TW201318807A - Method for producing sealing resin sheet - Google Patents
Method for producing sealing resin sheet Download PDFInfo
- Publication number
- TW201318807A TW201318807A TW101132388A TW101132388A TW201318807A TW 201318807 A TW201318807 A TW 201318807A TW 101132388 A TW101132388 A TW 101132388A TW 101132388 A TW101132388 A TW 101132388A TW 201318807 A TW201318807 A TW 201318807A
- Authority
- TW
- Taiwan
- Prior art keywords
- sealing
- resin sheet
- pressure plate
- resin
- solvent
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 217
- 239000011347 resin Substances 0.000 title claims abstract description 217
- 238000007789 sealing Methods 0.000 title claims abstract description 138
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 50
- 239000002904 solvent Substances 0.000 claims abstract description 45
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 description 45
- 239000000463 material Substances 0.000 description 18
- 238000003825 pressing Methods 0.000 description 15
- 239000000203 mixture Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- -1 Polyethylene Terephthalate Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本發明係關於一種製造密封安裝於基板上之電子零件之密封用樹脂片材之方法。 The present invention relates to a method of producing a resin sheet for sealing which seals an electronic component mounted on a substrate.
於基板上安裝有電子零件之電子零件模組係為了保護電子零件免受熱、濕度等影響，而形成密封安裝於基板上之電子零件之密封樹脂層。作為於基板上形成密封樹脂層之方法，有如下等方法：於安裝有電子零件之基板上塗佈液狀之樹脂，對所塗佈之樹脂進行加熱及加壓；及於安裝有電子零件之基板上載置半硬化狀態之密封用樹脂片材，對所載置之密封用樹脂片材進行加熱及加壓。 The electronic component module in which the electronic component is mounted on the substrate is formed to seal the sealing resin layer of the electronic component mounted on the substrate in order to protect the electronic component from heat, humidity, and the like. As a method of forming a sealing resin layer on a substrate, there is a method of applying a liquid resin to a substrate on which an electronic component is mounted, heating and pressurizing the applied resin, and mounting an electronic component. The resin sheet for sealing in a semi-hardened state is placed on the substrate, and the sealing resin sheet to be placed is heated and pressurized.
圖11係表示使用密封用樹脂片材而形成密封樹脂層之電子零件模組之製造方法之概略圖。如圖11(a)所示，對作為電極貼附於支持層90上之Cu箔等進行蝕刻而形成電路圖案91。於電路圖案91之特定位置塗佈導電性接著劑92，於導電性接著劑92上搭載電子零件93，並投入至烘箱內使導電性接著劑92硬化。繼而，如圖11(b)所示，於支持層90之電子零件93搭載側，隔著半硬化狀態之密封用樹脂片材94而壓接表面形成有電路圖案95之另一支持層96，使半硬化狀態之密封用樹脂片材94預硬化。藉由壓接，電子零件93埋設至密封用樹脂片材94中，並且電路圖案91、95密接於密封用樹脂片材94之正背面。繼而，如圖11(c)所示，於密封用樹脂片材94之熱壓接後，自預硬化狀態之密封用樹脂片 材94剝離支持層90、96。此後，經由使預硬化狀態之密封用樹脂片材94硬化而形成密封樹脂層之步驟等製造電子零件模組。 FIG. 11 is a schematic view showing a method of manufacturing an electronic component module in which a sealing resin layer is formed using a resin sheet for sealing. As shown in FIG. 11(a), a Cu foil or the like which is attached to the support layer 90 as an electrode is etched to form a circuit pattern 91. The conductive adhesive 92 is applied to a specific position of the circuit pattern 91, and the electronic component 93 is mounted on the conductive adhesive 92, and is placed in an oven to cure the conductive adhesive 92. Then, as shown in FIG. 11(b), on the mounting side of the electronic component 93 of the support layer 90, another supporting layer 96 having the circuit pattern 95 formed thereon is pressed against the sealing resin sheet 94 in a semi-hardened state. The sealing resin sheet 94 in a semi-hardened state is pre-cured. The electronic component 93 is embedded in the sealing resin sheet 94 by pressure bonding, and the circuit patterns 91 and 95 are in close contact with the front and back surfaces of the sealing resin sheet 94. Then, as shown in FIG. 11(c), after sealing the resin sheet 94 for sealing, the resin sheet for sealing from the pre-hardened state is obtained. The material 94 peels off the support layers 90,96. Thereafter, the electronic component module is manufactured by a step of curing the sealing resin sheet 94 in the pre-cured state to form a sealing resin layer.
於使用密封用樹脂片材而形成密封樹脂層之情形時，需要預先製造載置於安裝有電子零件之基板上之密封用樹脂片材。先前之製造密封用樹脂片材之方法揭示於專利文獻1中。圖12係表示專利文獻1中所揭示之密封用樹脂片材之製造方法之概略圖。於專利文獻1中，揭示有如下方法：藉由塗佈裝置101而將液狀之環氧樹脂組合物(樹脂)102塗佈於支持膜(保護膜)103之上表面，使所塗佈之環氧樹脂組合物102為半硬化狀態後，將自脫模膜輥104陸續送出之脫模膜105重疊於環氧樹脂組合物102之上表面，並藉由推壓輥106推壓，藉此製造密封用樹脂片材。 When a sealing resin layer is formed using a sealing resin sheet, it is necessary to previously manufacture a sealing resin sheet placed on a substrate on which an electronic component is mounted. A conventional method for producing a resin sheet for sealing is disclosed in Patent Document 1. FIG. 12 is a schematic view showing a method of producing a resin sheet for sealing disclosed in Patent Document 1. Patent Document 1 discloses a method in which a liquid epoxy resin composition (resin) 102 is applied onto the upper surface of a support film (protective film) 103 by a coating device 101 to be coated. After the epoxy resin composition 102 is in a semi-hardened state, the release film 105 which is successively fed out from the release film roll 104 is superposed on the upper surface of the epoxy resin composition 102, and is pressed by the pressing roller 106. A resin sheet for sealing is produced.
[專利文獻1]日本專利特開2009-29930號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-29930
然而，於專利文獻1中所揭示之密封用樹脂片材之製造方法中，為了將環氧樹脂組合物102塗佈於支持膜103之上表面並擴散，而於環氧樹脂組合物102中包含醇、酯等溶劑作為稀釋劑。於加熱包含溶劑之環氧樹脂組合物102並使其乾燥之情形時，溶劑氣化而於密封用樹脂片材之表面產生無數個氣泡痕跡。於在密封用樹脂片材94之表面產生 有氣泡痕跡之情形時，因氣泡痕跡之存在而有無法將電子零件93氣密密封之問題。 However, in the method for producing a resin sheet for sealing disclosed in Patent Document 1, the epoxy resin composition 102 is included in the epoxy resin composition 102 in order to apply the epoxy resin composition 102 to the upper surface of the support film 103 and diffuse it. A solvent such as an alcohol or an ester is used as a diluent. When the epoxy resin composition 102 containing a solvent is heated and dried, the solvent vaporizes to generate numerous bubbles on the surface of the resin sheet for sealing. Produced on the surface of the sealing resin sheet 94 In the case of a bubble mark, there is a problem that the electronic component 93 cannot be hermetically sealed due to the presence of a bubble mark.
本發明係鑒於上述情況而完成者，其目的在於提供一種難以於表面產生氣泡痕跡之密封用樹脂片材之製造方法。 The present invention has been made in view of the above circumstances, and an object of the invention is to provide a method for producing a resin sheet for sealing which is difficult to generate a bubble mark on a surface.
為了達成上述目的，本發明之密封用樹脂片材之製造方法係製造密封安裝於基板上之電子零件之密封用樹脂片材之方法，其特徵在於包含：第1步驟，其係將不包含溶劑之液狀之樹脂放入至模型中，藉由熱處理使其成為半硬化狀態而形成不包含溶劑之樹脂體；及第2步驟，其係將所形成之上述樹脂體供給至第1加壓板之上方並以低於硬化溫度之溫度加熱，並藉由上述第1加壓板、及位於該第1加壓板之上方之第2加壓板加壓而於上述第1加壓板之平面方向上拉長，從而形成不包含溶劑之上述密封用樹脂片材。 In order to achieve the above object, a method for producing a resin sheet for sealing according to the present invention is a method for producing a resin sheet for sealing of an electronic component mounted on a substrate, comprising: a first step, which does not contain a solvent The liquid resin is placed in a mold, and is formed into a semi-hardened state by heat treatment to form a resin body containing no solvent; and a second step of supplying the formed resin body to the first pressurizing plate Heating upward at a temperature lower than the curing temperature, and pressing the first pressure plate and the second pressure plate located above the first pressure plate to press the surface of the first pressure plate The direction is elongated to form the above-mentioned resin sheet for sealing which does not contain a solvent.
於上述構成中，將不包含溶劑之液狀之樹脂放入至模型，藉由熱處理使其成為半硬化狀態而形成不包含溶劑之樹脂體，將所形成之半硬化狀態之樹脂體供給至第1加壓板之上方並以低於硬化溫度之溫度加熱，並藉由第1加壓板、及位於第1加壓板之上方之第2加壓板加壓而於第1加壓板之平面方向上拉長，從而形成不包含溶劑之密封用樹脂片材。於樹脂體中不包含溶劑，因此密封用樹脂片材之製造過程中不會有溶劑氣化之情況。因此，難以於密封用樹脂片材之表面產生氣泡痕跡，從而可將電子零件氣密密封。 In the above configuration, a liquid resin containing no solvent is placed in a mold, and a resin body containing no solvent is formed in a semi-hardened state by heat treatment, and the formed semi-hardened resin body is supplied to the first 1 is heated above the pressure plate at a temperature lower than the curing temperature, and is pressurized by the first pressure plate and the second pressure plate located above the first pressure plate to the first pressure plate The sheet is stretched in the planar direction to form a sealing resin sheet containing no solvent. Since the solvent is not contained in the resin body, the solvent is not vaporized during the production of the resin sheet for sealing. Therefore, it is difficult to generate a bubble mark on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
繼而，為了達成上述目的，本發明之密封用樹脂片材之製造方法係製造密封安裝於基板上之電子零件的密封用樹脂片材之方法，其特徵在於包含：第1步驟，其係於第1加壓板之一面，配置形成上述密封用樹脂片材之外緣之外框，於由所配置之上述外框包圍之上述第1加壓板之一面上供給不包含溶劑之液狀樹脂；及第2步驟，其係以成為半硬化狀態之溫度加熱供給於由上述外框包圍之上述第1加壓板之一面上之上述樹脂，並藉由上述第1加壓板、及位於該第1加壓板之上方之第2加壓板加壓而形成不包含溶劑之上述密封用樹脂片材。 In order to achieve the above object, a method for producing a resin sheet for sealing according to the present invention is a method for producing a resin sheet for sealing of an electronic component mounted on a substrate, comprising the first step of a one surface of the pressure plate is disposed to form a frame other than the outer edge of the sealing resin sheet, and a liquid resin containing no solvent is supplied to one surface of the first pressure plate surrounded by the outer frame disposed; And a second step of heating the resin supplied to one surface of the first pressure plate surrounded by the outer frame at a temperature of a semi-hardened state, and the first pressure plate and the first The second pressurizing plate above the pressure plate is pressurized to form the above-mentioned resin sheet for sealing which does not contain a solvent.
於上述構成中，在第1加壓板之一面，配置形成密封用樹脂片材之外緣之外框，於由所配置之外框包圍之第1加壓板之一面上供給不包含溶劑之液狀樹脂，以成為半硬化狀態之溫度加熱供給於第1加壓板之一面上之液狀樹脂，並藉由第1加壓板、及位於第1加壓板之上方之第2加壓板加壓而形成不包含溶劑之密封用樹脂片材。於以成為半硬化狀態之溫度加熱之液狀樹脂中不包含溶劑，因此密封用樹脂片材之製造過程中不會有溶劑氣化之情況。因此，難以於密封用樹脂片材之表面產生氣泡痕跡，從而可將電子零件氣密密封。 In the above-described configuration, the outer surface of the outer surface of the sealing resin sheet is placed on one surface of the first pressure plate, and the solvent is not supplied to one surface of the first pressure plate surrounded by the outer frame. The liquid resin heats the liquid resin supplied to one surface of the first pressure plate at a temperature of a semi-hardened state, and the first pressure plate and the second pressure above the first pressure plate The sheet is pressurized to form a sealing resin sheet containing no solvent. Since the solvent is not contained in the liquid resin heated at the temperature of the semi-hardened state, the solvent is not vaporized during the production of the resin sheet for sealing. Therefore, it is difficult to generate a bubble mark on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
根據上述構成，於樹脂體中不包含溶劑，因此密封樹脂片材之製造過程中不會有溶劑氣化之情況。因此，難以於密封用樹脂片材之表面產生氣泡痕跡，從而可將電子零件 氣密密封。 According to the above configuration, since the solvent is not contained in the resin body, the solvent does not vaporize during the production process of the sealing resin sheet. Therefore, it is difficult to generate a bubble mark on the surface of the sealing resin sheet, so that the electronic part can be Hermetic seal.
又，根據上述構成，於以成為半硬化狀態之溫度加熱之液狀之樹脂中不包含溶劑，因此密封用樹脂片材之製造過程中不會有溶劑氣化之情況。因此，難以於密封用樹脂片材之表面產生氣泡痕跡，從而可將電子零件氣密密封。 Moreover, according to the above configuration, since the solvent is not contained in the liquid resin heated at the temperature of the semi-hardened state, the solvent does not vaporize during the production of the resin sheet for sealing. Therefore, it is difficult to generate a bubble mark on the surface of the sealing resin sheet, and the electronic component can be hermetically sealed.
以下，一面參照圖式，一面詳細地對本發明之實施形態進行說明。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(實施形態1) (Embodiment 1)
圖1係表示本發明之實施形態1之附有保護膜之密封用樹脂片材的構成之概略圖。如圖1所示，附有保護膜之密封用樹脂片材3包括密封用樹脂片材1、及設置於密封用樹脂片材1之兩面之保護膜2。密封用樹脂片材1係密封安裝於基板上之電子零件之樹脂片材，且係半硬化狀態之熱硬化性樹脂(例如，環氧樹脂)。為了容易操作，密封用樹脂片材1之兩面設置有保護膜2。對於保護膜2只要使用耐於密封用樹脂片材1之硬化溫度之樹脂材料即可。又，保護膜2為膜狀或薄層片材狀，例如PET(Polyethylene Terephthalate，聚對苯二甲酸乙二酯)、PTFE(Polytetra Fluorethylene，聚四氟乙烯)等。再者，並不限定於在密封用樹脂片材1之兩面設置有保護膜2之情形，亦可僅於單面(至少一面)設置有保護膜2。又，藉由使用具有導電性之材料形成保護膜2作為導電體層，而可製造設置有導電體層之密封用樹脂片材1。 Fig. 1 is a schematic view showing a configuration of a resin sheet for sealing with a protective film according to Embodiment 1 of the present invention. As shown in FIG. 1 , the sealing resin sheet 3 with a protective film includes a sealing resin sheet 1 and a protective film 2 provided on both surfaces of the sealing resin sheet 1 . The resin sheet for sealing 1 seals a resin sheet of an electronic component mounted on a substrate, and is a thermosetting resin (for example, an epoxy resin) in a semi-hardened state. The protective film 2 is provided on both surfaces of the sealing resin sheet 1 for ease of handling. The protective film 2 may be a resin material that is resistant to the curing temperature of the resin sheet for sealing 1 . Further, the protective film 2 is in the form of a film or a thin sheet, and examples thereof include PET (Polyethylene Terephthalate) and PTFE (Polytetra Fluorethylene). Further, the protective film 2 is not limited to the case where the protective film 2 is provided on both surfaces of the sealing resin sheet 1, and the protective film 2 may be provided only on one side (at least one side). Moreover, by forming the protective film 2 as a conductor layer using a material having conductivity, it is possible to manufacture the sealing resin sheet 1 provided with the conductor layer.
繼而，圖2係表示本發明之實施形態1之密封用樹脂片材1之製造方法的概略圖。首先，如圖2(a)所示，準備圓筒形之模型20，將液狀之樹脂21放入至模型20，藉由熱處理使其成為半硬化狀態而形成樹脂體22。液狀之樹脂21為環氧樹脂，不包含溶劑。所形成之樹脂體22之厚度大於製造之密封用樹脂片材1之膜厚。再者，亦可藉由縱向較長之圓筒形之模型20形成樹脂體22，進行切割而形成所期望之厚度之樹脂體22。又，使液狀之樹脂21為半硬化狀態之熱處理係根據液狀之樹脂21之材料而不同，但例如藉由烘箱等以40℃~160℃加熱5分鐘~120分鐘。 Next, Fig. 2 is a schematic view showing a method of manufacturing the sealing resin sheet 1 according to the first embodiment of the present invention. First, as shown in Fig. 2(a), a cylindrical mold 20 is prepared, and the liquid resin 21 is placed in the mold 20, and the resin body 22 is formed in a semi-hardened state by heat treatment. The liquid resin 21 is an epoxy resin and does not contain a solvent. The thickness of the formed resin body 22 is larger than the film thickness of the sealing resin sheet 1 to be produced. Further, the resin body 22 may be formed by a cylindrical mold 20 having a long longitudinal direction, and cut to form a resin body 22 having a desired thickness. Further, the heat treatment for changing the liquid resin 21 in a semi-hardened state differs depending on the material of the liquid resin 21, but it is heated at 40 ° C to 160 ° C for 5 minutes to 120 minutes by, for example, an oven.
繼而，如圖2(b)所示，準備加壓板(第1加壓板)23，於加壓板23之一面配置用以調整密封用樹脂片材1之膜厚之分隔件24，於由所配置之分隔件24包圍之加壓板23之一面載置保護膜2。對保護膜2及分隔件24實施脫模處理，以便於製造後可與密封用樹脂片材1分離。於密封用樹脂片材1上未設置保護膜2之情形時，對加壓板23實施脫模處理。再者，加壓板23及分隔件24中使用之材料只要為即便加壓亦可維持形狀即可，有不鏽鋼(SUS(Steel Use Stainless))、鋁(Al)、PET、PTFE等。 Then, as shown in FIG. 2(b), a pressure plate (first pressure plate) 23 is prepared, and a separator 24 for adjusting the film thickness of the resin sheet for sealing 1 is disposed on one surface of the pressure plate 23, and The protective film 2 is placed on one side of the pressurizing plate 23 surrounded by the disposed separator 24. The protective film 2 and the separator 24 are subjected to a release treatment so as to be separated from the sealing resin sheet 1 after the production. When the protective film 2 is not provided on the resin sheet for sealing 1, the pressure plate 23 is subjected to a mold release treatment. In addition, the material used for the pressure plate 23 and the separator 24 may be a shape which can maintain a shape even if it is pressurized, and may be stainless steel (SUS (Steel Use Stainless), aluminum (Al), PET, PTFE, etc.).
繼而，如圖2(c)所示，將不包含溶劑之樹脂體22供給至加壓板23之上方、即供給於載置於加壓板23之一面之保護膜2上之大致中央部。樹脂體22之厚度大於分隔件24之高度。 Then, as shown in FIG. 2(c), the resin body 22 containing no solvent is supplied to the upper portion of the pressure plate 23, that is, to the substantially central portion of the protective film 2 placed on one surface of the pressure plate 23. The thickness of the resin body 22 is greater than the height of the partition member 24.
繼而，如圖2(d)所示，於樹脂體22上載置保護膜2。載 置於樹脂體22上之保護膜2與載置於加壓板23之一面之保護膜2為相同之形狀且為相同之材料，但亦可為與載置於加壓板23之一面之保護膜2不同之形狀且不同之材料。亦對載置於樹脂體22上之保護膜2實施脫模處理，以便於製造後可與密封用樹脂片材1分離。 Then, as shown in FIG. 2(d), the protective film 2 is placed on the resin body 22. Load The protective film 2 placed on the resin body 22 has the same shape and the same material as the protective film 2 placed on one surface of the pressure plate 23, but may be protected from being placed on one side of the pressure plate 23. The film 2 has different shapes and different materials. The protective film 2 placed on the resin body 22 is also subjected to a release treatment so as to be separated from the sealing resin sheet 1 after the production.
繼而，如圖2(e)所示，以低於硬化溫度之溫度(例如160℃)加熱(加熱時間為120分鐘以下)樹脂體22，藉由加壓板23、及位於加壓板23之上方之加壓板(第2加壓板)25挾持並加壓，藉此於加壓板23之平面方向上拉長而製造半硬化狀態之密封用樹脂片材1。對所製造之密封用樹脂片材1自50℃加熱至350℃為止，熱提取認為來自溶劑之氣體並藉由GC-MS(Gas Chromatography Mass Spectrometer，氣相層析質譜分析計)進行分析，結果確認出認為來自溶劑之氣體為檢測極限以下，所製造出之密封用樹脂片材1中不包含溶劑。GC-MS係使用安捷倫科技(Agilent Technologies)公司製造之Agilent 7890A/5975C GC/MSD系統。再者，藉由兩片加壓板23、25挾持由兩片保護膜2夾住之樹脂體22並加壓，藉此可製造附有保護膜之密封用樹脂片材3。兩片加壓板23、25亦挾持用以調整密封用樹脂片材1之膜厚之分隔件24，因此可藉由兩片加壓板23、25挾持樹脂體22並加壓直至密封用樹脂片材1之膜厚變得與分隔件24之高度相同為止，從而可製造均勻之膜厚之密封用樹脂片材1。藉由變更分隔件24之高度，而可製造所期望之膜厚之密封用樹脂片材1。加壓板25與加壓板23為相同之形狀且 相同之材料，但亦可為與加壓板23不同之形狀且不同之材料。於密封用樹脂片材1上未設置保護膜2之情形時，對加壓板25實施脫模處理，以便於製造後可與密封用樹脂片材1分離。 Then, as shown in FIG. 2(e), the resin body 22 is heated at a temperature lower than the curing temperature (for example, 160 ° C) (heating time is 120 minutes or less), by the pressure plate 23, and at the pressure plate 23 The upper pressurizing plate (second pressurizing plate) 25 is held and pressurized, and is elongated in the planar direction of the pressurizing plate 23 to produce a semi-cured sealing resin sheet 1. The resin sheet 1 for sealing produced was heated from 50 ° C to 350 ° C, and the gas from the solvent was extracted by hot extraction and analyzed by GC-MS (Gas Chromatography Mass Spectrometer). It was confirmed that the gas derived from the solvent was not more than the detection limit, and the sealing resin sheet 1 produced did not contain a solvent. The GC-MS system used an Agilent 7890A/5975C GC/MSD system manufactured by Agilent Technologies. Further, the resin body 22 sandwiched between the two protective films 2 is held by the two pressing plates 23 and 25 and pressurized, whereby the sealing resin sheet 3 with the protective film can be produced. The two pressing plates 23 and 25 also hold the separator 24 for adjusting the film thickness of the sealing resin sheet 1, so that the resin body 22 can be held by the two pressing plates 23 and 25 and pressurized until the sealing resin is used. The film thickness of the sheet 1 becomes the same as the height of the separator 24, and a resin sheet 1 for sealing having a uniform film thickness can be produced. By changing the height of the separator 24, the resin sheet 1 for sealing having a desired film thickness can be produced. The pressing plate 25 and the pressing plate 23 have the same shape and The same material, but may be a material different from the pressure plate 23 and different materials. When the protective film 2 is not provided on the sealing resin sheet 1, the pressure plate 25 is subjected to a release treatment so as to be separated from the sealing resin sheet 1 after the production.
由於形成密封用樹脂片材1之外緣之外框係由分隔件24形成，因此可將樹脂體22拉長至與分隔件24接觸為止。而且，可由分隔件24形成密封用樹脂片材1之外緣，因此無需於製造後切割多餘之部分。 Since the frame is formed by the spacer 24 in addition to the outer edge of the resin sheet 1 for sealing, the resin body 22 can be elongated until it comes into contact with the separator 24. Moreover, the outer edge of the sealing resin sheet 1 can be formed by the spacer 24, so that it is not necessary to cut the excess portion after the production.
繼而，對作為對樹脂體22進行加壓之機構(加壓機構)使用之真空壓製機進行說明。圖3係表示本發明之實施形態1之密封用樹脂片材1之製造方法中使用的真空壓製機之構成之概略圖。圖3所示之真空壓製機30係藉由兩片加壓板23、25挾持由兩片保護膜2夾住之樹脂體22及分隔件24，並由兩片壓製板31夾持而對樹脂體22進行加壓。真空壓製機30係可製作真空狀態(例如5000 Pa以下)。藉由在真空狀態下對樹脂體22進行加壓，而不會產生氣泡進入至密封用樹脂片材1之不良狀況。自真空狀態開放大氣，於冷卻後自真空壓製機30取出經加壓而拉長之樹脂體22，藉此可製造附有保護膜之密封用樹脂片材3。於可藉由其他機構避免氣泡進入至密封用樹脂片材1之不良狀況之情形時，可使用於大氣狀態下進行壓製之壓製機而非真空壓製機30。又，只要可藉由真空壓製機30一面調整膜厚，一面對樹脂體22進行加壓，則無需藉由兩片加壓板23、25挾持分隔件24。 Next, a vacuum press used as a mechanism (pressurizing means) for pressurizing the resin body 22 will be described. Fig. 3 is a schematic view showing the configuration of a vacuum press used in the method for producing the resin sheet for sealing 1 according to the first embodiment of the present invention. The vacuum press machine 30 shown in Fig. 3 holds the resin body 22 and the partition member 24 sandwiched by the two protective films 2 by two press plates 23, 25, and is held by the two press plates 31 to the resin. The body 22 is pressurized. The vacuum press 30 can be made into a vacuum state (for example, 5000 Pa or less). By pressurizing the resin body 22 in a vacuum state, there is no problem that air bubbles enter the sealing resin sheet 1. When the atmosphere is opened in a vacuum state, the resin body 22 which is stretched and stretched is taken out from the vacuum press machine 30 after cooling, whereby the sealing resin sheet 3 with the protective film can be manufactured. In the case where the bubble can be prevented from entering the sealing resin sheet 1 by other means, the press for pressing in the atmosphere can be used instead of the vacuum press 30. Further, as long as the film thickness can be adjusted by the vacuum press machine 30 and the resin body 22 is pressed, it is not necessary to hold the separator 24 by the two press plates 23 and 25.
對樹脂體22進行加壓之加壓機構並不限定於真空壓製機30。圖4係表示本發明之實施形態1之密封用樹脂片材1之製造方法中使用的另一加壓機構之構成之概略圖。圖4所示之加壓機構係藉由兩片加壓板23、25挾持由兩片保護膜2夾住之樹脂體22及分隔件24並放入至具有氣體遮斷性之層壓袋(袋)40，藉由減壓袋裝置(未圖示)對層壓袋40之內部進行減壓而密封。對經減壓而密封之層壓袋40內之樹脂體22，自層壓袋40之外部施加因開放大氣產生之壓力並進而進行加熱。作為加壓機構，使用層壓袋40與減壓袋裝置，藉此與使用高價之真空壓製機30之情形相比，可抑制密封用樹脂片材1之製造成本。又，將藉由兩片加壓板23、25挾持之樹脂體22及分隔件24放入至具有氣體遮斷性之層壓袋40，對層壓袋40之內部進行減壓而密封，因此不會產生氣泡進入至密封用樹脂片材1之不良狀況。進而，可一面對經減壓而密封之層壓袋40內之樹脂體22進行加壓一面冷卻，從而可維持密封用樹脂片材1之形狀。 The pressurizing mechanism for pressurizing the resin body 22 is not limited to the vacuum press machine 30. Fig. 4 is a schematic view showing the configuration of another pressurizing mechanism used in the method for producing the resin sheet for sealing 1 according to the first embodiment of the present invention. The pressurizing mechanism shown in FIG. 4 holds the resin body 22 and the separator 24 sandwiched by the two protective films 2 by two pressing plates 23, 25 and puts them into a laminated bag having gas barrier properties ( The bag 40 is sealed by decompressing the inside of the laminated bag 40 by a pressure reducing bag device (not shown). The resin body 22 in the laminated bag 40 sealed under reduced pressure is applied from the outside of the laminated bag 40 to the pressure generated by the open atmosphere and further heated. As the pressurizing mechanism, the laminating bag 40 and the decompression bag device are used, whereby the manufacturing cost of the sealing resin sheet 1 can be suppressed as compared with the case of using the expensive vacuum press 30. Further, the resin body 22 and the separator 24 held by the two pressurizing plates 23 and 25 are placed in the laminated bag 40 having gas barrier properties, and the inside of the laminated bag 40 is pressure-reduced and sealed. There is no problem that air bubbles enter the sealing resin sheet 1. Further, the resin body 22 in the laminated bag 40 sealed under reduced pressure can be cooled while being pressurized, whereby the shape of the sealing resin sheet 1 can be maintained.
圖5係藉由先前之密封用樹脂片材94之製造方法製造之密封用樹脂片材94的表面狀態之圖像之例示圖，圖6係表示藉由本發明之實施形態1之密封用樹脂片材1之製造方法製造之密封用樹脂片材1的表面狀態之圖像之例示圖。如圖5所示，於塗佈包含溶劑之液狀之樹脂而製造之密封用樹脂片材94的表面，產生有無數個較小之氣泡痕跡。另一方面，如圖6所示，可明確於對不包含溶劑之樹脂體22進行加壓而製造之密封用樹脂片材1之表面，幾乎未產生氣 泡痕跡。 Fig. 5 is a view showing an image of the surface state of the sealing resin sheet 94 produced by the method for producing the sealing resin sheet 94, and Fig. 6 is a view showing the resin sheet for sealing according to the first embodiment of the present invention. An illustration of an image of the surface state of the sealing resin sheet 1 produced by the method for producing the material 1. As shown in FIG. 5, there are numerous small bubble marks on the surface of the sealing resin sheet 94 produced by applying a liquid resin containing a solvent. On the other hand, as shown in FIG. 6, it is clear that the surface of the sealing resin sheet 1 produced by pressurizing the resin body 22 containing no solvent hardly generates gas. Bubble traces.
如上所述，根據本發明之實施形態1，由於樹脂體22中不包含溶劑，因此密封用樹脂片材1之製造過程中不會有溶劑氣化之情況。因此，難以於密封用樹脂片材1之表面產生氣泡痕跡，從而可將電子零件氣密密封。 As described above, according to the first embodiment of the present invention, since the resin body 22 does not contain a solvent, the solvent is not vaporized during the production of the sealing resin sheet 1. Therefore, it is difficult to generate a bubble mark on the surface of the sealing resin sheet 1, and the electronic component can be hermetically sealed.
又，於先前之製造方法中，於對實施有脫模處理之支持膜103塗佈液狀之環氧樹脂組合物(樹脂)102之情形時，使用包含溶劑、及聚矽氧油等調平劑之液狀之環氧樹脂組合物102。於液狀之環氧樹脂組合物102包含調平劑之情形時，破泡性劣化而氣泡變得易於滯留於樹脂中。另一方面，於本實施形態1之密封用樹脂片材1之製造方法中，樹脂體22中既不包含溶劑亦不包含調平劑，因此氣泡滯留於樹脂中之可能性亦變低。 Further, in the case of applying the liquid epoxy resin composition (resin) 102 to the support film 103 subjected to the release treatment in the prior art, a solvent including a solvent and a polyoxygenated oil are used for leveling. A liquid epoxy resin composition 102 of the agent. When the liquid epoxy resin composition 102 contains a leveling agent, the foam breaking property is deteriorated and the bubbles become easily retained in the resin. On the other hand, in the method for producing the resin sheet for sealing 1 of the first embodiment, the resin body 22 does not contain a solvent or a leveling agent, and therefore the possibility of the bubbles remaining in the resin is also low.
進而，圖7係表示本發明之實施形態1之密封用樹脂片材1之製造方法中使用的加壓板及分隔件之另一構成之概略圖。如圖7所示，藉由平板狀之加壓板23與凸形狀之加壓板25a挾持由兩片保護膜2夾住之樹脂體22及分隔件24，該凸形狀之加壓板25a係與配置於加壓板23之一面之分隔件24嵌合。藉由使用凸形狀之加壓板25a，而可進一步加壓樹脂體22，從而可製造高密度之密封用樹脂片材1。 Furthermore, FIG. 7 is a schematic view showing another configuration of a pressure plate and a separator used in the method for producing the resin sheet for sealing 1 according to the first embodiment of the present invention. As shown in FIG. 7, the resin body 22 and the separator 24 sandwiched by the two protective films 2 are held by the flat pressing plate 23 and the convex pressing plate 25a, and the convex pressing plate 25a is attached. It is fitted to the partition member 24 disposed on one surface of the pressure plate 23. By using the pressing plate 25a having a convex shape, the resin body 22 can be further pressed, whereby the high-density sealing resin sheet 1 can be produced.
又，圖8係表示本發明之實施形態1之密封用樹脂片材1之製造方法中使用的加壓板及分隔件之又一構成之概略圖。如圖8所示，藉由使分隔件與加壓板一體成形之加壓板23a及平板狀之加壓板25挾持由兩片保護膜2夾住之樹脂 體22。無需於加壓板之一面配置分隔件之步驟，從而可抑制密封用樹脂片材1之製造成本。再者，保護膜2係沿加壓板23a及加壓板25之形狀而載置，因此加壓板23a及加壓板25不會直接與樹脂體22接觸。因此，無需為了於製造後可與密封用樹脂片材1分離，而對加壓板23a及加壓板25實施脫模處理。 In addition, FIG. 8 is a schematic view showing still another configuration of the pressure plate and the separator used in the method for producing the resin sheet for sealing 1 according to the first embodiment of the present invention. As shown in FIG. 8, the pressure plate 23a integrally formed with the separator and the pressure plate and the flat pressure plate 25 hold the resin sandwiched by the two protective films 2 Body 22. There is no need to arrange the separator on one side of the pressurizing plate, so that the manufacturing cost of the sealing resin sheet 1 can be suppressed. Further, since the protective film 2 is placed along the shape of the pressurizing plate 23a and the pressurizing plate 25, the pressurizing plate 23a and the pressurizing plate 25 are not directly in contact with the resin body 22. Therefore, it is not necessary to perform a mold release treatment on the pressurizing plate 23a and the pressurizing plate 25 in order to be separated from the sealing resin sheet 1 after the production.
又，能夠設計為不受保護膜2之厚度影響，而使形成於使分隔件與加壓板一體成形之加壓板23a之凹部之深度與密封用樹脂片材1之厚度變得相同。 Moreover, it is possible to design such that the depth of the concave portion formed in the pressurizing plate 23a in which the partition member and the pressurizing plate are integrally formed is the same as the thickness of the sealing resin sheet 1 without being affected by the thickness of the protective film 2.
進而，圖9係表示本發明之實施形態1之密封用樹脂片材1之製造方法中使用的加壓板及分隔件之進而又一構成之概略圖。如圖9所示，藉由平板狀之兩片加壓板23、25挾持由兩片保護膜2夾住之樹脂體22及分隔件24。而且，於載置於加壓板23之一面之保護膜2上配置有分隔件24。於載置於加壓板23之一面之保護膜2上配置有分隔件24，因此可容易地將加壓板23與分隔件24分離。 Furthermore, FIG. 9 is a schematic view showing still another configuration of the pressure plate and the separator used in the method for producing the resin sheet for sealing 1 according to the first embodiment of the present invention. As shown in Fig. 9, the resin body 22 and the separator 24 sandwiched by the two protective films 2 are held by two flat pressing plates 23, 25. Further, a separator 24 is disposed on the protective film 2 placed on one surface of the pressure plate 23. The separator 24 is disposed on the protective film 2 placed on one surface of the pressure plate 23, so that the pressure plate 23 and the separator 24 can be easily separated.
(實施形態2) (Embodiment 2)
本發明之實施形態2之密封用樹脂片材1之製造方法係不形成半硬化狀態之樹脂體22而製造密封用樹脂片材1之方法。圖10係表示本發明之實施形態2之密封用樹脂片材1之製造方法的概略圖。首先，如圖10(a)所示，準備加壓板(第1加壓板)81，於加壓板81之一面配置形成密封用樹脂片材1之外緣之外框82，於由所配置之外框82包圍之加壓板81之一面載置保護膜2。對保護膜2及外框82實施脫模處 理，以便於製造後可與密封用樹脂片材1分離。再者，於密封用樹脂片材1上未設置保護膜2之情形時，對加壓板81實施脫模處理。又，使用於加壓板81及外框82之材料只要為即便加壓亦可維持形狀之材料即可，有不鏽鋼(SUS)、鋁(Al)、PET、PTFE等。 The method for producing the resin sheet for sealing 1 according to the second embodiment of the present invention is a method for producing the resin sheet for sealing 1 without forming the resin body 22 in a semi-hardened state. Fig. 10 is a schematic view showing a method of manufacturing the resin sheet for sealing 1 according to the second embodiment of the present invention. First, as shown in Fig. 10 (a), a pressure plate (first pressure plate) 81 is prepared, and a frame 82 other than the outer edge of the sealing resin sheet 1 is placed on one surface of the pressure plate 81. The protective film 2 is placed on one surface of the pressurizing plate 81 surrounded by the outer frame 82. Performing a mold release on the protective film 2 and the outer frame 82 Therefore, it can be separated from the sealing resin sheet 1 after manufacture. In the case where the protective film 2 is not provided on the resin sheet for sealing 1, the pressurizing plate 81 is subjected to a mold release treatment. Further, the material used for the pressure plate 81 and the outer frame 82 may be a material that can maintain its shape even under pressure, and may be stainless steel (SUS), aluminum (Al), PET, PTFE or the like.
繼而，如圖10(b)所示，藉由分注器等向由所配置之外框82包圍之加壓板81之一面上供給液狀之樹脂83。液狀之樹脂83為環氧樹脂，且不包含溶劑。 Then, as shown in FIG. 10(b), the liquid resin 83 is supplied to one surface of the pressure plate 81 surrounded by the disposed outer frame 82 by a dispenser or the like. The liquid resin 83 is an epoxy resin and does not contain a solvent.
繼而，如圖10(c)所示，於供給於加壓板81之一面上之液狀之樹脂83上載置保護膜2。載置於液狀之樹脂83上之保護膜2與載置於加壓板81之一面的保護膜2為相同之形狀且相同之材料，但亦可為與載置於加壓板81之一面之保護膜2不同之形狀且不同之材料。 Then, as shown in FIG. 10(c), the protective film 2 is placed on the liquid resin 83 supplied to one surface of the pressure plate 81. The protective film 2 placed on the liquid resin 83 has the same shape and the same material as the protective film 2 placed on one surface of the pressure plate 81, but may be placed on one side of the pressure plate 81. The protective film 2 has different shapes and different materials.
繼而，如圖10(d)所示，以成為半硬化狀態之溫度(例如160℃)加熱(加熱時間為120分鐘以下)由兩片保護膜2夾住之液狀之樹脂83，藉由加壓板81、及位於加壓板81之上方之加壓板(第2加壓板)84加壓，藉此製造半硬化狀態之密封用樹脂片材1。藉由進行與實施形態1相同之分析，確認出於所製造之密封用樹脂片材1中不包含溶劑。配置於加壓板81之一面之外框82亦作為用以調整密封用樹脂片材1之膜厚的分隔件發揮功能，因此可藉由變更外框82之高度而製作所期望之膜厚之密封用樹脂片材1。再者，加壓板84係與加壓板81相同之形狀且相同之材料，但亦可為與加壓板81不同之形狀且不同之材料。又，對於藉由兩片加壓板 81、84對液狀之樹脂83進行加壓之加壓機構，可使用與實施形態1相同之加壓機構(例如，真空壓製機30、層壓袋40、及減壓袋裝置)。 Then, as shown in FIG. 10(d), the liquid resin 83 is sandwiched between the two protective films 2 by heating at a temperature (for example, 160 ° C) in a semi-hardened state (heating time is 120 minutes or less). The pressure plate 81 and the pressure plate (second pressure plate) 84 located above the pressure plate 81 are pressurized to produce a resin sheet 1 for sealing in a semi-hardened state. By the same analysis as in the first embodiment, it was confirmed that the sealing resin sheet 1 to be produced does not contain a solvent. The frame 82 disposed on one surface of the pressure plate 81 also functions as a separator for adjusting the film thickness of the sealing resin sheet 1. Therefore, the desired film thickness can be sealed by changing the height of the outer frame 82. A resin sheet 1 was used. Further, the pressurizing plate 84 is the same shape and material as the pressurizing plate 81, but may be a material different from the pressurizing plate 81 and different materials. Also, by using two pressure plates 81 and 84 The pressurizing mechanism for pressurizing the liquid resin 83 can be the same as that of the first embodiment (for example, the vacuum press 30, the lamination bag 40, and the decompression bag device).
如上所述，本發明之實施形態2之密封用樹脂片材1之製造方法係於加壓板81之一面配置形成密封用樹脂片材1之外緣之外框82，於由所配置之外框82包圍之加壓板81之一面上供給不包含溶劑之液狀之樹脂83，以成為半硬化狀態之溫度加熱供給於加壓板81之一面上之液狀樹脂83，藉由加壓板81及位於加壓板81之上方之加壓板84進行加壓，因此密封用樹脂片材1之製造過程中不會有溶劑氣化之情況。因此，難以於密封用樹脂片材1之表面產生氣泡痕跡，從而可將電子零件氣密密封。 As described above, in the method of manufacturing the resin sheet for sealing 1 according to the second embodiment of the present invention, the outer peripheral edge of the sealing resin sheet 1 is disposed on one surface of the pressure plate 81, and the frame 82 is disposed outside the frame. A liquid resin 83 containing no solvent is supplied to one surface of the pressurizing plate 81 surrounded by the frame 82, and the liquid resin 83 supplied to one surface of the pressurizing plate 81 is heated at a temperature of a semi-hardened state by a pressurizing plate. Since the pressure plate 81 located above the pressure plate 81 is pressurized, the solvent sheet of the sealing resin sheet 1 is not vaporized during the production process. Therefore, it is difficult to generate a bubble mark on the surface of the sealing resin sheet 1, and the electronic component can be hermetically sealed.
1‧‧‧密封用樹脂片材 1‧‧‧Seal sheet for sealing
2‧‧‧保護膜 2‧‧‧Protective film
3‧‧‧附有保護膜之密封用樹脂片材 3‧‧‧Resin sheet for sealing film with protective film
20‧‧‧模型 20‧‧‧ model
21‧‧‧液狀之樹脂 21‧‧‧Liquid resin
22‧‧‧樹脂體 22‧‧‧ resin body
23‧‧‧加壓板 23‧‧‧ Pressurized plate
24‧‧‧分隔件 24‧‧‧Parts
25‧‧‧加壓板 25‧‧‧ Pressurized plate
30‧‧‧真空壓製機 30‧‧‧Vacuum press
31‧‧‧壓製板 31‧‧‧ Pressing board
40‧‧‧層壓袋 40‧‧‧ laminated bags
81‧‧‧加壓板 81‧‧‧pressure plate
82‧‧‧外框 82‧‧‧Front frame
83‧‧‧液狀之樹脂 83‧‧‧Liquid resin
84‧‧‧加壓板 84‧‧‧pressure plate
圖1係表示本發明之實施形態1之附有保護膜之密封用樹脂片材之構成的概略圖。 Fig. 1 is a schematic view showing the configuration of a resin sheet for sealing with a protective film according to the first embodiment of the present invention.
圖2(a)~(e)係表示本發明之實施形態1之密封用樹脂片材之製造方法的概略圖。 2(a) to 2(e) are schematic views showing a method of producing a resin sheet for sealing according to Embodiment 1 of the present invention.
圖3係表示本發明之實施形態1之密封用樹脂片材之製造方法中使用的真空壓製機之構成之概略圖。 Fig. 3 is a schematic view showing the configuration of a vacuum press used in the method for producing a resin sheet for sealing according to the first embodiment of the present invention.
圖4係表示本發明之實施形態1之密封用樹脂片材之製造方法中使用的另一加壓機構之構成之概略圖。 Fig. 4 is a schematic view showing the configuration of another pressurizing mechanism used in the method for producing a resin sheet for sealing according to the first embodiment of the present invention.
圖5係表示藉由先前之密封用樹脂片材之製造方法製造的密封用樹脂片材之表面狀態之圖像的例示圖。 FIG. 5 is a view showing an image of the surface state of the resin sheet for sealing produced by the method for producing a resin sheet for sealing.
圖6係表示藉由本發明之實施形態1之密封用樹脂片材之 製造方法製造的密封用樹脂片材之表面狀態之圖像的例示圖。 Fig. 6 is a view showing a resin sheet for sealing according to the first embodiment of the present invention. An illustration of an image of the surface state of the resin sheet for sealing produced by the production method.
圖7係表示本發明之實施形態1之密封用樹脂片材之製造方法中使用的加壓板及分隔件之另一構成之概略圖。 Fig. 7 is a schematic view showing another configuration of a pressure plate and a separator used in the method for producing a resin sheet for sealing according to the first embodiment of the present invention.
圖8係表示本發明之實施形態1之密封用樹脂片材之製造方法中使用的加壓板及分隔件之又一構成之概略圖。 Fig. 8 is a schematic view showing still another configuration of a pressure plate and a separator used in the method for producing a resin sheet for sealing according to the first embodiment of the present invention.
圖9係表示本發明之實施形態1之密封用樹脂片材之製造方法中使用的加壓板及分隔件之進而又一構成之概略圖。 Fig. 9 is a schematic view showing still another configuration of a pressure plate and a separator used in the method for producing a resin sheet for sealing according to the first embodiment of the present invention.
圖10(a)~(d)係表示本發明之實施形態2之密封用樹脂片材之製造方法的概略圖。 (a) to (d) of FIG. 10 are schematic views showing a method of producing a resin sheet for sealing according to a second embodiment of the present invention.
圖11(a)~(c)係表示使用密封用樹脂片材而形成密封樹脂層之電子零件模組之製造方法之概略圖。 (a) to (c) of FIG. 11 are schematic views showing a method of manufacturing an electronic component module in which a sealing resin layer is formed using a resin sheet for sealing.
圖12係表示專利文獻1中所揭示之密封用樹脂片材之製造方法之概略圖。 FIG. 12 is a schematic view showing a method of producing a resin sheet for sealing disclosed in Patent Document 1.
1‧‧‧密封用樹脂片材 1‧‧‧Seal sheet for sealing
2‧‧‧保護膜 2‧‧‧Protective film
3‧‧‧附有保護膜之密封用樹脂片材 3‧‧‧Resin sheet for sealing film with protective film
20‧‧‧模型 20‧‧‧ model
21‧‧‧液狀之樹脂 21‧‧‧Liquid resin
22‧‧‧樹脂體 22‧‧‧ resin body
23‧‧‧加壓板 23‧‧‧ Pressurized plate
24‧‧‧分隔件 24‧‧‧Parts
25‧‧‧加壓板 25‧‧‧ Pressurized plate
Claims (2)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011226581 | 2011-10-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201318807A true TW201318807A (en) | 2013-05-16 |
| TWI480147B TWI480147B (en) | 2015-04-11 |
Family
ID=48081734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101132388A TWI480147B (en) | 2011-10-14 | 2012-09-05 | A method for producing a resin sheet for sealing |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2013054677A1 (en) |
| CN (1) | CN103946004A (en) |
| TW (1) | TWI480147B (en) |
| WO (1) | WO2013054677A1 (en) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0966523A (en) * | 1995-08-30 | 1997-03-11 | Toshiba Chem Corp | Manufacture of semiconductor sealing resin molding |
| JP3779091B2 (en) * | 1999-04-08 | 2006-05-24 | 日東電工株式会社 | Resin composition for sealing |
| JP2009029930A (en) * | 2007-07-26 | 2009-02-12 | Panasonic Electric Works Co Ltd | Manufacturing method for adhesive sheet with mold release film |
| JP2010003857A (en) * | 2008-06-20 | 2010-01-07 | Panasonic Corp | Hot press device and method of manufacturing electronic device |
| CN201338359Y (en) * | 2008-11-19 | 2009-11-04 | 上海工程技术大学 | Uniform temperature hot pressing die device for forming shape of thermoset plastics plate |
| JP5382693B2 (en) * | 2009-02-04 | 2014-01-08 | アピックヤマダ株式会社 | Compression molding method |
| JP2010219420A (en) * | 2009-03-18 | 2010-09-30 | Fuji Electric Systems Co Ltd | Semiconductor device |
| CN102194707B (en) * | 2010-03-01 | 2013-03-27 | 南茂科技股份有限公司 | Method for manufacturing semiconductor structure |
| JP2011199216A (en) * | 2010-03-24 | 2011-10-06 | Renesas Electronics Corp | Method of manufacturing semiconductor device |
-
2012
- 2012-09-05 TW TW101132388A patent/TWI480147B/en active
- 2012-10-01 WO PCT/JP2012/075365 patent/WO2013054677A1/en active Application Filing
- 2012-10-01 CN CN201280050200.7A patent/CN103946004A/en active Pending
- 2012-10-01 JP JP2013538497A patent/JPWO2013054677A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN103946004A (en) | 2014-07-23 |
| WO2013054677A1 (en) | 2013-04-18 |
| JPWO2013054677A1 (en) | 2015-03-30 |
| TWI480147B (en) | 2015-04-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5189194B2 (en) | Vacuum heating joining apparatus and vacuum heating joining method | |
| JP3790724B2 (en) | Laminating apparatus and laminating method | |
| JP4935957B1 (en) | Manufacturing method of resin sheet for sealing | |
| JP5283242B2 (en) | Lamination method and laminating apparatus | |
| JP2014116115A (en) | Organic el sealing device, sealing roll film manufacturing device and organic el system | |
| US20170057152A1 (en) | Thermoforming apparatus | |
| JPH11235754A (en) | Laminate molding method and apparatus | |
| TWI483831B (en) | A manufacturing apparatus for sealing a resin sheet for sealing, and a method for producing a resin sheet for sealing | |
| KR101959151B1 (en) | Bonding method and bonding apparatus | |
| TWI480147B (en) | A method for producing a resin sheet for sealing | |
| KR20130075869A (en) | Panel laminating method and cutting method thereof | |
| JP2010272848A (en) | Method of manufacturing electronic component | |
| JP5769478B2 (en) | Transfer material and method for producing molded product using the transfer material | |
| TWI483830B (en) | A method for manufacturing a resin sheet for packaging | |
| JP2010278421A (en) | Method of manufacturing electronic component | |
| JP2003324144A (en) | Electrostatic chuck and lamination device for flat panel substrate using it | |
| KR101243561B1 (en) | Method and Equipment of Bonding Flexible Substrate for the Liquid Crystal Panel on Glass Board | |
| JP2013114186A (en) | Bonding device and manufacturing apparatus of plasma display panel | |
| CN109585681A (en) | A kind of display panel and its packaging method and display device | |
| KR102694887B1 (en) | Metal heat dissipation sheet having a carbon-based composite adhesive layer and method for manufacturing the same | |
| US20080124527A1 (en) | Envelopment of Components Arranged on a Substrate | |
| JP2003302913A (en) | System for bonding substrate for flat panel | |
| CN117222119A (en) | Manufacturing method of copper foil carrier and copper foil carrier | |
| TWI426838B (en) | Method and device for manufacturing a laminated-board assembly and laminated-board assembly thereof | |
| JP3243608B2 (en) | Vacuum laminating apparatus and vacuum laminating method |