WO2013054677A1 - Method for producing sealing resin sheet - Google Patents

Method for producing sealing resin sheet Download PDF

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Publication number
WO2013054677A1
WO2013054677A1 PCT/JP2012/075365 JP2012075365W WO2013054677A1 WO 2013054677 A1 WO2013054677 A1 WO 2013054677A1 JP 2012075365 W JP2012075365 W JP 2012075365W WO 2013054677 A1 WO2013054677 A1 WO 2013054677A1
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WO
WIPO (PCT)
Prior art keywords
resin sheet
pressure plate
sealing resin
sealing
protective film
Prior art date
Application number
PCT/JP2012/075365
Other languages
French (fr)
Japanese (ja)
Inventor
有彌 井田
裕樹 北山
彰夫 勝部
渡部　浩司
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201280050200.7A priority Critical patent/CN103946004A/en
Publication of WO2013054677A1 publication Critical patent/WO2013054677A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a method for producing a sealing resin sheet for sealing electronic components mounted on a substrate.
  • An electronic component module in which an electronic component is mounted on a substrate has a sealing resin layer that seals the electronic component mounted on the substrate in order to protect the electronic component from heat, humidity, and the like.
  • a liquid resin is applied to a substrate on which an electronic component is mounted, and the applied resin is heated and pressurized.
  • a sealing resin in a semi-cured state on the substrate on which the electronic component is mounted There is a method of placing a sheet and heating and pressurizing the placed resin sheet for sealing.
  • FIG. 11 is a schematic view showing a method for manufacturing an electronic component module in which a sealing resin layer is formed using a sealing resin sheet.
  • a circuit pattern 91 is formed by etching a Cu foil or the like attached on the support layer 90 as an electrode.
  • a conductive adhesive 92 is applied to a predetermined position of the circuit pattern 91, an electronic component 93 is mounted on the conductive adhesive 92, and placed in an oven to cure the conductive adhesive 92.
  • FIG. 11B another support in which a circuit pattern 95 is formed on the surface with a semi-cured sealing resin sheet 94 interposed between the support layer 90 and the electronic component 93 mounting side.
  • the layer 96 is pressure-bonded, and the semi-cured sealing resin sheet 94 is temporarily cured.
  • the electronic component 93 is embedded in the sealing resin sheet 94 by pressure bonding, and the circuit patterns 91 and 95 are in close contact with the front and back surfaces of the sealing resin sheet 94.
  • the support layers 90 and 96 are peeled off from the temporarily cured sealing resin sheet 94.
  • the electronic component module is manufactured through a process of curing the temporarily cured sealing resin sheet 94 and forming a sealing resin layer.
  • FIG. 12 is a schematic diagram illustrating a method for producing a sealing resin sheet disclosed in Patent Document 1.
  • a liquid epoxy resin composition (resin) 102 to the upper surface of a support film (protective film) 103 by a coating apparatus 101, and making the applied epoxy resin composition 102 semi-cured.
  • the release film 105 fed out from the release film roller 104 is overlaid on the upper surface of the epoxy resin composition 102 and pressed by the pressure roller 106 to produce a sealing resin sheet.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide a method for producing a sealing resin sheet in which bubbles are hardly generated on the surface.
  • a method for producing a sealing resin sheet according to the present invention is a method for producing an encapsulating resin sheet for sealing an electronic component mounted on a substrate.
  • the first step of forming a resin body that does not contain a solvent in a semi-cured state by heat treatment supplying the formed resin body to one surface of the first pressure plate and heating at a temperature lower than the curing temperature
  • a second step of forming the sealing resin sheet containing no solvent by sandwiching and pressing between the first pressure plate and the second pressure plate, stretching in the plane direction of the first pressure plate and the second pressure plate It is characterized by including.
  • a liquid resin not containing a solvent is put in a mold, and is semi-cured by heat treatment to form a resin body that does not contain a solvent.
  • the formed semi-cured resin body is supplied to one surface of the first pressure plate, heated at a temperature lower than the curing temperature, and pressed between the first pressure plate and the second pressure plate.
  • the first pressure plate and the second pressure plate are stretched in the planar direction to form a sealing resin sheet that does not contain a solvent. Since the resin body does not contain a solvent, there is no possibility that the solvent is vaporized in the process of manufacturing the sealing resin sheet. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
  • a method for manufacturing a sealing resin sheet according to the present invention includes a sealing resin sheet manufacturing method for sealing an electronic component mounted on a substrate.
  • the resin supplied to one surface of the first pressure plate surrounded by the outer frame is heated at a temperature at which it is in a semi-cured state, and is sandwiched and pressed between the first pressure plate and the second pressure plate,
  • a second step of forming the sealing resin sheet containing no solvent is
  • an outer frame that forms the outer edge of the sealing resin sheet is disposed on one surface of the first pressure plate, and a liquid resin that does not contain a solvent on one surface of the first pressure plate surrounded by the disposed outer frame.
  • the liquid resin supplied to one surface of the first pressure plate is heated at a temperature at which it is in a semi-cured state, sandwiched between the first pressure plate and the second pressure plate and pressurized, and sealed without containing a solvent.
  • a stopping resin sheet is formed. Since the solvent is not included in the liquid resin heated at the temperature at which the semi-cured state is obtained, there is no possibility that the solvent is vaporized in the process of manufacturing the sealing resin sheet. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
  • the resin body does not contain a solvent, there is no possibility that the solvent is vaporized in the manufacturing process of the sealing resin sheet. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
  • the solvent is not included in the liquid resin heated at a temperature at which the resin is in a semi-cured state, there is no possibility that the solvent is vaporized in the manufacturing process of the sealing resin sheet. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
  • Embodiment 1 of the present invention It is an illustration figure of the image which shows the state of the surface of the resin sheet for sealing manufactured with the manufacturing method of the resin sheet for sealing (with a protective film) concerning Embodiment 1 of the present invention. It is the schematic which shows a part of manufacturing process in the case of using the pressure plate (2nd pressure plate) of another structure for manufacture of the resin sheet for sealing (with a protective film) which concerns on Embodiment 1 of this invention. . It is the schematic which shows a part of manufacturing process in the case of using the pressure plate (1st pressure plate) of another structure for manufacture of the resin sheet for sealing (with a protective film) which concerns on Embodiment 1 of this invention. .
  • FIG. 1 is a schematic diagram showing a configuration of a sealing resin sheet (with a protective film) according to Embodiment 1 of the present invention.
  • a sealing resin sheet (with a protective film) 3 includes a sealing resin sheet 1 and protective films 2 provided on both surfaces of the sealing resin sheet 1.
  • the sealing resin sheet 1 is a resin sheet for sealing an electronic component mounted on a substrate, and is a semi-cured thermosetting resin (for example, epoxy resin).
  • the sealing resin sheet 1 is provided with protective films 2 on both sides for easy handling.
  • the protective film 2 may be made of a resin material that can withstand the curing temperature of the sealing resin sheet 1.
  • the protective film 2 is in the form of a film or a thin sheet, and is, for example, PET (polyethylene terephthalate), PTFE (polytetrafluoroethylene), or the like. In addition, it is not limited to the structure which provided the protective film 2 on both surfaces of the resin sheet 1 for sealing, You may provide the protective film 2 only on one side (at least one surface). Moreover, the resin sheet for sealing which provided the conductor layer can also be manufactured by forming the protective film 2 as a conductor layer using the material which has electroconductivity.
  • FIG. 2 is a schematic view showing a method for producing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention.
  • a cylindrical mold 20 is prepared, a liquid resin 21 is put into the mold 20, and a resin body 22 is formed in a semi-cured state by heat treatment.
  • the liquid resin 21 is an epoxy resin and does not contain a solvent.
  • the thickness of the formed resin body 22 is larger than the film thickness of the sealing resin sheet 1 constituting the sealing resin sheet (with protective film) 3 to be manufactured.
  • the resin body 22 may be formed with a vertically long cylindrical mold 20 and cut to form the resin body 22 having a desired thickness.
  • the heat treatment for making the liquid resin 21 in a semi-cured state varies depending on the material of the liquid resin 21, for example, heating in an oven or the like at 40 ° C. to 160 ° C. for 5 minutes to 120 minutes.
  • a pressure plate (first pressure plate) 23 is prepared, and the thickness of the sealing resin sheet (with a protective film) 3 is adjusted on one surface of the pressure plate 23.
  • the protective film 2 is placed on one surface of the pressure plate 23 surrounded by the arranged spacers 24.
  • the protective film 2 and the spacer 24 are subjected to release treatment on the surface in contact with the sealing resin sheet 1 so that the protective film 2 and the spacer 24 can be separated from the sealing resin sheet 1 after manufacturing.
  • a release treatment is performed on the pressure plate 23 and the spacer 24.
  • the material used for the pressure plate 23 and the spacer 24 may be stainless steel (SUS), aluminum (Al), PET, PTFE, or the like as long as the shape can be maintained even when pressed.
  • a resin body 22 that does not contain a solvent is supplied to the substantially central portion of the protective film 2 placed on one surface of the pressure plate 23.
  • the thickness of the resin body 22 is larger than the height of the spacer 24.
  • the protective film 2 is placed on the resin body 22.
  • the protective film 2 placed on the resin body 22 has the same shape and the same material as the protective film 2 placed on one surface of the pressure plate 23, but the protective film 2 placed on one surface of the pressure plate 23 Different shapes or different materials may be used.
  • the protective film 2 placed on the resin body 22 is also subjected to mold release treatment so that it can be separated from the sealing resin sheet 1 after production.
  • the resin body 22 is heated at a temperature lower than the curing temperature (for example, 160 ° C.) (heating time is 120 minutes or less), and the pressure plate 23 and the pressure plate (second By being sandwiched between the pressure plates 25 and pressed, the pressure plates 23 and 25 are stretched in the plane direction to produce a semi-cured sealing resin sheet (with a protective film) 3.
  • the manufactured sealing resin sheet (with protective film) 3 was heated from 50 ° C. to 350 ° C., and the gas considered to be derived from the solvent was extracted by heat and analyzed by GC-MS (gas chromatograph mass spectrometer).
  • the gas considered to be derived from the solvent is below the detection limit, and it is confirmed that the produced sealing resin sheet (with protective film) 3 does not contain the solvent.
  • GC-MS Agilent 7890A / 5975C GC / MSD system manufactured by Agilent Technologies was used.
  • the two pressure plates 23 and 25 also sandwich the spacer 24 for adjusting the film thickness of the sealing resin sheet (with protective film) 3, so that the sealing resin sheet (with protective film) 3 Until the film thickness becomes the same as the height of the spacer 24, the resin body 22 can be sandwiched and pressed by the two pressure plates 23, 25, and the sealing resin sheet with a uniform film thickness (with protective film) 3 can be manufactured.
  • the pressure plate 25 has the same shape as the pressure plate 23 and is the same material, but may have a different shape from the pressure plate 23 or a different material.
  • the protective resin sheet 1 is not provided on the sealing resin sheet 1, the pressure plate 25 is subjected to a release treatment so that it can be separated from the sealing resin sheet 1 after manufacturing.
  • the resin body 22 can be stretched until it contacts the spacer 24. And since the outer edge of the resin sheet 1 for sealing can be formed with the spacer 24, it is not necessary to cut
  • FIG. 3 is a schematic diagram showing the configuration of a vacuum press used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention.
  • the vacuum press 30 shown in FIG. 3 includes a resin body 22 and a spacer 24 sandwiched between two protective films 2, sandwiched between two pressure plates 23 and 25, and sandwiched between two press plates 31. 22 is pressurized.
  • the vacuum press 30 can create a vacuum state (for example, 5000 Pa or less). By pressurizing the resin body 22 in a vacuum state, the problem that bubbles enter the sealing resin sheet 1 does not occur.
  • the sealing resin sheet (with protective film) 3 can be manufactured by releasing the air from the vacuum state to the atmosphere and taking out the resin body 22 that has been pressurized and stretched from the vacuum press machine 30 after cooling.
  • a press that pressurizes in the atmospheric state instead of the vacuum press 30 may be used.
  • the resin body 22 can be pressurized while the film thickness is adjusted by the vacuum press machine 30, it is not necessary to sandwich the spacer 24 between the two pressure plates 23 and 25.
  • FIG. 4 is a schematic view showing a configuration of another pressurizing means used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention.
  • the pressurizing means shown in FIG. 4 includes a resin body 22 and a spacer 24 sandwiched between two protective films 2, sandwiched between two pressurizing plates 23 and 25, and a laminated pack (bag) 40 having gas barrier properties. Then, the inside of the laminate pack 40 is decompressed and sealed with a decompression pack device (not shown). A pressure is applied to the resin body 22 in the laminated pack 40 that has been decompressed and sealed from the outside of the laminated pack 40, and further heat is applied.
  • the manufacturing cost of the sealing resin sheet (with a protective film) 3 can be suppressed as compared with the case where the expensive vacuum press 30 is used. Further, since the resin body 22 sandwiched between the two pressure plates 23 and 25 is put in a laminate pack 40 having gas barrier properties, and the inside of the laminate pack 40 is sealed by reducing the pressure, bubbles are generated in the sealing resin sheet 1. The trouble of entering does not occur. Furthermore, it becomes possible to cool the resin body 22 in the laminated pack 40 sealed under reduced pressure while applying pressure, and the shape of the sealing resin sheet (with a protective film) 3 can be maintained.
  • FIG. 5 is an illustration of an image showing the state of the surface of the sealing resin sheet 94 manufactured by a conventional manufacturing method
  • FIG. 6 shows the sealing resin sheet (protection) according to Embodiment 1 of the present invention. It is an illustration figure of the image which shows the state of the surface of the resin sheet 1 for sealing manufactured with the manufacturing method of 3 with a film
  • FIG. 5 countless small bubble marks are generated on the surface of the sealing resin sheet 94 manufactured by applying a liquid resin containing a solvent.
  • FIG. 6 it is clear that almost no bubble marks are generated on the surface of the sealing resin sheet 1 manufactured by pressurizing the resin body 22 containing no solvent.
  • the resin body 22 does not contain a solvent, there is no possibility that the solvent is vaporized in the manufacturing process of the sealing resin sheet 1. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet 1, and the electronic component can be hermetically sealed.
  • a liquid epoxy resin composition (resin) 102 is applied to the upper surface of the support film 103 that has been subjected to the mold release treatment.
  • a liquid epoxy resin composition 102 containing a solvent and a leveling agent such as silicone oil is used.
  • the liquid epoxy resin composition 102 contains a leveling agent, the foam breaking property is deteriorated, and bubbles are likely to stay in the resin.
  • the sealing resin sheet (with protective film) 3 according to the first embodiment since the resin body 22 contains neither a solvent nor a leveling agent, there is a possibility that bubbles may stay in the resin. Lower.
  • FIG. 7 shows a manufacturing process when a pressure plate (second pressure plate) of another configuration is used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention. It is the schematic which shows a part.
  • a resin body sandwiched between two protective films 2 by a flat pressure plate 23 and a convex pressure plate 25 a fitted to a spacer 24 arranged on one surface of the pressure plate 23. 22 and the spacer 24 are sandwiched.
  • the convex pressure plate 25a the resin body 22 can be further pressurized, and a high-density sealing resin sheet (with a protective film) 3 can be manufactured.
  • FIG. 8 shows a manufacturing process when a pressure plate (first pressure plate) of another configuration is used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention. It is the schematic which shows a part. As shown in FIG. 8, a resin body 22 sandwiched between two protective films 2 is sandwiched between a pressure plate 23 a integrally formed with a spacer 24 and a pressure plate 23 and a flat pressure plate 25. The process of disposing the spacer 24 on one surface of the pressure plate 23 becomes unnecessary, and the manufacturing cost of the sealing resin sheet (with a protective film) 3 can be suppressed.
  • the protective film 2 is mounted along the shape of the pressure plate 23a and the pressure plate 25, the pressure plate 23a and the pressure plate 25 and the resin body 22 are not in direct contact. Therefore, it is not necessary to perform a mold release process on the pressure plate 23a and the pressure plate 25 so that it can be separated from the sealing resin sheet 1 after manufacturing.
  • the thickness of the sealing resin sheet (with protective film) 3 depends on the depth of the recess formed in the pressure plate 23a formed by integrally molding the spacer 24 and the pressure plate 23, regardless of the thickness of the protective film 2. Can be adjusted.
  • FIG. 9 is a schematic view showing a part of the manufacturing process when the arrangement of the spacers 24 used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention is changed. is there.
  • the resin bodies 22 and the spacers 24 sandwiched between the two protective films 2 are sandwiched between two flat pressure plates 23 and 25.
  • the spacer 24 is disposed on the protective film 2 placed on one surface of the pressure plate 23. Since the spacer 24 is disposed on the protective film 2 placed on one surface of the pressure plate 23, the pressure plate 23 and the spacer 24 can be easily separated.
  • FIG. 10 is a schematic diagram showing a method for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 2 of the present invention.
  • a pressure plate (first pressure plate) 81 is prepared, and an outer frame that forms the outer edge of the sealing resin sheet (with a protective film) 3 on one surface of the pressure plate 81.
  • the protective film 2 is placed on one surface of the pressure plate 81 surrounded by the arranged outer frame 82.
  • the protective film 2 and the outer frame 82 are subjected to a mold release process so that they can be separated from the sealing resin sheet 1 after being manufactured.
  • a release treatment is performed on the pressure plate 81 and the outer frame 82.
  • the material used for the pressure plate 81 and the outer frame 82 may be stainless steel (SUS), aluminum (Al), PET, PTFE, or the like as long as the shape can be maintained even when pressed.
  • a liquid resin 83 is supplied to one surface of the pressure plate 81 surrounded by the arranged outer frame 82 with a dispenser or the like.
  • the liquid resin 83 is an epoxy resin and does not contain a solvent.
  • the protective film 2 is placed on the liquid resin 83 supplied to one surface of the pressure plate 81.
  • the protective film 2 placed on the liquid resin 83 has the same shape and the same material as the protective film 2 placed on one surface of the pressure plate 81, but the protective film 2 placed on one surface of the pressure plate 81. Different shapes or different materials may be used.
  • the liquid resin 83 sandwiched between the two protective films 2 is heated at a temperature at which it becomes a semi-cured state (for example, 160 ° C.) (heating time is 120 minutes or less). Then, the resin sheet for sealing (with protective film) 3 in a semi-cured state is manufactured by sandwiching and pressing between the pressure plate 81 and the pressure plate (second pressure plate) 84. By performing the same analysis as in the first embodiment, it is confirmed that the produced sealing resin sheet (with protective film) 3 does not contain a solvent. Since the outer frame 82 arranged on one surface of the pressure plate 81 also functions as the spacer 24 for adjusting the film thickness of the sealing resin sheet (with protective film) 3, the height of the outer frame 82 is changed.
  • the pressure plate 84 has the same shape as the pressure plate 81 and is made of the same material, but may have a different shape from the pressure plate 81 or a different material.
  • the pressurizing unit that pressurizes the liquid resin 83 with the two pressurizing plates 81 and 84 the same pressurizing unit as that of the first embodiment (for example, the vacuum press machine 30, the laminate pack 40 and the decompression pack apparatus) is used. Can be used.
  • the manufacturing method of the sealing resin sheet 1 according to Embodiment 2 of the present invention arranges the outer frame 82 that forms the outer edge of the sealing resin sheet 1 on one surface of the pressure plate 81, Arranged outer frame 8
  • the liquid resin 83 containing no solvent is supplied to one surface of the pressure plate 81 surrounded by 2, and the liquid resin 83 supplied to one surface of the pressure plate 81 is heated at a temperature at which it is in a semi-cured state.
  • the pressurizing plate 84 to pressurize, there is no possibility that the solvent is vaporized in the process of manufacturing the sealing resin sheet 1. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet 1, and the electronic component can be hermetically sealed.
  • Resin sheet for sealing 2
  • Protective film 3 Resin sheet for sealing (with protective film) 20 molds 21, 83 liquid resin 22 resin bodies 23, 23a, 81 pressure plate (first pressure plate) 24 Spacer 25, 25a, 84 Pressure plate (second pressure plate) 30 Vacuum press machine 31 Press plate 40 Laminate pack 82 Outer frame

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

Provided is a method for producing a sealing resin sheet whereby bubble trails are less likely to occur on the surface. A liquid resin (21) containing no solvent is placed in a mold (20) and brought to a semi-cured state by heat treatment to form a resin body (22) containing no solvent. The formed resin body (22) is supplied to one side of a first pressure plate (23), heated at a temperature lower than the curing temperature, compressed while clamped between the first pressure plate (23) and a second pressure plate (25), and stretched in the direction of the plane of the first pressure plate (23) and the second pressure plate (25), to form a sealing resin sheet (1) containing no solvent.

Description

封止用樹脂シートの製造方法Manufacturing method of resin sheet for sealing
　基板に実装した電子部品を封止する封止用樹脂シートを製造する方法に関する。 The present invention relates to a method for producing a sealing resin sheet for sealing electronic components mounted on a substrate.
　基板に電子部品を実装した電子部品モジュールは、熱、湿度等から電子部品を保護するために、基板に実装した電子部品を封止する封止樹脂層を形成してある。封止樹脂層を形成する方法としては、電子部品を実装した基板に液状の樹脂を塗布し、塗布した樹脂を加熱及び加圧する方法、電子部品を実装した基板に半硬化状態の封止用樹脂シートを載置し、載置した封止用樹脂シートを加熱及び加圧する方法等がある。 An electronic component module in which an electronic component is mounted on a substrate has a sealing resin layer that seals the electronic component mounted on the substrate in order to protect the electronic component from heat, humidity, and the like. As a method for forming the sealing resin layer, a liquid resin is applied to a substrate on which an electronic component is mounted, and the applied resin is heated and pressurized. A sealing resin in a semi-cured state on the substrate on which the electronic component is mounted There is a method of placing a sheet and heating and pressurizing the placed resin sheet for sealing.
　図１１は、封止用樹脂シートを用いて封止樹脂層を形成する電子部品モジュールの製造方法を示す概略図である。図１１（ａ）に示すように、電極として支持層９０上に貼り付けられているＣｕ箔などをエッチングし、回路パターン９１を形成する。回路パターン９１の所定の位置に導電性接着剤９２を塗布し、導電性接着剤９２の上に電子部品９３を搭載し、オーブンに投入して導電性接着剤９２を硬化させる。次に、図１１（ｂ）に示すように、支持層９０の電子部品９３搭載側に、半硬化状態の封止用樹脂シート９４を間にして、表面に回路パターン９５を形成した別の支持層９６を圧着し、半硬化状態の封止用樹脂シート９４を仮硬化させる。圧着によって、電子部品９３が封止用樹脂シート９４に埋設されるとともに、回路パターン９１、９５が封止用樹脂シート９４の表裏面に密着する。次に、図１１（ｃ）に示すように、封止用樹脂シート９４の熱圧着後、支持層９０、９６を仮硬化状態の封止用樹脂シート９４から剥離する。その後、仮硬化状態の封止用樹脂シート９４を硬化させて封止樹脂層を形成する工程等を経て電子部品モジュールを製造する。 FIG. 11 is a schematic view showing a method for manufacturing an electronic component module in which a sealing resin layer is formed using a sealing resin sheet. As shown in FIG. 11A, a circuit pattern 91 is formed by etching a Cu foil or the like attached on the support layer 90 as an electrode. A conductive adhesive 92 is applied to a predetermined position of the circuit pattern 91, an electronic component 93 is mounted on the conductive adhesive 92, and placed in an oven to cure the conductive adhesive 92. Next, as shown in FIG. 11B, another support in which a circuit pattern 95 is formed on the surface with a semi-cured sealing resin sheet 94 interposed between the support layer 90 and the electronic component 93 mounting side. The layer 96 is pressure-bonded, and the semi-cured sealing resin sheet 94 is temporarily cured. The electronic component 93 is embedded in the sealing resin sheet 94 by pressure bonding, and the circuit patterns 91 and 95 are in close contact with the front and back surfaces of the sealing resin sheet 94. Next, as illustrated in FIG. 11C, after the thermocompression bonding of the sealing resin sheet 94, the support layers 90 and 96 are peeled off from the temporarily cured sealing resin sheet 94. Thereafter, the electronic component module is manufactured through a process of curing the temporarily cured sealing resin sheet 94 and forming a sealing resin layer.
　封止用樹脂シートを用いて封止樹脂層を形成する場合、電子部品を実装した基板に載置する封止用樹脂シートを予め製造しておく必要がある。従来の封止用樹脂シートを製造する方法が、特許文献１に開示してある。図１２は、特許文献１に開示された封止用樹脂シートの製造方法を示す概略図である。図１２に示すように、塗布装置１０１によって液状のエポキシ樹脂組成物（樹脂）１０２を支持フィルム（保護膜）１０３の上面に塗布し、塗布したエポキシ樹脂組成物１０２を半硬化状態にした後、離型フィルムローラ１０４から繰り出した離型フィルム１０５をエポキシ樹脂組成物１０２の上面に重ねて、押圧ローラ１０６により押圧することで封止用樹脂シートを製造する。 When forming a sealing resin layer using a sealing resin sheet, it is necessary to manufacture in advance a sealing resin sheet to be placed on a substrate on which electronic components are mounted. A conventional method for producing a sealing resin sheet is disclosed in Patent Document 1. FIG. 12 is a schematic diagram illustrating a method for producing a sealing resin sheet disclosed in Patent Document 1. As shown in FIG. 12, after applying a liquid epoxy resin composition (resin) 102 to the upper surface of a support film (protective film) 103 by a coating apparatus 101, and making the applied epoxy resin composition 102 semi-cured, The release film 105 fed out from the release film roller 104 is overlaid on the upper surface of the epoxy resin composition 102 and pressed by the pressure roller 106 to produce a sealing resin sheet.
特開２００９－２９９３０号公報JP 2009-29930 A
　しかし、特許文献１に開示してある封止用樹脂シートの製造方法では、エポキシ樹脂組成物１０２を支持フィルム１０３の上面に塗布して広げるため、エポキシ樹脂組成物１０２に希釈剤としてアルコール、エステル等の溶剤が含まれている。溶剤を含んだエポキシ樹脂組成物１０２を加熱して乾燥させた場合、溶剤が気化し、完成した封止用樹脂シートの表面には無数の気泡跡が発生する。封止用樹脂シートの表面に気泡跡が発生した場合、気泡跡の存在により、電子部品を気密封止することができなくなるという問題点があった。 However, in the method for producing a sealing resin sheet disclosed in Patent Document 1, since the epoxy resin composition 102 is spread on the upper surface of the support film 103, alcohol, ester as a diluent is added to the epoxy resin composition 102. And other solvents. When the epoxy resin composition 102 containing a solvent is heated and dried, the solvent is vaporized, and countless bubble traces are generated on the surface of the completed sealing resin sheet. When bubble marks are generated on the surface of the sealing resin sheet, there is a problem in that the electronic components cannot be hermetically sealed due to the presence of the bubble marks.
　本発明は斯かる事情に鑑みてなされたものであり、表面に気泡跡が発生しにくい封止用樹脂シートの製造方法を提供することを目的とする。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a method for producing a sealing resin sheet in which bubbles are hardly generated on the surface.
　上記目的を達成するために本発明に係る封止用樹脂シートの製造方法は、基板に実装した電子部品を封止する封止用樹脂シートの製造方法において、溶剤を含まない液状の樹脂を型に入れ、熱処理で半硬化状態にして溶剤を含まない樹脂体を形成する第１工程と、形成した前記樹脂体を第１加圧板の一面に供給して硬化温度より低い温度で加熱し、前記第１加圧板と第２加圧板とで挟持して加圧し、前記第１加圧板及び前記第２加圧板の平面方向に引き伸ばし、溶剤を含まない前記封止用樹脂シートを形成する第２工程とを含むことを特徴とする。 In order to achieve the above object, a method for producing a sealing resin sheet according to the present invention is a method for producing an encapsulating resin sheet for sealing an electronic component mounted on a substrate. In the first step of forming a resin body that does not contain a solvent in a semi-cured state by heat treatment, supplying the formed resin body to one surface of the first pressure plate and heating at a temperature lower than the curing temperature, A second step of forming the sealing resin sheet containing no solvent by sandwiching and pressing between the first pressure plate and the second pressure plate, stretching in the plane direction of the first pressure plate and the second pressure plate It is characterized by including.
　上記構成では、溶剤を含まない液状の樹脂を型に入れ、熱処理で半硬化状態にして溶剤を含まない樹脂体を形成する。形成した半硬化状態の樹脂体を第１加圧板の一面に供給して硬化温度より低い温度で加熱し、第１加圧板と第２加圧板とで挟持して加圧する。加圧することにより第１加圧板及び第２加圧板の平面方向に引き伸ばし、溶剤を含まない封止用樹脂シートを形成する。樹脂体に溶剤を含まないので、封止用樹脂シートの製造過程において溶剤が気化する可能性がない。したがって、封止用樹脂シートの表面に気泡跡が発生しにくく、電子部品を気密封止することが可能となる。 In the above configuration, a liquid resin not containing a solvent is put in a mold, and is semi-cured by heat treatment to form a resin body that does not contain a solvent. The formed semi-cured resin body is supplied to one surface of the first pressure plate, heated at a temperature lower than the curing temperature, and pressed between the first pressure plate and the second pressure plate. By applying pressure, the first pressure plate and the second pressure plate are stretched in the planar direction to form a sealing resin sheet that does not contain a solvent. Since the resin body does not contain a solvent, there is no possibility that the solvent is vaporized in the process of manufacturing the sealing resin sheet. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
　次に、上記目的を達成するために本発明に係る封止用樹脂シートの製造方法は、基板に実装した電子部品を封止する封止用樹脂シートの製造方法において、第１加圧板の一面に、前記封止用樹脂シートの外縁を形成する外枠を配置し、配置した前記外枠で囲まれた前記第１加圧板の一面に溶剤を含まない液状の樹脂を供給する第１工程と、前記外枠で囲まれた前記第１加圧板の一面に供給した前記樹脂を、半硬化状態となる温度で加熱し、前記第１加圧板と第２加圧板とで挟持して加圧し、溶剤を含まない前記封止用樹脂シートを形成する第２工程とを含むことを特徴とする。 Next, in order to achieve the above object, a method for manufacturing a sealing resin sheet according to the present invention includes a sealing resin sheet manufacturing method for sealing an electronic component mounted on a substrate. A first step of disposing an outer frame forming an outer edge of the sealing resin sheet and supplying a liquid resin not containing a solvent to one surface of the first pressure plate surrounded by the arranged outer frame; The resin supplied to one surface of the first pressure plate surrounded by the outer frame is heated at a temperature at which it is in a semi-cured state, and is sandwiched and pressed between the first pressure plate and the second pressure plate, And a second step of forming the sealing resin sheet containing no solvent.
　上記構成では、第１加圧板の一面に、封止用樹脂シートの外縁を形成する外枠を配置し、配置した外枠で囲まれた第１加圧板の一面に溶剤を含まない液状の樹脂を供給し、第１加圧板の一面に供給した液状の樹脂を、半硬化状態となる温度で加熱し、第１加圧板と第２加圧板とで挟持して加圧し、溶剤を含まない封止用樹脂シートを形成する。半硬化状態となる温度で加熱された液状の樹脂に溶剤を含まないので、封止用樹脂シートの製造過程において溶剤が気化する可能性がない。したがって、封止用樹脂シートの表面に気泡跡が発生しにくく、電子部品を気密封止することが可能となる。 In the above configuration, an outer frame that forms the outer edge of the sealing resin sheet is disposed on one surface of the first pressure plate, and a liquid resin that does not contain a solvent on one surface of the first pressure plate surrounded by the disposed outer frame. The liquid resin supplied to one surface of the first pressure plate is heated at a temperature at which it is in a semi-cured state, sandwiched between the first pressure plate and the second pressure plate and pressurized, and sealed without containing a solvent. A stopping resin sheet is formed. Since the solvent is not included in the liquid resin heated at the temperature at which the semi-cured state is obtained, there is no possibility that the solvent is vaporized in the process of manufacturing the sealing resin sheet. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
　上記構成によれば、樹脂体に溶剤を含まないので、封止樹脂シートの製造過程において溶剤が気化する可能性がない。したがって、封止用樹脂シートの表面に気泡跡が発生しにくく、電子部品を気密封止することが可能となる。 According to the above configuration, since the resin body does not contain a solvent, there is no possibility that the solvent is vaporized in the manufacturing process of the sealing resin sheet. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
　また、上記構成によれば、半硬化状態となる温度で加熱された液状の樹脂に溶剤を含まないので、封止用樹脂シートの製造過程において溶剤が気化する可能性がない。したがって、封止用樹脂シートの表面に気泡跡が発生しにくく、電子部品を気密封止することが可能となる。 Further, according to the above configuration, since the solvent is not included in the liquid resin heated at a temperature at which the resin is in a semi-cured state, there is no possibility that the solvent is vaporized in the manufacturing process of the sealing resin sheet. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
本発明の実施の形態１に係る封止用樹脂シート（保護膜付）の構成を示す概略図であるIt is the schematic which shows the structure of the resin sheet for sealing (with a protective film) which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る封止用樹脂シート（保護膜付）の製造方法を示す概略図である。It is the schematic which shows the manufacturing method of the resin sheet for sealing (with a protective film) which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る封止用樹脂シート（保護膜付）の製造に用いる真空プレス機の構成を示す概略図である。It is the schematic which shows the structure of the vacuum press used for manufacture of the resin sheet for sealing (with a protective film) which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る封止用樹脂シート（保護膜付）の製造に用いる別の加圧手段の構成を示す概略図である。It is the schematic which shows the structure of another pressurization means used for manufacture of the resin sheet for sealing which concerns on Embodiment 1 of this invention (with a protective film). 従来の製造方法で製造した封止用樹脂シートの表面の状態を示す画像の例示図である。It is an illustration figure of the image which shows the state of the surface of the resin sheet for sealing manufactured with the conventional manufacturing method. 本発明の実施の形態１に係る封止用樹脂シート（保護膜付）の製造方法で製造した封止用樹脂シートの表面の状態を示す画像の例示図である。It is an illustration figure of the image which shows the state of the surface of the resin sheet for sealing manufactured with the manufacturing method of the resin sheet for sealing (with a protective film) concerning Embodiment 1 of the present invention. 本発明の実施の形態１に係る封止用樹脂シート（保護膜付）の製造に、別の構成の加圧板（第２加圧板）を用いる場合の製造工程の一部を示す概略図である。It is the schematic which shows a part of manufacturing process in the case of using the pressure plate (2nd pressure plate) of another structure for manufacture of the resin sheet for sealing (with a protective film) which concerns on Embodiment 1 of this invention. . 本発明の実施の形態１に係る封止用樹脂シート（保護膜付）の製造に、別の構成の加圧板（第１加圧板）を用いる場合の製造工程の一部を示す概略図である。It is the schematic which shows a part of manufacturing process in the case of using the pressure plate (1st pressure plate) of another structure for manufacture of the resin sheet for sealing (with a protective film) which concerns on Embodiment 1 of this invention. . 本発明の実施の形態１に係る封止用樹脂シート（保護膜付）の製造に用いるスペーサの配置を変更した場合の、製造工程の一部を示す概略図である。It is the schematic which shows a part of manufacturing process at the time of changing arrangement | positioning of the spacer used for manufacture of the resin sheet for sealing (with a protective film) which concerns on Embodiment 1 of this invention. 本発明の実施の形態２に係る封止用樹脂シート（保護膜付）の製造方法を示す概略図である。It is the schematic which shows the manufacturing method of the resin sheet for sealing (with a protective film) which concerns on Embodiment 2 of this invention. 封止用樹脂シートを用いて封止樹脂層を形成する電子部品モジュールの製造方法を示す概略図である。It is the schematic which shows the manufacturing method of the electronic component module which forms a sealing resin layer using the resin sheet for sealing. 特許文献１に開示された封止用樹脂シートの製造方法を示す概略図である。It is the schematic which shows the manufacturing method of the resin sheet for sealing disclosed by patent document 1. FIG.
　以下、本発明の実施の形態について、図面を参照しながら詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
　（実施の形態１）
　図１は、本発明の実施の形態１に係る封止用樹脂シート（保護膜付）の構成を示す概略図である。図１に示すように、封止用樹脂シート（保護膜付）３は、封止用樹脂シート１と、封止用樹脂シート１の両面に設けた保護膜２とで構成されている。封止用樹脂シート１は、基板に実装した電子部品を封止する樹脂シートであり、半硬化状態の熱硬化性樹脂（例えば、エポキシ樹脂）である。封止用樹脂シート１は、取り扱いを容易にするために、両面に保護膜２を設けてある。保護膜２には、封止用樹脂シート１の硬化温度に耐えられる樹脂材料を用いれば良い。また、保護膜２は、フィルム状又は薄層シート状であり、例えば、ＰＥＴ（ポリエチレンテレフタラート）、ＰＴＦＥ（ポリテトラフルオロエチレン）等である。なお、封止用樹脂シート１の両面に保護膜２を設けてある構成に限定されるものではなく、片面（少なくとも一面）にだけ保護膜２を設けてあっても良い。また、導電性を有する材料を用いて保護膜２を導電体層として形成することで、導電体層を設けた封止用樹脂シートを製造することもできる。 (Embodiment 1)
FIG. 1 is a schematic diagram showing a configuration of a sealing resin sheet (with a protective film) according to Embodiment 1 of the present invention. As shown in FIG. 1, a sealing resin sheet (with a protective film) 3 includes a sealing resin sheet 1 and protective films 2 provided on both surfaces of the sealing resin sheet 1. The sealing resin sheet 1 is a resin sheet for sealing an electronic component mounted on a substrate, and is a semi-cured thermosetting resin (for example, epoxy resin). The sealing resin sheet 1 is provided with protective films 2 on both sides for easy handling. The protective film 2 may be made of a resin material that can withstand the curing temperature of the sealing resin sheet 1. The protective film 2 is in the form of a film or a thin sheet, and is, for example, PET (polyethylene terephthalate), PTFE (polytetrafluoroethylene), or the like. In addition, it is not limited to the structure which provided the protective film 2 on both surfaces of the resin sheet 1 for sealing, You may provide the protective film 2 only on one side (at least one surface). Moreover, the resin sheet for sealing which provided the conductor layer can also be manufactured by forming the protective film 2 as a conductor layer using the material which has electroconductivity.
　次に、図２は、本発明の実施の形態１に係る封止用樹脂シート（保護膜付）３の製造方法を示す概略図である。まず、図２（ａ）に示すように、円筒形の型２０を準備し、液状の樹脂２１を型２０に入れ、熱処理で半硬化状態にして樹脂体２２を形成する。液状の樹脂２１はエポキシ樹脂であり、溶剤を含んでいない。形成した樹脂体２２の厚みは、製造する封止用樹脂シート（保護膜付）３を構成する封止用樹脂シート１の膜厚より大きい。なお、縦に長い円筒形の型２０で樹脂体２２を形成しておき、切断して所望の厚みの樹脂体２２を形成しても良い。また、液状の樹脂２１を半硬化状態にする熱処理は、液状の樹脂２１の材料により異なるが、例えば、４０℃～１６０℃で、５分～１２０分間オーブン等で加熱する。 Next, FIG. 2 is a schematic view showing a method for producing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention. First, as shown in FIG. 2A, a cylindrical mold 20 is prepared, a liquid resin 21 is put into the mold 20, and a resin body 22 is formed in a semi-cured state by heat treatment. The liquid resin 21 is an epoxy resin and does not contain a solvent. The thickness of the formed resin body 22 is larger than the film thickness of the sealing resin sheet 1 constituting the sealing resin sheet (with protective film) 3 to be manufactured. Alternatively, the resin body 22 may be formed with a vertically long cylindrical mold 20 and cut to form the resin body 22 having a desired thickness. Further, the heat treatment for making the liquid resin 21 in a semi-cured state varies depending on the material of the liquid resin 21, for example, heating in an oven or the like at 40 ° C. to 160 ° C. for 5 minutes to 120 minutes.
　次に、図２（ｂ）に示すように、加圧板（第１加圧板）２３を準備し、加圧板２３の一面に封止用樹脂シート（保護膜付）３の膜厚を調整するためのスペーサ２４を配置し、配置したスペーサ２４に囲まれた加圧板２３の一面に保護膜２を載置する。保護膜２及びスペーサ２４には、製造した後で封止用樹脂シート１と分離できるように、封止用樹脂シート１と接する面に離型処理を施しておく。封止用樹脂シート１に保護膜２を設けない場合は、加圧板２３及びスペーサ２４に離型処理を施しておく。なお、加圧板２３及びスペーサ２４に用いる材料は、加圧しても形状を維持することができれば良く、ステンレス鋼（ＳＵＳ）、アルミニウム（Ａｌ）、ＰＥＴ、ＰＴＦＥ等である。 Next, as shown in FIG. 2 (b), a pressure plate (first pressure plate) 23 is prepared, and the thickness of the sealing resin sheet (with a protective film) 3 is adjusted on one surface of the pressure plate 23. The protective film 2 is placed on one surface of the pressure plate 23 surrounded by the arranged spacers 24. The protective film 2 and the spacer 24 are subjected to release treatment on the surface in contact with the sealing resin sheet 1 so that the protective film 2 and the spacer 24 can be separated from the sealing resin sheet 1 after manufacturing. When the protective film 2 is not provided on the sealing resin sheet 1, a release treatment is performed on the pressure plate 23 and the spacer 24. The material used for the pressure plate 23 and the spacer 24 may be stainless steel (SUS), aluminum (Al), PET, PTFE, or the like as long as the shape can be maintained even when pressed.
　次に、図２（ｃ）に示すように、溶剤を含まない樹脂体２２を加圧板２３の一面に載置した保護膜２の略中央部に供給する。樹脂体２２の厚みは、スペーサ２４の高さに比べて大きい。 Next, as shown in FIG. 2 (c), a resin body 22 that does not contain a solvent is supplied to the substantially central portion of the protective film 2 placed on one surface of the pressure plate 23. The thickness of the resin body 22 is larger than the height of the spacer 24.
　次に、図２（ｄ）に示すように、樹脂体２２上に保護膜２を載置する。樹脂体２２上に載置した保護膜２は、加圧板２３の一面に載置した保護膜２と同じ形状であり、同じ材料であるが、加圧板２３の一面に載置した保護膜２と異なる形状であっても、異なる材料であっても良い。樹脂体２２上に載置した保護膜２にも、製造した後で封止用樹脂シート１と分離できるように、離型処理を施しておく。 Next, as shown in FIG. 2D, the protective film 2 is placed on the resin body 22. The protective film 2 placed on the resin body 22 has the same shape and the same material as the protective film 2 placed on one surface of the pressure plate 23, but the protective film 2 placed on one surface of the pressure plate 23 Different shapes or different materials may be used. The protective film 2 placed on the resin body 22 is also subjected to mold release treatment so that it can be separated from the sealing resin sheet 1 after production.
　次に、図２（ｅ）に示すように、樹脂体２２を、硬化温度より低い温度（例えば、１６０℃）で加熱（加熱時間は１２０分以下）し、加圧板２３と加圧板（第２加圧板）２５とで挟持して加圧することで、加圧板２３、２５の平面方向に引き伸ばし、半硬化状態の封止用樹脂シート（保護膜付）３を製造する。製造した封止用樹脂シート（保護膜付）３について、５０℃から３５０℃まで加熱し、溶剤に由来すると考えられるガスを熱抽出してＧＣ－ＭＳ（ガスクロマトグラフ質量分析計）で分析した結果から、溶剤に由来すると考えられるガスは検出限界以下であり、製造した封止用樹脂シート（保護膜付）３には溶剤は含まれていないことを確認している。ＧＣ－ＭＳとしては、アジレント・テクノロジー社製のＡｇｉｌｅｎｔ　７８９０Ａ／５９７５Ｃ　ＧＣ／ＭＳＤシステムを用いた。なお、二枚の加圧板２３、２５は、封止用樹脂シート（保護膜付）３の膜厚を調整するためのスペーサ２４も挟持するので、封止用樹脂シート（保護膜付）３の膜厚がスペーサ２４の高さと同じになるまで、樹脂体２２を二枚の加圧板２３、２５で挟持して加圧することができ、均一な膜厚の封止用樹脂シート（保護膜付）３を製造することができる。スペーサ２４の高さを変更することで、所望の膜厚の封止用樹脂シート（保護膜付）３を製造することができる。加圧板２５は、加圧板２３と同じ形状であり、同じ材料であるが、加圧板２３と異なる形状であっても、異なる材料であっても良い。封止用樹脂シート１に保護膜２を設けない場合は、製造した後で封止用樹脂シート１と分離できるように、加圧板２５に離型処理を施しておく。 Next, as shown in FIG. 2E, the resin body 22 is heated at a temperature lower than the curing temperature (for example, 160 ° C.) (heating time is 120 minutes or less), and the pressure plate 23 and the pressure plate (second By being sandwiched between the pressure plates 25 and pressed, the pressure plates 23 and 25 are stretched in the plane direction to produce a semi-cured sealing resin sheet (with a protective film) 3. The manufactured sealing resin sheet (with protective film) 3 was heated from 50 ° C. to 350 ° C., and the gas considered to be derived from the solvent was extracted by heat and analyzed by GC-MS (gas chromatograph mass spectrometer). Therefore, the gas considered to be derived from the solvent is below the detection limit, and it is confirmed that the produced sealing resin sheet (with protective film) 3 does not contain the solvent. As GC-MS, Agilent 7890A / 5975C GC / MSD system manufactured by Agilent Technologies was used. The two pressure plates 23 and 25 also sandwich the spacer 24 for adjusting the film thickness of the sealing resin sheet (with protective film) 3, so that the sealing resin sheet (with protective film) 3 Until the film thickness becomes the same as the height of the spacer 24, the resin body 22 can be sandwiched and pressed by the two pressure plates 23, 25, and the sealing resin sheet with a uniform film thickness (with protective film) 3 can be manufactured. By changing the height of the spacer 24, a sealing resin sheet (with a protective film) 3 having a desired film thickness can be manufactured. The pressure plate 25 has the same shape as the pressure plate 23 and is the same material, but may have a different shape from the pressure plate 23 or a different material. When the protective resin sheet 1 is not provided on the sealing resin sheet 1, the pressure plate 25 is subjected to a release treatment so that it can be separated from the sealing resin sheet 1 after manufacturing.
　封止用樹脂シート１の外縁を形成する外枠を、スペーサ２４で形成してあるので、樹脂体２２を、スペーサ２４と接触するまで引き伸ばすことができる。そして、スペーサ２４で封止用樹脂シート１の外縁を形成することができるので、製造後に不要な部分を切断する必要がない。 Since the outer frame forming the outer edge of the sealing resin sheet 1 is formed by the spacer 24, the resin body 22 can be stretched until it contacts the spacer 24. And since the outer edge of the resin sheet 1 for sealing can be formed with the spacer 24, it is not necessary to cut | disconnect an unnecessary part after manufacture.
　次に、樹脂体２２を加圧する手段（加圧手段）として用いる真空プレス機について説明する。図３は、本発明の実施の形態１に係る封止用樹脂シート（保護膜付）３の製造に用いる真空プレス機の構成を示す概略図である。図３に示す真空プレス機３０は、二枚の保護膜２に挟まれた樹脂体２２及びスペーサ２４を二枚の加圧板２３、２５で挟持し、二枚のプレス板３１で挟んで樹脂体２２を加圧する。真空プレス機３０は、真空状態（例えば、５０００Ｐａ以下）を作り出すことができる。真空状態で樹脂体２２を加圧することで、封止用樹脂シート１に気泡が入るという不具合が生じない。真空状態から大気開放して、冷却後に真空プレス機３０から、加圧して引き伸ばした樹脂体２２を取り出すことで、封止用樹脂シート（保護膜付）３を製造することができる。封止用樹脂シート１に気泡が入るという不具合を別の手段で回避できる場合、真空プレス機３０ではなく、大気状態で加圧するプレス機を用いても良い。また、真空プレス機３０で、膜厚を調整しながら樹脂体２２を加圧することができるのであれば、二枚の加圧板２３、２５でスペーサ２４を挟持する必要はない。 Next, a vacuum press machine used as means for pressurizing the resin body 22 (pressurizing means) will be described. FIG. 3 is a schematic diagram showing the configuration of a vacuum press used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention. The vacuum press 30 shown in FIG. 3 includes a resin body 22 and a spacer 24 sandwiched between two protective films 2, sandwiched between two pressure plates 23 and 25, and sandwiched between two press plates 31. 22 is pressurized. The vacuum press 30 can create a vacuum state (for example, 5000 Pa or less). By pressurizing the resin body 22 in a vacuum state, the problem that bubbles enter the sealing resin sheet 1 does not occur. The sealing resin sheet (with protective film) 3 can be manufactured by releasing the air from the vacuum state to the atmosphere and taking out the resin body 22 that has been pressurized and stretched from the vacuum press machine 30 after cooling. When the problem that air bubbles enter the sealing resin sheet 1 can be avoided by another means, a press that pressurizes in the atmospheric state instead of the vacuum press 30 may be used. Further, if the resin body 22 can be pressurized while the film thickness is adjusted by the vacuum press machine 30, it is not necessary to sandwich the spacer 24 between the two pressure plates 23 and 25.
　樹脂体２２を加圧する手段は、真空プレス機３０に限定されるものではない。図４は、本発明の実施の形態１に係る封止用樹脂シート（保護膜付）３の製造に用いる別の加圧手段の構成を示す概略図である。図４に示す加圧手段は、二枚の保護膜２に挟まれた樹脂体２２及びスペーサ２４を二枚の加圧板２３、２５で挟持し、気体遮断性を有するラミネートパック（袋）４０に入れ、減圧パック装置（図示せず）により、ラミネートパック４０の内部を減圧して密封する。減圧して密封したラミネートパック４０内の樹脂体２２に対しラミネートパック４０の外部から大気開放による圧力を加え、さらに熱を加える。加圧手段としてラミネートパック４０と減圧パック装置とを用いることで、高価な真空プレス機３０を用いる場合に比べて、封止用樹脂シート（保護膜付）３の製造コストを抑えることができる。また、二枚の加圧板２３、２５で挟持した樹脂体２２を気体遮断性を有するラミネートパック４０に入れ、ラミネートパック４０の内部を減圧して密封するので、封止用樹脂シート１に気泡が入るという不具合が生じない。さらに、減圧して密封したラミネートパック４０内の樹脂体２２を加圧しつつ冷却することが可能になり、封止用樹脂シート（保護膜付）３の形状を維持することができる。 The means for pressurizing the resin body 22 is not limited to the vacuum press 30. FIG. 4 is a schematic view showing a configuration of another pressurizing means used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention. The pressurizing means shown in FIG. 4 includes a resin body 22 and a spacer 24 sandwiched between two protective films 2, sandwiched between two pressurizing plates 23 and 25, and a laminated pack (bag) 40 having gas barrier properties. Then, the inside of the laminate pack 40 is decompressed and sealed with a decompression pack device (not shown). A pressure is applied to the resin body 22 in the laminated pack 40 that has been decompressed and sealed from the outside of the laminated pack 40, and further heat is applied. By using the laminate pack 40 and the decompression pack apparatus as the pressurizing means, the manufacturing cost of the sealing resin sheet (with a protective film) 3 can be suppressed as compared with the case where the expensive vacuum press 30 is used. Further, since the resin body 22 sandwiched between the two pressure plates 23 and 25 is put in a laminate pack 40 having gas barrier properties, and the inside of the laminate pack 40 is sealed by reducing the pressure, bubbles are generated in the sealing resin sheet 1. The trouble of entering does not occur. Furthermore, it becomes possible to cool the resin body 22 in the laminated pack 40 sealed under reduced pressure while applying pressure, and the shape of the sealing resin sheet (with a protective film) 3 can be maintained.
　図５は、従来の製造方法で製造した封止用樹脂シート９４の表面の状態を示す画像の例示図であり、図６は、本発明の実施の形態１に係る封止用樹脂シート（保護膜付）３の製造方法で製造した封止用樹脂シート１の表面の状態を示す画像の例示図である。図５に示すように、溶剤を含む液状の樹脂を塗布して製造した封止用樹脂シート９４の表面には、無数の小さな気泡跡が発生している。一方、図６に示すように、溶剤を含まない樹脂体２２を加圧して製造した封止用樹脂シート１の表面には、ほとんど気泡跡が発生していないことが明らかである。 FIG. 5 is an illustration of an image showing the state of the surface of the sealing resin sheet 94 manufactured by a conventional manufacturing method, and FIG. 6 shows the sealing resin sheet (protection) according to Embodiment 1 of the present invention. It is an illustration figure of the image which shows the state of the surface of the resin sheet 1 for sealing manufactured with the manufacturing method of 3 with a film | membrane. As shown in FIG. 5, countless small bubble marks are generated on the surface of the sealing resin sheet 94 manufactured by applying a liquid resin containing a solvent. On the other hand, as shown in FIG. 6, it is clear that almost no bubble marks are generated on the surface of the sealing resin sheet 1 manufactured by pressurizing the resin body 22 containing no solvent.
　以上のように、本発明の実施の形態１によれば、樹脂体２２に溶剤を含まないので、封止用樹脂シート１の製造過程において溶剤が気化する可能性がない。したがって、封止用樹脂シート１の表面に気泡跡が発生しにくく、電子部品を気密封止することが可能となる。 As described above, according to the first embodiment of the present invention, since the resin body 22 does not contain a solvent, there is no possibility that the solvent is vaporized in the manufacturing process of the sealing resin sheet 1. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet 1, and the electronic component can be hermetically sealed.
　また、従来の製造方法では、離型処理を施した支持フィルム１０３の上面に液状のエポキシ樹脂組成物（樹脂）１０２を塗布する。この場合、溶剤と、シリコーンオイル等のレベリング剤とを含む液状のエポキシ樹脂組成物１０２を用いる。液状のエポキシ樹脂組成物１０２がレベリング剤を含んでいる場合、破泡性が劣化し、気泡が樹脂中に滞留しやすくなる。一方、本実施の形態１に係る封止用樹脂シート（保護膜付）３の製造方法では、樹脂体２２に溶剤もレベリング剤も含まれていないので、気泡が樹脂中に滞留する可能性も低くなる。 In the conventional manufacturing method, a liquid epoxy resin composition (resin) 102 is applied to the upper surface of the support film 103 that has been subjected to the mold release treatment. In this case, a liquid epoxy resin composition 102 containing a solvent and a leveling agent such as silicone oil is used. When the liquid epoxy resin composition 102 contains a leveling agent, the foam breaking property is deteriorated, and bubbles are likely to stay in the resin. On the other hand, in the manufacturing method of the sealing resin sheet (with protective film) 3 according to the first embodiment, since the resin body 22 contains neither a solvent nor a leveling agent, there is a possibility that bubbles may stay in the resin. Lower.
　さらに、図７は、本発明の実施の形態１に係る封止用樹脂シート（保護膜付）３の製造に、別の構成の加圧板（第２加圧板）を用いる場合の製造工程の一部を示す概略図である。図７に示すように、平板状の加圧板２３と、加圧板２３の一面に配置したスペーサ２４と嵌合する凸形状の加圧板２５ａとで、二枚の保護膜２に挟まれた樹脂体２２及びスペーサ２４を挟持している。凸形状の加圧板２５ａを用いることで、樹脂体２２をより加圧することができ、高密度の封止用樹脂シート（保護膜付）３を製造することができる。 Furthermore, FIG. 7 shows a manufacturing process when a pressure plate (second pressure plate) of another configuration is used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention. It is the schematic which shows a part. As shown in FIG. 7, a resin body sandwiched between two protective films 2 by a flat pressure plate 23 and a convex pressure plate 25 a fitted to a spacer 24 arranged on one surface of the pressure plate 23. 22 and the spacer 24 are sandwiched. By using the convex pressure plate 25a, the resin body 22 can be further pressurized, and a high-density sealing resin sheet (with a protective film) 3 can be manufactured.
　また、図８は、本発明の実施の形態１に係る封止用樹脂シート（保護膜付）３の製造に、別の構成の加圧板（第１加圧板）を用いる場合の製造工程の一部を示す概略図である。図８に示すように、スペーサ２４と加圧板２３とを一体成形した加圧板２３ａと平板状の加圧板２５とで、二枚の保護膜２に挟まれた樹脂体２２を挟持している。加圧板２３の一面にスペーサ２４を配置する工程が不要となり、封止用樹脂シート（保護膜付）３の製造コストを抑えることができる。なお、保護膜２は、加圧板２３ａ及び加圧板２５の形状に沿って載置されているので、加圧板２３ａ及び加圧板２５と樹脂体２２とが直接接触することがない。そのため、製造した後で封止用樹脂シート１と分離することができるように、加圧板２３ａ及び加圧板２５に離型処理を施す必要がない。また、保護膜２の厚みに左右されず、スペーサ２４と加圧板２３とを一体成形した加圧板２３ａに形成される凹部の深さにより封止用樹脂シート（保護膜付）３の膜厚を調整することができる。 FIG. 8 shows a manufacturing process when a pressure plate (first pressure plate) of another configuration is used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention. It is the schematic which shows a part. As shown in FIG. 8, a resin body 22 sandwiched between two protective films 2 is sandwiched between a pressure plate 23 a integrally formed with a spacer 24 and a pressure plate 23 and a flat pressure plate 25. The process of disposing the spacer 24 on one surface of the pressure plate 23 becomes unnecessary, and the manufacturing cost of the sealing resin sheet (with a protective film) 3 can be suppressed. In addition, since the protective film 2 is mounted along the shape of the pressure plate 23a and the pressure plate 25, the pressure plate 23a and the pressure plate 25 and the resin body 22 are not in direct contact. Therefore, it is not necessary to perform a mold release process on the pressure plate 23a and the pressure plate 25 so that it can be separated from the sealing resin sheet 1 after manufacturing. The thickness of the sealing resin sheet (with protective film) 3 depends on the depth of the recess formed in the pressure plate 23a formed by integrally molding the spacer 24 and the pressure plate 23, regardless of the thickness of the protective film 2. Can be adjusted.
　さらに、図９は、本発明の実施の形態１に係る封止用樹脂シート（保護膜付）３の製造に用いるスペーサ２４の配置を変更した場合の、製造工程の一部を示す概略図である。図９に示すように、平板状の二枚の加圧板２３、２５で、二枚の保護膜２に挟まれた樹脂体２２及びスペーサ２４を挟持している。スペーサ２４は、加圧板２３の一面に載置した保護膜２の上に配置されている。加圧板２３の一面に載置した保護膜２の上にスペーサ２４を配置してあるので、加圧板２３とスペーサ２４とを容易に分離することができる。 Further, FIG. 9 is a schematic view showing a part of the manufacturing process when the arrangement of the spacers 24 used for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 1 of the present invention is changed. is there. As shown in FIG. 9, the resin bodies 22 and the spacers 24 sandwiched between the two protective films 2 are sandwiched between two flat pressure plates 23 and 25. The spacer 24 is disposed on the protective film 2 placed on one surface of the pressure plate 23. Since the spacer 24 is disposed on the protective film 2 placed on one surface of the pressure plate 23, the pressure plate 23 and the spacer 24 can be easily separated.
　（実施の形態２）
　本発明の実施の形態２に係る封止用樹脂シート（保護膜付）３の製造方法は、半硬化状態の樹脂体２２を形成することなく、封止用樹脂シート（保護膜付）３を製造する方法である。図１０は、本発明の実施の形態２に係る封止用樹脂シート（保護膜付）３の製造方法を示す概略図である。まず、図１０（ａ）に示すように、加圧板（第１加圧板）８１を準備し、加圧板８１の一面に、封止用樹脂シート（保護膜付）３の外縁を形成する外枠８２を配置し、配置した外枠８２に囲まれた加圧板８１の一面に保護膜２を載置する。保護膜２及び外枠８２には、製造した後で封止用樹脂シート１と分離できるように、離型処理を施しておく。なお、封止用樹脂シート１に保護膜２を設けない場合は、加圧板８１及び外枠８２に離型処理を施しておく。また、加圧板８１及び外枠８２に用いる材料は、加圧しても形状を維持することができれば良く、ステンレス鋼（ＳＵＳ）、アルミニウム（Ａｌ）、ＰＥＴ、ＰＴＦＥ等である。 (Embodiment 2)
The manufacturing method of the resin sheet for sealing (with a protective film) 3 according to Embodiment 2 of the present invention is the method of manufacturing the resin sheet for sealing (with a protective film) 3 without forming the semi-cured resin body 22. It is a manufacturing method. FIG. 10 is a schematic diagram showing a method for manufacturing the sealing resin sheet (with a protective film) 3 according to Embodiment 2 of the present invention. First, as shown in FIG. 10A, a pressure plate (first pressure plate) 81 is prepared, and an outer frame that forms the outer edge of the sealing resin sheet (with a protective film) 3 on one surface of the pressure plate 81. 82 is arranged, and the protective film 2 is placed on one surface of the pressure plate 81 surrounded by the arranged outer frame 82. The protective film 2 and the outer frame 82 are subjected to a mold release process so that they can be separated from the sealing resin sheet 1 after being manufactured. In addition, when the protective film 2 is not provided on the sealing resin sheet 1, a release treatment is performed on the pressure plate 81 and the outer frame 82. Further, the material used for the pressure plate 81 and the outer frame 82 may be stainless steel (SUS), aluminum (Al), PET, PTFE, or the like as long as the shape can be maintained even when pressed.
　次に、図１０（ｂ）に示すように、ディスペンサ等で、配置した外枠８２に囲まれた加圧板８１の一面に液状の樹脂８３を供給する。液状の樹脂８３はエポキシ樹脂であり、溶剤を含んでいない。 Next, as shown in FIG. 10 (b), a liquid resin 83 is supplied to one surface of the pressure plate 81 surrounded by the arranged outer frame 82 with a dispenser or the like. The liquid resin 83 is an epoxy resin and does not contain a solvent.
　次に、図１０（ｃ）に示すように、加圧板８１の一面に供給した液状の樹脂８３上に保護膜２を載置する。液状の樹脂８３上に載置した保護膜２は、加圧板８１の一面に載置した保護膜２と同じ形状であり、同じ材料であるが、加圧板８１の一面に載置した保護膜２と異なる形状であっても、異なる材料であっても良い。 Next, as shown in FIG. 10C, the protective film 2 is placed on the liquid resin 83 supplied to one surface of the pressure plate 81. The protective film 2 placed on the liquid resin 83 has the same shape and the same material as the protective film 2 placed on one surface of the pressure plate 81, but the protective film 2 placed on one surface of the pressure plate 81. Different shapes or different materials may be used.
　次に、図１０（ｄ）に示すように、二枚の保護膜２に挟まれた液状の樹脂８３を、半硬化状態となる温度（例えば、１６０℃）で加熱（加熱時間は１２０分以下）し、加圧板８１と加圧板（第２加圧板）８４とで挟持して加圧することで、半硬化状態の封止用樹脂シート（保護膜付）３を製造する。実施の形態１と同様の分析を行うことにより、製造した封止用樹脂シート（保護膜付）３に溶剤は含まれていないことを確認している。加圧板８１の一面に配置した外枠８２は、封止用樹脂シート（保護膜付）３の膜厚を調整するためのスペーサ２４としても機能するので、外枠８２の高さを変更することで、所望の膜厚の封止用樹脂シート（保護膜付）３を製造することができる。なお、加圧板８４は、加圧板８１と同じ形状であり、同じ材料であるが、加圧板８１と異なる形状であっても、異なる材料であっても良い。また、二枚の加圧板８１、８４で液状の樹脂８３を加圧する加圧手段については、実施の形態１と同じ加圧手段（例えば、真空プレス機３０、ラミネートパック４０と減圧パック装置）を用いることができる。 Next, as shown in FIG. 10 (d), the liquid resin 83 sandwiched between the two protective films 2 is heated at a temperature at which it becomes a semi-cured state (for example, 160 ° C.) (heating time is 120 minutes or less). Then, the resin sheet for sealing (with protective film) 3 in a semi-cured state is manufactured by sandwiching and pressing between the pressure plate 81 and the pressure plate (second pressure plate) 84. By performing the same analysis as in the first embodiment, it is confirmed that the produced sealing resin sheet (with protective film) 3 does not contain a solvent. Since the outer frame 82 arranged on one surface of the pressure plate 81 also functions as the spacer 24 for adjusting the film thickness of the sealing resin sheet (with protective film) 3, the height of the outer frame 82 is changed. Thus, a sealing resin sheet (with a protective film) 3 having a desired film thickness can be produced. The pressure plate 84 has the same shape as the pressure plate 81 and is made of the same material, but may have a different shape from the pressure plate 81 or a different material. As for the pressurizing unit that pressurizes the liquid resin 83 with the two pressurizing plates 81 and 84, the same pressurizing unit as that of the first embodiment (for example, the vacuum press machine 30, the laminate pack 40 and the decompression pack apparatus) is used. Can be used.
　以上のように、本発明の実施の形態２に係る封止用樹脂シート１の製造方法は、加圧板
８１の一面に、封止用樹脂シート１の外縁を形成する外枠８２を配置し、配置した外枠８
２に囲まれた加圧板８１の一面に溶剤を含まない液状の樹脂８３を供給し、加圧板８１の一面に供給した液状の樹脂８３を、半硬化状態となる温度で加熱し、加圧板８１と加圧板８４とで挟持して加圧するので、封止用樹脂シート１の製造過程において溶剤が気化する可能性がない。したがって、封止用樹脂シート１の表面に気泡跡が発生しにくく、電子部品を気密封止することが可能となる。 As described above, the manufacturing method of the sealing resin sheet 1 according to Embodiment 2 of the present invention arranges the outer frame 82 that forms the outer edge of the sealing resin sheet 1 on one surface of the pressure plate 81, Arranged outer frame 8
The liquid resin 83 containing no solvent is supplied to one surface of the pressure plate 81 surrounded by 2, and the liquid resin 83 supplied to one surface of the pressure plate 81 is heated at a temperature at which it is in a semi-cured state. And the pressurizing plate 84 to pressurize, there is no possibility that the solvent is vaporized in the process of manufacturing the sealing resin sheet 1. Therefore, it is difficult for bubble marks to be generated on the surface of the sealing resin sheet 1, and the electronic component can be hermetically sealed.
　なお、本発明は上記実施例に限定されるものではなく、本発明の趣旨の範囲内であれば多種の変形、置換等が可能であることは言うまでもない。 It should be noted that the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications and substitutions are possible within the scope of the present invention.
　１　封止用樹脂シート
　２　保護膜
　３　封止用樹脂シート（保護膜付）
　２０　型
　２１、８３　液状の樹脂
　２２　樹脂体
　２３、２３ａ、８１　加圧板（第１加圧板）
　２４　スペーサ
　２５、２５ａ、８４　加圧板（第２加圧板）
　３０　真空プレス機
　３１　プレス板
　４０　ラミネートパック
　８２　外枠 1 Resin sheet for sealing 2 Protective film 3 Resin sheet for sealing (with protective film)
20 molds 21, 83 liquid resin 22 resin bodies 23, 23a, 81 pressure plate (first pressure plate)
24 Spacer 25, 25a, 84 Pressure plate (second pressure plate)
30 Vacuum press machine 31 Press plate 40 Laminate pack 82 Outer frame

Claims (2)

  1. 　基板に実装した電子部品を封止する封止用樹脂シートの製造方法において、
    　溶剤を含まない液状の樹脂を型に入れ、熱処理で半硬化状態にして溶剤を含まない樹脂体を形成する第１工程と、
    　形成した前記樹脂体を第１加圧板の一面に供給して硬化温度より低い温度で加熱し、前記第１加圧板と第２加圧板とで挟持して加圧し、前記第１加圧板及び前記第２加圧板の平面方向に引き伸ばし、溶剤を含まない前記封止用樹脂シートを形成する第２工程と
    　を含むことを特徴とする封止用樹脂シートの製造方法。     In the manufacturing method of the sealing resin sheet for sealing the electronic component mounted on the substrate,
    A first step of placing a liquid resin not containing a solvent into a mold and forming a resin body that does not contain a solvent in a semi-cured state by heat treatment;
    The formed resin body is supplied to one surface of the first pressure plate and heated at a temperature lower than the curing temperature, and is sandwiched and pressed between the first pressure plate and the second pressure plate, and the first pressure plate and the A second step of stretching the second pressure plate in the planar direction to form the sealing resin sheet not containing a solvent, and a method for producing a sealing resin sheet.
  2. 　基板に実装した電子部品を封止する封止用樹脂シートの製造方法において、
    　第１加圧板の一面に、前記封止用樹脂シートの外縁を形成する外枠を配置し、配置した前記外枠で囲まれた前記第１加圧板の一面に溶剤を含まない液状の樹脂を供給する第１工程と、
    　前記外枠で囲まれた前記第１加圧板の一面に供給した前記樹脂を、半硬化状態となる温度で加熱し、前記第１加圧板と第２加圧板とで挟持して加圧し、溶剤を含まない前記封止用樹脂シートを形成する第２工程と
    　を含むことを特徴とする封止用樹脂シートの製造方法。     In the manufacturing method of the sealing resin sheet for sealing the electronic component mounted on the substrate,
    An outer frame that forms an outer edge of the sealing resin sheet is disposed on one surface of the first pressure plate, and a liquid resin that does not contain a solvent is disposed on the one surface of the first pressure plate that is surrounded by the disposed outer frame. A first step of supplying;
    The resin supplied to one surface of the first pressure plate surrounded by the outer frame is heated at a temperature at which it is in a semi-cured state, and is sandwiched and pressurized between the first pressure plate and the second pressure plate, And a second step of forming the encapsulating resin sheet that does not contain a sealing resin sheet.
PCT/JP2012/075365 2011-10-14 2012-10-01 Method for producing sealing resin sheet WO2013054677A1 (en)

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JPH0966523A (en) * 1995-08-30 1997-03-11 Toshiba Chem Corp Manufacture of semiconductor sealing resin molding
JP2000290471A (en) * 1999-04-08 2000-10-17 Nitto Denko Corp Resin composition for sealing
JP2010003857A (en) * 2008-06-20 2010-01-07 Panasonic Corp Hot press device and method of manufacturing electronic device
JP2010179507A (en) * 2009-02-04 2010-08-19 Apic Yamada Corp Compression molding method

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