placed on the base member 4. Specifically, the length of each side of the sheet opening portion 33 is larger than the diameter of the third guide pin 18.

The release sheet 31 is made of, for example, a resin such as a polyethylene terephthalate film, a polystyrene film, a polypropylene film, a polycarbonate film, an acrylic film, an anthrone resin film, a styrene resin film, or a fluororesin film. Film formation. Further, the surface of the release sheet 31 may also be subjected to a mold release treatment.

The thickness of the release sheet 31 is, for example, 20 μm or more, preferably 30 μm or more, and is, for example, 100 μm or less, preferably 50 μm or less.

The sealing resin layer 32 is formed in a sheet shape having a substantially circular shape in plan view. A plurality of (four) sealing resin layers 32 are interposed between the pair of front and rear sheet through-holes 19, and are laminated on the upper surface of the release sheet 31 at intervals in the front-rear direction.

The sealing resin layer 32 is formed of a sealing resin composition containing a sealing resin.

The sealing resin may, for example, be a thermoplastic resin plasticized by heating, for example, a thermosetting resin which is cured by heating, for example, an active energy ray which is hardened by irradiation with an active energy ray (for example, ultraviolet rays, electron beams, etc.). Curable resin, etc.

Examples of the thermoplastic resin include a vinyl acetate resin, an ethylene-vinyl acetate copolymer (EVA), a vinyl chloride resin, and an EVA-vinyl chloride resin copolymer.

Examples of the thermosetting resin and the active energy ray-curable resin include an anthrone resin, an epoxy resin, a polyimide resin, a phenol resin, a urea resin, a melamine resin, and an unsaturated polyester resin. As the sealing resin, a thermosetting resin is preferable, and A good example is the ketone resin.

In addition, examples of the sealing resin composition containing the fluorenone resin as the sealing resin include a thermosetting ketone resin composition such as a two-stage curing fluorenone resin composition and a one-stage curing fluorenone resin composition.

The two-stage hardening type fluorenone resin composition has a two-stage reaction mechanism, and is subjected to a B-stage (semi-hardening) in the first-stage reaction, and a C-stage (final hardening) in the second-stage reaction. A thermosetting ketone resin composition.

Further, the B-stage sealing resin composition is soluble in a state between the A-stage of the solvent and the C-stage of the final hardening, and is slightly hardened and gelled, and is swollen in a solvent but does not completely dissolve. It is softened by heating but does not melt.

The two-stage curing type fluorenone resin composition may, for example, be a condensation reaction/addition reaction-curable fluorenone resin composition.

Further, in the sealing resin composition, a phosphor or a filler may be contained in an appropriate ratio as needed.

Examples of the phosphor include a yellow phosphor that converts blue light into yellow light. Examples of such a phosphor include a phosphor doped with a metal atom such as cerium (Ce) or europium (Eu) in a composite metal oxide or a metal sulfide.

Specifically, examples of the phosphor include Y ₃ Al ₅ O ₁₂ :Ce (YAG (Yttrium Aluminum Garnet): Ce).

The sealing resin layer 32 is preferably of the B-stage and has a hardness of, for example, a compressive elastic modulus of, for example, 0.025 MPa or more, and further, for example, 0.15 MPa or less.

Further, the sealing resin layer 32 is formed to have a larger diameter than the optical semiconductor element 35 (described later) when projected in the vertical direction, and has a diameter of, for example, 1 mm or more and 100 mm or less.

Further, the thickness of the sealing resin layer 32 is, for example, 100 μm or more, and is, for example, 1000 μm or less, or preferably 800 μm or less.

The thickness of the sealing sheet 3 (that is, from the lower surface of the peeling sheet 31 to the sealing resin layer 32) The distance from the upper surface is larger than the thickness of the spacer 5, and the difference L1 between the thicknesses thereof is, for example, 1 μm or more, preferably 50 μm or more, and is, for example, 500 μm or less, preferably 100 μm or less.

Specifically, the sealing sheet 3 is placed on the sealing sheet region 13 such that the release sheet 31 is on the lower side. At this time, the sealing sheet 3 is placed so that the first guide pin 16 is inserted into the sheet through-hole 19 . Thereby, the sealing sheet 3 is positioned with respect to the bottom plate 7 by the 1st guide pin 16. In addition, the third guide pin 18 does not come into contact with the end edge of the sheet opening portion 33, but penetrates the sheet opening portion 33 in the thickness direction with play.

Next, as shown in FIG. 4A and FIG. 4B, the spacer 5 is placed on the base member 4 so that the sealing sheet 3 is exposed upward. Specifically, the spacer 5 is placed on the spacer region 12 of the base member 4. At this time, the spacer 5 is placed in the spacer region 12 such that the second guide pin 17 is inserted into the spacer through hole 21. Thereby, the spacer 5 is positioned with respect to the bottom plate 7 by the second guide pin 17. Therefore, the sealing sheet 3 is exposed upward from the opening 10 of the spacer 5. Specifically, in each of the blocks 11, a plurality of (three) sealing sheets 3 arranged at intervals in the left-right direction are disposed in the opening 10 so as to be partitioned by the partition portion 24.

Then, as shown in FIGS. 5A and 5B, the optical semiconductor component 2 is supported by the spring 8 at intervals above the sealing sheet 3 (support step).

The optical semiconductor component 2 includes a circuit board 34 and a plurality of (12) optical semiconductor elements 35 supported on the surface (lower surface) of the circuit board 34.

The circuit board 34 has a substantially flat plate shape having a substantially rectangular shape in plan view, and includes a ceramic substrate such as alumina, a resin substrate such as polyimide, and a metal core substrate using a metal plate for the core, and the like, which is generally used for the optical semiconductor device 30.

A notch portion 22 is formed in the circuit board 34. The notch portion 22 is provided corresponding to the third guide pin 18, and a plurality of (three) are formed at intervals between the front end edge and the rear end edge. The notch portion 22 is formed in a substantially semi-arc shape in plan view so that the inner portion of the third guide pin 18 abuts.

The circuit board 34 includes a conductor pattern 38 on its surface (lower surface). The conductor pattern 38 has a pair of external electrodes 36 connected to an external power source (not shown), a wiring 37, and an internal electrode (not shown). It is electrically connected to the optical semiconductor element 35.

The conductor pattern 38 is connected to the circuit board 34, and a plurality of (four) are arranged side by side in the longitudinal direction, and a plurality of (three) are arranged side by side in the lateral direction, that is, the array is arranged. There are a total of 12 configurations.

The optical semiconductor element 35 is formed in a substantially circular disk shape having a smaller diameter than the sealing resin layer 32, and a plurality of (four) are arranged side by side in the front-rear direction on the upper surface of the circuit board 34, and A plurality of (three) are arranged side by side in the left-right direction, that is, a total of twelve are arranged. The optical semiconductor element 35 is disposed corresponding to each of the conductor patterns 38. Specifically, each of the optical semiconductor elements 35 is disposed so as to be interposed between the corresponding one of the pair of external electrodes 36.

The optical semiconductor element 35 is supplied with electric power from an internal electrode (not shown) by wire bonding (not shown) or flip chip mounting (not shown) to an internal electrode (not shown). Glowing.

The thickness of the optical semiconductor element 35 is equal to or smaller than the difference L1 between the thicknesses of the sealing sheet 3 and the spacer 5, and is, for example, 1 μm or more, preferably 50 μm or more, and is, for example, 200 μm or less, preferably 100 μm or less.

The optical semiconductor element 35 is, for example, a light-emitting diode, specifically, an optical semiconductor element (particularly a blue light-emitting diode element) that emits blue light.

In the supporting step, specifically, the optical semiconductor element 35 is placed below, and the four corners of the circuit board 34 are placed on the upper end of each spring 8 in each block 11. At this time, the optical semiconductor component 2 is placed such that the notch portion 22 of the circuit board 34 comes into contact with the inner side of the third guide pin 18. Thereby, the optical semiconductor component 2 is positioned with respect to the bottom plate 7, and the optical semiconductor component 2 and the sealing sheet 3 can be disposed to face each other in the vertical direction without the optical semiconductor element 35 being in contact with the sealing resin layer 32.

In addition, when the projection is in the vertical direction, the semiconductor element 35 and the sealing resin layer 32 are concentrically overlapped, and the pair of external electrodes 36 are disposed on the outer side of the sealing resin layer 32 with the sealing resin layer 32 interposed therebetween. Configuration.

When projecting in the vertical direction, both ends of the circuit board 34 in the left-right direction overlap one of the spacers 5 with respect to the front and rear outer frame portions 25a, and both ends of the circuit board 34 in the front-rear direction overlap the partition portion 24.

Next, as shown in FIGS. 6A and 6B, the upper plate 6 is placed on the optical semiconductor component 2.

At this time, the upper plate 6 is placed on the circuit board 34 such that the first guide pin 16, the second guide pin 17, and the third guide pin 18 are inserted into the through holes 20 (20a, 20b, 20c) of the upper plate 6. Above the surface. Thereby, the upper plate 6 is positioned relative to the bottom plate 7. Further, when the upper plate 6 is placed on the optical semiconductor component 2, the spring 8 is slightly compressed by the weight of the upper plate 6, that is, the distance L2 between the optical semiconductor element 35 and the sealing resin layer 32 is slightly close, but the optical semiconductor The component 2 is disposed opposite to the sealing sheet 3 while the optical semiconductor element 35 is not in contact with the sealing resin layer 32. Further, the distance L2 between the optical semiconductor element 35 and the sealing resin layer 32 is, for example, 0.5 mm or more, preferably 1 mm or more, and is, for example, 4 mm or less, preferably 2 mm or less.

Thereby, the sealing sheet 3 and the optical semiconductor component 2 are provided in the sealing jig 1.

[attachment steps]

The attaching step has a pressurizing step of pressing the upper plate 6 against the elastic force of the spring 8 until the movement of the upper plate 6 is restricted by the spacer 5.

Specifically, as shown in FIG. 6B, the sealing jig is horizontally placed on the upper surface of the lower plate presser lower plate 40 (the imaginary line of FIG. 6B), and thereafter, as shown in FIG. 7, will be parallel The plate press upper plate 41 (the imaginary line of Fig. 7) pressurizes the upper plate 6 from the upper side downward.

At this time, the upper plate 6 is pressed downward until the optical semiconductor component 2 comes into contact with the spacer 5, specifically, until the lower surface of the circuit substrate 34 comes into contact with the upper surface of the spacer 5. Thereby, the sealing resin layer 32 is in contact with the optical semiconductor component 2, that is, the optical semiconductor component 35. The surface (lower surface and side surface) and the lower surface of the circuit board 34. In other words, the optical semiconductor element 35 is sealed by the sealing resin layer 32.

As a condition at the time of pressurization, the temperature is, for example, normal temperature. Further, it can be carried out, for example, under vacuum or reduced pressure, and is, for example, 5 hPa or less, preferably 3 hPa or less.

The pressurization pressure is, for example, 0.1 MPa or more, preferably 0.2 MPa or more, and is, for example, 1.0 MPa or less, preferably 0.8 MPa or less.

The pressurization time is, for example, 0.1 minute or longer, preferably 0.4 minute or longer, and for example, 2 minutes or shorter, preferably 1 minute or shorter.

In this way, the optical semiconductor device 30 in which the sealing sheet 3 is laminated on the optical semiconductor component 2, that is, the optical semiconductor device 35 is sealed by the sealing resin layer 32, and the optical semiconductor having the peeling sheet 31 on the surface area of the sealing resin layer 32 is formed. Device 30.

Then, the optical semiconductor device 30 is recovered from the sealing jig 1 and the step of heat-curing the optical semiconductor device 30 is performed when the sealing resin layer 32 contains a thermosetting resin.

Specifically, the heating temperature is, for example, 80 ° C or higher, preferably 100 ° C or higher, and further, for example, 200 ° C or lower, preferably 180 ° C or lower. The heating time is, for example, 0.1 hour or longer, preferably 1 hour or longer, and for example, 20 hours or shorter, preferably 10 hours or shorter.

[Effect]

Further, according to the sealing jig 1 and the manufacturing method of the optical semiconductor device 30 using the same, when the sealing sheet 3 and the optical semiconductor component 2 are placed on the sealing jig, as shown in FIG. 6B, with respect to the sealing sheet The optical semiconductor component 2 is supported by the spring 8 at a distance L2 from above. Therefore, the sealing sheet 3 and the optical semiconductor component 2 are arranged at intervals in the vertical direction. As a result, even if the sealing jig 1 in which the sealing sheet 3 and the optical semiconductor component 2 are provided is conveyed, the optical semiconductor element 35 supported by the optical semiconductor component 2 can be prevented from strongly contacting the peeling sheet of the sealing sheet 3. The surface of 31, thereby preventing the optical semiconductor element 35 damage. Therefore, it is excellent in handling property.

Moreover, as shown in FIG. 7, the sealing jig 1 is provided with the spacer 5 which has the thickness thinner than the sealing sheet 3. Therefore, the photo-semiconductor part 2 comes into contact with the spacer 5 during pressurization, whereby the distance between the sealing sheet 3 and the photo-semiconductor part 2 can be restricted. As a result, the optical semiconductor element 35 can be accurately sealed by the sealing sheet 3.

Further, since the member configured to support the optical semiconductor component 2 is the spring 8, when the pressing force from the upper plate 6 is applied during pressurization, the spring 8 is easily compressed. Therefore, it is possible to easily pressurize without removing the spring 8 after the conveyance.

Further, the sealing jig 1 includes a first guide pin 16 which is provided on the bottom plate 7, and positions the sealing sheet 3 with respect to the bottom plate 7, and a second guide pin which is provided on the bottom plate 7, and the spacer 5 is opposed to the bottom plate 7 and positioning; and a third guide pin 18, which is disposed on the bottom plate 7, and positions the optical semiconductor component 2 relative to the bottom plate 7.

Therefore, each of the sealing sheet 3, the spacer 5, and the optical semiconductor component 2 can be placed at an accurate position with respect to the bottom plate 7. Therefore, the optical semiconductor element 35 can be accurately sealed by the sealing sheet 3.

Further, in the sealing jig 1, the sealing sheet region 13 on which the sealing sheet 3 is placed and the spacer region 12 on which the spacer 5 is placed are divided on the surface of the bottom plate 7, and the spring 8 is attached to the sealing sheet region 13 The spacer regions 12 are disposed at an edge region 14 at intervals.

Therefore, the spring 8 can be prevented from coming into contact with the spacer 5 and the sealing sheet 3. Therefore, the spring 8 can surely support the optical semiconductor component 2.

(variation)

A modification of the sealing jig 1 will be described with reference to Figs. 8 and 9 . In the modified example, members that are the same as those in the above-described embodiment are denoted by the same reference numerals, and their description is omitted.

In the embodiment shown in FIG. 1 to FIG. 7, the spacer 5 has a substantially rectangular frame shape in plan view and includes the frame portion 23 and the partition portion 24. However, for example, as shown in FIG. A plurality of spacers 5 having a shape.

That is, in the embodiment of FIG. 8, the spacer 5 is provided with the first spacer 51 and the second spacer 52.

The first spacer 51 has a substantially flat strip shape having a substantially rectangular shape in plan view, and is formed to have a thickness thinner than the thickness of the sealing sheet 3 . In the first spacer 51, a plurality of (two) spacer through holes 21 penetrating in the thickness direction are formed.

The spacer through-holes 21 of the first spacers 51 are provided at one end portion in the left-right direction of the first spacer 51, that is, two in total.

The second spacer 52 has a substantially flat strip shape having a substantially rectangular shape in plan view, and is formed to have a thickness thinner than the thickness of the sealing sheet 3 . In the second spacer 52, a plurality of (two) spacer through holes 21 penetrating in the thickness direction are formed.

The spacer through-holes 21 of the second spacers 52 are provided at one of the two ends in the left-right direction of the second spacer 52, that is, two in total.

The second guide pins 17 are disposed at four corners of the bottom plate 7 so as to overlap the spacers 5, respectively. The second guide pin 17 is inserted into the spacer through hole 21 of the spacer 5 and the second through hole 20b of the upper plate 6.

According to the sealing jig 1, it is a simpler device and also exhibits the same operational effects as those of the embodiment of Fig. 1.

Further, according to the embodiment of FIG. 8, since the spacer 5 does not include the intermediate frame portion 26 and the partition portion 24, the area of the spacer 5 placed on the bottom plate 7 (i.e., the spacer region 12) is reduced, so that the spacer 5 can be increased. The sheet area 13 is sealed, or the degree of freedom of the shape of the sealing sheet area 13 is increased.

In the embodiment shown in FIGS. 1 to 7, the first guide pin 16, the second guide pin 17, and the third guide pin 18 are formed in a substantially cylindrical shape extending in the vertical direction, but for example, as shown in FIG. The first guide pin 16, the second guide pin 17, and the third guide pin 18 are formed in a substantially conical ladder shape extending in the vertical direction.

That is, in the embodiment of Fig. 9, the first guide pin 16, the second guide pin 17, and the third guide pin 18 are formed in a substantially trapezoidal shape in a cross-sectional view in which the diameter is reduced toward the upper side.

According to the embodiment of Fig. 9, after the optical semiconductor element 35 is sealed by the sealing sheet 3, the sealing sheet 3, the spacer 5, and the upper plate 6 can be easily attached and detached from the bottom plate 7.

In the embodiment shown in FIGS. 1 to 7, the upper surface of the spacer 5 is formed flat. Although not shown, for example, the inner side of the spacer 5 may be formed on the upper surface of the spacer 5 (opening 10). ) A groove that communicates with the outside. The grooves may also be formed in plural, and may be formed into a radial shape. According to such a groove, it can be used as a discharge passage. That is, when the sealing resin layer 32 is excessively present, the material of the sealing resin layer 32 leaking from the sealing sheet region 13 can be excluded to the outside of the spacer 5 via the groove at the time of pressurization.

In the embodiment shown in FIGS. 1 to 7, the circuit board 34 is in contact with the spacer 5, and the movement of the upper plate 6 is restricted by the spacer 5. Although not shown, the upper plate 6 may be used, for example. Contact with the spacer 5, and the movement of the upper plate 6 is restricted by the spacer 5.

In the embodiment, as the circuit board 34, the circuit board 34 which is not in contact with the spacer 5 at the time of pressurization, that is, the circuit board 34 which does not overlap the spacer 5 when projected in the vertical direction is used. Further, the preparation steps and the support steps are the same as those of the embodiment shown in FIGS. 1 to 7, and secondly, in the attaching step, the upper plate 6 is pressed downward until the lower surface of the upper plate 6 contacts the spacer 5 Up to the top surface.

In this embodiment, the upper plate 6 is in contact with the spacer 5 at the time of pressurization, whereby the distance between the sealing sheet 3 and the optical semiconductor component 2 can also be restricted, so that the optical semiconductor element 35 can be accurately sealed by the sealing sheet 3. . Therefore, this embodiment exerts the same operational effects as those of the embodiment of Figs. 1 to 7 .

Furthermore, the invention described above is provided as an exemplified embodiment of the invention, and is merely illustrative and not restrictive. Variations of the invention that are apparent to those skilled in the art are included in the scope of the appended claims.

[Industrial availability]

The attaching jig of the present invention can be preferably used as, for example, an attaching jig for attaching a resin sheet to an electronic component such as an optical semiconductor element. The method of manufacturing an electronic device of the present invention can be preferably applied to, for example, an electronic device in which an electronic component such as an optical semiconductor element is attached with a resin sheet.

2‧‧‧Light semiconductor parts

3‧‧‧Seal sheet

4‧‧‧Base member

5‧‧‧ spacers

6‧‧‧Upper board

7‧‧‧floor

8‧‧‧ Spring

15a‧‧‧Small groove

15b‧‧‧Rough path slot

15c‧‧‧small groove

15d‧‧‧Rough path slot

16‧‧‧1st guide

17‧‧‧2nd guide

18‧‧‧3rd sales guide

20a‧‧‧1st through hole

20b‧‧‧2nd through hole

20c‧‧‧3rd through hole

23‧‧‧ Frame Department

25a‧‧‧ Front and rear frame

26b‧‧‧ about the middle frame

31‧‧‧ peeling sheet

32‧‧‧ sealing resin layer

34‧‧‧ circuit board

35‧‧‧Optical semiconductor components

36‧‧‧External electrode

37‧‧‧Wiring

38‧‧‧Conductor pattern

40‧‧‧ parallel plate presser lower plate

41‧‧‧parallel plate presser upper plate

L2‧‧‧ Distance between the optical semiconductor component 35 and the sealing resin layer 32

Claims (4)

An attachment jig for attaching a resin sheet to an electronic component, comprising: a lower plate configured to mount a resin sheet; and an intermediate plate configured to make the resin The sheet is placed on the lower plate and has a thickness thinner than the thickness of the resin sheet; and the elastic member is configured to support the above with respect to the resin sheet at intervals The electronic component; and the upper plate are configured to be placed on the electronic component so as to face the lower plate in the vertical direction. The attaching jig according to claim 1, comprising: a first positioning member provided on the lower plate to position the resin sheet with respect to the lower plate; and a second positioning member provided on the lower plate. The intermediate plate is positioned relative to the lower plate; and the third positioning member is disposed on the lower plate to position the electronic component relative to the lower plate. The attaching jig of claim 1, wherein a resin sheet region on which the resin sheet is placed and an intermediate plate region on which the intermediate plate is disposed are partitioned on a surface of the lower plate, and the elastic member is bonded to the resin The sheet region and the intermediate plate region are provided on the lower plate at intervals. A method of manufacturing an electronic device, characterized in that it is a method of manufacturing an electronic device in which a resin sheet is attached to an electronic component, and includes a preparation step of arranging the resin sheet and the electronic component on the attached device a jig; and an attaching step of pressurizing the attaching jig after the preparing step; the preparing step comprising: placing the resin sheet on the lower plate; and applying the resin sheet upward a method of placing an intermediate plate having a thickness thinner than a thickness of the resin sheet on the lower plate in a manner of being exposed; supporting the above by an elastic member at intervals with respect to the resin sheet And the step of placing the upper plate on the electronic component in a manner opposite to the lower plate in the up-and-down direction; and in the attaching step, resisting the elastic force of the elastic member, The plate is pressurized until the movement of the upper plate is restricted by the intermediate plate, whereby the electronic component is brought into contact with the resin sheet.