JPH06291158A - Method and device for manufacturing semiconductor - Google Patents

Abstract

PURPOSE:To make it possible to perform continuous molding with a simple configuration by providing a high use efficiency of materials, easy handling and greatly improved coefficient of thermal expansion and coefficient of thermal conductivity. CONSTITUTION:A first tape 11a and a second tape 11b have recessed portions 12 at the equal spacings, and resins 13a and 13b forming a package are placed in the recessed portions 12. IC pellet 15 provided for a lead frame 14 is continuously sealed by the resins 13a and 13b provided on the first and second tapes 11a and 11b. Since the resins are retained by the first and second tapes 11a and 11b, the use efficiency is high and handling is easy and the package can be continuously molded by a simple configuration.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a semiconductor device, for example, a package for sealing a semiconductor integrated circuit.

[0002]

2. Description of the Related Art A semiconductor integrated circuit is sealed with a resin package. Conventionally, low-pressure transfer molding (injection molding) is often used for manufacturing resin packages,
As another method, the method disclosed in JP-A-2-177552 is known.

The device for performing the low-pressure transfer molding is composed of a mold, a mold clamping device for driving the mold, a transfer device for injecting resin into the mold, and the like. The mold has a pot for containing a resin, a plurality of cavities for accommodating semiconductor integrated circuit pellets, and a runner and a gate for communicating these cavities with the pot. In such a configuration, the molds are combined by the mold clamping device, and in this state, the resin is transferred into the molds by the transfer device to form a package in which the semiconductor integrated circuit pellets are sealed.

The method disclosed in the above publication is
Resin is housed in each of the upper cover and the under cover, and the semiconductor integrated circuit pellets are arranged between the upper cover and the under cover. After that, the undercover is held by the base, and the semiconductor integrated circuit pellets are mounted on the resin of the upper cover. further,
The upper cover is placed on the under cover, and in order to bring the resin of the upper cover into close contact with the resin of the under cover, heating is performed with a weight placed on the upper cover.

[0005]

By the way, in the above-mentioned low-pressure transfer mold, since the resin remains on the pot bottom (cull), the runner and the gate during the package molding, the utilization efficiency of the material is low, and the residual resin is discarded. It becomes a thing. This resin waste is one of the wastes from the semiconductor industry.
Occupy / 3, which is a big problem.

Further, the transfer mold is a runner,
In order to move the resin inside the gate or the like, it is necessary to use a resin having good fluidity. Therefore, upon molding, there are restrictions on the coefficient of thermal expansion and thermal conductivity of the resin. That is, the package is required to have a small coefficient of thermal expansion and good thermal conductivity. However, if these are to be satisfied, the fluidity of the resin will deteriorate, and the deformation of the bonding wires and leads on the semiconductor chip,
This causes the tab to flow, and in the worst case, causes the cutting of the wire.

Furthermore, it is necessary to use a release agent so that the resin can be easily released from the mold after the molding.
In the case of the transfer mold having the above structure, the mold is provided with a plurality of cavities, runners, and gates. Therefore, it is complicated to apply the mold release agent to the cavity, runner, and gate for each molding. Therefore, a resin containing a release agent inside is generally used. However, the resin containing the release agent is not suitable because it causes a loss of adhesion with the semiconductor chip, the bonding wire, and the outer leads to which the bonding wire is connected. Therefore, in transfer molding, the method of releasing the molded product has become a problem.

On the other hand, in the method and apparatus disclosed in the above publication, the material can be utilized almost 100%, so that the utilization efficiency of the material is good and the resin is not moved.
The fluidity of the resin does not matter so much. However, since the upper cover and the under cover are independent of each other, in the step of accommodating them on the position regulation table, their transportation and positioning are complicated, and they are not suitable for mass production in a continuous process.

The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is that material utilization efficiency is good, handling is easy, and continuous molding is possible with a simple structure. A semiconductor device manufacturing method and a manufacturing device are provided.

[0010]

The manufacturing method of the present invention comprises:
To form a tape-shaped first holding means containing a resin for forming a package in a concave portion arranged at a predetermined distance and a package in a concave portion arranged at a predetermined distance A lead frame in which the semiconductor integrated circuit pellets are arranged at a predetermined distance from each other between the second frame and the tape-shaped second holding means containing the resin, and the semiconductor integrated circuit pellets are attached to the first, It is characterized in that it is continuously sealed by a resin provided in the second holding means.

Further, the manufacturing apparatus of the present invention is separated from the first tape-shaped holding means in which resin for forming the package is accommodated in the concave portion arranged to be separated from the predetermined interval with a predetermined interval. The semiconductor integrated circuit pellet is provided between the tape-shaped second holding means in which a resin for forming a package is housed in the provided recess and the first and second holding means. A manufacturing device of a semiconductor device, comprising: a lead frame arranged with a space therebetween, and continuously sealing the semiconductor integrated circuit pellets with a resin provided on the first and second tapes, A first die having a first accommodating portion for accommodating a protrusion corresponding to the concave portion of the first holding means, and a first die opposed to the first die;
A second mold having a second accommodating portion for accommodating a protrusion corresponding to the recess of the holding means, a driving means for bringing the first and second molds into contact with each other, and the first and second molds. And a moving means for moving the first and second holding means and the lead frame in a direction orthogonal to the driving direction of the first die in a state in which is opened.

[0012]

That is, in the present invention, the semiconductor integrated circuit pellets arranged at equal intervals on the lead frame are continuously sealed by the resin provided on the first and second holding means. Since the individual resins for forming the package are held by the first and second holding means, the utilization efficiency of the resins is good and the handling is easy. Moreover, since the package can be continuously molded with a simple structure, it is suitable for mass production.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

1 to 10 show a first embodiment of the present invention. 1 and 2, the tape 11 is made of, for example, polyimide having heat resistance. A thermoplastic resin can also be applied to the material of the tape 11. A plurality of recesses 12 are provided on the surface of the tape 11 at predetermined intervals. The recess 12 forms an emboss on the back surface of the tape 11.
Hereinafter, the concave portion and the embossing are treated as common and the reference numeral 12 is attached. The shape of the recess 12 is, for example, DIP (Dua
l In-line Package), SOJ (Small Outline J-leaded
Package) and other package shapes. The inside of these recesses 12 is filled with resin 13, as shown in FIGS. The resin 13 is, for example, a phenol-curable epoxy resin containing 20 to 97 wt /% of filler, and the filler is, for example, silica, SiN, or S.
iC etc. The resin 13 is B-staged for homogenization, and has a viscosity that does not drop even when the tape 11 is heated inside out.

The amount of the filler affects the thermal expansion coefficient of the resin, and the smaller the amount of the filler, the larger the thermal expansion coefficient. In the above example, the lower limit of the filler was set to 20 wt /%,
When a resin having a small coefficient of thermal expansion is used, or when the coefficient of thermal expansion is negligible depending on the performance and application of the semiconductor device, the filler may be 20 to 0 wt /%.

A release agent (not shown) is applied to the inner surface of the recess 12 of the tape 11 before the resin 13 is filled. This release agent can be automatically applied while moving the tape 11 in the longitudinal direction, for example. Since the release agent is applied to the inner surface of the recess 12, the resin 13 does not contain the release agent. The application of the release agent and the filling of the resin 13 can be automatically performed in a continuous process. Alternatively, embossing may be performed after the release agent is applied to the tape 11.

Next, the tape 1 filled with the above resin 13
A method of manufacturing a package using two 1's will be described.

First, as shown in FIG. 5, the lead frame 14 is arranged between the first tape 11a for forming one package and the second tape 11b for forming the other package. To do. Semiconductor integrated circuit pellets (hereinafter referred to as IC pellets) 15 are die-bonded to the surface of the lead frame 14 facing the first tape 11a at intervals corresponding to the recesses 12. Each IC pellet 15 is bonded to an inner lead (not shown) of the lead frame 14 by a bonding wire 16. In this state, the first and second
The resins 13a and 13b of the tapes 11a and 11b of FIG.
Soften 3.

Next, as shown in FIG. 6, for example, first, the lead frame 14 is raised and the lead frame 14 is brought into contact with the back surface of the second tape 11b. In this state, the tape 11a on the lower side is raised, and the IC pellet 15 and the bonding wire 16 provided on the lead frame 14 are made to enter the inside of the resin 13a of the first tape 11a.
FIG. 6 shows a state in which the first tape 11a is slightly raised. After this, as shown in FIG. 7, the first tape 11
a and the second tape 11b are brought into pressure contact with each other, and the IC pellet 15 and the bonding wire 16 are connected to each other by the first and second tapes 1 and 2.
It seals with resin 13a, 13b provided in 1a, 11b.

The speed at which the IC pellet 15 and the bonding wire 16 provided on the lead frame 14 enter the inside of the resin 13a of the first tape 11a must be such that the bonding wire 16 is not deformed.
When the diameter of the bonding wire 16 is 25 μm and the resin 13 is under the above conditions, the entry speed is preferably 0.05 to 5.0 mm / sec. The range where this approach speed is required is shown by the distance L ₁ in FIGS. 5 and 6. This distance L ₁ is extremely small compared to the mutual distance L ₂ between the first and second tapes 11a and 11b. Therefore, by operating the range of the distance L ₃ at high speed, the second tape 11 with respect to the first tape 11a can be operated.
The moving time of b can be shortened.

After the resins 13a and 13b provided on the first and second tapes 11a and 11b are sufficiently hardened, the first and second tapes 11a and 11b are attached to the lead frame 14.
Peeled from the package 17, as shown in FIG.
7 is formed.

In the above embodiment, the lead frame 14 was first brought into contact with the second tape 11b during the molding of the package, but the lead frame 14 was previously attached to the second tape 11b as shown in FIG. You may abut.

Furthermore, the first and second tapes 11a, 11
The peeling time of b is arbitrary, and the first and second tapes 11
It is also possible to save with a and 11b attached.
Further, the tie bar cutting of the lead frame 14 may be performed at a necessary time.

Furthermore, the first and second tapes 11a and 11
It is also possible to remove the parts other than the recess 12 of b and use the recess 12 as a cover of the semiconductor device. In this case, the recess 1
Since it is not necessary to release the resins 13a and 13b from 2,
It is not necessary to apply a release agent to the recess 12.

Further, the first and second tapes 11a,
The moving order of 11b is essentially the same regardless of which order comes first. For example, as shown in FIG.
The 1a and the lead frame 14 may be combined, and then the second tape 11b and the first tape 11a may be pressed against each other. Further, as shown in FIG. 10, first, the second tape 1
The lead frame 14 may be integrated with the 1b, and then the second tape 11b and the first tape 11a may be pressed against each other.
Further, the first and second tapes 11a and 11b may be pressed against the lead frame 14 at the same time.

According to the above embodiment, the resins 13a and 1 filled in the recesses 12 of the first and second tapes 11a and 11b.
The IC pellet 15 provided on the lead frame 14 is sealed by 3b. Therefore, since the waste of the molding resin is hardly generated, the resin utilization efficiency is almost 100%.
%, And the yield of the molding resin can be dramatically increased as compared with the conventional transfer molding.

Further, each resin 13 is used as the first and second tapes 1.
It is held by 1a and 11b. Therefore, the resin pellet 13 and the IC pellet 15 provided on the lead frame 14 can be easily positioned, which is suitable for automation and has excellent mass productivity.

Furthermore, since the resin 13 does not contain a release agent, the resin 13, the lead frame 14, and the IC pellet 1
5. The adhesiveness of the bonding wire 16 can be improved. Therefore, it is possible to reliably prevent moisture from entering the package. Moreover, since the application of the release agent to the concave portions of the tape can be automated, the time required for the application can be shortened.

Further, I provided on the lead frame 14
The speed at which the C pellet 15 and the bonding wire 16 enter the inside of the resin 13a of the first tape 11a is
Bonding wire 1 because it is 0.05 to 5.0 mm / sec.
The deformation of 6 can be prevented. Moreover, the distance required for this speed is small. Therefore, the influence on the molding time of the package is negligible.

FIG. 11 shows the relationship between the flow rate of the resin in the cavity and the deformation rate of the bonding wire in the conventional transfer mold. Here, the diameter of the bonding wire and the type of resin are the same as in the above embodiment. The deformation rate of the bonding wire is represented by 1 / L. L represents the length of the wire, and l represents the distance between the apex of the curved wire and the original position when the resin flows from the direction orthogonal to the length direction of the wire.

T1 and T2 have different resin temperature conditions, T2 is set to 180 ° C. and T1 is set to a temperature higher than this. As is clear from the figure, the deformation rate of the bonding wire increases as the resin flow velocity in the cavity increases. In the case of the present invention, the speed at which the bonding wire enters the inside of the resin (relatively the flow velocity of the resin) is 0.05
~ 5.0 mm / sec. Therefore, the deformation rate of the bonding wire can be 5% or less. Further, in the case of the present invention, the resin contacts from the apex portion of the curved wire as shown in FIGS. 5 and 6, which is different from the lateral contact of the curved wire as in the conventional transfer mold. Therefore, in the case of the present invention, the strength of the wire is greater than in the conventional case, and the deformation rate of the wire can be reduced.

Further, the first and second tapes 11a and 11b
Can be used as a cover for the package after the package is molded, and in this case, it is possible to more reliably prevent moisture from entering the inside of the package.

Next, another embodiment of the present invention will be described. The same parts as those in the first embodiment are designated by the same reference numerals.

FIG. 12 shows a second embodiment of the tape. On the back side of this tape 11, a metal film 21
Is provided. For the metal film 21, for example, aluminum, iron, copper, nickel or the like can be applied. This tape 1
After molding the resin package by the method described above using 1, the embossing 12 is left as shown in FIG.
The other parts of the tape 11 and the metal film 21 are cut off.
Then, a semiconductor device in which the package 17 is covered with the tape 11 forming the emboss 12 and the metal film 21 can be obtained.

According to this embodiment, compared to the first embodiment, it is possible to form a package capable of preventing moisture from entering. Further, since the end portion of the tape 11 is interposed between the end portion of the metal film 21 and the lead frame 14, the metal film 21 and the lead frame 14 can be reliably insulated.

Although the metal film is provided on the back surface of the tape in the second embodiment, a tape may be further provided on the front surface of the metal film and the metal film may be sandwiched between the tapes. Further, a metal film may be provided between the tape and the resin.

FIG. 14 shows a third embodiment of the present invention. In this embodiment, the upper resin 13a and the lower resin 13b forming the package 17 are made of different materials. Upper resin 13a and lower resin 1
The combination of 3b is selected according to the purpose and application of the package. For example, when improving the heat resistance of the package, a polyimide resin is used for the upper side and an epoxy resin is used for the lower side. Further, in order to improve reliability and reduce manufacturing cost, a high-purity epoxy resin or polyimide resin for semiconductor is used on the upper side, and a low-purity epoxy resin or phenol resin is used on the lower side. When manufacturing such a package, resin 13 is applied to the upper first tape 11a.
It is sufficient to hold a and the resin 13b on the second tape 11b on the lower side. Further, the amount of filler mixed with the resins 13a and 13b may be changed. For example, IC pellet 1
The amount of filler in the package on the side where 5 is not provided can be approximately 99%. In this case, depending on the type of filler, it is possible to obtain a thermal conductivity similar to that of metal.

FIG. 23 shows the amount of filler and the thermal conductivity λ of resin.
It shows the relationship with. In the figure, A is silicon nitride as a filler, B is silicon carbide as a filler,
C shows the case where quartz is used as the filler, and D shows the case where amorphous silica is used as the filler.

As described above, the thermal expansion coefficient, thermal conductivity, heat resistance performance, and water resistance performance of the package can be arbitrarily set by changing the composition of the resin according to the purpose and application of the package.

FIG. 15 shows a fourth embodiment of the present invention. In this embodiment, another resin 13c is provided on the surface of the upper resin 13a constituting the package 17. Generally, various marks are written on the surface of the package. This mark is formed, for example, by mixing a dye in the mold resin of the package, irradiating the surface of the package with laser light after the package is molded, and coloring the dye. However, since the dye contained in the molding resin may adversely affect the IC pellet and the bonding wire, it is desirable that the dye and the dye do not come into contact with each other.
It was difficult with the conventional transfer mold.

In this embodiment, the first tape 11a is
First, a resin 13c containing a dye is thinly filled in the recess 12 and then the resin 13a is filled therein. The first tape 11a containing the resin having the two-layer structure and the resin 13b described above.
When the package is molded using the second tape 11b containing the resin, the resin 13c containing the dye is located on the surface of the package 17, as shown in FIG.

According to this embodiment, since the resin 13c containing the dye is located on the surface of the package 17, this resin 13c
A required mark can be described in c, and since the resin 13c containing the dye does not come into contact with the IC pellet 15 and the bonding wire 16, they do not adversely affect them.

FIG. 16 shows a fifth embodiment of the present invention. In this embodiment, a metal film 22 is provided inside the resin 13a that constitutes the package 17.
That is, the resin 13a is first thinly filled in the recess 12 of the first tape 11a, the metal film 22 is placed thereon, and the resin 13a is further filled therein. When a package is molded using the first tape 11a containing the resin 13a having the above structure and the second tape 11b containing the resin 13b described above, a metal film is formed inside the resin 13a as shown in FIG. 22 is located.

According to this embodiment, the metal film 22 can prevent water from entering the inside of the resin 13a.

FIG. 17 shows a sixth embodiment of the present invention. In this embodiment, for example, the tape 11a is provided with a groove 23. One end of this groove 23 is a recess 1
Located at the corner of 2 and communicates with the recess 12, and the other end is the tape 1
It is located at the edge of 1a. The groove 23 may be provided in both the first tape 11a and the second tape 11b, or in either one.

According to this embodiment, when the resin 13a, 13b is compressed during the molding of the package, the resin 13a, 1b is compressed.
Air from the inside of 3b can be discharged to the outside of the tape through the groove 23. Therefore, it is possible to prevent the occurrence of voids inside or on the surface of the molded package.

FIG. 18 shows a first embodiment of a manufacturing apparatus using the above manufacturing method. In the compression molding machine 31, the base 32 is provided with a drive device 33, for example, by a servo motor. The drive unit 33 is provided with a first fixed base 34, and the first fixed base 34 is provided with one end of a plurality of shafts 35. A second fixed base 36 is provided on the other end of the shaft 35. The plurality of shafts 35
A movable base 37 is provided on the movable base 37, and a plunger 38 provided on the drive unit 33 is connected to the movable base 37. Therefore, the drive device 33 is driven and the plunger 3
When 8 is moved, the moving table 37 is moved in the axial direction accordingly. The movable table 37 and the second fixed table 36
Are provided with first and second molds 39, 40 facing each other.

On the other hand, a first support 41 is provided near one side surface of the compression molding machine 31, and a second support 42 is provided near the other side surface. The first support 4
1 is provided with a first reel 43 around which the first tape 11a is wound, and the second tape 11b.
A second reel 44 around which is wound is provided. First
The tape 11a is filled with resin 13a in the concave portion 12,
A resin 13b is filled in the recess 12 of the first tape 11b. The lead frame 14 is supplied between the first and second reels 43 and 44 from a supply device (not shown). The first and second tapes 11a and 11b and the lead frame 14 supplied from the first and second reels 43 and 44 are guided between the first and second molds 39 and 40, respectively. The second mold 39, 40 is used to mold the package. The first after molding this package,
Second tape 11a, 11b and lead frame 14
Is the third reel 4 provided on the second support 42.
Take up by 5.

FIG. 19 shows the structure of the control system of the manufacturing apparatus. The control unit 51 controls the entire apparatus, and is configured by, for example, a microcomputer. The control unit 51 is connected to a servo motor driving unit 52 that drives the driving device 33, and is also connected to a reel driving unit 53 that drives the first to third reels 43, 44 and 45. Further, the control unit 51 is connected to a heating device 54 that heats the first and second molds 39 and 40.

FIG. 20 shows the first and second molds 39, 4
It shows 0. The first and second molds 39 and 40 have first, second and third molds 39 and 40 along the moving direction of the first and second tapes 11a and 11b and the lead frame 14, respectively.
Steps 39a, 39b, 39c, 40a, 40b, 40 of
c is provided. The second steps 39b and 40b are the first
Of the third step 39c, which protrudes from the step 39a, 40a of
40c projects from the second step portions 39b and 40b.
First, second and third step portions 39a, 39b, 39c, 40
a, 40b, 40c have the first and second tapes 11a,
The cavities 46 for accommodating the embosses 12 provided in 11b are provided respectively. These cavities 46
Has the same shape as the emboss 12.

The first and second step portions 39a, 39b, 4
0a and 40b preheat the resin 13 filled in the recesses 12 of the first and second tapes 11a and 11b, and the first and second tapes 11 at the third step portions 39c and 40c.
a, 11b and the lead frame 14 are pressed, and the resin 1
A package is formed by 3a and 13b.

The operation of the manufacturing apparatus having the above structure will be described.

The first and second molds 39 and 40 are the heating device 5
4 is heated to a predetermined temperature. In this state, first, the driving device 33 is driven by the servo motor driving unit 52, the moving table 37 is lowered, and the first and second molds 39 and 40 are opened. In this state, the reel drive unit 53 causes the first to third reels 43, 44, 45.
20 to drive the first and second tapes 1 as shown in FIG.
1a, 11b and the lead frame 14 are simultaneously moved to move the emboss 12 of the first tape 11a to the first mold 39.
The first, second, and third step portions 39a, 39b provided in the
The embossment 12 of the second tape 11b is made to correspond to the cavities 46 of 39c, respectively, and the step portion 40 of the second mold 40 is made.
It corresponds to the cavities 46 of a, 40b, and 40c, respectively.

Thereafter, for example, the lead frame 14 is brought into contact with the second tape 11b by moving means (not shown). In this state, the movable table 37 is raised to bring the first mold 39 closer to the second mold 40 at high speed, and the mutual distance between the third step portions 39c and 40c becomes the distance L ₁ shown in FIG. At this time, the ascending speed of the moving table 37 is increased to 0.05 to 5.0 mm /
Let sec. At this speed, the third step 39c and the third step 40c are brought into contact with each other and pressed as shown in FIG. At this time, the first and second step portions 39, 39b, 40a, 40b are separated from each other.

After pressurizing for a predetermined time in the above state, the movable table 3
7 is lowered and the first and second molds 39 and 40 are opened, the embossing 12 of the first and second tapes 11a and 11b.
Is released from each cavity 46. After that, the first to third reels 43, 44 and 45 are driven to move the first and second tapes 11a and 11b and the lead frame 14. Hereinafter, the same operation is continuously repeated to automatically form the package.

FIG. 22 shows another embodiment of the manufacturing apparatus. Although the above example used one compression molding machine,
In this embodiment, the first to fourth molding machines 61, 62, 63,
64 is used. These first to fourth molding machines 61 to
64 includes first molds 61a, 6 as lower molds, respectively.
2a, 63a, 64a, second mold 61 as upper mold
b, 62b, 63b, 64b are provided. A cavity 65 for accommodating the emboss 12 is provided in each of the first and second molds 61a to 64b. First
The first to third molding machines 61, 62, 63 constitute, for example, preheating sections, and the first to third molding machines 61, 6 are used.
The resin in the housing portion 12 is preheated by 2, 63. Fourth
This molding machine 64 constitutes a compression section, and the fourth molding machine 64
The resin is compression molded by.

FIG. 22 shows the first to fourth molding machines 61 to 64.
First molds 61a to 64a and second molds 61b to 6
4b shows the closest state. First mold 6
The operations of 1a to 64a and the second molds 61b to 64b are the same as those of the apparatus shown in FIG. With such a configuration, the same effect as that of the device shown in FIG. 18 can be obtained.

As described above, since the manufacturing apparatus shown in FIGS. 18 and 22 is basically a compression molding apparatus, the structure is simple and the manufacturing cost is low. Moreover, since the resin is integrally provided on the first and second tapes 11a and 11b, it can be easily set in the apparatus, and it is necessary to apply a release agent to the cavity of each mold. Since it does not exist, continuous molding can be performed by a simple operation.

In the manufacturing apparatus shown in FIGS. 18 and 22, the mold is moved in the vertical direction, and the first and second tapes 11a and 11 are formed.
b and the lead frame 14 were moved horizontally,
The present invention is not limited to this, and the same production can be performed by moving the mold in the horizontal direction and moving the first and second tapes 11a and 11b and the lead frame 14 in the vertical direction.

Of course, various modifications can be made without departing from the spirit of the present invention.

[0061]

As described above in detail, according to the present invention,
It is possible to provide a semiconductor device manufacturing method and a manufacturing apparatus which have good material utilization efficiency, are easy to handle, can significantly improve the thermal expansion coefficient and thermal conductivity, and can be continuously molded with a simple configuration.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a tape applied to the present invention.

FIG. 2 is a side view of the tape shown in FIG.

FIG. 3 is a perspective view showing a state where the tape shown in FIG. 1 is filled with resin.

FIG. 4 is a cross-sectional view taken along line 4-4 of FIG.

FIG. 5 is a sectional view showing an embodiment of the manufacturing method of the present invention.

6 is a cross-sectional view showing a step that follows FIG.

FIG. 7 is a cross-sectional view showing a step that follows FIG.

FIG. 8 is a cross-sectional view showing a step that follows FIG.

FIG. 9 is a cross-sectional view showing another embodiment of the manufacturing method of the present invention.

FIG. 10 is a sectional view showing another embodiment of the manufacturing method of the present invention.

FIG. 11 is a characteristic diagram showing a relationship between a resin flow velocity in a cavity and a deformation rate of a bonding wire in a conventional transfer mold.

FIG. 12 is a sectional view showing a second embodiment of the tape according to the present invention.

13 is a sectional view showing a resin package molded using the tape shown in FIG.

FIG. 14 is a sectional view showing a third embodiment of the tape according to the present invention.

FIG. 15 is a sectional view showing a fourth embodiment of the tape according to the present invention.

FIG. 16 is a sectional view showing a fifth embodiment of the tape according to the present invention.

FIG. 17 is a perspective view showing a sixth embodiment of the tape according to the present invention.

FIG. 18 is a side view showing an embodiment of the manufacturing apparatus according to the present invention.

19 is a configuration diagram showing a control system of the manufacturing apparatus shown in FIG.

20 is a sectional view showing an example of a mold applied to the manufacturing apparatus shown in FIG.

21 is a cross-sectional view shown for explaining the operation of the manufacturing apparatus shown in FIG.

FIG. 22 is a sectional view showing another embodiment of the manufacturing apparatus according to the present invention and showing only a main part.

FIG. 23 is a characteristic diagram showing the relationship between the amount of filler and the thermal conductivity λ of resin.

[Explanation of symbols]

11, 11a, 11b ... First and second tapes, 12 ... Recesses (embossing), 13, 13a, 13b, 13c ... Resin, 14 ... Lead frame, 15 ... IC pellet, 16
... Bonding wire, 17 ... Package, 21, 22
... metal film, 23 ... groove, 31 ... compression molding machine, 33 ...
Drive device, 34, 36 ... First and second fixed bases, 37 ... Moving base, 39, 40 ... First and second molds, 51 ... Control unit,
46 ... Cavities, 61, 62, 63, 64 ... First to fourth molding machines.

Claims (10)

[Claims] 1. A tape-shaped first holding means in which a resin for forming a package is accommodated in a recess provided at a predetermined interval and a recess provided at a predetermined interval. A lead frame, in which semiconductor integrated circuit pellets are arranged at a predetermined interval, is provided between the tape-shaped second holding means containing a resin for forming a package and the semiconductor integrated circuit pellets. Is continuously sealed with resin provided on the first and second holding means. 2. The method of manufacturing a semiconductor device according to claim 1, further comprising the step of removing the first and second holding means after sealing the semiconductor integrated circuit pellet with the resin. 3. A tape-shaped first holding means in which resin for forming a package is accommodated in a concave portion arranged at a predetermined distance, and a concave portion arranged at a predetermined distance. It is provided between the tape-shaped second holding means in which the resin for forming the package is housed and the first and second holding means, and the semiconductor integrated circuit pellets are arranged at a predetermined interval. A lead frame, and a semiconductor device manufacturing apparatus for continuously sealing the semiconductor integrated circuit pellets with a resin provided on the first and second tapes. A first mold having a first accommodating portion for accommodating a protrusion corresponding to the recess, and a second mold opposed to the first mold and accommodating the protrusion corresponding to the recess of the second holding means. A second mold having a housing, and the first and second molds Drive means for contacting and separating, and moving means for moving the first and second holding means and the lead frame in a direction orthogonal to the drive direction of the first mold in a state where the first and second molds are opened. An apparatus for manufacturing a semiconductor device, comprising: 4. The driving means has a speed of causing the semiconductor integrated circuit pellets to enter into the softened resin of 0.05 to 5.0 mm.
4. The apparatus for manufacturing a semiconductor device according to claim 3, wherein it is variable within a range of / sec. 5. The resin contains a filler of 20 to 97 wt / wt.
%, The manufacturing apparatus of the semiconductor device according to claim 3. 6. The semiconductor device manufacturing apparatus according to claim 3, wherein the first and second holding means are provided with a metal film. 7. The semiconductor device manufacturing apparatus according to claim 3, wherein the resin provided in the first holding means is different in material from the resin provided in the second holding means. 8. The resin provided on the first holding means is composed of a first resin in contact with the semiconductor integrated circuit pellet and a second resin provided on the surface of the first resin and containing a dye. 4. The semiconductor device manufacturing apparatus according to claim 3, wherein: 9. The apparatus for manufacturing a semiconductor device according to claim 3, wherein the resin provided on the first holding means includes a metal foil at a position where it does not contact the semiconductor integrated circuit pellet. 10. The manufacturing of a semiconductor device according to claim 3, wherein at least one of the first and second holding means is provided with a groove portion that connects the recess and the edge portion of the holding means. apparatus.