CN117222119A - Manufacturing method of copper foil carrier and copper foil carrier - Google Patents
Manufacturing method of copper foil carrier and copper foil carrier Download PDFInfo
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- CN117222119A CN117222119A CN202210619655.1A CN202210619655A CN117222119A CN 117222119 A CN117222119 A CN 117222119A CN 202210619655 A CN202210619655 A CN 202210619655A CN 117222119 A CN117222119 A CN 117222119A
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- Prior art keywords
- copper foil
- inner liner
- carrier
- vacuum
- liner layer
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 273
- 239000011889 copper foil Substances 0.000 title claims abstract description 266
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000000853 adhesive Substances 0.000 claims description 35
- 230000001070 adhesive effect Effects 0.000 claims description 35
- 238000004806 packaging method and process Methods 0.000 claims description 33
- 238000005538 encapsulation Methods 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 238000010146 3D printing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 238000012216 screening Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 17
- 239000007788 liquid Substances 0.000 abstract description 10
- 229910052802 copper Inorganic materials 0.000 abstract description 7
- 239000010949 copper Substances 0.000 abstract description 7
- 238000003801 milling Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 6
- 230000001788 irregular Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 229940126214 compound 3 Drugs 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The application provides a method for manufacturing a copper foil carrier and the copper foil carrier, wherein the method for manufacturing the copper foil carrier comprises the following steps: the first copper foil is provided with a first surface and a second copper foil, wherein the first copper foil is provided with a first surface and a second surface, and the second copper foil is provided with a second surface, and the first surface and the second surface are respectively provided with a first surface and a second surface. The inner liner is arranged between the first copper foil and the second copper foil, and the first surfaces of the first copper foil and the second copper foil face the inner liner to form the assembly. And carrying out vacuum and hot press curing on the combination body to generate the copper foil carrier. Compared with the prior art, the manufacturing method of the copper foil carrier and the copper foil carrier provided by the application have the advantages that the copper foil carrier has certain rigidity and flatness, copper foil cannot float during circuit etching, etching liquid leakage cannot occur, and the inner liner of the carrier plate is easy to strip after positioning, fishing and milling, the surface of a copper layer is not polluted, and the like.
Description
Technical Field
The application belongs to the field of printed circuit board production, and particularly relates to a manufacturing method of a copper foil carrier and the copper foil carrier.
Background
A copper foil carrier can be used for a method for manufacturing fine circuits on copper foil and then embedding the circuits in a semi-buried mode, and fine circuits with line width L/S of less than 30um can be manufactured. Copper foil carrier requirements: a. the flatness and the overall supporting strength of the copper foil, the vacuum degree between the copper foil in the middle area and the lining layer is kept, and the fine circuit processing on the copper foil is not influenced; b. the periphery of the copper foil carrier is integrally bonded and sealed in a certain width area, so that etching liquid leakage cannot be generated in the processing process, and the inner surface of the copper foil is polluted; c. the copper foil carrier frame packaging area is removed, the inner liner layer is easy to strip, the surface of the copper layer is not polluted, and the like.
Disclosure of Invention
The manufacturing method of the copper foil carrier and the copper foil carrier provided by the application have better flatness, strength and vacuum degree, etching liquid leakage can not be generated during processing of the upper surface layer circuit of the copper foil, the inner surface of the copper foil is polluted, and the inner liner layer of the carrier plate is easy to strip after positioning, fishing and milling, and the surface of the copper layer is not polluted.
The method is realized by the following technical scheme:
a method for manufacturing a copper foil carrier comprises the following steps:
attaching packaging glue to the edge area of the first surface of the first copper foil, and attaching packaging glue to the edge area of the first surface of the second copper foil;
disposing an inner liner layer between the first copper foil and the second copper foil with first surfaces of both the first copper foil and the second copper foil facing the inner liner layer to form a combination;
and carrying out vacuum and hot press curing on the combination body to generate the copper foil carrier.
In one embodiment, the first surface of both the first copper foil and the second copper foil is a roughened surface, and the second surface of both the first copper foil and the second copper foil is a smooth surface.
In one embodiment, the attaching the encapsulation glue is accomplished by:
the first surface of the first copper foil and/or the first surface of the second copper foil are/is upwards positioned for adsorption;
printing packaging adhesive on the first surface of the first copper foil and/or the first surface of the second copper foil according to a preset pattern to form a pattern film; the shape of the graphic film is a closed shape with a hollow interior, and the size of the graphic film is smaller than the size of the first copper foil or smaller than the size of the second copper foil.
In one embodiment, the printing of the encapsulation glue is achieved by flat coating, spraying, silk screen printing or 3D printing, and the thickness of the edge area encapsulation glue ranges between 10 and 100 microns.
In a specific embodiment, the width of the edge area packaging adhesive of the first copper foil or the second copper foil ranges from 5 to 80 millimeters.
In a specific embodiment, the first copper foil and the second copper foil are the same shape and size; the thickness of the first copper foil ranges from 12 to 180 micrometers.
In a specific embodiment, the projection of the edge area of the adhesive packaging glue on the first copper foil and/or the second copper foil on the inner lining layer is completely located in the inner lining layer, the thickness of the inner lining layer ranges from 0.05 mm to 0.50 mm, and the inner lining layer is made of a non-metal material.
In one embodiment, the vacuum, thermal press curing comprises the steps of:
placing the assembly in a vacuum press for vacuumizing treatment;
and carrying out hot press curing on the combined body through the vacuum press under a vacuum environment.
In a specific embodiment, the time range of the vacuuming treatment is 5-60min; the hot press curing treatment is that under the environment of 120-140 ℃, the combination body is subjected to surface pressure of 1-2MPa for 5-20min, then the temperature is raised to 160-200 ℃, and the combination body is subjected to surface pressure of 2-8MPa for 20-120min.
In one embodiment, the copper foil carrier is made based on the manufacturing method described above.
The application has at least the following beneficial effects:
the application provides a method for manufacturing a copper foil carrier and the copper foil carrier, wherein the method for manufacturing the copper foil carrier comprises the following steps: the first copper foil is provided with a first surface and a second copper foil, wherein the first copper foil is provided with a first surface and a second surface, and the second copper foil is provided with a second surface, and the first surface and the second surface are respectively provided with a first surface and a second surface. The inner liner is arranged between the first copper foil and the second copper foil, and the first surfaces of the first copper foil and the second copper foil face the inner liner to form the assembly. And carrying out vacuum and hot press curing on the combination body to generate the copper foil carrier. Compared with the prior art, the manufacturing method of the copper foil carrier and the copper foil carrier provided by the application have the advantages that the copper foil carrier has certain rigidity and flatness, copper foil cannot float during circuit etching, etching liquid leakage cannot occur, and the inner liner of the carrier plate is easy to strip after positioning, fishing and milling, the surface of a copper layer is not polluted, and the like.
Furthermore, the first surfaces of the first copper foil and the second copper foil are rough surfaces, and are bonded with the packaging adhesive later, so that the bonding compactness is improved.
Further, the packaging adhesive is printed on the first surface of the first copper foil and the first surface of the second copper foil according to a preset pattern, so that holes or gaps are avoided through the packaging adhesive between the first copper foil and the second copper foil, and the first surface of the first copper foil and the first surface of the second copper foil are prevented from being leaked by etching liquid.
Further, the inner liner is arranged between the first copper foil and the second copper foil, so that the overall rigidity and flatness of the carrier plate are improved, and the rough surface of the copper foil is protected.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is an overall schematic of the copper foil carrier provided in example 1;
FIG. 2 is a schematic view of a first copper foil and a packaging adhesive provided in example 1;
FIG. 3 is a schematic view of a second copper foil and a packaging adhesive provided in example 1;
fig. 4 is a flowchart of a method for manufacturing a copper foil carrier according to example 1.
Reference numerals:
1-a first copper foil; 2-a second copper foil; 3-packaging adhesive; 4-an inner liner layer;
11-a first side of a first copper foil; 12-a second side of the first copper foil; 21-a first side of a second copper foil; 22-a second side of the second copper foil.
Detailed Description
The embodiment of the application provides a manufacturing method of a copper foil carrier and the copper foil carrier, which are used for improving the overall rigidity and flatness of a carrier plate, realizing the advantages that copper foil is not floated when a circuit is manufactured by etching, etching liquid leakage is not generated, and the inner liner layer of the carrier plate is easy to strip after positioning, fishing and milling, and the surface of a copper layer is not polluted.
In order that those skilled in the art will better understand the present application, a technical solution in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.
The following will each explain in detail by means of specific examples.
As shown in fig. 1 to 4, the present application provides a method for manufacturing a copper foil carrier and a copper foil carrier, the method for manufacturing the copper foil carrier comprising:
s1, attaching the packaging adhesive 3 to the edge area of the first surface 11 of the first copper foil, and attaching the packaging adhesive 3 to the edge area of the first surface 21 of the second copper foil.
And S2, arranging the inner liner 4 between the first copper foil 1 and the second copper foil 2, wherein the first surfaces of the first copper foil 1 and the second copper foil 2 face the inner liner 4, so as to form a combined body.
And S3, carrying out vacuum and hot press curing on the combined body to generate the copper foil carrier.
Compared with the prior art, the manufacturing method of the copper foil carrier and the copper foil carrier provided by the application have the advantages that the copper foil carrier has certain rigidity and flatness, copper foil cannot float during circuit etching, etching liquid leakage cannot occur, and the inner liner of the carrier plate is easy to strip after positioning, fishing and milling, the surface of a copper layer is not polluted, and the like.
As shown in fig. 1 to 3, specifically, the first surfaces of the first copper foil 1 and the second copper foil 2 are both rough surfaces, and the second surfaces of the first copper foil 1 and the second copper foil 2 are both smooth surfaces. The first surfaces of the first copper foil 1 and the second copper foil 2 are rough surfaces, and are subsequently bonded with the packaging adhesive 3, so that the bonding compactness is improved.
Here, "the encapsulation adhesive 3 is attached to the edge region of the first surface 11 of the first copper foil, and the encapsulation adhesive 3 is attached to the edge region of the first surface 21 of the second copper foil. "is achieved by:
the first surface 11 of the first copper foil and/or the first surface 21 of the second copper foil are/is positioned to face upwards for adsorption.
Printing the packaging adhesive 3 on the first surface 11 of the first copper foil and/or the first surface 21 of the second copper foil according to a preset pattern to form a pattern film; the shape of the graphic film is a closed shape with a hollow interior, and the edges of the graphic film coincide with the edges of the first copper foil 1 and/or the second copper foil 2.
The printing of the packaging adhesive can be realized by plane coating, spraying, silk screen printing or 3D printing.
In the present embodiment, "the first surface 11 of the first copper foil and/or the first surface 21 of the second copper foil are positioned to face upward" includes: the second surface 12 of the first copper foil is placed on a screen printing platform, so that the first surface 11 of the first copper foil faces upwards, and adsorption positioning is carried out through the screen printing platform. Similarly, the adsorption positioning of the second copper foil 2 is consistent with the adsorption positioning process of the first copper foil 1, the second surface 22 of the second copper foil is placed on the screen printing platform, the first surface 21 of the second copper foil faces upwards, and the adsorption positioning is performed through the screen printing platform.
In other embodiments, the printing of the encapsulation glue may also be implemented by way of planar coating, spraying, 3D printing, or the like.
"printing the packaging adhesive 3 on the first surface 11 of the first copper foil and/or the first surface 21 of the second copper foil according to a preset pattern to form a pattern film; the shape of the graphic film as a closed shape with a hollow interior "includes: the packaging adhesive 3 is printed on the first surface 11 of the first copper foil according to a preset pattern, a pattern film is formed on the first surface 11 of the first copper foil, and the shape of the pattern film is matched with the shape of the edge of the first copper foil 1. And the shape of the graphic film is a closed shape with a hollow interior. Specifically, when the shape of the first copper foil 1 is circular, the shape of the graphic film is a circular ring shape with a hollow inside. When the first copper foil 1 is rectangular in shape, the graphic film is rectangular in shape with a hollow inside. When the first copper foil 1 has an irregular pattern in shape, the pattern film has an irregular shape with a hollow interior. Likewise, the graphic film printed on the second side 22 of the second copper foil also matches the edge shape of the second copper foil 2. And the shape of the graphic film is a closed shape with a hollow interior. Specifically, when the shape of the second copper foil 2 is circular, the shape of the graphic film is a circular ring shape with a hollow inside. When the second copper foil 2 has a rectangular shape, the graphic film has a rectangular frame with a hollow interior. When the shape of the second copper foil 2 is an irregular pattern, the shape of the pattern film is an irregular pattern with a hollow inside. The shapes of the first copper foil 1 and the second copper foil 2 may be other polygons such as triangles, parallelograms, and the like.
In one embodiment, the size of the graphic film is smaller than the size of the first copper foil 1 and the second copper foil 2, specifically, the edges of the first copper foil 1 and the second copper foil 2 are more protruded than the edges of the graphic film, so that the graphic film is prevented from overflowing during actual production, so that the entire copper foil carrier is stuck on the production platform.
The edge of the pattern film formed on the first copper foil 1 is smaller than the edge of the first copper foil 1. The edge of the pattern film formed on the second copper foil 2 is smaller than the edge of the second copper foil 2. The patterned film on the first copper foil 1 is aligned with the patterned film on the second copper foil 2, and the first copper foil 1, the second copper foil 2, and the inner liner 4 are bonded.
In this embodiment, the edge of the pattern film formed on the first copper foil 1 may coincide with the edge of the first copper foil 1. The edge of the pattern film formed on the second copper foil 2 coincides with the edge of the second copper foil 2. The patterned film on the first copper foil 1 is aligned with the patterned film on the second copper foil 2, and the first copper foil 1, the second copper foil 2, and the inner liner 4 are bonded. Wherein the thickness of the edge area encapsulation glue 3 is in the range of 10-100 micrometers.
Wherein, "the packaging adhesive 3 is printed on the first surface 11 of the first copper foil and/or the first surface 21 of the second copper foil according to a preset pattern to form a pattern film; the steps following the graphic film being in the shape of a closed shape with a hollow interior include: the first copper foil 1 and the second copper foil 2 are printed on the first side 11 of the first copper foil and/or the first side 21 of the second copper foil according to a preset pattern to form a pattern film, and are dried or baked to a certain degree for standby.
As shown in fig. 1 to 3, "the encapsulation adhesive 3 is attached to the edge region of the first surface 11 of the first copper foil, and the encapsulation adhesive 3 is attached to the edge region of the first surface 21 of the second copper foil. The packaging adhesive 3 in the' is adhesive with high temperature resistance, high cohesiveness and etching resistance of etching solution. During the thermo-compression curing, the potting adhesive 3 is able to penetrate into the corresponding area of the inner liner layer 4. Specifically, the encapsulation compound 3 of the first copper foil 1 and the encapsulation compound 3 of the second copper foil 2 jointly penetrate into the inner liner layer 4. The encapsulation adhesive 3 permeated into the inside of the inner liner 4 is cured to form a seal, thereby preventing permeation of etching liquid or permeation of gas in the subsequent processing process.
The encapsulation glue 3 is attached to the edge area of the first side 11 of the first copper foil, the edge area is in the range of 5-80 mm, and the size of the edge area can be determined according to the bonding degree of the encapsulation glue 3, so that the penetration of etching liquid or the penetration of gas can be prevented better. For example, the width of the edge area encapsulation compound of the first copper foil or the second copper foil is in the range of 5-80 mm.
As shown in fig. 1 to 3, the thickness of the first copper foil 1 and the second copper foil 2 ranges from 12 to 180 micrometers, and the specific copper foil thickness depends on the thickness of the plating. The copper foil with different thickness can meet the requirements of various copper-based laminates on packing density and line width and space reduction, and the defect of inconvenience in the manufacturing process of the thick copper foil is also reduced, so that the processing operations such as subsequent etching, laser perforation and the like are facilitated. Wherein, the shape of the first copper foil 1 is consistent with the shape and the size of the second copper foil 2, so that the same packaging adhesive 3 is arranged on the first surface 11 of the first copper foil and the first surface 21 of the second copper foil, and the subsequent packaging adhesive 3 on the first copper foil 1 and the packaging adhesive 3 on the second copper foil 2 are aligned.
As shown in fig. 1 to 3, the projections of the edge areas of the first copper foil 1 and the second copper foil 2 to which the encapsulation compound is attached onto the inner liner 4 are entirely located within the inner liner 4, and the inner liner 4 is entirely interposed between the first copper foil 1 and the second copper foil 2 so that the first copper foil 1 and the second copper foil 2 entirely cover the inner liner 4. At this time, the inner liner 4 can be bonded to the first copper foil 1 and the second copper foil 2, and the first copper foil 1, the second copper foil 2, and the inner liner 4 can be in a vacuum state. Wherein the thickness of the inner liner 4 ranges from 0.05 to 0.50 mm.
In one embodiment, the inner liner 4 is cut to a size greater than the first copper foil 1 and the second copper foil 2.
In this embodiment, the inner liner 4 is cut to conform to the size and shape of the first copper foil 1 and the second copper foil 2, so that the waste of materials is reduced, and the edges of the first copper foil 1, the inner liner 4 and the second copper foil 2 after combination are overlapped.
The inner liner 4 can be made of nonmetal materials, and the specific materials are high-temperature-resistant special paper, and specifically, the inner liner 4 can resist the high temperature of 220 ℃ and is not embrittled or yellowing for 2 hours. When the packaging adhesive 3 printed on the first copper foil 1 and the second copper foil 2 is under the action of hot pressing, the packaging adhesive 3 can permeate into the inner liner 4 and is cured at a high temperature, so that a sealing effect is achieved.
In other embodiments, the material of the inner liner 4 may be other high temperature resistant materials such as a web/PI film.
Wherein, as shown in fig. 1-4, "vacuum, heat press curing the assembly to produce a copper foil carrier" comprises:
and placing the assembly in a vacuum press for vacuumizing. And carrying out hot press curing on the combined body through a vacuum press under a vacuum environment.
Specifically, "placing the assembly in a vacuum press to perform a vacuum-pumping treatment" includes: placing the assembly in a vacuum press, starting the vacuum press, and vacuumizing the assembly for 5-60min to form a vacuum state inside the assembly.
Specifically, "hot press curing of the assembly by a vacuum press under a vacuum environment" includes: and (3) placing the assembly subjected to the vacuum treatment in a vacuum press for hot press curing treatment. Wherein, the hot press curing treatment is that under the environment of 120-140 ℃, the surface pressure of 1-2MPa is applied to the combination body for prepressing for 5-20min, then the temperature is raised to 160-200 ℃, and the surface pressure of 2-8MPa is applied to the combination body for maintaining for 20-120min.
In this example, the vacuum-treated assembly was placed in a vacuum press and the press heated plate was preheated to 130 ℃. At this time, the vacuum combining machine is started, and the surface pressure is 1-2MPa for prepressing for 5-20min at 130 ℃. Then heating to 160-200 deg.C, and maintaining 2-8MPa surface pressure for 20-120min. The packaging film is cured under the high temperature condition through vacuum and hot press curing molding treatment, so that the first copper foil 1, the inner liner 4 and the second copper foil 2 are firmly bonded into a whole, and the first copper foil 1, the inner liner 4 and the second copper foil 2 are in a stable internal vacuum state.
As shown in fig. 1 to 4, the steps after "hot press curing of the assembly by a vacuum press under vacuum environment" further include: after the hot press solidification is completed, the vacuum is released, and the temperature is reduced to 60-100 ℃ for plate unloading operation.
The application also provides a copper foil carrier which is manufactured by adopting the manufacturing method of the copper foil carrier.
By means of the implementation steps disclosed by the application, compared with the prior art, the application has the following remarkable effect improvement and breakthrough:
1. the first surfaces of the first copper foil and the second copper foil are set to be rough surfaces, and then the first copper foil and the second copper foil are bonded with the packaging adhesive, so that the bonding compactness is improved.
2. The packaging adhesive 3 is printed on the first surface 11 of the first copper foil and the first surface 21 of the second copper foil according to a preset pattern, so that the first copper foil 1 and the second copper foil 2 are adhered through the packaging adhesive 3, and the generation of holes or gaps is avoided, so that the first surface 11 of the first copper foil and the first surface 21 of the second copper foil are prevented from being leaked by etching liquid.
3. Through being equipped with inner liner 4 between first copper foil 1 and the second copper foil 2, owing to first copper foil 1 and the even surface of attaching inner liner 4 of second copper foil 2, improved the whole rigidity and the planarization of carrier plate to protect the copper foil rough surface.
4. In the manufacturing process, the inner liner 4 is completely coated by the first copper foil 1 and the second copper foil 2, so that the inner liner 4 can be protected from being polluted by materials or dust, can be reused, and saves materials.
Note that the above is only a preferred embodiment of the present application and the technical principle applied. It will be understood by those skilled in the art that the present application is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the application. Therefore, while the application has been described in connection with the above embodiments, the application is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the application, which is set forth in the following claims.
The foregoing disclosure is merely illustrative of some embodiments of the application, and the application is not limited thereto, as modifications may be made by those skilled in the art without departing from the scope of the application.
Claims (10)
1. A method for making a copper foil carrier, comprising:
attaching packaging glue to the edge area of the first surface of the first copper foil, and attaching packaging glue to the edge area of the first surface of the second copper foil;
disposing an inner liner layer between the first copper foil and the second copper foil with first surfaces of both the first copper foil and the second copper foil facing the inner liner layer to form a combination;
and carrying out vacuum and hot press curing on the combination body to generate the copper foil carrier.
2. The method of claim 1, wherein the step of determining the position of the substrate comprises,
the first surfaces of the first copper foil and the second copper foil are rough surfaces, and the second surfaces of the first copper foil and the second copper foil are smooth surfaces.
3. The method of claim 1, wherein attaching the encapsulation glue is accomplished by:
the first surface of the first copper foil and/or the first surface of the second copper foil are/is upwards positioned for adsorption;
printing packaging adhesive on the first surface of the first copper foil and/or the first surface of the second copper foil according to a preset pattern to form a pattern film; the shape of the graphic film is a closed shape with a hollow interior, and the size of the graphic film is smaller than the size of the first copper foil or smaller than the size of the second copper foil.
4. A method according to claim 3, wherein printing the encapsulation glue is achieved by flat coating, spraying, silk screening or 3D printing; the thickness of the edge area encapsulant ranges between 10-100 microns.
5. The method of claim 1, wherein the edge area encapsulation glue of the first copper foil or the second copper foil has a width in the range of 5-80 millimeters.
6. The method of claim 1, wherein the first copper foil is the same shape and size as the second copper foil; the thickness of the first copper foil ranges from 12 to 180 micrometers.
7. The method of claim 1, wherein the projection of the edge area of the adhesive packaging glue on the first copper foil and/or the second copper foil on the inner liner layer is completely located in the inner liner layer, the thickness of the inner liner layer ranges from 0.05 mm to 0.50 mm, and the inner liner layer is made of non-metal materials.
8. The method of claim 1, wherein the vacuum, thermal press curing comprises the steps of:
placing the assembly in a vacuum press for vacuumizing treatment;
and carrying out hot press curing on the combined body through the vacuum press under a vacuum environment.
9. The method of claim 8, wherein the vacuuming is for a period of time ranging from 5 to 60 minutes; the hot press curing treatment is that under the environment of 120-140 ℃, the combination body is subjected to surface pressure of 1-2MPa for 5-20min, then the temperature is raised to 160-200 ℃, and the combination body is subjected to surface pressure of 2-8MPa for 20-120min.
10. A copper foil carrier, characterized in that the copper foil carrier is manufactured based on the manufacturing method according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210619655.1A CN117222119A (en) | 2022-06-02 | 2022-06-02 | Manufacturing method of copper foil carrier and copper foil carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210619655.1A CN117222119A (en) | 2022-06-02 | 2022-06-02 | Manufacturing method of copper foil carrier and copper foil carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117222119A true CN117222119A (en) | 2023-12-12 |
Family
ID=89041227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210619655.1A Pending CN117222119A (en) | 2022-06-02 | 2022-06-02 | Manufacturing method of copper foil carrier and copper foil carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117222119A (en) |
-
2022
- 2022-06-02 CN CN202210619655.1A patent/CN117222119A/en active Pending
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