JPH0477204A - Method for compression bonding of ceramic laminate - Google Patents
Method for compression bonding of ceramic laminateInfo
- Publication number
- JPH0477204A JPH0477204A JP18988490A JP18988490A JPH0477204A JP H0477204 A JPH0477204 A JP H0477204A JP 18988490 A JP18988490 A JP 18988490A JP 18988490 A JP18988490 A JP 18988490A JP H0477204 A JPH0477204 A JP H0477204A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic laminate
- film
- outer periphery
- ionomer
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims description 17
- 230000006835 compression Effects 0.000 title abstract description 3
- 238000007906 compression Methods 0.000 title abstract description 3
- 229920000554 ionomer Polymers 0.000 claims abstract description 20
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 239000012530 fluid Substances 0.000 claims abstract description 10
- 229920001971 elastomer Polymers 0.000 claims abstract description 9
- 238000002788 crimping Methods 0.000 claims description 8
- 239000010408 film Substances 0.000 abstract description 40
- 230000002706 hydrostatic effect Effects 0.000 abstract description 10
- 238000003825 pressing Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 16
- 239000002346 layers by function Substances 0.000 description 8
- 238000010304 firing Methods 0.000 description 7
- 238000000576 coating method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 239000004816 latex Substances 0.000 description 4
- 229920000126 latex Polymers 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000009461 vacuum packaging Methods 0.000 description 3
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、セラミック積層体の圧着方法に関す（従来技
術）
複数枚のグリーンシートを積層して各層間を圧着してな
るセラミック積層体は焼成され、各層表面に施された各
機能層に応じて積層プリント回路基板、半導体集積回路
用セラミックパッケージの積層基板、セラミックコンデ
ンサ等として利用される。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a method for crimping a ceramic laminate (prior art) A ceramic laminate made by laminating a plurality of green sheets and crimping between each layer is It is fired and used as a laminated printed circuit board, a laminated substrate for a ceramic package for semiconductor integrated circuits, a ceramic capacitor, etc., depending on the functional layer applied to the surface of each layer.
しかして、かかるセラミック積層体の各層間を圧着する
方法として静水圧プレスを利用する方法があり、かかる
方法においては特開昭６１−２２７０４３号公報に示さ
れているように、セラミック積層体の外周をポリエチレ
ンのフィルムにて被覆して静水圧プレスを施す方法、特
開昭６１−１５９７１８号公報に示すように、セラミッ
ク積層体の外周をゴムにて被覆して上記と同様に静水圧
プレスを施す方法等が採用されている。Therefore, there is a method of using a hydrostatic press to pressure bond each layer of the ceramic laminate, and in this method, as shown in Japanese Patent Application Laid-Open No. 61-227043, the outer periphery of the ceramic laminate is As shown in JP-A-61-159718, the outer periphery of the ceramic laminate is covered with rubber and hydrostatic pressing is performed in the same manner as above. methods have been adopted.
（発明が解決しようとする課題）
ところで、セラミック積層体には各種のチップやその他
の部品を実装するために、その少なくとも一面側に開口
する凹所を備えたものがあり、この種のセラミック積層
体に対して前記各方法を採用する場合には以下に示すご
とき不具合が生じる。(Problem to be Solved by the Invention) By the way, some ceramic laminates are provided with recesses that open at least on one side in order to mount various chips and other components. When each of the above methods is applied to the body, the following problems occur.
すなわち、この種のセラミック積層体においては、凹所
を構成する底面と側面との境界部が線状または点状の隅
部になっているため、皮膜である薄膜がかかる隅部に絞
り込まれて密着していないと、たとえ静水圧プレスを施
してもかかる隅部に静水圧が的確に付与されず、かかる
隅部が加圧力不良となって隅部近傍の接着力が低くなり
、その後の焼成時または焼成後に各層間に剥離や膨れが
発生するという問題があり、また凹所の底面に回路パタ
ーンや電極層等の機能層が形成されている場合には静水
圧プレスを施した後の皮膜の剥離の際にこれらの機能層
に剥離が発生することが確認される。これらの問題に対
しては、例えばポリエチレンフィルムを用いてセラミッ
ク積層体を真空包装する要領で被覆するとともに、同時
にセラミック積層体の外周から圧力を付与することによ
りフィルムを十分に絞り込むことが考えられるが、ポリ
エチレンフィルムではポリマーの特性として絞り込みが
十分ではなく、隅部に隙間ができてかかる隅部が加工不
良を生じる。In other words, in this type of ceramic laminate, the boundary between the bottom and side surfaces of the recess is a linear or dotted corner, so the thin film is squeezed into the corner. If they are not in close contact, even if hydrostatic pressure is applied, the hydrostatic pressure will not be applied accurately to the corner, resulting in insufficient pressurizing force at the corner, resulting in low adhesive strength near the corner, and subsequent firing. There is a problem that peeling or blistering occurs between each layer after heating or firing, and if a functional layer such as a circuit pattern or electrode layer is formed on the bottom of the recess, the coating after isostatic pressing may It is confirmed that peeling occurs in these functional layers when peeling off. One possible solution to these problems is to cover the ceramic laminate with a polyethylene film in the same way as vacuum packaging, and at the same time apply pressure from the outer periphery of the ceramic laminate to sufficiently squeeze the film. However, due to the characteristics of the polymer, polyethylene film does not have sufficient narrowing, and gaps are formed at the corners, resulting in processing defects.
従って、本発明はこれらの問題に対処することにある。The present invention therefore seeks to address these problems.
（課題を解決するための手段）
本発明は、複数枚のグリーンノートを積層してなりかつ
少なくとも一面側に開口する凹所を備工たセラミック積
層体の各層間を圧着するセラミック積層体の圧着方法に
おいて、前記セラミック積層体の外周をアイオノマーの
薄膜にて被覆した状態で、当該セラミ／り積層体に流体
圧プレスを施すことを特徴とするものであり、さらにか
かる圧着方法において、アイオノマーを被覆されたセラ
ミック積層体の外周をゴムの薄膜にて被覆した状態で、
当該セラミック積層体に流体圧プレスを施すことを特徴
とするものである。(Means for Solving the Problems) The present invention provides crimping of a ceramic laminate, which crimps between each layer of a ceramic laminate made of a plurality of stacked green notebooks and provided with a recess opening on at least one side. The method is characterized in that the ceramic laminate is subjected to fluid pressure pressing while the outer periphery of the ceramic laminate is coated with a thin film of ionomer. With the outer periphery of the ceramic laminate covered with a thin rubber film,
This method is characterized in that the ceramic laminate is subjected to fluid pressure pressing.
本発明におけるセラミック積層体の外周を被覆する第１
層の皮膜の形成に使用するアイオノマは、オレフィンを
主成分としその長鎖間カイオン結合にて架橋結合された
熱可塑性合成樹脂であり、特に金属イオンまたは第４級
アンモニウムイオンにより部分的または完全に中和され
ているものである。具体的には、エチレン−メタクリル
酸共重合体の分子間をＮａ“２ ｎ＋ ４等の金属イオ
ンで架橋した合成樹脂が好適に使用し得るものであり、
より具体的にはハイミラン（三片・デュポンポリケミカ
ル株式会社製アイオノマー 商品名）が挙げられる。セ
ラミック積層体の外周をかかるアイオノマーの薄膜で被
覆するには、アイオノマーのフィルムを使用して公知の
真空包装手段にて被覆する。The first coating covering the outer periphery of the ceramic laminate in the present invention
The ionomer used to form the layer film is a thermoplastic synthetic resin whose main component is olefin, which is cross-linked by long interchain ion bonds, and is partially or completely oxidized by metal ions or quaternary ammonium ions. It has been neutralized. Specifically, a synthetic resin in which the molecules of an ethylene-methacrylic acid copolymer are cross-linked with metal ions such as Na'2 n+ 4 can be suitably used.
More specifically, Hymilan (trade name of an ionomer manufactured by DuPont Mikata Polychemicals Co., Ltd.) can be mentioned. In order to cover the outer periphery of the ceramic laminate with such a thin ionomer film, the ionomer film is coated using a known vacuum packaging method.
この場合、加熱してアイオノマーフィルムラ軟化状態に
して真空包装手段を施し、同時に圧力を付与する。In this case, the ionomer film is heated to soften it and subjected to vacuum packaging, and at the same time pressure is applied.
本発明においてアイオノマーの薄膜の外周を被覆する第
２層の皮膜であるゴムの薄膜の形成には、天然ゴムを主
要成分とするラテックスを使用することが好ましく、デ
ィッピング処理によりラテックスを第１層の皮膜の外周
に塗布しその後乾燥する。In the present invention, it is preferable to use latex containing natural rubber as a main component to form the second layer of rubber film that covers the outer periphery of the ionomer thin film. Apply to the outer periphery of the film and then dry.
本発明の流体圧処理には主として静水圧処理が採用され
る。Hydrostatic pressure treatment is mainly adopted as the fluid pressure treatment of the present invention.
（発明の作用・効果）
本発明に係るセラミック積層体の圧着方法においては、
第１層の皮膜をアイオノマーの薄膜にて形成しているた
め、アイオノマーの特性を有効に利用して同薄膜をセラ
ミック積層体の凹所の隅部にまで十分に絞り込んで密着
させることができる。(Operations and Effects of the Invention) In the method for crimping a ceramic laminate according to the present invention,
Since the first layer film is formed of a thin ionomer film, the properties of the ionomer can be effectively utilized to sufficiently narrow and adhere the thin film to the corners of the recesses in the ceramic laminate.
これに加えて、かかる皮膜の外周にゴムの薄膜を被覆し
ている場合には、セラミック積層体に流体圧プレスを施
してもアイオノマーの薄膜上に直接流体圧が付与されて
いないことから、かかるプレス時に流体圧媒体がアイオ
ノマーの薄膜内に侵入してセラミック積層体に加圧不良
が発生することはない。従って、セラミック積層体は流
体圧により全体に均等かつ十分に加圧されるとともに凹
所の隅部までも十分に加圧され、セラミック積層体の各
層間の接着強度が高くてセラミック積層体のその後の焼
成時または焼成後に層間に剥離が発生することはない。In addition, if the outer periphery of such a coating is coated with a thin rubber film, even if fluid pressure is applied to the ceramic laminate, fluid pressure is not applied directly to the ionomer thin film. During pressing, the fluid pressure medium will not penetrate into the ionomer thin film and cause pressurization failure in the ceramic laminate. Therefore, the entire ceramic laminate is evenly and sufficiently pressurized by the fluid pressure, and even the corners of the recesses are sufficiently pressurized, and the adhesive strength between each layer of the ceramic laminate is high, and the ceramic laminate is No peeling occurs between the layers during or after firing.
また、各層上に形成された各機能層の接着強度が高くて
各機能層がアイオノマの薄膜を剥離する際に剥離するこ
ともない。Further, since the adhesive strength of each functional layer formed on each layer is high, each functional layer does not peel off when the ionomer thin film is peeled off.
（実施例）
以下本発明の実施例を、竿導体集積回路用セラミ、クパ
ノケージの積層基板を製造する例に基づいて説明する。(Example) Examples of the present invention will be described below based on an example of manufacturing a laminated substrate of ceramic for a rod conductor integrated circuit and a cupano cage.
図面には当該積層基板の焼成以前の状態であるセラミッ
ク積層体１０を概略的に示しており、セラミ、り積層体
１０の外周は第１皮膜２１および第２皮膜２２にて被覆
されている。セラミック積層体１０は複数枚のグリーン
ノート１１〜１４を積層してなるもので、各グリーンノ
ートｉｔ〜１４はアルミナ等のセラミック質粉末に鉱化
剤とともに熱可塑性合成樹脂を均一に混合して混練した
ものを、ドクターブレード法等により／−ト化してなる
ものである。The drawing schematically shows a ceramic laminate 10 in a state before firing the multilayer substrate, and the outer periphery of the ceramic laminate 10 is covered with a first film 21 and a second film 22. The ceramic laminate 10 is made by laminating a plurality of green notes 11 to 14, and each green note it to 14 is made by uniformly mixing and kneading a ceramic powder such as alumina with a mineralizer and a thermoplastic synthetic resin. It is obtained by converting the obtained material into /-t by a doctor blade method or the like.
かかるグリーンノートを複数枚積層するに際しては各グ
リーンノートを所定形状に打ち抜き、さらにグリーンノ
ート上に導体ペースト等による印刷により回路パターン
が形成され、これらのグリ−７ノートはその後に積層さ
れかつ溶剤を用いて各グリーンノートの層間を仮接着さ
れて、セラミ。When stacking a plurality of such Green Notes, each Green Note is punched out into a predetermined shape, a circuit pattern is formed on the Green Note by printing with conductive paste, etc., and these Green Notes are then stacked and treated with a solvent. The layers of each green note are temporarily bonded using ceramic.
り積層体ｌＯを形成している。A laminate IO is formed.
セラミック積層体１０においては、その表面側に段付き
の凹所１５を備えている。かかる凹所１５は正方形を呈
していて、凹所１５の底面と側面との境界部、および段
面と側面との境界部に方形の隅部１５ａ、 １５ｂを備
えている。かかるセラミック積層体１０は静水圧プレス
により圧着処理され、その後焼成されて積層基板となる
。また、セラミ／り積層体】Ｏに静水圧プレスを施すに
際しては同セラミック積層体１０の外周を第１皮膜２１
および第２皮膜２２にて被覆する。The ceramic laminate 10 has a stepped recess 15 on its surface side. The recess 15 has a square shape, and has rectangular corners 15a and 15b at the boundary between the bottom surface and the side surface of the recess 15, and at the boundary between the stepped surface and the side surface. The ceramic laminate 10 is subjected to a pressure bonding process using a hydrostatic press, and then fired to form a laminate substrate. In addition, when applying hydrostatic pressing to the ceramic laminate 10, the outer periphery of the ceramic laminate 10 is coated with the first coating 21.
and covered with a second film 22.
第１皮膜２１はアイオフ７−の薄膜からなり、かつ第２
皮膜２２はゴムの薄膜からなる。アイオノマの薄膜とし
てはハイミラン１６５２を原料とするフィルム（ハイミ
ラノフィルム）を用い、セラミ。The first film 21 is made of a thin film of eye-off 7-, and the second
The film 22 is made of a thin rubber film. As the ionomer thin film, a film made from Himilan 1652 (Himilan film) was used, and a ceramic film was used.
り積層体１０をハイミランフィルムからなる袋に収納し
て温度的８０°Ｃの雰囲気中て真空包装し、同時にその
外周から５ｋｇ／ｃｍ２の圧力を１ｏｓｅｃ間付与する
。これにより、セラミック積層体１０の外周に第１皮膜
２１が形成される。ハイミラ７１６５２は三片・デュポ
ンポリケミカル株式会社製アイオノマーの商品名であり
、エチレン−メタクリル酸共重合体の分子間をＺｎイオ
ンで架橋したものである。また、ゴムの薄膜の形成には
天然ゴムを主体としたラテックスが用いられ、第１皮膜
２１にて被覆されたセラミック１層体１ｏをラテックス
にディッピングして同ラテックスを第１皮膜２１の外周
に塗布し、約１００°Ｃにて乾燥して同第１皮膜２１の
外周を第２皮膜２２にて被覆する。第１皮膜２１および
第２皮膜２２にて被覆されたセラミック積層体１０に温
度的８０℃。The laminate 10 was housed in a bag made of Himilan film and vacuum packaged in an atmosphere at a temperature of 80° C., and at the same time a pressure of 5 kg/cm 2 was applied from the outer periphery for 1 osec. As a result, the first film 21 is formed on the outer periphery of the ceramic laminate 10. Himira 71652 is a trade name of an ionomer manufactured by DuPont Mikata Polychemical Co., Ltd., which is an ethylene-methacrylic acid copolymer whose molecules are cross-linked with Zn ions. Also, latex mainly made of natural rubber is used to form the thin rubber film, and the ceramic single-layer body 1o coated with the first film 21 is dipped in latex, and the latex is applied to the outer periphery of the first film 21. It is applied and dried at about 100° C., and the outer periphery of the first film 21 is covered with the second film 22. The temperature of the ceramic laminate 10 coated with the first film 21 and the second film 22 was 80°C.
圧力１００ｋｇ／□□□２９時間２ｍ１ｎ、常法の静水
圧プレスを施し、その後両皮膜２１．２２を剥離して水
素ガス雰囲気中で約１６００℃にて焼成した。A conventional hydrostatic press was applied at a pressure of 100 kg/□□□ for 29 hours and 2 ml, and then both films 21 and 22 were peeled off and fired at about 1600° C. in a hydrogen gas atmosphere.
かかる圧着方法により得られたセラミック積層体１０に
ついて、両皮膜２１．２２を剥離する際の回路パターン
（機能層）の剥離状態を観察したところ、機能層が剥離
している状態は認められなかった。Regarding the ceramic laminate 10 obtained by this pressure bonding method, when the peeling state of the circuit pattern (functional layer) was observed when both films 21 and 22 were peeled off, no peeling of the functional layer was observed. .
また、かかるセラミック積層体１０の焼成後の各層間の
剥離および膨れ状態を観察したところ、このような剥離
や膨れは全く認められなかった。これに対して、セラミ
ック積層体１０の外周をポリエチレンの薄膜のみにて被
覆した従来法（比較例）においては、同薄膜がセラミッ
ク積層体１０の凹所１５の各隅部１５ａ、１５ｂにまで
は密着しておらず、機能層の剥離および焼成後の各層間
の剥離、膨れが認められた。また、セラミック積層体１
０の外周をアイオノマーの＃膜のみにて被覆した例にお
いては、焼成後の各層間の膨れが僅かに認められたが製
品としては殆ど問題がなかった。Moreover, when the peeling and swelling between the layers of the ceramic laminate 10 after firing were observed, no such peeling or swelling was observed. On the other hand, in the conventional method (comparative example) in which the outer periphery of the ceramic laminate 10 is covered only with a polyethylene thin film, the thin film does not reach each corner 15a, 15b of the recess 15 of the ceramic laminate 10. There was no adhesion, and peeling of the functional layer and peeling and swelling between the layers after firing were observed. In addition, ceramic laminate 1
In an example in which the outer periphery of 0 was covered only with the ionomer # film, slight swelling between the layers was observed after firing, but there was almost no problem with the product.
図面は本発明の圧着方法に採用する各皮膜にて被覆され
たセラミック積層体の断面図である。
符 号 の 説 明
１０・ ・・セラミック積層体、１１〜１４・・・グリ
ン／−ト、 １５・・・凹所、 】５ａ、ｊ５ｂ・ ・
・隅部、 ２】・・・第１皮膜（アイオノマーの薄膜
）、２２・・・第２皮膜（ゴムの薄膜）。The drawings are cross-sectional views of ceramic laminates coated with various coatings employed in the compression bonding method of the present invention. Explanation of symbols 10...Ceramic laminate, 11-14...Grin/-t, 15...Recess, ]5a, j5b...
- Corner, 2]...first film (ionomer thin film), 22...second film (rubber thin film).
Claims (2)
なくとも一面側に開口する凹所を備えたセラミック積層
体の各層間を圧着するセラミック積層体の圧着方法にお
いて、前記セラミック積層体の外周をアイオノマーの薄
膜にて被覆した状態で、当該セラミック積層体に流体圧
プレスを施すことを特徴とするセラミック積層体の圧着
方法。(1). In a method for crimping a ceramic laminate, the outer periphery of the ceramic laminate is covered with a thin film of ionomer. 1. A method for crimping a ceramic laminate, which comprises subjecting the ceramic laminate to a fluid pressure press while the ceramic laminate is coated with a ceramic laminate.
ノマーの薄膜を被覆されたセラミック積層体の外周をゴ
ムの薄膜にて被覆した状態で、当該セラミック積層体に
流体圧プレスを施すことを特徴とするセラミック積層体
の圧着方法。(2). In the crimping method according to item 1, the ceramic laminate coated with the ionomer thin film is subjected to a fluid pressure press while the outer periphery of the ceramic laminate is covered with a rubber thin film. Method of crimping laminates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18988490A JPH0477204A (en) | 1990-07-18 | 1990-07-18 | Method for compression bonding of ceramic laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18988490A JPH0477204A (en) | 1990-07-18 | 1990-07-18 | Method for compression bonding of ceramic laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0477204A true JPH0477204A (en) | 1992-03-11 |
| JPH0577483B2 JPH0577483B2 (en) | 1993-10-26 |
Family
ID=16248793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18988490A Granted JPH0477204A (en) | 1990-07-18 | 1990-07-18 | Method for compression bonding of ceramic laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0477204A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0939160A (en) * | 1995-07-25 | 1997-02-10 | Nec Corp | Manufacture of ceramic multilayer wiring board |
| JP2010537846A (en) * | 2007-09-03 | 2010-12-09 | ダウ グローバル テクノロジーズ インコーポレイティド | Substrate containing polymer layer and method for preparing the same |
| CN111645451A (en) * | 2019-03-04 | 2020-09-11 | 世联株式会社 | Decorative sheet |
-
1990
- 1990-07-18 JP JP18988490A patent/JPH0477204A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0939160A (en) * | 1995-07-25 | 1997-02-10 | Nec Corp | Manufacture of ceramic multilayer wiring board |
| JP2010537846A (en) * | 2007-09-03 | 2010-12-09 | ダウ グローバル テクノロジーズ インコーポレイティド | Substrate containing polymer layer and method for preparing the same |
| CN111645451A (en) * | 2019-03-04 | 2020-09-11 | 世联株式会社 | Decorative sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0577483B2 (en) | 1993-10-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0381879A1 (en) | Method of manufacturing laminated ceramic electronic component | |
| US5089071A (en) | Process for producing a multilayered ceramic structure using an adhesive film | |
| JPH01120097A (en) | Manufacture of multilayer ceramic board | |
| US5948526A (en) | Protected sheet laminate | |
| US6726984B2 (en) | Ceramic structure using a support sheet | |
| KR100357434B1 (en) | Laminates to seal and encapsulate electronic circuit boards | |
| JPH0477204A (en) | Method for compression bonding of ceramic laminate | |
| JPH03250612A (en) | Manufacture of laminated ceramic parts | |
| JP3846241B2 (en) | Manufacturing method of multilayer ceramic electronic component | |
| JP2001044071A (en) | Manufacture of ceramic electronic component | |
| JPH09129487A (en) | Manufacture of laminated ceramic electronic part | |
| JPH0477205A (en) | Method for compression bonding of ceramic laminate | |
| JP2979330B2 (en) | Elastic material sheet with adhesive for manufacturing electronic parts and method for manufacturing laminated chip parts | |
| JPH01208824A (en) | Manufacture of laminated ceramic electronic part | |
| JPH0218988A (en) | Manufacture of flexible printed board | |
| EP0771181B1 (en) | Sheets with high temperature stable protective coating | |
| JPH034017B2 (en) | ||
| JPH04201514A (en) | Laminating method for ceramic green sheet | |
| JPH03236210A (en) | Manufacture of sheet-shaped ceramic composite capacitor | |
| JPH07130586A (en) | Surface treatment method of butyl rubber and composite material formed thereof | |
| JPS62145890A (en) | Manufacture of printed circuit substrate | |
| JPH05283277A (en) | Manufacture of laminated ceramic electronic component | |
| JPH09148745A (en) | Manufacture of multilayer wiring board | |
| JPH0242352B2 (en) | ||
| JPS62202705A (en) | Ceramic film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |