TWI483830B - A method for manufacturing a resin sheet for packaging - Google Patents
A method for manufacturing a resin sheet for packaging Download PDFInfo
- Publication number
- TWI483830B TWI483830B TW102107366A TW102107366A TWI483830B TW I483830 B TWI483830 B TW I483830B TW 102107366 A TW102107366 A TW 102107366A TW 102107366 A TW102107366 A TW 102107366A TW I483830 B TWI483830 B TW I483830B
- Authority
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- Taiwan
- Prior art keywords
- resin
- resin sheet
- pressing
- resin body
- encapsulation
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims description 174
- 239000011347 resin Substances 0.000 title claims description 174
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 238000004806 packaging method and process Methods 0.000 title description 18
- 238000000034 method Methods 0.000 title description 5
- 238000003825 pressing Methods 0.000 claims description 93
- 238000005538 encapsulation Methods 0.000 claims description 37
- 230000001681 protective effect Effects 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 description 9
- 239000011342 resin composition Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
本發明係關於一種用於對搭載於基板上之複數個電子零件進行絕緣封裝之封裝用樹脂片材之製造方法。The present invention relates to a method for producing a resin sheet for encapsulation for insulating and encapsulating a plurality of electronic components mounted on a substrate.
於基板上搭載有複數個電子零件之電子零件模組為了保護電子零件免受濕氣、外部接觸等之影響,而以覆蓋基板及電子零件之方式形成有封裝樹脂層。該封裝樹脂層係藉由在搭載有電子零件之基板上載置半硬化狀態(B階段)之封裝用樹脂片材,並對載置之封裝用樹脂片材進行加熱及按壓而形成。An electronic component module in which a plurality of electronic components are mounted on a substrate is formed with an encapsulating resin layer so as to cover the substrate and the electronic component in order to protect the electronic component from moisture and external contact. The encapsulating resin layer is formed by placing a resin sheet for encapsulation in a semi-hardened state (B stage) on a substrate on which an electronic component is mounted, and heating and pressing the resin sheet for encapsulation placed thereon.
圖10(A)至圖10(C)係表示使用封裝用樹脂片材205製造電子零件模組200之一般例之圖。如圖10(A)所示,於電路基板201上形成有電路圖案202,於電路圖案202上經由導電性接著劑203而搭載有電子零件204。10(A) to 10(C) are views showing a general example of manufacturing the electronic component module 200 using the resin sheet for packaging 205. As shown in FIG. 10(A), a circuit pattern 202 is formed on the circuit board 201, and the electronic component 204 is mounted on the circuit pattern 202 via the conductive adhesive 203.
如圖10(B)所示,於搭載有電子零件204之電路基板201之上方配置封裝用樹脂片材205。其後,利用兩個平板206夾住電路基板201及封裝用樹脂片材205,並對封裝用樹脂片材205進行加熱、按壓。藉此,電子零件204埋設於封裝用樹脂片材205中,且封裝用樹脂片材205藉由加熱而硬化,成為封裝樹脂層209。As shown in FIG. 10(B), the encapsulating resin sheet 205 is placed above the circuit board 201 on which the electronic component 204 is mounted. Then, the circuit board 201 and the encapsulating resin sheet 205 are sandwiched by the two flat plates 206, and the encapsulating resin sheet 205 is heated and pressed. Thereby, the electronic component 204 is embedded in the encapsulating resin sheet 205, and the encapsulating resin sheet 205 is cured by heating to form the encapsulating resin layer 209.
圖10(C)所示者係藉由上述之過程而製作之電子零件模組200,電子零件204及電路基板201係由硬化之封裝樹脂層209覆蓋而封裝。The electronic component module 200 manufactured by the above process is shown in FIG. 10(C), and the electronic component 204 and the circuit board 201 are covered by the cured encapsulating resin layer 209 and packaged.
至此為止係電子零件模組200之製造過程之說明。以下,對電子 零件模組200之製造過程中所使用之封裝用樹脂片材205之製造方法進行說明。The description of the manufacturing process of the electronic component module 200 has been made so far. Following, on electronics A method of manufacturing the encapsulating resin sheet 205 used in the manufacturing process of the part module 200 will be described.
上述封裝用樹脂片材205之製造方法例如記載於專利文獻1(日本專利特開2009-29930號公報)中。根據專利文獻1,利用圖11所示之塗佈裝置101將液狀之樹脂組合物102塗佈於支持膜103之上表面上,將自脫模膜輥104陸續送出之脫模膜105重疊於樹脂組合物102之上表面,並利用按壓輥106按壓樹脂組合物102,藉此製造封裝用樹脂片材205。The method of producing the resin sheet 205 for encapsulation is described in, for example, Patent Document 1 (Japanese Patent Laid-Open Publication No. 2009-29930). According to Patent Document 1, the liquid resin composition 102 is applied onto the upper surface of the support film 103 by the coating device 101 shown in Fig. 11, and the release film 105 which is successively fed from the release film roll 104 is superposed on the surface. The upper surface of the resin composition 102 is pressed against the resin composition 102 by the pressing roller 106, whereby the encapsulating resin sheet 205 is produced.
[專利文獻1]日本專利特開2009-29930號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-29930
然而,於專利文獻1所記載之封裝用樹脂片材205之製造方法中,由於必需塗佈裝置101、脫模膜輥104、按壓輥106等昂貴之設備,故而有封裝用樹脂片材205之製造成本變高之問題。However, in the method of manufacturing the encapsulating resin sheet 205 described in Patent Document 1, since the expensive equipment such as the coating device 101, the release film roll 104, and the pressing roller 106 is required, the resin sheet for encapsulation 205 is used. The problem of higher manufacturing costs.
又,於如專利文獻1所記載般在支持膜103之上表面塗佈液狀之樹脂組合物102之方法中,由於液狀之樹脂組合物102濡濕擴散,故而難以製造厚度較大之封裝用樹脂片材205。Further, in the method of applying the liquid resin composition 102 to the upper surface of the support film 103 as described in Patent Document 1, since the liquid resin composition 102 is wet-diffused, it is difficult to manufacture a package having a large thickness. Resin sheet 205.
進而,於如專利文獻1所記載般在支持膜103之上表面塗佈液狀之樹脂組合物102並重疊脫模膜105之製造方法中,有於塗佈時在樹脂組合物102之內部夾帶氣泡,並將該氣泡封入支持膜103與脫模膜105之間的情況。就耐濕性、外部遮斷性之觀點而言,較理想為電子零件模組200之封裝樹脂層209中未混入氣泡。為此,較理想為於電子零件模組200之製造過程中所使用封裝用樹脂片材205中氣泡之混入亦較少,但利用專利文獻1所記載之製造方法有氣泡殘留於樹脂組合物102 之內部之情況。Further, in the method for producing a liquid resin composition 102 on the surface of the support film 103 and superimposing the release film 105 as described in Patent Document 1, the resin composition 102 is entrained at the time of coating. Air bubbles are sealed between the support film 103 and the release film 105. From the viewpoint of moisture resistance and external barrier properties, it is preferable that bubbles are not mixed in the encapsulating resin layer 209 of the electronic component module 200. For this reason, it is preferable that the resin sheet 205 for encapsulation used in the manufacturing process of the electronic component module 200 has a small amount of air bubbles. However, in the manufacturing method described in Patent Document 1, air bubbles remain in the resin composition 102. The internal situation.
本發明所欲解決之課題在於減少與上述封裝用樹脂片材205之製造方法有關之問題。The problem to be solved by the present invention is to reduce the problems associated with the above-described method of manufacturing the resin sheet for encapsulation 205.
本發明係一種封裝用樹脂片材之製造方法,其係用以對搭載於基板上之複數個電子零件進行絕緣封裝之封裝用樹脂片材之製造方法,且包括如下步驟:樹脂體配置步驟,其將成為封裝用樹脂片材之材料之半硬化狀態之樹脂體配置於由相對向之一對按壓板與設置於按壓板之外周側之側板所圍成之空間內;及延伸步驟,其將所圍成之空間內抽成真空,並以低於樹脂體之硬化溫度之溫度加熱樹脂體,且藉由按壓板以0.004 mm/秒以上且0.06 mm/秒以下之按壓速度對樹脂體進行按壓而使其延伸。The present invention relates to a method for producing a resin sheet for encapsulation, which is a method for producing a resin sheet for encapsulation which insulates a plurality of electronic components mounted on a substrate, and includes the following steps: a resin body disposing step, The resin body in a semi-hardened state in which the material of the resin sheet for encapsulation is disposed is disposed in a space surrounded by the pair of pressing plates and the side plates provided on the outer peripheral side of the pressing plate; and an extending step of which The vacuum is formed in the enclosed space, and the resin body is heated at a temperature lower than the hardening temperature of the resin body, and the resin body is pressed by the pressing plate at a pressing speed of 0.004 mm/sec or more and 0.06 mm/sec or less. And let it extend.
較佳為於樹脂體配置步驟中,在樹脂體與按壓板之間插入經實施脫模處理之保護膜,且於延伸步驟中,對樹脂體進行按壓而使其於保護膜上延伸。Preferably, in the resin body disposing step, a protective film subjected to a release treatment is inserted between the resin body and the pressing plate, and in the extending step, the resin body is pressed to extend over the protective film.
或者較佳為對按壓板實施有脫模處理,且於延伸步驟中,對樹脂體進行按壓而使其於按壓板之面方向上延伸。Alternatively, it is preferable to perform a mold release treatment on the pressing plate, and in the extending step, the resin body is pressed to extend in the direction of the surface of the pressing plate.
根據本發明,可無需昂貴之設備而廉價地製造膜厚較大之封裝用樹脂片材。又,可抑制封裝用樹脂片材之內部之氣泡之殘留。According to the present invention, it is possible to inexpensively manufacture a resin sheet for encapsulation having a large film thickness without expensive equipment. Moreover, the residual of the bubble inside the resin sheet for encapsulation can be suppressed.
11、205‧‧‧封裝用樹脂片材11, 205‧‧‧Packaging resin sheet
12‧‧‧保護膜12‧‧‧Protective film
20‧‧‧模具20‧‧‧Mold
21‧‧‧液狀樹脂21‧‧‧Liquid resin
22‧‧‧樹脂體22‧‧‧ resin body
23、25‧‧‧按壓板23, 25‧‧‧ Press plate
24‧‧‧側板24‧‧‧ side panels
26‧‧‧空間26‧‧‧ Space
30‧‧‧按壓裝置30‧‧‧ Pressing device
31‧‧‧受壓板31‧‧‧ under pressure plate
32‧‧‧加壓板32‧‧‧ Pressurized plate
33‧‧‧加熱器33‧‧‧heater
34‧‧‧加壓伺服機構34‧‧‧Pressure servo
35‧‧‧基座板35‧‧‧Base plate
36‧‧‧頂板36‧‧‧ top board
37‧‧‧支柱37‧‧‧ pillar
38‧‧‧真空機構38‧‧‧vacuum mechanism
101‧‧‧塗佈裝置101‧‧‧ Coating device
102‧‧‧樹脂組合物102‧‧‧Resin composition
103‧‧‧支持膜103‧‧‧Support film
104‧‧‧脫模膜輥104‧‧‧ release film roll
105‧‧‧脫模膜105‧‧‧ release film
106‧‧‧按壓輥106‧‧‧Press roller
200‧‧‧電子零件模組200‧‧‧Electronic parts module
201‧‧‧電路基板201‧‧‧ circuit board
202‧‧‧電路圖案202‧‧‧ circuit pattern
203‧‧‧導電性接著劑203‧‧‧Electrical adhesive
204‧‧‧電子零件204‧‧‧Electronic parts
206‧‧‧平板206‧‧‧ tablet
209‧‧‧封裝樹脂層209‧‧‧Encapsulated resin layer
b‧‧‧氣泡B‧‧‧ bubble
e‧‧‧箭頭E‧‧‧arrow
w‧‧‧旋渦W‧‧‧ vortex
圖1係自正面觀察封裝用樹脂片材11之剖面圖。Fig. 1 is a cross-sectional view of the resin sheet 11 for encapsulation viewed from the front.
圖2(A)-(E)係依序表示本發明之第1實施形態之封裝用樹脂片材11之製造步驟之圖。2(A) to 2(E) are diagrams showing the steps of manufacturing the encapsulating resin sheet 11 according to the first embodiment of the present invention.
圖3係圖2(C)中所表示之步驟中之按壓裝置30之概略圖。Fig. 3 is a schematic view of the pressing device 30 in the step shown in Fig. 2(C).
圖4係表示按壓時之按壓速度與封裝用樹脂片材11中確認到之氣 泡數之關係之圖。Fig. 4 is a view showing the pressing speed at the time of pressing and the gas confirmed in the resin sheet 11 for packaging. A diagram of the relationship between the number of bubbles.
圖5(A)-(E)係改變按壓板時之按壓速度之情形之封裝用樹脂片材11之表面之照片。5(A) to (E) are photographs showing the surface of the encapsulating resin sheet 11 in the case where the pressing speed at the time of pressing the sheet is changed.
圖6(A)、(B)係說明延伸樹脂體22時之樹脂體22之外周附近之情況之圖。6(A) and 6(B) are views showing the vicinity of the outer periphery of the resin body 22 when the resin body 22 is stretched.
圖7係表示封裝用樹脂片材11之樹脂黏度與厚度不均之關係之圖。Fig. 7 is a view showing the relationship between the resin viscosity and the thickness unevenness of the resin sheet 11 for packaging.
圖8係表示封裝用樹脂片材11之溫度與黏度之關係之圖。Fig. 8 is a view showing the relationship between the temperature and the viscosity of the resin sheet 11 for encapsulation.
圖9(A)-(E)係依序表示本發明之第2實施形態之封裝用樹脂片材11之製造步驟之圖。9(A) to 9(E) are diagrams showing the steps of manufacturing the encapsulating resin sheet 11 according to the second embodiment of the present invention.
圖10(A)-(C)係表示使用封裝用樹脂片材205製造電子零件模組200之一般例之圖。10(A) to 10(C) are views showing a general example of manufacturing the electronic component module 200 using the resin sheet for packaging 205.
圖11係表示先前技術中之封裝用樹脂片材205之製造方法之圖。Fig. 11 is a view showing a method of manufacturing the encapsulating resin sheet 205 of the prior art.
於在基板上搭載有複數個電子零件之電子零件模組中,為了對電子零件進行絕緣封裝而使用封裝用樹脂片材。如圖1所示,封裝用樹脂片材11呈平板形狀,厚度為0.1 mm~3.5 mm。封裝用樹脂片材11之材料為絕緣樹脂(例如環氧樹脂),為了提高機械強度而於絕緣樹脂中含有例如二氧化矽或氧化鋁作為填料。In an electronic component module in which a plurality of electronic components are mounted on a substrate, a resin sheet for encapsulation is used for insulating and encapsulating the electronic components. As shown in Fig. 1, the resin sheet for encapsulation 11 has a flat plate shape and has a thickness of 0.1 mm to 3.5 mm. The material of the resin sheet for encapsulation 11 is an insulating resin (for example, an epoxy resin), and for example, ceria or alumina is contained as a filler in the insulating resin in order to improve mechanical strength.
為了保護封裝用樹脂片材11之表面而於封裝用樹脂片材11之兩個主面安裝有保護膜12。保護膜12之材料例如為PET(polyethylene terephthalate,聚對苯二甲酸乙二酯)、PTFE(polytetrafluoroethylene,聚四氟乙烯)等。於保護膜12之表面實施有利用聚矽氧樹脂等之脫模處理,於在電子零件模組之製造過程中使用封裝用樹脂片材11之情形時,係剝離保護膜12而使用。The protective film 12 is attached to the two main surfaces of the encapsulating resin sheet 11 in order to protect the surface of the encapsulating resin sheet 11. The material of the protective film 12 is, for example, PET (polyethylene terephthalate) or PTFE (polytetrafluoroethylene). In the case where the resin sheet 11 for encapsulation is used in the manufacturing process of the electronic component module, the release film 12 is peeled off from the surface of the protective film 12, and the protective film 12 is peeled off.
參照圖2(A)至圖2(E)及圖3,對封裝用樹脂片材11之製造方法進行說明。A method of manufacturing the encapsulating resin sheet 11 will be described with reference to Figs. 2(A) to 2(E) and Fig. 3 .
如圖2(A)所示,準備有底之圓筒形之模具20,將液狀樹脂21倒入模具20中,利用熱處理使其成為半硬化狀態而製作樹脂體22。As shown in Fig. 2(A), a bottomed cylindrical mold 20 is prepared, and the liquid resin 21 is poured into the mold 20, and the resin body 22 is produced in a semi-hardened state by heat treatment.
樹脂體22係含有填料之絕緣樹脂,且係成為封裝用樹脂片材11之材料者。所謂半硬化狀態係指硬化反應之中間階段之狀態,亦稱為B階段。為了使液狀樹脂21成為半硬化狀態,於環氧樹脂之情形時,藉由40℃~160℃之溫度於烘箱中進行5分鐘~120分鐘加熱處理。The resin body 22 is an insulating resin containing a filler and is a material of the resin sheet 11 for encapsulation. The semi-hardened state refers to the state of the intermediate stage of the hardening reaction, which is also referred to as the B stage. In order to make the liquid resin 21 semi-hardened, in the case of an epoxy resin, heat treatment is performed in an oven at a temperature of 40 ° C to 160 ° C for 5 minutes to 120 minutes.
樹脂體22可使用在溫度60℃下為120 Pa.s~1800 Pa.s之黏度者。此時之黏度係使用TA Instruments公司製造之AR550於工具尺寸8 mm、測定厚度550 μm、頻率1 Hz、應變0.1%之條件下測定之值。The resin body 22 can be used at a temperature of 60 ° C of 120 Pa. S~1800 Pa. s viscosity. The viscosity at this time is the AR550 manufactured by TA Instruments. The value measured under conditions of 8 mm, thickness 550 μm, frequency 1 Hz, strain 0.1%.
如圖2(B)所示,準備用以將封裝用樹脂片材11成形之下側之按壓板23,於按壓板23之主面之外周側配置側板24。側板24可為殼體,亦可以形成環狀之方式配置複數個板材。同時,於按壓板23之主面且由側板24圍成之區域內配置保護膜12,進而將圖2(A)之步驟中製作之樹脂體22配置於保護膜12上之中央。As shown in FIG. 2(B), the pressing plate 23 for molding the resin sheet 11 for packaging is formed, and the side plate 24 is disposed on the outer peripheral side of the main surface of the pressing plate 23. The side panels 24 may be shells or a plurality of panels may be formed in an annular manner. At the same time, the protective film 12 is placed in the region surrounded by the side plate 24 on the main surface of the pressing plate 23, and the resin body 22 produced in the step of FIG. 2(A) is placed on the center of the protective film 12.
按壓板23、側板24只要為即便按壓亦可維持形狀之材質即可,例如可使用不鏽鋼或鋁。側板24係用以決定成形之封裝用樹脂片材11之厚度之構件,亦考慮保護膜12之厚度而設定。於保護膜12之厚度為0.05 mm之情形時,亦可採用側板24之厚度為0.2 mm~3.6 mm之範圍內者。The pressing plate 23 and the side plate 24 may be any material that can maintain a shape even when pressed, and for example, stainless steel or aluminum can be used. The side plate 24 is a member for determining the thickness of the formed resin sheet 11 for packaging, and is also set in consideration of the thickness of the protective film 12. When the thickness of the protective film 12 is 0.05 mm, the thickness of the side plate 24 may be in the range of 0.2 mm to 3.6 mm.
如圖2(C)所示,以與圖2(B)之步驟中配置之保護膜12及按壓板23相對向之方式,於樹脂體22之上方依序配置另一保護膜12及上側之按壓板25。藉此,成為樹脂體22配置於由相對向之一對按壓板23、25與設置於側方之側板24所圍成之空間26內之狀態。As shown in FIG. 2(C), another protective film 12 and the upper side are sequentially disposed above the resin body 22 so as to face the protective film 12 and the pressing plate 23 disposed in the step of FIG. 2(B). The plate 25 is pressed. Thereby, the resin body 22 is placed in a state in which the pair of pressing plates 23 and 25 are opposed to each other and the space 26 provided in the side plate 24 on the side.
此處,對封裝用樹脂片材11之製造步驟中所使用之按壓裝置進行 說明。圖3係圖2(C)中所示之步驟中之按壓裝置30之概略圖。如圖3所示,樹脂體22及保護膜12係配置於由一對按壓板23、25與設置於側方之側板24所圍之空間26內。於該狀態下藉由按壓裝置30使空間26內減壓而對樹脂體22進行加熱、按壓。Here, the pressing device used in the manufacturing steps of the encapsulating resin sheet 11 is performed. Description. Figure 3 is a schematic view of the pressing device 30 in the step shown in Figure 2(C). As shown in FIG. 3, the resin body 22 and the protective film 12 are disposed in the space 26 surrounded by the pair of pressing plates 23 and 25 and the side plates 24 provided on the side. In this state, the resin body 22 is heated and pressed by depressurizing the space 26 by the pressing device 30.
於按壓板25之上側設置有加壓板32,於按壓板23之下側設置有受壓板31。加壓板32及受壓板31中分別內置有加熱器33。藉由該加熱器33而經由按壓板23、25加熱樹脂體22。A pressure plate 32 is provided on the upper side of the pressing plate 25, and a pressure receiving plate 31 is provided on the lower side of the pressing plate 23. A heater 33 is built in each of the pressure plate 32 and the pressure receiving plate 31. The resin body 22 is heated by the heaters 33 via the pressing plates 23 and 25.
又,以包圍加壓板32及受壓板31之方式設置真空機構38。真空機構38係藉由未圖示之真空源而抽成真空。於側板24上在水平方向開有未圖示之貫通孔,通過該貫通孔,空間26內亦被抽成真空而成為減壓狀態。Further, a vacuum mechanism 38 is provided to surround the pressure plate 32 and the pressure receiving plate 31. The vacuum mechanism 38 is evacuated by a vacuum source (not shown). A through hole (not shown) is opened in the horizontal direction on the side plate 24, and the space 26 is also evacuated by the through hole to be in a reduced pressure state.
於加壓板32之上側連接有加壓伺服機構34之驅動軸。藉由使加壓伺服機構34之驅動軸下降而按壓加壓板32及按壓板25,結果樹脂體22受到按壓。再者,加壓伺服機構34係設置於頂板36之中央,頂板36係固定於立於下方之基座35之支柱37上。A drive shaft of the pressurizing servo mechanism 34 is connected to the upper side of the pressure plate 32. When the pressure plate 32 and the pressing plate 25 are pressed by lowering the drive shaft of the pressurizing servo mechanism 34, the resin body 22 is pressed. Further, the pressurizing servo mechanism 34 is disposed at the center of the top plate 36, and the top plate 36 is fixed to the pillar 37 of the base 35 standing below.
此處再次參照圖2對封裝用樹脂片材11之製造方法進行說明。使用上述按壓裝置30,如圖2(D)所示,使一對按壓板23、25於相互靠近之方向上移動。藉此,位於按壓板23、25之間之樹脂體22沿保護膜12之面方向延伸而使封裝用樹脂片材11成形。Here, a method of manufacturing the encapsulating resin sheet 11 will be described with reference to FIG. 2 again. Using the above-described pressing device 30, as shown in Fig. 2(D), the pair of pressing plates 23, 25 are moved in the direction in which they approach each other. Thereby, the resin body 22 located between the pressing plates 23 and 25 extends in the surface direction of the protective film 12, and the resin sheet 11 for encapsulation is formed.
樹脂體22延伸時之加熱溫度為低於樹脂體22之硬化溫度之溫度(例如40℃~160℃)。由一對按壓板23、25與側板24圍成之空間26內之由減壓所形成之壓力為5000 Pa以下。由按壓板23、25產生之按壓速度為0.004 mm/秒以上且0.06 mm/秒以下。於下文敍述將按壓速度設定於該範圍內之原因。The heating temperature at which the resin body 22 is extended is a temperature lower than the curing temperature of the resin body 22 (for example, 40 ° C to 160 ° C). The pressure formed by the pressure reduction in the space 26 surrounded by the pair of pressing plates 23, 25 and the side plates 24 is 5000 Pa or less. The pressing speed generated by the pressing plates 23 and 25 is 0.004 mm/sec or more and 0.06 mm/sec or less. The reason why the pressing speed is set within this range is described below.
藉由圖2(D)中所示之步驟之樹脂體22之延伸,底面積706.5 mm2 ~1962.5 mm2 、高度5 mm~30 mm之樹脂體22成形為面積16900 mm2 、厚度0.1mm~3.5mm之封裝用樹脂片材11。第1實施形態較佳為應用於該範圍內。The resin body 22 having a bottom area of 706.5 mm 2 to 1962.5 mm 2 and a height of 5 mm to 30 mm is formed into an area of 16900 mm 2 and a thickness of 0.1 mm by the extension of the resin body 22 of the step shown in Fig. 2(D). A resin sheet 11 for packaging of 3.5 mm. The first embodiment is preferably applied to this range.
圖2(D)中所示之步驟後,解除由按壓板23、25產生之按壓力,並且將按壓板23、25及側板24所圍成之空間26進行大氣開放。藉此,製作如圖2(E)所示之雙面附有保護膜12之封裝用樹脂片材11。After the step shown in Fig. 2(D), the pressing force generated by the pressing plates 23, 25 is released, and the space 26 surrounded by the pressing plates 23, 25 and the side plates 24 is opened to the atmosphere. Thereby, the encapsulating resin sheet 11 with the protective film 12 on both sides as shown in FIG. 2(E) was produced.
於圖2(D)之步驟中,將樹脂體22一面加熱一面延伸,其加熱溫度為低於樹脂體22之硬化溫度之溫度,成形之封裝用樹脂片材11亦保持半硬化狀態。因此,於使用封裝用樹脂片材11之電子零件模組200之製造過程(參照圖10)中,可將電子零件埋設於封裝用樹脂片材11中並進行封裝。In the step of Fig. 2(D), the resin body 22 is heated while being heated, and the heating temperature is lower than the curing temperature of the resin body 22, and the formed resin sheet 11 for packaging is also semi-hardened. Therefore, in the manufacturing process (see FIG. 10) of the electronic component module 200 using the encapsulating resin sheet 11, the electronic component can be embedded in the encapsulating resin sheet 11 and packaged.
樹脂體22雖然多少會於夾帶氣泡之狀態下延伸,但由於此時空間26內被抽成真空,故而可使向外散出之力作用於夾帶之氣泡而有效地去除氣泡。Although the resin body 22 is somewhat extended in a state in which air bubbles are entrained, since the space 26 is evacuated at this time, the force radiated outward can be applied to the entrained air bubbles to effectively remove the air bubbles.
樹脂體22延伸時之由按壓板23、25產生之按壓速度為0.004mm/秒以上且0.06mm/秒以下。該按壓速度係藉由加壓伺服機構34而正確地設定。藉由將按壓速度設定為該範圍內,可減少殘留於封裝用樹脂片材11中之氣泡。When the resin body 22 is extended, the pressing speed by the pressing plates 23 and 25 is 0.004 mm/sec or more and 0.06 mm/sec or less. This pressing speed is correctly set by the pressurizing servo mechanism 34. By setting the pressing speed within this range, the air bubbles remaining in the encapsulating resin sheet 11 can be reduced.
圖4係表示按壓板23、25對樹脂體22之相對按壓速度與封裝用樹脂片材11中確認到之氣泡數之關係之圖。封裝用樹脂片材11大致係藉由上述製造方法而製作。氣泡係藉由將製作後之封裝用樹脂片材11置於加熱減壓環境下(例如溫度100℃、壓力200Pa)使氣泡表面化而測定。氣泡數係存在於100mm2 封裝用樹脂片材11中之直徑0.1mm以上之大小之氣泡數。樣品數n=10。如圖4所示,於按壓速度為0.09mm/秒以上之情形時,氣泡數平均為4個以上,與此相對,於按壓速度為0.06mm/秒以下之情形時,氣泡穩定變少。4 is a view showing the relationship between the relative pressing speed of the pressing plates 23 and 25 with respect to the resin body 22 and the number of bubbles confirmed in the encapsulating resin sheet 11. The resin sheet for encapsulation 11 is roughly produced by the above-described production method. The bubble is measured by subjecting the produced resin sheet 11 for packaging to a surface in a heated reduced pressure atmosphere (for example, a temperature of 100 ° C and a pressure of 200 Pa) to surface the bubbles. The number of bubbles is the number of bubbles having a diameter of 0.1 mm or more in the resin sheet 11 for encapsulation of 100 mm 2 . The number of samples is n=10. As shown in FIG. 4, when the pressing speed is 0.09 mm/sec or more, the number of air bubbles is four or more on average, and when the pressing speed is 0.06 mm/sec or less, the bubble stability is reduced.
圖5(A)至圖5(E)係表示改變按壓速度之情形之封裝用樹脂片材11 之表面之照片。各照片之面積為10000 mm2 。照片係將製作後之封裝用樹脂片材11置於加熱減壓環境下(例如溫度100℃、壓力200 Pa)並使氣泡表面化之圖。於按壓速度為0.45 mm/秒、0.225 mm/秒之情形時,於表面可視認大量之氣泡,於按壓速度為0.06 mm/秒、0.009 mm/秒、0.0004 mm/秒之情形時,氣泡數減少。5(A) to 5(E) are photographs showing the surface of the encapsulating resin sheet 11 in the case where the pressing speed is changed. The area of each photo is 10000 mm 2 . The photograph is a diagram in which the resin sheet 11 for encapsulation after production is placed in a heated decompression environment (for example, a temperature of 100 ° C and a pressure of 200 Pa) to surface the bubbles. When the pressing speed is 0.45 mm/sec and 0.225 mm/sec, a large number of bubbles are visible on the surface, and the number of bubbles is reduced at a pressing speed of 0.06 mm/sec, 0.009 mm/sec, 0.0004 mm/sec. .
根據該等情況可知,若將由按壓板23、25產生之按壓速度設定於0.004 mm/秒以上且0.06 mm/秒以下之範圍內,則可減少殘留於封裝用樹脂片材11中之氣泡數。再者,作為按壓速度之下限值之0.004 mm/秒係設定為加壓伺服機構34可穩定地輸出按壓力之按壓速度。According to these facts, when the pressing speed by the pressing plates 23 and 25 is set to be in the range of 0.004 mm/sec or more and 0.06 mm/sec or less, the number of bubbles remaining in the encapsulating resin sheet 11 can be reduced. Further, 0.004 mm/sec which is the lower limit of the pressing speed is set so that the pressing servo mechanism 34 can stably output the pressing speed of the pressing force.
參照圖6,說明樹脂體22延伸時之樹脂體22之外周附近之情況。圖6(A)係表示按壓速度為0.45 mm/秒之情形之圖,圖6(B)係表示按壓速度為0.06 mm/秒之情形之圖。The vicinity of the outer periphery of the resin body 22 when the resin body 22 is extended will be described with reference to Fig. 6 . Fig. 6(A) is a view showing a case where the pressing speed is 0.45 mm/sec, and Fig. 6(B) is a view showing a case where the pressing speed is 0.06 mm/sec.
如圖6(A)及圖6(B)所示,於樹脂體22在箭頭e方向上延伸時,在位於保護膜12之界面附近之樹脂體22之內部產生旋渦w。圖6(A)中,由於按壓速度較大,故而未於樹脂體22之外周而於稍靠內產生旋渦w。因此,樹脂體22之外周附近之氣體夾帶於旋渦w中而成為氣泡b,氣泡b殘留於樹脂體22之內部。與此相對,於圖6(B)中,由於按壓速度較小,故而於樹脂體22之外周產生旋渦w。因此,於樹脂體22之外周附近被夾帶之氣泡b藉由樹脂體22於箭頭e方向之擴散及伴隨於此之旋渦w之移動而被引導至樹脂體22之外周前端。藉由真空機構38(參照圖3)之抽真空而使被引導至外周前端之氣泡b之排出至外部之力起作用,可抑制樹脂體22之內部之氣泡b之殘留。As shown in FIGS. 6(A) and 6(B), when the resin body 22 extends in the direction of the arrow e, a vortex w is generated inside the resin body 22 located in the vicinity of the interface of the protective film 12. In FIG. 6(A), since the pressing speed is large, the vortex w is generated slightly inside the outer periphery of the resin body 22. Therefore, the gas in the vicinity of the outer periphery of the resin body 22 is entrained in the vortex w to become the bubble b, and the bubble b remains inside the resin body 22. On the other hand, in FIG. 6(B), since the pressing speed is small, the vortex w is generated on the outer periphery of the resin body 22. Therefore, the bubble b entrained in the vicinity of the outer periphery of the resin body 22 is guided to the outer peripheral end of the resin body 22 by the diffusion of the resin body 22 in the direction of the arrow e and the movement of the vortex w accompanying this. By the vacuuming of the vacuum mechanism 38 (see FIG. 3), the force of the bubble b guided to the outer peripheral end is discharged to the outside, and the residual of the bubble b inside the resin body 22 can be suppressed.
又,第1實施形態中所使用之保護膜12之表面上實施有脫模處理。由於藉由實施脫模處理而具有降低保護膜12之表面之摩擦力之效果,故而樹脂體22延伸時之滑動性變良好,可減少夾帶氣泡b。進而,保護膜12可於每次製造封裝用樹脂片材11時進行更換,故而無需 考慮脫模處理之劣化,可良好地再現樹脂體22延伸時之滑動狀態。Further, a release treatment is performed on the surface of the protective film 12 used in the first embodiment. Since the effect of reducing the frictional force of the surface of the protective film 12 is performed by performing the mold release treatment, the slidability at the time of extending the resin body 22 is improved, and the entrained air bubbles b can be reduced. Further, the protective film 12 can be replaced every time the resin sheet 11 for packaging is manufactured, so that it is not necessary The sliding state at the time of extension of the resin body 22 can be favorably reproduced in consideration of the deterioration of the mold release treatment.
又,根據第1實施形態,由於只要準備按壓裝置30及特定之模具20即可,故而可不使用昂貴之設備而製造封裝用樹脂片材11。又,若使用按壓裝置30,則可藉由側板24之設定而製造膜厚相對較大之封裝用樹脂片材11。Further, according to the first embodiment, the pressing device 30 and the specific mold 20 can be prepared. Therefore, the resin sheet for packaging 11 can be produced without using expensive equipment. Moreover, when the pressing device 30 is used, the encapsulating resin sheet 11 having a relatively large film thickness can be produced by setting the side plate 24.
製造之封裝用樹脂片材11較佳於溫度60℃下為120Pa.s~1800 Pa.s之黏度。此時之黏度係使用TA Instruments公司製造之AR550於工具尺寸8 mm、測定厚度550 μm、頻率1 Hz、應變0.1%之條件下測定之值。封裝用樹脂片材11之厚度係於封裝用樹脂片材11之兩個主面附有保護膜12之狀態下自其上利用反射型之雷射位移計測定之值。圖7係表示封裝用樹脂片材11之樹脂黏度與厚度不均之關係之圖,封裝用樹脂片材11之樹脂黏度為120 Pa.s~1800 Pa.s時,封裝用樹脂片材11之厚度不均為10 μm以下,與此相對,樹脂黏度為100 Pa.s時,厚度不均為15 μm以上,樹脂黏度為6000 Pa.s時之厚度不均甚至有20 μm以上。再者,封裝用樹脂片材11之厚度不均係3σ之數值,樣品數n=20。The encapsulating resin sheet 11 produced is preferably 120 Pa at a temperature of 60 ° C. S~1800 Pa. s viscosity. The viscosity at this time is the AR550 manufactured by TA Instruments. The value measured under conditions of 8 mm, thickness 550 μm, frequency 1 Hz, strain 0.1%. The thickness of the resin sheet for encapsulation 11 is a value measured by a reflection type laser displacement meter from the state in which the protective film 12 is attached to the two main surfaces of the encapsulating resin sheet 11. Fig. 7 is a view showing the relationship between the resin viscosity and the thickness unevenness of the resin sheet 11 for encapsulation, and the resin sheet 11 for encapsulation has a resin viscosity of 120 Pa. S~1800 Pa. In the case of s, the thickness of the resin sheet 11 for packaging is not more than 10 μm, whereas the resin viscosity is 100 Pa. When s, the thickness is not more than 15 μm, and the resin viscosity is 6000 Pa. The thickness unevenness in s is even more than 20 μm. Further, the thickness unevenness of the encapsulating resin sheet 11 is a value of 3σ, and the number of samples is n=20.
又,圖8係表示封裝用樹脂片材11之溫度與黏度之關係之一例之圖。如圖8所示,若溫度變高,則黏度有降低之傾向,於溫度為60℃時黏度為1800 Pa.s,而於溫度為120℃時黏度為20 Pa.s。藉由提昇溫度而將樹脂之黏度降低至20 Pa.s,可使封裝用樹脂片材11於硬化前流動化而將樹脂材料填充至電子零件與基板之間。Moreover, FIG. 8 is a view showing an example of the relationship between the temperature and the viscosity of the resin sheet 11 for packaging. As shown in Fig. 8, if the temperature becomes higher, the viscosity tends to decrease, and the viscosity is 1800 Pa at a temperature of 60 °C. s, and the viscosity is 20 Pa at a temperature of 120 ° C. s. Reduce the viscosity of the resin to 20 Pa by increasing the temperature. s, the resin sheet for encapsulation 11 can be fluidized before being hardened to fill the resin material between the electronic component and the substrate.
參照圖9(A)至圖9(E),對第2實施形態之封裝用樹脂片材11之製造方法進行說明。第2實施形態係不使用保護膜12(參照圖2)而直接於按壓板23、25之間製造封裝用樹脂片材11之方法。再者,對與第1實施形態共通之構成、製造條件省略詳細之說明。又,按壓過程中所使 用之按壓裝置30與第1實施形態相同故省略說明。A method of manufacturing the encapsulating resin sheet 11 of the second embodiment will be described with reference to FIG. 9(A) to FIG. 9(E). In the second embodiment, a method of manufacturing the resin sheet 11 for encapsulation directly between the pressing plates 23 and 25 without using the protective film 12 (see FIG. 2). In addition, the detailed description of the configuration and manufacturing conditions common to the first embodiment will be omitted. Also, during the pressing process Since the pressing device 30 is the same as that of the first embodiment, the description thereof is omitted.
如圖9(A)所示,準備有底之圓筒形之模具20,將液狀樹脂21倒入模具20中,利用熱處理使其成為半硬化狀態而製作樹脂體22。As shown in Fig. 9(A), a bottomed cylindrical mold 20 is prepared, and the liquid resin 21 is poured into the mold 20, and the resin body 22 is produced in a semi-hardened state by heat treatment.
如圖9(B)所示,準備用以將封裝用樹脂片材11成形之下側之按壓板23,於按壓板23之主面之外周側配置側板24。同時,於按壓板23之主面且由側板24所圍成之區域內之中央,配置圖9(A)之步驟中所製作之樹脂體22。側板24係用以決定成形之封裝用樹脂片材11之厚度之構件。惟於第2實施形態中,由於不使用保護膜12,故而無需考慮保護膜12之厚度。又,於與樹脂體22抵接之按壓板23之面上實施有利用聚矽氧樹脂等之脫模處理。As shown in FIG. 9(B), the pressing plate 23 for molding the resin sheet 11 for packaging is formed, and the side plate 24 is disposed on the outer peripheral side of the main surface of the pressing plate 23. At the same time, the resin body 22 produced in the step of Fig. 9(A) is placed at the center of the main surface of the pressing plate 23 and surrounded by the side plate 24. The side plate 24 is a member for determining the thickness of the formed resin sheet 11 for packaging. However, in the second embodiment, since the protective film 12 is not used, it is not necessary to consider the thickness of the protective film 12. Moreover, a mold release treatment using a polyfluorene resin or the like is performed on the surface of the pressing plate 23 that is in contact with the resin body 22.
如圖9(C)所示,以與圖9(B)中配置之按壓板23相對向之方式於樹脂體22之上方配置上側之按壓板25。藉此,成為將樹脂體22配置於由相對向之一對按壓板23、25與設置於側方之側板24所圍成之空間26內之狀態。再者,於與樹脂體22抵接之按壓板25之面上亦實施有利用聚矽氧樹脂等之脫模處理。As shown in FIG. 9(C), the upper pressing plate 25 is disposed above the resin body 22 so as to face the pressing plate 23 disposed in FIG. 9(B). Thereby, the resin body 22 is placed in a state in which the pair of pressing plates 23 and 25 are opposed to each other and the space 26 provided in the side plate 24 on the side. Further, a release treatment using a polyoxymethylene resin or the like is also performed on the surface of the pressing plate 25 that is in contact with the resin body 22.
如圖9(D)所示,藉由使一對按壓板23、25於相互靠近之方向上移動,而使位於按壓板23、25之間之樹脂體22沿按壓板23、25之面方向延伸,而使封裝用樹脂片材11成形。樹脂體22延伸時,樹脂體22被加熱至低於硬化溫度之溫度。由相對向之一對按壓板23、25與設置於側方之側板24所圍成之空間26被抽成真空。按壓板23、25之按壓速度為0.004 mm/秒以上且0.06 mm/秒以下。As shown in Fig. 9(D), by moving the pair of pressing plates 23, 25 in the direction in which they are close to each other, the resin body 22 located between the pressing plates 23, 25 is directed along the direction of the pressing plates 23, 25. The resin sheet 11 for encapsulation is formed by stretching. When the resin body 22 is extended, the resin body 22 is heated to a temperature lower than the hardening temperature. The space 26 surrounded by the pair of pressing plates 23 and 25 and the side plates 24 provided on the side is evacuated. The pressing speed of the pressing plates 23 and 25 is 0.004 mm/sec or more and 0.06 mm/sec or less.
於圖9(D)中所示之步驟後,解除由按壓板23、25產生之按壓力,並且將由按壓板23、25及側板24所圍成之空間26進行大氣開放。藉此,製作如圖9(E)所示之封裝用樹脂片材11。After the step shown in Fig. 9(D), the pressing force generated by the pressing plates 23, 25 is released, and the space 26 surrounded by the pressing plates 23, 25 and the side plates 24 is opened to the atmosphere. Thereby, the resin sheet 11 for encapsulation shown in FIG. 9(E) was produced.
第2實施形態中所使用之按壓板23、25之表面上實施有脫模處理。藉由實施脫模處理而有降低按壓板23、25之表面之摩擦力之效 果,故而樹脂體22延伸時之滑動性變良好,可減少夾帶氣泡。The surface of the pressing plates 23 and 25 used in the second embodiment is subjected to a mold release treatment. The effect of reducing the friction of the surfaces of the pressing plates 23, 25 by performing the demolding treatment As a result, the slidability of the resin body 22 when it is extended becomes good, and entrained air bubbles can be reduced.
根據第2實施形態,可不使用保護膜12而製造封裝用樹脂片材11。因此可更廉價地製造封裝用樹脂片材11。According to the second embodiment, the resin sheet for encapsulation 11 can be produced without using the protective film 12. Therefore, the resin sheet for encapsulation 11 can be manufactured more inexpensively.
11‧‧‧封裝用樹脂片材11‧‧‧Packaging resin sheet
12‧‧‧保護膜12‧‧‧Protective film
20‧‧‧模具20‧‧‧Mold
21‧‧‧液狀樹脂21‧‧‧Liquid resin
22‧‧‧樹脂體22‧‧‧ resin body
23、25‧‧‧按壓板23, 25‧‧‧ Press plate
24‧‧‧側板24‧‧‧ side panels
26‧‧‧空間26‧‧‧ Space
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JPH08172146A (en) * | 1994-12-16 | 1996-07-02 | Toshiba Chem Corp | Method for manufacturing sheet-shaped resin for sealing semiconductor |
JPH0966523A (en) * | 1995-08-30 | 1997-03-11 | Toshiba Chem Corp | Manufacture of semiconductor sealing resin molding |
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JP3495913B2 (en) * | 1998-05-28 | 2004-02-09 | シャープ株式会社 | Resin sheet for mounting semiconductor devices |
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JP2009166415A (en) * | 2008-01-18 | 2009-07-30 | Sumitomo Heavy Ind Ltd | Resin for compression molding, resin sealing apparatus and resin sealing method |
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JP2011086745A (en) * | 2009-10-15 | 2011-04-28 | Sanyu Rec Co Ltd | Resin sealing method of electronic component |
JP4935957B1 (en) * | 2010-11-17 | 2012-05-23 | 株式会社村田製作所 | Manufacturing method of resin sheet for sealing |
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JPH08172146A (en) * | 1994-12-16 | 1996-07-02 | Toshiba Chem Corp | Method for manufacturing sheet-shaped resin for sealing semiconductor |
JPH0966523A (en) * | 1995-08-30 | 1997-03-11 | Toshiba Chem Corp | Manufacture of semiconductor sealing resin molding |
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