JP5902291B2 - Sealing sheet and manufacturing method thereof - Google Patents

Description

  The present invention relates to a sealing sheet and a method for manufacturing the same, and more particularly to a method for manufacturing a sealing sheet and a sealing sheet manufactured thereby.

  Conventionally, it is known to seal an optical semiconductor element such as a light emitting diode (LED) with a sealing sheet.

  For example, an encapsulating sheet in which a sealing resin layer containing particles such as phosphors and silica is laminated on a long release sheet so as to be continuous in the longitudinal direction is arranged at an interval in the longitudinal direction. A method has been proposed in which a sealing resin layer is disposed opposite to a plurality of LEDs to seal the LEDs (see, for example, Patent Document 1 below).

JP 2012-142364 A

  However, the sealing resin layer (that is, the sealing region) located relatively close to each optical semiconductor element contributes to sealing of the optical semiconductor element by covering the upper surface and side surfaces of the optical semiconductor element. On the other hand, a sealing resin layer positioned relatively remotely with respect to each optical semiconductor element, specifically, a sealing resin layer positioned in the center (in the middle of the longitudinal direction) between adjacent optical semiconductor elements (that is, non-blocking resin layer) The sealing region) does not substantially contribute to the sealing of the optical semiconductor element. Therefore, the sealing resin layer in the non-sealing region becomes an unnecessary region in the sealing of the optical semiconductor element, and accordingly, the yield of the sealing resin layer containing the above-described particles is lowered. As a result, there exists a malfunction that the manufacturing cost of a sealing sheet increases.

  On the other hand, it is also devised to remove the above-described non-sealing region after once forming the sealing resin layer, but the sealing resin layer contains a resin and an additive in addition to the above-described particles. It is difficult to recover and reuse only the particles from the removed non-sealed region. Therefore, there is still a problem that it is impossible to prevent a decrease in the yield of the sealing resin layer due to the formation of the non-sealing region and an increase in the manufacturing cost of the sealing sheet due to the yield.

  The objective of this invention is improving the yield of a sealing layer, and providing the manufacturing method of a sealing sheet which can reduce the manufacturing cost of a sealing sheet, and the sealing sheet manufactured by it. .

  In order to achieve the above object, a manufacturing method of a sealing sheet of the present invention is a manufacturing method of a sealing sheet including a plurality of sealing members arranged at intervals in a first direction, wherein the first The sealing layer forming step of forming a sealing layer containing particles so as to be continuous in one direction, and after the sealing layer forming step, the sealing layer is divided into a plurality of portions in the first direction. A cutting step of cutting a sealing layer to form a plurality of the sealing members, and an arrangement in which the plurality of sealing members are arranged so as to be spaced apart from each other in the first direction after the cutting step. It is characterized by comprising a process.

  In the manufacturing method of the sealing sheet, the sealing layer is cut so that the sealing layer is divided into a plurality of parts in the first direction to form a plurality of sealing members. It arrange | positions so that it may mutually space apart in one direction. Therefore, since the plurality of sealing members after cutting are arranged so as to be spaced apart from each other in the first direction by a simple method, the sealing layer formed so as to be continuous in the first direction is effectively used. can do. Therefore, the yield of a sealing layer can be improved and the manufacturing cost of a sealing sheet can be reduced.

  Moreover, in the manufacturing method of the sealing sheet of this invention, the said sealing layer formation process WHEREIN: By forming the said sealing layer on the surface of the 1st base material sheet continuous in the said 1st direction, the said sealing is performed. Forming a laminated sheet comprising a layer and the first base sheet, and in the cutting step, cutting the laminated sheet so that the laminated sheet is divided into a plurality of pieces in the first direction, whereby the sealing layer It is preferable to form the sealing member from the first base sheet.

  According to this method for producing a sealing sheet, in the sealing layer forming step, a laminated sheet including the sealing layer and the first base sheet is formed, so that the sealing layer can be supported by the first base sheet. Then, since the laminated sheet is cut in the cutting step, the handleability of the sealing layer can be improved, and the accuracy of cutting the sealing layer in the cutting step can be improved.

  Moreover, in the manufacturing method of the sealing sheet of this invention, in the said arrangement | positioning process, the said 1st direction is provided on the surface of the 2nd base material sheet formed continuously in the said 1st direction in the said some sealing member. It is preferable to arrange them at a distance from each other.

  In this sealing sheet manufacturing method, since the plurality of sealing members are arranged on the surface of the second base sheet, the accuracy of the arrangement of the plurality of sealing members can be improved. Therefore, a plurality of optical semiconductor elements can be accurately sealed by a plurality of sealing members.

  Moreover, in the manufacturing method of the sealing sheet of this invention, it is suitable for particle | grains to contain fluorescent substance.

  In this method for producing a sealing sheet, the yield of particles containing a phosphor can be improved.

  The method for producing a sealing sheet of the present invention includes a sealing layer forming step of forming a sealing layer containing particles along a second direction that is spaced from each other in the first direction and intersects the first direction. And a cutting step of cutting the sealing layer so that the sealing layer is divided into a plurality of parts in the second direction.

  In the manufacturing method of this sealing sheet, since the sealing layer containing particles is formed along the second direction that is spaced from each other in the first direction and intersects the first direction, the sealing layer is then formed. The sealing layer can be used effectively if sealing is performed on the objects to be sealed that are spaced from each other in the first direction. Therefore, the yield of a sealing layer can be improved and the manufacturing cost of a sealing sheet can be reduced.

  In the method for producing a sealing sheet of the present invention, it is preferable that in the sealing layer forming step, the sealing layer is formed by applying a sealing composition along the second direction.

  In this sealing sheet manufacturing method, in the sealing layer forming step, the sealing layer is formed by applying the sealing composition along the second direction, so the sealing layer along the second direction is efficiently used. Can be well formed.

  Further, in this method, after the sealing layer forming step of applying the sealing composition along the second direction, a cutting step of cutting the sealing layer so that the sealing layer is divided into a plurality of portions in the second direction. Since it implements, the yield of the sealing layer in a 2nd direction can be improved, and the manufacturing cost of a sealing sheet can be reduced.

  The method for producing a sealing sheet of the present invention includes a step of cutting the sealing layer so as to partition a sealing region corresponding to a sealing target, and removing the sealing layer outside the sealing region. It is preferable to further include a step.

  In this method for producing a sealing sheet, the sealing layer is cut and the sealing layer outside the sealing region is removed so as to partition the sealing region corresponding to the target to be sealed. It can be used effectively.

  In the manufacturing method of the sealing sheet of this invention, it is suitable for particle | grains to contain fluorescent substance.

  In this method for producing a sealing sheet, since the particles contain the phosphor, the yield of the particles containing the phosphor can be improved.

  The sealing sheet of the present invention further comprises a step of continuously forming a phosphor-free sealing layer containing no particles in the first direction, and in the sealing layer forming step, the sealing layer is The phosphor-free sealing layer is laminated, and in the cutting step, the phosphor-free sealing layer is divided into a plurality of the phosphor-free sealing layers together with the sealing layer in the second direction. Thus, it is preferable to cut.

  Since the phosphor-free encapsulating layer does not contain a phosphor, the phosphor-free encapsulating layer can be manufactured at low cost even if the phosphor-free encapsulating layer is continuously formed in the first direction. Can do. Therefore, if such a phosphor-free sealing layer is formed and the sealing layer is laminated on the phosphor-free sealing layer, a sealing sheet having various physical properties can be configured.

  In addition, the sealing sheet of the present invention is disposed on the surface of the second base sheet and the second base sheet formed so as to be continuous in the first direction, and spaced from each other in the first direction. A plurality of sealing members, wherein the plurality of sealing members are laminated on the surface of the second base material sheet, and are laminated on the surface of the first base material sheet. It is characterized by providing the sealing layer containing this.

  In this sealing sheet, the sealing layer is formed by a second base material sheet that is formed so as to be continuous in the first direction, via the first base material sheet that is arranged at an interval in the first direction, Can be supported. Therefore, the sealing layer can be flexibly supported by the first base sheet and the second base sheet while reducing the manufacturing cost.

  The sealing sheet of the present invention includes a base sheet that is continuous in a first direction and a plurality of sealing members that are spaced apart from each other in the first direction, and the plurality of sealing members are It is characterized by comprising a phosphor-free encapsulating layer laminated on the surface of the substrate sheet, and a encapsulating layer containing particles laminated on the surface of the phosphor-free encapsulating layer.

  This sealing sheet can have various physical properties by the phosphor-free sealing layer and the sealing layer.

  In the manufacturing method of the sealing sheet of this invention, the yield of a sealing layer can be improved and the manufacturing cost of a sealing sheet can be reduced.

  The sealing sheet of this invention can support a sealing layer flexibly with a 1st base material sheet and a 2nd base material sheet, reducing manufacturing cost. Moreover, the sealing member which has various physical properties can be comprised.

FIG. 1 shows a sealing layer forming step of a first embodiment of the method for producing a sealing sheet of the present invention, FIG. 1A is a perspective view, and FIG. 1B is a side sectional view. FIG. 2 shows a first cutting step of the first embodiment of the method for producing a sealing sheet of the present invention, FIG. 2A is a perspective view, and FIG. 2B is a side sectional view. FIG. 3 shows the peeling process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention, FIG. 3A shows a perspective view, FIG. 3B shows a sectional side view. FIG. 4: shows the mounting process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention, FIG. 4A shows a perspective view, FIG. 4B shows a sectional side view. FIG. 5: shows the 2nd cutting process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention, FIG. 5A shows a perspective view, FIG. 5B shows a side sectional view. FIG. 6 shows a removing step of the first embodiment of the method for producing a sealing sheet of the present invention, FIG. 6A is a perspective view, and FIG. 6B is a side sectional view. FIG. 7 shows a third cutting step of the first embodiment of the method for producing a sealing sheet of the present invention, FIG. 7A is a perspective view, FIG. 7B is a side sectional view, and FIG. 7C is a plan view. FIG. 8 shows the recovery process of the first embodiment of the method for producing a sealing sheet of the present invention, FIG. 8A is a perspective view, FIG. 8B is a front sectional view, FIG. 8C is a side sectional view, and FIG. FIG. FIG. 9 shows a method of encapsulating the optical semiconductor element with the encapsulating sheet of FIG. 8, FIG. 9A is a process of arranging the encapsulating sheet opposite to the substrate on which the optical semiconductor element is mounted, and FIG. 9B is an encapsulating sheet. The process of sealing an optical semiconductor element with a stop sheet, FIG. 9C shows the process of removing a 2nd base material sheet, an adhesive bond layer, and a 1st base material sheet. FIG. 10: shows the top view of the sealing sheet manufactured by the modification (mode provided with the positioning mark) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. FIG. 11: shows the top view of the sealing sheet manufactured by the modification (mode provided with the positioning mark) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. FIG. 12: shows the top view of the sealing sheet manufactured by the modification (embodiment whose sealing layer is substantially elliptical shape) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. FIG. 13: shows the top view of the sealing sheet manufactured by the modification (the aspect whose sealing layer is substantially hexagonal shape) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. FIG. 14: shows the top view of the sealing sheet manufactured by the modification (the aspect whose sealing layer is substantially rectangular shape) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. FIG. 15 shows the third cutting step of the second embodiment of the method for producing the sealing sheet of the present invention, FIG. 15A is a perspective view, FIG. 15B is a side sectional view, and FIG. 15C is a plan view. FIG. 16 shows the collection process of the second embodiment of the method for producing a sealing sheet of the present invention, FIG. 16A is a perspective view, FIG. 16B is a front sectional view, FIG. 16C is a side sectional view, and FIG. FIG. FIG. 17: shows the perspective view of the 1st cutting process and peeling process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention. FIG. 18: shows the perspective view of the mounting process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention. FIG. 19: shows the perspective view of the 2nd cutting process and removal process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention. FIG. 20: shows the perspective view of the 3rd cutting process and collection | recovery process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention. FIG. 21 shows a manufacturing process diagram (perspective view) of the fourth embodiment of the manufacturing method of the sealing sheet of the present invention, and FIG. 21A shows a sealing layer forming process (process for preparing a base sheet), FIG. FIG. 21C shows a sealing layer forming step (step of providing a sealing layer) and FIG. 21C shows a cutting step. FIG. 22 is a process diagram (side sectional view) illustrating a method for encapsulating an optical semiconductor element with the encapsulating sheet of the fourth embodiment, and FIG. 22A is a process for preparing a substrate on which the optical semiconductor element is mounted. FIG. 22B is a step of sealing the optical semiconductor element with a sealing sheet, and FIG. 22C is a step of removing the base sheet from the sealing layer. The process of peeling is shown. FIG. 23 is a perspective view of a modification of the fourth embodiment. FIG. 23A is a step of cutting the sealing layer into a substantially circular shape, and FIG. 23B is a step of removing the sealing layer outside the sealing region. Process, FIG. 23C shows the cutting process. FIG. 24: shows the manufacturing process figure (perspective view) of 5th Embodiment of the manufacturing method of the sealing sheet of this invention, FIG. 24A is a fluorescent substance-free sealing layer formation process (process which prepares a base material sheet) 24B is a phosphor-free sealing layer forming step (step of providing a phosphor-free sealing layer). FIG. 24C is a sealing layer forming step, and FIG. 24D is a cutting step. FIG. 25 is a process diagram (side sectional view) illustrating a method for encapsulating an optical semiconductor element with the encapsulating sheet of the fifth embodiment, and FIG. 25A is a process of preparing a substrate on which the optical semiconductor element is mounted. And a step of arranging each sealing layer so as to face the optical semiconductor element, FIG. 25B is a step of sealing the optical semiconductor element with a sealing sheet, and FIG. 25C is a phosphor-free substrate sheet. The process of peeling off from a sealing layer is shown. FIG. 26 is a perspective view of a modification of the fifth embodiment. FIG. 26A is a step of cutting the sealing layer into a substantially circular shape, and FIG. 26B is a step of removing the sealing layer outside the sealing region. Process, FIG. 26C shows the cutting process. FIG. 27 is a process diagram (side sectional view) illustrating a method for sealing an optical semiconductor element by a modification of the sealing sheet of the fifth embodiment. FIG. 27A illustrates a substrate on which the optical semiconductor element is mounted. Step of preparing, step of arranging each sealing layer so as to face the optical semiconductor element, FIG. 27B is a step of sealing the optical semiconductor element with a sealing sheet, and FIG. The process of peeling off from a body-free sealing layer is shown.

<First Embodiment>
The front-rear direction (or vertical direction) indicated by the arrows in FIG. 1A is an example of a first direction, and the left-right direction (or horizontal direction) indicated by the arrows in FIG. 1A is an example of a second direction orthogonal to the first direction. Yes, the up-down direction indicated by the arrows in FIG. 1A is an example (or thickness direction) of a third direction orthogonal to the first direction and the second direction. For the drawings other than FIG. 1A, the direction of FIG. 1A is used as a reference unless otherwise specified.

  As shown in FIGS. 1-8, the manufacturing method of the sealing sheet 1 which is 1st Embodiment of this invention is the 1st cutting process (FIG. 2) as a sealing layer formation process (refer FIG. 1) and a cutting process. Reference), placement step (see FIGS. 3 and 4), second cutting step (see FIG. 5), removal step (see FIG. 6), third cutting step (see FIG. 7), and recovery step (see FIG. 8). ).

[Sealing layer forming step]
In the sealing layer forming step, as shown in FIGS. 1A and 1B, first, a laminated base sheet 2 is prepared.

  The laminated base sheet 2 is formed in a substantially rectangular flat plate shape extending in the front-rear direction (vertical direction) and the left-right direction (lateral direction). The laminated substrate sheet 2 includes a first substrate sheet 3, an adhesive layer 4 laminated on the lower surface of the first substrate sheet 3, and a release sheet 5 laminated on the lower surface of the adhesive layer 4. .

  The first base sheet 3 has an outer shape in a plan view of the laminated base sheet 2, and is specifically formed in a substantially rectangular flat plate shape that is continuous in the front-rear direction and the left-right direction. The first base sheet 3 is formed of a material that can support the sealing layer 6 described below. Examples of such a material include polyethylene terephthalate, polyester of polyethylene terephthalate, such as polyethylene and polypropylene. Examples thereof include resin materials such as polyolefin. Examples of the material include a ceramic sheet such as a metal foil. The thickness of the 1st base material sheet 3 is 0.03 mm or more, for example, Preferably, it is 0.05 mm or more, for example, is 2 mm or less, Preferably, it is 1 mm or less. Moreover, the dimension of the 1st base material sheet 3 is suitably adjusted with the dimension of the sealing layer 6 demonstrated below, Specifically, the length of 1 side is 10 mm or more, for example, Preferably, it is 20 mm or more. Yes, for example, 300 mm or less, preferably 250 mm or less.

  The adhesive layer 4 is provided on the entire lower surface of the first base sheet 3. The adhesive layer 4 is made of, for example, an adhesive such as an acrylic pressure sensitive adhesive or a urethane pressure sensitive adhesive. The thickness of the adhesive layer 4 is, for example, 0.1 mm or more, preferably 0.2 mm or more, and 1 mm or less, preferably 0.5 mm or less.

  The release sheet 5 is provided on the entire lower surface of the adhesive layer 4 in order to prevent the lower surface of the adhesive layer 4 from being contaminated. Examples of the release sheet 5 include polymer films such as a polyethylene film and a polyester film (such as PET), for example, a ceramic sheet such as a metal foil. Preferably, a polymer film is used. Further, the surface of the release sheet 5 can be subjected to a peeling treatment such as a fluorine treatment. The thickness of the release sheet 5 is, for example, 0.3 mm or more, preferably 0.5 mm or more, and for example, 2 mm or less, preferably 1 mm or less.

  In order to produce the laminated substrate sheet 2, for example, first, the first substrate sheet 3 is prepared, and then the adhesive layer 4 is laminated on the lower surface of the first substrate sheet 3, and then the release sheet. 5 is laminated on the lower surface of the adhesive layer 4. In addition, the laminated base material sheet 2 can also use a commercially available thing.

  The thickness of the laminated substrate sheet 2 is, for example, 0.6 mm or more, preferably 1 mm or more, and for example, 5 mm or less, preferably 3 mm or less.

  After preparing the laminated base sheet 2, a sealing layer 6 is provided on the upper surface of the laminated base sheet 2 as shown in FIGS. 1A and 1B.

  In order to provide the sealing layer 6 on the upper surface of the laminated base sheet 2, for example, first, a sealing composition is prepared.

  The sealing composition contains particles as essential components, and specifically contains particles and a resin.

  Examples of the particles include phosphors and fillers.

  The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light.

Examples of the yellow phosphor include silicate phosphors such as (Ba, Sr, Ca) ₂ SiO ₄ ; Eu, (Sr, Ba) ₂ SiO ₄ : Eu (barium orthosilicate (BOS)), for example, Y ₃ Al Garnet-type phosphors having a garnet-type crystal structure such as ₅ O ₁₂ : Ce (YAG (yttrium, aluminum, garnet): Ce), Tb ₃ Al ₃ O ₁₂ : Ce (TAG (terbium, aluminum, garnet): Ce) Examples thereof include oxynitride phosphors such as Ca-α-SiAlON. Examples of the red phosphor include nitride phosphors such as CaAlSiN ₃ : Eu and CaSiN ₂ : Eu. Examples of the shape of the phosphor include a spherical shape, a plate shape, and a needle shape. Preferably, spherical shape is mentioned from a fluid viewpoint. The average value of the maximum length of the phosphor (in the case of a sphere, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and for example, 200 μm or less, preferably 100 μm or less. It is. The phosphors can be used alone or in combination. The blending ratio of the phosphor is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, for example, 80 parts by mass or less, preferably 50 parts by mass or less with respect to 100 parts by mass of the resin. It is.

  Examples of the filler include organic fine particles such as silicone particles, and inorganic fine particles such as silica, talc, alumina, aluminum nitride, and silicon nitride. Further, the average value of the maximum length of the filler (in the case of a spherical shape, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and, for example, 200 μm or less, preferably 100 μm or less. The filler can be used alone or in combination. The blending ratio of the filler is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, and, for example, 70 parts by mass or less, preferably 50 parts by mass with respect to 100 parts by mass of the resin. Or less.

  The mixing ratio of the particles is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, and, for example, 80 parts by mass or less, preferably 60 parts by mass with respect to 100 parts by mass of the resin. It is as follows.

  Examples of the resin include a thermoplastic resin that is plasticized by heating, for example, a thermosetting resin that is cured by heating, for example, an active energy ray curable that is cured by irradiation with active energy rays (for example, ultraviolet rays, electron beams, etc.). Resin etc. are mentioned. Examples of the thermoplastic resin include vinyl acetate resin, ethylene / vinyl acetate copolymer (EVA), vinyl chloride resin, EVA / vinyl chloride resin copolymer, and the like. Examples of the thermosetting resin include silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin. The resin preferably includes a curable resin such as a thermosetting resin and an active energy ray curable resin.

  Examples of the curable resin include silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin. Examples of the curable resin include a two-stage curable resin and a one-stage curable resin, and a two-stage curable resin is preferable.

  The two-stage curable resin has a two-stage reaction mechanism, and is B-staged (semi-cured) by the first-stage reaction and C-staged (final-cured) by the second-stage reaction. On the other hand, the one-step curable resin has a one-step reaction mechanism and is completely cured by the first-step reaction. The B stage is a state between the A stage in which the curable resin is in a liquid state and the fully cured C stage, and the curing and gelation are slightly advanced, and the compression elastic modulus is the elasticity of the C stage. It is a state smaller than the rate.

  To prepare the sealing composition, particles and a resin are blended. In addition, when resin is curable resin, the resin at the time of a mixing | blending is A stage.

  Subsequently, in this method, the prepared sealing composition is applied onto the laminated base sheet 2. Specifically, the sealing composition is applied to the upper surface of the first base sheet 3 in an appropriate thickness by a method such as casting, spin coating, roll coating, and the like, and the film 7 Form. Specifically, the film 7 is formed in a pattern smaller than the first base sheet 3 in plan view, and more specifically, in a substantially rectangular pattern that exposes the peripheral edge of the upper surface of the first base sheet 3. A film 7 is formed. In other words, the film 7 is formed in a pattern continuous at least in the front-rear direction.

  Thereafter, if necessary, when the resin is a curable resin, the coating 7 is heated and / or irradiated with active energy rays. More specifically, when the resin contains a two-step curable resin, the sealing layer 6 is B-staged (semi-cured) by heating and / or active energy ray irradiation.

  Thereby, the sheet-like sealing layer 6 is formed in the above-described pattern on the upper surface of the first base sheet 3.

  Alternatively, the sealing composition is applied to a release sheet (not shown) to form the film 7, and then the film 7 is heated and / or irradiated with active energy rays as necessary to form the sealing layer 6. Thereafter, the sealing layer 6 can be transferred to the upper surface of the first base sheet 3.

  The dimension of the sealing layer 6 is appropriately adjusted depending on its use and purpose. Specifically, the length of one side is, for example, 5 mm or more, preferably 10 mm or more, and, for example, 300 mm or less, preferably Is 250 mm or less.

  Thereby, the 1st lamination sheet 8 provided with lamination substrate sheet 2 and sealing layer 6 is formed.

[First cutting step]
In this method, the first cutting step shown in FIG. 2 is performed after the sealing layer forming step shown in FIG. In the first cutting step, the first laminated sheet 8 is cut so that the first laminated sheet 8 is divided into a plurality (specifically, five) in the front-rear direction (an example of the first direction).

  For example, the first laminated sheet 8 is partitioned into an outer portion 13 outside the sealing layer 6 and an inner portion 12 that includes the sealing layer 6 and is surrounded by the outer portion 13, and is sealed in the inner portion 12. The first laminated sheet 8 is cut so that the layer 6 is divided into a plurality (specifically, five) in the front-rear direction. By cutting the first laminated sheet 8, a first cut consisting of a first horizontal cutting line 9 along a plurality of left and right directions and a first vertical cutting line 10 continuing to each of both ends in the left and right direction of the plurality of cutting lines 9. A line 17 is formed.

  The plurality of first horizontal cutting lines 9 are arranged in parallel at intervals in the front-rear direction. Of the plurality of first horizontal cutting lines 9, the first horizontal cutting line 9 </ b> A located on the foremost side is formed so as to overlap the front edge of the sealing layer 6 in plan view. Moreover, the 1st horizontal cutting line 9B located in the rear side among the several 1st horizontal cutting lines 9 is formed so that it may overlap with the rear-end edge of the sealing layer 6 in planar view.

  The first vertical cutting lines 10 are formed along the front-rear direction, and are formed as a pair so as to face each other with a gap in the left-right direction. The first vertical cutting lines 10 are formed on both outer sides in the left-right direction of the sealing layer 6 with a space therebetween.

  The first cutting line 17 has a cutting line positioned outside, specifically, the first horizontal cutting lines 9A and 9B positioned on the foremost side and the rearmost side, and the pair of first vertical cutting lines 10 in plan view. A substantially rectangular shape is formed, and the first laminated sheet 8 is partitioned into an outer portion 13 and an inner portion 12.

  In order to cut the first laminated sheet 8, for example, a dicing apparatus using a disk-shaped dicing saw (dicing blade), a cutting apparatus using a cutter, a laser irradiation apparatus, a Thomson blade cutting machine using a Thomson blade, or the like is used.

  By the cutting step, the sealing layer 6 and the laminated substrate sheet 2 corresponding to the sealing layer 6 (specifically, the plurality of laminated substrate sheets 2 on which the plurality of sealing layers 6 are laminated) A plurality of sealing members 11 provided are formed. Specifically, a plurality of sealing members 11 are formed side by side in the front-rear direction by dividing the inner portion 12 into a plurality of parts in the front-rear direction. Each of the plurality of sealing members 11 is formed in a rectangular shape that is substantially rectangular in plan view and extends in the left-right direction.

  In the sealing member 11, both end portions in the left-right direction include the first base sheet 3, the adhesive layer 4 and the release sheet 5, and both end portions in the left-right direction of the first base sheet 3 are sealed layers. 6 is exposed. That is, in the sealing member 11, the sealing layer 6 is formed midway in the left-right direction of the first base sheet 3.

  The length in the front-rear direction of each sealing member 11 is, for example, 5 mm or more, preferably 8 mm or more, and for example, 100 mm or less, preferably 50 mm or less.

[Arrangement process]
Next, in this method, the arrangement step shown in FIGS. 3 and 4 is performed after the first cutting step shown in FIG. The arranging step includes a peeling step shown in FIG. 3 and a placing step shown in FIG.

[Peeling process]
In the peeling step, as shown in FIGS. 3A and 3B, first, the respective sealing members 11 are sequentially pulled up from the outer portion 13. Specifically, for example, each sealing member 11 is pulled up by peeling the sealing member 11 by hand.

[Installation process]
Subsequent to the peeling step shown in FIGS. 3A and 3B, in the placing step, a plurality of sealing members 11 are arranged on the second base sheet 14 as shown in FIGS. 4A and 4B.

  Specifically, the plurality of sealing members 11 are arranged on the upper surface of the second base sheet 14 so as to be spaced from each other in the front-rear direction. Specifically, first, as shown by phantom lines in FIGS. 3A and 3B, the release sheet 5 of the sealing member 11 is peeled from the adhesive layer 4, and then, the adhesive layer 4 shown in FIGS. 4A and 4B. Is placed on the upper surface of the second base sheet 14, and the first base sheet 3 and the second base sheet 14 are bonded via the adhesive layer 4.

  The 2nd base material sheet 14 is formed in the substantially rectangular flat plate shape extended in the front-back direction and the left-right direction. The second base sheet 14 is formed from the same material as the first base sheet 3. Moreover, the 2nd base material sheet 14 is formed larger than the sealing layer 6 (refer FIG. 1A), and, specifically, the 2nd base material sheet 14 is the length of the front-back direction at least before a cutting | disconnection. The sealing layer 6 (see FIG. 1A) is longer than the length in the front-rear direction. Further, the length of the second base sheet 14 in the left-right direction is longer than the length of the sealing member 11 in the left-right direction. The dimension of the second base sheet 14 is appropriately adjusted depending on its use and purpose. Specifically, the length in the front-rear direction is, for example, 20 mm or more, preferably 40 mm or more, and, for example, 300 mm or less, Preferably, it is 200 mm or less. Further, the length in the left-right direction is, for example, 20 mm or more, preferably 50 mm or more, and for example, 300 mm or less, preferably 200 mm or less.

  The interval L1 in the front-rear direction of the sealing member 11 to be arranged is appropriately set according to the pitch of the optical semiconductor element 15 described below, and specifically, for example, 1 mm or more, preferably 3 mm or more. Also, for example, it is 20 mm or less, preferably 10 mm or less. Further, the pitch L2 between the sealing members 11, that is, the total distance L2 of the distance L1 and the length in the front-rear direction of the sealing member 11 is, for example, 5 mm or more, preferably 10 mm or more. 100 mm or less, preferably 50 mm or less.

  Thereby, the 2nd lamination sheet 28 provided with a plurality of sealing members 11 and the 2nd substrate sheet 14 is constituted.

[Second cutting step]
In this method, the second cutting step shown in FIG. 5 is performed after the arranging step shown in FIG. In the second cutting step, as shown in FIGS. 5A and 5B, the sealing layer 6 is cut so as to partition a sealing region 16 corresponding to an optical semiconductor element 15 (see FIG. 9A) described later.

  Specifically, the sealing layer 6 is cut so that each sealing region 16 has a substantially circular shape in plan view.

  In order to cut the sealing layer 6, for example, a dicing apparatus using a disk-shaped dicing saw (dicing blade), a cutting apparatus using a cutter, a laser irradiation apparatus, a Thomson blade cutting machine using a Thomson blade, or the like is used.

  In addition, as shown to FIG. 5B, specifically, the sealing layer 6 is cut | disconnected so that the 1st base material sheet 3 may not be cut | disconnected over the thickness direction so that the lamination | stacking base material sheet 2 may not be cut | disconnected over the thickness direction. . Specifically, the cutting line formed in the thickness direction in the second cutting step is formed on the sealing layer 6 while not formed on the first base sheet 3 at all.

[Removal process]
In this method, the removing step shown in FIG. 6 is performed after the second cutting step shown in FIG. In the removal step, the sealing layer 6 outside the sealing region 16 is removed as shown in FIGS. 6A and 6B.

  In order to remove the sealing layer 6 outside the sealing region 16, for example, the sealing layer 6 outside the sealing region 16 is peeled from the first base sheet 3. In order to peel off the sealing layer 6 outside the sealing region 16, a known peeling device is used. Specifically, an adsorption device or the like is used.

  Thus, the circular sealing layer 6 constitutes a sealing region 16 that substantially contributes to the sealing of the optical semiconductor element 15.

  The diameter of the sealing area | region 16 is 5 mm or more, for example, Preferably, it is 8 mm or more, for example, is 50 mm or less, Preferably, it is 30 mm or less.

[Third cutting step]
In this method, the third cutting step shown in FIG. 7 is performed after the removing step shown in FIGS. 6A and 6B. In the third cutting step, as shown in FIGS. 7A to 7C, the second lamination is performed so that the sealing member 11 is divided into a plurality (specifically, five) in the left-right direction. The sheet 28 is cut. Moreover, the through-hole 24 is formed in the front-back direction both ends of the 2nd base material sheet 14 simultaneously with the division | segmentation of the sealing member 11. FIG.

  By the cutting of the second laminated sheet 28, it is composed of a second longitudinal cutting line 19 along a plurality of front and rear directions and a second horizontal cutting line 20 continuous to each of both end portions in the front and rear direction of the plurality of second longitudinal cutting lines 19. A second cutting line 18 is formed.

  The plurality of second vertical cutting lines 19 are formed in parallel in the left-right direction at intervals. The second vertical cutting line 19 divides the first base material sheet 3, the adhesive layer 4 and the second base material sheet 14 in the left-right direction, and separates the plurality of sealing layers 6 into individual pieces. ,It is formed. The sealing layers 6 are arranged in a plurality of rows (specifically, 4 rows) in the front-rear direction by the second horizontal cutting lines 19. In addition, the second vertical cutting line 19C on the both outer sides in the left-right direction includes the first base sheet 3, the adhesive layer 4 and the second base sheet 14 (that is, the inner part in the left-right direction) corresponding to the sealing layer 6, It forms so that the 1st base material sheet 3 and the adhesive bond layer 4 (namely, left-right direction outer side part) which do not correspond to the sealing layer 6 may be partitioned off.

  The second horizontal cutting lines 20 are formed along the left-right direction, and are formed as a pair in the front-rear direction with a space therebetween. The pair of second horizontal cutting lines 20 are formed on the front side of the foremost sealing member 11 and on the rear side of the rearmost sealing member 11 with a gap therebetween.

  The second cutting line 18 includes a pair of second vertical cutting lines 19C and a pair of second vertical cutting lines 20 on the outside in the left and right direction, specifically, in plan view. It is formed so as to form a substantially rectangular shape and include a plurality of sealing layers 6.

  The through hole 24 is formed by penetrating the second base material sheet 14 on both outer sides in the front-rear direction of the first base material sheet 3 and the adhesive layer 4 in the thickness direction. A pair of through holes 24 is provided for each row of the second base sheet 14 partitioned into a plurality of rows by the second vertical cutting line 20, and each through hole 24 has a substantially circular shape in plan view. Is formed.

[Recovery process]
In this method, the collection step shown in FIG. 8 is performed after the third cutting step shown in FIG. In the collecting step, as shown in FIGS. 8A to 8D, the second laminated sheet 28 (see FIG. 7) including the sealing member 11 partitioned by the second cutting line 18 is collected.

  By this collection, the second base sheet 14 formed so as to be continuous in the front-rear direction and a plurality of seals arranged on the upper surface (front surface) of the second base sheet 14 at intervals from each other in the front-rear direction. A sealing sheet 1 including the member 11 is obtained. Further, in the sealing sheet 1, the plurality of sealing members 11 are stacked on the upper surface of the second base sheet 14 at intervals in the front-rear direction, and the plurality of adhesive layers 4. And a plurality of first base sheet 3 bonded to the upper surface, and a plurality of sealing layers 6 respectively stacked on the upper surfaces of the plurality of first base sheet 3. Each of the plurality of sealing layers 6 defines a sealing region 16.

  Thereafter, a fixing member (not shown) such as a pin provided in the transport container is inserted into the through hole 24 of the seal sheet 1 to fix the seal sheet 1 to the transport container. It is transported to equipment manufacturing factories.

  Next, with reference to FIG. 9A-FIG. 9C, the method to seal the optical semiconductor element 15 with the sealing sheet 1 is demonstrated.

  In this method, as shown in FIG. 9A, first, a substrate 21 on which an optical semiconductor element 15 to be sealed is mounted is prepared.

  The substrate 21 is formed in a substantially rectangular flat plate shape extending at least in the front-rear direction. The substrate 21 is made of an insulating substrate such as a silicon substrate, a ceramic substrate, a polyimide resin substrate, or a laminated substrate in which an insulating layer is laminated on a metal substrate.

  Further, a conductor pattern (not shown) provided on the upper surface of the substrate 21 is provided with an electrode (not shown) for electrically connecting to a terminal (not shown) of the optical semiconductor element 15 and a wiring continuous therewith. Is formed. The conductor pattern is formed from a conductor such as gold, copper, silver, or nickel.

  The dimension in plan view of the substrate 21 is appropriately selected. Specifically, the length in the front-rear direction is, for example, 5 mm or more, preferably 10 mm or more, and for example, 200 mm or less, preferably 150 mm or less. is there. The thickness of the board | substrate 21 is 100 micrometers or more, for example, Preferably, it is 500 micrometers or more, for example, is 5000 micrometers or less, Preferably, it is 3000 micrometers or less.

  The optical semiconductor element 15 is an optical semiconductor element that converts electrical energy into light energy. For example, the thickness is the length in the plane direction (the length in the direction perpendicular to the thickness direction, specifically, the length in the front-rear direction and the length in the left-right direction). A) It is formed in a substantially rectangular shape in section view. The optical semiconductor element 15 is formed in a substantially rectangular shape in plan view.

  Examples of the optical semiconductor element 15 include an LED (light emitting diode element) such as a blue LED that emits blue light, and an LD (laser diode). The dimensions of the optical semiconductor element 15 are appropriately set according to the application and purpose. Specifically, the thickness is, for example, 10 to 1000 μm, the length in the front-rear direction and / or the length in the left-right direction in plan view, For example, it is 0.01 mm or more, preferably 0.1 mm or more, and for example, 15 mm or less, preferably 20 mm or less.

  The optical semiconductor elements 15 are aligned and spaced in the front-rear direction. An interval (interval in the front-rear direction) L3 between the optical semiconductor elements 15 is, for example, 3 mm or more, preferably 5 mm or more, and, for example, 150 mm or less, preferably 70 mm or less. Further, the pitch L4 between the optical semiconductor elements 15, that is, the total distance L4 of the distance L3 and the length of the optical semiconductor element 15 is the same as the pitch L2 between the sealing members 11, and specifically, Is, for example, 5 mm or more, preferably 10 mm or more, and for example, 100 mm or less, preferably 50 mm or less.

  The optical semiconductor element 15 is flip-chip mounted on the substrate 21, for example. Alternatively, the optical semiconductor element 15 is connected to an electrode (not shown) of the substrate 21 by wire bonding.

  Subsequently, in this method, the sealing sheet 1 is arranged so that each sealing layer 6 faces the optical semiconductor element 15 in the thickness direction.

  In this method, the optical semiconductor element 15 is then sealed with the sealing sheet 1 as shown in FIG. 9B. Specifically, the sealing sheet 1 is pushed down relative to the substrate 21. Thereby, each of the plurality of sealing layers 6 covers and seals each of the plurality of optical semiconductor elements 15. That is, each of the plurality of sealing layers 6 embeds each of the plurality of optical semiconductor elements 15. Thereafter, when the sealing layer 6 contains a curable resin, the sealing layer 6 is C-staged (completely cured).

  Thereafter, in this method, as shown in FIG. 9C, the second base sheet 14, the adhesive layer 4 and the first base sheet 3 are peeled off from the sealing layer 6.

  As a result, an optical semiconductor device 22 including the substrate 21, the plurality of optical semiconductor elements 15, and the plurality of sealing layers 6 is obtained.

  In the optical semiconductor device 22, the plurality of sealing layers 6 are provided at intervals in the front-rear direction and form a sealing region 16. Each of the plurality of sealing layers 6 seals each of the plurality of optical semiconductor elements 15. Specifically, the sealing region 16 covers the upper surface and side surfaces of the optical semiconductor element 15.

  Thereafter, as necessary, as indicated by broken lines in FIG. 9C, the substrate 21 corresponding to each optical semiconductor element 15 is cut into individual pieces. Thus, the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, and the single sealing layer 6 is obtained.

  And in this manufacturing method of the sealing sheet 1, the sealing layer 6 is cut | disconnected so that the sealing layer 6 may be divided | segmented into two or more in the front-back direction, the several sealing member 11 is formed, and several sealing member is made after that. The stop member 11 is arrange | positioned so that it may mutually space apart in the front-back direction (refer FIG. 4A). Therefore, since the plurality of sealing members 11 after cutting are arranged so as to be spaced apart from each other in the front-rear direction by a simple method, the sealing layer 6 formed to be continuous in the front-rear direction (see FIG. 1A). Can be used effectively. Therefore, the yield of the sealing layer 6 can be improved and the manufacturing cost of the sealing sheet can be reduced.

  Moreover, according to this method, since the 1st lamination sheet 8 provided with the sealing layer 6 and the 1st base material sheet 3 is formed in the sealing layer formation process shown in FIG. In the first cutting step shown in FIG. 2, the first laminated sheet 8 is cut, so that the handling property of the sealing layer 6 is improved and the first cutting step can be performed. The accuracy of cutting the sealing layer 6 can be improved.

  In the manufacturing method of this sealing sheet 1, since the some sealing member 11 is arrange | positioned on the upper surface of the 2nd base material sheet 14, as shown in FIG. 4, the precision of arrangement | positioning of the several sealing member 11 is improved. be able to. Therefore, the plurality of optical semiconductor elements 15 can be accurately sealed by the plurality of sealing members 11.

  In the manufacturing method of this sealing sheet 1, the yield of the particle | grains containing fluorescent substance can be improved.

  In this sealing sheet 1, the sealing layer 6 is interposed by the second base material sheet 14 formed so as to be continuous in the front-rear direction, with the first base material sheet 3 arranged at intervals in the front-rear direction. Can be supported. Therefore, the sealing layer 6 can be flexibly supported by the first base material sheet 3 and the second base material sheet 14 while reducing the manufacturing cost of the sealing sheet 1.

<Modification of First Embodiment>
As shown in FIGS. 10 and 11, a positioning mark 23 can be provided on the sealing sheet 1.

  The positioning mark 23 is formed simultaneously with the formation of the second cutting line 18 in the third cutting step shown in FIG.

  The positioning mark 23 is formed outside the sealing layer 6 as shown in FIGS. 10 and 11. A pair of positioning marks 23 is provided for each sealing layer 6. A pair of positioning marks 23 are provided so as to sandwich each sealing layer 6, and one positioning mark 23 is provided on the rear side and the right side with respect to the sealing layer 6, and the other positioning mark 23 is positioned. The mark 23 is provided on the front side and the left side with respect to the sealing layer 6.

  Each positioning mark 23 is formed as a substantially circular through hole in plan view that penetrates the sealing sheet 1 in the thickness direction.

  In the modification shown in FIG. 10, the positioning mark 23 is formed on the outer side of the first base sheet 3 and the adhesive layer 4, specifically on both outer sides in the front-rear direction, and penetrates the second base sheet 14. It is formed to do. Note that the positioning marks 23 provided between the plurality of sealing layers 6 are formed to face each other in the left-right direction.

  On the other hand, in the modification shown in FIG. 11, the positioning mark 23 is outside the sealing layer 6 and inside the peripheral edge of the first base sheet 3, the first base sheet 3, the adhesive layer 4, and the first 2 It is formed so as to penetrate through the base material sheet 14. Specifically, the pair of positioning marks 23 is formed on a diagonal line of the substantially rectangular first base sheet 3.

  10 and 11, the positioning mark 23 provided on the forefront side is formed on the diagonally left rear side of the front through hole 24 with an interval. On the other hand, the positioning mark 23 provided on the rear side is formed on the right front side of the rear through hole 24 at an interval.

  As shown in FIG. 8C, the sealing region 16 of each sealing layer 6 is formed in a substantially circular shape, but the shape is not particularly limited. For example, as shown in FIG. 12, it is long in the front-rear direction. It is also possible to form a substantially elliptical shape, for example, a substantially hexagonal shape as shown in FIG. 13, for example, a substantially rectangular shape as shown in FIG.

  Moreover, the 2nd cutting process shown in FIG. 5 can also be implemented after the 1st cutting process shown in FIG. 2, or simultaneously with a 1st cutting process.

  Preferably, from the viewpoint of positioning accuracy of the sealing layer 6 with respect to the optical semiconductor element 15 to be described later, the second cutting step shown in FIG. 5 is performed after the arranging step shown in FIG.

  Moreover, without performing the 1st cutting process shown in FIG. 5, the removal process of FIG. 6 is implemented after the mounting process shown in FIG. The sealing region 16 can also be formed.

  Furthermore, as shown to FIG. 1A, although the adhesive layer 4 is provided in the lamination | stacking base material sheet 2, without providing the adhesive bond layer 4, the lamination | stacking base material sheet 2 and the 1st base material sheet 3 and a release sheet are provided. It can also consist of five. In that case, the first base sheet 3 preferably has adhesiveness, and the release sheet 5 is laminated on the lower surface thereof.

  Furthermore, in the sealing layer forming step shown in FIG. 1, the sealing layer 6 is formed on the laminated substrate sheet 2, and subsequently, in the first cutting step shown in FIG. 2, the sealing layer 6 is laminated. Although it cut | disconnects with the base material sheet 2, for example, although not shown in figure, the laminated base material sheet 2 is not cut | disconnected but only the sealing layer 6 is cut | disconnected, Then, FIG. 4 is referred in the mounting process. In this way, only the adhesive layer 4 can be placed on the second base sheet 14. Furthermore, without forming the sealing layer 6 on the laminated base sheet 2, it can also be formed in a sheet form alone. After cutting the sealing layer 6, the cut sealing layer 6 is then cut. It can also be placed on the second base sheet 14.

  Moreover, in the 1st cutting process, when not cut | disconnecting the lamination | stacking base material sheet 2, but only the sealing layer 6 is cut | disconnected, in the mounting process, only the cut | disconnected sealing layer 6 is once from the lamination | stacking base material sheet 2. It peels and can also mount (rearrange) on the upper surface of the lamination | stacking base material sheet 2 so that it may space apart in the front-back direction.

  In the first embodiment, in the sealing layer forming step of FIGS. 1A and 1B, the adhesive layer 4 is provided between the first base sheet 3 and the release sheet 5, and the recovery step of FIGS. 8A and 8B. In the sealing member 11 recovered in step (1), the adhesive layer 4 is provided between the second base sheet 14 and the first base sheet 3. However, although not shown in FIG. 1A and FIG. 1B, in the sealing layer forming step, the adhesive layer 4 is not provided, and the laminated base sheet 2 is configured from the first base sheet 3 and the release sheet 5, Although not shown in FIGS. 8A and 8B, the sealing member 11 can also be configured from the second base sheet 14, the first base sheet 3, and the sealing layer 6 that are recovered in the recovery step. That is, in the sealing member 11, the first base sheet 3 can be directly laminated on the upper surface of the second base sheet 14.

  Moreover, the 2nd cutting process of FIG. 5 and the 3rd cutting process of FIG. 7 can also be implemented simultaneously. In this method, in the second cutting step and the third cutting step, the sealing layer 6 is cut so as to partition the sealing region 16, and the second laminated sheet is divided into a plurality of sealing members 11. 28 is cut.

  After the second cutting step and the third cutting step, the removing step shown in FIG. 6 is performed. That is, in this removing step, the sealing layer 6 outside the sealing region 16 is removed.

  According to this method, since the 2nd cutting process and the 3rd cutting process are carried out simultaneously, the position accuracy of the sealing layer 6 in the sealing sheet 1 can be improved.

Second Embodiment
2nd Embodiment of the sealing sheet of this invention and its manufacturing method is described with reference to FIGS. 1-4, FIG. 15, and FIG.

  In FIG. 15 and FIG. 16, members and processes similar to those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the first embodiment, the second cutting step shown in FIG. 5 and the removing step shown in FIG. 6 are carried out, but the second cutting step and the removing step are not carried out, and after the arrangement step shown in FIG. The 3rd cutting process shown in 15 can also be implemented.

  That is, the manufacturing method of the sealing sheet 1 which is 2nd Embodiment of this invention is a sealing layer formation process (refer FIG. 1), a 1st cutting process (refer FIG. 2), an arrangement | positioning process (refer FIG. 3 and FIG. 4). ), A third cutting step (see FIG. 15), and a recovery step (see FIG. 16), and these steps are sequentially performed.

  As shown in FIG. 16, the sealing layer 6 after the recovery step has a substantially rectangular shape in plan view, and is disposed so as to be opposed to each other in the front-rear direction.

  According to the second embodiment, the same operational effects as those of the first embodiment can be obtained. Further, since the second cutting step (see FIG. 5) and the removing step (see FIG. 6) are not performed, the number of manufacturing steps can be reduced. The manufacturing cost can be further reduced.

<Third Embodiment>
3rd Embodiment of the sealing sheet of this invention and its manufacturing method is described with reference to FIGS.

  17 to 20, the same members and steps as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[First cutting step]
In the first cutting step, as shown in FIG. 17, the first laminated sheet 8 is cut so that the first laminated sheet 8 is divided into a plurality of parts in the front-rear direction and the left-right direction. By cutting the first laminated sheet 8, the first cutting lines 17 are formed in a substantially grid pattern in plan view. Specifically, the first vertical cutting lines 10 are arranged in parallel in the left-right direction at intervals.

[Arrangement process]
[Peeling process]
In the peeling step in the placement step, the sealing member 11 is pulled up as shown by the arrow in FIG.

[Installation process]
Subsequently, in the placing step, as shown by arrows in FIG. 18, the plurality of sealing members 11 are arranged on the upper surface of the second base sheet 14 so as to be spaced apart from each other in the front-rear direction and the left-right direction.

[Second cutting step and removal step]
As shown in FIG. 19, the sealing layer 6 is cut in the second cutting step, and then the sealing layer 6 outside the sealing region 16 is removed in the removing step as shown by the arrow in FIG. To do.

[Third cutting step]
As shown in FIG. 20, the second base sheet 14 is cut so that the sealing member 11 is divided into a plurality of rows (specifically, four rows) in the left-right direction.

  Specifically, the second longitudinal cutting line 19 of the second cutting line 18 is formed so as to pass between the first base sheet 3 and the adhesive layer 4 adjacent in the left-right direction.

  In the sealing sheet 1 obtained by this, the 1st base material sheet 3 and the adhesive bond layer 4 are formed in the left-right direction center (middle) of each 2nd base material sheet 14. FIG. That is, the upper surface of the peripheral end portion of the second base sheet 14 is exposed from the first base sheet 3.

  According to the third embodiment, the same operational effects as those of the first embodiment can be obtained. Further, as shown in FIG. 17, in the first cutting step, the first laminated sheet 8 is divided into a plurality of parts in the left-right direction. First, the first laminated sheet 8 is cut, and then, as shown in FIG. 18, a plurality of sealing members 11 are arranged on the second base sheet 14 so as to be spaced from each other in the left-right direction. Therefore, the yield of the sealing layer 6 can be further improved, and the manufacturing cost of the sealing sheet 1 can be reduced.

<Fourth embodiment>
In FIG. 21, FIG. 23, FIG. 24, FIG. 26, and FIG. 27, the left-right direction (or lateral direction) indicated by an arrow is an example of the first direction, and the front-rear direction (or vertical direction indicated by the arrow in FIGS. (Direction) is an example of the second direction.

  4th Embodiment of the manufacturing method of the sealing sheet of this invention is described with reference to FIGS.

  21 to 23, members and processes similar to those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 21, the manufacturing method of the sealing sheet 1 which is 3rd Embodiment of this invention is equipped with a sealing layer formation process (refer FIG. 21A and FIG. 21B), and a cutting process (refer FIG. 21C).

[Sealing layer forming process]
As shown in FIG. 21A, first, a base sheet 31 is prepared. The base material sheet 31 is formed in a substantially rectangular flat plate shape extending in the front-rear direction and the left-right direction, and is configured similarly to the first base material sheet 3 of the first embodiment.

  Next, as illustrated in FIG. 21B, the sealing layer 6 is provided on the upper surface of the base sheet 31. Specifically, the plurality of sealing layers 6 are provided on the upper surface of the base sheet 31 so as to be along the front-rear direction with a space in the left-right direction. As shown in FIG. 22A, the interval L5 between the sealing layers 6 is appropriately set depending on the pitch of the optical semiconductor element 15 (see FIG. 22A) as a sealing target, and specifically, for example, 1 mm or more. The thickness is preferably 3 mm or more, and for example, 20 mm or less, preferably 10 mm or less. The pitch L6 between the plurality of sealing layers 6, that is, the above-described distance L5 and the total length L6 of the length in the front-rear direction of the sealing layer 6 is, for example, 5 mm or more, preferably 10 mm or more. 100 mm or less, preferably 50 mm or less.

  In order to provide the sealing layer 6 on the upper surface of the base material sheet 31, for example, a method of applying the sealing composition described above to the base material sheet 31, for example, on a separately prepared release sheet (not shown), A method of transferring the sealing layer 6 to the base material sheet 31 after applying the sealing composition described above in the left-right direction at a distance from each other to form the sealing layer 6 may be mentioned. Preferably, the base material sheet 31 is applied from the viewpoint of reducing the number of manufacturing steps.

  In the method of applying the sealing composition to the base sheet 31, the sealing composition is continuously spaced in the front-rear direction, spaced apart from each other in the left-right direction in an area smaller than the base sheet 31 on the upper surface of the base sheet 31. The film 7 is formed by coating with a pattern.

  Thereafter, if necessary, when the resin is a curable resin, the coating 7 is heated and / or irradiated with active energy rays. More specifically, when the resin contains a two-step curable resin, the sealing layer 6 is B-staged (semi-cured) by heating and / or active energy ray irradiation.

  Thereby, the sheet-like sealing layer 6 is provided on the upper surface of the base material sheet 31 at intervals in the left-right direction.

  Moreover, the lamination sheet 32 comprised from the base material sheet 31 and the some sealing layer 6 is obtained.

[Cutting process]
In the cutting step, as shown in FIG. 21C, the laminated sheet 32 is cut so that the laminated sheet 32 is divided into a plurality of parts in the front-rear direction.

  Specifically, the sealing layer 6 is cut together with the base sheet 31 so that each of the plurality of sealing layers 6 is divided into a plurality of parts in the front-rear direction.

  Thereby, the sealing sheet 1 provided with the base material sheet 31 extended in the left-right direction and the sealing layer 6 arrange | positioned on the upper surface of the base material sheet 31 at intervals in the left-right direction is obtained.

  Next, with reference to FIG. 22A-FIG. 22C, the method to seal the optical semiconductor element 15 with the sealing sheet 1 is demonstrated.

  In this method, as shown in FIG. 22A, first, a substrate 21 on which an optical semiconductor element 15 is mounted is prepared.

  Subsequently, in this method, the sealing sheet 1 is arranged so that each sealing layer 6 faces the optical semiconductor element 15 in the thickness direction.

  In this method, the optical semiconductor element 15 is then sealed with the sealing sheet 1 as shown in FIG. 22B. Specifically, the sealing sheet 1 is pushed down relative to the substrate 21. Thereby, each of the plurality of sealing layers 6 covers and seals each of the plurality of optical semiconductor elements 15. That is, each of the plurality of sealing layers 6 embeds each of the plurality of optical semiconductor elements 15. Thereafter, when the sealing layer 6 contains a curable resin, the sealing layer 6 is C-staged (completely cured).

  Thereafter, in this method, the base sheet 31 is peeled off from the sealing layer 6 as shown in FIG. 22C.

  As a result, an optical semiconductor device 22 including the substrate 21, the plurality of optical semiconductor elements 15, and the plurality of sealing layers 6 is obtained.

  Thereafter, as necessary, as indicated by broken lines in FIG. 22C, the substrate 21 corresponding to each optical semiconductor element 15 is cut into individual pieces. Thus, the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, and the single sealing layer 6 is obtained.

  And in this manufacturing method of the sealing sheet 1, since the sealing layer 6 containing particles is formed at intervals in the left-right direction and along the front-rear direction, the sealing layer 6 is then moved in the left-right direction. Are sealed with respect to the optical semiconductor element 15 arranged at a distance from each other. Therefore, the sealing layer 6 can be used effectively. As a result, the yield of the sealing layer 6 can be improved and the manufacturing cost of the sealing sheet 1 can be reduced.

  Moreover, in the manufacturing method of this sealing sheet 1, in a sealing layer formation process, since the sealing layer 6 is formed by apply | coating a sealing composition along the front-back direction, the sealing layer along the front-back direction 6 can be formed efficiently.

  Further, in this method, after the sealing layer forming step of applying the sealing composition along the front-rear direction, a cutting step of cutting the sealing layer 6 so that the sealing layer 6 is divided into a plurality of portions in the front-rear direction. Since it implements, the yield of the sealing layer 6 in the front-back direction can be improved and the manufacturing cost of the sealing sheet 1 can be reduced.

  In the manufacturing method of this sealing sheet 1, if a particle contains fluorescent substance, the yield of the particle | grains containing fluorescent substance can be improved.

<Modification of Fourth Embodiment>
As shown in FIG. 23A, prior to the above-described cutting step (see FIG. 21C), the sealing layer 6 shown in FIG. 21B can be cut into a predetermined shape. Specifically, the sealing layer 6 is cut into a substantially circular shape so as not to cut the base sheet 31. Specifically, a dicing apparatus using a disk-shaped dicing saw (dicing blade), a cutting apparatus using a cutter, a laser irradiation apparatus, a Thomson blade cutting machine using a Thomson blade, and the like are used.

  Thereby, a substantially circular sealing region 16 made of the sealing layer 6 is formed.

  Subsequently, as shown in FIG. 23B, the sealing layer 6 outside the sealing region 16 is removed.

  Thereby, the sealing sheet 1 provided with the sealing area | region 16 formed in the upper surface of the base material sheet 31 is obtained.

  Then, as shown to FIG. 23C, a cutting process is implemented.

<Fifth Embodiment>
5th Embodiment of the sealing sheet of this invention and its manufacturing method is described with reference to FIGS. 24-26.

  24 to 26, members and processes similar to those of the fourth embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In 4th Embodiment, as shown to FIG. 21B, in the sealing sheet 1, only the sealing layer 6 is provided on the base material sheet 31, For example, as shown to FIG. An encapsulating layer 33 can be further provided.

  As shown in FIGS. 24 and 25, the manufacturing method of the sealing sheet 1 according to the fourth embodiment of the present invention includes a phosphor-free sealing layer forming step (see FIGS. 24A and 24B), and a sealing layer formation. A process (refer FIG. 24C) and a cutting process (refer FIG. 24D) are provided.

[Phosphor-free sealing layer forming step]
As shown in FIG. 24A, first, a base sheet 31 is prepared.

  Next, as shown in FIG. 24B, the phosphor-free sealing layer 33 is provided on the upper surface of the base material sheet 31. Specifically, the phosphor-free encapsulating layer 33 is formed on the upper surface of the base material sheet 31 from the encapsulating composition not containing the phosphor. Thereby, the phosphor-free sealing layer 33 having a substantially rectangular shape in plan view that is slightly smaller than the base sheet 31 is formed. That is, the phosphor-free sealing layer 33 is formed in a pattern that exposes the outer peripheral end of the base sheet 31.

[Sealing layer forming process]
Next, as illustrated in FIG. 24C, the sealing layer 6 is formed on the upper surface of the phosphor-free sealing layer 33.

  In the sealing composition forming the sealing layer 6, the particles preferably contain a phosphor.

  By the sealing layer forming step, a laminated sheet 32 composed of the base material sheet 31, the phosphor-free sealing layer 33 and the sealing layer 6 is obtained.

[Cutting process]
In the cutting step, the laminated sheet 32 is cut so that the laminated sheet 32 is divided into a plurality of parts in the front-rear direction. More specifically, each of the phosphor-free sealing layer 33 and the sealing layer 6 is divided into a plurality of parts in the front-rear direction, so that the phosphor-free sealing layer 33 and the sealing layer 6 are not divided. Is cut together with the base material sheet 31.

  Accordingly, the base sheet 31 extending in the left-right direction, the phosphor-free sealing layer 33 continuously formed in the left-right direction on the upper surface of the base sheet 31, and the upper surface of the phosphor-free sealing layer 33 And the sealing sheet 1 provided with the sealing layer 6 arrange | positioned at intervals in the left-right direction is obtained.

  Next, with reference to FIG. 25A-FIG. 25C, the method to seal the optical semiconductor element 15 with the sealing sheet 1 is demonstrated.

  In this method, as shown in FIG. 25A, first, a substrate 21 on which an optical semiconductor element 15 is mounted is prepared.

  Subsequently, in this method, the sealing sheet 1 is arranged so that each sealing layer 6 faces the optical semiconductor element 15 in the thickness direction.

  In this method, the optical semiconductor element 15 is then sealed with the sealing sheet 1 as shown in FIG. 25B. Specifically, the sealing sheet 1 is pushed down relative to the substrate 21. Thereby, each of the plurality of sealing layers 6 covers and seals each of the plurality of optical semiconductor elements 15. That is, each of the plurality of sealing layers 6 embeds each of the plurality of optical semiconductor elements 15. Further, the phosphor-free sealing layer 33 exposed from the sealing layer 6 fills the gaps between the plurality of sealing layers 6. Thereafter, when the sealing layer 6 and / or the phosphor-free sealing layer 33 contains a curable resin, the sealing layer 6 and / or the phosphor-free sealing layer 33 is made C-staged (completely cured). )

  Thereafter, in this method, as shown in FIG. 25C, the base material sheet 31 is peeled off from the phosphor-free sealing layer 33.

  As a result, the optical semiconductor device 22 including the substrate 21, the plurality of optical semiconductor elements 15, the single phosphor-free sealing layer 33, and the plurality of sealing layers 6 is obtained.

  Thereafter, as necessary, as indicated by broken lines in FIG. 25C, the substrate 21 and the phosphor-free sealing layer 33 corresponding to each optical semiconductor element 15 are cut into individual pieces. As a result, the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, the single phosphor-free sealing layer 33, and the single sealing layer 6 is obtained.

  And in this manufacturing method of the sealing sheet 1, since the phosphor-free sealing layer 33 does not contain a phosphor, even if the phosphor-free sealing layer 33 is formed with a pattern that is continuous in the left-right direction, The phosphor-free sealing layer 33 can be manufactured at a low cost. Therefore, if the phosphor-free sealing layer 33 is formed and the sealing layer 6 is laminated on the phosphor-free sealing layer 33, the sealing sheet 1 having various physical properties can be configured. it can.

  Moreover, in this sealing sheet sealing sheet 1, the phosphor-free sealing layer 33 and the sealing layer 6 can have various physical properties.

<Modification of Fifth Embodiment>
As shown in FIG. 26A, prior to the cutting step (see FIG. 24D), the sealing layer 6 and the phosphor-free sealing layer 33 shown in FIG. 24C can be cut into a predetermined shape. Specifically, the sealing layer 6 and the phosphor-free sealing layer 33 are cut into a substantially circular shape so as not to cut the base sheet 31.

  As a result, a substantially circular sealing region 16 composed of the sealing layer 6 and the phosphor-free sealing layer 33 is formed.

  Subsequently, as shown in FIG. 26B, the sealing layer 6 outside the sealing region 16 and the phosphor-free sealing layer 33 are removed.

  Thereby, the sealing sheet 1 provided with the sealing area | region 16 formed in the upper surface of the base material sheet 31 is obtained.

  Then, as shown to FIG. 26C, a cutting process is implemented.

  Then, as shown in FIGS. 27A and 27B, if the optical semiconductor element 15 is sealed with the sealing sheet 1, the substrate 21, the plurality of optical semiconductor elements 15, the plurality of phosphor-free sealing layers 33, and An optical semiconductor device 22 including a plurality of sealing layers 6 is obtained.

  Thereafter, as necessary, as shown by broken lines in FIG. 27C, the substrate 21 and the phosphor-free sealing layer 33 corresponding to each optical semiconductor element 15 are cut into individual pieces. As a result, the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, the single phosphor-free sealing layer 33, and the single sealing layer 6 is obtained.

  Although the above description has been provided as an exemplary embodiment of the present invention, this is merely an example and should not be construed as limiting. Modifications of the present invention apparent to those skilled in the art are intended to be included within the scope of the following claims.

  The manufacturing method of a sealing sheet is used for manufacture of a sealing sheet.

DESCRIPTION OF SYMBOLS 1 Sealing sheet 3 1st base material sheet 6 Sealing layer 8 Laminate sheet 11 Sealing member 14 2nd base material sheet 15 Optical semiconductor element 16 Sealing area 31 Base material sheet 33 Phosphor-free sealing layer

Claims (5)

A step of continuously forming a phosphor-free sealing layer containing no phosphor in the first direction ;
A sealing layer forming step of forming a sealing layer containing particles along a second direction intersecting the first direction with a distance L1 from each other in the first direction; and
A cutting step of cutting the sealing layer so that the sealing layer is divided into a plurality of parts in the second direction,
The interval L1 is set to 1 mm or more and 20 mm or less so as to correspond to the sealing objects arranged with the interval L3 from each other in the first direction,
In the sealing layer forming step, the sealing layer is laminated on the phosphor-free sealing layer,
In the cutting step, the phosphor-free sealing layer is cut together with the sealing layer so that the phosphor-free sealing layer is divided into a plurality of parts in the second direction. Stop sheet manufacturing method.   The said sealing layer formation process forms the said sealing layer by apply | coating a sealing composition along the said 2nd direction, The manufacturing method of the sealing sheet of Claim 1 characterized by the above-mentioned. . Cutting the sealing layer so as to partition the sealing region corresponding to the sealing target; and
The method for producing a sealing sheet according to claim 1, further comprising a step of removing the sealing layer outside the sealing region.   The method for producing a sealing sheet according to any one of claims 1 to 3, wherein the particles contain a phosphor. A base sheet continuous in the first direction;
A plurality of sealing members disposed at a distance L1 from each other in the first direction,
The plurality of sealing members are
A phosphor-free sealing layer that is laminated on the surface of the base sheet and does not contain a phosphor,
Laminated on the surface of the phosphor-free sealing layer, comprising a sealing layer containing particles,
The said sheet | seat L1 is set to 1 mm or more and 20 mm or less so that it may respond | correspond to the sealing object arrange | positioned mutually spaced apart in the said 1st direction by the space | interval L3.

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