CN112406217B - Metal plastic composite film and preparation method and application thereof - Google Patents

Metal plastic composite film and preparation method and application thereof Download PDF

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Publication number
CN112406217B
CN112406217B CN202011165523.3A CN202011165523A CN112406217B CN 112406217 B CN112406217 B CN 112406217B CN 202011165523 A CN202011165523 A CN 202011165523A CN 112406217 B CN112406217 B CN 112406217B
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plastic composite
metal
film
composite film
metal foil
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CN112406217A (en
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陈康
韩佳明
陈勇利
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AAC Module Technologies Changzhou Co Ltd
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AAC Module Technologies Changzhou Co Ltd
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Priority to PCT/CN2020/128917 priority patent/WO2022088274A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a metal plastic composite film, a preparation method of the metal plastic composite film and application of the metal plastic composite film in the field of LCP substrate preparation. The metal plastic composite film comprises a first metal foil, a polymer filling film, a second metal foil, an adhesive layer and a polymer release film which are sequentially stacked. Above-mentioned metal plastic composite film is including the first metal foil that stacks gradually, polymer filling film, second metal foil, adhesive layer and polymer release film, and when this metal plastic composite film was applied to LCP base plate preparation, only need provide three kinds of pressfitting auxiliary materials of this metal plastic composite film, high temperature blotter and mirror surface steel sheet, and the number of piles is piled up to the auxiliary material that significantly reduces to can reduce the mistake and leak and save the lamination time.

Description

Metal plastic composite film and preparation method and application thereof
[ technical field ] A method for producing a semiconductor device
The invention relates to a LCP high-temperature laminating process, in particular to a metal plastic composite film, a preparation method thereof and application of the metal plastic composite film in the field of LCP substrate preparation.
[ background of the invention ]
With the rapid development of 5G communication and millimeter waves, the demand of high-frequency and high-speed FPCs is increasing. Currently, the high-frequency substrate mainly used in the industry is mainly an LCP substrate (liquid crystal polymer substrate), and a high-temperature pressing process is usually required to manufacture the LCP substrate.
LCP base plate preparation needs to use corresponding supplementary material to carry out the pressfitting, and the supplementary material of the main selection of LCP base plate preparation at present is high temperature blotter, mirror surface steel sheet, metal foil, polymer filling film, polymer release film etc. respectively. Wherein the high-temperature buffer cushion and the mirror steel plate play the roles of heat transfer and pressure equalization, and the two auxiliary materials can be used for multiple times; the metal foil is mainly used for preventing the polymer filling film from being stuck on the mirror steel plate and preventing the polymer filling film from cooling and shrinking after being melted; the polymer filling film is mainly converted from a solid state to a liquid state at high temperature, plays a role in filling in the pressing process and has a forming function; the polymer release film is required to have the characteristics of heat resistance, excellent non-adhesiveness, low friction coefficient and the like, is not easy to fuse with other substances, is not easy to adhere to other substances, and mainly plays a release role.
Referring to fig. 1, in a conventional LCP substrate manufacturing process, high-temperature laminated auxiliary materials such as a high-temperature cushion, a metal foil, a polymer filling film, a polymer release film, and a mirror steel plate need to be stacked layer by layer, and sizes of the auxiliary materials are different, and the auxiliary materials need to be aligned when being stacked. That is to say, in the conventional LCP high temperature lamination process, the number of layers of the high temperature lamination auxiliary material is stacked more, which is prone to causing error leakage and wasting lamination time.
[ summary of the invention ]
Therefore, there is a need for a metal plastic composite film, which can reduce the leakage and save the lamination time when applied to the LCP high temperature lamination process.
In addition, a preparation method of the metal plastic composite film and an application of the metal plastic composite film in the field of LCP substrate preparation are also needed to be provided.
The metal plastic composite film comprises a first metal foil, a polymer filling film, a second metal foil, an adhesive layer and a polymer release film which are sequentially stacked.
The preparation method of the metal plastic composite film comprises the following steps:
coating a polymer filling material on a first metal foil, and drying for the first time to obtain a first membrane material, wherein the first membrane material comprises the first metal foil and a polymer filling membrane which are laminated;
coating a second metal foil to form an adhesive layer, then overlapping a polymer release film on the adhesive layer, and drying for the second time to obtain a second film material, wherein the second film material comprises the second metal foil, the adhesive layer and the polymer release film which are laminated; and
and laminating the first film material and the second film material together to obtain a metal plastic composite film, wherein the metal plastic composite film comprises the first metal foil, the polymer filling film, the second metal foil and the polymer release film which are sequentially laminated.
The metal plastic composite film or the metal plastic composite film prepared by the preparation method of the metal plastic composite film is applied to the field of LCP substrate preparation.
Above-mentioned metal plastic composite film is including the first metal foil that stacks gradually, polymer filling film, second metal foil, adhesive layer and polymer release film, combines fig. 1, and when this metal plastic composite film was applied to LCP base plate preparation, only need provide three kinds of pressfitting auxiliary materials of this metal plastic composite film, high temperature blotter and mirror surface steel sheet, the number of piles of the auxiliary material that significantly reduces to can reduce the mistake and leak and save the lamination time.
[ description of the drawings ]
Fig. 1 is a schematic view showing the lamination of various film layers in the preparation of a conventional LCP substrate.
Fig. 2 is a schematic structural view of a metal plastic composite film according to an embodiment.
Fig. 3 is a flow chart of a process for preparing the metal plastic composite film shown in fig. 1.
[ detailed description ] embodiments
The invention is further described with reference to the following figures and embodiments.
As shown in fig. 2, the metal plastic composite film 100 according to one embodiment includes a first metal foil 110, a polymer filling film 120, a second metal foil 130, an adhesive layer 140, and a polymer release film 150, which are sequentially stacked.
The metal plastic composite film 100 includes a first metal foil 110, a polymer filling film 120, a second metal foil 130, an adhesive layer 140, and a polymer release film 150, which are sequentially stacked. Referring to fig. 1, when the metal plastic composite film 100 is applied to the preparation of LCP substrates, only three pressing auxiliary materials, namely the metal plastic composite film 100, the high temperature buffer pad and the mirror steel plate, need to be provided, so that the number of stacked auxiliary materials is greatly reduced, thereby reducing the possibility of missing and saving the stacking time.
Specifically, in the preparation of the conventional LCP substrate, since the number of auxiliary material stacking layers is large, it takes a long time to stack the substrate in order to meet the requirement of aligning the stacked substrate.
When the metal plastic composite film 100 is applied to the preparation of LCP substrates, the number of auxiliary material stacking layers is greatly reduced, so that the time for aligning the stacked plates is greatly saved.
The first metal foil 110 is required to be soft and can meet the molding requirement. The first metal foil 110 needs to deform along with the shape of the FPC to be bonded during the bonding process.
Preferably, the first metal foil 110 has a thickness of 0.05mm to 0.5 mm.
Preferably, the first metal foil 110 is a copper foil or an aluminum foil.
The size of the first metal foil 110 is mainly determined by the size of the mirror steel plate, and generally, the length of the first metal foil 110 is 320 mm-800 mm, and the width is 320 mm-800 mm.
The thickness of the polymer filled film 120 depends on the thickness of the LCP to be laminated, and the thickness is required to be more than half the thickness of the LCP to be laminated.
Generally, the thickness of the polymer-filled film 120 may be 0.05mm to 0.2 mm.
Preferably, the material of the polymer-filled film 120 may be Polyethylene (PE), polyvinyl chloride (pvc), or polypropylene (pp).
Particularly preferably, the material of the polymer filled film 120 is High Density Polyethylene (HDPE).
Preferably, the boundary of the polymer filling film 120 is shortened by 5mm to 40mm compared with the boundary of the first metal foil 110, so as to prevent the polymer filling film 120 from overflowing the first metal foil 110 at high temperature.
In particular, the boundary of the polymer-filled film 120 is preferably shortened by 20mm compared to the boundary of the first metal foil 110.
The second metal foil 130 is required to be soft in texture and can meet the molding requirement. The second metal foil 130 needs to deform along with the shape of the FPC to be bonded during the bonding process.
Preferably, the thickness of the second metal foil 130 is 0.05mm to 0.5 mm.
Preferably, the second metal foil 130 is a copper foil or an aluminum foil.
The size of the second metal foil 130 is mainly determined by the size of the mirror steel plate, and the length and width of the second metal foil 130 are generally consistent with those of the first metal foil 110, specifically, the length of the second metal foil 130 is 320 mm-800 mm, and the width is 320 mm-800 mm.
The adhesive layer 140 is used for bonding the second metal foil 130 and the polymer release film 150
Preferably, the thickness of the adhesive layer 140 may be 3 μm to 15 μm, and the material of the adhesive layer 140 may be selected from at least one of a polyimide adhesive, a polybenzimidazole adhesive, and a silicone adhesive.
Preferably, the thickness of the polymeric release film 150 may be 0.05mm to 0.2 mm.
Generally, it is desirable that the polymeric release film 150 can withstand a temperature of 330 ℃.
Specifically, the material of the polymeric release film 150 may be Polytetrafluoroethylene (PTFE), polyvinyl chloride, or polypropylene.
As shown in fig. 3, the present invention further provides a method for preparing the metal plastic composite film, which comprises the following steps:
s10, coating a polymer filling material on the first metal foil 110, and drying for the first time to obtain a first film.
The first film material includes a first metal foil 110 and a polymer-filled film 120 which are laminated.
Specifically, the first drying condition is drying for 1-2 h at 50-70 ℃.
S20, coating the second metal foil 130 with an adhesive layer 140, laminating a polymer release film 150 on the adhesive layer 140, and drying for the second time to obtain a second film.
The second film includes a second metal foil 130, an adhesive layer 140, and a polymeric release film 150, which are laminated.
Specifically, the second drying is carried out at 60-90 deg.C for 15-45 min
And S30, laminating the first film material obtained in the step S10 and the second film material obtained in the step S20 together for pressing, and obtaining the required metal plastic composite film 100.
The metal plastic composite film 100 includes a first metal foil 110, a polymer filling film 120, a second metal foil 130, and a polymer release film 150, which are sequentially stacked.
Specifically, when the first film material and the second film material are laminated together for lamination, the polymer filling film 120 directly contacts with the second metal foil 130, so as to ensure that the first metal foil 110, the polymer filling film 120, the second metal foil 130 and the polymer release film 150 are sequentially laminated in the metal plastic composite film 100 obtained after lamination.
Preferably, the first film material and the second film material are overlapped together for pressing, and the pressing pressure is 0.5 MPa-1.2 MPa in the operation of obtaining the metal plastic composite film.
The metal plastic composite film 100 or the metal plastic composite film 100 prepared by the preparation method of the metal plastic composite film can be applied to the preparation of LCP substrates.
Referring to fig. 1, when the metal plastic composite film 100 is applied to the preparation of the LCP substrate, only three pressing auxiliary materials, namely the metal plastic composite film 100, the high temperature buffer pad and the mirror steel plate, need to be provided, so that the number of stacked auxiliary materials is greatly reduced, thereby reducing the possibility of missing and saving the stacking time.
While the foregoing is directed to embodiments of the present invention, it will be understood by those skilled in the art that various changes may be made without departing from the spirit and scope of the invention.

Claims (12)

1. A metal plastic composite film is characterized by being applied to a LCP high-temperature laminating process and consisting of a first metal foil, a polymer filling film, a second metal foil, an adhesive layer and a polymer release film which are sequentially stacked.
2. The metal plastic composite film according to claim 1, wherein the polymer-filled film has a thickness of 0.05mm to 0.2 mm.
3. The metal plastic composite film according to claim 2, wherein the polymer filled film is made of polyethylene, polyvinyl chloride or polypropylene.
4. The metal plastic composite film according to claim 1, wherein the boundary of the polymer-filled film is shortened by 5mm to 40mm from the boundary of the first metal foil.
5. The metal plastic composite film according to claim 1, wherein the thickness of the polymeric release film is 0.05mm to 0.2 mm.
6. The metal plastic composite film according to claim 5, wherein the polymeric release film can resist a temperature of 330 ℃, and the polymeric release film is made of polytetrafluoroethylene, polyvinyl chloride or polypropylene.
7. The metal plastic composite film according to any one of claims 1 to 6, wherein the first metal foil has a thickness of 0.05mm to 0.5mm, and the second metal foil has a thickness of 0.05mm to 0.5 mm;
the first metal foil is a copper foil or an aluminum foil, and the second metal foil is a copper foil or an aluminum foil.
8. The metal plastic composite film according to claim 7, wherein the thickness of the adhesive layer is 3 μm to 15 μm, and the material of the adhesive layer is at least one selected from the group consisting of a polyimide adhesive, a polybenzimidazole adhesive, and a silicone adhesive.
9. A method for preparing a metal plastic composite film according to any one of claims 1 to 8, comprising the steps of:
coating a polymer filling material on a first metal foil, and drying for the first time to obtain a first membrane material, wherein the first membrane material comprises the first metal foil and a polymer filling membrane which are laminated;
coating a second metal foil to form an adhesive layer, then overlapping a polymer release film on the adhesive layer, and drying for the second time to obtain a second film material, wherein the second film material comprises the second metal foil, the adhesive layer and the polymer release film which are laminated; and
and laminating the first film material and the second film material together to obtain the required metal plastic composite film, wherein the metal plastic composite film is composed of the first metal foil, the polymer filling film, the second metal foil and the polymer release film which are sequentially laminated.
10. The method for preparing a metal plastic composite film according to claim 9, wherein the first film material and the second film material are laminated together and pressed to obtain the metal plastic composite film, and the pressure of the pressing is 0.5MPa to 1.2 MPa.
11. The method for preparing the metal plastic composite film according to claim 9, wherein the first drying is performed at 50-70 ℃ for 1-2 h, and the second drying is performed at 60-90 ℃ for 15-45 min.
12. A metal-plastic composite film according to any one of claims 1 to 8 or a metal-plastic composite film produced by the method of producing a metal-plastic composite film according to any one of claims 9 to 11, which is used in the field of LCP substrate production.
CN202011165523.3A 2020-10-27 2020-10-27 Metal plastic composite film and preparation method and application thereof Active CN112406217B (en)

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CN202011165523.3A CN112406217B (en) 2020-10-27 2020-10-27 Metal plastic composite film and preparation method and application thereof
PCT/CN2020/128917 WO2022088274A1 (en) 2020-10-27 2020-11-16 Metal plastic composite film, preparation method therefor and use thereof

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CN112406217B true CN112406217B (en) 2022-04-26

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114474924A (en) * 2021-12-20 2022-05-13 深圳市瑞昌星科技有限公司 High-temperature-resistant polymer-coated release film and manufacturing method thereof

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US20050221080A1 (en) * 2000-10-27 2005-10-06 Kaneka Corporation Laminate
CN1980537A (en) * 2005-11-29 2007-06-13 比亚迪股份有限公司 Crimp jointing method of flexible circuit and filling layer special for said method
CN106891586A (en) * 2017-04-01 2017-06-27 松扬电子材料(昆山)有限公司 Aluminum foil substrate suitable for FPC and preparation method thereof
CN206765465U (en) * 2017-04-01 2017-12-19 广州宏仁电子工业有限公司 Copper-clad plate presses auxiliary material
CN108235594A (en) * 2016-12-09 2018-06-29 松本涂层科技（昆山）有限公司 A kind of combined type folds structure release film and preparation method thereof
CN108495543A (en) * 2017-12-18 2018-09-04 印可得株式会社 Electromagnetic wave interdicts the manufacturing method that film, the manufacturing method of printed circuit board and electromagnetic wave interdict film
CN208883783U (en) * 2018-06-01 2019-05-21 深圳市瑞昌星科技有限公司 A kind of wiring board Thermal pressuring separating type film
CN111040649A (en) * 2019-11-14 2020-04-21 苏州市新广益电子有限公司 PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof
CN111605265A (en) * 2020-04-28 2020-09-01 深圳市信维通信股份有限公司 Liquid crystal polymer disturbing copper-clad plate and manufacturing method thereof

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CN100569049C (en) * 2006-12-25 2009-12-09 比亚迪股份有限公司 A kind of compression method of flexible circuit board

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Publication number Priority date Publication date Assignee Title
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US20050221080A1 (en) * 2000-10-27 2005-10-06 Kaneka Corporation Laminate
CN1980537A (en) * 2005-11-29 2007-06-13 比亚迪股份有限公司 Crimp jointing method of flexible circuit and filling layer special for said method
CN108235594A (en) * 2016-12-09 2018-06-29 松本涂层科技（昆山）有限公司 A kind of combined type folds structure release film and preparation method thereof
CN106891586A (en) * 2017-04-01 2017-06-27 松扬电子材料(昆山)有限公司 Aluminum foil substrate suitable for FPC and preparation method thereof
CN206765465U (en) * 2017-04-01 2017-12-19 广州宏仁电子工业有限公司 Copper-clad plate presses auxiliary material
CN108495543A (en) * 2017-12-18 2018-09-04 印可得株式会社 Electromagnetic wave interdicts the manufacturing method that film, the manufacturing method of printed circuit board and electromagnetic wave interdict film
CN208883783U (en) * 2018-06-01 2019-05-21 深圳市瑞昌星科技有限公司 A kind of wiring board Thermal pressuring separating type film
CN111040649A (en) * 2019-11-14 2020-04-21 苏州市新广益电子有限公司 PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof
CN111605265A (en) * 2020-04-28 2020-09-01 深圳市信维通信股份有限公司 Liquid crystal polymer disturbing copper-clad plate and manufacturing method thereof

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