JPH0477205A - Method for compression bonding of ceramic laminate - Google Patents
Method for compression bonding of ceramic laminateInfo
- Publication number
- JPH0477205A JPH0477205A JP18988590A JP18988590A JPH0477205A JP H0477205 A JPH0477205 A JP H0477205A JP 18988590 A JP18988590 A JP 18988590A JP 18988590 A JP18988590 A JP 18988590A JP H0477205 A JPH0477205 A JP H0477205A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic laminate
- recess
- flexible sheet
- fluid chamber
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims description 19
- 230000006835 compression Effects 0.000 title description 3
- 238000007906 compression Methods 0.000 title description 3
- 238000003825 pressing Methods 0.000 claims abstract description 25
- 239000012530 fluid Substances 0.000 claims abstract description 15
- 238000002788 crimping Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） る。[Detailed description of the invention] (Industrial application field) Ru.
（従来技術）
複数枚のグリーンノートを積層して各層間を圧着してな
るセラミック積層体は焼成され、各層表面に設けた各機
能層に応じて積層プリント回路基板、半導体集積回路用
セラミックパッケージの積層基板、セラミ／クコンデン
サ等として利用される。(Prior art) A ceramic laminate made by stacking a plurality of Green Notes and pressing the layers together is fired, and a laminated printed circuit board and a ceramic package for semiconductor integrated circuits are formed according to each functional layer provided on the surface of each layer. Used as multilayer substrates, ceramic/capacitors, etc.
しかして、かかるセラミック積層体の各層間を圧着する
方法としては大別して、特公昭５７−２７８０２号公報
に示されているようにセラミック積層体を受型と押型間
にて押圧処理する方法と、セラミ。Methods for press-bonding the layers of such a ceramic laminate can be roughly divided into two methods: a method of pressing the ceramic laminate between a receiving mold and a pressing die as shown in Japanese Patent Publication No. 57-27802; Cerami.
り積層体の外周を可撓性のフィルムにて被覆して静水圧
プレスする方法とがある。There is a method in which the outer periphery of the laminate is covered with a flexible film and hydrostatically pressed.
（発明が解決しようとする課題）
ところで、セラミック積層体には各種のチップやその他
の部品を実装するために、その少なくとも一面側に開口
する凹所を備えたものがあり、この種のセラミック積層
体に対して前記各方法を採用する場合には以下に示すご
とき不具合が生じる。(Problem to be Solved by the Invention) By the way, some ceramic laminates are provided with recesses that open at least on one side in order to mount various chips and other components. When each of the above methods is applied to the body, the following problems occur.
すなわち、前者の押圧処理する方法においては、セラミ
ック積層体の一面側は凹所を除く部分が十分に押圧され
るものの同凹所の表面は十分には押圧されず、同凹所の
表面が山形に盛り上がる現象が生じる。これに対処すべ
く押型をセラミ、り積層体の一面側の表面形状に対応す
る凸形状に形成することが考えられるが、セラミ、り積
層体の凹所の表面まで確実に均等に押圧するには押型の
凸形状には極めて高い寸法精度が必要になり、押型が高
価なものとなってコストアップの大きな要因となる。ま
た、後者の静水圧プレスの方法においては、プレスに先
立ってセラミック積層体に所謂真空パ、り処理をしなけ
ればならないとともに、プレス後にはセラミック積層体
の外周を被覆する被膜を剥離しなければならず、プレス
の前後に多数の手間がかかりこれがコストアップの要因
となる。In other words, in the former method of pressing, although one side of the ceramic laminate is sufficiently pressed except for the recesses, the surface of the recesses is not sufficiently pressed, and the surface of the recesses becomes chevron-shaped. A phenomenon of excitement occurs. To deal with this, it is possible to form the press into a convex shape that corresponds to the surface shape of one side of the ceramic laminate, but it is difficult to ensure even pressure to the surface of the recess in the ceramic laminate. The convex shape of the stamping die requires extremely high dimensional accuracy, making the stamping die expensive and becoming a major factor in increasing costs. In addition, in the latter method of hydrostatic pressing, the ceramic laminate must be subjected to a so-called vacuum purging process prior to pressing, and the coating covering the outer periphery of the ceramic laminate must be peeled off after pressing. However, a lot of work is required before and after pressing, which increases costs.
したがって、本発明の目的は、かかる問題に対処するこ
とにある。It is therefore an object of the present invention to address such problems.
（課題を解決するための手段）
本発明は、複数枚のグリ−７シートを積層してなりかつ
少なくとも一面側に開口する凹所を備えたセラミック積
層体を、同セラミック積層体を支承する受型と同セラミ
ック積層体の一面側に対応する形状の押圧面を有する押
型とにより押圧して各層間を圧着するセラミック積層体
の圧着方法において、前記押型として、同押型の少なく
とも前記セラミック積層体の凹所に対向する部位をゴム
等可撓性材料からなる可撓性ンートにて開口部が密閉さ
れる流体室に形成した押型を採用し、同押型と前記セラ
ミック積層体の一面側間に前記可撓性シートを介在させ
て同押型の流体室に圧力流体を供給して前記セラミック
積層体を押圧処理することを特徴とするものである。(Means for Solving the Problems) The present invention provides a ceramic laminate that is formed by laminating a plurality of GREE-7 sheets and has a recess that is open on at least one side, and a support that supports the ceramic laminate. In a method for crimping a ceramic laminate in which each layer is crimped by pressing with a mold and a pressing mold having a pressing surface of a shape corresponding to one side of the ceramic laminate, the pressing mold includes at least one of the ceramic laminate of the same pressing mold. A press mold is used in which the part facing the recess is formed into a fluid chamber whose opening is sealed with a flexible channel made of a flexible material such as rubber, and between the press mold and one side of the ceramic laminate, the The present invention is characterized in that the ceramic laminate is pressed by supplying pressurized fluid to the fluid chamber of the pressing mold with a flexible sheet interposed therebetween.
（発明の作用・効果）
本発明の圧着方法においては、セラミック積層体の押圧
時に付与される流体圧により可撓性シートがセラミック
積層体の凹所の形状に変形して同凹所の表面に密接して
、流体圧かセラミ、り積層体の一面側の全面に均等に付
与される。このため、セラミック積層体は一面側から確
実かつ均等に押圧され、各層間の接着力が高く、その後
の焼成時および焼成後において各層間が剥離したり膨れ
が発生することはない。(Operations and Effects of the Invention) In the crimping method of the present invention, the flexible sheet is deformed into the shape of the recess in the ceramic laminate by the fluid pressure applied when pressing the ceramic laminate, and is attached to the surface of the recess. In close contact, fluid pressure is applied evenly to the entire surface of one side of the ceramic laminate. Therefore, the ceramic laminate is reliably and evenly pressed from one side, and the adhesive strength between the layers is high, so that the layers do not peel or bulge during and after the subsequent firing.
しかして、かかる押型においては、セラミック積層体の
一面側の表面形状に精度よ（一致させる必要がなく、か
つかかる押型を使用すればセラミック積層体を予め真空
パック処理や、抑圧処理後に被膜の剥離処理をする必要
が全くないため、従来の圧着処理を行う場合に比較して
コストが極めて低減する。However, in such a press, it is not necessary to precisely match the surface shape of one side of the ceramic laminate, and if such a press is used, the ceramic laminate can be vacuum-packed in advance, or the coating can be peeled off after the suppression treatment. Since there is no need for any processing, the cost is extremely reduced compared to the case of conventional crimping processing.
（実施例）
以下本発明の実施例を、半導体集積回路用セラミ、クパ
、ケージの積層基板を製造する例に基づいて説明する。(Example) Examples of the present invention will be described below based on an example of manufacturing a laminated substrate of ceramic, cuppa, and cage for semiconductor integrated circuits.
第１図には本発明の一実施例に係る圧着方法を実施する
方法が概略的に示され、かつ第２図には当該積層基板の
圧着処理以前の状態であるセラミック積層体１０が概略
的に示されている。セラミック積層体１０は複数枚のグ
リーンノート１１〜１４を積層してなるもので、各グリ
ーンノート１１〜１４はアルミナ等のセラミック質粉末
に鉱化剤とともに熱可塑性合成樹脂を均一に混合して混
練したものを、ドクターブレード法等によりシート化し
てなるものである。かかるグリーンノートを複数枚積層
するに際しては各グリーンノートを所定形状に打ち抜き
、さらにグリーンノート上に導体ペースト等による印刷
により回路パターンが形成され、これらのグリ−ノン−
トはその後に積層されかつ溶剤を用いて各グリーンノー
トの層間を仮接着されて、セラミック積層体１０を形成
している。FIG. 1 schematically shows a method for carrying out a crimping method according to an embodiment of the present invention, and FIG. 2 schematically shows a ceramic laminate 10 in a state before the crimping process of the laminate substrate. is shown. The ceramic laminate 10 is made by laminating a plurality of Green Notes 11 to 14, and each Green Note 11 to 14 is made by uniformly mixing and kneading a ceramic powder such as alumina with a mineralizer and a thermoplastic synthetic resin. This material is made into a sheet by a doctor blade method or the like. When stacking a plurality of such green notes, each green note is punched out into a predetermined shape, and a circuit pattern is formed on the green note by printing with conductive paste or the like.
The green notes are then laminated and the layers of each green note are temporarily bonded using a solvent to form the ceramic laminate 10.
セラミック積層体ｌＯにおいては、その表面側に段付き
の凹所１５を備えている。かかる凹所１５は正方形を呈
していて、凹所」５の底面と側面との境界部、および段
面と側面との境界部に方形の隅部１５ａ、 １５ｂを備
えている。かかるセラミック積層体は圧着処理され、そ
の後焼成されて積層基板となる。The ceramic laminate IO has a stepped recess 15 on its surface side. The recess 15 has a square shape, and has rectangular corners 15a and 15b at the boundary between the bottom and side surfaces of the recess 5 and at the boundary between the stepped surface and the side surfaces. Such a ceramic laminate is subjected to a pressure bonding treatment and then fired to become a laminate substrate.
しかして、本実施例においては第１図に示すよウニ、セ
ラミック積層体１０は方形のステンレスの枠体２１に収
容された状態にて下型２２に載置され、この状態にて上
型２３にて押圧される。上型２３は下面側にセラミック
積層体１０の表面に対向する凹所２３ａを備え、同凹所
２３ａは油圧ポンプ２４に接続される連通路２３ｂを備
えている。かかる上型２３には凹所２３ａの開口部を密
閉する可撓性シート２３ｃが予め形成されていて、同凹
所２３ａが流体室Ｒに形成されている。可撓性シート２
３ｃは上型２３をンリコンゴムの溶剤溶液に浸積するこ
とにより形成されている。In the present embodiment, as shown in FIG. Pressed at. The upper mold 23 has a recess 23 a facing the surface of the ceramic laminate 10 on the lower surface side, and the recess 23 a has a communication path 23 b connected to the hydraulic pump 24 . A flexible sheet 23c for sealing the opening of the recess 23a is formed in advance on the upper mold 23, and the recess 23a is formed in the fluid chamber R. Flexible sheet 2
3c is formed by immersing the upper mold 23 in a solvent solution of silicone rubber.
上型２３にはセラミック積層体１０の表面に載置された
状態にて流体室Ｒに油圧が付与される。これにより、可
撓性ンート２３ｃは油圧の作用にて凹所１５の形状に変
形してセラミック積層体１ｏの凹所１５の表面に密着し
、付与される油圧はセラミック積層体１０の表面全面に
確実に均等に付与される。なお、この同上型２２は埋設
されているヒータにて約８０℃に保持され、１００ｋｇ
／ｃｍ２の圧力が２分間付与される。Hydraulic pressure is applied to the fluid chamber R of the upper mold 23 while it is placed on the surface of the ceramic laminate 10 . As a result, the flexible groove 23c is deformed into the shape of the recess 15 by the action of the hydraulic pressure and comes into close contact with the surface of the recess 15 of the ceramic laminate 1o, and the applied hydraulic pressure covers the entire surface of the ceramic laminate 10. ensure that it is evenly distributed. In addition, this same mold 22 is maintained at about 80°C by a buried heater, and weighs 100 kg.
A pressure of /cm2 is applied for 2 minutes.
この結果、セラミック積層体１ｏを構成している各層ｌ
ｌ−１４間は強固に接着し、その後の焼成時においても
また焼成後においても各層１１〜１４間に剥離や膨れが
発生することはない。また、かかる上型２３においては
、可撓性ノート２３ｃが油圧の作用により変形してセラ
ミック積層体１０の凹所１５の表面に常に密着すること
になるため、同上型２３の下面の形状をセラミック積層
体１０の表面形状に精度よく一致させる必要は全くなく
、かつかかる上型２３を使用することによりセラミック
積層体１０に、押圧前の真空パック処理やこれに伴う被
膜の剥離処理を行う必要は全くなく、従来の圧着方法に
比較して著しくコストの低減を図ることができる。As a result, each layer l constituting the ceramic laminate 1o
The layers 11 to 14 are firmly bonded, and neither peeling nor blistering occurs between the layers 11 to 14 during and after firing. In addition, in such an upper mold 23, since the flexible notebook 23c is deformed by the action of hydraulic pressure and always comes into close contact with the surface of the recess 15 of the ceramic laminate 10, the shape of the lower surface of the upper mold 23 is There is no need to accurately match the surface shape of the laminate 10, and by using the upper mold 23, there is no need to perform vacuum packing treatment on the ceramic laminate 10 before pressing or peeling of the coating associated therewith. There is no pressure bonding at all, and costs can be significantly reduced compared to conventional crimping methods.
なお、本発明においては、予め用意した可撓性シートを
セラミック積層体１０の表面と上型２３の下面間に介在
させ、この状態で同上型２３の流体室Ｒに油圧を付与す
るようにしてもよい。また、可撓性ンートを形成する可
撓性材料としてはラテックス等各種ゴム、アイオノマー
等各種合成樹脂等を使用することができる。In the present invention, a flexible sheet prepared in advance is interposed between the surface of the ceramic laminate 10 and the lower surface of the upper mold 23, and in this state, hydraulic pressure is applied to the fluid chamber R of the upper mold 23. Good too. Further, as the flexible material forming the flexible belt, various rubbers such as latex, various synthetic resins such as ionomer, etc. can be used.
第１図は本発明の一実施例にかかる圧着方法を概略的に
示す概略的説明図、第２図は同圧着方法に採用したセラ
ミック積層体の縦断面図である。
符 号 の 説 明
】０・・・セラミック積層体、１１〜１４・・・グリン
シート層、 １５・ ・ ・凹所、 ２１・ ・ ・枠
体、 ２２・・下型、 ２３・ ・ ・上型、 ２３ａ
・ ・ ・凹所、 ２３ｃ・・・可撓性シート。FIG. 1 is a schematic explanatory view schematically showing a compression bonding method according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a ceramic laminate adopted in the compression bonding method. Explanation of symbols] 0... Ceramic laminate, 11-14... Green sheet layer, 15... Recess, 21... Frame, 22... Lower mold, 23... Upper mold , 23a
・ ・ ・Concavity, 23c...Flexible sheet.
Claims (1)
も一面側に開口する凹所を備えたセラミック積層体を、
同セラミック積層体を支承する受型と同セラミック積層
体の一面側に対応する形状の押圧面を有する押型とによ
り押圧して各層間を圧着するセラミック積層体の圧着方
法において、前記押型として、同押型の少なくとも前記
セラミック積層体の凹所に対向する部位をゴム等可撓性
材からなる可撓性シートで開口部が密閉される流体室に
形成した押型を採用し、同押型と前記セラミック積層体
の一面側間に前記可撓性シートを介在させて同押型の流
体室に圧力流体を供給して前記セラミック積層体を押圧
処理することを特徴とするセラミック積層体の圧着方法
。A ceramic laminate made by laminating a plurality of green sheets and having a recess opening on at least one side,
In a method for crimping a ceramic laminate in which each layer is crimped by pressing with a receiving mold that supports the ceramic laminate and a pressing mold having a pressing surface of a shape corresponding to one side of the ceramic laminate, the pressing mold is A pressing mold is employed in which at least a portion of the pressing mold facing the recess of the ceramic laminate is formed into a fluid chamber whose opening is sealed with a flexible sheet made of a flexible material such as rubber, and the pressing mold and the ceramic laminate are A method for crimping a ceramic laminate, characterized in that the flexible sheet is interposed between one side of the body and a pressurized fluid is supplied to a fluid chamber of the pressing mold to press the ceramic laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18988590A JPH0477205A (en) | 1990-07-18 | 1990-07-18 | Method for compression bonding of ceramic laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18988590A JPH0477205A (en) | 1990-07-18 | 1990-07-18 | Method for compression bonding of ceramic laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0477205A true JPH0477205A (en) | 1992-03-11 |
Family
ID=16248810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18988590A Pending JPH0477205A (en) | 1990-07-18 | 1990-07-18 | Method for compression bonding of ceramic laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477205A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6306237B1 (en) * | 1995-11-28 | 2001-10-23 | Roy D. Wemyss | Lamination of surfaces using pressurized liquid |
| CN110548831A (en) * | 2018-06-01 | 2019-12-10 | 波音公司 | Apparatus for manufacturing parts and related method |
-
1990
- 1990-07-18 JP JP18988590A patent/JPH0477205A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6306237B1 (en) * | 1995-11-28 | 2001-10-23 | Roy D. Wemyss | Lamination of surfaces using pressurized liquid |
| CN110548831A (en) * | 2018-06-01 | 2019-12-10 | 波音公司 | Apparatus for manufacturing parts and related method |
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