CN111246682A - Manufacturing method of rigid-flex board of bonding wire bonding pad at bottom of blind groove - Google Patents
Manufacturing method of rigid-flex board of bonding wire bonding pad at bottom of blind groove Download PDFInfo
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- CN111246682A CN111246682A CN202010069834.3A CN202010069834A CN111246682A CN 111246682 A CN111246682 A CN 111246682A CN 202010069834 A CN202010069834 A CN 202010069834A CN 111246682 A CN111246682 A CN 111246682A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a method for manufacturing a soft-hard combined board of a bonding wire bonding pad at the bottom of a blind groove, which comprises the following steps: s1, inner layer manufacturing: pasting an adhesive tape on the inner layer in a reverse mode, quickly pressing in vacuum, baking and pressing; s2, outer layer manufacturing: depth control, uncovering and finishing the manufacture. In the step S1, the rigid-flex board includes a blind groove, and the inner layer is attached with a reverse tape by providing a PI surface and a glue surface, the glue surface faces the blind groove, and the PI surface is connected to a bonding pad with a circuit pattern. The invention solves the feasibility problem of the manufacture of the bonding pad with the bonding wire at the bottom of the opening with the size of less than 5mm by 5mm and below, solves the pollution problem of residual glue stain of the torn adhesive tape and ensures the quality of the manufacture of the bonding pad with the bonding wire at the bottom.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a manufacturing method of a soft-hard combined board of a bonding wire bonding pad at the bottom of a blind groove.
Background
The birth and development of FPC and PCB have promoted a new product of soft and hard combined board. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like. The rigid-flex circuit board has the characteristics of both FPC and PCB, so that the rigid-flex circuit board can be used in products with special requirements, has a certain flexible area and a certain rigid area, and is greatly helpful for saving the internal space of the products, reducing the volume of finished products and improving the performance of the products.
At present, the general manufacturing methods of the products are as follows: firstly, a method for manufacturing a glue-blocking film by adopting a tape to positively paste a protective circuit pattern. And secondly, filling gaps among the lines to resist the glue when the adhesive tape is reversely pasted and the non-adhesive surface of the adhesive tape is pressed. However, the processing method in the prior art still has the defects that: the problem that the lines are polluted by the residual adhesive of the front adhesive tape is solved, the operational problem of tearing the adhesive tape is continuously reduced along with the window, and the problem of PP adhesive permeation between lines of the back adhesive tape is solved.
Disclosure of Invention
In view of this, the present invention provides a rigid-flex board for a wire bonding pad (wire bonding pad) at the bottom of a blind via and a method for manufacturing the same, which solves the feasibility problem of manufacturing a wire bonding pad at the bottom of an opening with a size of less than 5mm by 5mm and below, solves the problem of residual glue stain pollution of a tape, and ensures the quality of manufacturing the wire bonding pad at the bottom.
The technical scheme of the invention is as follows:
a manufacturing method of a rigid-flex board of a bonding wire bonding pad at the bottom of a blind groove is characterized by comprising the following steps:
s1, inner layer manufacturing: pasting an adhesive tape on the inner layer in a reverse mode, quickly pressing in vacuum, baking and pressing;
s2, outer layer manufacturing: depth control, uncovering and finishing the manufacture.
Further, in step S1, the rigid-flex board includes a blind groove, and the inner layer is attached with a reverse tape by providing a PI surface and a glue surface, where the glue surface faces the blind groove, and the PI surface is connected to the bonding pad with the circuit pattern.
Further, in step S1, the method for manufacturing the adhesive tape back glue includes: controlling the temperature at 70-85 ℃; pressure: 0.6-1.0 mpa; the gum equipment of the prior art is adopted.
Furthermore, the adhesive tape back adhesive is manufactured, and the processing speed is adjusted according to the actual production quality requirement.
Further, in step S1, the tape lamination manufacturing parameters are: using vacuum fast pressing equipment, the processing parameters are as follows: vacuumizing time: 15-30S, fast pressing time: 150- "200S", baking time: baking at 200 ℃ for 1.5-2.8h at 160-.
Further, the method also comprises the following manufacturing steps:
A. respectively manufacturing inner layer circuits of a soft board core board and a hard board core board; the soft board core board comprises a soft board area and a soft and hard combination area;
B. aligning and attaching a cover film to a soft board area on a soft board core board;
C. sticking a protective adhesive tape on the covering film;
D. milling blind grooves in a depth-controlled manner on the periphery of the hard plate core plate corresponding to the soft plate area, wherein the bottoms of the blind grooves are used as connecting ribs;
E. pressing the soft board core board and the hard board core board into a production board by using flowable rubber PP, windowing the flowable rubber PP at a position corresponding to the soft board area, and placing one side of the hard board core board with a blind groove at the inner side to be in contact with a flowable rubber PP sheet;
F. sequentially manufacturing an outer layer circuit and a solder mask on a production board, and then carrying out surface treatment;
G. and routing connecting ribs inwards at positions corresponding to the blind grooves on the production board, removing the parts corresponding to the soft board areas on the hard board core board and the protective adhesive tapes after uncovering, and thus obtaining the soft-hard combined board.
Further, in the step C, a reverse adhesive tape is adopted for attaching the protective adhesive tape.
And further, in the step C, the covering film and the soft board core board are completely bonded in a quick pressing mode, and the soft board core board is baked to enable the covering film to be cured.
The innovation points of the invention are as follows:
1. the bonding pad of the bonding wire is protected by reversely pasting the adhesive tape on the window, so that the circuit is prevented from contacting the adhesive layer of the adhesive tape, and the circuit is prevented from being polluted in the manufacturing process.
2. The reverse adhesive tape is removed along with window waste materials in the uncovering operation through the curing adhesive of the PP-side pasted adhesive tape, so that the damage caused in the adhesive tape tearing operation is avoided.
3. The fabrication of design windows with the size of the fabrication window of the dense circuits and the bonding pads at the bottom being smaller than 5mm x 5mm and smaller can be performed.
This difference with prior art of this application technical scheme is that mainly because the protection sticky tape that uses concentrates the advantage of just pasting with the anti-stick for the anti-stick protection sticky tape of special preparation together, eliminates the drawback of two kinds of preparation methods simultaneously, and this preparation method combines the sticky tape just to paste and the technological advantage of anti-stick. The invention solves the problem of manufacturing quality of a bonding pad (wire bonding pad) at the bottom of the blind groove in the manufacturing process of the circuit board, and solves the general limitation that the blind groove can be manufactured and processed in different sizes and specifications.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A manufacturing method of a rigid-flex board of a bonding wire bonding pad at the bottom of a blind groove is characterized by comprising the following steps:
s1, inner layer manufacturing: pasting an adhesive tape on the inner layer in a reverse mode, quickly pressing in vacuum, baking and pressing;
s2, outer layer manufacturing: depth control, uncovering and finishing the manufacture.
Further, in step S1, the rigid-flex board includes a blind groove, and the inner layer is attached with a reverse tape by providing a PI surface and a glue surface, where the glue surface faces the blind groove, and the PI surface is connected to the bonding pad with the circuit pattern.
Further, in step S1, the method for manufacturing the adhesive tape back glue includes: controlling the temperature at 70 ℃; pressure: 0.6 mpa; the gum equipment of the prior art is adopted.
Furthermore, the adhesive tape back adhesive is manufactured, and the processing speed is adjusted according to the actual production quality requirement.
Further, in step S1, the tape lamination manufacturing parameters are: using vacuum fast pressing equipment, the processing parameters are as follows: vacuumizing time: 15S, fast pressing time: 200S, baking time: baking at 160 deg.C for 2.8 h.
Further, the method also comprises the following manufacturing steps:
A. respectively manufacturing inner layer circuits of a soft board core board and a hard board core board; the soft board core board comprises a soft board area and a soft and hard combination area;
B. aligning and attaching a cover film to a soft board area on a soft board core board;
C. sticking a protective adhesive tape on the covering film;
D. milling blind grooves in a depth-controlled manner on the periphery of the hard plate core plate corresponding to the soft plate area, wherein the bottoms of the blind grooves are used as connecting ribs;
E. pressing the soft board core board and the hard board core board into a production board by using flowable rubber PP, windowing the flowable rubber PP at a position corresponding to the soft board area, and placing one side of the hard board core board with a blind groove at the inner side to be in contact with a flowable rubber PP sheet;
F. sequentially manufacturing an outer layer circuit and a solder mask on a production board, and then carrying out surface treatment;
G. and routing connecting ribs inwards at positions corresponding to the blind grooves on the production board, removing the parts corresponding to the soft board areas on the hard board core board and the protective adhesive tapes after uncovering, and thus obtaining the soft-hard combined board.
Further, in the step C, a reverse adhesive tape is adopted for attaching the protective adhesive tape.
And further, in the step C, the covering film and the soft board core board are completely bonded in a quick pressing mode, and the soft board core board is baked to enable the covering film to be cured.
Example 2
A manufacturing method of a rigid-flex board of a bonding wire bonding pad at the bottom of a blind groove is characterized by comprising the following steps:
s1, inner layer manufacturing: pasting an adhesive tape on the inner layer in a reverse mode, quickly pressing in vacuum, baking and pressing;
s2, outer layer manufacturing: depth control, uncovering and finishing the manufacture.
Further, in step S1, the rigid-flex board includes a blind groove, and the inner layer is attached with a reverse tape by providing a PI surface and a glue surface, where the glue surface faces the blind groove, and the PI surface is connected to the bonding pad with the circuit pattern.
Further, in step S1, the method for manufacturing the adhesive tape back glue includes: controlling the temperature at 85 ℃; pressure: 1.0 mpa; the gum equipment of the prior art is adopted.
Furthermore, the adhesive tape back adhesive is manufactured, and the processing speed is adjusted according to the actual production quality requirement.
Further, in step S1, the tape lamination manufacturing parameters are: using vacuum fast pressing equipment, the processing parameters are as follows: vacuumizing time: 30S, fast pressing time: 150S, baking time: baking at 200 deg.C for 1.5 h.
Further, the method also comprises the following manufacturing steps:
A. respectively manufacturing inner layer circuits of a soft board core board and a hard board core board; the soft board core board comprises a soft board area and a soft and hard combination area;
B. aligning and attaching a cover film to a soft board area on a soft board core board;
C. sticking a protective adhesive tape on the covering film;
D. milling blind grooves in a depth-controlled manner on the periphery of the hard plate core plate corresponding to the soft plate area, wherein the bottoms of the blind grooves are used as connecting ribs;
E. pressing the soft board core board and the hard board core board into a production board by using flowable rubber PP, windowing the flowable rubber PP at a position corresponding to the soft board area, and placing one side of the hard board core board with a blind groove at the inner side to be in contact with a flowable rubber PP sheet;
F. sequentially manufacturing an outer layer circuit and a solder mask on a production board, and then carrying out surface treatment;
G. and routing connecting ribs inwards at positions corresponding to the blind grooves on the production board, removing the parts corresponding to the soft board areas on the hard board core board and the protective adhesive tapes after uncovering, and thus obtaining the soft-hard combined board.
Further, in the step C, a reverse adhesive tape is adopted for attaching the protective adhesive tape.
And further, in the step C, the covering film and the soft board core board are completely bonded in a quick pressing mode, and the soft board core board is baked to enable the covering film to be cured.
Example 3
A manufacturing method of a rigid-flex board of a bonding wire bonding pad at the bottom of a blind groove is characterized by comprising the following steps:
s1, inner layer manufacturing: pasting an adhesive tape on the inner layer in a reverse mode, quickly pressing in vacuum, baking and pressing;
s2, outer layer manufacturing: depth control, uncovering and finishing the manufacture.
Further, in step S1, the rigid-flex board includes a blind groove, and the inner layer is attached with a reverse tape by providing a PI surface and a glue surface, where the glue surface faces the blind groove, and the PI surface is connected to the bonding pad with the circuit pattern.
Further, in step S1, the method for manufacturing the adhesive tape back glue includes: controlling the temperature at 80 ℃; pressure: 0.8 mpa; the gum equipment of the prior art is adopted.
Furthermore, the adhesive tape back adhesive is manufactured, and the processing speed is adjusted according to the actual production quality requirement.
Further, in step S1, the tape lamination manufacturing parameters are: using vacuum fast pressing equipment, the processing parameters are as follows: vacuumizing time: 24S, fast pressing time: 170S, baking time: baking at 180 deg.C for 2.3 h.
Further, the method also comprises the following manufacturing steps:
A. respectively manufacturing inner layer circuits of a soft board core board and a hard board core board; the soft board core board comprises a soft board area and a soft and hard combination area;
B. aligning and attaching a cover film to a soft board area on a soft board core board;
C. sticking a protective adhesive tape on the covering film;
D. milling blind grooves in a depth-controlled manner on the periphery of the hard plate core plate corresponding to the soft plate area, wherein the bottoms of the blind grooves are used as connecting ribs;
E. pressing the soft board core board and the hard board core board into a production board by using flowable rubber PP, windowing the flowable rubber PP at a position corresponding to the soft board area, and placing one side of the hard board core board with a blind groove at the inner side to be in contact with a flowable rubber PP sheet;
F. sequentially manufacturing an outer layer circuit and a solder mask on a production board, and then carrying out surface treatment;
G. and routing connecting ribs inwards at positions corresponding to the blind grooves on the production board, removing the parts corresponding to the soft board areas on the hard board core board and the protective adhesive tapes after uncovering, and thus obtaining the soft-hard combined board.
Further, in the step C, a reverse adhesive tape is adopted for attaching the protective adhesive tape.
And further, in the step C, the covering film and the soft board core board are completely bonded in a quick pressing mode, and the soft board core board is baked to enable the covering film to be cured.
Example 4
A manufacturing method of a rigid-flex board of a bonding wire bonding pad at the bottom of a blind groove is characterized by comprising the following steps:
s1, inner layer manufacturing: pasting an adhesive tape on the inner layer in a reverse mode, quickly pressing in vacuum, baking and pressing;
s2, outer layer manufacturing: depth control, uncovering and finishing the manufacture.
Further, in step S1, the rigid-flex board includes a blind groove, and the inner layer is attached with a reverse tape by providing a PI surface and a glue surface, where the glue surface faces the blind groove, and the PI surface is connected to the bonding pad with the circuit pattern.
Further, in step S1, the method for manufacturing the adhesive tape back glue includes: controlling the temperature at 75 ℃; pressure: 0.7 mpa; the gum equipment of the prior art is adopted.
Furthermore, the adhesive tape back adhesive is manufactured, and the processing speed is adjusted according to the actual production quality requirement.
Further, in step S1, the tape lamination manufacturing parameters are: using vacuum fast pressing equipment, the processing parameters are as follows: vacuumizing time: 22S, fast pressing time: 160S, baking time: baking at 170 deg.C for 2 h.
Further, the method also comprises the following manufacturing steps:
A. respectively manufacturing inner layer circuits of a soft board core board and a hard board core board; the soft board core board comprises a soft board area and a soft and hard combination area;
B. aligning and attaching a cover film to a soft board area on a soft board core board;
C. sticking a protective adhesive tape on the covering film;
D. milling blind grooves in a depth-controlled manner on the periphery of the hard plate core plate corresponding to the soft plate area, wherein the bottoms of the blind grooves are used as connecting ribs;
E. pressing the soft board core board and the hard board core board into a production board by using flowable rubber PP, windowing the flowable rubber PP at a position corresponding to the soft board area, and placing one side of the hard board core board with a blind groove at the inner side to be in contact with a flowable rubber PP sheet;
F. sequentially manufacturing an outer layer circuit and a solder mask on a production board, and then carrying out surface treatment;
G. and routing connecting ribs inwards at positions corresponding to the blind grooves on the production board, removing the parts corresponding to the soft board areas on the hard board core board and the protective adhesive tapes after uncovering, and thus obtaining the soft-hard combined board.
Further, in the step C, a reverse adhesive tape is adopted for attaching the protective adhesive tape.
And further, in the step C, the covering film and the soft board core board are completely bonded in a quick pressing mode, and the soft board core board is baked to enable the covering film to be cured.
Comparative example
The comparative example provides a manufacturing method of a rigid-flex board of a bonding wire bonding pad at the bottom of a blind groove in the prior art, and the manufacturing method comprises the following steps:
s1, manufacturing a front adhesive tape:
inner layer adhesive tape pasting: manufacturing a graphic circuit with a window exposed on the inner layer, pressing brown, pasting an adhesive tape (pasting the adhesive tape at the window circuit according to the manufacturing specification) and pressing;
opening the cover on the outer layer: depth control window routing, cover opening, adhesive tape tearing and cleaning;
s2, manufacturing a reverse adhesive tape:
inner layer flow: pp glue preparation, laser manufacture of window position reverse adhesive tape pattern, and pressing.
Outer layer flow: depth control window routing-uncovering-cleaning glue penetration.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (8)
1. A manufacturing method of a rigid-flex board of a bonding wire bonding pad at the bottom of a blind groove is characterized by comprising the following steps:
s1, inner layer manufacturing: pasting an adhesive tape on the inner layer in a reverse mode, quickly pressing in vacuum, baking and pressing;
s2, outer layer manufacturing: depth control, uncovering and finishing the manufacture.
2. The method for manufacturing the rigid-flex board with the wire bonding pad at the bottom of the blind groove according to claim 1, wherein in step S1, the rigid-flex board includes the blind groove, and the inner layer is attached with the reverse adhesive tape by providing the adhesive tape with a PI surface and an adhesive surface, the adhesive surface faces the blind groove, and the PI surface is connected to the wire bonding pad with the circuit pattern.
3. The method for manufacturing the rigid-flex board with the wire bonding pad at the bottom of the blind via according to claim 1, wherein in the step S1, the method for manufacturing the adhesive tape back adhesive comprises: controlling the temperature at 70-85 ℃; pressure: 0.6mpa to 1.0 mpa.
4. The method for manufacturing the rigid-flex board with the bonding pads at the bottoms of the blind grooves according to claim 1, wherein the adhesive tape is coated with an adhesive, and the processing speed is adjusted according to actual production quality requirements.
5. The method for manufacturing the rigid-flex board with the wire bonding pad at the bottom of the blind groove according to claim 1, wherein in the step S1, the tape bonding manufacturing parameters are as follows: using vacuum fast pressing equipment, the processing parameters are as follows: vacuumizing time: 15-30S, fast pressing time: 150- "200S", baking time: baking at 200 ℃ for 1.5-2.8h at 160-.
6. The method for manufacturing the rigid-flex board with the bonding pads at the bottoms of the blind grooves according to claim 1, further comprising the following steps:
A. respectively manufacturing inner layer circuits of a soft board core board and a hard board core board; the soft board core board comprises a soft board area and a soft and hard combination area;
B. aligning and attaching a cover film to a soft board area on a soft board core board;
C. sticking a protective adhesive tape on the covering film;
D. milling blind grooves in a depth-controlled manner on the periphery of the hard plate core plate corresponding to the soft plate area, wherein the bottoms of the blind grooves are used as connecting ribs;
E. pressing the soft board core board and the hard board core board into a production board by using flowable rubber PP, windowing the flowable rubber PP at a position corresponding to the soft board area, and placing one side of the hard board core board with a blind groove at the inner side to be in contact with a flowable rubber PP sheet;
F. sequentially manufacturing an outer layer circuit and a solder mask on a production board, and then carrying out surface treatment;
G. and routing connecting ribs inwards at positions corresponding to the blind grooves on the production board, removing the parts corresponding to the soft board areas on the hard board core board and the protective adhesive tapes after uncovering, and thus obtaining the soft-hard combined board.
7. The method for manufacturing the rigid-flex board with the wire bonding pad at the bottom of the blind groove according to claim 6, wherein in the step C, the protective tape is pasted by a reverse pasting tape.
8. The method for manufacturing the rigid-flex board with the bonding pads at the bottoms of the blind grooves according to claim 7, wherein the step C further comprises completely bonding the cover film and the core board of the flexible printed circuit board in a rapid press fit manner, and baking the core board of the flexible printed circuit board to cure the cover film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010069834.3A CN111246682A (en) | 2020-01-21 | 2020-01-21 | Manufacturing method of rigid-flex board of bonding wire bonding pad at bottom of blind groove |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010069834.3A CN111246682A (en) | 2020-01-21 | 2020-01-21 | Manufacturing method of rigid-flex board of bonding wire bonding pad at bottom of blind groove |
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| CN111246682A true CN111246682A (en) | 2020-06-05 |
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| CN202010069834.3A Pending CN111246682A (en) | 2020-01-21 | 2020-01-21 | Manufacturing method of rigid-flex board of bonding wire bonding pad at bottom of blind groove |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111954394A (en) * | 2020-08-07 | 2020-11-17 | 惠州中京电子科技有限公司 | Manufacturing method of 5G high-speed backboard ladder gold finger |
| CN113690286A (en) * | 2021-08-24 | 2021-11-23 | 京东方科技集团股份有限公司 | Protective film, display module, manufacturing method of display module and display device |
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| JP2011014594A (en) * | 2009-06-30 | 2011-01-20 | Dainippon Printing Co Ltd | Method of manufacturing flexible printed board junction |
| CN108617113A (en) * | 2018-06-13 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of PP adds the method for Protection glue band making Rigid Flex |
| CN108990319A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of stepped plate pressing stack and preparation method thereof |
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2020
- 2020-01-21 CN CN202010069834.3A patent/CN111246682A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011014594A (en) * | 2009-06-30 | 2011-01-20 | Dainippon Printing Co Ltd | Method of manufacturing flexible printed board junction |
| CN108617113A (en) * | 2018-06-13 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A kind of PP adds the method for Protection glue band making Rigid Flex |
| CN108990319A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of stepped plate pressing stack and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111954394A (en) * | 2020-08-07 | 2020-11-17 | 惠州中京电子科技有限公司 | Manufacturing method of 5G high-speed backboard ladder gold finger |
| CN113690286A (en) * | 2021-08-24 | 2021-11-23 | 京东方科技集团股份有限公司 | Protective film, display module, manufacturing method of display module and display device |
| CN113690286B (en) * | 2021-08-24 | 2024-05-07 | 京东方科技集团股份有限公司 | Protective film, display module, manufacturing method of display module and display device |
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Application publication date: 20200605 |