CN216491280U

CN216491280U - Circuit board multilayer pressfitting location slow-heating blotter and manufacture equipment thereof

Info

Publication number: CN216491280U
Application number: CN202120794361.3U
Authority: CN
Inventors: 郭夕军; 宋亦健; 何华明; 聂超; 董海斌
Original assignee: Guangdong Shuocheng Technology Co ltd
Current assignee: Guangdong Shuocheng Technology Co ltd
Priority date: 2021-04-16
Filing date: 2021-04-16
Publication date: 2022-05-10
Anticipated expiration: 2031-04-16

Abstract

The utility model provides a circuit board multilayer pressing positioning slow-heating buffer pad which comprises at least one surface layer, at least one middle layer and at least one positioning device. Each surface layer comprises a first base material and a protective layer, the protective layer is positioned on the surface of the first base material, and at least one first hole glue placing hole is formed in a specific position of each surface layer. Each middle layer comprises a second base material and a rubber film layer, at least one second base material and at least one rubber film layer are alternately superposed, and a specific position of each middle layer is provided with at least one second hole rubber placing hole. When the surface layer is overlapped with the middle layer, each positioning device is positioned in each first hole glue placing hole and each second hole glue placing hole which are aligned with each other, and the surface layer, the middle layer and the positioning devices are combined through a vulcanization process.

Description

Circuit board multilayer pressfitting location slow-heating blotter and manufacture equipment thereof

Technical Field

The utility model relates to a circuit board, in particular to the field of multilayer circuit board laminated (PIN-LAM) PCB production.

Background

With the progress of the times and the rapid development of electronic technology, the continuous progress and development of the technical field of printed circuit boards are promoted. The circuit board is an indispensable role in the electronic industry field nowadays. In particular, the use specific gravity of the PCB multi-layer board has been increased year by year. Through development and progress of a single-sided, double-sided and multi-layered circuit board, the use proportion of the PCB multi-layer board is increased year by year till now, and meanwhile, the PCB multi-layer board is also developed to two extremes of high, precision, density, thinness and small. An important process for manufacturing multilayer boards of PCBs is lamination, and control of lamination quality is increasingly important in multilayer board manufacturing. In other words, the lamination quality further affects the quality of the printed circuit board.

When the circuit board multi-layer board is laminated, kraft paper is mostly adopted for heat transfer buffering. Kraft paper is placed between a hot plate and a steel plate of a laminating machine to moderate the temperature rise curve closest to bulk materials, so that the temperature difference of each layer of board material among a plurality of substrates or multilayer boards to be laminated is pulled as close as possible, and the common specification is 90 pounds to 150 pounds. However, the kraft paper has been broken at high temperature and high pressure during pressing, and thus has no toughness and is difficult to function, and therefore, it is necessary to replace the kraft paper with new one. Further, in the conventional production line board lamination, kraft paper is used as a spacer material, and the use is disposable. The use of kraft paper in large quantities is not beneficial to environmental protection and sustainable development. In addition, products on the market are also prepared by adopting a dip-coating process, using glass fiber mesh cloth, gluing by a dip-coating method, drying in the air or by drying in the air, and pressing. In the process of dip coating, a large amount of solvent is used, so that the production cost is increased, and the environment is not protected. In addition, problems such as lamination displacement, sliding plate, layering, resin space and bubble residue are easy to generate in the current multilayer circuit board manufacturing, and a great defect rate is generated.

Disclosure of Invention

The utility model has the main advantages that the circuit board multi-layer pressing positioning slow-heating buffer pad and the manufacturing equipment thereof can well and effectively solve the problems of precision and rapidity in punching and aligning in the working procedure. Furthermore, the utility model uses special materials for positioning, so that the PCB with 24-40 layers or more can be accurately aligned when being produced into multi-layer lamination production, wherein the PCB can only be pressed into two or four layers unlike the traditional non-perforated material. In other words, the utility model can make the structure of the final product more complex by using the positioning mode.

The utility model has the main advantages that the circuit board multilayer lamination positioning heat-buffering cushion and the manufacturing equipment thereof are provided, wherein the circuit board multilayer lamination positioning heat-buffering cushion can adjust the number of middle layers and combine the desired heat-buffering and buffering performances according to the requirements of customers. And the circuit board multilayer pressfitting location slow-heating blotter can accomplish the location of punching accurately to in the follow-up production, can clear up quick product and overflow and glue. Particularly, the circuit board multilayer pressing positioning heat-buffering cushion has the characteristic of repeated recycling.

The utility model has the main advantages that the utility model provides the circuit board multilayer pressing positioning slow-heating buffer pad and the manufacturing equipment thereof, wherein based on a common rubber processing method, rubber is manufactured and mixed, and rubber films with different thicknesses are rolled by adopting a rolling method. In particular, the utility model solves a series of problems of adhesion, stable heat transfer, uniform distribution and the like in the formula. Therefore, the utility model has the advantages of flexible production process, simple and controllable process and the like.

The utility model has the main advantages that the utility model provides a circuit board multilayer pressing positioning slow-heating buffer pad and manufacturing equipment thereof, wherein the hole glue formula is unique, the positioning effect is realized in the circuit board production, the sealing effect is realized in the process high pressure during the production, the overflow glue is effectively prevented from overflowing from PIN holes, the overflow resin is not adhered, and the cleaning is simple and quick after the mold is opened and drawn.

The utility model has the main advantages that the utility model provides a circuit board multilayer lamination positioning slow-heating buffer pad and manufacturing equipment thereof, wherein the circuit board multilayer lamination positioning slow-heating buffer pad has accurate positioning and can completely avoid the conditions of lamination displacement and easy generation of sliding plates during lamination production. In particular, defects such as delamination, resin voids and bubble residues are effectively avoided after the product is used. In other words, the present invention can greatly reduce the defective rate.

The utility model has the main advantages that the circuit board multilayer lamination positioning slow-heating buffer cushion comprises a protective layer, a first base material, at least one middle layer, a first base material and the protective layer, and is formed in a superposition mode, wherein hole positions are punched in advance at all interlayer positions, hole glue is placed, the interlayer positions are placed in a flat vulcanizing machine and are vulcanized and formed into a whole, the desired slow-heating buffer performance can be combined according to the number of the middle layers, and positioning holes can be punched accurately according to the requirements of customers after forming.

The utility model has the main advantages that the utility model provides a circuit board multilayer laminated positioning slow-heating buffer cushion and manufacturing equipment thereof, wherein the positioning slow-heating buffer cushion is a positioning laminated cushion used in a PIN-LAMINATION production process in circuit board production. Particularly, the service life of the circuit board multi-layer pressing positioning heat-buffering cushion exceeds 500 cycles.

The utility model has the main advantages that the circuit board multilayer pressing positioning slow-heating buffer cushion and the manufacturing equipment thereof are provided, wherein the final product is used as a substitute material for replacing kraft paper in practical application, and inherits the heat resistance and the micro elasticity of a paper material under a high-pressure condition. Meanwhile, the utility model has the function of repeated use. The formula and the product size can be adjusted according to different customers, and the product can be produced and customized for the customers.

The utility model has the main advantages that the circuit board multilayer laminating positioning slow-heating buffer pad and the manufacturing equipment thereof are provided, wherein the adhesive tape used by the heat-resistant and temperature-resistant elastic rubber pad adopts a rubber calendering adhesive film mode, the use of a large amount of organic solvents is avoided, and the circuit board multilayer laminating positioning slow-heating buffer pad is environment-friendly and safe.

Additional advantages and features of the utility model will be set forth in the detailed description which follows and in part will be apparent from the description, or may be learned by practice of the utility model as set forth hereinafter.

According to the present invention, the circuit board multilayer press-fit positioning heat-buffering cushion capable of achieving the aforementioned objects and other objects and advantages comprises:

at least one surface layer, wherein each surface layer comprises a first base material and a protective layer, the protective layer is positioned on the surface of the first base material, and a specific position of each surface layer is provided with at least one first hole glue placing hole;

at least one middle layer, wherein each middle layer comprises a second base material and a rubber film layer, the at least one second base material and the at least one rubber film layer are alternately superposed, and a specific position of each middle layer is provided with at least one second hole glue placing hole; and

at least one positioning device, wherein when the surface layer is overlapped with the middle layer, each positioning device is positioned in each first hole glue placing hole and each second hole glue placing hole which are aligned with each other, and the surface layer, the middle layer and the positioning devices are combined through a vulcanization process.

According to an embodiment of the present invention, each of the positioning devices includes a positioning hole and a positioning glue wall, wherein the positioning glue wall surrounds the first hole glue placing hole and the second hole glue placing hole, and the positioning hole is located in the middle of the positioning glue wall.

According to an embodiment of the present invention, the positioning device includes two reinforced portions formed on the surface of the protective layer and the surface of the rubber film layer, wherein the reinforced portions extend outward from two ends of the positioning rubber wall to form a flange.

According to an embodiment of the present invention, the protective layer is cured on the first substrate by a spraying process.

According to an embodiment of the present invention, the first substrate embodiment of the surface layer is a plain-woven alkali-free glass fiber cloth with a thickness of 0.18mm, a basis weight of 280 g, a warp density of 44 and a weft density of 32, wherein the thickness of the protective layer is 0.02-0.04mm, and the protective layer comprises an aqueous polytetrafluoroethylene resin PTFE aqueous system dispersion, a thickening agent, a coupling agent and water.

According to an embodiment of the present invention, the second substrate of the middle layer is a twill alkali-free glass fiber cloth with a thickness of 0.45mm, a basis weight of 500 g, a warp density of 48 and a weft density of 36, wherein the material of the rubber film layer comprises rubber, a reinforcing material, a cross-linking agent, a heat-resistant material, an acid absorbent and a processing aid.

According to an embodiment of the present invention, the positioning device is formed by a porous adhesive, wherein the material of the porous adhesive includes methyl vinyl silicone rubber, fumed silica, peroxide curing agent, zinc stearate, vinyl methoxy silane, α, ω dihydroxy polydimethylsiloxane, and cerium oxide.

According to an embodiment of the present invention, at least one of the middle layers is disposed between two of the facing layers for performing a multi-layer vulcanization combination, wherein the protection layers of the facing layers are respectively disposed at the outer sides.

According to an embodiment of the present invention, the positioning device includes two reinforced portions respectively formed on the surfaces of the two protective layers, wherein the reinforced portions respectively extend outward from two ends of a positioning rubber wall of the positioning device to form a flange, and the flange is bonded to the surface of the surface layer.

According to the present invention, the aforementioned and other objects and advantages are realized in accordance with the present invention by an apparatus for manufacturing a multi-layered press-fit positioning heat-buffering cushion for circuit boards, comprising:

a spraying machine, which solidifies a protective layer on a first base material to form a surface layer;

a rubber refining unit, which forms a middle rubber film layer;

the vulcanizing unit is used for laminating the surface layer, the rubber film layer and the second base material, which are pre-formed with at least one hole glue placing hole, placing a hole glue into the hole glue placing hole, vulcanizing and forming a combination layer, and performing secondary vulcanization through an oven of the vulcanizing unit;

the cutting and edge sealing unit is used for cutting, unhairing and edge sealing the combined layer to form at least one nonporous cushion pad; and

and the punching machine is used for punching the hole glue on the nonporous buffer pad to form the circuit board multilayer press-fit positioning heat-buffering buffer pad with at least one positioning hole.

According to one embodiment of the utility model, the rubber refining unit comprises an internal mixer, an open mill and a calender, wherein after the material of a rubber film layer is fed into the internal mixer for refining, the material is discharged to the open mill to form a rubber film, and the rubber film layer is formed through the calender.

Further objects and advantages of the utility model will be fully apparent from the ensuing description and drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

Fig. 1A to fig. 1D are schematic structural views of a positioning and heat-buffering cushion for multi-layer press-fitting of a circuit board according to a preferred embodiment of the utility model.

FIG. 2 is a logic diagram of a manufacturing flow apparatus for a multi-layer press-fit positioning thermal buffer for a circuit board according to a preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the utility model so as to enable any person skilled in the art to practice the utility model. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the utility model, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the utility model.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Fig. 1A to fig. 1D show a multi-layer press-fit positioning heat-buffering cushion for circuit board and a method for manufacturing the same according to a first preferred embodiment of the present invention. The circuit board multilayer press-fit positioning heat-buffering cushion 1 comprises at least one surface layer 10 and at least one middle layer 20. The face layer 10 and the middle layer 20 are respectively provided with at least one hole

glue placing hole

101, 201, wherein the hole glue placing hole 101 of the face layer 10 and the hole glue placing hole 201 of the middle layer 2 are aligned with each other when the face layer 10 and the middle layer 20 are laminated. Next, a hole paste 3 is placed in the hole

paste placing hole

101, 201, and then a vulcanization process S3 is performed to form the positioning device 30 in the hole paste 3. And finally, forming the circuit board multilayer press-fit positioning heat-buffering cushion 1. It should be noted that the positioning device 30 includes a positioning hole 301 and a positioning rubber wall 302. The positioning rubber walls 302 surround the hole

rubber placing holes

101 and 201, and the positioning hole 301 is located in the middle of the positioning rubber walls 302. In other words, after the positioning hole 301 is formed by the hole paste 3, the hole wall of the positioning hole 301 is the positioning paste wall 302.

It is understood that at least one first hole glue placing hole 101 is provided at a specific position of the surface layer 10, and at least one second hole glue placing hole 201 is also provided at a specific position of the middle layer 20. When the top sheet 10 is laminated with the middle sheet 20, the first hole paste placing hole 101 at a specific position is aligned with the second hole paste placing hole 201 at a specific position, and then the hole paste 3 is filled into the aligned first hole paste placing hole 101 and second hole paste placing hole 201. Then, the positioning hole 301 is formed in the middle of the hole paste 3 by punching separately. As shown in fig. 1A-1B. Particularly, when the hole adhesive 3 is filled, a reinforcing portion 303 may be formed on the surface of the surface layer 10 or the middle layer 20 by the hole adhesive 3 to reinforce the bonding strength between the hole adhesive 3 and the surface layer 10 or the middle layer 20, as shown in fig. 1C and 1D. In other words, the reinforced portion 303 extends outwards from both ends of the positioning rubber wall 302 to form a flange, and the flange is bonded to the surface of the surface layer 10 or the middle layer 20 to form the reinforced portion 303, so as to further ensure the bonding strength of the positioning device 30 and the surface layer 10 to the middle layer 20.

It should be noted that the middle layer 20 can be disposed according to the required number of layers. In other words, the circuit board multi-layer press-fit positioning heat-buffering cushion 1 is formed by compounding at least one or at least two surface layers 10 and at least one or more middle layers 20. That is, the circuit board multi-layer press-fit positioning heat-buffering cushion 1 can be combined by two surface layers 10 and at least one middle layer 20, wherein the middle layer 20 is disposed between the two surface layers 10. Or, the circuit board multilayer press-fit positioning heat-buffering cushion 1 is formed by laminating and combining the surface layer 10 and at least one middle layer 20. In addition, the surface layer 10 includes a first substrate 11 and a protective layer 12. The protective layer 12 is cured on the first substrate 11 by a spraying process S1 to form the surface layer 10. It should be noted that after the protective layer 12 is cured on the first substrate 11, holes are formed in the surface layer 10 to form the first hole glue placing holes 101. The middle layer 20 includes a second substrate 21 and a rubber film 22. The middle layer 20 is formed by alternately laminating the second base material 21 and the rubber film layer 22 according to product requirements, and the number of layers or the thickness is adjusted according to actual requirements. It should be noted that before the surface layer 10 and the middle layer 20 are combined, the second base material 21 and the rubber film layer 22 of the middle layer 20 are respectively perforated to form the second hole glue placing hole 201.

In addition, as shown in fig. 1A, the structure of the circuit board multilayer press-fit positioning heat-buffering cushion 1 is the protection layer 12, the first substrate 11, the middle layer 20, the first substrate 11, and the protection layer 12, wherein the number of layers or the thickness of the middle layer 20 is adjusted according to actual requirements. Alternatively, as shown in fig. 1B, the heat-resistant elastic cushion 1 may also be formed by combining the surface layer 10 and at least one middle layer 20, that is, combining the protective layer 12, the first substrate 11 and at least one middle layer 20, which is not limited by the disclosure.

The first substrate 11 of the face layer 10 is a plain-woven alkali-free glass fiber cloth with a thickness of 0.18mm, a basis weight of 280 g, a warp density of 44 and a weft density of 32. The second substrate 21 of the middle layer 20 is made of twill alkali-free glass fiber cloth with a thickness of 0.45mm, a basis weight of 500 g, a warp density of 48 and a weft density of 36. The protective layer 12 comprises aqueous polytetrafluoroethylene resin PTFE aqueous system dispersion, a thickening agent, a coupling agent and the following components in parts by weight:

aqueous PTFE dispersion: 100

Thickening agent: 0.15

Coupling agent: 0.08

Water: 10

Further, in the spraying process S1, the protective layer 12 is implemented as an aqueous PTFE dispersion, wherein the curing thickness of the protective layer 12 is 0.02-0.04mm, the curing temperature of the protective layer 12 is 380 degrees, and the curing time is 10-20 minutes.

The second substrate 21 of the middle layer 20 is made of twill glass fiber cloth with a special weaving method, and electronic grade alkali-free glass fiber is adopted. The rubber film layer 22 is formed through a rubber refining process S2. The rubber film layer 22 is made of rubber, reinforcing material, cross-linking agent, heat-resisting material, acid-absorbing agent and processing aid. Wherein the mass portions are as follows:

rubber: 100

Reinforcing material: 15-20

Heat-resistant filler: 15-30

A crosslinking agent: 3-6

Calcium hydroxide: 3-6

Magnesium oxide: 3-6

Processing aid: 2-10.

The rubber refining process S2 includes a rubber compounding process S201, a rubber compound pre-preparation process S202, a rubber compound vulcanizing process S203, and a calendering film-forming process S204.

The rubber compounding process S201 is to cut a certain proportion of rubber, weigh a certain proportion of reinforcing material, cross-linking agent, heat-resisting material, acid-absorbing agent and tackifier into a container with a corresponding name.

The rubber compound prefabricating process S202 is that rubber is put into an internal mixer, the air pressure is 0.6-0.8MPa, after the rubber is dropped, the temperature of the display material rises to 80-90 ℃, heat resistance materials, reinforcing materials and the drop hammer are sequentially put into the internal mixer, the pressure is exerted, after the rubber is powdered, acid absorbing agents and processing aids are put into the internal mixer, when the temperature rises to 110 ℃, the hammer is lifted to clean, and when the temperature rises to 120 ℃, the rubber is unloaded to an open mill to form a rubber sheet. Further, passing through the open mill for three times or more with a roll spacing of 0.5-1mm, passing through thinly, wrapping with a triangular bag for three times or more, passing through again with a roll spacing of 5-10mm, passing through thickly for three times or more, discharging with a thickness of about 5-10mm, and cooling for 24 hours for later use. In other words, the water temperature of the open mill is not more than 30 ℃, the roller temperature is not more than 80 ℃, the roller spacing is 0.5-1mm, the open mill is passed through the rolls for three times or more, the open mill is triangularly wrapped for three times or more, the roller spacing is 5-10mm, the open mill is passed through the rolls for three times or more, the thickness of the produced sheet is about 5-10mm, and the sheet is kept for standby after 24 hours, wherein the sheet is thick.

And the step S203 of vulcanizing the rubber compound, namely putting the mixed rubber into the internal mixer again, heating to 85-90 ℃, adding a cross-linking agent, discharging when the temperature is raised to 95 ℃, passing the mixed rubber in an open mill with a roller moment of 5mm for three times, passing the mixed rubber through a roller distance of 0.5-1mm for three times, passing the mixed rubber through a thin roller for three times or more, and then passing the mixed rubber through the thin roller for three times to obtain a small roll of 1-2 kg. Conveying to a calender.

And the rolling film forming process S204 is to send the film into a rolling machine to roll and form a film, to support and convey the release PE film out, and to wind the film into a coil, wherein the temperature of the upper roller, the middle roller and the lower roller of the rolling machine is set to be 80-90 ℃. The width is 1350 and 1400mm, the thickness is set according to requirements, and the thickness tolerance of the adhesive film is within 0.03 mm.

In the vulcanization process S3, holes are respectively punched in the surface layer 10 and the middle layer 20 according to the needs of customers to form the hole

glue placing holes

101 and 201, then the hole glue 30 is placed into the hole glue, and is introduced into a vulcanizing machine for vulcanization and pressing, and is fully vulcanized twice in an oven, and after cooling, the hole glue 30 is punched by a punching machine to form the positioning holes 301, and finally the circuit board multilayer press-fit positioning heat buffering cushion 1 is formed. The conditions of the vulcanization process S3 are as follows: 160 ℃, the pressure of 30-35 kg/cm 2, the vulcanization pressing time of 25-35Min, the secondary vulcanization temperature of 200 ℃ and the time of 9 hours.

The pore size 30 comprises the following components: methyl vinyl silicone rubber, fumed silica, a peroxide vulcanizing agent, zinc stearate, vinyl methoxysilane, alpha, omega dihydroxy polydimethylsiloxane and cerium oxide.

The pore glue comprises the following components in parts by weight: methyl vinyl silicone rubber: 100, fumed silica: 40, peroxide vulcanizing agent: 4, zinc stearate: 1 vinyl methoxy silane 0.1. α, ω -dihydroxy polydimethylsiloxane: 3. cerium oxide: 0.5.

the rubber refining process S2, the rubber is a fluorine rubber, further a group consisting of a ternary fluorine rubber and a binary fluorine rubber tetrapropylfluoride rubber. The reinforcing agent is selected from the group consisting of carbon black and fumed silica. The heat-resistant material is composed of diatomite and sepiolite powder. The processing aid is selected from the group consisting of palm wax. The acid acceptor is selected from the group consisting of calcium hydroxide and magnesium oxide. The cross-linking agent is a group consisting of BIBP, tripropyl isonitrile ureate, hexafluoro isopropyl diphenol and benzyl triphenyl phosphorus chloride.

The rubber compound comprises the following components in parts by weight: 100 parts of fluororubber, N9908 parts of carbon black, 10 parts of fumed silica, 12 parts of diatomite, 3 parts of calcium hydroxide 6 and magnesium oxide, 1.5 parts of palm wax, 1.5 parts of hexafluoroisopropyl diphenol, benzyl triphenyl chloride and 0.5 part of diphenyl ether.

In addition, the utility model also provides a manufacturing method of the circuit board multilayer pressing positioning heat-buffering cushion pad 1, which comprises the following steps:

(A) forming a surface layer 10 by a spraying process S1;

(B) forming a rubber film layer 22 of a middle layer 20 by a rubber refining process S2;

(C) forming at least one

glue placing hole

101, 201 in the surface layer 10 and the middle layer 20 respectively;

(D) when the surface layer 10 is laminated with a second base material 21 of the middle layer 20 and the rubber film layer 22, placing a hole adhesive 3 in the hole adhesive placing

holes

101, 201 of the surface layer 10 aligned with the middle layer 20;

(E) bonding the surface layer 10 and the middle layer 20 through a vulcanization process S3; and

(F) the circuit board multi-layer press-fit positioning heat-buffering cushion 1 with at least one positioning hole 301 is formed through a cutting and edge-sealing process S4 and a stamping process S5.

In step (a), the protective layer 12 is cured on the first substrate 11 by the spraying process S1.

The protective layer 12 is implemented as an aqueous PTFE dispersion, wherein the protective layer 12 is cured to a thickness of 0.02 to 0.04mm, and the protective layer 12 is cured at a temperature of 380 degrees for a time period of 10 to 20 minutes.

In step (B), the rubber refining process S2 includes a rubber compounding process S201, a rubber compound preparation process S202, a rubber compound vulcanizing process S203, and a rolling film forming process S204.

In the step (D), the pore size 30 is prepared by using the following components: methyl vinyl silicone rubber, fumed silica, a peroxide vulcanizing agent, zinc stearate, vinyl methoxysilane, alpha, omega dihydroxy polydimethylsiloxane and cerium oxide.

in step (E), the vulcanization process S3, the laminated surface layer 10 and middle layer 20 are introduced into a vulcanizing machine 931 for vulcanization pressing, and are fully vulcanized twice through an oven 932. The conditions of the vulcanization process S3 are as follows: 160 ℃, the pressure of 30-35 kg/cm 2, the vulcanization pressing time of 25-35Min, the secondary vulcanization temperature of 200 ℃ and the time of 9 hours.

In step (F), in the punching process S5, the hole paste 3 provided in the hole paste placement holes 101 and 201 is punched to form the positioning hole 301. It can be understood that the stamping process S5 forms at least one positioning device 30 on at least one hole paste 3 of the circuit board multi-layer press-fit positioning heat-insulating cushion 1. Each positioning device 30 comprises a positioning hole 301 and a positioning rubber wall 302. The positioning rubber wall 302 is formed in a surrounding manner, and the positioning hole 301 is located in the middle of the positioning rubber wall 302. In other words, the positioning glue wall 302 is the structure of the hole glue 3 after removing the positioning hole 301.

As shown in FIG. 2, the present invention also provides a manufacturing apparatus for a multi-layer press-fit positioning heat-buffering cushion 1 of a circuit board.

The manufacturing equipment 90 for the circuit board multilayer press-fit positioning heat-buffering cushion 1 comprises a spraying machine 91, a rubber refining unit 92, a vulcanizing unit 93, a cutting edge sealing unit 94 and a punching machine 95.

A face layer 10 is formed by the applicator 91. The rubber refining group 92 includes an internal mixer 921, an open mill 922 and a calender 923, forming a rubber film layer 22 of a middle layer 20. Rubber, a heat-resistant material, a reinforcing material, a drop hammer and pressure are added, after the rubber has powder, an acid-absorbing agent and a processing aid are added into an internal mixer 921 and mixed, the mixture is conveyed to an open mill 922 to form a rubber sheet, and the rubber sheet is conveyed to a calender 923 to form the rubber film layer 22 of the middle layer 20.

The vulcanizer set 93 includes a vulcanizer 931 and an oven 932. The surface layer 10 and the middle layer 20 provided with the hole adhesive 3 are introduced into the vulcanizing machine 931 to be vulcanized and pressed to form a bonding layer 4, and then fully vulcanized twice in the oven 932. The edge banding unit 94 includes a guillotine 941 and an edge banding machine 942, after will sulfurizing the anchor coat 4 passes through the guillotine 941 cut with the edge banding machine 942 carries out the banding and forms at least an imperforate cushion 5. The punch 95 punches on the hole glue 3 of the nonporous buffer pad to make the circuit board multilayer press-fit positioning heat-buffering buffer pad 1 have at least one positioning hole 301.

It will be appreciated by persons skilled in the art that the embodiments of the utility model described above and shown in the drawings are given by way of example only and are not limiting of the utility model.

The objects of the utility model have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. The utility model provides a slow heat blotter of circuit board multilayer pressfitting location which characterized in that includes:

2. A circuit board multi-layer press-fit positioning heat-buffering cushion as claimed in claim 1, wherein each positioning device comprises a positioning hole and a positioning rubber wall, wherein the positioning rubber wall surrounds the first hole rubber placing hole and the second hole rubber placing hole, and the positioning hole is located in the middle of the positioning rubber wall.

3. A multi-layer press-fit positioning heat-buffering cushion for circuit boards as claimed in claim 2, wherein the positioning device comprises two reinforced parts formed on the surface of the protection layer and the rubber film layer, wherein the reinforced parts extend outwards from two ends of the positioning rubber wall to form a flange.

4. A multi-layer press-fit positioning heat-buffering cushion for circuit board as claimed in claim 1, wherein the protection layer is cured on the first substrate by a spraying process.

5. A multi-layer press-fit positioning heat-buffering cushion for circuit board as claimed in claim 1, wherein at least one of the middle layers is disposed between two of the facing layers for multi-layer vulcanization assembly, wherein the protection layers of the facing layers are respectively disposed at the outer sides.

6. A multi-layer press-fit positioning heat-buffering cushion for circuit board as claimed in claim 5, wherein said positioning device includes two reinforced parts formed on the surfaces of said two protection layers, respectively, wherein said reinforced parts extend outwards from two ends of a positioning rubber wall of said positioning device to form a flange, respectively, and said flange is bonded to the surface of said surface layer.

7. A circuit board multilayer pressfitting location slow heat blotter manufacture equipment, its characterized in that includes:

a rubber refining unit, which forms a middle rubber film layer;

8. The apparatus of claim 7, wherein the rubber refining unit comprises an internal mixer, an open mill and a calender, wherein after a rubber film is fed into the internal mixer for refining, the open mill is unloaded to form a rubber film, and the rubber film is formed by the calender.