WO2014188742A1 - Sealing sheet and method for manufacturing same - Google Patents

Sealing sheet and method for manufacturing same Download PDF

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Publication number
WO2014188742A1
WO2014188742A1 PCT/JP2014/052697 JP2014052697W WO2014188742A1 WO 2014188742 A1 WO2014188742 A1 WO 2014188742A1 JP 2014052697 W JP2014052697 W JP 2014052697W WO 2014188742 A1 WO2014188742 A1 WO 2014188742A1
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WO
WIPO (PCT)
Prior art keywords
sealing
sheet
sealing layer
layer
cutting
Prior art date
Application number
PCT/JP2014/052697
Other languages
French (fr)
Japanese (ja)
Inventor
広和 松田
恭也 大薮
善彦 北山
貴司 鵜飼
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN201480026002.6A priority Critical patent/CN105190857A/en
Priority to JP2014507277A priority patent/JP5902291B2/en
Priority to KR1020157033271A priority patent/KR20160013030A/en
Publication of WO2014188742A1 publication Critical patent/WO2014188742A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil

Definitions

  • the present invention relates to a sealing sheet and a method for manufacturing the same, and more particularly to a method for manufacturing a sealing sheet and a sealing sheet manufactured thereby.
  • an encapsulating sheet in which a sealing resin layer containing particles such as phosphors and silica is laminated on a long release sheet so as to be continuous in the longitudinal direction is arranged at an interval in the longitudinal direction.
  • a method has been proposed in which a sealing resin layer is disposed opposite to a plurality of LEDs to seal the LEDs (see, for example, Patent Document 1 below).
  • a sealing resin layer that is, a sealing region
  • a sealing resin layer positioned relatively near each optical semiconductor element contributes to sealing of the optical semiconductor element by covering the upper surface and side surfaces of the optical semiconductor element.
  • a sealing resin layer positioned relatively remotely with respect to each optical semiconductor element specifically, a sealing resin layer positioned in the center (in the middle of the longitudinal direction) between adjacent optical semiconductor elements (that is, non-blocking resin layer)
  • the sealing region does not substantially contribute to the sealing of the optical semiconductor element. Therefore, the sealing resin layer in the non-sealing region becomes an unnecessary region in the sealing of the optical semiconductor element, and accordingly, the yield of the sealing resin layer containing the above-described particles is lowered. As a result, there exists a malfunction that the manufacturing cost of a sealing sheet increases.
  • the sealing resin layer contains a resin and an additive in addition to the above-described particles. It is difficult to recover and reuse only the particles from the removed non-sealed region. Therefore, there is still a problem that it is impossible to prevent a decrease in the yield of the sealing resin layer due to the formation of the non-sealing region and an increase in the manufacturing cost of the sealing sheet due to the yield.
  • the objective of this invention is improving the yield of a sealing layer, and providing the manufacturing method of a sealing sheet which can reduce the manufacturing cost of a sealing sheet, and the sealing sheet manufactured by it. .
  • a manufacturing method of a sealing sheet of the present invention is a manufacturing method of a sealing sheet including a plurality of sealing members arranged at intervals in a first direction, wherein the first
  • the sealing layer forming step of forming a sealing layer containing particles so as to be continuous in one direction, and after the sealing layer forming step, the sealing layer is divided into a plurality of portions in the first direction.
  • the sealing layer is cut so that the sealing layer is divided into a plurality of parts in the first direction to form a plurality of sealing members. It arrange
  • the said sealing layer formation process WHEREIN By forming the said sealing layer on the surface of the 1st base material sheet continuous in the said 1st direction, the said sealing is performed. Forming a laminated sheet comprising a layer and the first base sheet, and in the cutting step, cutting the laminated sheet so that the laminated sheet is divided into a plurality of pieces in the first direction, whereby the sealing layer It is preferable to form the sealing member from the first base sheet.
  • a laminated sheet including the sealing layer and the first base sheet is formed, so that the sealing layer can be supported by the first base sheet. Then, since the laminated sheet is cut in the cutting step, the handleability of the sealing layer can be improved, and the accuracy of cutting the sealing layer in the cutting step can be improved.
  • the said 1st direction is provided on the surface of the 2nd base material sheet formed continuously in the said 1st direction in the said some sealing member. It is preferable to arrange them at a distance from each other.
  • the particles contain a phosphor.
  • the yield of particles containing a phosphor can be improved.
  • the method for producing a sealing sheet of the present invention includes a sealing layer forming step of forming a sealing layer containing particles along a second direction that is spaced from each other in the first direction and intersects the first direction. And a cutting step of cutting the sealing layer so that the sealing layer is divided into a plurality of parts in the second direction.
  • this sealing sheet since the sealing layer containing particles is formed along the second direction that is spaced from each other in the first direction and intersects the first direction, the sealing layer is then formed.
  • the sealing layer can be used effectively if sealing is performed on the objects to be sealed that are spaced from each other in the first direction. Therefore, the yield of a sealing layer can be improved and the manufacturing cost of a sealing sheet can be reduced.
  • the sealing layer is formed by applying a sealing composition along the second direction.
  • the sealing layer is formed by applying the sealing composition along the second direction, so the sealing layer along the second direction is efficiently used. Can be well formed.
  • a cutting step of cutting the sealing layer so that the sealing layer is divided into a plurality of portions in the second direction since it implements, the yield of the sealing layer in a 2nd direction can be improved, and the manufacturing cost of a sealing sheet can be reduced.
  • the method for producing a sealing sheet of the present invention includes a step of cutting the sealing layer so as to partition a sealing region corresponding to a sealing target, and removing the sealing layer outside the sealing region. It is preferable to further include a step.
  • the sealing layer is cut and the sealing layer outside the sealing region is removed so as to partition the sealing region corresponding to the target to be sealed. It can be used effectively.
  • the particles contain a phosphor.
  • the sealing sheet of the present invention further comprises a step of continuously forming a phosphor-free sealing layer containing no particles in the first direction, and in the sealing layer forming step, the sealing layer is The phosphor-free sealing layer is laminated, and in the cutting step, the phosphor-free sealing layer is divided into a plurality of the phosphor-free sealing layers together with the sealing layer in the second direction. Thus, it is preferable to cut.
  • the phosphor-free encapsulating layer does not contain a phosphor, the phosphor-free encapsulating layer can be manufactured at low cost even if the phosphor-free encapsulating layer is continuously formed in the first direction. Can do. Therefore, if such a phosphor-free sealing layer is formed and the sealing layer is laminated on the phosphor-free sealing layer, a sealing sheet having various physical properties can be configured.
  • the sealing sheet of the present invention is disposed on the surface of the second base sheet and the second base sheet formed so as to be continuous in the first direction, and spaced from each other in the first direction.
  • the sealing layer is formed by a second base material sheet that is formed so as to be continuous in the first direction, via the first base material sheet that is arranged at an interval in the first direction, Can be supported. Therefore, the sealing layer can be flexibly supported by the first base sheet and the second base sheet while reducing the manufacturing cost.
  • the sealing sheet of the present invention includes a base sheet that is continuous in a first direction and a plurality of sealing members that are spaced apart from each other in the first direction, and the plurality of sealing members are It is characterized by comprising a phosphor-free encapsulating layer laminated on the surface of the substrate sheet, and a encapsulating layer containing particles laminated on the surface of the phosphor-free encapsulating layer.
  • This sealing sheet can have various physical properties by the phosphor-free sealing layer and the sealing layer.
  • the yield of a sealing layer can be improved and the manufacturing cost of a sealing sheet can be reduced.
  • the sealing sheet of the present invention can flexibly support the sealing layer by the first base sheet and the second base sheet while reducing the manufacturing cost.
  • the sealing member which has various physical properties can be comprised.
  • FIG. 1 shows a sealing layer forming step of a first embodiment of the method for producing a sealing sheet of the present invention
  • FIG. 1A is a perspective view
  • FIG. 1B is a side sectional view
  • FIG. 2 shows a first cutting step of the first embodiment of the method for producing a sealing sheet of the present invention
  • FIG. 2A is a perspective view
  • FIG. 2B is a side sectional view
  • FIG. 3 shows the peeling process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention
  • FIG. 3A shows a perspective view
  • FIG. 3B shows a sectional side view
  • FIG. 4 shows the mounting process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention
  • FIG. 4 shows the mounting process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention
  • FIG. 4A shows a perspective view
  • FIG. 4B shows a sectional side view
  • FIG. 5 shows the 2nd cutting process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention
  • FIG. 5A shows a perspective view
  • FIG. 5B shows a side sectional view
  • FIG. 6 shows a removing step of the first embodiment of the method for producing a sealing sheet of the present invention
  • FIG. 6A is a perspective view
  • FIG. 6B is a side sectional view
  • FIG. 7 shows a third cutting step of the first embodiment of the method for producing a sealing sheet of the present invention
  • FIG. 7A is a perspective view
  • FIG. 7B is a side sectional view
  • FIG. 7C is a plan view.
  • FIG. 8 shows the recovery process of the first embodiment of the method for producing a sealing sheet of the present invention
  • FIG. 8A is a perspective view
  • FIG. 8B is a front sectional view
  • FIG. 8C is a side sectional view
  • FIG. FIG. 9 shows a method of encapsulating the optical semiconductor element with the encapsulating sheet of FIG. 8
  • FIG. 9A is a process of arranging the encapsulating sheet opposite to the substrate on which the optical semiconductor element is mounted
  • FIG. 9B is an encapsulating sheet.
  • FIG. 9C shows the process of removing a 2nd base material sheet, an adhesive bond layer, and a 1st base material sheet.
  • FIG. 9A is a perspective view
  • FIG. 8B is a front sectional view
  • FIG. 8C is a side sectional view
  • FIG. FIG. FIG. 9 shows a method of encapsulating the optical semiconductor element with the encapsulating sheet of FIG
  • FIG. 10 shows the top view of the sealing sheet manufactured by the modification (mode provided with the positioning mark) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention.
  • FIG. 11 shows the top view of the sealing sheet manufactured by the modification (mode provided with the positioning mark) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention.
  • FIG. 12 shows the top view of the sealing sheet manufactured by the modification (embodiment whose sealing layer is substantially elliptical shape) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention.
  • FIG. 13 shows the top view of the sealing sheet manufactured by the modification (the aspect whose sealing layer is substantially hexagonal shape) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention.
  • FIG. 11 shows the top view of the sealing sheet manufactured by the modification (mode provided with the positioning mark) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention.
  • FIG. 12 shows the top view of the sealing sheet manufactured by
  • FIG. 14 shows the top view of the sealing sheet manufactured by the modification (the aspect whose sealing layer is substantially rectangular shape) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention.
  • FIG. 15 shows the third cutting step of the second embodiment of the method for producing the sealing sheet of the present invention, FIG. 15A is a perspective view, FIG. 15B is a side sectional view, and FIG. 15C is a plan view.
  • FIG. 16 shows the collection process of the second embodiment of the method for producing a sealing sheet of the present invention, FIG. 16A is a perspective view, FIG. 16B is a front sectional view, FIG. 16C is a side sectional view, and FIG. FIG. FIG.
  • FIG. 17 shows the perspective view of the 1st cutting process and peeling process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention.
  • FIG. 18 shows the perspective view of the mounting process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention.
  • FIG. 19 shows the perspective view of the 2nd cutting process and removal process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention.
  • FIG. 20 shows the perspective view of the 3rd cutting process and collection
  • FIG. 21 shows a manufacturing process diagram (perspective view) of the fourth embodiment of the manufacturing method of the sealing sheet of the present invention, and FIG.
  • FIG. 21A shows a sealing layer forming process (process for preparing a base sheet),
  • FIG. 21C shows a sealing layer forming step (step of providing a sealing layer), and
  • FIG. 21C shows a cutting step.
  • FIG. 22 is a process diagram (side sectional view) illustrating a method for encapsulating an optical semiconductor element with the encapsulating sheet of the fourth embodiment
  • FIG. 22A is a process for preparing a substrate on which the optical semiconductor element is mounted.
  • FIG. 22B is a step of sealing the optical semiconductor element with a sealing sheet
  • FIG. 22C is a step of removing the base sheet from the sealing layer. The process of peeling is shown.
  • FIG. 23 is a perspective view of a modification of the fourth embodiment.
  • FIG. 23A is a step of cutting the sealing layer into a substantially circular shape
  • FIG. 23B is a step of removing the sealing layer outside the sealing region.
  • FIG. 23C shows the cutting process.
  • FIG. 24 shows the manufacturing process figure (perspective view) of 5th Embodiment of the manufacturing method of the sealing sheet of this invention
  • FIG. 24A is a fluorescent substance-free sealing layer formation process (process which prepares a base material sheet)
  • 24B is a phosphor-free sealing layer forming step (step of providing a phosphor-free sealing layer).
  • FIG. 24C is a sealing layer forming step
  • FIG. 24D is a cutting step.
  • FIG. 25 is a process diagram (side sectional view) illustrating a method for encapsulating an optical semiconductor element with the encapsulating sheet of the fifth embodiment
  • FIG. 25A is a process of preparing a substrate on which the optical semiconductor element is mounted. And a step of arranging each sealing layer so as to face the optical semiconductor element
  • FIG. 25B is a step of sealing the optical semiconductor element with a sealing sheet
  • FIG. 25C is a phosphor-free substrate sheet. The process of peeling off from a sealing layer is shown.
  • FIG. 26 is a perspective view of a modification of the fifth embodiment.
  • FIG. 26A is a step of cutting the sealing layer into a substantially circular shape
  • FIG. 26B is a step of removing the sealing layer outside the sealing region. Process, FIG.
  • FIG. 27 is a process diagram (side sectional view) illustrating a method for sealing an optical semiconductor element by a modification of the sealing sheet of the fifth embodiment.
  • FIG. 27A illustrates a substrate on which the optical semiconductor element is mounted. Step of preparing, step of arranging each sealing layer so as to face the optical semiconductor element,
  • FIG. 27B is a step of sealing the optical semiconductor element with a sealing sheet, and
  • FIG. The process of peeling off from a body-free sealing layer is shown.
  • the front-rear direction (or vertical direction) indicated by the arrows in FIG. 1A is an example of a first direction
  • the left-right direction (or horizontal direction) indicated by the arrows in FIG. 1A is an example of a second direction orthogonal to the first direction
  • the up-down direction indicated by the arrows in FIG. 1A is an example (or thickness direction) of a third direction orthogonal to the first direction and the second direction.
  • the direction of FIG. 1A is used as a reference unless otherwise specified.
  • the manufacturing method of the sealing sheet 1 according to the first embodiment of the present invention includes a sealing layer forming step (see FIG. 1), a first cutting step as a cutting step (FIG. 2). Reference), placement step (see FIGS. 3 and 4), second cutting step (see FIG. 5), removal step (see FIG. 6), third cutting step (see FIG. 7), and recovery step (see FIG. 8). ).
  • sealing layer forming step In the sealing layer forming step, as shown in FIGS. 1A and 1B, first, a laminated base sheet 2 is prepared.
  • the laminated base sheet 2 is formed in a substantially rectangular flat plate shape extending in the front-rear direction (vertical direction) and the left-right direction (lateral direction).
  • the laminated substrate sheet 2 includes a first substrate sheet 3, an adhesive layer 4 laminated on the lower surface of the first substrate sheet 3, and a release sheet 5 laminated on the lower surface of the adhesive layer 4. .
  • the first base sheet 3 has an outer shape in plan view of the laminated base sheet 2, and is specifically formed in a substantially rectangular flat plate shape that is continuous in the front-rear direction and the left-right direction.
  • the first base sheet 3 is formed of a material that can support the sealing layer 6 described below. Examples of such a material include polyethylene terephthalate, polyester of polyethylene terephthalate, such as polyethylene and polypropylene. Examples thereof include resin materials such as polyolefin. Examples of the material include a ceramic sheet such as a metal foil.
  • the thickness of the 1st base material sheet 3 is 0.03 mm or more, for example, Preferably, it is 0.05 mm or more, for example, is 2 mm or less, Preferably, it is 1 mm or less.
  • the dimension of the 1st base material sheet 3 is suitably adjusted with the dimension of the sealing layer 6 demonstrated below, Specifically, the length of 1 side is 10 mm or more, for example, Preferably, it is 20 mm or more. Yes, for example, 300 mm or less, preferably 250 mm or less.
  • the adhesive layer 4 is provided on the entire lower surface of the first base sheet 3.
  • the adhesive layer 4 is made of, for example, an adhesive such as an acrylic pressure sensitive adhesive or a urethane pressure sensitive adhesive.
  • the thickness of the adhesive layer 4 is, for example, 0.1 mm or more, preferably 0.2 mm or more, and 1 mm or less, preferably 0.5 mm or less.
  • the release sheet 5 is provided on the entire lower surface of the adhesive layer 4 in order to prevent the lower surface of the adhesive layer 4 from being contaminated.
  • the release sheet 5 include polymer films such as a polyethylene film and a polyester film (such as PET), for example, a ceramic sheet such as a metal foil.
  • a polymer film is used.
  • the surface of the release sheet 5 can be subjected to a peeling treatment such as a fluorine treatment.
  • the thickness of the release sheet 5 is, for example, 0.3 mm or more, preferably 0.5 mm or more, and for example, 2 mm or less, preferably 1 mm or less.
  • the laminated substrate sheet 2 for example, first, the first substrate sheet 3 is prepared, and then the adhesive layer 4 is laminated on the lower surface of the first substrate sheet 3, and then the release sheet. 5 is laminated on the lower surface of the adhesive layer 4.
  • the laminated base material sheet 2 can also use a commercially available thing.
  • the thickness of the laminated substrate sheet 2 is, for example, 0.6 mm or more, preferably 1 mm or more, and for example, 5 mm or less, preferably 3 mm or less.
  • a sealing layer 6 is provided on the upper surface of the laminated base sheet 2 as shown in FIGS. 1A and 1B.
  • a sealing composition is prepared.
  • Sealing composition contains particles as essential components, and specifically contains particles and a resin.
  • Examples of the particles include phosphors and fillers.
  • the phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light.
  • yellow phosphor examples include silicate phosphors such as (Ba, Sr, Ca) 2 SiO 4 ; Eu, (Sr, Ba) 2 SiO 4 : Eu (barium orthosilicate (BOS)), for example, Y 3 Al Garnet-type phosphors having a garnet-type crystal structure such as 5 O 12 : Ce (YAG (yttrium, aluminum, garnet): Ce), Tb 3 Al 3 O 12 : Ce (TAG (terbium, aluminum, garnet): Ce) Examples thereof include oxynitride phosphors such as Ca- ⁇ -SiAlON.
  • silicate phosphors such as (Ba, Sr, Ca) 2 SiO 4 ; Eu, (Sr, Ba) 2 SiO 4 : Eu (barium orthosilicate (BOS)
  • Y 3 Al Garnet-type phosphors having a garnet-type crystal structure such as 5 O 12 : Ce (YAG (yttrium, aluminum, garnet): Ce
  • red phosphor examples include nitride phosphors such as CaAlSiN 3 : Eu and CaSiN 2 : Eu.
  • shape of the phosphor examples include a spherical shape, a plate shape, and a needle shape. Preferably, spherical shape is mentioned from a fluid viewpoint.
  • the average value of the maximum length of the phosphor is, for example, 0.1 ⁇ m or more, preferably 1 ⁇ m or more, and for example, 200 ⁇ m or less, preferably 100 ⁇ m or less. It is.
  • the phosphors can be used alone or in combination.
  • the blending ratio of the phosphor is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, for example, 80 parts by mass or less, preferably 50 parts by mass or less with respect to 100 parts by mass of the resin. It is.
  • the filler examples include organic fine particles such as silicone particles, and inorganic fine particles such as silica, talc, alumina, aluminum nitride, and silicon nitride.
  • the average value of the maximum length of the filler is, for example, 0.1 ⁇ m or more, preferably 1 ⁇ m or more, and, for example, 200 ⁇ m or less, preferably 100 ⁇ m or less.
  • the filler can be used alone or in combination.
  • the blending ratio of the filler is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, and, for example, 70 parts by mass or less, preferably 50 parts by mass with respect to 100 parts by mass of the resin. Or less.
  • the mixing ratio of the particles is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, and, for example, 80 parts by mass or less, preferably 60 parts by mass with respect to 100 parts by mass of the resin. It is as follows.
  • the resin examples include a thermoplastic resin that is plasticized by heating, for example, a thermosetting resin that is cured by heating, for example, an active energy ray curable that is cured by irradiation with active energy rays (for example, ultraviolet rays, electron beams, etc.). Resin etc. are mentioned.
  • the thermoplastic resin examples include vinyl acetate resin, ethylene / vinyl acetate copolymer (EVA), vinyl chloride resin, EVA / vinyl chloride resin copolymer, and the like.
  • the thermosetting resin include silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin.
  • the resin preferably includes a curable resin such as a thermosetting resin and an active energy ray curable resin.
  • the curable resin examples include silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin.
  • the curable resin examples include a two-stage curable resin and a one-stage curable resin, and a two-stage curable resin is preferable.
  • the two-stage curable resin has a two-stage reaction mechanism, and is B-staged (semi-cured) by the first-stage reaction and C-staged (final-cured) by the second-stage reaction.
  • the one-step curable resin has a one-step reaction mechanism and is completely cured by the first-step reaction.
  • the B stage is a state between the A stage in which the curable resin is in a liquid state and the fully cured C stage, and the curing and gelation are slightly advanced, and the compression elastic modulus is the elasticity of the C stage. It is a state smaller than the rate.
  • a sealing composition particles and a resin are blended.
  • blending is A stage.
  • the prepared sealing composition is applied onto the laminated base sheet 2.
  • the sealing composition is applied to the upper surface of the first base sheet 3 in an appropriate thickness by a method such as casting, spin coating, roll coating, and the like, and the film 7 Form.
  • the film 7 is formed in a pattern smaller than the first base sheet 3 in plan view, and more specifically, in a substantially rectangular pattern that exposes the peripheral edge of the upper surface of the first base sheet 3.
  • a film 7 is formed.
  • the film 7 is formed in a pattern continuous at least in the front-rear direction.
  • the coating 7 is heated and / or irradiated with active energy rays. More specifically, when the resin contains a two-step curable resin, the sealing layer 6 is B-staged (semi-cured) by heating and / or active energy ray irradiation.
  • the sheet-like sealing layer 6 is formed in the above-described pattern on the upper surface of the first base material sheet 3.
  • the sealing composition is applied to a release sheet (not shown) to form the film 7, and then the film 7 is heated and / or irradiated with active energy rays as necessary to form the sealing layer 6. Thereafter, the sealing layer 6 can be transferred to the upper surface of the first base sheet 3.
  • the dimension of the sealing layer 6 is appropriately adjusted depending on its use and purpose. Specifically, the length of one side is, for example, 5 mm or more, preferably 10 mm or more, and, for example, 300 mm or less, preferably Is 250 mm or less.
  • the first laminated sheet 8 including the laminated base sheet 2 and the sealing layer 6 is formed.
  • First cutting step In this method, the first cutting step shown in FIG. 2 is performed after the sealing layer forming step shown in FIG. In the first cutting step, the first laminated sheet 8 is cut so that the first laminated sheet 8 is divided into a plurality (specifically, five) in the front-rear direction (an example of the first direction).
  • the first laminated sheet 8 is partitioned into an outer portion 13 outside the sealing layer 6 and an inner portion 12 that includes the sealing layer 6 and is surrounded by the outer portion 13, and is sealed in the inner portion 12.
  • the first laminated sheet 8 is cut so that the layer 6 is divided into a plurality (specifically, five) in the front-rear direction.
  • a first cut consisting of a first horizontal cutting line 9 along a plurality of left and right directions and a first vertical cutting line 10 continuing to each of both ends in the left and right direction of the plurality of cutting lines 9.
  • a line 17 is formed.
  • the plurality of first horizontal cutting lines 9 are arranged in parallel at intervals in the front-rear direction.
  • the first horizontal cutting line 9 ⁇ / b> A located on the foremost side is formed so as to overlap the front edge of the sealing layer 6 in plan view.
  • the 1st horizontal cutting line 9B located in the rear side among the several 1st horizontal cutting lines 9 is formed so that it may overlap with the rear-end edge of the sealing layer 6 in planar view.
  • the first vertical cutting lines 10 are formed along the front-rear direction, and are formed as a pair so as to face each other with a gap in the left-right direction.
  • the first vertical cutting lines 10 are formed on both outer sides in the left-right direction of the sealing layer 6 with a space therebetween.
  • the first cutting line 17 has a cutting line positioned outside, specifically, the first horizontal cutting lines 9A and 9B positioned on the foremost side and the rearmost side, and the pair of first vertical cutting lines 10 in plan view.
  • a substantially rectangular shape is formed, and the first laminated sheet 8 is partitioned into an outer portion 13 and an inner portion 12.
  • a dicing apparatus using a disc-shaped dicing saw (dicing blade), a cutting apparatus using a cutter, a laser irradiation apparatus, a Thomson blade cutting machine using a Thomson blade, or the like is used.
  • the sealing layer 6 and the laminated substrate sheet 2 corresponding to the sealing layer 6 (specifically, the plurality of laminated substrate sheets 2 on which the plurality of sealing layers 6 are laminated)
  • a plurality of sealing members 11 provided are formed. Specifically, a plurality of sealing members 11 are formed side by side in the front-rear direction by dividing the inner portion 12 into a plurality of parts in the front-rear direction.
  • Each of the plurality of sealing members 11 is formed in a rectangular shape that is substantially rectangular in plan view and extends in the left-right direction.
  • both end portions in the left-right direction include the first base sheet 3, the adhesive layer 4 and the release sheet 5, and both end portions in the left-right direction of the first base sheet 3 are sealed layers. 6 is exposed. That is, in the sealing member 11, the sealing layer 6 is formed midway in the left-right direction of the first base sheet 3.
  • each sealing member 11 is, for example, 5 mm or more, preferably 8 mm or more, and for example, 100 mm or less, preferably 50 mm or less.
  • the arrangement step shown in FIGS. 3 and 4 is performed after the first cutting step shown in FIG.
  • the arranging step includes a peeling step shown in FIG. 3 and a placing step shown in FIG.
  • each sealing member 11 is pulled up by peeling the sealing member 11 by hand.
  • the plurality of sealing members 11 are arranged on the upper surface of the second base sheet 14 so as to be spaced from each other in the front-rear direction. Specifically, first, as shown by phantom lines in FIGS. 3A and 3B, the release sheet 5 of the sealing member 11 is peeled from the adhesive layer 4, and then, the adhesive layer 4 shown in FIGS. 4A and 4B. Is placed on the upper surface of the second base sheet 14, and the first base sheet 3 and the second base sheet 14 are bonded via the adhesive layer 4.
  • the second base sheet 14 is formed in a substantially rectangular flat plate shape extending in the front-rear direction and the left-right direction.
  • the second base sheet 14 is formed from the same material as the first base sheet 3.
  • the 2nd base material sheet 14 is formed larger than the sealing layer 6 (refer FIG. 1A), and, specifically, the 2nd base material sheet 14 is the length of the front-back direction at least before a cutting
  • the sealing layer 6 (see FIG. 1A) is longer than the length in the front-rear direction.
  • the length of the second base sheet 14 in the left-right direction is longer than the length of the sealing member 11 in the left-right direction.
  • the dimension of the second base sheet 14 is appropriately adjusted depending on its use and purpose.
  • the length in the front-rear direction is, for example, 20 mm or more, preferably 40 mm or more, and, for example, 300 mm or less, Preferably, it is 200 mm or less.
  • the length in the left-right direction is, for example, 20 mm or more, preferably 50 mm or more, and for example, 300 mm or less, preferably 200 mm or less.
  • the interval L1 in the front-rear direction of the sealing member 11 to be arranged is appropriately set depending on the pitch of the optical semiconductor element 15 described below, and specifically, for example, 1 mm or more, preferably 3 mm or more. Also, for example, it is 20 mm or less, preferably 10 mm or less. Further, the pitch L2 between the sealing members 11, that is, the total distance L2 of the distance L1 and the length in the front-rear direction of the sealing member 11 is, for example, 5 mm or more, preferably 10 mm or more. 100 mm or less, preferably 50 mm or less.
  • the second laminated sheet 28 including the plurality of sealing members 11 and the second base sheet 14 is configured.
  • the second cutting step shown in FIG. 5 is performed after the arranging step shown in FIG.
  • the sealing layer 6 is cut so as to partition a sealing region 16 corresponding to an optical semiconductor element 15 (see FIG. 9A) described later.
  • each sealing region 16 has a substantially circular shape in plan view.
  • a dicing apparatus using a disk-shaped dicing saw (dicing blade), a cutting apparatus using a cutter, a laser irradiation apparatus, a Thomson blade cutting machine using a Thomson blade, or the like is used.
  • the sealing layer 6 is cut
  • the cutting line formed in the thickness direction in the second cutting step is formed on the sealing layer 6 while not formed on the first base sheet 3 at all.
  • the removing step shown in FIG. 6 is performed after the second cutting step shown in FIG.
  • the sealing layer 6 outside the sealing region 16 is removed as shown in FIGS. 6A and 6B.
  • the sealing layer 6 outside the sealing region 16 is peeled from the first base material sheet 3.
  • a known peeling device is used. Specifically, an adsorption device or the like is used.
  • the circular sealing layer 6 constitutes a sealing region 16 that substantially contributes to the sealing of the optical semiconductor element 15.
  • the diameter of the sealing region 16 is, for example, 5 mm or more, preferably 8 mm or more, and, for example, 50 mm or less, preferably 30 mm or less.
  • the third cutting step shown in FIG. 7 is performed after the removing step shown in FIGS. 6A and 6B.
  • the sealing member 11 is divided into a plurality of (specifically, five) sealing members 11 in the left-right direction.
  • the sheet 28 is cut.
  • the through-hole 24 is formed in the front-back direction both ends of the 2nd base material sheet 14 simultaneously with the division
  • the second laminated sheet 28 By the cutting of the second laminated sheet 28, it is composed of a second longitudinal cutting line 19 along a plurality of front and rear directions and a second horizontal cutting line 20 continuous to each of both end portions in the front and rear direction of the plurality of second longitudinal cutting lines 19.
  • a second cutting line 18 is formed.
  • the plurality of second vertical cutting lines 19 are formed in parallel in the left-right direction at intervals.
  • the second vertical cutting line 19 divides the first base material sheet 3, the adhesive layer 4 and the second base material sheet 14 in the left-right direction, and separates the plurality of sealing layers 6 into individual pieces. ,It is formed.
  • the sealing layers 6 are arranged in a plurality of rows (specifically, 4 rows) in the front-rear direction by the second horizontal cutting lines 19.
  • the second vertical cutting line 19C on the both outer sides in the left-right direction includes the first base sheet 3, the adhesive layer 4 and the second base sheet 14 (that is, the inner part in the left-right direction) corresponding to the sealing layer 6, It forms so that the 1st base material sheet 3 and the adhesive bond layer 4 (namely, left-right direction outer side part) which do not correspond to the sealing layer 6 may be partitioned off.
  • the second horizontal cutting lines 20 are formed along the left-right direction, and are formed as a pair in the front-rear direction with a space therebetween.
  • the pair of second horizontal cutting lines 20 are formed on the front side of the foremost sealing member 11 and on the rear side of the rearmost sealing member 11 with a gap therebetween.
  • the second cutting line 18 includes a pair of second vertical cutting lines 19C and a pair of second vertical cutting lines 20 on the outside in the left and right direction, specifically, in plan view. It is formed so as to form a substantially rectangular shape and include a plurality of sealing layers 6.
  • the through hole 24 is formed by penetrating the second base material sheet 14 on both outer sides in the front-rear direction of the first base material sheet 3 and the adhesive layer 4 in the thickness direction.
  • a pair of through holes 24 is provided for each row of the second base sheet 14 partitioned into a plurality of rows by the second vertical cutting line 20, and each through hole 24 has a substantially circular shape in plan view. Is formed.
  • the collection step shown in FIG. 8 is performed after the third cutting step shown in FIG.
  • the collecting step as shown in FIGS. 8A to 8D, the second laminated sheet 28 (see FIG. 7) including the sealing member 11 partitioned by the second cutting line 18 is collected.
  • the second base sheet 14 formed so as to be continuous in the front-rear direction and a plurality of seals arranged on the upper surface (front surface) of the second base sheet 14 at intervals from each other in the front-rear direction.
  • a sealing sheet 1 including the member 11 is obtained.
  • the plurality of sealing members 11 are stacked on the upper surface of the second base sheet 14 at intervals in the front-rear direction, and the plurality of adhesive layers 4.
  • a plurality of first base sheet 3 bonded to the upper surface, and a plurality of sealing layers 6 respectively stacked on the upper surfaces of the plurality of first base sheet 3.
  • Each of the plurality of sealing layers 6 defines a sealing region 16.
  • a fixing member such as a pin provided in the transport container is inserted into the through hole 24 of the seal sheet 1 to fix the seal sheet 1 to the transport container. It is transported to equipment manufacturing factories.
  • a substrate 21 on which an optical semiconductor element 15 to be sealed is mounted is prepared.
  • the substrate 21 is formed in a substantially rectangular flat plate shape extending at least in the front-rear direction.
  • the substrate 21 is made of an insulating substrate such as a silicon substrate, a ceramic substrate, a polyimide resin substrate, or a laminated substrate in which an insulating layer is laminated on a metal substrate.
  • a conductor pattern (not shown) provided on the upper surface of the substrate 21 is provided with an electrode (not shown) for electrically connecting to a terminal (not shown) of the optical semiconductor element 15 and a wiring continuous therewith. Is formed.
  • the conductor pattern is formed from a conductor such as gold, copper, silver, or nickel.
  • the dimension in plan view of the substrate 21 is appropriately selected. Specifically, the length in the front-rear direction is, for example, 5 mm or more, preferably 10 mm or more, and for example, 200 mm or less, preferably 150 mm or less. is there.
  • substrate 21 is 100 micrometers or more, for example, Preferably, it is 500 micrometers or more, for example, is 5000 micrometers or less, Preferably, it is 3000 micrometers or less.
  • the optical semiconductor element 15 is an optical semiconductor element that converts electrical energy into light energy.
  • the thickness is the length in the plane direction (the length in the direction perpendicular to the thickness direction, specifically, the length in the front-rear direction and the length in the left-right direction).
  • A) It is formed in a substantially rectangular shape in section view.
  • the optical semiconductor element 15 is formed in a substantially rectangular shape in plan view.
  • the optical semiconductor element 15 examples include an LED (light emitting diode element) such as a blue LED that emits blue light, and an LD (laser diode).
  • the dimensions of the optical semiconductor element 15 are appropriately set according to the use and purpose. Specifically, the thickness is, for example, 10 to 1000 ⁇ m, the length in the front-rear direction and / or the length in the left-right direction in plan view is For example, it is 0.01 mm or more, preferably 0.1 mm or more, and for example, 15 mm or less, preferably 20 mm or less.
  • the optical semiconductor elements 15 are aligned and spaced in the front-rear direction.
  • An interval (interval in the front-rear direction) L3 between the optical semiconductor elements 15 is, for example, 3 mm or more, preferably 5 mm or more, and, for example, 150 mm or less, preferably 70 mm or less.
  • the pitch L4 between the optical semiconductor elements 15, that is, the total distance L4 of the distance L3 and the length of the optical semiconductor element 15 is the same as the pitch L2 between the sealing members 11, and specifically, Is, for example, 5 mm or more, preferably 10 mm or more, and for example, 100 mm or less, preferably 50 mm or less.
  • the optical semiconductor element 15 is, for example, flip-chip mounted on the substrate 21. Alternatively, the optical semiconductor element 15 is connected to an electrode (not shown) of the substrate 21 by wire bonding.
  • the sealing sheet 1 is arranged so that each sealing layer 6 faces the optical semiconductor element 15 in the thickness direction.
  • the optical semiconductor element 15 is then sealed with the sealing sheet 1 as shown in FIG. 9B.
  • the sealing sheet 1 is pushed down relative to the substrate 21.
  • each of the plurality of sealing layers 6 covers and seals each of the plurality of optical semiconductor elements 15. That is, each of the plurality of sealing layers 6 embeds each of the plurality of optical semiconductor elements 15.
  • the sealing layer 6 contains a curable resin, the sealing layer 6 is C-staged (completely cured).
  • the optical semiconductor device 22 including the substrate 21, the plurality of optical semiconductor elements 15, and the plurality of sealing layers 6 is obtained.
  • the plurality of sealing layers 6 are provided at intervals in the front-rear direction and form the sealing region 16.
  • Each of the plurality of sealing layers 6 seals each of the plurality of optical semiconductor elements 15.
  • the sealing region 16 covers the upper surface and side surfaces of the optical semiconductor element 15.
  • the substrate 21 corresponding to each optical semiconductor element 15 is cut into individual pieces.
  • the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, and the single sealing layer 6 is obtained.
  • the sealing layer 6 is cut
  • the stop member 11 is arrange
  • the 1st lamination sheet 8 provided with the sealing layer 6 and the 1st base material sheet 3 is formed in the sealing layer formation process shown in FIG.
  • the first laminated sheet 8 is cut, so that the handling property of the sealing layer 6 is improved and the first cutting step can be performed.
  • the accuracy of cutting the sealing layer 6 can be improved.
  • this sealing sheet 1 since the some sealing member 11 is arrange
  • the sealing layer 6 is interposed by the second base material sheet 14 formed so as to be continuous in the front-rear direction, with the first base material sheet 3 arranged at intervals in the front-rear direction. Can be supported. Therefore, the sealing layer 6 can be flexibly supported by the first base material sheet 3 and the second base material sheet 14 while reducing the manufacturing cost of the sealing sheet 1.
  • a positioning mark 23 can be provided on the sealing sheet 1.
  • the positioning mark 23 is formed simultaneously with the formation of the second cutting line 18 in the third cutting step shown in FIG.
  • the positioning mark 23 is formed outside the sealing layer 6 as shown in FIGS.
  • a pair of positioning marks 23 is provided for each sealing layer 6.
  • a pair of positioning marks 23 are provided so as to sandwich each sealing layer 6, and one positioning mark 23 is provided on the rear side and the right side with respect to the sealing layer 6, and the other positioning mark 23 is positioned.
  • the mark 23 is provided on the front side and the left side with respect to the sealing layer 6.
  • Each positioning mark 23 is formed as a substantially circular through hole in a plan view that penetrates the sealing sheet 1 in the thickness direction.
  • the positioning mark 23 is formed on the outer side of the first base sheet 3 and the adhesive layer 4, specifically on both outer sides in the front-rear direction, and penetrates the second base sheet 14. It is formed to do. Note that the positioning marks 23 provided between the plurality of sealing layers 6 are formed to face each other in the left-right direction.
  • the positioning mark 23 is outside the sealing layer 6 and inside the peripheral edge of the first base sheet 3, the first base sheet 3, the adhesive layer 4, and the first 2 It is formed so as to penetrate through the base material sheet 14.
  • the pair of positioning marks 23 is formed on a diagonal line of the substantially rectangular first base sheet 3.
  • the positioning mark 23 provided on the foremost side is formed on the diagonally left rear side of the front through-hole 24 with an interval.
  • the positioning mark 23 provided on the rear side is formed on the right front side of the rear through hole 24 at an interval.
  • the sealing region 16 of each sealing layer 6 is formed in a substantially circular shape, but the shape is not particularly limited. For example, as shown in FIG. 12, it is long in the front-rear direction. It is also possible to form a substantially elliptical shape, for example, a substantially hexagonal shape as shown in FIG. 13, for example, a substantially rectangular shape as shown in FIG.
  • the second cutting step shown in FIG. 5 can be performed after the first cutting step shown in FIG. 2 or simultaneously with the first cutting step.
  • the second cutting step shown in FIG. 5 is performed after the placement step shown in FIG.
  • the removal process of FIG. 6 is implemented after the mounting process shown in FIG.
  • the sealing region 16 can also be formed.
  • the adhesive layer 4 is provided in the lamination
  • the first base sheet 3 preferably has adhesiveness, and the release sheet 5 is laminated on the lower surface thereof.
  • the sealing layer 6 is formed on the laminated substrate sheet 2, and subsequently, in the first cutting step shown in FIG. 2, the sealing layer 6 is laminated. Although it cut
  • the adhesive layer 4 is provided between the first base sheet 3 and the release sheet 5, and the recovery step of FIGS. 8A and 8B.
  • the adhesive layer 4 is provided between the second base sheet 14 and the first base sheet 3.
  • the adhesive layer 4 is not provided, and the laminated base sheet 2 is configured from the first base sheet 3 and the release sheet 5,
  • the sealing member 11 can also be configured from the second base sheet 14, the first base sheet 3, and the sealing layer 6 that are recovered in the recovery step. That is, in the sealing member 11, the first base sheet 3 can be directly laminated on the upper surface of the second base sheet 14.
  • the second cutting step in FIG. 5 and the third cutting step in FIG. 7 can be performed simultaneously.
  • the sealing layer 6 is cut so as to partition the sealing region 16, and the second laminated sheet is divided into a plurality of sealing members 11. 28 is cut.
  • the removing step shown in FIG. 6 is performed. That is, in this removing step, the sealing layer 6 outside the sealing region 16 is removed.
  • the second cutting step shown in FIG. 5 and the removing step shown in FIG. 6 are carried out, but the second cutting step and the removing step are not carried out, and after the arrangement step shown in FIG.
  • the 3rd cutting process shown in 15 can also be implemented.
  • the manufacturing method of the sealing sheet 1 which is 2nd Embodiment of this invention is a sealing layer formation process (refer FIG. 1), a 1st cutting process (refer FIG. 2), an arrangement
  • the sealing layer 6 after the recovery step has a substantially rectangular shape in plan view, and is disposed to face each other with a space in the front-rear direction.
  • the same operational effects as those of the first embodiment can be obtained. Further, since the second cutting step (see FIG. 5) and the removing step (see FIG. 6) are not performed, the number of manufacturing steps can be reduced. The manufacturing cost can be further reduced.
  • the first laminated sheet 8 is cut so that the first laminated sheet 8 is divided into a plurality of parts in the front-rear direction and the left-right direction.
  • the first cutting lines 17 are formed in a substantially grid pattern in plan view. Specifically, the first vertical cutting lines 10 are arranged in parallel in the left-right direction at intervals.
  • the plurality of sealing members 11 are arranged on the upper surface of the second base sheet 14 so as to be spaced apart from each other in the front-rear direction and the left-right direction.
  • the second base sheet 14 is cut so that the sealing member 11 is divided into a plurality of rows (specifically, four rows) in the left-right direction.
  • the second longitudinal cutting line 19 of the second cutting line 18 is formed so as to pass between the first base sheet 3 and the adhesive layer 4 adjacent in the left-right direction.
  • the first base sheet 3 and the adhesive layer 4 are formed in the middle (in the middle) of the second base sheet 14 in the left-right direction. That is, the upper surface of the peripheral end portion of the second base sheet 14 is exposed from the first base sheet 3.
  • the same operational effects as those of the first embodiment can be obtained.
  • the first laminated sheet 8 is divided into a plurality of parts in the left-right direction.
  • the first laminated sheet 8 is cut, and then, as shown in FIG. 18, a plurality of sealing members 11 are arranged on the second base sheet 14 so as to be spaced from each other in the left-right direction. Therefore, the yield of the sealing layer 6 can be further improved, and the manufacturing cost of the sealing sheet 1 can be reduced.
  • FIG. 21 FIG. 23, FIG. 24, FIG. 26 and FIG. 27, the left-right direction (or horizontal direction) indicated by the arrow is an example of the first direction. (Direction) is an example of the second direction.
  • the manufacturing method of the sealing sheet 1 which is 3rd Embodiment of this invention comprises a sealing layer formation process (refer FIG. 21A and FIG. 21B), and a cutting process (refer FIG. 21C).
  • a base sheet 31 is prepared.
  • the base material sheet 31 is formed in a substantially rectangular flat plate shape extending in the front-rear direction and the left-right direction, and is configured similarly to the first base material sheet 3 of the first embodiment.
  • the sealing layer 6 is provided on the upper surface of the base sheet 31.
  • the plurality of sealing layers 6 are provided on the upper surface of the base sheet 31 so as to be along the front-rear direction with a space in the left-right direction.
  • the interval L5 between the sealing layers 6 is appropriately set depending on the pitch of the optical semiconductor element 15 (see FIG. 22A) as a sealing target, and specifically, for example, 1 mm or more.
  • the thickness is preferably 3 mm or more, and for example, 20 mm or less, preferably 10 mm or less.
  • the pitch L6 between the plurality of sealing layers 6, that is, the above-described distance L5 and the total length L6 of the length in the front-rear direction of the sealing layer 6 is, for example, 5 mm or more, preferably 10 mm or more. 100 mm or less, preferably 50 mm or less.
  • the sealing layer 6 on the upper surface of the base material sheet 31, for example, a method of applying the sealing composition described above to the base material sheet 31, for example, on a separately prepared release sheet (not shown), A method of transferring the sealing layer 6 to the base material sheet 31 after applying the sealing composition described above in the left-right direction at a distance from each other to form the sealing layer 6 may be mentioned.
  • the base material sheet 31 is applied from the viewpoint of reducing the number of manufacturing steps.
  • the sealing composition is continuously spaced in the front-rear direction, spaced apart from each other in the left-right direction in an area smaller than the base sheet 31 on the upper surface of the base sheet 31.
  • the film 7 is formed by coating with a pattern.
  • the coating 7 is heated and / or irradiated with active energy rays. More specifically, when the resin contains a two-step curable resin, the sealing layer 6 is B-staged (semi-cured) by heating and / or active energy ray irradiation.
  • the sheet-shaped sealing layer 6 is provided on the upper surface of the base material sheet 31 at intervals in the left-right direction.
  • the laminated sheet 32 is cut so that the laminated sheet 32 is divided into a plurality of parts in the front-rear direction.
  • the sealing layer 6 is cut together with the base sheet 31 so that each of the plurality of sealing layers 6 is divided into a plurality of parts in the front-rear direction.
  • the sealing sheet 1 including the base sheet 31 extending in the left-right direction and the sealing layers 6 arranged on the upper surface of the base sheet 31 at intervals in the left-right direction is obtained.
  • a substrate 21 on which an optical semiconductor element 15 is mounted is prepared.
  • the sealing sheet 1 is arranged so that each sealing layer 6 faces the optical semiconductor element 15 in the thickness direction.
  • the optical semiconductor element 15 is then sealed with the sealing sheet 1 as shown in FIG. 22B.
  • the sealing sheet 1 is pushed down relative to the substrate 21.
  • each of the plurality of sealing layers 6 covers and seals each of the plurality of optical semiconductor elements 15. That is, each of the plurality of sealing layers 6 embeds each of the plurality of optical semiconductor elements 15.
  • the sealing layer 6 contains a curable resin, the sealing layer 6 is C-staged (completely cured).
  • the base material sheet 31 is peeled off from the sealing layer 6 as shown in FIG. 22C.
  • the optical semiconductor device 22 including the substrate 21, the plurality of optical semiconductor elements 15, and the plurality of sealing layers 6 is obtained.
  • the substrate 21 corresponding to each optical semiconductor element 15 is cut into individual pieces.
  • the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, and the single sealing layer 6 is obtained.
  • the sealing layer 6 containing particles is formed at intervals in the left-right direction and along the front-rear direction, the sealing layer 6 is then moved in the left-right direction. Are sealed with respect to the optical semiconductor element 15 arranged at a distance from each other. Therefore, the sealing layer 6 can be used effectively. As a result, the yield of the sealing layer 6 can be improved and the manufacturing cost of the sealing sheet 1 can be reduced.
  • this sealing sheet 1 in a sealing layer formation process, since the sealing layer 6 is formed by apply
  • a cutting step of cutting the sealing layer 6 so that the sealing layer 6 is divided into a plurality of portions in the front-rear direction since it implements, the yield of the sealing layer 6 in the front-back direction can be improved and the manufacturing cost of the sealing sheet 1 can be reduced.
  • the yield of the particles containing the phosphor can be improved.
  • the sealing layer 6 shown in FIG. 21B can be cut into a predetermined shape. Specifically, the sealing layer 6 is cut into a substantially circular shape so as not to cut the base sheet 31. Specifically, a dicing apparatus using a disk-shaped dicing saw (dicing blade), a cutting apparatus using a cutter, a laser irradiation apparatus, a Thomson blade cutting machine using a Thomson blade, and the like are used.
  • the sealing sheet 1 including the sealing region 16 formed on the upper surface of the base sheet 31 is obtained.
  • the manufacturing method of the sealing sheet 1 according to the fourth embodiment of the present invention includes a phosphor-free sealing layer forming step (see FIGS. 24A and 24B), and a sealing layer formation.
  • a process (refer FIG. 24C) and a cutting process (refer FIG. 24D) are provided.
  • a phosphor-free sealing layer 33 is provided on the upper surface of the base material sheet 31.
  • the phosphor-free encapsulating layer 33 is formed on the upper surface of the base material sheet 31 from the encapsulating composition not containing the phosphor.
  • the phosphor-free sealing layer 33 having a substantially rectangular shape in plan view that is slightly smaller than the base sheet 31 is formed. That is, the phosphor-free sealing layer 33 is formed in a pattern that exposes the outer peripheral end of the base sheet 31.
  • the particles preferably contain a phosphor.
  • the laminated sheet 32 comprised from the base material sheet 31, the fluorescent substance-free sealing layer 33, and the sealing layer 6 is obtained by the sealing layer forming step.
  • the laminated sheet 32 is cut so that the laminated sheet 32 is divided into a plurality of parts in the front-rear direction. More specifically, each of the phosphor-free sealing layer 33 and the sealing layer 6 is divided into a plurality of parts in the front-rear direction, so that the phosphor-free sealing layer 33 and the sealing layer 6 are not divided. Is cut together with the base material sheet 31.
  • the base sheet 31 extending in the left-right direction, the phosphor-free sealing layer 33 continuously formed in the left-right direction on the upper surface of the base sheet 31, and the upper surface of the phosphor-free sealing layer 33 And the sealing sheet 1 provided with the sealing layer 6 arrange
  • a substrate 21 on which an optical semiconductor element 15 is mounted is prepared.
  • the sealing sheet 1 is arranged so that each sealing layer 6 faces the optical semiconductor element 15 in the thickness direction.
  • the optical semiconductor element 15 is then sealed with the sealing sheet 1 as shown in FIG. 25B.
  • the sealing sheet 1 is pushed down relative to the substrate 21.
  • each of the plurality of sealing layers 6 covers and seals each of the plurality of optical semiconductor elements 15. That is, each of the plurality of sealing layers 6 embeds each of the plurality of optical semiconductor elements 15.
  • the phosphor-free sealing layer 33 exposed from the sealing layer 6 fills the gaps between the plurality of sealing layers 6. Thereafter, when the sealing layer 6 and / or the phosphor-free sealing layer 33 contains a curable resin, the sealing layer 6 and / or the phosphor-free sealing layer 33 is made C-staged (completely cured). )
  • the base material sheet 31 is peeled off from the phosphor-free sealing layer 33.
  • the optical semiconductor device 22 including the substrate 21, the plurality of optical semiconductor elements 15, the single phosphor-free sealing layer 33, and the plurality of sealing layers 6 is obtained.
  • the substrate 21 and the phosphor-free sealing layer 33 corresponding to each optical semiconductor element 15 are cut into individual pieces.
  • the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, the single phosphor-free sealing layer 33, and the single sealing layer 6 is obtained.
  • the sealing sheet 1 since the phosphor-free sealing layer 33 does not contain a phosphor, even if the phosphor-free sealing layer 33 is formed with a pattern that is continuous in the left-right direction, The phosphor-free sealing layer 33 can be manufactured at a low cost. Therefore, if the phosphor-free sealing layer 33 is formed and the sealing layer 6 is laminated on the phosphor-free sealing layer 33, the sealing sheet 1 having various physical properties can be configured. it can.
  • the phosphor-free sealing layer 33 and the sealing layer 6 can have various physical properties.
  • the sealing layer 6 and the phosphor-free sealing layer 33 shown in FIG. 24C can be cut into a predetermined shape. Specifically, the sealing layer 6 and the phosphor-free sealing layer 33 are cut into a substantially circular shape so as not to cut the base sheet 31.
  • the sealing sheet 1 including the sealing region 16 formed on the upper surface of the base sheet 31 is obtained.
  • the substrate 21 and the phosphor-free sealing layer 33 corresponding to each optical semiconductor element 15 are cut into individual pieces.
  • the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, the single phosphor-free sealing layer 33, and the single sealing layer 6 is obtained.
  • the manufacturing method of a sealing sheet is used for manufacture of a sealing sheet.

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Abstract

A method for manufacturing a sealing sheet provided with a plurality of sealing members spaced apart from each other in a first direction. The method for manufacturing a sealing sheet is provided with: a sealing layer formation step for forming a sealing layer containing particles so as to be continuous in the first direction; a cutting step for cutting the sealing layer after the sealing layer formation step so that the sealing layer is divided in a plurality of sections in the first direction, and forming a plurality of sealing members; and a layout step for laying out the sealing members after the cutting step so that the sealing members are spaced apart from each other in the first direction.

Description

封止シートおよびその製造方法Sealing sheet and manufacturing method thereof
　本発明は、封止シートおよびその製造方法、詳しくは、封止シートの製造方法およびそれによって製造される封止シートに関する。 The present invention relates to a sealing sheet and a method for manufacturing the same, and more particularly to a method for manufacturing a sealing sheet and a sealing sheet manufactured thereby.
　従来、発光ダイオード（ＬＥＤ）などの光半導体素子を、封止シートで封止することが知られている。 Conventionally, it is known to seal an optical semiconductor element such as a light emitting diode (LED) with a sealing sheet.
　例えば、長尺状の剥離シートに、長尺方向に連続するように、蛍光体やシリカなどの粒子を含有する封止樹脂層を積層した封止シートによって、長尺方向に間隔を隔てて配置される複数のＬＥＤに封止樹脂層を対向配置して、ＬＥＤを封止する方法が提案されている（例えば、下記特許文献１参照。）。 For example, an encapsulating sheet in which a sealing resin layer containing particles such as phosphors and silica is laminated on a long release sheet so as to be continuous in the longitudinal direction is arranged at an interval in the longitudinal direction. A method has been proposed in which a sealing resin layer is disposed opposite to a plurality of LEDs to seal the LEDs (see, for example, Patent Document 1 below).
特開２０１２－１４２３６４号公報JP 2012-142364 A
　しかるに、各光半導体素子の比較的近傍に位置する封止樹脂層（すなわち、封止領域）は、光半導体素子の上面および側面を被覆するなどして、光半導体素子の封止に寄与する。一方、各光半導体素子に対して比較的遠隔に位置する封止樹脂層、具体的には、隣接する光半導体素子間の中央（長尺方向途中）に位置する封止樹脂層（すなわち、非封止領域）は、光半導体素子の封止に実質的に寄与しない。そのため、非封止領域の封止樹脂層は、光半導体素子の封止において不要な領域となり、その分、上記した粒子を含有する封止樹脂層の歩留まりが低下する。その結果、封止シートの製造コストが増大するという不具合がある。 However, a sealing resin layer (that is, a sealing region) positioned relatively near each optical semiconductor element contributes to sealing of the optical semiconductor element by covering the upper surface and side surfaces of the optical semiconductor element. On the other hand, a sealing resin layer positioned relatively remotely with respect to each optical semiconductor element, specifically, a sealing resin layer positioned in the center (in the middle of the longitudinal direction) between adjacent optical semiconductor elements (that is, non-blocking resin layer) The sealing region) does not substantially contribute to the sealing of the optical semiconductor element. Therefore, the sealing resin layer in the non-sealing region becomes an unnecessary region in the sealing of the optical semiconductor element, and accordingly, the yield of the sealing resin layer containing the above-described particles is lowered. As a result, there exists a malfunction that the manufacturing cost of a sealing sheet increases.
　他方、上記した非封止領域を、封止樹脂層を一旦形成した後に除去することも試案されるが、封止樹脂層は、上記した粒子の他に、樹脂や添加物を含有するので、除去した非封止領域から、粒子のみを回収して再利用することは困難である。そのため、やはり、非封止領域の形成に起因する封止樹脂層の歩留まりの低下およびそれに起因する封止シートの製造コストの増大を防止することができないという不具合がある。 On the other hand, it is also devised to remove the above-described non-sealing region after once forming the sealing resin layer, but the sealing resin layer contains a resin and an additive in addition to the above-described particles. It is difficult to recover and reuse only the particles from the removed non-sealed region. Therefore, there is still a problem that it is impossible to prevent a decrease in the yield of the sealing resin layer due to the formation of the non-sealing region and an increase in the manufacturing cost of the sealing sheet due to the yield.
　本発明の目的は、封止層の歩留まりを向上させて、封止シートの製造コストを低減することのできる、封止シートの製造方法およびそれによって製造される封止シートを提供することにある。 The objective of this invention is improving the yield of a sealing layer, and providing the manufacturing method of a sealing sheet which can reduce the manufacturing cost of a sealing sheet, and the sealing sheet manufactured by it. .
　上記目的を達成するために、本発明の封止シートの製造方法は、第１方向に互いに間隔を隔てて配置される複数の封止部材を備える封止シートの製造方法であって、前記第１方向に連続するように、粒子を含有する封止層を形成する封止層形成工程、前記封止層形成工程の後に、前記封止層が前記第１方向において複数分割されるように前記封止層を切断して、複数の前記封止部材を形成する切断工程、および、前記切断工程の後に、複数の前記封止部材を、前記第１方向に互いに間隔を隔てるように配置する配置工程を備えることを特徴としている。 In order to achieve the above object, a manufacturing method of a sealing sheet of the present invention is a manufacturing method of a sealing sheet including a plurality of sealing members arranged at intervals in a first direction, wherein the first The sealing layer forming step of forming a sealing layer containing particles so as to be continuous in one direction, and after the sealing layer forming step, the sealing layer is divided into a plurality of portions in the first direction. A cutting step of cutting a sealing layer to form a plurality of the sealing members, and an arrangement in which the plurality of sealing members are arranged so as to be spaced apart from each other in the first direction after the cutting step. It is characterized by comprising a process.
　この封止シートの製造方法では、封止層が第１方向において複数分割されるように封止層を切断して、複数の封止部材を形成し、その後、複数の封止部材を、第１方向に互いに間隔を隔てるように配置する。そのため、切断後の複数の封止部材を、簡便な方法によって、第１方向に互いに間隔を隔てるように配置するので、第１方向に連続するように形成される封止層を、有効に利用することができる。そのため、封止層の歩留まりを向上させて、封止シートの製造コストを低減することができる。 In the manufacturing method of the sealing sheet, the sealing layer is cut so that the sealing layer is divided into a plurality of parts in the first direction to form a plurality of sealing members. It arrange | positions so that it may mutually space apart in one direction. Therefore, since the plurality of sealing members after cutting are arranged so as to be spaced apart from each other in the first direction by a simple method, the sealing layer formed so as to be continuous in the first direction is effectively used. can do. Therefore, the yield of a sealing layer can be improved and the manufacturing cost of a sealing sheet can be reduced.
　また、本発明の封止シートの製造方法では、前記封止層形成工程では、前記封止層を、前記第１方向に連続する第１基材シートの表面に形成することによって、前記封止層および前記第１基材シートを備える積層シートを形成し、前記切断工程では、前記積層シートが前記第１方向において複数分割されるように、前記積層シートを切断することによって、前記封止層および前記第１基材シートから前記封止部材を形成することが好適である。 Moreover, in the manufacturing method of the sealing sheet of this invention, the said sealing layer formation process WHEREIN: By forming the said sealing layer on the surface of the 1st base material sheet continuous in the said 1st direction, the said sealing is performed. Forming a laminated sheet comprising a layer and the first base sheet, and in the cutting step, cutting the laminated sheet so that the laminated sheet is divided into a plurality of pieces in the first direction, whereby the sealing layer It is preferable to form the sealing member from the first base sheet.
　この封止シートの製造方法によれば、封止層形成工程では、封止層および第１基材シートを備える積層シートを形成するので、封止層を第１基材シートによって支持することができ、続いて、切断工程において、積層シートを切断するので、封止層の取扱性を向上させて、切断工程における封止層の切断の精度を向上させることができる。 According to this method for producing a sealing sheet, in the sealing layer forming step, a laminated sheet including the sealing layer and the first base sheet is formed, so that the sealing layer can be supported by the first base sheet. Then, since the laminated sheet is cut in the cutting step, the handleability of the sealing layer can be improved, and the accuracy of cutting the sealing layer in the cutting step can be improved.
　また、本発明の封止シートの製造方法では、前記配置工程では、複数の前記封止部材を、前記第１方向に連続して形成される第２基材シートの表面に、前記第１方向に互いに間隔を隔てるように配置することが好適である。 Moreover, in the manufacturing method of the sealing sheet of this invention, in the said arrangement | positioning process, the said 1st direction is provided on the surface of the 2nd base material sheet formed continuously in the said 1st direction in the said some sealing member. It is preferable to arrange them at a distance from each other.
　この封止シートの製造方法では、複数の封止部材を第２基材シートの表面に配置するので、複数の封止部材の配置の精度を向上させることができる。そのため、複数の封止部材によって複数の光半導体素子を精度よく封止することができる。 In this method for manufacturing a sealing sheet, since a plurality of sealing members are arranged on the surface of the second base sheet, the accuracy of the arrangement of the plurality of sealing members can be improved. Therefore, a plurality of optical semiconductor elements can be accurately sealed by a plurality of sealing members.
　また、本発明の封止シートの製造方法では、粒子が、蛍光体を含有することが好適である。 In the method for producing a sealing sheet of the present invention, it is preferable that the particles contain a phosphor.
　この封止シートの製造方法では、蛍光体を含有する粒子の歩留まりを向上させることができる。 In this method for producing a sealing sheet, the yield of particles containing a phosphor can be improved.
　本発明の封止シートの製造方法は、第１方向に互いに間隔を隔て、かつ、前記第１方向に対する交差する第２方向に沿い、粒子を含有する封止層を形成する封止層形成工程、および、前記封止層が前記第２方向において複数分割されるように前記封止層を切断する切断工程を備えることを特徴としている。 The method for producing a sealing sheet of the present invention includes a sealing layer forming step of forming a sealing layer containing particles along a second direction that is spaced from each other in the first direction and intersects the first direction. And a cutting step of cutting the sealing layer so that the sealing layer is divided into a plurality of parts in the second direction.
　この封止シートの製造方法では、第１方向に互いに間隔を隔て、かつ、第１方向に対する交差する第２方向に沿い、粒子を含有する封止層を形成するので、その後、封止層を、第１方向に互いに間隔を隔てて配置される封止対象に対して封止すれば、封止層を有効に利用することができる。そのため、封止層の歩留まりを向上させて、封止シートの製造コストを低減することができる。 In the manufacturing method of this sealing sheet, since the sealing layer containing particles is formed along the second direction that is spaced from each other in the first direction and intersects the first direction, the sealing layer is then formed. The sealing layer can be used effectively if sealing is performed on the objects to be sealed that are spaced from each other in the first direction. Therefore, the yield of a sealing layer can be improved and the manufacturing cost of a sealing sheet can be reduced.
　本発明の封止シートの製造方法において、前記封止層形成工程では、封止組成物を前記第２方向に沿って塗布することによって、前記封止層を形成することが好適である。 In the method for producing a sealing sheet of the present invention, it is preferable that in the sealing layer forming step, the sealing layer is formed by applying a sealing composition along the second direction.
　この封止シートの製造方法では、封止層形成工程では、封止組成物を第２方向に沿って塗布することによって、封止層を形成するので、第２方向に沿う封止層を効率よく形成することができる。 In this sealing sheet manufacturing method, in the sealing layer forming step, the sealing layer is formed by applying the sealing composition along the second direction, so the sealing layer along the second direction is efficiently used. Can be well formed.
　さらに、この方法では、封止組成物を第２方向に沿って塗布する封止層形成工程の後に、封止層が第２方向において複数分割されるように封止層を切断する切断工程を実施するので、第２方向における封止層の歩留まりを向上させて、封止シートの製造コストを低減することができる。 Further, in this method, after the sealing layer forming step of applying the sealing composition along the second direction, a cutting step of cutting the sealing layer so that the sealing layer is divided into a plurality of portions in the second direction. Since it implements, the yield of the sealing layer in a 2nd direction can be improved, and the manufacturing cost of a sealing sheet can be reduced.
　本発明の封止シートの製造方法は、封止対象に対応する封止領域を仕切るように、前記封止層を切断する工程、および、前記封止領域の外側の前記封止層を除去する工程をさらに備えることが好適である。 The method for producing a sealing sheet of the present invention includes a step of cutting the sealing layer so as to partition a sealing region corresponding to a sealing target, and removing the sealing layer outside the sealing region. It is preferable to further include a step.
　この封止シートの製造方法では、封止対象に対応する封止領域を仕切るように、封止層を切断し、封止領域の外側の封止層を除去するので、封止層をより一層有効に利用することができる。 In this method for producing a sealing sheet, the sealing layer is cut and the sealing layer outside the sealing region is removed so as to partition the sealing region corresponding to the target to be sealed. It can be used effectively.
　本発明の封止シートの製造方法では、粒子が、蛍光体を含有することが好適である。 In the method for producing a sealing sheet of the present invention, it is preferable that the particles contain a phosphor.
　この封止シートの製造方法では、粒子が、蛍光体を含有するので、蛍光体を含有する粒子の歩留まりを向上させることができる。 In this method for producing a sealing sheet, since the particles contain a phosphor, the yield of the particles containing the phosphor can be improved.
　本発明の封止シートは、粒子を含有しない蛍光体不含封止層を前記第１方向に連続して形成する工程をさらに備え、前記封止層形成工程では、前記封止層を、前記蛍光体不含封止層に対して積層し、前記切断工程では、前記蛍光体不含封止層を前記封止層とともに、前記蛍光体不含封止層が前記第２方向において複数分割されるように、切断することが好適である。 The sealing sheet of the present invention further comprises a step of continuously forming a phosphor-free sealing layer containing no particles in the first direction, and in the sealing layer forming step, the sealing layer is The phosphor-free sealing layer is laminated, and in the cutting step, the phosphor-free sealing layer is divided into a plurality of the phosphor-free sealing layers together with the sealing layer in the second direction. Thus, it is preferable to cut.
　蛍光体不含封止層は、蛍光体を含有しないので、蛍光体不含封止層を第１方向に連続して形成しても、蛍光体不含封止層を低コストで製造することができる。そのため、かかる蛍光体不含封止層を形成し、その蛍光体不含封止層に対して封止層を積層すれば、種々の物性を有する封止シートを構成することができる。 Since the phosphor-free encapsulating layer does not contain a phosphor, the phosphor-free encapsulating layer can be manufactured at low cost even if the phosphor-free encapsulating layer is continuously formed in the first direction. Can do. Therefore, if such a phosphor-free sealing layer is formed and the sealing layer is laminated on the phosphor-free sealing layer, a sealing sheet having various physical properties can be configured.
　また、本発明の封止シートは、第１方向に連続するように形成される第２基材シートと、前記第２基材シートの表面に、前記第１方向に互いに間隔を隔てて配置される複数の封止部材とを備え、複数の前記封止部材は、前記第２基材シートの表面に積層される第１基材シートと、前記第１基材シートの表面に積層され、粒子を含有する封止層とを備えることを特徴としている。 In addition, the sealing sheet of the present invention is disposed on the surface of the second base sheet and the second base sheet formed so as to be continuous in the first direction, and spaced from each other in the first direction. A plurality of sealing members, wherein the plurality of sealing members are laminated on the surface of the second base material sheet, and are laminated on the surface of the first base material sheet. It is characterized by providing the sealing layer containing this.
　この封止シートでは、封止層を、第１方向に連続するように形成される第２基材シートによって、第１方向に互いに間隔を隔てて配置される第１基材シートを介して、支持することができる。そのため、製造コストを低減しながら、第１基材シートおよび第２基材シートによって、封止層を柔軟に支持することができる。 In this sealing sheet, the sealing layer is formed by a second base material sheet that is formed so as to be continuous in the first direction, via the first base material sheet that is arranged at an interval in the first direction, Can be supported. Therefore, the sealing layer can be flexibly supported by the first base sheet and the second base sheet while reducing the manufacturing cost.
　本発明の封止シートは、第１方向に連続する基材シートと、前記第１方向に互いに間隔を隔てて配置される複数の封止部材とを備え、複数の前記封止部材は、前記基材シートの表面に積層される蛍光体不含封止層と、前記蛍光体不含封止層の表面に積層される粒子を含有する封止層とを備えることを特徴としている。 The sealing sheet of the present invention includes a base sheet that is continuous in a first direction and a plurality of sealing members that are spaced apart from each other in the first direction, and the plurality of sealing members are It is characterized by comprising a phosphor-free encapsulating layer laminated on the surface of the substrate sheet, and a encapsulating layer containing particles laminated on the surface of the phosphor-free encapsulating layer.
　この封止シートでは、蛍光体不含封止層と封止層とによって、種々の物性を有することができる。 This sealing sheet can have various physical properties by the phosphor-free sealing layer and the sealing layer.
　本発明の封止シートの製造方法では、封止層の歩留まりを向上させて、封止シートの製造コストを低減することができる。 In the manufacturing method of the sealing sheet of this invention, the yield of a sealing layer can be improved and the manufacturing cost of a sealing sheet can be reduced.
　本発明の封止シートは、製造コストを低減しながら、第１基材シートおよび第２基材シートによって、封止層を柔軟に支持することができる。また、種々の物性を有する封止部材を構成することができる。 The sealing sheet of the present invention can flexibly support the sealing layer by the first base sheet and the second base sheet while reducing the manufacturing cost. Moreover, the sealing member which has various physical properties can be comprised.
図１は、本発明の封止シートの製造方法の第１実施形態の封止層形成工程を示し、図１Ａは、斜視図、図１Ｂは、側断面図を示す。FIG. 1 shows a sealing layer forming step of a first embodiment of the method for producing a sealing sheet of the present invention, FIG. 1A is a perspective view, and FIG. 1B is a side sectional view. 図２は、本発明の封止シートの製造方法の第１実施形態の第１切断工程を示し、図２Ａは、斜視図、図２Ｂは、側断面図を示す。FIG. 2 shows a first cutting step of the first embodiment of the method for producing a sealing sheet of the present invention, FIG. 2A is a perspective view, and FIG. 2B is a side sectional view. 図３は、本発明の封止シートの製造方法の第１実施形態の剥離工程を示し、図３Ａは、斜視図、図３Ｂは、側断面図を示す。FIG. 3 shows the peeling process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention, FIG. 3A shows a perspective view, FIG. 3B shows a sectional side view. 図４は、本発明の封止シートの製造方法の第１実施形態の載置工程を示し、図４Ａは、斜視図、図４Ｂは、側断面図を示す。FIG. 4: shows the mounting process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention, FIG. 4A shows a perspective view, FIG. 4B shows a sectional side view. 図５は、本発明の封止シートの製造方法の第１実施形態の第２切断工程を示し、図５Ａは、斜視図、図５Ｂは、側断面図を示す。FIG. 5: shows the 2nd cutting process of 1st Embodiment of the manufacturing method of the sealing sheet of this invention, FIG. 5A shows a perspective view, FIG. 5B shows a side sectional view. 図６は、本発明の封止シートの製造方法の第１実施形態の除去工程を示し、図６Ａは、斜視図、図６Ｂは、側断面図を示す。FIG. 6 shows a removing step of the first embodiment of the method for producing a sealing sheet of the present invention, FIG. 6A is a perspective view, and FIG. 6B is a side sectional view. 図７は、本発明の封止シートの製造方法の第１実施形態の第３切断工程を示し、図７Ａは、斜視図、図７Ｂは、側断面図、図７Ｃは、平面図を示す。FIG. 7 shows a third cutting step of the first embodiment of the method for producing a sealing sheet of the present invention, FIG. 7A is a perspective view, FIG. 7B is a side sectional view, and FIG. 7C is a plan view. 図８は、本発明の封止シートの製造方法の第１実施形態の回収工程を示し、図８Ａは、斜視図、図８Ｂは、正断面図、図８Ｃは、側断面図、図８Ｄは、平面図を示す。FIG. 8 shows the recovery process of the first embodiment of the method for producing a sealing sheet of the present invention, FIG. 8A is a perspective view, FIG. 8B is a front sectional view, FIG. 8C is a side sectional view, and FIG. FIG. 図９は、図８の封止シートによって光半導体素子を封止する方法を示し、図９Ａは、封止シートを、光半導体素子が実装された基板に対向配置する工程、図９Ｂは、封止シートによって光半導体素子を封止する工程、図９Ｃは、第２基材シート、接着剤層および第１基材シートを除去する工程を示す。FIG. 9 shows a method of encapsulating the optical semiconductor element with the encapsulating sheet of FIG. 8, FIG. 9A is a process of arranging the encapsulating sheet opposite to the substrate on which the optical semiconductor element is mounted, and FIG. 9B is an encapsulating sheet. The process of sealing an optical semiconductor element with a stop sheet, FIG. 9C shows the process of removing a 2nd base material sheet, an adhesive bond layer, and a 1st base material sheet. 図１０は、本発明の封止シートの製造方法の第１実施形態の変形例（位置決めマークが設けられる態様）により製造される封止シートの平面図を示す。FIG. 10: shows the top view of the sealing sheet manufactured by the modification (mode provided with the positioning mark) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. 図１１は、本発明の封止シートの製造方法の第１実施形態の変形例（位置決めマークが設けられる態様）により製造される封止シートの平面図を示す。FIG. 11: shows the top view of the sealing sheet manufactured by the modification (mode provided with the positioning mark) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. 図１２は、本発明の封止シートの製造方法の第１実施形態の変形例（封止層が略楕円形状である態様）により製造される封止シートの平面図を示す。FIG. 12: shows the top view of the sealing sheet manufactured by the modification (embodiment whose sealing layer is substantially elliptical shape) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. 図１３は、本発明の封止シートの製造方法の第１実施形態の変形例（封止層が略６角形状である態様）により製造される封止シートの平面図を示す。FIG. 13: shows the top view of the sealing sheet manufactured by the modification (the aspect whose sealing layer is substantially hexagonal shape) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. 図１４は、本発明の封止シートの製造方法の第１実施形態の変形例（封止層が略矩形状である態様）により製造される封止シートの平面図を示す。FIG. 14: shows the top view of the sealing sheet manufactured by the modification (the aspect whose sealing layer is substantially rectangular shape) of 1st Embodiment of the manufacturing method of the sealing sheet of this invention. 図１５は、本発明の封止シートの製造方法の第２実施形態の第３切断工程を示し、図１５Ａは、斜視図、図１５Ｂは、側断面図、図１５Ｃは、平面図を示す。FIG. 15 shows the third cutting step of the second embodiment of the method for producing the sealing sheet of the present invention, FIG. 15A is a perspective view, FIG. 15B is a side sectional view, and FIG. 15C is a plan view. 図１６は、本発明の封止シートの製造方法の第２実施形態の回収工程を示し、図１６Ａは、斜視図、図１６Ｂは、正断面図、図１６Ｃは、側断面図、図１６Ｄは、平面図を示す。FIG. 16 shows the collection process of the second embodiment of the method for producing a sealing sheet of the present invention, FIG. 16A is a perspective view, FIG. 16B is a front sectional view, FIG. 16C is a side sectional view, and FIG. FIG. 図１７は、本発明の封止シートの製造方法の第３実施形態の第１切断工程および剥離工程の斜視図を示す。FIG. 17: shows the perspective view of the 1st cutting process and peeling process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention. 図１８は、本発明の封止シートの製造方法の第３実施形態の載置工程の斜視図を示す。FIG. 18: shows the perspective view of the mounting process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention. 図１９は、本発明の封止シートの製造方法の第３実施形態の第２切断工程および除去工程の斜視図を示す。FIG. 19: shows the perspective view of the 2nd cutting process and removal process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention. 図２０は、本発明の封止シートの製造方法の第３実施形態の第３切断工程および回収工程の斜視図を示す。FIG. 20: shows the perspective view of the 3rd cutting process and collection | recovery process of 3rd Embodiment of the manufacturing method of the sealing sheet of this invention. 図２１は、本発明の封止シートの製造方法の第４実施形態の製造工程図（斜視図）を示し、図２１Ａは、封止層形成工程（基材シートを用意する工程）、図２１Ｂは、封止層形成工程（封止層を設ける工程）、図２１Ｃは、切断工程を示す。FIG. 21 shows a manufacturing process diagram (perspective view) of the fourth embodiment of the manufacturing method of the sealing sheet of the present invention, and FIG. 21A shows a sealing layer forming process (process for preparing a base sheet), FIG. FIG. 21C shows a sealing layer forming step (step of providing a sealing layer), and FIG. 21C shows a cutting step. 図２２は、第４実施形態の封止シートによって光半導体素子を封止する方法を説明する工程図（側断面図）を示し、図２２Ａは、光半導体素子が実装された基板を用意する工程、および、各封止層が光半導体素子と対向するように配置する工程、図２２Ｂは、封止シートによって、光半導体素子を封止する工程、図２２Ｃは、基材シートを封止層から引き剥がす工程を示す。FIG. 22 is a process diagram (side sectional view) illustrating a method for encapsulating an optical semiconductor element with the encapsulating sheet of the fourth embodiment, and FIG. 22A is a process for preparing a substrate on which the optical semiconductor element is mounted. FIG. 22B is a step of sealing the optical semiconductor element with a sealing sheet, and FIG. 22C is a step of removing the base sheet from the sealing layer. The process of peeling is shown. 図２３は、第４実施形態の変形例の斜視図であって、図２３Ａは、封止層を略円形状に切断する工程、図２３Ｂは、封止領域の外側の封止層を除去する工程、図２３Ｃは、切断工程を示す。FIG. 23 is a perspective view of a modification of the fourth embodiment. FIG. 23A is a step of cutting the sealing layer into a substantially circular shape, and FIG. 23B is a step of removing the sealing layer outside the sealing region. Process, FIG. 23C shows the cutting process. 図２４は、本発明の封止シートの製造方法の第５実施形態の製造工程図（斜視図）を示し、図２４Ａは、蛍光体不含封止層形成工程（基材シートを用意する工程）、図２４Ｂは、蛍光体不含封止層形成工程（蛍光体不含封止層を設ける工程）図２４Ｃは、封止層形成工程、図２４Ｄは、切断工程を示す。FIG. 24: shows the manufacturing process figure (perspective view) of 5th Embodiment of the manufacturing method of the sealing sheet of this invention, FIG. 24A is a fluorescent substance-free sealing layer formation process (process which prepares a base material sheet) 24B is a phosphor-free sealing layer forming step (step of providing a phosphor-free sealing layer). FIG. 24C is a sealing layer forming step, and FIG. 24D is a cutting step. 図２５は、第５実施形態の封止シートによって光半導体素子を封止する方法を説明する工程図（側断面図）を示し、図２５Ａは、光半導体素子が実装された基板を用意する工程、および、各封止層が光半導体素子と対向するように配置する工程、図２５Ｂは、封止シートによって、光半導体素子を封止する工程、図２５Ｃは、基材シートを蛍光体不含封止層から引き剥がす工程を示す。FIG. 25 is a process diagram (side sectional view) illustrating a method for encapsulating an optical semiconductor element with the encapsulating sheet of the fifth embodiment, and FIG. 25A is a process of preparing a substrate on which the optical semiconductor element is mounted. And a step of arranging each sealing layer so as to face the optical semiconductor element, FIG. 25B is a step of sealing the optical semiconductor element with a sealing sheet, and FIG. 25C is a phosphor-free substrate sheet. The process of peeling off from a sealing layer is shown. 図２６は、第５実施形態の変形例の斜視図であって、図２６Ａは、封止層を略円形状に切断する工程、図２６Ｂは、封止領域の外側の封止層を除去する工程、図２６Ｃは、切断工程を示す。FIG. 26 is a perspective view of a modification of the fifth embodiment. FIG. 26A is a step of cutting the sealing layer into a substantially circular shape, and FIG. 26B is a step of removing the sealing layer outside the sealing region. Process, FIG. 26C shows the cutting process. 図２７は、第５実施形態の封止シートの変形例によって光半導体素子を封止する方法を説明する工程図（側断面図）を示し、図２７Ａは、光半導体素子が実装された基板を用意する工程、および、各封止層が光半導体素子と対向するように配置する工程、図２７Ｂは、封止シートによって、光半導体素子を封止する工程、図２７Ｃは、基材シートを蛍光体不含封止層から引き剥がす工程を示す。FIG. 27 is a process diagram (side sectional view) illustrating a method for sealing an optical semiconductor element by a modification of the sealing sheet of the fifth embodiment. FIG. 27A illustrates a substrate on which the optical semiconductor element is mounted. Step of preparing, step of arranging each sealing layer so as to face the optical semiconductor element, FIG. 27B is a step of sealing the optical semiconductor element with a sealing sheet, and FIG. The process of peeling off from a body-free sealing layer is shown.
　　＜第１実施形態＞
　図１Ａの矢印で示す前後方向（あるいは縦方向）は、第１方向の一例であり、図１Ａの矢印で示す左右方向（あるいは横方向）は、第１方向に直交する第２方向の一例であり、図１Ａの矢印で示す上下方向は、第１方向および第２方向に直交する第３方向の一例（あるいは厚み方向）である。図１Ａ以外の図面については、特記しない限り、図１Ａの方向を基準とする。 <First Embodiment>
The front-rear direction (or vertical direction) indicated by the arrows in FIG. 1A is an example of a first direction, and the left-right direction (or horizontal direction) indicated by the arrows in FIG. 1A is an example of a second direction orthogonal to the first direction. Yes, the up-down direction indicated by the arrows in FIG. 1A is an example (or thickness direction) of a third direction orthogonal to the first direction and the second direction. For the drawings other than FIG. 1A, the direction of FIG. 1A is used as a reference unless otherwise specified.
　図１～図８に示すように、本発明の第１実施形態である封止シート１の製造方法は、封止層形成工程（図１参照）、切断工程としての第１切断工程（図２参照）、配置工程（図３および図４参照）、第２切断工程（図５参照）、除去工程（図６参照）、第３切断工程（図７参照）、および、回収工程（図８参照）を備える。 As shown in FIGS. 1 to 8, the manufacturing method of the sealing sheet 1 according to the first embodiment of the present invention includes a sealing layer forming step (see FIG. 1), a first cutting step as a cutting step (FIG. 2). Reference), placement step (see FIGS. 3 and 4), second cutting step (see FIG. 5), removal step (see FIG. 6), third cutting step (see FIG. 7), and recovery step (see FIG. 8). ).
　　［封止層形成工程］
　封止層形成工程では、図１Ａおよび図１Ｂが参照されるように、まず、積層基材シート２を用意する。 [Sealing layer forming step]
In the sealing layer forming step, as shown in FIGS. 1A and 1B, first, a laminated base sheet 2 is prepared.
　積層基材シート２は、前後方向（縦方向）および左右方向（横方向）に延びる略矩形の平板形状に形成されている。積層基材シート２は、第１基材シート３と、第１基材シート３の下面に積層される接着剤層４と、接着剤層４の下面に積層される離型シート５とを備える。 The laminated base sheet 2 is formed in a substantially rectangular flat plate shape extending in the front-rear direction (vertical direction) and the left-right direction (lateral direction). The laminated substrate sheet 2 includes a first substrate sheet 3, an adhesive layer 4 laminated on the lower surface of the first substrate sheet 3, and a release sheet 5 laminated on the lower surface of the adhesive layer 4. .
　第１基材シート３は、積層基材シート２の平面視における外形形状をなし、具体的には、前後方向および左右方向に連続する略矩形の平板形状に形成されている。第１基材シート３は、次に説明する封止層６を支持できる材料から形成されており、そのような材料としては、例えば、ポリエチレンテレフタレート、ポリエチレンテレフタレートのポリエステル、例えば、ポリエチレン、ポリプロピレンなどのポリオレフィンなどの樹脂材料などが挙げられる。また、材料として、例えば、セラミクスシート、例えば、金属箔なども挙げられる。第１基材シート３の厚みは、例えば、０．０３ｍｍ以上、好ましくは、０．０５ｍｍ以上であり、また、例えば、２ｍｍ以下、好ましくは、１ｍｍ以下である。また、第１基材シート３の寸法は、次に説明する封止層６の寸法によって適宜調節され、具体的には、１辺の長さが、例えば、１０ｍｍ以上、好ましくは、２０ｍｍ以上であり、また、例えば、３００ｍｍ以下、好ましくは、２５０ｍｍ以下である。 The first base sheet 3 has an outer shape in plan view of the laminated base sheet 2, and is specifically formed in a substantially rectangular flat plate shape that is continuous in the front-rear direction and the left-right direction. The first base sheet 3 is formed of a material that can support the sealing layer 6 described below. Examples of such a material include polyethylene terephthalate, polyester of polyethylene terephthalate, such as polyethylene and polypropylene. Examples thereof include resin materials such as polyolefin. Examples of the material include a ceramic sheet such as a metal foil. The thickness of the 1st base material sheet 3 is 0.03 mm or more, for example, Preferably, it is 0.05 mm or more, for example, is 2 mm or less, Preferably, it is 1 mm or less. Moreover, the dimension of the 1st base material sheet 3 is suitably adjusted with the dimension of the sealing layer 6 demonstrated below, Specifically, the length of 1 side is 10 mm or more, for example, Preferably, it is 20 mm or more. Yes, for example, 300 mm or less, preferably 250 mm or less.
　接着剤層４は、第１基材シート３の下面全面に設けられている。接着剤層４は、例えば、アクリル系感圧接着剤、ウレタン系感圧接着性などの接着剤などから形成されている。接着剤層４の厚みは、例えば、０．１ｍｍ以上、好ましくは、０．２ｍｍ以上であり、また、１ｍｍ以下、好ましくは、０．５ｍｍ以下である。 The adhesive layer 4 is provided on the entire lower surface of the first base sheet 3. The adhesive layer 4 is made of, for example, an adhesive such as an acrylic pressure sensitive adhesive or a urethane pressure sensitive adhesive. The thickness of the adhesive layer 4 is, for example, 0.1 mm or more, preferably 0.2 mm or more, and 1 mm or less, preferably 0.5 mm or less.
　離型シート５は、接着剤層４の下面が汚染されることを防止するために、接着剤層４の下面全面に設けられている。離型シート５としては、例えば、ポリエチレンフィルム、ポリエステルフィルム（ＰＥＴなど）などのポリマーフィルム、例えば、セラミクスシート、例えば、金属箔などが挙げられる。好ましくは、ポリマーフィルムが挙げられる。また、離型シート５の表面には、フッ素処理などの剥離処理を施すこともできる。離型シート５の厚みは、例えば、０．３ｍｍ以上、好ましくは、０．５ｍｍ以上であり、また、例えば、２ｍｍ以下、好ましくは、１ｍｍ以下である。 The release sheet 5 is provided on the entire lower surface of the adhesive layer 4 in order to prevent the lower surface of the adhesive layer 4 from being contaminated. Examples of the release sheet 5 include polymer films such as a polyethylene film and a polyester film (such as PET), for example, a ceramic sheet such as a metal foil. Preferably, a polymer film is used. Further, the surface of the release sheet 5 can be subjected to a peeling treatment such as a fluorine treatment. The thickness of the release sheet 5 is, for example, 0.3 mm or more, preferably 0.5 mm or more, and for example, 2 mm or less, preferably 1 mm or less.
　積層基材シート２を作製するには、例えば、まず、第１基材シート３を用意し、続いて、接着剤層４を第１基材シート３の下面に積層し、その後、離型シート５を接着剤層４の下面に積層する。なお、積層基材シート２は、市販のものを用いることもできる。 In order to produce the laminated substrate sheet 2, for example, first, the first substrate sheet 3 is prepared, and then the adhesive layer 4 is laminated on the lower surface of the first substrate sheet 3, and then the release sheet. 5 is laminated on the lower surface of the adhesive layer 4. In addition, the laminated base material sheet 2 can also use a commercially available thing.
　積層基材シート２の厚みは、例えば、０．６ｍｍ以上、好ましくは、１ｍｍ以上であり、また、例えば、５ｍｍ以下、好ましくは、３ｍｍ以下である。 The thickness of the laminated substrate sheet 2 is, for example, 0.6 mm or more, preferably 1 mm or more, and for example, 5 mm or less, preferably 3 mm or less.
　積層基材シート２を用意した後、図１Ａおよび図１Ｂに示すように、封止層６を積層基材シート２の上面に設ける。 After preparing the laminated base sheet 2, a sealing layer 6 is provided on the upper surface of the laminated base sheet 2 as shown in FIGS. 1A and 1B.
　封止層６を積層基材シート２の上面に設けるには、例えば、まず、封止組成物を用意する。 In order to provide the sealing layer 6 on the upper surface of the laminated base sheet 2, for example, first, a sealing composition is prepared.
　封止組成物は、粒子を必須成分として含有し、具体的には、粒子および樹脂を含有する。 Sealing composition contains particles as essential components, and specifically contains particles and a resin.
　粒子としては、例えば、蛍光体、充填剤などが挙げられる。 Examples of the particles include phosphors and fillers.
　蛍光体は、波長変換機能を有しており、例えば、青色光を黄色光に変換することのできる黄色蛍光体、青色光を赤色光に変換することのできる赤色蛍光体などが挙げられる。 The phosphor has a wavelength conversion function, and examples thereof include a yellow phosphor capable of converting blue light into yellow light, and a red phosphor capable of converting blue light into red light.
　黄色蛍光体としては、例えば、（Ｂａ，Ｓｒ，Ｃａ）２ＳｉＯ４；Ｅｕ、（Ｓｒ，Ｂａ）２ＳｉＯ４：Ｅｕ（バリウムオルソシリケート（ＢＯＳ））などのシリケート蛍光体、例えば、Ｙ３Ａｌ５Ｏ１２：Ｃｅ（ＹＡＧ（イットリウム・アルミニウム・ガーネット）：Ｃｅ）、Ｔｂ３Ａｌ３Ｏ１２：Ｃｅ（ＴＡＧ（テルビウム・アルミニウム・ガーネット）：Ｃｅ）などのガーネット型結晶構造を有するガーネット型蛍光体、例えば、Ｃａ－α－ＳｉＡｌＯＮなどの酸窒化物蛍光体などが挙げられる。赤色蛍光体としては、例えば、ＣａＡｌＳｉＮ３：Ｅｕ、ＣａＳｉＮ２：Ｅｕなどの窒化物蛍光体などが挙げられる。蛍光体の形状としては、例えば、球状、板状、針状などが挙げられる。好ましくは、流動性の観点から、球状が挙げられる。蛍光体の最大長さの平均値（球状である場合には、平均粒子径）は、例えば、０．１μｍ以上、好ましくは、１μｍ以上であり、また、例えば、２００μｍ以下、好ましくは、１００μｍ以下である。蛍光体は、単独使用または併用することができる。蛍光体の配合割合は、樹脂１００質量部に対して、例えば、０．１質量部以上、好ましくは、０．５質量部以上であり、例えば、８０質量部以下、好ましくは、５０質量部以下である。 Examples of the yellow phosphor include silicate phosphors such as (Ba, Sr, Ca) 2 SiO 4 ; Eu, (Sr, Ba) 2 SiO 4 : Eu (barium orthosilicate (BOS)), for example, Y 3 Al Garnet-type phosphors having a garnet-type crystal structure such as 5 O 12 : Ce (YAG (yttrium, aluminum, garnet): Ce), Tb 3 Al 3 O 12 : Ce (TAG (terbium, aluminum, garnet): Ce) Examples thereof include oxynitride phosphors such as Ca-α-SiAlON. Examples of the red phosphor include nitride phosphors such as CaAlSiN 3 : Eu and CaSiN 2 : Eu. Examples of the shape of the phosphor include a spherical shape, a plate shape, and a needle shape. Preferably, spherical shape is mentioned from a fluid viewpoint. The average value of the maximum length of the phosphor (in the case of a sphere, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and for example, 200 μm or less, preferably 100 μm or less. It is. The phosphors can be used alone or in combination. The blending ratio of the phosphor is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, for example, 80 parts by mass or less, preferably 50 parts by mass or less with respect to 100 parts by mass of the resin. It is.
　充填剤としては、例えば、シリコーン粒子などの有機微粒子、例えば、シリカ、タルク、アルミナ、窒化アルミニウム、窒化ケイ素などの無機微粒子が挙げられる。また、充填剤の最大長さの平均値（球状である場合には、平均粒子径）は、例えば、０．１μｍ以上、好ましくは、１μｍ以上であり、また、例えば、２００μｍ以下、好ましくは、１００μｍ以下である。充填剤は、単独使用または併用することができる。充填剤の配合割合は、樹脂１００質量部に対して、例えば、０．１質量部以上、好ましくは、０．５質量部以上であり、また、例えば、７０質量部以下、好ましくは、５０質量部以下である。 Examples of the filler include organic fine particles such as silicone particles, and inorganic fine particles such as silica, talc, alumina, aluminum nitride, and silicon nitride. Further, the average value of the maximum length of the filler (in the case of a spherical shape, the average particle diameter) is, for example, 0.1 μm or more, preferably 1 μm or more, and, for example, 200 μm or less, preferably 100 μm or less. The filler can be used alone or in combination. The blending ratio of the filler is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, and, for example, 70 parts by mass or less, preferably 50 parts by mass with respect to 100 parts by mass of the resin. Or less.
　粒子の配合割合は、樹脂１００質量部に対して、例えば、０．１質量部以上、好ましくは、０．５質量部以上であり、また、例えば、８０質量部以下、好ましくは、６０質量部以下である。 The mixing ratio of the particles is, for example, 0.1 parts by mass or more, preferably 0.5 parts by mass or more, and, for example, 80 parts by mass or less, preferably 60 parts by mass with respect to 100 parts by mass of the resin. It is as follows.
　樹脂としては、例えば、加熱により可塑化する熱可塑性樹脂、例えば、加熱により硬化する熱硬化性樹脂、例えば、活性エネルギー線（例えば、紫外線、電子線など）の照射により硬化する活性エネルギー線硬化性樹脂などが挙げられる。熱可塑性樹脂としては、例えば、酢酸ビニル樹脂、エチレン・酢酸ビニル共重合体（ＥＶＡ）、塩化ビニル樹脂、ＥＶＡ・塩化ビニル樹脂共重合体などが挙げられる。熱硬化性樹脂としては、例えば、シリコーン樹脂、エポキシ樹脂、ポリイミド樹脂、フェノール樹脂、尿素樹脂、メラミン樹脂、不飽和ポリエステル樹脂などが挙げられる。樹脂としては、好ましくは、熱硬化性樹脂および活性エネルギー線硬化性樹脂などの硬化性樹脂が挙げられる。 Examples of the resin include a thermoplastic resin that is plasticized by heating, for example, a thermosetting resin that is cured by heating, for example, an active energy ray curable that is cured by irradiation with active energy rays (for example, ultraviolet rays, electron beams, etc.). Resin etc. are mentioned. Examples of the thermoplastic resin include vinyl acetate resin, ethylene / vinyl acetate copolymer (EVA), vinyl chloride resin, EVA / vinyl chloride resin copolymer, and the like. Examples of the thermosetting resin include silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin. The resin preferably includes a curable resin such as a thermosetting resin and an active energy ray curable resin.
　硬化性樹脂として、例えば、シリコーン樹脂、エポキシ樹脂、ポリイミド樹脂、フェノール樹脂、尿素樹脂、メラミン樹脂、不飽和ポリエステル樹脂などが挙げられる。また、硬化性樹脂としては、例えば、２段階硬化性樹脂、１段階硬化性樹脂などが挙げられ、好ましくは、２段階硬化性樹脂が挙げられる。 Examples of the curable resin include silicone resin, epoxy resin, polyimide resin, phenol resin, urea resin, melamine resin, and unsaturated polyester resin. Examples of the curable resin include a two-stage curable resin and a one-stage curable resin, and a two-stage curable resin is preferable.
　２段階硬化性樹脂は、２段階の反応機構を有しており、１段階目の反応でＢステージ化（半硬化）し、２段階目の反応でＣステージ化（最終硬化）する。一方、１段階硬化性樹脂は、１段階の反応機構を有しており、１段階目の反応で完全硬化する。また、Ｂステージは、硬化性樹脂が、液状であるＡステージと、完全硬化したＣステージとの間の状態であって、硬化およびゲル化がわずかに進行し、圧縮弾性率がＣステージの弾性率よりも小さい状態である。 The two-stage curable resin has a two-stage reaction mechanism, and is B-staged (semi-cured) by the first-stage reaction and C-staged (final-cured) by the second-stage reaction. On the other hand, the one-step curable resin has a one-step reaction mechanism and is completely cured by the first-step reaction. The B stage is a state between the A stage in which the curable resin is in a liquid state and the fully cured C stage, and the curing and gelation are slightly advanced, and the compression elastic modulus is the elasticity of the C stage. It is a state smaller than the rate.
　封止組成物を調製するには、粒子および樹脂を配合する。なお、樹脂が硬化性樹脂である場合には、配合時の樹脂は、Ａステージである。 In order to prepare a sealing composition, particles and a resin are blended. In addition, when resin is curable resin, the resin at the time of a mixing | blending is A stage.
　続いて、この方法では、調製した封止組成物を、積層基材シート２の上に塗布する。具体的には、封止組成物を、第１基材シート３の上面に、例えば、キャスティング、スピンコーティング、ロールコーティングなどの方法により適当な厚さで、上記したパターンで塗布して、皮膜７を形成する。具体的には、皮膜７を、平面視において、第１基材シート３より小さいパターンに形成し、詳しくは、第１基材シート３の上面の周端部を露出する略矩形状のパターンに皮膜７を形成する。換言すれば、皮膜７は、少なくとも前後方向に連続するパターンに形成される。 Subsequently, in this method, the prepared sealing composition is applied onto the laminated base sheet 2. Specifically, the sealing composition is applied to the upper surface of the first base sheet 3 in an appropriate thickness by a method such as casting, spin coating, roll coating, and the like, and the film 7 Form. Specifically, the film 7 is formed in a pattern smaller than the first base sheet 3 in plan view, and more specifically, in a substantially rectangular pattern that exposes the peripheral edge of the upper surface of the first base sheet 3. A film 7 is formed. In other words, the film 7 is formed in a pattern continuous at least in the front-rear direction.
　その後、必要により、樹脂が硬化性樹脂である場合には、皮膜７を、加熱および／または活性エネルギー線照射する。より具体的には、樹脂が２段階硬化性樹脂を含有する場合には、加熱および／または活性エネルギー線照射によって、封止層６をＢステージ化（半硬化）させる。 Thereafter, if necessary, when the resin is a curable resin, the coating 7 is heated and / or irradiated with active energy rays. More specifically, when the resin contains a two-step curable resin, the sealing layer 6 is B-staged (semi-cured) by heating and / or active energy ray irradiation.
　これにより、シート状の封止層６を第１基材シート３の上面に上記したパターンに形成する。 Thereby, the sheet-like sealing layer 6 is formed in the above-described pattern on the upper surface of the first base material sheet 3.
　あるいは、封止組成物を、図示しない離型シートに塗布して皮膜７を形成し、その後、皮膜７に、必要により、加熱および／または活性エネルギー線照射して、封止層６を形成した後、封止層６を、第１基材シート３の上面に転写することもできる。 Alternatively, the sealing composition is applied to a release sheet (not shown) to form the film 7, and then the film 7 is heated and / or irradiated with active energy rays as necessary to form the sealing layer 6. Thereafter, the sealing layer 6 can be transferred to the upper surface of the first base sheet 3.
　封止層６の寸法は、その用途および目的によって適宜調節され、具体的には、１辺の長さが、例えば、５ｍｍ以上、好ましくは、１０ｍｍ以上であり、また、例えば、３００ｍｍ以下、好ましくは、２５０ｍｍ以下である。 The dimension of the sealing layer 6 is appropriately adjusted depending on its use and purpose. Specifically, the length of one side is, for example, 5 mm or more, preferably 10 mm or more, and, for example, 300 mm or less, preferably Is 250 mm or less.
　これによって、積層基材シート２および封止層６を備える第１積層シート８を形成する。 Thereby, the first laminated sheet 8 including the laminated base sheet 2 and the sealing layer 6 is formed.
　　［第１切断工程］
　この方法では、図２に示す第１切断工程を、図１に示す封止層形成工程の後に実施する。第１切断工程では、第１積層シート８が前後方向（第１方向の一例）において複数（具体的には、５つに）分割されるように、第１積層シート８を切断する。 [First cutting step]
In this method, the first cutting step shown in FIG. 2 is performed after the sealing layer forming step shown in FIG. In the first cutting step, the first laminated sheet 8 is cut so that the first laminated sheet 8 is divided into a plurality (specifically, five) in the front-rear direction (an example of the first direction).
　例えば、第１積層シート８が、封止層６の外側の外側部分１３と、封止層６を含み、外側部分１３に囲まれる内側部分１２とに仕切られ、かつ、内側部分１２における封止層６が前後方向において複数（具体的には、５つに）分割されるように、第１積層シート８を切断する。第１積層シート８の切断によって、複数の左右方向に沿う第１横切断ライン９と、複数の切断ライン９の左右方向両端部のそれぞれに連続する第１縦切断ライン１０とからなる第１切断ライン１７が形成される。 For example, the first laminated sheet 8 is partitioned into an outer portion 13 outside the sealing layer 6 and an inner portion 12 that includes the sealing layer 6 and is surrounded by the outer portion 13, and is sealed in the inner portion 12. The first laminated sheet 8 is cut so that the layer 6 is divided into a plurality (specifically, five) in the front-rear direction. By cutting the first laminated sheet 8, a first cut consisting of a first horizontal cutting line 9 along a plurality of left and right directions and a first vertical cutting line 10 continuing to each of both ends in the left and right direction of the plurality of cutting lines 9. A line 17 is formed.
　複数の第１横切断ライン９は、前後方向に互いに間隔を隔てて並列配置されている。複数の第１横切断ライン９のうち、最前側に位置する第１横切断ライン９Ａは、平面視において、封止層６の前端縁と重なるように、形成されている。また、複数の第１横切断ライン９のうち、最後側に位置する第１横切断ライン９Ｂは、平面視において、封止層６の後端縁と重なるように、形成されている。 The plurality of first horizontal cutting lines 9 are arranged in parallel at intervals in the front-rear direction. Of the plurality of first horizontal cutting lines 9, the first horizontal cutting line 9 </ b> A located on the foremost side is formed so as to overlap the front edge of the sealing layer 6 in plan view. Moreover, the 1st horizontal cutting line 9B located in the rear side among the several 1st horizontal cutting lines 9 is formed so that it may overlap with the rear-end edge of the sealing layer 6 in planar view.
　第１縦切断ライン１０は、前後方向に沿うように形成されており、左右方向に互いに間隔を隔てて対向するように１対形成されている。第１縦切断ライン１０は、封止層６の左右方向両外側に間隔を隔てて形成されている。 The first vertical cutting lines 10 are formed along the front-rear direction, and are formed as a pair so as to face each other with a gap in the left-right direction. The first vertical cutting lines 10 are formed on both outer sides in the left-right direction of the sealing layer 6 with a space therebetween.
　第１切断ライン１７において外側に位置する切断ライン、具体的には、最前側および最後側に位置する第１横切断ライン９Ａおよび９Ｂと、１対の第１縦切断ライン１０とにより、平面視略矩形状を形成し、第１積層シート８を外側部分１３と内側部分１２とに仕切っている。 The first cutting line 17 has a cutting line positioned outside, specifically, the first horizontal cutting lines 9A and 9B positioned on the foremost side and the rearmost side, and the pair of first vertical cutting lines 10 in plan view. A substantially rectangular shape is formed, and the first laminated sheet 8 is partitioned into an outer portion 13 and an inner portion 12.
　第１積層シート８を切断するには、例えば、円盤状のダイシングソー（ダイシングブレード）を用いるダイシング装置、カッターを用いるカッティング装置、レーザー照射装置、トムソン刃を用いるトムソン刃切断機などが用いられる。 In order to cut the first laminated sheet 8, for example, a dicing apparatus using a disc-shaped dicing saw (dicing blade), a cutting apparatus using a cutter, a laser irradiation apparatus, a Thomson blade cutting machine using a Thomson blade, or the like is used.
　切断工程によって、封止層６、および、封止層６に対応する積層基材シート２（具体的には、複数の封止層６のそれぞれが積層される複数の積層基材シート２）を備える封止部材１１が複数形成される。詳しくは、封止部材１１は、内側部分１２が前後方向において複数分割されることによって、前後方向に並んで複数形成されている。複数の封止部材１１のそれぞれは、左右方向に延びる平面視略矩形の短冊状に形成されている。 By the cutting step, the sealing layer 6 and the laminated substrate sheet 2 corresponding to the sealing layer 6 (specifically, the plurality of laminated substrate sheets 2 on which the plurality of sealing layers 6 are laminated) A plurality of sealing members 11 provided are formed. Specifically, a plurality of sealing members 11 are formed side by side in the front-rear direction by dividing the inner portion 12 into a plurality of parts in the front-rear direction. Each of the plurality of sealing members 11 is formed in a rectangular shape that is substantially rectangular in plan view and extends in the left-right direction.
　封止部材１１において、その左右方向両端部は、第１基材シート３、接着剤層４および離型シート５からなり、また、第１基材シート３の左右方向両端部は、封止層６から露出している。つまり、封止部材１１において、封止層６は、第１基材シート３の左右方向途中に形成されている。 In the sealing member 11, both end portions in the left-right direction include the first base sheet 3, the adhesive layer 4 and the release sheet 5, and both end portions in the left-right direction of the first base sheet 3 are sealed layers. 6 is exposed. That is, in the sealing member 11, the sealing layer 6 is formed midway in the left-right direction of the first base sheet 3.
　各封止部材１１の前後方向長さは、例えば、５ｍｍ以上、好ましくは、８ｍｍ以上であり、また、例えば、１００ｍｍ以下、好ましくは、５０ｍｍ以下である。 The longitudinal length of each sealing member 11 is, for example, 5 mm or more, preferably 8 mm or more, and for example, 100 mm or less, preferably 50 mm or less.
　　［配置工程］
　次いで、この方法では、図３および図４に示す配置工程を、図２に示す第１切断工程の後に実施する。配置工程は、図３に示す剥離工程、および、図４に示す載置工程を備える。 [Arrangement process]
Next, in this method, the arrangement step shown in FIGS. 3 and 4 is performed after the first cutting step shown in FIG. The arranging step includes a peeling step shown in FIG. 3 and a placing step shown in FIG.
　　〔剥離工程〕
　剥離工程では、図３Ａおよび図３Ｂに示すように、まず、各封止部材１１を外側部分１３から順次引き上げる。具体的には、例えば、各封止部材１１を手で剥離することによって、各封止部材１１を引き上げる。 [Peeling process]
In the peeling step, as shown in FIGS. 3A and 3B, first, the respective sealing members 11 are sequentially pulled up from the outer portion 13. Specifically, for example, each sealing member 11 is pulled up by peeling the sealing member 11 by hand.
　　〔載置工程〕
　図３Ａおよび図３Ｂに示す剥離工程に続いて、載置工程では、図４Ａおよび図４Ｂに示すように、複数の封止部材１１を第２基材シート１４の上に配置する。 [Installation process]
Subsequent to the peeling step shown in FIGS. 3A and 3B, in the placing step, a plurality of sealing members 11 are arranged on the second base sheet 14 as shown in FIGS. 4A and 4B.
　具体的には、複数の封止部材１１を、前後方向に互いに間隔を隔てるように、第２基材シート１４の上面に配置する。詳しくは、まず、図３Ａおよび図３Ｂの仮想線で示すように、封止部材１１の離型シート５を接着剤層４から剥離し、続いて、図４Ａおよび図４Ｂに示す接着剤層４を第２基材シート１４の上面に載置して、第１基材シート３と第２基材シート１４とを接着剤層４を介して接着する。 Specifically, the plurality of sealing members 11 are arranged on the upper surface of the second base sheet 14 so as to be spaced from each other in the front-rear direction. Specifically, first, as shown by phantom lines in FIGS. 3A and 3B, the release sheet 5 of the sealing member 11 is peeled from the adhesive layer 4, and then, the adhesive layer 4 shown in FIGS. 4A and 4B. Is placed on the upper surface of the second base sheet 14, and the first base sheet 3 and the second base sheet 14 are bonded via the adhesive layer 4.
　第２基材シート１４は、前後方向および左右方向に延びる略矩形の平板形状に形成されている。第２基材シート１４は、第１基材シート３と同様の材料から形成されている。また、第２基材シート１４は、封止層６（図１Ａ参照）より大きく形成されており、具体的には、第２基材シート１４は、少なくとも、その前後方向長さが、切断前の封止層６（図１Ａ参照）の前後方向長さより長く形成されている。また、第２基材シート１４の左右方向長さは、封止部材１１の左右方向長さよりが長く形成されている。第２基材シート１４の寸法は、その用途および目的によって適宜調節され、具体的には、前後方向長さが、例えば、２０ｍｍ以上、好ましくは、４０ｍｍ以上であり、また、例えば、３００ｍｍ以下、好ましくは、２００ｍｍ以下である。また、左右方向長さが、例えば、２０ｍｍ以上、好ましくは、５０ｍｍ以上であり、また、例えば、３００ｍｍ以下、好ましくは、２００ｍｍ以下である。 The second base sheet 14 is formed in a substantially rectangular flat plate shape extending in the front-rear direction and the left-right direction. The second base sheet 14 is formed from the same material as the first base sheet 3. Moreover, the 2nd base material sheet 14 is formed larger than the sealing layer 6 (refer FIG. 1A), and, specifically, the 2nd base material sheet 14 is the length of the front-back direction at least before a cutting | disconnection. The sealing layer 6 (see FIG. 1A) is longer than the length in the front-rear direction. Further, the length of the second base sheet 14 in the left-right direction is longer than the length of the sealing member 11 in the left-right direction. The dimension of the second base sheet 14 is appropriately adjusted depending on its use and purpose. Specifically, the length in the front-rear direction is, for example, 20 mm or more, preferably 40 mm or more, and, for example, 300 mm or less, Preferably, it is 200 mm or less. Further, the length in the left-right direction is, for example, 20 mm or more, preferably 50 mm or more, and for example, 300 mm or less, preferably 200 mm or less.
　また、配置される封止部材１１の前後方向の間隔Ｌ１は、次に説明する光半導体素子１５のピッチなどによって適宜設定され、具体的には、例えば、１ｍｍ以上、好ましくは、３ｍｍ以上であり、また、例えば、２０ｍｍ以下、好ましくは、１０ｍｍ以下である。また、封止部材１１間のピッチＬ２、すなわち、上記した間隔Ｌ１および封止部材１１の前後方向長さの総長さＬ２が、例えば、５ｍｍ以上、好ましくは、１０ｍｍ以上であり、また、例えば、１００ｍｍ以下、好ましくは、５０ｍｍ以下である。 Further, the interval L1 in the front-rear direction of the sealing member 11 to be arranged is appropriately set depending on the pitch of the optical semiconductor element 15 described below, and specifically, for example, 1 mm or more, preferably 3 mm or more. Also, for example, it is 20 mm or less, preferably 10 mm or less. Further, the pitch L2 between the sealing members 11, that is, the total distance L2 of the distance L1 and the length in the front-rear direction of the sealing member 11 is, for example, 5 mm or more, preferably 10 mm or more. 100 mm or less, preferably 50 mm or less.
　これによって、複数の封止部材１１と、第２基材シート１４とを備える第２積層シート２８が構成される。 Thus, the second laminated sheet 28 including the plurality of sealing members 11 and the second base sheet 14 is configured.
　　［第２切断工程］
　この方法では、図５に示す第２切断工程を、図４に示す配置工程の後に、実施する。第２切断工程では、図５Ａおよび図５Ｂに示すように、後述する光半導体素子１５（図９Ａ参照）に対応する封止領域１６を仕切るように、封止層６を切断する。 [Second cutting step]
In this method, the second cutting step shown in FIG. 5 is performed after the arranging step shown in FIG. In the second cutting step, as shown in FIGS. 5A and 5B, the sealing layer 6 is cut so as to partition a sealing region 16 corresponding to an optical semiconductor element 15 (see FIG. 9A) described later.
　具体的には、各封止領域１６が平面視略円形状をなすように、封止層６を切断する。 Specifically, the sealing layer 6 is cut so that each sealing region 16 has a substantially circular shape in plan view.
　封止層６を切断するには、例えば、円盤状のダイシングソー（ダイシングブレード）を用いるダイシング装置、カッターを用いるカッティング装置、レーザー照射装置、トムソン刃を用いるトムソン刃切断機などが用いられる。 In order to cut the sealing layer 6, for example, a dicing apparatus using a disk-shaped dicing saw (dicing blade), a cutting apparatus using a cutter, a laser irradiation apparatus, a Thomson blade cutting machine using a Thomson blade, or the like is used.
　なお、図５Ｂに示すように、積層基材シート２が厚み方向にわたって切断されないように、具体的には、第１基材シート３が厚み方向にわたって切断されないように、封止層６を切断する。詳しくは、第２切断工程において厚み方向に形成される切断線が、第１基材シート３に全く形成されない一方、封止層６に形成される。 In addition, as shown to FIG. 5B, specifically, the sealing layer 6 is cut | disconnected so that the 1st base material sheet 3 may not be cut | disconnected over the thickness direction so that the lamination | stacking base material sheet 2 may not be cut | disconnected over the thickness direction. . Specifically, the cutting line formed in the thickness direction in the second cutting step is formed on the sealing layer 6 while not formed on the first base sheet 3 at all.
　　［除去工程］
　この方法では、図６に示す除去工程を、図５に示す第２切断工程の後に、実施する。除去工程では、図６Ａおよび図６Ｂに示すように、封止領域１６の外側の封止層６を除去する。 [Removal process]
In this method, the removing step shown in FIG. 6 is performed after the second cutting step shown in FIG. In the removal step, the sealing layer 6 outside the sealing region 16 is removed as shown in FIGS. 6A and 6B.
　封止領域１６の外側の封止層６を除去するには、例えば、封止領域１６の外側の封止層６を、第１基材シート３から剥離する。封止領域１６の外側の封止層６を剥離するには、公知の剥離装置が用いられる。具体的には、吸着装置などが用いられる。 In order to remove the sealing layer 6 outside the sealing region 16, for example, the sealing layer 6 outside the sealing region 16 is peeled from the first base material sheet 3. In order to peel off the sealing layer 6 outside the sealing region 16, a known peeling device is used. Specifically, an adsorption device or the like is used.
　これによって、円形状の封止層６は、光半導体素子１５の封止に実質的に寄与する封止領域１６を構成する。 Thereby, the circular sealing layer 6 constitutes a sealing region 16 that substantially contributes to the sealing of the optical semiconductor element 15.
　封止領域１６の直径は、例えば、例えば、５ｍｍ以上、好ましくは、８ｍｍ以上であり、また、例えば、５０ｍｍ以下、好ましくは、３０ｍｍ以下である。 The diameter of the sealing region 16 is, for example, 5 mm or more, preferably 8 mm or more, and, for example, 50 mm or less, preferably 30 mm or less.
　　［第３切断工程］
　この方法では、図７に示す第３切断工程を、図６Ａおよび図６Ｂに示す除去工程の後に、実施する。第３切断工程では、図７Ａ～図７Ｃに示すように、封止部材１１を、封止部材１１が左右方向において複数（具体的には、５つに）分割されるように、第２積層シート２８を切断する。また、封止部材１１の分割と同時に、第２基材シート１４の前後方向両端部に、貫通孔２４を形成する。 [Third cutting step]
In this method, the third cutting step shown in FIG. 7 is performed after the removing step shown in FIGS. 6A and 6B. In the third cutting step, as shown in FIGS. 7A to 7C, the sealing member 11 is divided into a plurality of (specifically, five) sealing members 11 in the left-right direction. The sheet 28 is cut. Moreover, the through-hole 24 is formed in the front-back direction both ends of the 2nd base material sheet 14 simultaneously with the division | segmentation of the sealing member 11. FIG.
　第２積層シート２８の切断によって、複数の前後方向に沿う第２縦切断ライン１９と、複数の第２縦切断ライン１９の前後方向両端部のそれぞれに連続する第２横切断ライン２０とからなる第２切断ライン１８が形成される。 By the cutting of the second laminated sheet 28, it is composed of a second longitudinal cutting line 19 along a plurality of front and rear directions and a second horizontal cutting line 20 continuous to each of both end portions in the front and rear direction of the plurality of second longitudinal cutting lines 19. A second cutting line 18 is formed.
　複数の第２縦切断ライン１９は、左右方向に互いに間隔を隔てて並列して形成されている。第２縦切断ライン１９は、第１基材シート３、接着剤層４および第２基材シート１４を左右方向に分断するように、かつ、複数の封止層６を個片化するように、形成される。第２横切断ライン１９によって、封止層６は、前後方向に複数列（具体的には、４列）に配列される。なお、左右方向両外側の第２縦切断ライン１９Ｃは、封止層６に対応する第１基材シート３、接着剤層４および第２基材シート１４（すなわち、左右方向内側部分）と、封止層６に対応しない第１基材シート３および接着剤層４（すなわち、左右方向外側部分）とを仕切るように、形成されている。 The plurality of second vertical cutting lines 19 are formed in parallel in the left-right direction at intervals. The second vertical cutting line 19 divides the first base material sheet 3, the adhesive layer 4 and the second base material sheet 14 in the left-right direction, and separates the plurality of sealing layers 6 into individual pieces. ,It is formed. The sealing layers 6 are arranged in a plurality of rows (specifically, 4 rows) in the front-rear direction by the second horizontal cutting lines 19. In addition, the second vertical cutting line 19C on the both outer sides in the left-right direction includes the first base sheet 3, the adhesive layer 4 and the second base sheet 14 (that is, the inner part in the left-right direction) corresponding to the sealing layer 6, It forms so that the 1st base material sheet 3 and the adhesive bond layer 4 (namely, left-right direction outer side part) which do not correspond to the sealing layer 6 may be partitioned off.
　第２横切断ライン２０は、左右方向に沿うように形成されており、前後方向に互いに間隔を隔てて１対形成されている。１対の第２横切断ライン２０は、最前側の封止部材１１より前側、および、最後側の封止部材１１より後側に、間隔を隔てて形成されている。 The second horizontal cutting lines 20 are formed along the left-right direction, and are formed as a pair in the front-rear direction with a space therebetween. The pair of second horizontal cutting lines 20 are formed on the front side of the foremost sealing member 11 and on the rear side of the rearmost sealing member 11 with a gap therebetween.
　なお、第２切断ライン１８において外側に位置する切断ライン、具体的には、左右方向両外側の１対の第２縦切断ライン１９Ｃと、１対の第２縦切断ライン２０とにより、平面視略矩形状を形成し、かつ、複数の封止層６を含むように、形成されている。 The second cutting line 18 includes a pair of second vertical cutting lines 19C and a pair of second vertical cutting lines 20 on the outside in the left and right direction, specifically, in plan view. It is formed so as to form a substantially rectangular shape and include a plurality of sealing layers 6.
　貫通孔２４は、第１基材シート３および接着剤層４の前後方向両外側の第２基材シート１４を厚み方向を貫通することによって形成される。貫通孔２４は、第２縦切断ライン２０によって複数列に仕切られる第２基材シート１４の各１列に対して、１対設けられており、各貫通孔２４は、平面視略円形状に形成されている。 The through hole 24 is formed by penetrating the second base material sheet 14 on both outer sides in the front-rear direction of the first base material sheet 3 and the adhesive layer 4 in the thickness direction. A pair of through holes 24 is provided for each row of the second base sheet 14 partitioned into a plurality of rows by the second vertical cutting line 20, and each through hole 24 has a substantially circular shape in plan view. Is formed.
　　［回収工程］
　この方法では、図８に示す回収工程を、図７に示す第３切断工程の後に、実施する。回収工程では、図８Ａ～図８Ｄに示すように、第２切断ライン１８により仕切られた、封止部材１１を含む第２積層シート２８（図７参照）を、回収する。 [Recovery process]
In this method, the collection step shown in FIG. 8 is performed after the third cutting step shown in FIG. In the collecting step, as shown in FIGS. 8A to 8D, the second laminated sheet 28 (see FIG. 7) including the sealing member 11 partitioned by the second cutting line 18 is collected.
　この回収によって、前後方向に連続するように形成される第２基材シート１４と、第２基材シート１４の上面（表面）に、前後方向に互いに間隔を隔てて配置される複数の封止部材１１とを備える封止シート１を得る。また、封止シート１において、複数の封止部材１１は、第２基材シート１４の上面に、前後方向に間隔を隔てて積層される複数の接着剤層４と、複数の接着剤層４のそれぞれに上面にそれぞれ接着される複数の第１基材シート３と、複数の第１基材シート３のそれぞれの上面にそれぞれ積層される複数の封止層６とを備える。また、複数の封止層６のそれぞれは、封止領域１６を区画している。 By this collection, the second base sheet 14 formed so as to be continuous in the front-rear direction and a plurality of seals arranged on the upper surface (front surface) of the second base sheet 14 at intervals from each other in the front-rear direction. A sealing sheet 1 including the member 11 is obtained. Further, in the sealing sheet 1, the plurality of sealing members 11 are stacked on the upper surface of the second base sheet 14 at intervals in the front-rear direction, and the plurality of adhesive layers 4. And a plurality of first base sheet 3 bonded to the upper surface, and a plurality of sealing layers 6 respectively stacked on the upper surfaces of the plurality of first base sheet 3. Each of the plurality of sealing layers 6 defines a sealing region 16.
　その後、封止シート１の貫通孔２４に、搬送容器に設けられたピンなどの固定部材（図示せず）を挿入することによって、封止シート１が搬送容器に固定されながら、例えば、光半導体装置製造工場などに搬送される。 Thereafter, a fixing member (not shown) such as a pin provided in the transport container is inserted into the through hole 24 of the seal sheet 1 to fix the seal sheet 1 to the transport container. It is transported to equipment manufacturing factories.
　次に、図９Ａ～図９Ｃを参照して、封止シート１によって、光半導体素子１５を封止する方法を説明する。 Next, a method for sealing the optical semiconductor element 15 with the sealing sheet 1 will be described with reference to FIGS. 9A to 9C.
　この方法では、図９Ａに示すように、まず、封止対象としての光半導体素子１５が実装された基板２１を用意する。 In this method, as shown in FIG. 9A, first, a substrate 21 on which an optical semiconductor element 15 to be sealed is mounted is prepared.
　基板２１は、少なくとも前後方向に延びる略矩形の平板状に形成されている。基板２１は、例えば、シリコン基板、セラミック基板、ポリイミド樹脂基板、金属基板に絶縁層が積層された積層基板などの絶縁基板からなる。 The substrate 21 is formed in a substantially rectangular flat plate shape extending at least in the front-rear direction. The substrate 21 is made of an insulating substrate such as a silicon substrate, a ceramic substrate, a polyimide resin substrate, or a laminated substrate in which an insulating layer is laminated on a metal substrate.
　また、基板２１の上面には、光半導体素子１５の端子（図示せず）と電気的に接続するための電極（図示せず）と、それに連続する配線とを備える導体パターン（図示せず）が形成されている。導体パターンは、例えば、金、銅、銀、ニッケルなどの導体から形成されている。 Further, a conductor pattern (not shown) provided on the upper surface of the substrate 21 is provided with an electrode (not shown) for electrically connecting to a terminal (not shown) of the optical semiconductor element 15 and a wiring continuous therewith. Is formed. The conductor pattern is formed from a conductor such as gold, copper, silver, or nickel.
　基板２１の平面視における寸法は適宜選択され、具体的には、前後方向の長さが、例えば、５ｍｍ以上、好ましくは、１０ｍｍ以上であり、また、例えば、２００ｍｍ以下、好ましくは、１５０ｍｍ以下である。基板２１の厚みは、例えば、１００μｍ以上、好ましくは、５００μｍ以上であり、また、例えば、５０００μｍ以下、好ましくは、３０００μｍ以下である。 The dimension in plan view of the substrate 21 is appropriately selected. Specifically, the length in the front-rear direction is, for example, 5 mm or more, preferably 10 mm or more, and for example, 200 mm or less, preferably 150 mm or less. is there. The thickness of the board | substrate 21 is 100 micrometers or more, for example, Preferably, it is 500 micrometers or more, for example, is 5000 micrometers or less, Preferably, it is 3000 micrometers or less.
　光半導体素子１５は、電気エネルギーを光エネルギーに変換する光半導体素子であり、例えば、厚みが面方向長さ（厚み方向に対する直交方向長さ、具体的には、前後方向長さおよび左右方向長さ）より短い断面視略矩形状に形成されている。また、光半導体素子１５は、平面視略矩形状に形成されている。 The optical semiconductor element 15 is an optical semiconductor element that converts electrical energy into light energy. For example, the thickness is the length in the plane direction (the length in the direction perpendicular to the thickness direction, specifically, the length in the front-rear direction and the length in the left-right direction). A) It is formed in a substantially rectangular shape in section view. The optical semiconductor element 15 is formed in a substantially rectangular shape in plan view.
　光半導体素子１５としては、例えば、青色光を発光する青色ＬＥＤなどのＬＥＤ（発光ダイオード素子）や、ＬＤ（レーザーダイオード）などが挙げられる。光半導体素子１５の寸法は、用途および目的に応じて適宜設定され、具体的には、厚みが、例えば、１０～１０００μｍ、平面視における前後方向の長さおよび／または左右方向の長さが、例えば、０．０１ｍｍ以上、好ましくは、０．１ｍｍ以上であり、また、例えば、１５ｍｍ以下、好ましくは、２０ｍｍ以下である。 Examples of the optical semiconductor element 15 include an LED (light emitting diode element) such as a blue LED that emits blue light, and an LD (laser diode). The dimensions of the optical semiconductor element 15 are appropriately set according to the use and purpose. Specifically, the thickness is, for example, 10 to 1000 μm, the length in the front-rear direction and / or the length in the left-right direction in plan view is For example, it is 0.01 mm or more, preferably 0.1 mm or more, and for example, 15 mm or less, preferably 20 mm or less.
　光半導体素子１５は、前後方向に間隔を隔てて整列配置されている。各光半導体素子１５間の間隔（前後方向の間隔）Ｌ３は、例えば、３ｍｍ以上、好ましくは、５ｍｍ以上であり、また、例えば、１５０ｍｍ以下、好ましくは、７０ｍｍ以下である。また、光半導体素子１５間のピッチＬ４、すなわち、上記した間隔Ｌ３および光半導体素子１５の長さの総長さＬ４は、上記した封止部材１１間のピッチＬ２と同一であって、具体的には、例えば、５ｍｍ以上、好ましくは、１０ｍｍ以上であり、また、例えば、１００ｍｍ以下、好ましくは、５０ｍｍ以下である。 The optical semiconductor elements 15 are aligned and spaced in the front-rear direction. An interval (interval in the front-rear direction) L3 between the optical semiconductor elements 15 is, for example, 3 mm or more, preferably 5 mm or more, and, for example, 150 mm or less, preferably 70 mm or less. Further, the pitch L4 between the optical semiconductor elements 15, that is, the total distance L4 of the distance L3 and the length of the optical semiconductor element 15 is the same as the pitch L2 between the sealing members 11, and specifically, Is, for example, 5 mm or more, preferably 10 mm or more, and for example, 100 mm or less, preferably 50 mm or less.
　光半導体素子１５は、基板２１に対して、例えば、フリップチップ実装されている。あるいは、光半導体素子１５は、基板２１の電極（図示せず）とワイヤボンディング接続されている。 The optical semiconductor element 15 is, for example, flip-chip mounted on the substrate 21. Alternatively, the optical semiconductor element 15 is connected to an electrode (not shown) of the substrate 21 by wire bonding.
　続いて、この方法では、封止シート１を、各封止層６が、厚み方向において光半導体素子１５と対向するように、配置する。 Subsequently, in this method, the sealing sheet 1 is arranged so that each sealing layer 6 faces the optical semiconductor element 15 in the thickness direction.
　この方法では、次いで、図９Ｂに示すように、封止シート１によって、光半導体素子１５を封止する。具体的には、封止シート１を、基板２１に対して相対的に押し下げる。これによって、複数の封止層６のそれぞれが複数の光半導体素子１５のそれぞれを被覆して封止する。つまり、複数の封止層６のそれぞれが複数の光半導体素子１５のそれぞれを埋設する。その後、封止層６が硬化性樹脂を含有する場合には、封止層６をＣステージ化（完全硬化）させる。 In this method, the optical semiconductor element 15 is then sealed with the sealing sheet 1 as shown in FIG. 9B. Specifically, the sealing sheet 1 is pushed down relative to the substrate 21. Thereby, each of the plurality of sealing layers 6 covers and seals each of the plurality of optical semiconductor elements 15. That is, each of the plurality of sealing layers 6 embeds each of the plurality of optical semiconductor elements 15. Thereafter, when the sealing layer 6 contains a curable resin, the sealing layer 6 is C-staged (completely cured).
　その後、この方法では、図９Ｃに示すように、第２基材シート１４、接着剤層４および第１基材シート３を、封止層６から引き剥がす。 Thereafter, in this method, as shown in FIG. 9C, the second base sheet 14, the adhesive layer 4, and the first base sheet 3 are peeled off from the sealing layer 6.
　これによって、基板２１、複数の光半導体素子１５および複数の封止層６を備える光半導体装置２２を得る。 Thereby, the optical semiconductor device 22 including the substrate 21, the plurality of optical semiconductor elements 15, and the plurality of sealing layers 6 is obtained.
　光半導体装置２２において、複数の封止層６は、前後方向に間隔を隔てて設けられており、封止領域１６をなす。複数の封止層６のそれぞれは、複数の光半導体素子１５のそれぞれを封止している。具体的には、封止領域１６は、光半導体素子１５の上面および側面を被覆している。 In the optical semiconductor device 22, the plurality of sealing layers 6 are provided at intervals in the front-rear direction and form the sealing region 16. Each of the plurality of sealing layers 6 seals each of the plurality of optical semiconductor elements 15. Specifically, the sealing region 16 covers the upper surface and side surfaces of the optical semiconductor element 15.
　その後、必要によって、図９Ｃの破線で示すように、各光半導体素子１５に対応する基板２１を切断して個片化する。これによって、基板２１、単数の光半導体素子１５および単数の封止層６を備える光半導体装置２２を得る。 Thereafter, as necessary, as indicated by broken lines in FIG. 9C, the substrate 21 corresponding to each optical semiconductor element 15 is cut into individual pieces. Thus, the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, and the single sealing layer 6 is obtained.
　そして、この封止シート１の製造方法では、封止層６が前後方向において複数分割されるように封止層６を切断して、複数の封止部材１１を形成し、その後、複数の封止部材１１を、前後方向に互いに間隔を隔てるように配置する（図４Ａ参照）。そのため、切断後の複数の封止部材１１を、簡便な方法によって、前後方向に互いに間隔を隔てるように配置するので、前後方向に連続するように形成される封止層６（図１Ａ参照）を、有効に利用することができる。そのため、封止層６の歩留まりを向上させて、封止シートの製造コストを低減することができる。 And in this manufacturing method of the sealing sheet 1, the sealing layer 6 is cut | disconnected so that the sealing layer 6 may be divided | segmented into two or more in the front-back direction, the several sealing member 11 is formed, and several sealing member is made after that. The stop member 11 is arrange | positioned so that it may mutually space apart in the front-back direction (refer FIG. 4A). Therefore, the plurality of sealing members 11 after being cut are arranged so as to be spaced apart from each other in the front-rear direction by a simple method, so that the sealing layer 6 formed so as to be continuous in the front-rear direction (see FIG. 1A) Can be used effectively. Therefore, the yield of the sealing layer 6 can be improved and the manufacturing cost of the sealing sheet can be reduced.
　また、この方法によれば、図１に示す封止層形成工程では、封止層６および第１基材シート３を備える第１積層シート８を形成するので、封止層６を第１基材シート３によって支持することができ、続いて、図２に示す第１切断工程において、第１積層シート８を切断するので、封止層６の取扱性を向上させて、第１切断工程における封止層６の切断の精度を向上させることができる。 Moreover, according to this method, since the 1st lamination sheet 8 provided with the sealing layer 6 and the 1st base material sheet 3 is formed in the sealing layer formation process shown in FIG. In the first cutting step shown in FIG. 2, the first laminated sheet 8 is cut, so that the handling property of the sealing layer 6 is improved and the first cutting step can be performed. The accuracy of cutting the sealing layer 6 can be improved.
　この封止シート１の製造方法では、図４に示すように、複数の封止部材１１を第２基材シート１４の上面に配置するので、複数の封止部材１１の配置の精度を向上させることができる。そのため、複数の封止部材１１によって、複数の光半導体素子１５を精度よく封止することができる。 In the manufacturing method of this sealing sheet 1, since the some sealing member 11 is arrange | positioned on the upper surface of the 2nd base material sheet 14, as shown in FIG. 4, the precision of arrangement | positioning of the several sealing member 11 is improved. be able to. Therefore, the plurality of optical semiconductor elements 15 can be accurately sealed by the plurality of sealing members 11.
　この封止シート１の製造方法では、蛍光体を含有する粒子の歩留まりを向上させることができる。 In the manufacturing method of this sealing sheet 1, the yield of the particle | grains containing a fluorescent substance can be improved.
　この封止シート１では、封止層６を、前後方向に連続するように形成される第２基材シート１４によって、前後方向に互いに間隔を隔てて配置される第１基材シート３を介して、支持することができる。そのため、封止シート１の製造コストを低減しながら、第１基材シート３および第２基材シート１４によって、封止層６を柔軟に支持することができる。 In this sealing sheet 1, the sealing layer 6 is interposed by the second base material sheet 14 formed so as to be continuous in the front-rear direction, with the first base material sheet 3 arranged at intervals in the front-rear direction. Can be supported. Therefore, the sealing layer 6 can be flexibly supported by the first base material sheet 3 and the second base material sheet 14 while reducing the manufacturing cost of the sealing sheet 1.
　　＜第１実施形態の変形例＞
　図１０および図１１に示すように、封止シート１に位置決めマーク２３を設けることもできる。 <Modification of First Embodiment>
As shown in FIGS. 10 and 11, a positioning mark 23 can be provided on the sealing sheet 1.
　位置決めマーク２３は、図７に示される第３切断工程において、第２切断ライン１８の形成と同時に、形成される。 The positioning mark 23 is formed simultaneously with the formation of the second cutting line 18 in the third cutting step shown in FIG.
　位置決めマーク２３は、図１０および図１１に示すように、封止層６の外側に形成される。また、位置決めマーク２３は、各封止層６に対して、１対設けられている。１対の位置決めマーク２３は、各封止層６を挟むように設けられており、一方の位置決めマーク２３は、封止層６に対して、後側かつ右側に設けられ、また、他方の位置決めマーク２３は、封止層６に対して、前側かつ左側に設けられている。 The positioning mark 23 is formed outside the sealing layer 6 as shown in FIGS. A pair of positioning marks 23 is provided for each sealing layer 6. A pair of positioning marks 23 are provided so as to sandwich each sealing layer 6, and one positioning mark 23 is provided on the rear side and the right side with respect to the sealing layer 6, and the other positioning mark 23 is positioned. The mark 23 is provided on the front side and the left side with respect to the sealing layer 6.
　各位置決めマーク２３は、封止シート１を厚み方向に貫通する平面視略円形状の貫通孔として形成されている。 Each positioning mark 23 is formed as a substantially circular through hole in a plan view that penetrates the sealing sheet 1 in the thickness direction.
　図１０に示す変形例では、位置決めマーク２３は、第１基材シート３および接着剤層４の外側、具体的には、前後方向両外側に形成されており、第２基材シート１４を貫通するように形成されている。なお、複数の封止層６の間に設けられる位置決めマーク２３は、左右方向に対向して形成されている。 In the modification shown in FIG. 10, the positioning mark 23 is formed on the outer side of the first base sheet 3 and the adhesive layer 4, specifically on both outer sides in the front-rear direction, and penetrates the second base sheet 14. It is formed to do. Note that the positioning marks 23 provided between the plurality of sealing layers 6 are formed to face each other in the left-right direction.
　一方、図１１に示す変形例では、位置決めマーク２３は、封止層６の外側であって、第１基材シート３の周縁の内側において、第１基材シート３、接着剤層４および第２基材シート１４を貫通するように形成されている。詳しくは、１対の位置決めマーク２３は、略矩形状の第１基材シート３の対角線上に形成されている。 On the other hand, in the modification shown in FIG. 11, the positioning mark 23 is outside the sealing layer 6 and inside the peripheral edge of the first base sheet 3, the first base sheet 3, the adhesive layer 4, and the first 2 It is formed so as to penetrate through the base material sheet 14. Specifically, the pair of positioning marks 23 is formed on a diagonal line of the substantially rectangular first base sheet 3.
　なお、図１０および図１１において、最前側に設けられる位置決めマーク２３は、前側の貫通孔２４の左方斜め後側に間隔を隔てて形成される。一方、最後側に設けられる位置決めマーク２３は、後側の貫通孔２４の右方斜め前側に間隔を隔てて形成される。 10 and 11, the positioning mark 23 provided on the foremost side is formed on the diagonally left rear side of the front through-hole 24 with an interval. On the other hand, the positioning mark 23 provided on the rear side is formed on the right front side of the rear through hole 24 at an interval.
　図８Ｃに示すように、各封止層６の封止領域１６を略円形状に形成しているが、その形状は、特に限定されず、例えば、図１２に示すように、前後方向に長い略楕円形状、例えば、図１３に示すように、略６角形状、例えば、図１４に示すように、略矩形状に形成することもできる。 As shown in FIG. 8C, the sealing region 16 of each sealing layer 6 is formed in a substantially circular shape, but the shape is not particularly limited. For example, as shown in FIG. 12, it is long in the front-rear direction. It is also possible to form a substantially elliptical shape, for example, a substantially hexagonal shape as shown in FIG. 13, for example, a substantially rectangular shape as shown in FIG.
　また、図５に示す第２切断工程を、図２に示す第１切断工程の後または第１切断工程と同時に実施することもできる。 Further, the second cutting step shown in FIG. 5 can be performed after the first cutting step shown in FIG. 2 or simultaneously with the first cutting step.
　好ましくは、後述する光半導体素子１５に対する封止層６の位置決め精度の観点から、図４に示す配置工程の後に、図５に示す第２切断工程を実施する。 Preferably, from the viewpoint of positioning accuracy of the sealing layer 6 with respect to the optical semiconductor element 15 described later, the second cutting step shown in FIG. 5 is performed after the placement step shown in FIG.
　また、図５に示す第１切断工程を実施することなく、例えば、ドライエッチングなどのエッチングによって、図４に示す載置工程の後に、図６の除去工程を実施して、封止層６の封止領域１６を形成することもできる。 Moreover, without performing the 1st cutting process shown in FIG. 5, the removal process of FIG. 6 is implemented after the mounting process shown in FIG. The sealing region 16 can also be formed.
　さらに、図１Ａに示すように、積層基材シート２に接着剤層４を設けているが、接着剤層４を設けることなく、積層基材シート２を第１基材シート３および離型シート５から構成することもできる。その場合には、好ましくは、第１基材シート３は、好ましくは、接着性を有しており、その下面に、離型シート５が積層されている。 Furthermore, as shown to FIG. 1A, although the adhesive layer 4 is provided in the lamination | stacking base material sheet 2, without providing the adhesive bond layer 4, the lamination | stacking base material sheet 2 and the 1st base material sheet 3 and a release sheet are provided. It can also consist of five. In that case, the first base sheet 3 preferably has adhesiveness, and the release sheet 5 is laminated on the lower surface thereof.
　さらにまた、図１で示す封止層形成工程では、封止層６を積層基材シート２の上に形成して、続いて、図２で示す第１切断工程において、封止層６を積層基材シート２とともに切断しているが、例えば、図示しないが、積層基材シート２を切断せず、封止層６のみを切断し、続いて、載置工程において、図４が参照されるように、接着剤層４のみを第２基材シート１４に載置することもできる。さらに、封止層６を積層基材シート２の上に形成することなく、単独でシート状に形成することもでき、かかる封止層６を切断して、その後、切断した封止層６を第２基材シート１４に載置することもできる。 Furthermore, in the sealing layer forming step shown in FIG. 1, the sealing layer 6 is formed on the laminated substrate sheet 2, and subsequently, in the first cutting step shown in FIG. 2, the sealing layer 6 is laminated. Although it cut | disconnects with the base material sheet 2, for example, although not shown in figure, the laminated base material sheet 2 is not cut | disconnected but only the sealing layer 6 is cut | disconnected, Then, FIG. 4 is referred in the mounting process. In this way, only the adhesive layer 4 can be placed on the second base sheet 14. Furthermore, without forming the sealing layer 6 on the laminated base sheet 2, it can also be formed in a sheet form alone. After cutting the sealing layer 6, the cut sealing layer 6 is then cut. It can also be placed on the second base sheet 14.
　また、第１切断工程において、積層基材シート２を切断せず、封止層６のみを切断する場合において、載置工程において、切断した封止層６のみを、積層基材シート２から一旦剥離し、再度、積層基材シート２の上面に、前後方向において間隔を隔てるように載置（再配置）することもできる。 Moreover, in the 1st cutting process, when not cut | disconnecting the lamination | stacking base material sheet 2, but only the sealing layer 6 is cut | disconnected, in the mounting process, only the cut | disconnected sealing layer 6 is once from the lamination | stacking base material sheet 2. It peels and can also mount (rearrange) on the upper surface of the lamination | stacking base material sheet 2 so that it may space apart in the front-back direction.
　第１実施形態では、図１Ａおよび図１Ｂの封止層形成工程において、接着剤層４を第１基材シート３および離型シート５の間に設け、また、図８Ａおよび図８Ｂの回収工程で回収される封止部材１１において、接着剤層４を、第２基材シート１４と第１基材シート３との間に設けている。しかしながら、図１Ａおよび図１Ｂでは図示しないが、封止層形成工程において、接着剤層４を設けず、第１基材シート３および離型シート５から積層基材シート２を構成し、また、図８Ａおよび図８Ｂでは図示しないが、回収工程で回収される第２基材シート１４、第１基材シート３および封止層６から封止部材１１を構成することもできる。つまり、封止部材１１において、第１基材シート３を第２基材シート１４の上面に直接積層することもできる。 In the first embodiment, in the sealing layer forming step of FIGS. 1A and 1B, the adhesive layer 4 is provided between the first base sheet 3 and the release sheet 5, and the recovery step of FIGS. 8A and 8B. In the sealing member 11 recovered in step (1), the adhesive layer 4 is provided between the second base sheet 14 and the first base sheet 3. However, although not shown in FIG. 1A and FIG. 1B, in the sealing layer forming step, the adhesive layer 4 is not provided, and the laminated base sheet 2 is configured from the first base sheet 3 and the release sheet 5, Although not shown in FIGS. 8A and 8B, the sealing member 11 can also be configured from the second base sheet 14, the first base sheet 3, and the sealing layer 6 that are recovered in the recovery step. That is, in the sealing member 11, the first base sheet 3 can be directly laminated on the upper surface of the second base sheet 14.
　また、図５の第２切断工程と、図７の第３切断工程とを、同時に実施することもできる。この方法では、第２切断工程と第３切断工程とにおいて、封止領域１６を仕切るように、封止層６を切断するとともに、封止部材１１が複数に分割されるように第２積層シート２８を切断する。 Also, the second cutting step in FIG. 5 and the third cutting step in FIG. 7 can be performed simultaneously. In this method, in the second cutting step and the third cutting step, the sealing layer 6 is cut so as to partition the sealing region 16, and the second laminated sheet is divided into a plurality of sealing members 11. 28 is cut.
　第２切断工程および第３切断工程の後に、図６の除去工程を実施する。すなわち、この除去工程では、封止領域１６の外側の封止層６を除去する。 6 After the second cutting step and the third cutting step, the removing step shown in FIG. 6 is performed. That is, in this removing step, the sealing layer 6 outside the sealing region 16 is removed.
　この方法によれば、第２切断工程と第３切断工程とを同時に実施するので、封止シート１における封止層６の位置精度を向上させることができる。 According to this method, since the second cutting step and the third cutting step are performed simultaneously, the positional accuracy of the sealing layer 6 in the sealing sheet 1 can be improved.
　　＜第２実施形態＞
　本発明の封止シートおよびその製造方法の第２実施形態を、図１～図４、図１５および図１６を参照して説明する。 Second Embodiment
A second embodiment of the sealing sheet and the method for producing the same of the present invention will be described with reference to FIGS. 1 to 4, 15 and 16.
　図１５および図１６において、第１実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。 15 and FIG. 16, members and processes similar to those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
　第１実施形態では、図５に示す第２切断工程および図６に示す除去工程を実施しているが、第２切断工程および除去工程を実施せず、図４に示す配置工程の後に、図１５に示す第３切断工程を実施することもできる。 In the first embodiment, the second cutting step shown in FIG. 5 and the removing step shown in FIG. 6 are carried out, but the second cutting step and the removing step are not carried out, and after the arrangement step shown in FIG. The 3rd cutting process shown in 15 can also be implemented.
　つまり、本発明の第２実施形態である封止シート１の製造方法は、封止層形成工程（図１参照）、第１切断工程（図２参照）、配置工程（図３および図４参照）、第３切断工程（図１５参照）、および、回収工程（図１６参照）を備えており、これら各工程が順次実施される。 That is, the manufacturing method of the sealing sheet 1 which is 2nd Embodiment of this invention is a sealing layer formation process (refer FIG. 1), a 1st cutting process (refer FIG. 2), an arrangement | positioning process (refer FIG. 3 and FIG. 4). ), A third cutting step (see FIG. 15), and a recovery step (see FIG. 16), and these steps are sequentially performed.
　図１６に示すように、回収工程後の封止層６は、平面視略矩形状をなし、前後方向に互いに間隔を隔てて対向配置されている。 As shown in FIG. 16, the sealing layer 6 after the recovery step has a substantially rectangular shape in plan view, and is disposed to face each other with a space in the front-rear direction.
　第２実施形態によれば、第１実施形態と同様の作用効果を奏することができ、さらに、第２切断工程（図５参照）および除去工程（図６参照）を実施しないので、製造工数を削減して、製造コストをより一層低減することができる。 According to the second embodiment, the same operational effects as those of the first embodiment can be obtained. Further, since the second cutting step (see FIG. 5) and the removing step (see FIG. 6) are not performed, the number of manufacturing steps can be reduced. The manufacturing cost can be further reduced.
　　＜第３実施形態＞
　本発明の封止シートおよびその製造方法の第３実施形態を、図１７～図２０を参照して説明する。 <Third Embodiment>
A third embodiment of the sealing sheet and the method for producing the same according to the present invention will be described with reference to FIGS.
　図１７～図２０において、第１実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。 17 to 20, members and steps similar to those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
　　［第１切断工程］
　第１切断工程では、図１７に示すように、第１積層シート８が前後方向および左右方向において複数分割されるように、第１積層シート８を切断する。第１積層シート８の切断によって、第１切断ライン１７は、平面視略碁盤目状に形成される。具体的には、第１縦切断ライン１０は、左右方向に互いに間隔を隔てて並列配置されている。 [First cutting step]
In the first cutting step, as shown in FIG. 17, the first laminated sheet 8 is cut so that the first laminated sheet 8 is divided into a plurality of parts in the front-rear direction and the left-right direction. By cutting the first laminated sheet 8, the first cutting lines 17 are formed in a substantially grid pattern in plan view. Specifically, the first vertical cutting lines 10 are arranged in parallel in the left-right direction at intervals.
　　［配置工程］
　　〔剥離工程〕
　配置工程における剥離工程では、図１７の矢印で示すように、封止部材１１を引き上げる。 [Arrangement process]
[Peeling process]
In the peeling step in the placement step, the sealing member 11 is pulled up as shown by the arrow in FIG.
　　〔載置工程〕
　続いて、載置工程では、図１８の矢印で示すように、複数の封止部材１１を、前後方向および左右方向に互いに間隔を隔てるように、第２基材シート１４の上面に配置する。 [Installation process]
Subsequently, in the placing step, as shown by arrows in FIG. 18, the plurality of sealing members 11 are arranged on the upper surface of the second base sheet 14 so as to be spaced apart from each other in the front-rear direction and the left-right direction.
　　［第２切断工程および除去工程］
　図１９に示すように、第２切断工程において、封止層６を切断し、続いて、図１９の矢印で示すように、除去工程において、封止領域１６の外側の封止層６を除去する。 [Second cutting step and removal step]
As shown in FIG. 19, the sealing layer 6 is cut in the second cutting step, and then the sealing layer 6 outside the sealing region 16 is removed in the removing step as shown by the arrow in FIG. To do.
　　［第３切断工程］
　図２０に示すように、封止部材１１を、封止部材１１が左右方向において複数列（具体的には、４列に）分割されるように、第２基材シート１４を切断する。 [Third cutting step]
As shown in FIG. 20, the second base sheet 14 is cut so that the sealing member 11 is divided into a plurality of rows (specifically, four rows) in the left-right direction.
　具体的には、第２切断ライン１８の第２縦切断ライン１９が、左右方向に隣接する第１基材シート３および接着剤層４の間を通過するように、形成される。 Specifically, the second longitudinal cutting line 19 of the second cutting line 18 is formed so as to pass between the first base sheet 3 and the adhesive layer 4 adjacent in the left-right direction.
　これによって得られる封止シート１において、第１基材シート３および接着剤層４は、各第２基材シート１４の左右方向中央（途中）に形成される。つまり、第２基材シート１４の周端部の上面は、第１基材シート３から露出している。 In the encapsulating sheet 1 obtained as a result, the first base sheet 3 and the adhesive layer 4 are formed in the middle (in the middle) of the second base sheet 14 in the left-right direction. That is, the upper surface of the peripheral end portion of the second base sheet 14 is exposed from the first base sheet 3.
　第３実施形態によっても、第１実施形態と同様の作用効果を奏することができ、さらに、図１７に示すように、第１切断工程において、第１積層シート８が左右方向にも複数分割されるように、第１積層シート８を切断し、続いて、図１８に示すように、複数の封止部材１１を、左右方向にも互いに間隔を隔てるように、第２基材シート１４に配置するので、封止層６の歩留まりをより一層向上させて、封止シート１の製造コストを低減することができる。 According to the third embodiment, the same operational effects as those of the first embodiment can be obtained. Further, as shown in FIG. 17, in the first cutting step, the first laminated sheet 8 is divided into a plurality of parts in the left-right direction. First, the first laminated sheet 8 is cut, and then, as shown in FIG. 18, a plurality of sealing members 11 are arranged on the second base sheet 14 so as to be spaced from each other in the left-right direction. Therefore, the yield of the sealing layer 6 can be further improved, and the manufacturing cost of the sealing sheet 1 can be reduced.
　　＜第４実施形態＞
　図２１、図２３、図２４、図２６および図２７において、矢印で示す左右方向（あるいは横方向）は、第１方向の一例であり、図２１～図２７の矢印で示す前後方向（あるいは縦方向）は、第２方向の一例である。 <Fourth embodiment>
In FIG. 21, FIG. 23, FIG. 24, FIG. 26 and FIG. 27, the left-right direction (or horizontal direction) indicated by the arrow is an example of the first direction. (Direction) is an example of the second direction.
　本発明の封止シートの製造方法の第４実施形態を、図２１～図２３を参照して説明する。 A fourth embodiment of the method for producing a sealing sheet of the present invention will be described with reference to FIGS.
　図２１～図２３において、第１実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。 21 to 23, the same members and processes as those of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
　図２１に示すように、本発明の第３実施形態である封止シート１の製造方法は、封止層形成工程（図２１Ａおよび図２１Ｂ参照）、切断工程（図２１Ｃ参照）を備える。 As shown in FIG. 21, the manufacturing method of the sealing sheet 1 which is 3rd Embodiment of this invention comprises a sealing layer formation process (refer FIG. 21A and FIG. 21B), and a cutting process (refer FIG. 21C).
　　[封止層形成工程]
　図２１Ａに示すように、まず、基材シート３１を用意する。基材シート３１は、前後方向および左右方向に延びる略矩形の平板形状に形成されており、第１実施形態の第１基材シート３と同様に構成されている。 [Sealing layer forming process]
As shown in FIG. 21A, first, a base sheet 31 is prepared. The base material sheet 31 is formed in a substantially rectangular flat plate shape extending in the front-rear direction and the left-right direction, and is configured similarly to the first base material sheet 3 of the first embodiment.
　次いで、図２１Ｂに示すように、封止層６を、基材シート３１の上面に設ける。具体的には、複数の封止層６を、基材シート３１の上面において、左右方向に互いに間隔を隔てて、前後方向に沿うように、設ける。図２２Ａが参照されるように、各封止層６の間隔Ｌ５は、封止対象としての光半導体素子１５（図２２Ａ参照）のピッチなどによって適宜設定され、具体的には、例えば、１ｍｍ以上、好ましくは、３ｍｍ以上であり、また、例えば、２０ｍｍ以下、好ましくは、１０ｍｍ以下である。複数の封止層６間のピッチＬ６、すなわち、上記した間隔Ｌ５および封止層６の前後方向長さの総長さＬ６が、例えば、５ｍｍ以上、好ましくは、１０ｍｍ以上であり、また、例えば、１００ｍｍ以下、好ましくは、５０ｍｍ以下である。 Next, as shown in FIG. 21B, the sealing layer 6 is provided on the upper surface of the base sheet 31. Specifically, the plurality of sealing layers 6 are provided on the upper surface of the base sheet 31 so as to be along the front-rear direction with a space in the left-right direction. As shown in FIG. 22A, the interval L5 between the sealing layers 6 is appropriately set depending on the pitch of the optical semiconductor element 15 (see FIG. 22A) as a sealing target, and specifically, for example, 1 mm or more. The thickness is preferably 3 mm or more, and for example, 20 mm or less, preferably 10 mm or less. The pitch L6 between the plurality of sealing layers 6, that is, the above-described distance L5 and the total length L6 of the length in the front-rear direction of the sealing layer 6 is, for example, 5 mm or more, preferably 10 mm or more. 100 mm or less, preferably 50 mm or less.
　封止層６を基材シート３１の上面に設けるには、例えば、上記した封止組成物を基材シート３１の塗布する方法、例えば、別途用意した剥離シート（図示せず）の上に、上記した封止組成物を左右方向に互いに間隔を隔てて一旦塗布して封止層６を形成した後、この封止層６を基材シート３１に転写する方法が挙げられる。好ましくは、製造工程数の低減の観点から、封止組成物を基材シート３１の塗布する。 In order to provide the sealing layer 6 on the upper surface of the base material sheet 31, for example, a method of applying the sealing composition described above to the base material sheet 31, for example, on a separately prepared release sheet (not shown), A method of transferring the sealing layer 6 to the base material sheet 31 after applying the sealing composition described above in the left-right direction at a distance from each other to form the sealing layer 6 may be mentioned. Preferably, the base material sheet 31 is applied from the viewpoint of reducing the number of manufacturing steps.
　封止組成物を基材シート３１の塗布する方法では、封止組成物を、基材シート３１の上面において、基材シート３１より小さいエリアに、左右方向に互いに間隔を隔て、前後方向に連続するパターンで塗布して、皮膜７を形成する。 In the method of applying the sealing composition to the base sheet 31, the sealing composition is continuously spaced in the front-rear direction, spaced apart from each other in the left-right direction in an area smaller than the base sheet 31 on the upper surface of the base sheet 31. The film 7 is formed by coating with a pattern.
　その後、必要により、樹脂が硬化性樹脂である場合には、皮膜７を、加熱および／または活性エネルギー線照射する。より具体的には、樹脂が２段階硬化性樹脂を含有する場合には、加熱および／または活性エネルギー線照射によって、封止層６をＢステージ化（半硬化）させる。 Thereafter, if necessary, when the resin is a curable resin, the coating 7 is heated and / or irradiated with active energy rays. More specifically, when the resin contains a two-step curable resin, the sealing layer 6 is B-staged (semi-cured) by heating and / or active energy ray irradiation.
　これにより、シート状の封止層６を基材シート３１の上面に左右方向に互いに間隔を隔て設ける。 Thereby, the sheet-shaped sealing layer 6 is provided on the upper surface of the base material sheet 31 at intervals in the left-right direction.
　また、基材シート３１および複数の封止層６から構成される積層シート３２を得る。 Further, a laminated sheet 32 composed of the base sheet 31 and the plurality of sealing layers 6 is obtained.
　　［切断工程］
　切断工程では、図２１Ｃに示すように、積層シート３２が前後方向において複数分割されるように、積層シート３２を切断する。 [Cutting process]
In the cutting step, as shown in FIG. 21C, the laminated sheet 32 is cut so that the laminated sheet 32 is divided into a plurality of parts in the front-rear direction.
　具体的には、複数の封止層６のそれぞれが、前後方向に複数分割されるように、封止層６を基材シート３１とともに切断する。 Specifically, the sealing layer 6 is cut together with the base sheet 31 so that each of the plurality of sealing layers 6 is divided into a plurality of parts in the front-rear direction.
　これによって、左右方向に延びる基材シート３１と、基材シート３１の上面において、左右方向に互いに間隔を隔てて配置される封止層６とを備える封止シート１を得る。 Thus, the sealing sheet 1 including the base sheet 31 extending in the left-right direction and the sealing layers 6 arranged on the upper surface of the base sheet 31 at intervals in the left-right direction is obtained.
　次に、図２２Ａ～図２２Ｃを参照して、封止シート１によって、光半導体素子１５を封止する方法を説明する。 Next, a method for sealing the optical semiconductor element 15 with the sealing sheet 1 will be described with reference to FIGS. 22A to 22C.
　この方法では、図２２Ａに示すように、まず、光半導体素子１５が実装された基板２１を用意する。 In this method, as shown in FIG. 22A, first, a substrate 21 on which an optical semiconductor element 15 is mounted is prepared.
　続いて、この方法では、封止シート１を、各封止層６が、厚み方向において光半導体素子１５と対向するように、配置する。 Subsequently, in this method, the sealing sheet 1 is arranged so that each sealing layer 6 faces the optical semiconductor element 15 in the thickness direction.
　この方法では、次いで、図２２Ｂに示すように、封止シート１によって、光半導体素子１５を封止する。具体的には、封止シート１を、基板２１に対して相対的に押し下げる。これによって、複数の封止層６のそれぞれが複数の光半導体素子１５のそれぞれを被覆して封止する。つまり、複数の封止層６のそれぞれが複数の光半導体素子１５のそれぞれを埋設する。その後、封止層６が硬化性樹脂を含有する場合には、封止層６をＣステージ化（完全硬化）させる。 In this method, the optical semiconductor element 15 is then sealed with the sealing sheet 1 as shown in FIG. 22B. Specifically, the sealing sheet 1 is pushed down relative to the substrate 21. Thereby, each of the plurality of sealing layers 6 covers and seals each of the plurality of optical semiconductor elements 15. That is, each of the plurality of sealing layers 6 embeds each of the plurality of optical semiconductor elements 15. Thereafter, when the sealing layer 6 contains a curable resin, the sealing layer 6 is C-staged (completely cured).
　その後、この方法では、図２２Ｃに示すように、基材シート３１を封止層６から引き剥がす。 Thereafter, in this method, the base material sheet 31 is peeled off from the sealing layer 6 as shown in FIG. 22C.
　これによって、基板２１、複数の光半導体素子１５および複数の封止層６を備える光半導体装置２２を得る。 Thereby, the optical semiconductor device 22 including the substrate 21, the plurality of optical semiconductor elements 15, and the plurality of sealing layers 6 is obtained.
　その後、必要によって、図２２Ｃの破線で示すように、各光半導体素子１５に対応する基板２１を切断して個片化する。これによって、基板２１、単数の光半導体素子１５および単数の封止層６を備える光半導体装置２２を得る。 Thereafter, as necessary, as indicated by broken lines in FIG. 22C, the substrate 21 corresponding to each optical semiconductor element 15 is cut into individual pieces. Thus, the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, and the single sealing layer 6 is obtained.
　そして、この封止シート１の製造方法では、左右方向に互いに間隔を隔て、かつ、前後方向に沿い、粒子を含有する封止層６を形成するので、その後、封止層６を、左右方向に互いに間隔を隔てて配置される光半導体素子１５に対して封止する。そのため、封止層６を有効に利用することができる。その結果、封止層６の歩留まりを向上させて、封止シート１の製造コストを低減することができる。 And in this manufacturing method of the sealing sheet 1, since the sealing layer 6 containing particles is formed at intervals in the left-right direction and along the front-rear direction, the sealing layer 6 is then moved in the left-right direction. Are sealed with respect to the optical semiconductor element 15 arranged at a distance from each other. Therefore, the sealing layer 6 can be used effectively. As a result, the yield of the sealing layer 6 can be improved and the manufacturing cost of the sealing sheet 1 can be reduced.
　また、この封止シート１の製造方法では、封止層形成工程では、封止組成物を前後方向に沿って塗布することによって、封止層６を形成するので、前後方向に沿う封止層６を効率よく形成することができる。 Moreover, in the manufacturing method of this sealing sheet 1, in a sealing layer formation process, since the sealing layer 6 is formed by apply | coating a sealing composition along the front-back direction, the sealing layer along the front-back direction 6 can be formed efficiently.
　さらに、この方法では、封止組成物を前後方向に沿って塗布する封止層形成工程の後に、封止層６が前後方向において複数分割されるように封止層６を切断する切断工程を実施するので、前後方向における封止層６の歩留まりを向上させて、封止シート１の製造コストを低減することができる。 Further, in this method, after the sealing layer forming step of applying the sealing composition along the front-rear direction, a cutting step of cutting the sealing layer 6 so that the sealing layer 6 is divided into a plurality of portions in the front-rear direction. Since it implements, the yield of the sealing layer 6 in the front-back direction can be improved and the manufacturing cost of the sealing sheet 1 can be reduced.
　この封止シート１の製造方法では、粒子が、蛍光体を含有すれば、蛍光体を含有する粒子の歩留まりを向上させることができる。 In the method for manufacturing the encapsulating sheet 1, if the particles contain a phosphor, the yield of the particles containing the phosphor can be improved.
　　＜第４実施形態の変形例＞
　図２３Ａに示すように、上記した切断工程（図２１Ｃ参照）に先立ち、図２１Ｂで示される封止層６を所定形状に切断することもできる。詳しくは、封止層６を、基材シート３１を切断しないように、略円形状に切断する。具体的には、円盤状のダイシングソー（ダイシングブレード）を用いるダイシング装置、カッターを用いるカッティング装置、レーザー照射装置、トムソン刃を用いるトムソン刃切断機などが用いられる。 <Modification of Fourth Embodiment>
As shown in FIG. 23A, prior to the above-described cutting step (see FIG. 21C), the sealing layer 6 shown in FIG. 21B can be cut into a predetermined shape. Specifically, the sealing layer 6 is cut into a substantially circular shape so as not to cut the base sheet 31. Specifically, a dicing apparatus using a disk-shaped dicing saw (dicing blade), a cutting apparatus using a cutter, a laser irradiation apparatus, a Thomson blade cutting machine using a Thomson blade, and the like are used.
　これによって、封止層６からなる略円形状の封止領域１６が構成される。 Thereby, a substantially circular sealing region 16 composed of the sealing layer 6 is formed.
　続いて、図２３Ｂに示すように、封止領域１６の外側の封止層６を除去する。 Subsequently, as shown in FIG. 23B, the sealing layer 6 outside the sealing region 16 is removed.
　これによって、基材シート３１の上面に形成される封止領域１６を備える封止シート１を得る。 Thereby, the sealing sheet 1 including the sealing region 16 formed on the upper surface of the base sheet 31 is obtained.
　その後、図２３Ｃに示すように、切断工程を実施する。 Thereafter, as shown in FIG. 23C, a cutting process is performed.
　　＜第５実施形態＞
　本発明の封止シートおよびその製造方法の第５実施形態を、図２４～図２６を参照して説明する。 <Fifth Embodiment>
A fifth embodiment of the sealing sheet and the manufacturing method thereof of the present invention will be described with reference to FIGS.
　図２４～図２６において、第４実施形態と同様の部材および工程については、同一の参照符号を付し、その詳細な説明を省略する。 24 to 26, the same members and steps as those in the fourth embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
　第４実施形態では、図２１Ｂに示すように、封止シート１において、基材シート３１の上に、封止層６のみを設けているが、例えば、図２４Ｃに示すように、蛍光体不含封止層３３をさらに設けることもができる。 In 4th Embodiment, as shown to FIG. 21B, in the sealing sheet 1, only the sealing layer 6 is provided on the base material sheet 31, For example, as shown to FIG. An encapsulating layer 33 can be further provided.
　図２４および図２５に示すように、本発明の第４実施形態である封止シート１の製造方法は、蛍光体不含封止層形成工程（図２４Ａおよび図２４Ｂ参照）、封止層形成工程（図２４Ｃ参照）、切断工程（図２４Ｄ参照）を備える。 As shown in FIGS. 24 and 25, the manufacturing method of the sealing sheet 1 according to the fourth embodiment of the present invention includes a phosphor-free sealing layer forming step (see FIGS. 24A and 24B), and a sealing layer formation. A process (refer FIG. 24C) and a cutting process (refer FIG. 24D) are provided.
　　[蛍光体不含封止層形成工程]
　図２４Ａに示すように、まず、基材シート３１を用意する。 [Phosphor-free sealing layer forming step]
As shown in FIG. 24A, first, a base sheet 31 is prepared.
　次いで、図２４Ｂに示すように、蛍光体不含封止層３３を、基材シート３１の上面に設ける。具体的には、蛍光体を含まない封止組成物から蛍光体不含封止層３３を基材シート３１の上面に形成する。これにより、基材シート３１よりわずかに小さい平面視略矩形状の蛍光体不含封止層３３を形成する。つまり、蛍光体不含封止層３３を、基材シート３１の外周端部を露出するパターンに形成する。 Next, as shown in FIG. 24B, a phosphor-free sealing layer 33 is provided on the upper surface of the base material sheet 31. Specifically, the phosphor-free encapsulating layer 33 is formed on the upper surface of the base material sheet 31 from the encapsulating composition not containing the phosphor. Thereby, the phosphor-free sealing layer 33 having a substantially rectangular shape in plan view that is slightly smaller than the base sheet 31 is formed. That is, the phosphor-free sealing layer 33 is formed in a pattern that exposes the outer peripheral end of the base sheet 31.
　　[封止層形成工程]
　次いで、図２４Ｃに示すように、封止層６を、蛍光体不含封止層３３の上面に形成する。 [Sealing layer forming process]
Next, as illustrated in FIG. 24C, the sealing layer 6 is formed on the upper surface of the phosphor-free sealing layer 33.
　封止層６を形成する封止組成物において、粒子は、好ましくは、蛍光体を含有する。 In the sealing composition for forming the sealing layer 6, the particles preferably contain a phosphor.
　封止層形成工程により、基材シート３１、蛍光体不含封止層３３および封止層６から構成される積層シート３２を得る。 The laminated sheet 32 comprised from the base material sheet 31, the fluorescent substance-free sealing layer 33, and the sealing layer 6 is obtained by the sealing layer forming step.
　　[切断工程]
　切断工程では、積層シート３２が前後方向において複数分割されるように、積層シート３２を切断する。より具体的には、蛍光体不含封止層３３のそれぞれ、および、封止層６のそれぞれが、前後方向に複数分割されるように、蛍光体不含封止層３３および封止層６を基材シート３１とともに切断する。 [Cutting process]
In the cutting step, the laminated sheet 32 is cut so that the laminated sheet 32 is divided into a plurality of parts in the front-rear direction. More specifically, each of the phosphor-free sealing layer 33 and the sealing layer 6 is divided into a plurality of parts in the front-rear direction, so that the phosphor-free sealing layer 33 and the sealing layer 6 are not divided. Is cut together with the base material sheet 31.
　これによって、左右方向に延びる基材シート３１と、基材シート３１の上面において左右方向に連続して形成される蛍光体不含封止層３３と、蛍光体不含封止層３３の上面において、左右方向に互いに間隔を隔てて配置される封止層６とを備える封止シート１を得る。 Accordingly, the base sheet 31 extending in the left-right direction, the phosphor-free sealing layer 33 continuously formed in the left-right direction on the upper surface of the base sheet 31, and the upper surface of the phosphor-free sealing layer 33 And the sealing sheet 1 provided with the sealing layer 6 arrange | positioned at intervals in the left-right direction is obtained.
　次に、図２５Ａ～図２５Ｃを参照して、封止シート１によって、光半導体素子１５を封止する方法を説明する。 Next, a method of sealing the optical semiconductor element 15 with the sealing sheet 1 will be described with reference to FIGS. 25A to 25C.
　この方法では、図２５Ａに示すように、まず、光半導体素子１５が実装された基板２１を用意する。 In this method, as shown in FIG. 25A, first, a substrate 21 on which an optical semiconductor element 15 is mounted is prepared.
　続いて、この方法では、封止シート１を、各封止層６が、厚み方向において光半導体素子１５と対向するように、配置する。 Subsequently, in this method, the sealing sheet 1 is arranged so that each sealing layer 6 faces the optical semiconductor element 15 in the thickness direction.
　この方法では、次いで、図２５Ｂに示すように、封止シート１によって、光半導体素子１５を封止する。具体的には、封止シート１を、基板２１に対して相対的に押し下げる。これによって、複数の封止層６のそれぞれが複数の光半導体素子１５のそれぞれを被覆して封止する。つまり、複数の封止層６のそれぞれが複数の光半導体素子１５のそれぞれを埋設する。また、封止層６から露出する蛍光体不含封止層３３が、複数の封止層６間の隙間を充填する。その後、封止層６および／または蛍光体不含封止層３３が硬化性樹脂を含有する場合には、封止層６および／または蛍光体不含封止層３３をＣステージ化（完全硬化）させる。 In this method, the optical semiconductor element 15 is then sealed with the sealing sheet 1 as shown in FIG. 25B. Specifically, the sealing sheet 1 is pushed down relative to the substrate 21. Thereby, each of the plurality of sealing layers 6 covers and seals each of the plurality of optical semiconductor elements 15. That is, each of the plurality of sealing layers 6 embeds each of the plurality of optical semiconductor elements 15. Further, the phosphor-free sealing layer 33 exposed from the sealing layer 6 fills the gaps between the plurality of sealing layers 6. Thereafter, when the sealing layer 6 and / or the phosphor-free sealing layer 33 contains a curable resin, the sealing layer 6 and / or the phosphor-free sealing layer 33 is made C-staged (completely cured). )
　その後、この方法では、図２５Ｃに示すように、基材シート３１を蛍光体不含封止層３３から引き剥がす。 Thereafter, in this method, as shown in FIG. 25C, the base material sheet 31 is peeled off from the phosphor-free sealing layer 33.
　これによって、基板２１、複数の光半導体素子１５、単数の蛍光体不含封止層３３および複数の封止層６を備える光半導体装置２２を得る。 Thereby, the optical semiconductor device 22 including the substrate 21, the plurality of optical semiconductor elements 15, the single phosphor-free sealing layer 33, and the plurality of sealing layers 6 is obtained.
　その後、必要によって、図２５Ｃの破線で示すように、各光半導体素子１５に対応する基板２１および蛍光体不含封止層３３を切断して個片化する。これによって、基板２１、単数の光半導体素子１５、単数の蛍光体不含封止層３３および単数の封止層６を備える光半導体装置２２を得る。 Thereafter, as necessary, as shown by broken lines in FIG. 25C, the substrate 21 and the phosphor-free sealing layer 33 corresponding to each optical semiconductor element 15 are cut into individual pieces. As a result, the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, the single phosphor-free sealing layer 33, and the single sealing layer 6 is obtained.
　そして、この封止シート１の製造方法では、蛍光体不含封止層３３は、蛍光体を含有しないので、蛍光体不含封止層３３を左右方向に連続するパターで形成しても、蛍光体不含封止層３３を低コストで製造することができる。そのため、かかる蛍光体不含封止層３３を形成し、その蛍光体不含封止層３３に対して封止層６を積層すれば、種々の物性を有する封止シート１を構成することができる。 And in this manufacturing method of the sealing sheet 1, since the phosphor-free sealing layer 33 does not contain a phosphor, even if the phosphor-free sealing layer 33 is formed with a pattern that is continuous in the left-right direction, The phosphor-free sealing layer 33 can be manufactured at a low cost. Therefore, if the phosphor-free sealing layer 33 is formed and the sealing layer 6 is laminated on the phosphor-free sealing layer 33, the sealing sheet 1 having various physical properties can be configured. it can.
　また、この封止シート封止シート１では、蛍光体不含封止層３３と封止層６とによって、種々の物性を有することができる。 Moreover, in this sealing sheet sealing sheet 1, the phosphor-free sealing layer 33 and the sealing layer 6 can have various physical properties.
　　＜第５実施形態の変形例＞
　図２６Ａに示すように、切断工程（図２４Ｄ参照）に先立ち、図２４Ｃで示される封止層６および蛍光体不含封止層３３を所定形状に切断することもできる。詳しくは、封止層６および蛍光体不含封止層３３を、基材シート３１を切断しないように、略円形状に切断する。 <Modification of Fifth Embodiment>
As shown in FIG. 26A, prior to the cutting step (see FIG. 24D), the sealing layer 6 and the phosphor-free sealing layer 33 shown in FIG. 24C can be cut into a predetermined shape. Specifically, the sealing layer 6 and the phosphor-free sealing layer 33 are cut into a substantially circular shape so as not to cut the base sheet 31.
　これによって、封止層６および蛍光体不含封止層３３からなる略円形状の封止領域１６が構成される。 Thereby, a substantially circular sealing region 16 composed of the sealing layer 6 and the phosphor-free sealing layer 33 is formed.
　続いて、図２６Ｂに示すように、封止領域１６の外側の封止層６および蛍光体不含封止層３３を除去する。 Subsequently, as shown in FIG. 26B, the sealing layer 6 outside the sealing region 16 and the phosphor-free sealing layer 33 are removed.
　これによって、基材シート３１の上面に形成される封止領域１６を備える封止シート１を得る。 Thereby, the sealing sheet 1 including the sealing region 16 formed on the upper surface of the base sheet 31 is obtained.
　その後、図２６Ｃに示すように、切断工程を実施する。 Thereafter, as shown in FIG. 26C, a cutting process is performed.
　そして、図２７Ａおよび図２７Ｂに示すように、この封止シート１によって、光半導体素子１５を封止すれば、基板２１、複数の光半導体素子１５、複数の蛍光体不含封止層３３および複数の封止層６を備える光半導体装置２２を得る。 Then, as shown in FIGS. 27A and 27B, if the optical semiconductor element 15 is sealed with the sealing sheet 1, the substrate 21, the plurality of optical semiconductor elements 15, the plurality of phosphor-free sealing layers 33, and An optical semiconductor device 22 including a plurality of sealing layers 6 is obtained.
　その後、必要によって、図２７Ｃの破線で示すように、各光半導体素子１５に対応する基板２１および蛍光体不含封止層３３を切断して個片化する。これによって、基板２１、単数の光半導体素子１５、単数の蛍光体不含封止層３３および単数の封止層６を備える光半導体装置２２を得る。 Thereafter, as necessary, as shown by broken lines in FIG. 27C, the substrate 21 and the phosphor-free sealing layer 33 corresponding to each optical semiconductor element 15 are cut into individual pieces. As a result, the optical semiconductor device 22 including the substrate 21, the single optical semiconductor element 15, the single phosphor-free sealing layer 33, and the single sealing layer 6 is obtained.
　なお、上記説明は、本発明の例示の実施形態として提供したが、これは単なる例示にすぎず、限定的に解釈してはならない。当該技術分野の当業者によって明らかな本発明の変形例は、後記の特許請求の範囲に含まれるものである。 Although the above description has been provided as an exemplary embodiment of the present invention, this is merely an example and should not be interpreted in a limited manner. Modifications of the present invention apparent to those skilled in the art are intended to be included within the scope of the following claims.
　封止シートの製造方法は、封止シートの製造に用いられる。 The manufacturing method of a sealing sheet is used for manufacture of a sealing sheet.
１     封止シート
３     第１基材シート
６     封止層
８     積層シート
１１   封止部材
１４   第２基材シート
１５   光半導体素子
１６   封止領域
３１   基材シート
３３   蛍光体不含封止層 DESCRIPTION OF SYMBOLS 1 Sealing sheet 3 1st base material sheet 6 Sealing layer 8 Laminate sheet 11 Sealing member 14 2nd base material sheet 15 Optical semiconductor element 16 Sealing area 31 Base material sheet 33 Phosphor-free sealing layer

Claims (11)

  1. 　第１方向に互いに間隔を隔てて配置される複数の封止部材を備える封止シートの製造方法であって、
    　前記第１方向に連続するように、粒子を含有する封止層を形成する封止層形成工程、
    　前記封止層形成工程の後に、前記封止層が前記第１方向において複数分割されるように前記封止層を切断して、複数の前記封止部材を形成する切断工程、および、
    　前記切断工程の後に、複数の前記封止部材を、前記第１方向に互いに間隔を隔てるように配置する配置工程
    を備えることを特徴とする、封止シートの製造方法。     A method for producing a sealing sheet comprising a plurality of sealing members arranged at intervals in the first direction,
    A sealing layer forming step of forming a sealing layer containing particles so as to be continuous in the first direction;
    After the sealing layer forming step, cutting the sealing layer so that the sealing layer is divided into a plurality of portions in the first direction to form a plurality of the sealing members, and
    The manufacturing method of the sealing sheet characterized by including the arrangement | positioning process which arrange | positions the said some sealing member so that it may mutually space in the said 1st direction after the said cutting process.
  2. 　前記封止層形成工程では、前記封止層を、前記第１方向に連続する第１基材シートの表面に形成することによって、前記封止層および前記第１基材シートを備える積層シートを形成し、
    　前記切断工程では、前記積層シートが前記第１方向において複数分割されるように、前記積層シートを切断することによって、前記封止層および前記第１基材シートから前記封止部材を形成することを特徴とする、請求項１に記載の封止シートの製造方法。     In the sealing layer forming step, by forming the sealing layer on the surface of the first base sheet continuous in the first direction, a laminated sheet including the sealing layer and the first base sheet Forming,
    In the cutting step, the sealing member is formed from the sealing layer and the first base sheet by cutting the laminated sheet so that the laminated sheet is divided into a plurality of parts in the first direction. The manufacturing method of the sealing sheet of Claim 1 characterized by these.
  3. 　前記配置工程では、複数の前記封止部材を、前記第１方向に連続して形成される第２基材シートの表面に、前記第１方向に互いに間隔を隔てるように配置することを特徴とする、請求項に記載の封止シートの製造方法。 In the arranging step, the plurality of sealing members are arranged on the surface of the second base sheet continuously formed in the first direction so as to be spaced from each other in the first direction. The manufacturing method of the sealing sheet of Claim.
  4. 　粒子が、蛍光体を含有することを特徴とする、請求項１に記載の封止シートの製造方法。 The method for producing a sealing sheet according to claim 1, wherein the particles contain a phosphor.
  5. 　第１方向に互いに間隔を隔て、かつ、前記第１方向に対する交差する第２方向に沿い、粒子を含有する封止層を形成する封止層形成工程、および、
    　前記封止層が前記第２方向において複数分割されるように前記封止層を切断する切断工程を備えることを特徴とする、封止シートの製造方法。     A sealing layer forming step of forming a sealing layer containing particles along a second direction that is spaced apart from each other in the first direction and intersects the first direction; and
    The manufacturing method of the sealing sheet characterized by including the cutting process which cut | disconnects the said sealing layer so that the said sealing layer may be divided into two or more in the said 2nd direction.
  6. 　前記封止層形成工程では、封止組成物を前記第２方向に沿って塗布することによって、前記封止層を形成することを特徴とする、請求項５に記載の封止シートの製造方法。 In the said sealing layer formation process, the said sealing layer is formed by apply | coating a sealing composition along the said 2nd direction, The manufacturing method of the sealing sheet of Claim 5 characterized by the above-mentioned. .
  7. 　封止対象に対応する封止領域を仕切るように、前記封止層を切断する工程、および、
    　前記封止領域の外側の前記封止層を除去する工程
    をさらに備えることを特徴とする、請求項５に記載の封止シートの製造方法。     Cutting the sealing layer so as to partition the sealing region corresponding to the sealing target; and
    The method for producing a sealing sheet according to claim 5, further comprising a step of removing the sealing layer outside the sealing region.
  8. 　粒子が、蛍光体を含有することを特徴とする、請求項５に記載の封止シートの製造方法。 The method for producing a sealing sheet according to claim 5, wherein the particles contain a phosphor.
  9. 　粒子を含有しない蛍光体不含封止層を前記第１方向に連続して形成する工程をさらに備え、
    　前記封止層形成工程では、前記封止層を、前記蛍光体不含封止層に対して積層し、
    　前記切断工程では、前記蛍光体不含封止層を前記封止層とともに、前記蛍光体不含封止層が前記第２方向において複数分割されるように、切断することを特徴とする、請求項８に記載の封止シートの製造方法。     Further comprising a step of continuously forming a phosphor-free sealing layer containing no particles in the first direction,
    In the sealing layer forming step, the sealing layer is laminated on the phosphor-free sealing layer,
    The cutting step includes cutting the phosphor-free sealing layer together with the sealing layer so that the phosphor-free sealing layer is divided into a plurality of portions in the second direction. Item 9. A method for producing a sealing sheet according to Item 8.
  10. 　第１方向に連続するように形成される第２基材シートと、
    　前記第２基材シートの表面に、前記第１方向に互いに間隔を隔てて配置される複数の封止部材とを備え、
    　複数の前記封止部材は、
    　　前記第２基材シートの表面に積層される第１基材シートと、
    　　前記第１基材シートの表面に積層され、粒子を含有する封止層と
    を備えることを特徴とする、封止シート。     A second substrate sheet formed to be continuous in the first direction;
    A plurality of sealing members disposed on the surface of the second base sheet at intervals in the first direction;
    The plurality of sealing members are
    A first base sheet laminated on the surface of the second base sheet;
    A sealing sheet comprising: a sealing layer laminated on a surface of the first base sheet and containing particles.
  11. 　第１方向に連続する基材シートと、
    　前記第１方向に互いに間隔を隔てて配置される複数の封止部材とを備え、
    　複数の前記封止部材は、
    　　前記基材シートの表面に積層される蛍光体不含封止層と、
    　前記蛍光体不含封止層の表面に積層される粒子を含有する封止層と
    を備えることを特徴とする、封止シート。     A base sheet continuous in the first direction;
    A plurality of sealing members disposed at intervals in the first direction,
    The plurality of sealing members are
    A phosphor-free sealing layer laminated on the surface of the base sheet;
    A sealing sheet comprising a sealing layer containing particles laminated on the surface of the phosphor-free sealing layer.
PCT/JP2014/052697 2013-05-24 2014-02-05 Sealing sheet and method for manufacturing same WO2014188742A1 (en)

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