CN104160492A - Method for manufacturing sealing resin sheet - Google Patents
Method for manufacturing sealing resin sheet Download PDFInfo
- Publication number
- CN104160492A CN104160492A CN201380011555.XA CN201380011555A CN104160492A CN 104160492 A CN104160492 A CN 104160492A CN 201380011555 A CN201380011555 A CN 201380011555A CN 104160492 A CN104160492 A CN 104160492A
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- Prior art keywords
- sealing resin
- resin sheet
- resinite
- sheet material
- pressing plate
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
In order to manufacture a sealing resin sheet for insulating and sealing a plurality of electronic components mounted on a substrate at low cost and suppress mixing of air bubbles into the sealing resin sheet, in the first step, a resin body (22) in a semi-cured state is disposed in a space (26) surrounded by a pair of pressing plates (23, 25) facing each other and a side plate (24) provided on the outer peripheral side. In the second step, a vacuum is drawn into the space (26), and the resin body (22) is heated at a temperature lower than a curing temperature and extended by being pressed at a pressing speed of 0.004-0.06 mm/sec (inclusive) by the pressing plates (23, 25). Consequently, a sealing resin sheet (11) is produced.
Description
Technical field
The present invention relates to the sealing resin sheet material manufacture method for carry out insulated enclosure to being equipped on multiple electronic devices and components on substrate.
Background technology
On substrate, be equipped with the electronic component module of multiple electronic devices and components in order to protect electronic devices and components not to be subject to the impact of moisture, external contact etc., form sealing resin layer so that its covered substrate and electronic devices and components.Sealing resin bed is the sealing resin sheet material by put semi-cured state (B stage) on the substrate that is equipped with electronic devices and components and put sealing resin sheet material is heated and pressed forms.
Figure 10 (A) to Figure 10 (C) be the figure that represents to manufacture with sealing resin sheet material 205 generic instance of electronic component module 200.As shown in Figure 10 (A), on circuit substrate 201, be formed with circuit pattern 202, above circuit pattern 202, be equipped with electronic devices and components 204 via conductive adhesive 203.
As shown in Figure 10 (B), be equipped with electronic devices and components 204 circuit substrate 201 above configure sealing resin sheet material 205.Afterwards, utilize two flat boards 206 that circuit substrate 201 and sealing resin sheet material 205 are clamped, sealing resin sheet material 205 is heated and pressed.Thus, electronic devices and components 204 are embedded in sealing resin sheet material 205, and sealing resin sheet material 205 solidifies by heating, and become sealing resin layer 209.
Shown in Figure 10 (C) is the electronic component module 200 of manufacturing by said process, and the sealing resin layer 209 that electronic devices and components 204 and circuit substrate 201 are cured covers so that its sealing.
The manufacture process of electronic component module 200 hereto, has been described.Then, the manufacture method of the sealing resin sheet material 205 using in the manufacture process of electronic component module 200 is described.
The manufacture method of above-mentioned sealing resin sheet material 205 is for example recorded in patent documentation 1 (Japanese Patent Laid-Open 2009-29930 communique).According to patent documentation 1, utilize the apparatus for coating 101 shown in Figure 11 aqueous resin combination 102 to be coated on to the upper surface of support membrane 103, the mold release film of sending from mold release film roller 104 105 is overlapped to the upper surface of resin combination 102, utilize and press resin combination 102 by pressure roller 106, thereby manufacture sealing resin sheet material 205.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 2009-29930 communique
Summary of the invention
Invent technical problem to be solved
But, in the manufacture method of the sealing resin sheet material 205 that patent documentation 1 is recorded, owing to needing apparatus for coating 101, mold release film roller 104, by the expensive equipment such as pressure roller 106, the problem that therefore exists the manufacturing cost of sealing resin sheet material 205 to uprise.
In addition, as described in Patent Document 1, be coated with in the method for aqueous resin combination 102 at the upper surface of support membrane 103, because aqueous resin combination 102 infiltrates expansion, be therefore difficult to manufacture the sealing resin sheet material 205 that thickness is large.
And, as described in Patent Document 1, be coated with in the manufacture method of aqueous resin combination 102 overlapping mold release film 105 at the upper surface of support membrane 103, when coating, can carry bubble secretly in the inside of resin combination 102, this bubble can be enclosed between support membrane 103 and mold release film 105.From the viewpoint of moisture-proof, outside barrier property, be preferably in the sealing resin layer 209 of electronic component module 200 and do not have bubble to sneak into.For this reason, be preferably sneaking into of bubble in the sealing resin sheet material 205 using also less in the manufacture process of electronic component module 200, but in the manufacture method of recording at patent documentation 1, can be at the residual bubble in the inside of resin combination 102.
The problem to be solved in the present invention is to reduce the above-mentioned problem about sealing resin sheet material manufacture method.
The technical scheme of technical solution problem
The present invention is a kind of sealing resin sheet material manufacture method, for the multiple electronic devices and components that are equipped on substrate are carried out to insulated enclosure, have: resinite arrangement step, wherein will be configured in by relative a pair of pressing plate and be arranged in the space that the side plate of the outer circumferential side of pressing plate surrounds as the resinite of the semi-cured state of the material of sealing resin sheet material; And extension operation, wherein will in the space of encirclement, vacuumize, and the temperature with the curing temperature lower than resinite heats resinite, and utilize pressing plate resinite to be pressed so that its extension with the speed of pressing below above 0.06mm/ second 0.004mm/ second.
Be preferably, in resinite arrangement step, between resinite and pressing plate, insert the diaphragm of having implemented demoulding processing, in extension operation, press resinite so that it extends on diaphragm.
Or be preferably, pressing plate is implemented to demoulding processing, in extension operation, press resinite so that it extends in the face direction of pressing plate.
Invention effect
According to the present invention, can manufacture at an easy rate the sealing resin sheet material that thickness is larger, and not need expensive equipment.In addition, can suppress air entrapment residual of sealing resin sheet material.
Brief description of the drawings
Fig. 1 is the cutaway view of observing sealing resin sheet material 11 from front.
Fig. 2 is the figure that the manufacturing process of the related sealing resin sheet material 11 of the first execution mode of the present invention is shown successively.
Fig. 3 is the concise and to the point figure of the press device 30 in the operation shown in Fig. 2 (C).
Fig. 4 is the figure of the relation between the number of bubbles of confirming in the speed of pressing while representing to press and sealing resin sheet material 11.
Fig. 5 is the surperficial photo of the sealing resin sheet material 11 in the situation of the speed of pressing while representing to change pressing plate.
Fig. 6 is the figure that near the situation of periphery of the resinite 22 when resinite 22 extends is described.
Fig. 7 is the figure that represents the relation between resin viscosity and the thickness deviation of sealing resin sheet material 11.
Fig. 8 is the figure that represents the relation between temperature and the viscosity of sealing resin sheet material 11.
Fig. 9 is the figure that the manufacturing process of the related sealing resin sheet material 11 of the second execution mode of the present invention is shown successively.
Figure 10 is the figure that represents to manufacture with sealing resin sheet material 205 generic instance of electronic component module 200.
Figure 11 is the figure that represents the manufacture method of sealing resin sheet material 205 of the prior art.
Embodiment
[the first execution mode]
For the electronic component module that is equipped with multiple electronic devices and components on substrate, use sealing resin sheet material for electronic devices and components are carried out to insulated enclosure.As shown in Figure 1, sealing resin sheet material 11 is tabular, and thickness is 0.1mm～3.5mm.The material of sealing resin sheet material 11 is insulating resin (being for example epoxy resin), in order to improve mechanical strength, in insulating resin, contains for example silica or aluminium oxide as filler.
At two interareas of sealing resin sheet material 11, the surface of diaphragm 12 for protection sealing resin sheet material 11 is installed.The material of diaphragm 12 is for example PET (PETG), PTFE (polytetrafluoroethylene) etc.For the surface of diaphragm 12, implement to utilize the demoulding processing of silicones etc., in the manufacture process of electronic component module, use sealing resin sheet material 11, peel off diaphragm 12 and use.
, to Fig. 2 (E) and Fig. 3 the manufacture method of sealing resin sheet material 11 is described with reference to Fig. 2 (A).
As shown in Fig. 2 (A), prepare to have the columnar mould 20 at the end, liquid resin 21 is injected to mould 20, and become semi-cured state by heat treatment, to manufacture resinite 22.
Resinite 22 is containing Packed insulating resin, becomes the material of sealing resin sheet material 11.Semi-cured state refers to the state in the interstage of curing reaction, is also referred to as the B stage.In order to make aqueous resin 21 become semi-cured state, in the situation that being epoxy resin, with the temperature of 40 DEG C～160 DEG C, utilize baking oven heat treated 5 minutes～120 minutes.
Resinite 22 can use the resin that viscosity is 120Pas～1800Pas at the temperature of 60 DEG C.Viscosity is now the AR550 that uses TA Instruments company to produce, the value of measuring under the condition of tool sizes φ 8mm, mensuration thickness 550 μ m, frequency 1Hz, strain 0.1%.
As shown in Fig. 2 (B), prepare the pressing plate 23 for downside that sealing resin sheet material 11 is formed, at the outer circumferential side configuration side plate 24 of the interarea of pressing plate 23.Side plate 24 both can be framework, and the mode that also can form ring-type configures multiple sheet material.Meanwhile, configuration protection film 12 in region interarea, that surrounded by side plate 24 of pressing plate 23, and the resinite of manufacturing in the operation of Fig. 2 (A) 22 is configured in to the central authorities on diaphragm 12.
For example, even if pressing plate 23, side plate 24, as long as pressing the material that also can maintain shape, can use stainless steel, aluminium.Side plate 24 is members of the thickness of the sealing resin sheet material 11 for determining formed thereby, and the thickness of diaphragm 12 is also taken into account to set.Be 0.05mm at the thickness of diaphragm 12, the thickness of side plate 24 adopts the scope of 0.2mm～3.6mm.
As shown in Fig. 2 (C), above resinite 22, configure successively the pressing plate 25 of another diaphragm 12 and upside, so that it is relative with pressing plate 23 with the diaphragm 12 configuring in the operation of Fig. 2 (B).Thus, become at a pair of pressing plate 23,25 by relative and be arranged at the state that disposes resinite 22 in the space 26 that the side plate 24 of side surrounds.
Here, the press device using in the manufacturing process of sealing resin sheet material 11 is described.Fig. 3 is the concise and to the point figure of the press device 30 in the operation shown in Fig. 2 (C).As shown in Figure 3, resinite 22 and diaphragm 12 are configured in by a pair of pressing plate 23,25 and are arranged in the space 26 that the side plate 24 of side surrounds.Under this state, utilize press device 30 to reducing pressure in space 26, and resinite 22 is heated, pressed.
At the upside of pressing plate 25, increased pressure board 32 is set, at the downside of pressing plate 23, compression plate 31 is set.Increased pressure board 32 and compression plate 31 are built-in with respectively heater 33.Utilize this heater 33, heat via 23,25 pairs of resinites 22 of pressing plate.
In addition, vacuum mechanism 38 is set so that it surrounds increased pressure board 32 and compression plate 31.Vacuum mechanism utilizes not shown vacuum source to vacuumize.On side plate 24, have in the horizontal direction not shown through hole, will in space 26, also vacuumize by this through hole, to become decompression state.
Be connected with the driving shaft of pressurization servomechanism 34 at the upside of increased pressure board 32.By making the driving shaft decline of servomechanism 34 of pressurizeing, thereby press increased pressure board 32 and pressing plate 25, consequently press resinite 22.In addition, pressurization servomechanism 34 is arranged at the central authorities of top board 36, and top board 36 is fixed on pillar 37, and this pillar 37 is erected in the substrate 35 of below.
Here referring again to Fig. 2, the manufacture method of sealing resin sheet material 11 is described.Use above-mentioned press device 30, as shown in Fig. 2 (D), a pair of pressing plate 23,25 is moved towards direction close to each other.Thus, the resinite 22 between pressing plate 23,25 extends along the face direction of diaphragm 12, and sealing resin sheet material 11 is formed.
Heating-up temperature when resinite 22 extends is for example, lower than the temperature of the curing temperature of resinite 22 (40 DEG C～160 DEG C).Utilization in the space 26 being surrounded by a pair of pressing plate 23,25 and side plate 24 pressure forming that reduces pressure is below 5000Pa.The speed of pressing of pressing plate 23,25 is below above 0.06mm/ second 0.004mm/ second.For by pressing Speed Setting and become the reason of this scope, set forth in the back.
By in the operation shown in Fig. 2 (D), resinite 22 being extended, thereby by floor space 706.5mm
2～1962.5mm
2, height 5mm～30mm resinite 22 be configured as area 16900mm
2, thickness 0.1mm～3.5mm sealing resin sheet material 11.The first execution mode is preferably within the scope of this to be applied.
After the operation shown in Fig. 2 (D), remove the pressing force being produced by pressing plate 23,25, and make the space 26 being surrounded by pressing plate 23,25 and side plate 24 to atmosphere opening.Thus, manufacture as shown in Fig. 2 (E) on two sides with the sealing resin sheet material 11 of diaphragm 12.
In the operation of Fig. 2 (D), resinite 22 extends in heating, but its heating-up temperature is the temperature lower than the curing temperature of resinite 22, and the sealing resin sheet material 11 of formed thereby also keeps semi-cured state.Thereby, in the manufacture process (with reference to Figure 10) of electronic component module 200 that uses sealing resin sheet material 11, can when being embedded in to sealing resin sheet material 11, electronic devices and components seal.
How many resinites 22 can carried secretly under the state of some bubbles extends, but owing to now vacuumizing in space 26, therefore can make the masterpiece that outwards the sheds bubble for carrying secretly, thereby effectively remove bubble.
The speed of pressing of the pressing plate 23,25 when resinite 22 extends is below above 0.06mm/ second 0.004mm/ second.This speed of pressing can by mechanism pressurize servo 34 exactly set.Become this scope by pressing Speed Setting, thereby can reduce the bubble residuing in sealing resin sheet material 11.
Fig. 4 represents the figure of pressing plate 23,25 with respect to the relation between the number of bubbles of confirming in the speed of relatively pressing of resinite 22 and sealing resin sheet material 11.Sealing resin sheet material 1 is roughly manufactured by above-mentioned manufacture method.Bubble is for example, by the sealing resin sheet material 11 for after manufacturing (100 DEG C of temperature, pressure 200Pa) under heating reduced pressure atmosphere remarkableization of bubble to be measured.Number of bubbles is the 100mm of sealing resin sheet material 11
2the number of bubbles of the above size of diameter 0.1mm of middle existence.Sample number n=10.As shown in Figure 4, be 0.09mm/ second above in the situation that in the speed of pressing, number of bubbles on average has more than 4, and is below 0.06mm/ second in the situation that in the speed of pressing, and number of bubbles is stable to tail off.
Fig. 5 (A) is the surperficial photo of the sealing resin sheet material 11 while representing that speed is pressed in change to Fig. 5 (E).The area of each photo is 10000mm
2.Photo is for example, to make the figure after remarkableization of bubble for the sealing resin sheet material 11 after manufacturing (100 DEG C of temperature, pressure 200Pa) under heating reduced pressure atmosphere.In the situation that the speed of pressing is 0.45mm/ second, 0.225mm/ second, can identify on surface more bubble, in the situation that the speed of pressing is 0.06mm/ second, 0.009mm/ second, 0.0004mm/ second, number of bubbles reduces.
Known according to above-mentioned situation, if by the pressing in the scope of Speed Setting below above 0.06mm/ second 0.004mm/ second of pressing plate 23,25, can reduce the number of bubbles residuing in sealing resin sheet material 11.In addition, can stably export the speed of pressing of pressing force as the 0.004mm/ that the presses lower velocity limit value servomechanism 34 that is set as second pressurizeing.
With reference to Fig. 6, near the situation of periphery of the resinite 22 when resinite 22 extends is described.Fig. 6 (A) represents that the speed of pressing is the figure of the situation of 0.45mm/ second, and Fig. 6 (B) represents that the speed of pressing is the figure of the situation of 0.06mm/ second.
As shown in Fig. 6 (A) and Fig. 6 (B), when resinite 22 extends towards arrow e direction, can produce whirlpool w in the inside of resinite 22 of the near interface that is positioned at diaphragm 12.In Fig. 6 (A), because the speed of pressing is larger, therefore not in the periphery of resinite 22 and at slightly inner generation whirlpool w.Therefore, near the gas periphery of resinite 22 becomes entrained in whirlpool w and becomes bubble b, and bubble b remains in the inside of resinite 22.In contrast to this, in Fig. 6 (B), because the speed of pressing is less, therefore can produce whirlpool w in the periphery of resinite 22.Therefore, near the bubble b carrying secretly the periphery of resinite 22 passes through resinite 22 towards the expansion of arrow e direction and the movement of the whirlpool w thereupon producing, and is directed to the periphery front end of resinite 22.For the bubble b that is directed to periphery front end, act on the power of discharging towards outside by vacuumizing of vacuum mechanism 38 (with reference to Fig. 3), can suppress residual in the inside of resinite 22 of bubble b.
In addition, implement demoulding processing for the surface of the diaphragm 12 using in the first execution mode.By implementing demoulding processing, thereby have the effect of the skin-friction force that reduces diaphragm 12, sliding when therefore resinite 22 extends is better, can reduce carrying secretly of bubble b.And diaphragm 12 can be changed while manufacturing sealing resin sheet material 11 each, therefore need not consider the deteriorated of demoulding processing, the sliding mode can reproduce well resinite 22 and extend time.
In addition, according to the first execution mode, due to as long as prepare press device 30 and predetermined mould 20, therefore can not use expensive equipment and manufacture sealing resin sheet material 11.In addition, if use press device 30, can manufacture the sealing resin sheet material 11 that Film Thickness Ratio is larger by setting side plate 24.
The resin viscosity that is preferably the sealing resin sheet material 11 of manufacturing is 120Pas～1800Pas at the temperature of 60 DEG C.Viscosity is now the AR550 that uses TA Instruments company to produce, the value of measuring under the condition of tool sizes φ 8mm, mensuration thickness 550 μ m, frequency 1Hz, strain 0.1%.The thickness of sealing resin sheet material 11 is under two interareas at sealing resin sheet material 11 state with diaphragm 12, utilizes reflection-type laser displacement gauge to measure from the upper side and the value that obtains.Fig. 7 is the figure that represents the relation between resin viscosity and the thickness deviation of sealing resin sheet material 11, in the time that the resin viscosity of sealing resin sheet material 11 is 120Pas～1800Pas, the thickness deviation of sealing resin sheet material 11 is below 10 μ m, in contrast to this in the time that resin viscosity is 100Pas, thickness deviation is more than 15 μ m, more than thickness deviation when resin viscosity is 6000Pas even has 20 μ m.In addition, the thickness deviation of sealing resin sheet material 11 is the numerical value of 3 σ, sample number n=20.
In addition, Fig. 8 is the figure that represents an example of the relation between temperature and the viscosity of sealing resin sheet material 11.As shown in Figure 8, have a declining tendency if temperature uprises viscosity, in the time that temperature is 60 DEG C, viscosity is 1800Pas, and in the time that temperature is 120 DEG C, viscosity becomes 20Pas.Thereby, by improving temperature so that the viscosity of resin is dropped to for example 20Pas, and make its liquidation before sealing resin sheet material 11 solidifies, thereby as shown in Figure 10 (C), resin material can be filled between electronic devices and components and substrate.
[the second execution mode]
, to Fig. 9 (E) manufacture method of the related sealing resin sheet material 11 of the second execution mode is described with reference to Fig. 9 (A).The second execution mode is not use diaphragm 12 (with reference to Fig. 2) and the method for directly manufacturing sealing resin sheet material 11 between pressing plate 23,25.In addition, for the common structure of the first execution mode, create conditions, omit detailed explanation.In addition, press the press device 30 using in process identical with the first execution mode, description thereof is omitted.
As shown in Fig. 9 (A), prepare to have the columnar mould 20 at the end, liquid resin 21 is injected to mould 20, and become semi-cured state by heat treatment, to manufacture resinite 22.
As shown in Fig. 9 (B), prepare the pressing plate 23 for downside that sealing resin sheet material 11 is formed, at the outer circumferential side configuration side plate 24 of the interarea of pressing plate 23.Meanwhile, the central authorities in region interarea, that surrounded by side plate 24 of pressing plate 23, the resinite 22 of manufacturing in the operation of allocation plan 9 (A).Side plate 24 is members of the thickness of the sealing resin sheet material 11 for determining formed thereby.Wherein, in the second execution mode, owing to not using diaphragm 12, therefore without the thickness of considering diaphragm 12.In addition, implement to utilize the demoulding processing of silicones etc. for the surface of the pressing plate 23 connecting with resinite 22.
As shown in Fig. 9 (C), above resinite 22, configure the pressing plate 25 of upside, so that it is relative with the pressing plate 23 of configuration in Fig. 9 (B).Thus, become at a pair of pressing plate 23,25 by relative and be arranged at the state that disposes resinite 22 in the space 26 that the side plate 24 of side surrounds.In addition, also implement to utilize the demoulding processing of silicones etc. for the surface of the pressing plate 25 connecting with resinite 22.
As shown in Fig. 9 (D), by a pair of pressing plate 23,25 is moved towards direction close to each other, thereby the resinite 22 between pressing plate 23,25 extends along the face direction of pressing plate 23,25, and sealing resin sheet material 11 is formed.In the time that resinite 22 extends, resinite 22 is heated to the temperature lower than curing temperature.For a pair of pressing plate 23,25 by relative be arranged at the space 26 that the side plate 24 of side surrounds and vacuumize.The speed of pressing of pressing plate 23,25 is below above 0.06mm/ second 0.004mm/ second.
After the operation shown in Fig. 9 (D), remove the pressing force that pressing plate 23,25 produces, and the space 26 being surrounded by pressing plate 23,25 and side plate 24 is to atmosphere opening.Thus, manufacture the sealing resin sheet material 11 as shown in Fig. 9 (E).
Demoulding processing is implemented on surface for the pressing plate 23,25 using in the second execution mode.By implementing demoulding processing, thereby have the effect of the skin-friction force that reduces pressing plate 23,25, sliding when therefore resinite 22 extends is better, can reduce carrying secretly of bubble.
According to the second execution mode, can not use diaphragm 12 ground to manufacture sealing resin sheet material 11.Therefore, can manufacture more at an easy rate sealing resin sheet material 11.
Label declaration
11: sealing resin sheet material
12: diaphragm
20: mould
21: aqueous resin
22: resinite
23,25: pressing plate
24: side plate
31: compression plate
32: increased pressure board
33: heater
34: pressurization servomechanism
35: substrate plate
36: top board
37: pillar
38: vacuum mechanism
Claims (3)
1. a sealing resin sheet material manufacture method, for the multiple electronic devices and components that are equipped on substrate are carried out to insulated enclosure, is characterized in that having:
Resinite arrangement step, wherein will be configured in by relative a pair of pressing plate and be arranged in the space that the side plate of the outer circumferential side of described pressing plate surrounds as the resinite of the semi-cured state of the material of sealing resin sheet material; And
Extension operation, wherein will in the space of described encirclement, vacuumize, and the temperature with the curing temperature lower than described resinite heats described resinite, and utilize described pressing plate with the speed of pressing below above 0.06mm/ second 0.004mm/ second, described resinite to be pressed so that its extension.
2. sealing resin sheet material manufacture method as claimed in claim 1, is characterized in that,
In described resinite arrangement step, between described resinite and described pressing plate, insert the diaphragm of having implemented demoulding processing,
In described extension operation, press described resinite so that it extends in the face direction of described diaphragm.
3. sealing resin sheet material manufacture method as claimed in claim 1, is characterized in that,
Described pressing plate is implemented to demoulding processing,
In described extension operation, press described resinite so that it extends in the face direction of described pressing plate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012045575 | 2012-03-01 | ||
| JP2012-045575 | 2012-03-01 | ||
| PCT/JP2013/054749 WO2013129307A1 (en) | 2012-03-01 | 2013-02-25 | Method for manufacturing sealing resin sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104160492A true CN104160492A (en) | 2014-11-19 |
| CN104160492B CN104160492B (en) | 2017-02-08 |
Family
ID=49082505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380011555.XA Active CN104160492B (en) | 2012-03-01 | 2013-02-25 | Method for manufacturing sealing resin sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5854125B2 (en) |
| CN (1) | CN104160492B (en) |
| TW (1) | TWI483830B (en) |
| WO (1) | WO2013129307A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867797A (en) * | 2017-12-15 | 2020-10-30 | 西部制药服务有限公司 | Smooth film laminated elastomeric articles |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6143665B2 (en) * | 2013-12-26 | 2017-06-07 | Ｔｏｗａ株式会社 | Semiconductor sealing method and semiconductor sealing device |
| TWI656007B (en) * | 2017-12-28 | 2019-04-11 | 綠點高新科技股份有限公司 | A method for manufacturing a housing module and mold thereof and housing module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1424191A (en) * | 2001-11-30 | 2003-06-18 | 山田尖端技术株式会社 | Compression moulding machines |
| JP2006256195A (en) * | 2005-03-18 | 2006-09-28 | Towa Corp | Compression-molding method of electronic component and resin material |
| JP2009166415A (en) * | 2008-01-18 | 2009-07-30 | Sumitomo Heavy Ind Ltd | Resin for compression molding, resin sealing apparatus and resin sealing method |
| JP2010040939A (en) * | 2008-08-07 | 2010-02-18 | Sumitomo Heavy Ind Ltd | Preforming metal mold, preforming device, preforming method, and preforming resin |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06291158A (en) * | 1993-03-31 | 1994-10-18 | Toshiba Corp | Method and device for manufacturing semiconductor |
| JPH08172146A (en) * | 1994-12-16 | 1996-07-02 | Toshiba Chem Corp | Method for manufacturing sheet-shaped resin for sealing semiconductor |
| JPH0966523A (en) * | 1995-08-30 | 1997-03-11 | Toshiba Chem Corp | Manufacture of semiconductor sealing resin molding |
| JP3397743B2 (en) * | 1996-07-12 | 2003-04-21 | 富士通株式会社 | Semiconductor device |
| JP3495913B2 (en) * | 1998-05-28 | 2004-02-09 | シャープ株式会社 | Resin sheet for mounting semiconductor devices |
| JP2003165130A (en) * | 2001-11-30 | 2003-06-10 | Apic Yamada Corp | Mold opening/closing control mechanism for compression molding machine and method for controlling mold opening/closing |
| JP4855329B2 (en) * | 2007-05-08 | 2012-01-18 | Ｔｏｗａ株式会社 | Electronic component compression molding method and apparatus |
| JP5382693B2 (en) * | 2009-02-04 | 2014-01-08 | アピックヤマダ株式会社 | Compression molding method |
| JP2011086745A (en) * | 2009-10-15 | 2011-04-28 | Sanyu Rec Co Ltd | Resin sealing method of electronic component |
| JP4935957B1 (en) * | 2010-11-17 | 2012-05-23 | 株式会社村田製作所 | Manufacturing method of resin sheet for sealing |
-
2013
- 2013-02-25 WO PCT/JP2013/054749 patent/WO2013129307A1/en active Application Filing
- 2013-02-25 CN CN201380011555.XA patent/CN104160492B/en active Active
- 2013-02-25 JP JP2014502204A patent/JP5854125B2/en active Active
- 2013-03-01 TW TW102107366A patent/TWI483830B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1424191A (en) * | 2001-11-30 | 2003-06-18 | 山田尖端技术株式会社 | Compression moulding machines |
| JP2006256195A (en) * | 2005-03-18 | 2006-09-28 | Towa Corp | Compression-molding method of electronic component and resin material |
| JP2009166415A (en) * | 2008-01-18 | 2009-07-30 | Sumitomo Heavy Ind Ltd | Resin for compression molding, resin sealing apparatus and resin sealing method |
| JP2010040939A (en) * | 2008-08-07 | 2010-02-18 | Sumitomo Heavy Ind Ltd | Preforming metal mold, preforming device, preforming method, and preforming resin |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111867797A (en) * | 2017-12-15 | 2020-10-30 | 西部制药服务有限公司 | Smooth film laminated elastomeric articles |
| US11325367B2 (en) | 2017-12-15 | 2022-05-10 | West Pharmaceutical Services, Inc. | Smooth film laminated elastomer articles |
| CN111867797B (en) * | 2017-12-15 | 2022-05-17 | 西部制药服务有限公司 | Smooth film laminated elastomeric articles |
| US11945204B2 (en) | 2017-12-15 | 2024-04-02 | West Pharmaceutical Services, Inc. | Smooth film laminated elastomer articles |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104160492B (en) | 2017-02-08 |
| WO2013129307A1 (en) | 2013-09-06 |
| JPWO2013129307A1 (en) | 2015-07-30 |
| JP5854125B2 (en) | 2016-02-09 |
| TW201343368A (en) | 2013-11-01 |
| TWI483830B (en) | 2015-05-11 |
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