JPH0218988A - Manufacture of flexible printed board - Google Patents
Manufacture of flexible printed boardInfo
- Publication number
- JPH0218988A JPH0218988A JP16929488A JP16929488A JPH0218988A JP H0218988 A JPH0218988 A JP H0218988A JP 16929488 A JP16929488 A JP 16929488A JP 16929488 A JP16929488 A JP 16929488A JP H0218988 A JPH0218988 A JP H0218988A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- circuit conductor
- gas
- film
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000012787 coverlay film Substances 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims abstract description 25
- 238000007731 hot pressing Methods 0.000 claims abstract description 6
- 229920003023 plastic Polymers 0.000 claims abstract description 6
- 239000004033 plastic Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229920002457 flexible plastic Polymers 0.000 claims description 5
- 239000010408 film Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 18
- 239000011888 foil Substances 0.000 description 16
- 230000037303 wrinkles Effects 0.000 description 7
- 238000007747 plating Methods 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、フレキシブルプリント基板の製造方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a flexible printed circuit board.
［従来の技術］
フレキシブルプリント基板は、一般に、可撓性を有する
プラスチック製基板の表面に銅箔からなる回路導体を形
成した後、その表面にカバーレイフィルムを貼り合わせ
て製造される。[Prior Art] A flexible printed circuit board is generally manufactured by forming a circuit conductor made of copper foil on the surface of a flexible plastic substrate and then bonding a coverlay film to the surface.
カバーレイフィルムを基板に貼り合わせるには、主に、
熱板プレスにより高温高圧下で熱圧着する方法がとられ
ている。To attach the coverlay film to the substrate, the main steps are:
A method of thermocompression bonding under high temperature and pressure using a hot plate press is used.
ところで、カバーレイフィルムをむらなく均一に基板に
貼り合わせるために、カバーレイフィルムの上に、クッ
ション材（ＩＥ、ＰＥ、ＥＶＡ等）を載せてこの上から
熱板プレスを行っているが、クッション材と基板との離
型性を確保するために、これらの間に有機フィルム等の
離型フィルムを介在させている。By the way, in order to bond the coverlay film evenly and uniformly to the substrate, a cushioning material (IE, PE, EVA, etc.) is placed on top of the coverlay film and hot plate pressing is performed on top of the cushioning material. In order to ensure releasability between the material and the substrate, a release film such as an organic film is interposed between them.
［発明が解決しようとする課題］
ところで、上記のようにクッション材と基板との間に離
型フィルムを介在させた状態で熱圧着を行うと、以下の
ような問題が生じる。[Problems to be Solved by the Invention] By the way, when thermocompression bonding is performed with a release film interposed between the cushion material and the substrate as described above, the following problems occur.
■離型フィルムから発生する分解ガスが、回路導体の表
面に付着し、後の工程の回路導体に対する鍍金の付着不
良の原因となる。(2) Decomposition gas generated from the release film adheres to the surface of the circuit conductor, causing poor adhesion of plating to the circuit conductor in the subsequent process.
■離型フィルムは、ガスの透過を防止する作用に限度が
あるため、クッション材から発生するガスか透過して回
路導体の表面に何首し、上記と同様に、後の工程の回路
導体に対する鍍金の付着不良の原因となる。■The mold release film has a limited ability to prevent gas from permeating, so the gas generated from the cushioning material can permeate the surface of the circuit conductor. This may cause poor plating adhesion.
■離型フィルムが熱によって寸法変化を起こすことによ
り、基板寸法の変化およびカバーレイフィルム表面にし
わが生じて外観が不良となる。-Dimensions of the release film change due to heat, resulting in changes in substrate dimensions and wrinkles on the surface of the coverlay film, resulting in poor appearance.
［課題を解決するための手段］
本発明は上記課題を解決するためになされたちのであっ
て、可撓性を有するプラスチック製基板の表面に回路導
体を形成し、その上に、カバーレイフィルム、金属層を
有する離型材、り、／ヨン材、鏡面板をこの順序で積層
し、次いで、これらをプラスチック基板に対し熱間プレ
スし、カバー（／イフィルムを前記基板に熱圧着して貼
り合わせることを特徴としている。[Means for Solving the Problems] The present invention has been made to solve the above problems, and includes forming a circuit conductor on the surface of a flexible plastic substrate, and forming a coverlay film thereon. The mold release material having a metal layer, the adhesive material, and the mirror plate are laminated in this order, and then these are hot-pressed onto a plastic substrate, and the cover film is bonded to the substrate by hot pressing. It is characterized by
［作用］
離型材の金属層からはガスが発生しないことから、基板
の回路導体に何ら影響を及ぼさず、また、完全にガスの
透過を遮断するから、クッション材から発生するガスが
完全に遮断され、したがって、そのガスが回路導体の表
面に付着することかない。[Function] Since no gas is generated from the metal layer of the mold release material, it has no effect on the circuit conductors of the board, and it completely blocks gas transmission, so gas generated from the cushioning material is completely blocked. Therefore, the gas will not adhere to the surface of the circuit conductor.
また、金属層は熱によって寸法変化か起きず、また、そ
れ自体に鏡面板が圧着されることによりしわの発生が防
がれるから、基板の寸法変化およびカバーレイフィルム
表面にしわが生じて外観が不良となるといったことがな
い。In addition, the metal layer does not undergo dimensional changes due to heat, and since the mirror plate is crimped onto itself, wrinkles are prevented, resulting in dimensional changes in the substrate and wrinkles on the surface of the coverlay film, resulting in poor appearance. There is no possibility that it will become defective.
［実施例１
以下、第１図を参照し、本発明方法にもとついてフレキ
ンプルプリント基板を製造する第１ Ｘ Ｉｈ例を、手
順を追って説明する。[Example 1] Hereinafter, a first example of manufacturing a flexible printed circuit board based on the method of the present invention will be explained step by step with reference to FIG.
図中１は可撓性を有するプラスチック装基板であり、ま
ず、この基［１の表面に、銅箔による回路導体（図示略
）を形成する。In the figure, reference numeral 1 denotes a flexible plastic board, and first, a circuit conductor (not shown) made of copper foil is formed on the surface of this board [1].
次いで、ステンレス板等からなる鏡面板２の上に離型剤
としてのアルミニウム箔（金属層）３を重ね、その上に
前記基板１を置き、この基［１の表面に、カバーレイフ
ィルム４を重ねた後、離型材としてのアルミニウム箔３
、クン／ジン材５、境面仮（ステンレス板等）２をこれ
らの順に積層する。Next, an aluminum foil (metal layer) 3 as a mold release agent is layered on a mirror plate 2 made of a stainless steel plate, etc., the substrate 1 is placed on top of it, and a coverlay film 4 is placed on the surface of this substrate 1. After stacking, aluminum foil 3 as a mold release material
, Kun/Jin material 5, and interface temporary (stainless steel plate, etc.) 2 are laminated in this order.
前記クソンヨン材５としては、適宜厚さの紙、紙と合成
樹脂を積層させたもの、ＰＥ（ポリエチレン）、Ｅ Ｖ
Ａ （エチレン酢酸ビニル共重合体）、シリコンゴム
等を用いる。The material 5 may be paper of appropriate thickness, a laminate of paper and synthetic resin, PE (polyethylene), EV, etc.
A (ethylene vinyl acetate copolymer), silicone rubber, etc. are used.
そして、これらを図中矢印方向に、高温高圧下で熱間プ
レスすることにより、カバーレイフィルム４を基板１表
面に圧着させる。プレスの条件としては、温度： １３
０〜１８０°Ｃ１圧力 ２０〜８０ｋｇ／ｃｍ’、時間
：３０〜９０分が適当である。Then, by hot pressing these in the direction of the arrow in the figure under high temperature and high pressure, the coverlay film 4 is pressed onto the surface of the substrate 1. Pressing conditions include temperature: 13
Appropriate conditions are 0 to 180°C, pressure 20 to 80 kg/cm', and time 30 to 90 minutes.
次いて、両鏡面板２を外し、両アルミニウム箔３ととも
にクッション材４を剥かすことにより、基板１表面にカ
バーレイフィルム４か圧着状態で貼り合わせられたフレ
キシブルプリント基板を得る。Next, both the mirror plates 2 are removed and the cushioning material 4 is peeled off together with both the aluminum foils 3, thereby obtaining a flexible printed circuit board in which the coverlay film 4 is bonded to the surface of the substrate 1 in a pressure-bonded state.
この方法によれば、離型材として用いているアルミニウ
ム箔３は、ガスが発生しないことから基板１の回路導体
に何ら影響を及ぼさず、また、完全にガスの透過を遮断
するから、クツ７ョン材５から発生するガスが完全に遮
断され、したがって、そのガスが回路導体の表面に付着
することがなく、後工程における回路導体への鍍金の付
着不良か起こらない。According to this method, the aluminum foil 3 used as a mold release material has no effect on the circuit conductor of the board 1 since no gas is generated, and it completely blocks gas transmission, so The gas generated from the conductor material 5 is completely blocked, and therefore, the gas does not adhere to the surface of the circuit conductor, thereby preventing poor adhesion of plating to the circuit conductor in a subsequent process.
また、アルミニウム７Ｉ３は熱によって寸法変化か起き
ず、また、アルミニウム箔３自体か、鏡面板２が圧冴さ
れることにより、しわの発生か防がれるから、基＋ｉ
ｔの寸法変化およびカバーレイフィルム４表面にしわが
生じて外観か不良となるといったことがない。In addition, aluminum 7I3 does not undergo dimensional changes due to heat, and wrinkles are prevented by pressing the aluminum foil 3 itself or the mirror plate 2.
There will be no dimensional change in t or wrinkles on the surface of the coverlay film 4 resulting in poor appearance.
次いで、第２図を参照して、本発明方法の第２実施例を
説明する。Next, a second embodiment of the method of the present invention will be described with reference to FIG.
前記鏡面板２の上に離型剤としてのアルミニウム箔３を
重ね、その上に回路導体を形成した前記基板１を置き、
この基板１の表面に、カバーレイフィルム４を重ねた後
、離型材としてのアルミニウム箔と耐熱フィルムの積層
体６、前記クッション材５、鏡面板（ステンレス板等）
２をこれらの順に積層する。Aluminum foil 3 as a mold release agent is layered on the mirror plate 2, and the substrate 1 on which the circuit conductor is formed is placed on top of the aluminum foil 3.
After overlaying the coverlay film 4 on the surface of this substrate 1, a laminate 6 of aluminum foil and a heat-resistant film as a mold release material, the cushioning material 5, and a mirror plate (stainless steel plate, etc.)
2 are stacked in this order.
そして、これらを図中矢印方向に、高温高圧下で熱間プ
レスすることにより、カバーレイフィルム４を基板１表
面に圧着させる。Then, by hot pressing these in the direction of the arrow in the figure under high temperature and high pressure, the coverlay film 4 is pressed onto the surface of the substrate 1.
次いで、両鏡面板２を外し、両アルミニウム箔３ととも
にクッション材５、積層体６を剥がすことにより、基板
１表面にカバーレイフィルム４が圧着状態で貼り合わせ
られたフレキシブルプリント基板を得る。Next, both the mirror plates 2 are removed, and the cushioning material 5 and the laminate 6 are peeled off together with both the aluminum foils 3, thereby obtaining a flexible printed circuit board in which the coverlay film 4 is bonded to the surface of the substrate 1 in a pressure-bonded state.
次いで、第３図を参照して本発明方法の第３実施例を説
明する。Next, a third embodiment of the method of the present invention will be described with reference to FIG.
前記鏡面板２の上に離型剤としてのアルミニウム箔３を
重ね、その上に回路導体を形成した前記基板Ｉを置き、
この基板１の表面に、カバーレイフィルム４を重ねた後
、アルミニウム箔の上にクノンヨン材を重ねた積層体７
、前記鏡面板２をこれらの順に積層する。Aluminum foil 3 as a mold release agent is layered on the mirror plate 2, and the substrate I on which the circuit conductor is formed is placed on top of the aluminum foil 3,
A laminate 7 in which a coverlay film 4 is overlaid on the surface of this substrate 1, and then a kunonyon material is overlaid on aluminum foil.
, the mirror plates 2 are stacked in this order.
そして、これらを図中矢印方向に、高温高圧下で熱間プ
レスすることにより、カバーレイフィルム４を基板１表
面に圧着させる。Then, by hot pressing these in the direction of the arrow in the figure under high temperature and high pressure, the coverlay film 4 is pressed onto the surface of the substrate 1.
次いで、両鏡面板２を外し、アルミニウム箔３および積
層体７を剥がすことにより、基板１表面にカバーレイフ
ィルム４が圧着状態で貼り合わせられたフレキシブルプ
リント基板を得る。Next, both the mirror plates 2 are removed, and the aluminum foil 3 and the laminate 7 are peeled off to obtain a flexible printed circuit board in which the coverlay film 4 is bonded to the surface of the substrate 1 under pressure.
上記第２、第３実施例によっても、先の第１実施例と同
様の効果を得る。The second and third embodiments described above also provide the same effects as the first embodiment.
なお、上記各実施例において、アルミニウム箔３の代わ
りに、フィルムの表面にアルミニウム等の金属が蒸着に
より積層された金属蒸着フィルムを用いてもよい。In each of the above embodiments, instead of the aluminum foil 3, a metal vapor-deposited film in which a metal such as aluminum is laminated on the surface of the film by vapor deposition may be used.
また、基板１の下にアルミニウム箔３をおいているが、
基板１裏面にはカバーレイフィルム４を貼り合わせない
ので、通常の離型フィルムを用いてもよい。Also, an aluminum foil 3 is placed under the substrate 1,
Since the coverlay film 4 is not bonded to the back surface of the substrate 1, a normal release film may be used.
［発明の効果］
以上説明したように、本発明のフレキシブルプリント基
板の製造方法によれば、可撓性を有するプラスチック製
基板の表面に回路導体を形成し、その上に、カバーレイ
フィルム、金属層を有する離型材、クッション材、鏡面
板をこの順序で積層し、次いで、これらをプラスチック
基板に対し熱間プレスし、カバーレイフィルムを前記基
板に熱圧着して貼り合わせることを特徴とするから、以
下のような効果を奏する。[Effects of the Invention] As explained above, according to the method for manufacturing a flexible printed circuit board of the present invention, a circuit conductor is formed on the surface of a flexible plastic substrate, and a coverlay film, a metal The method is characterized in that a release material, a cushioning material, and a mirror plate having layers are laminated in this order, and then these are hot pressed against a plastic substrate, and a coverlay film is bonded to the substrate by thermocompression. , has the following effects.
■離型材の金属層からはガスが発生しないことから、基
板の回路導体に何ら影響を及ぼさず、また、完全にガス
の透過を遮断するから、クッション材から発生するガス
が完全に遮断され、したがって、そのガスが回路導体の
表面に付着することがなく、後工程における回路導体へ
の鍍金の付着不良が起こらない。■Since no gas is generated from the metal layer of the mold release material, it has no effect on the circuit conductors of the board, and because it completely blocks gas transmission, gas generated from the cushioning material is completely blocked. Therefore, the gas does not adhere to the surface of the circuit conductor, and failure of plating to adhere to the circuit conductor in a subsequent process does not occur.
■金属層は熱によって寸法変化が起きず、また、それ自
体に鏡面板が圧着されることによりしわの発生が防がれ
るから、基板の寸法変化およびカバーレイフィルム表面
にしわが生じて外観が不良となるといったことがない。■The metal layer does not undergo dimensional changes due to heat, and the mirror plate is crimped onto itself to prevent wrinkles, resulting in dimensional changes in the substrate and wrinkles on the surface of the coverlay film, resulting in poor appearance. There is no such thing as
第１図は本発明の第１実施例を説明する側面図、第２図
は本発明の第２実施例を説明する側面図、第３図は本発
明の第３実施例を説明する側面図である。
■・・・・・・基板、２・・・・・・鏡面板、３・・・
・・・アルミニウム箔（金属層）、４・・・・・・カバ
ーレイフィルム、５ ・・・・・クッション材。FIG. 1 is a side view explaining a first embodiment of the invention, FIG. 2 is a side view explaining a second embodiment of the invention, and FIG. 3 is a side view explaining a third embodiment of the invention. It is. ■...Substrate, 2...Mirror plate, 3...
... Aluminum foil (metal layer), 4 ... Coverlay film, 5 ... Cushion material.
Claims (1)
形成し、その上に、カバーレイフィルム、金属層を有す
る離型材、クッション材、鏡面板をこの順序で積層し、
次いで、これらをプラスチック基板に対し熱間プレスし
、カバーレイフィルムを前記基板に熱圧着して貼り合わ
せることを特徴とするフレキシブルプリント基板の製造
方法。A circuit conductor is formed on the surface of a flexible plastic substrate, and a coverlay film, a mold release material having a metal layer, a cushioning material, and a mirror plate are laminated in this order on top of the circuit conductor.
A method for manufacturing a flexible printed circuit board, which comprises: hot pressing these onto a plastic substrate, and bonding a coverlay film to the substrate by thermocompression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16929488A JPH0218988A (en) | 1988-07-07 | 1988-07-07 | Manufacture of flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16929488A JPH0218988A (en) | 1988-07-07 | 1988-07-07 | Manufacture of flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0218988A true JPH0218988A (en) | 1990-01-23 |
Family
ID=15883853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16929488A Pending JPH0218988A (en) | 1988-07-07 | 1988-07-07 | Manufacture of flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0218988A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05280412A (en) * | 1992-04-01 | 1993-10-26 | Nippondenso Co Ltd | Engine controller |
| US6391460B1 (en) | 1998-08-06 | 2002-05-21 | Yamauchi Corporation | Rubber for hot press cushioning pad, manufacturing method thereof, hot press cushioning pad and method of manufacturing printed circuit board |
| JP2005059543A (en) * | 2003-08-20 | 2005-03-10 | Toyo Aluminium Kk | Mold releasing material and method of manufacturing circuit board structure using it |
| JP2010201778A (en) * | 2009-03-03 | 2010-09-16 | Fujikura Ltd | Cushion film for hot press |
-
1988
- 1988-07-07 JP JP16929488A patent/JPH0218988A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05280412A (en) * | 1992-04-01 | 1993-10-26 | Nippondenso Co Ltd | Engine controller |
| US6391460B1 (en) | 1998-08-06 | 2002-05-21 | Yamauchi Corporation | Rubber for hot press cushioning pad, manufacturing method thereof, hot press cushioning pad and method of manufacturing printed circuit board |
| JP2005059543A (en) * | 2003-08-20 | 2005-03-10 | Toyo Aluminium Kk | Mold releasing material and method of manufacturing circuit board structure using it |
| JP2010201778A (en) * | 2009-03-03 | 2010-09-16 | Fujikura Ltd | Cushion film for hot press |
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