JPWO2013129307A1 - Manufacturing method of resin sheet for sealing - Google Patents
Manufacturing method of resin sheet for sealing Download PDFInfo
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- JPWO2013129307A1 JPWO2013129307A1 JP2014502204A JP2014502204A JPWO2013129307A1 JP WO2013129307 A1 JPWO2013129307 A1 JP WO2013129307A1 JP 2014502204 A JP2014502204 A JP 2014502204A JP 2014502204 A JP2014502204 A JP 2014502204A JP WO2013129307 A1 JPWO2013129307 A1 JP WO2013129307A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
基板上に搭載された複数の電子部品を絶縁封止するための封止用樹脂シートを安価に製造し、封止用樹脂シートへの気泡の混入を抑制する。第１工程にて、半硬化状態の樹脂体２２を、対向する１対の押圧板２３、２５と外周側に設けた側板２４とにより囲まれた空間２６内に配置する。第２工程にて、空間２６内を真空引きし、樹脂体２２を硬化温度より低い温度で加熱し、押圧板２３、２５により０．００４ｍｍ／秒以上０．０６ｍｍ／秒以下の押圧速度で押圧して延ばす。これにより、封止用樹脂シート１１を作製する。A sealing resin sheet for insulating and sealing a plurality of electronic components mounted on the substrate is manufactured at low cost, and mixing of bubbles into the sealing resin sheet is suppressed. In the first step, the semi-cured resin body 22 is disposed in a space 26 surrounded by a pair of opposing pressing plates 23 and 25 and a side plate 24 provided on the outer peripheral side. In the second step, the space 26 is evacuated, the resin body 22 is heated at a temperature lower than the curing temperature, and pressed by the pressing plates 23 and 25 at a pressing speed of 0.004 mm / second to 0.06 mm / second. And extend. Thereby, the resin sheet 11 for sealing is produced.
Description
本発明は、基板上に搭載された複数の電子部品を絶縁封止するために用いられる封止用樹脂シートの製造方法に関する。 The present invention relates to a method for producing a sealing resin sheet used for insulatingly sealing a plurality of electronic components mounted on a substrate.
基板上に複数の電子部品の搭載された電子部品モジュールは、湿気、外部接触等から電子部品を保護するために、基板および電子部品を覆うように封止樹脂層が形成される。この封止樹脂層は、電子部品の搭載された基板上に半硬化状態（Ｂステージ）の封止用樹脂シートを載置し、載置した封止用樹脂シートを加熱および押圧することにより形成される。 In an electronic component module in which a plurality of electronic components are mounted on a substrate, a sealing resin layer is formed so as to cover the substrate and the electronic components in order to protect the electronic components from moisture, external contact, and the like. The sealing resin layer is formed by placing a semi-cured (B stage) sealing resin sheet on a substrate on which electronic components are mounted, and heating and pressing the mounted sealing resin sheet. Is done.
図１０（Ａ）から図１０（Ｃ）は、封止用樹脂シート２０５を用いて電子部品モジュール２００を製造する一般例を示した図である。図１０（Ａ）に示すように、回路基板２０１には回路パターン２０２が形成されており、回路パターン２０２の上には導電性接着剤２０３を介して電子部品２０４が搭載されている。 FIG. 10A to FIG. 10C are diagrams showing a general example of manufacturing the electronic component module 200 using the sealing resin sheet 205. As shown in FIG. 10A, a circuit pattern 202 is formed on the circuit board 201, and an electronic component 204 is mounted on the circuit pattern 202 via a conductive adhesive 203.
図１０（Ｂ）に示すように、電子部品２０４の搭載された回路基板２０１の上方に封止用樹脂シート２０５が配置される。その後、回路基板２０１および封止用樹脂シート２０５を２つの平板２０６で挟み込み、封止用樹脂シート２０５を加熱し押圧する。これにより、電子部品２０４は封止用樹脂シート２０５に埋設され、かつ封止用樹脂シート２０５は加熱により硬化され、封止樹脂層２０９となる。 As shown in FIG. 10B, a sealing resin sheet 205 is disposed above the circuit board 201 on which the electronic component 204 is mounted. Thereafter, the circuit board 201 and the sealing resin sheet 205 are sandwiched between the two flat plates 206, and the sealing resin sheet 205 is heated and pressed. As a result, the electronic component 204 is embedded in the sealing resin sheet 205, and the sealing resin sheet 205 is cured by heating to become the sealing resin layer 209.
図１０（Ｃ）に示すものは、上記の過程により作製された電子部品モジュール２００であり、電子部品２０４および回路基板２０１が、硬化された封止樹脂層２０９にて覆われ封止されている。 FIG. 10C shows an electronic component module 200 manufactured by the above process, in which the electronic component 204 and the circuit board 201 are covered and sealed with a cured sealing resin layer 209. .
ここまでは、電子部品モジュール２００の製造過程の説明である。次に、電子部品モジュール２００の製造過程で用いられる封止用樹脂シート２０５の製造方法について説明する。 Up to here, the manufacturing process of the electronic component module 200 has been described. Next, a manufacturing method of the sealing resin sheet 205 used in the manufacturing process of the electronic component module 200 will be described.
上述した封止用樹脂シート２０５の製造方法が、たとえば特許文献１（特開２００９−２９９３０号公報）に記載されている。特許文献１によれば、図１１に示す塗布装置１０１によって液状の樹脂組成物１０２を支持フィルム１０３の上面に塗布し、離型フィルムローラ１０４から繰り出された離型フィルム１０５を樹脂組成物１０２の上面に重ね、押圧ローラ１０６で樹脂組成物１０２を押圧することにより封止用樹脂シート２０５を製造している。 The manufacturing method of the resin sheet 205 for sealing mentioned above is described in patent document 1 (Unexamined-Japanese-Patent No. 2009-29930), for example. According to Patent Document 1, the liquid resin composition 102 is applied to the upper surface of the support film 103 by the coating apparatus 101 shown in FIG. 11, and the release film 105 fed from the release film roller 104 is applied to the resin composition 102. A resin sheet 205 for sealing is manufactured by overlapping the upper surface and pressing the resin composition 102 with the pressing roller 106.
しかしながら、特許文献１に記載されている封止用樹脂シート２０５の製造方法では、塗布装置１０１、離型フィルムローラ１０４、押圧ローラ１０６等の高価な設備が必要となるため封止用樹脂シート２０５の製造コストが高くなるという問題がある。 However, since the manufacturing method of the sealing resin sheet 205 described in Patent Document 1 requires expensive equipment such as the coating device 101, the release film roller 104, and the pressing roller 106, the sealing resin sheet 205 is used. There is a problem that the manufacturing cost of the is high.
また、特許文献１に記載のように支持フィルム１０３の上面に液状の樹脂組成物１０２を塗布する方法では、液状の樹脂組成物１０２が濡れ広がるため、厚みの大きい封止用樹脂シート２０５を製造することが困難である。 Further, in the method of applying the liquid resin composition 102 on the upper surface of the support film 103 as described in Patent Document 1, the liquid resin composition 102 is wet and spreads, and thus a thick sealing resin sheet 205 is manufactured. Difficult to do.
更に、特許文献１に記載のように支持フィルム１０３の上面に液状の樹脂組成物１０２を塗布して離型フィルム１０５を重ねる製造方法では、塗布時に樹脂組成物１０２の内部に気泡を巻き込み、その気泡を支持フィルム１０３と離型フィルム１０５の間に閉じ込めてしまうことがある。耐湿性、外部遮断性という観点から、電子部品モジュール２００の封止樹脂層２０９には気泡は混入していない方が望ましい。そのためには、電子部品モジュール２００の製造過程で用いられる封止用樹脂シート２０５にも気泡の混入は少ない方が望ましいが、特許文献１に記載の製造方法では、樹脂組成物１０２の内部に気泡が残留してしまうことがある。 Furthermore, in the manufacturing method in which the liquid resin composition 102 is applied to the upper surface of the support film 103 and the release film 105 is stacked as described in Patent Document 1, bubbles are entrained inside the resin composition 102 during application, Air bubbles may be trapped between the support film 103 and the release film 105. From the viewpoint of moisture resistance and external blocking properties, it is desirable that no bubbles be mixed into the sealing resin layer 209 of the electronic component module 200. For this purpose, it is desirable that the encapsulating resin sheet 205 used in the manufacturing process of the electronic component module 200 contain less air bubbles. However, in the manufacturing method described in Patent Document 1, the resin composition 102 has air bubbles inside. May remain.
本発明が解決しようとする課題は、上述した封止用樹脂シートの製造方法に関する問題を低減することである。 The problem to be solved by the present invention is to reduce the problems relating to the above-described method for producing a sealing resin sheet.
本発明は、基板上に搭載された複数の電子部品を絶縁封止するための封止用樹脂シートの製造方法であって、封止用樹脂シートの材料となる半硬化状態の樹脂体が、対向する１対の押圧板と押圧板の外周側に設けられた側板とにより囲まれた空間内に配置される樹脂体配置工程と、囲まれた空間内が真空引きされるとともに、樹脂体が樹脂体の硬化温度より低い温度で加熱され、かつ、樹脂体が押圧板により０．００４ｍｍ／秒以上０．０６ｍｍ／秒以下の押圧速度で押圧されて延ばされる延ばし工程と、を有する。 The present invention is a method for producing a sealing resin sheet for insulatingly sealing a plurality of electronic components mounted on a substrate, and a semi-cured resin body that is a material for the sealing resin sheet comprises: A resin body arranging step disposed in a space surrounded by a pair of opposing pressing plates and a side plate provided on the outer peripheral side of the pressing plate, and the enclosed space is evacuated and the resin body is And an extending step in which the resin body is heated at a temperature lower than the curing temperature of the resin body and is extended by being pressed by the pressing plate at a pressing speed of 0.004 mm / second or more and 0.06 mm / second or less.
樹脂体配置工程では、樹脂体と押圧板の間に離型処理の施された保護フィルムが挿入され、延ばし工程では、樹脂体が押圧されて保護フィルム上に延ばされるのが好ましい。 In the resin body arranging step, it is preferable that a protective film subjected to a release treatment is inserted between the resin body and the pressing plate, and in the extending step, the resin body is pressed and extended on the protective film.
あるいは、押圧板には、離型処理が施されており、延ばし工程では、樹脂体が押圧されて押圧板の面方向に延ばされるのが好ましい。 Alternatively, the pressing plate is subjected to a release treatment, and in the extending step, the resin body is preferably pressed and extended in the surface direction of the pressing plate.
本発明によれば、高価な設備を必要とせず、膜厚の大きい封止用樹脂シートを安価に製造できる。また、封止用樹脂シートの内部の気泡の残留を抑制できる。 ADVANTAGE OF THE INVENTION According to this invention, an expensive installation is not required and the resin sheet for sealing with a big film thickness can be manufactured cheaply. Moreover, the bubble remaining inside the sealing resin sheet can be suppressed.
［第１実施形態］
基板上に複数の電子部品が搭載された電子部品モジュールには、電子部品を絶縁封止するために封止用樹脂シートが用いられる。図１に示すように、封止用樹脂シート１１は平板形状をしており、厚みは０．１ｍｍ〜３．５ｍｍである。封止用樹脂シート１１の材料は絶縁樹脂（たとえばエポキシ樹脂）であり、機械的強度を高めるために、絶縁樹脂には、フィラーとしてたとえばシリカ又はアルミナが含有される。[First Embodiment]
In an electronic component module in which a plurality of electronic components are mounted on a substrate, a sealing resin sheet is used for insulating and sealing the electronic components. As shown in FIG. 1, the sealing resin sheet 11 has a flat plate shape and a thickness of 0.1 mm to 3.5 mm. The material of the sealing resin sheet 11 is an insulating resin (for example, epoxy resin), and the insulating resin contains, for example, silica or alumina as a filler in order to increase mechanical strength.
封止用樹脂シート１１の両主面には、封止用樹脂シート１１の表面を保護するために保護フィルム１２が取り付けられる。保護フィルム１２の材料は、たとえばＰＥＴ（ポリエチレンテレフタラート）、ＰＴＦＥ（ポリテトラフルオロエチレン）等である。保護フィルム１２の表面には、シリコーン樹脂等による離型処理が施されており、封止用樹脂シート１１を電子部品モジュールの製造過程で用いる場合は、保護フィルム１２を剥離して用いる。 A protective film 12 is attached to both main surfaces of the sealing resin sheet 11 in order to protect the surface of the sealing resin sheet 11. The material of the protective film 12 is, for example, PET (polyethylene terephthalate), PTFE (polytetrafluoroethylene), or the like. The surface of the protective film 12 is subjected to a release treatment with a silicone resin or the like. When the sealing resin sheet 11 is used in the manufacturing process of the electronic component module, the protective film 12 is peeled off.
図２（Ａ）から図２（Ｅ）および図３を参照して、封止用樹脂シート１１の製造方法について説明する。 With reference to FIG. 2 (A) to FIG. 2 (E) and FIG. 3, the manufacturing method of the resin sheet 11 for sealing is demonstrated.
図２（Ａ）に示すように、底を有する円筒形の金型２０を準備し、液状樹脂２１を金型２０に入れ、熱処理で半硬化状態にして樹脂体２２を作製する。 As shown in FIG. 2A, a cylindrical mold 20 having a bottom is prepared, and a liquid resin 21 is placed in the mold 20 and is semi-cured by heat treatment to produce a resin body 22.
樹脂体２２は、フィラーを含有した絶縁樹脂であり、封止用樹脂シート１１の材料となるものである。半硬化状態とは、硬化反応の中間段階の状態を指し、Ｂステージとも呼ばれる。液状樹脂２１を半硬化状態にするためには、エポキシ樹脂の場合は、４０℃〜１６０℃の温度により５分〜１２０分間、オーブンで加熱処理する。 The resin body 22 is an insulating resin containing a filler and is a material of the sealing resin sheet 11. The semi-cured state refers to a state at an intermediate stage of the curing reaction and is also called a B stage. In order to make the liquid resin 21 into a semi-cured state, in the case of an epoxy resin, it is heat-treated in an oven at a temperature of 40 ° C. to 160 ° C. for 5 minutes to 120 minutes.
樹脂体２２は、温度６０℃で１２０Ｐａ・ｓ〜１８００Ｐａ・ｓの粘度のものを使うことができる。このときの粘度はＴＡ Ｉｎｓｔｒｕｍｅｎｔｓ社製、ＡＲ５５０を用いて、ツールサイズφ８ｍｍ、測定厚み５５０μｍ、周波数１Ｈｚ、歪み０．１％の条件で測定した値である。 As the resin body 22, a resin body having a viscosity of 120 Pa · s to 1800 Pa · s at a temperature of 60 ° C. can be used. The viscosity at this time is a value measured by using TA550 manufactured by TA Instruments under the conditions of tool size φ8 mm, measurement thickness 550 μm, frequency 1 Hz, and strain 0.1%.
図２（Ｂ）に示すように、封止用樹脂シート１１を成形するための下側の押圧板２３を準備し、押圧板２３の主面の外周側に側板２４を配置する。側板２４は枠体であってもよいし、複数の板材をループを描くように配置してもよい。同時に、押圧板２３の主面であって、側板２４で囲まれた領域内に保護フィルム１２を配置し、更に図２（Ａ）の工程で作製された樹脂体２２を保護フィルム１２上の中央に配置する。 As shown in FIG. 2B, a lower pressing plate 23 for molding the sealing resin sheet 11 is prepared, and the side plate 24 is disposed on the outer peripheral side of the main surface of the pressing plate 23. The side plate 24 may be a frame, or a plurality of plate materials may be arranged so as to draw a loop. At the same time, the protective film 12 is disposed in the main surface of the pressing plate 23 and surrounded by the side plate 24, and the resin body 22 produced in the process of FIG. To place.
押圧板２３、側板２４は、押圧しても形状を維持することのできる材質であればよく、たとえばステンレス鋼やアルミニウムが用いられる。側板２４は、成形される封止用樹脂シート１１の厚みを決めるための部材であり、保護フィルム１２の厚みも考慮して設定される。保護フィルム１２の厚みが０．０５ｍｍの場合、側板２４の厚みは、０．２ｍｍ〜３．６ｍｍの範囲のものが採用される。 The pressing plate 23 and the side plate 24 may be made of any material that can maintain the shape even when pressed, and for example, stainless steel or aluminum is used. The side plate 24 is a member for determining the thickness of the sealing resin sheet 11 to be molded, and is set in consideration of the thickness of the protective film 12. When the thickness of the protective film 12 is 0.05 mm, the thickness of the side plate 24 is in the range of 0.2 mm to 3.6 mm.
図２（Ｃ）に示すように、樹脂体２２の上方に、図２（Ｂ）の工程で配置された保護フィルム１２および押圧板２３と対向するように、別の保護フィルム１２および上側の押圧板２５を順に配置する。これにより、対向する１対の押圧板２３、２５と側方に設けられた側板２４とにより囲まれた空間２６に、樹脂体２２が配置された状態となる。 As shown in FIG. 2 (C), another protective film 12 and the upper pressing are provided above the resin body 22 so as to face the protective film 12 and the pressing plate 23 arranged in the step of FIG. 2 (B). The plates 25 are arranged in order. As a result, the resin body 22 is disposed in a space 26 surrounded by the pair of opposing pressing plates 23 and 25 and the side plate 24 provided on the side.
ここで、封止用樹脂シート１１の製造工程で用いる押圧装置について説明する。図３は、図２（Ｃ）で示した工程における押圧装置３０の概略図である。図３に示すとおり、樹脂体２２および保護フィルム１２が、１対の押圧板２３、２５と側方に設けられた側板２４とにより囲まれた空間２６内に配置される。この状態で、押圧装置３０により空間２６内が減圧され、樹脂体２２が加熱、押圧される。 Here, the pressing device used in the manufacturing process of the sealing resin sheet 11 will be described. FIG. 3 is a schematic view of the pressing device 30 in the step shown in FIG. As shown in FIG. 3, the resin body 22 and the protective film 12 are arranged in a space 26 surrounded by a pair of pressing plates 23 and 25 and a side plate 24 provided on the side. In this state, the pressure in the space 26 is reduced by the pressing device 30, and the resin body 22 is heated and pressed.
押圧板２５の上側には加圧板３２が設置され、押圧板２３の下側には受圧板３１が設置される。加圧板３２および受圧板３１のそれぞれにはヒータ３３が内蔵される。このヒータ３３により、押圧板２３、２５を介して樹脂体２２が加熱される。 A pressure plate 32 is installed on the upper side of the pressing plate 25, and a pressure receiving plate 31 is installed on the lower side of the pressing plate 23. A heater 33 is built in each of the pressure plate 32 and the pressure plate 31. The resin body 22 is heated by the heater 33 through the pressing plates 23 and 25.
また、加圧板３２および受圧板３１を取り囲むように真空機構３８が設けられる。真空機構３８は、図示しない真空源により真空引きされる。側板２４には水平方向に図示しない貫通穴があいており、この貫通穴を通じて空間２６内も真空引きされ減圧状態となる。 A vacuum mechanism 38 is provided so as to surround the pressure plate 32 and the pressure receiving plate 31. The vacuum mechanism 38 is evacuated by a vacuum source (not shown). The side plate 24 has a through hole (not shown) in the horizontal direction, and the space 26 is also evacuated through the through hole to be in a reduced pressure state.
加圧板３２の上側には、加圧サーボ機構３４の駆動軸が接続される。加圧サーボ機構３４の駆動軸が下降することにより、加圧板３２および押圧板２５が押され、結果的に樹脂体２２が押圧される。なお、加圧サーボ機構３４は天板３６の中央に設置され、天板３６は下方のベース３５に立てられた支柱３７に固定されている。 A drive shaft of a pressure servo mechanism 34 is connected to the upper side of the pressure plate 32. When the drive shaft of the pressurizing servo mechanism 34 is lowered, the pressurizing plate 32 and the pressing plate 25 are pressed, and as a result, the resin body 22 is pressed. The pressurizing servo mechanism 34 is installed in the center of the top plate 36, and the top plate 36 is fixed to a support column 37 that stands on the lower base 35.
ここで再び図２を参照して、封止用樹脂シート１１の製造方法について説明する。上述した押圧装置３０を用いて、図２（Ｄ）に示すように、１対の押圧板２３、２５を互いに近づける方向に移動させる。これにより、押圧板２３、２５の間にある樹脂体２２が保護フィルム１２の面方向に沿って延ばされ、封止用樹脂シート１１が成形される。 Here, with reference to FIG. 2 again, the manufacturing method of the resin sheet 11 for sealing is demonstrated. Using the pressing device 30 described above, as shown in FIG. 2D, the pair of pressing plates 23 and 25 are moved in a direction to approach each other. Thereby, the resin body 22 between the press plates 23 and 25 is extended along the surface direction of the protective film 12, and the sealing resin sheet 11 is shape | molded.
樹脂体２２が延ばされる際の加熱温度は、樹脂体２２の硬化温度より低い温度（たとえば４０℃〜１６０℃）である。１対の押圧板２３、２５と側板２４とにより囲まれた空間２６内の減圧による圧力は、５０００Ｐａ以下である。押圧板２３、２５による押圧速度は、０．００４ｍｍ／秒以上０．０６ｍｍ／秒以下である。押圧速度をこの範囲に設定した理由については、後述する。 The heating temperature when the resin body 22 is extended is lower than the curing temperature of the resin body 22 (for example, 40 ° C. to 160 ° C.). The pressure due to the reduced pressure in the space 26 surrounded by the pair of pressing plates 23 and 25 and the side plate 24 is 5000 Pa or less. The pressing speed by the pressing plates 23 and 25 is 0.004 mm / second or more and 0.06 mm / second or less. The reason why the pressing speed is set within this range will be described later.
図２（Ｄ）で示した工程にて樹脂体２２が延ばされることにより、底面積７０６．５ｍｍ2〜１９６２．５ｍｍ2、高さ５ｍｍ〜３０ｍｍであった樹脂体２２が、面積１６９００ｍｍ2、厚み０．１ｍｍ〜３．５ｍｍの封止用樹脂シート１１に成形される。第１実施形態は、好ましくはこの範囲において適用される。By extending the resin body 22 in the process shown in FIG. 2D, the resin body 22 having a bottom area of 706.5 mm 2 to 1962.5 mm 2 and a height of 5 mm to 30 mm has an area of 16900 mm 2 and a thickness. It is formed into a sealing resin sheet 11 of 0.1 mm to 3.5 mm. The first embodiment is preferably applied in this range.
図２（Ｄ）で示した工程の後、押圧板２３、２５による押圧力が解除されるとともに押圧板２３、２５および側板２４で囲まれた空間２６が大気開放される。これにより、図２（Ｅ）に示すような、両面に保護フィルム１２のついた封止用樹脂シート１１が作製される。 After the step shown in FIG. 2D, the pressing force by the pressing plates 23 and 25 is released, and the space 26 surrounded by the pressing plates 23 and 25 and the side plate 24 is opened to the atmosphere. As a result, a sealing resin sheet 11 having protective films 12 on both sides as shown in FIG.
図２（Ｄ）の工程において、樹脂体２２は加熱されながら延ばされるが、その加熱温度は樹脂体２２の硬化温度より低い温度であり、成形された封止用樹脂シート１１も半硬化状態のままである。したがって、封止用樹脂シート１１を使用する電子部品モジュール２００の製造過程（図１０参照）において、電子部品を封止用樹脂シート１１に埋設させながら封止することができる。 In the step of FIG. 2D, the resin body 22 is extended while being heated, but the heating temperature is lower than the curing temperature of the resin body 22, and the molded sealing resin sheet 11 is also in a semi-cured state. It remains. Therefore, in the manufacturing process of the electronic component module 200 using the sealing resin sheet 11 (see FIG. 10), the electronic component can be sealed while being embedded in the sealing resin sheet 11.
樹脂体２２は多少なりとも気泡を巻き込みながら延ばされるが、その際に空間２６内は真空引きされているので、巻き込まれた気泡に対し外向きに飛び出す力を作用させ、効果的に気泡を除去することができる。 The resin body 22 is extended while enclosing air bubbles to some extent, but since the space 26 is evacuated at that time, the force that pops outward is applied to the entrained air bubbles to effectively remove the air bubbles. can do.
樹脂体２２が延ばされる際の押圧板２３、２５による押圧速度は、０．００４ｍｍ／秒以上０．０６ｍｍ／秒以下である。この押圧速度は、加圧サーボ機構３４により正確に設定される。押圧速度をこの範囲に設定することにより、封止用樹脂シート１１に残留する気泡を低減することができる。 The pressing speed by the pressing plates 23 and 25 when the resin body 22 is extended is 0.004 mm / second or more and 0.06 mm / second or less. This pressing speed is accurately set by the pressurizing servo mechanism 34. By setting the pressing speed within this range, bubbles remaining in the sealing resin sheet 11 can be reduced.
図４は、樹脂体２２に対する押圧板２３、２５の相対的な押圧速度と封止用樹脂シート１１で確認される気泡数の関係を示した図である。封止用樹脂シート１１は概ね上述した製造方法により作製される。気泡は、作製後の封止用樹脂シート１１を加熱減圧環境下（たとえば温度１００℃、圧力２００Ｐａ）におき、気泡を顕在化することにより測定した。気泡数は、封止用樹脂シート１１の１００ｍｍ2中に存在する直径０．１ｍｍ以上の大きさの気泡数である。サンプル数はｎ＝１０である。図４に示すように、押圧速度が０．０９ｍｍ／秒以上の場合は気泡数が平均して４個以上あるのに対し、押圧速度が０．０６ｍｍ／秒以下の場合は気泡数が安定して少なくなる。FIG. 4 is a diagram showing the relationship between the relative pressing speed of the pressing plates 23 and 25 against the resin body 22 and the number of bubbles confirmed on the sealing resin sheet 11. The sealing resin sheet 11 is generally manufactured by the manufacturing method described above. Bubbles were measured by placing the encapsulating resin sheet 11 in a heated and reduced pressure environment (for example, a temperature of 100 ° C. and a pressure of 200 Pa) and revealing the bubbles. The number of bubbles is the number of bubbles having a diameter of 0.1 mm or more present in 100 mm 2 of the sealing resin sheet 11. The number of samples is n = 10. As shown in FIG. 4, when the pressing speed is 0.09 mm / second or more, the average number of bubbles is 4 or more, whereas when the pressing speed is 0.06 mm / second or less, the number of bubbles is stable. Less.
図５（Ａ）から図５（Ｅ）は、押圧速度を変えた場合の封止用樹脂シート１１の表面を示した写真である。それぞれの写真の面積は１００００ｍｍ2である。写真は、作製後の封止用樹脂シート１１を加熱減圧環境下（たとえば温度１００℃、圧力２００Ｐａ）におき、気泡を顕在化させた図である。押圧速度が０．４５ｍｍ／秒、０．２２５ｍｍ／秒の場合は、表面に多くの気泡を視認できるが、押圧速度が０．０６ｍｍ／秒、０．００９ｍｍ／秒、０．０００４ｍｍ／秒の場合は、気泡数が低減している。5 (A) to 5 (E) are photographs showing the surface of the sealing resin sheet 11 when the pressing speed is changed. The area of each photograph is 10,000 mm 2 . The photograph is a diagram in which the encapsulating resin sheet 11 is placed in a heated and reduced pressure environment (for example, a temperature of 100 ° C. and a pressure of 200 Pa) to make bubbles appear. When the pressing speed is 0.45 mm / sec, 0.225 mm / sec, many bubbles can be visually recognized on the surface, but when the pressing speed is 0.06 mm / sec, 0.009 mm / sec, 0.0004 mm / sec The number of bubbles is reduced.
これらより、押圧板２３、２５による押圧速度を０．００４ｍｍ／秒以上０．０６ｍｍ／秒以下の範囲内に設定すれば、封止用樹脂シート１１に残留する気泡数を低減できることがわかる。なお、押圧速度の下限値である０．００４ｍｍ／秒は、加圧サーボ機構３４が安定して押圧力を出力することのできる押圧速度として設定している。 From these, it can be seen that the number of bubbles remaining in the sealing resin sheet 11 can be reduced by setting the pressing speed by the pressing plates 23 and 25 within the range of 0.004 mm / second or more and 0.06 mm / second or less. The lower limit value of the pressing speed of 0.004 mm / second is set as a pressing speed at which the pressurizing servo mechanism 34 can stably output the pressing force.
図６を参照して、樹脂体２２が延ばされる際の樹脂体２２の外周付近の様子を説明する。図６（Ａ）は押圧速度が０．４５ｍｍ／秒の場合を示した図であり、図６（Ｂ）は押圧速度が０．０６ｍｍ／秒の場合を示した図である。 With reference to FIG. 6, a state near the outer periphery of the resin body 22 when the resin body 22 is extended will be described. 6A is a diagram showing a case where the pressing speed is 0.45 mm / second, and FIG. 6B is a diagram showing a case where the pressing speed is 0.06 mm / second.
図６（Ａ）および図６（Ｂ）に示すように、樹脂体２２が矢印ｅ方向に延ばされる際に、保護フィルム１２の界面付近にある樹脂体２２の内部に渦ｗが発生する。図６（Ａ）は、押圧速度が大きいため、樹脂体２２の外周ではなく少し内寄りにて渦ｗが発生する。そのため、樹脂体２２の外周付近における気体が渦ｗに巻き込まれて気泡ｂとなり、気泡ｂが樹脂体２２の内部に残留する。それに対し、図６（Ｂ）では、押圧速度が小さいため、樹脂体２２の外周にて渦ｗが発生する。そのため、樹脂体２２の外周付近にて巻き込まれた気泡ｂは、樹脂体２２の矢印ｅ方向への広がりとそれに伴う渦ｗの移動により、樹脂体２２の外周先端へ誘導される。外周先端へ誘導された気泡ｂは、真空機構３８（図３参照）の真空引きにより外部へ排出される力が働き、樹脂体２２の内部での気泡ｂの残留が抑制される。 As shown in FIGS. 6A and 6B, when the resin body 22 is extended in the direction of arrow e, a vortex w is generated inside the resin body 22 near the interface of the protective film 12. In FIG. 6A, since the pressing speed is high, the vortex w is generated slightly inward rather than on the outer periphery of the resin body 22. Therefore, the gas in the vicinity of the outer periphery of the resin body 22 is entrained in the vortex w and becomes a bubble b, and the bubble b remains inside the resin body 22. On the other hand, in FIG. 6B, since the pressing speed is low, a vortex w is generated on the outer periphery of the resin body 22. For this reason, the bubbles b entrained near the outer periphery of the resin body 22 are guided to the front end of the outer periphery of the resin body 22 by the spread of the resin body 22 in the direction of arrow e and the movement of the vortex w associated therewith. The bubble b guided to the outer peripheral tip is subjected to a force discharged to the outside by evacuation of the vacuum mechanism 38 (see FIG. 3), and the remaining of the bubble b inside the resin body 22 is suppressed.
また、第１実施形態で用いられる保護フィルム１２の表面には離型処理が施されている。離型処理を施すことにより保護フィルム１２の表面の摩擦力を低減する効果があるので、樹脂体２２が延ばされる際の滑りが良くなり、気泡ｂの巻き込みを低減することができる。さらに、保護フィルム１２は封止用樹脂シート１１の製造毎に交換され得るので、離型処理の劣化を考慮する必要がなく、樹脂体２２が延ばされる際の滑り状態は良好に再現される。 Further, the surface of the protective film 12 used in the first embodiment is subjected to a mold release process. Since the effect of reducing the frictional force on the surface of the protective film 12 is obtained by performing the mold release treatment, slipping when the resin body 22 is extended is improved, and entrainment of the bubbles b can be reduced. Furthermore, since the protective film 12 can be replaced every time the sealing resin sheet 11 is manufactured, it is not necessary to consider the deterioration of the mold release process, and the sliding state when the resin body 22 is extended is well reproduced.
また、第１実施形態によれば、押圧装置３０および所定の金型２０を準備すればよいので、高価な設備を使用せずに封止用樹脂シート１１を製造することができる。また、押圧装置３０を使えば側板２４の設定により比較的膜厚の大きい封止用樹脂シート１１を製造することができる。 Moreover, according to 1st Embodiment, since the press apparatus 30 and the predetermined metal mold | die 20 should just be prepared, the resin sheet 11 for sealing can be manufactured, without using an expensive installation. Further, if the pressing device 30 is used, the sealing resin sheet 11 having a relatively large film thickness can be manufactured by setting the side plate 24.
製造された封止用樹脂シート１１の樹脂粘度は、温度６０℃で１２０Ｐａ・ｓ〜１８００Ｐａ・ｓであることが好ましい。このときの粘度は、ＴＡ Ｉｎｓｔｒｕｍｅｎｔｓ社製ＡＲ５５０を用いてツールサイズφ８ｍｍ、測定厚み５５０μｍ、周波数１Ｈｚ、歪み０．１％の条件で測定した値である。封止用樹脂シート１１の厚みは、封止用樹脂シート１１の両主面に保護フィルム１２をつけた状態で、その上から反射型のレーザ変位計で測定した値である。図７は封止用樹脂シート１１の樹脂粘度と厚みばらつきの関係を示した図であるが、封止用樹脂シート１１の樹脂粘度が１２０Ｐａ・ｓ〜１８００Ｐａ・ｓのときは封止用樹脂シート１１の厚みばらつきが１０μｍ以下であるのに対し、１００Ｐａ・ｓのときは厚みばらつきが１５μｍ以上あり、６０００Ｐａ・ｓのときの厚みばらつきは２０μｍ以上もある。なお、封止用樹脂シート１１の厚みばらつきは３σの数値であり、サンプル数は、ｎ＝２０である。 The resin viscosity of the produced sealing resin sheet 11 is preferably 120 Pa · s to 1800 Pa · s at a temperature of 60 ° C. The viscosity at this time is a value measured under the conditions of a tool size of φ8 mm, a measurement thickness of 550 μm, a frequency of 1 Hz, and a strain of 0.1% using an AR550 manufactured by TA Instruments. The thickness of the sealing resin sheet 11 is a value measured with a reflective laser displacement meter from above with the protective films 12 attached to both main surfaces of the sealing resin sheet 11. FIG. 7 is a view showing the relationship between the resin viscosity of the sealing resin sheet 11 and the thickness variation. When the resin viscosity of the sealing resin sheet 11 is 120 Pa · s to 1800 Pa · s, the sealing resin sheet is used. The thickness variation at 11 is 10 μm or less, whereas the thickness variation at 100 Pa · s is 15 μm or more, and the thickness variation at 6000 Pa · s is 20 μm or more. The thickness variation of the sealing resin sheet 11 is a numerical value of 3σ, and the number of samples is n = 20.
また、図８は封止用樹脂シート１１の温度と粘度の関係の一例を示した図である。図８に示すように、温度が高くなると粘度は下がる傾向にあり、温度６０℃のときに粘度１８００Ｐａ・ｓであったものが、温度１２０℃のときには粘度２０Ｐａ・ｓとなる。したがって、温度を上げて樹脂の粘度をたとえば２０Ｐａ・ｓまで下げ、封止用樹脂シート１１が硬化する前に流動化させることにより、図１０（Ｃ）に示すように、電子部品と基板の間まで樹脂材料を充填することができる。 FIG. 8 is a view showing an example of the relationship between the temperature and the viscosity of the sealing resin sheet 11. As shown in FIG. 8, the viscosity tends to decrease as the temperature increases, and the viscosity is 1800 Pa · s when the temperature is 60 ° C., but becomes 20 Pa · s when the temperature is 120 ° C. Therefore, by raising the temperature and lowering the viscosity of the resin to, for example, 20 Pa · s and fluidizing before the sealing resin sheet 11 is cured, as shown in FIG. The resin material can be filled up to.
［第２実施形態］
図９（Ａ）から図９（Ｅ）を参照して、第２実施形態にかかる封止用樹脂シート１１の製造方法について説明する。第２実施形態は、保護フィルム１２（図２参照）を用いずに押圧板２３、２５の間に直接、封止用樹脂シート１１を製造する方法である。なお、第１実施形態と共通する構成、製造条件については詳しい説明を省略する。また、押圧過程で用いる押圧装置３０は、第１実施形態と同じであり説明を省略する。[Second Embodiment]
With reference to Drawing 9 (A) to Drawing 9 (E), the manufacturing method of resin sheet 11 for closure concerning a 2nd embodiment is explained. 2nd Embodiment is the method of manufacturing the resin sheet 11 for sealing directly between the press plates 23 and 25, without using the protective film 12 (refer FIG. 2). Detailed description of the configuration and manufacturing conditions common to the first embodiment will be omitted. Further, the pressing device 30 used in the pressing process is the same as that in the first embodiment, and a description thereof will be omitted.
図９（Ａ）に示すように、底を有する円筒形の金型２０を準備し、液状樹脂２１を金型２０に入れ、熱処理で半硬化状態にして樹脂体２２を作製する。 As shown in FIG. 9A, a cylindrical mold 20 having a bottom is prepared, a liquid resin 21 is placed in the mold 20, and a resin body 22 is produced in a semi-cured state by heat treatment.
図９（Ｂ）に示すように、封止用樹脂シート１１を成形するための下側の押圧板２３を準備し、押圧板２３の主面の外周側に側板２４を配置する。同時に、押圧板２３の主面であって、側板２４で囲まれた領域内の中央に、図９（Ａ）の工程で作製された樹脂体２２を配置する。側板２４は、成形される封止用樹脂シート１１の厚みを決めるための部材である。ただし第２実施形態においては、保護フィルム１２を使用しないので、保護フィルム１２の厚みを考慮する必要はない。また、樹脂体２２と当接する押圧板２３の面にはシリコーン樹脂等による離型処理が施されている。 As shown in FIG. 9B, a lower pressing plate 23 for forming the sealing resin sheet 11 is prepared, and the side plate 24 is arranged on the outer peripheral side of the main surface of the pressing plate 23. At the same time, the resin body 22 produced in the step of FIG. 9A is arranged at the center of the main surface of the pressing plate 23 and surrounded by the side plate 24. The side plate 24 is a member for determining the thickness of the sealing resin sheet 11 to be molded. However, in 2nd Embodiment, since the protective film 12 is not used, it is not necessary to consider the thickness of the protective film 12. In addition, the surface of the pressing plate 23 that comes into contact with the resin body 22 is subjected to a release treatment with a silicone resin or the like.
図９（Ｃ）に示すように、樹脂体２２の上方に、図９（Ｂ）で配置された押圧板２３と対向するように、上側の押圧板２５を配置する。これにより、対向する１対の押圧板２３、２５と側方に設けられた側板２４とにより囲まれた空間２６に、樹脂体２２が配置された状態となる。なお、樹脂体２２と当接する押圧板２５の面にもシリコーン樹脂等による離型処理が施されている。 As shown in FIG. 9C, the upper pressing plate 25 is arranged above the resin body 22 so as to face the pressing plate 23 arranged in FIG. 9B. As a result, the resin body 22 is disposed in a space 26 surrounded by the pair of opposing pressing plates 23 and 25 and the side plate 24 provided on the side. The surface of the pressing plate 25 that comes into contact with the resin body 22 is also subjected to a release treatment with a silicone resin or the like.
図９（Ｄ）に示すように、１対の押圧板２３、２５を互いに近づける方向に移動させることにより、押圧板２３、２５の間にある樹脂体２２が押圧板２３、２５の面方向に沿って延ばされ、封止用樹脂シート１１が成形される。樹脂体２２が延ばされる際、樹脂体２２は硬化温度より低い温度に加熱される。対向する１対の押圧板２３、２５と側方に設けられた側板２４とにより囲まれた空間２６は、真空引きされる。押圧板２３、２５による押圧速度は、０．００４ｍｍ／秒以上０．０６ｍｍ／秒以下である。 As shown in FIG. 9D, the resin body 22 between the pressing plates 23 and 25 is moved in the surface direction of the pressing plates 23 and 25 by moving the pair of pressing plates 23 and 25 in the direction to approach each other. It is extended along and the resin sheet 11 for sealing is shape | molded. When the resin body 22 is extended, the resin body 22 is heated to a temperature lower than the curing temperature. A space 26 surrounded by a pair of opposing pressing plates 23 and 25 and a side plate 24 provided on the side is evacuated. The pressing speed by the pressing plates 23 and 25 is 0.004 mm / second or more and 0.06 mm / second or less.
図９（Ｄ）で示した工程の後、押圧板２３、２５による押圧力が解除されるとともに押圧板２３、２５および側板２４で囲まれた空間２６が大気開放される。これにより、図９（Ｅ）に示すような、封止用樹脂シート１１が作製される。 After the step shown in FIG. 9D, the pressing force by the pressing plates 23 and 25 is released, and the space 26 surrounded by the pressing plates 23 and 25 and the side plate 24 is opened to the atmosphere. Thereby, the resin sheet 11 for sealing as shown in FIG.9 (E) is produced.
第２実施形態で用いられる押圧板２３，２５の表面には離型処理が施されている。離型処理を施すことにより押圧板２３，２５の表面の摩擦力を低減する効果があるので、樹脂体２２が延ばされる際の滑りが良くなり、気泡の巻き込みを低減することができる。 The surface of the pressing plates 23 and 25 used in the second embodiment is subjected to a mold release process. By performing the mold release process, there is an effect of reducing the frictional force on the surfaces of the pressing plates 23, 25. Therefore, the sliding when the resin body 22 is extended is improved, and the entrainment of bubbles can be reduced.
第２実施形態によれば、保護フィルム１２を用いずに封止用樹脂シート１１を製造することができる。そのため封止用樹脂シート１１をより安価に製造することができる。 According to the second embodiment, the sealing resin sheet 11 can be manufactured without using the protective film 12. Therefore, the sealing resin sheet 11 can be manufactured at a lower cost.
１１：封止用樹脂シート
１２：保護フィルム
２０：金型
２１：液状樹脂
２２：樹脂体
２３、２５：押圧板
２４：側板
３１：受圧板
３２：加圧板
３３：ヒータ
３４：加圧サーボ機構
３５：ベース板
３６：天板
３７：支柱
３８：真空機構11: Resin sheet for sealing 12: Protective film 20: Mold 21: Liquid resin 22: Resin body 23, 25: Press plate 24: Side plate 31: Pressure plate 32: Pressure plate 33: Heater 34: Pressure servo mechanism 35 : Base plate 36: Top plate 37: Support column 38: Vacuum mechanism
Claims (3)
封止用樹脂シートの材料となる半硬化状態の樹脂体が、対向する１対の押圧板と前記押圧板の外周側に設けられた側板とにより囲まれた空間内に配置される樹脂体配置工程と、
前記囲まれた空間内が真空引きされるとともに、前記樹脂体が前記樹脂体の硬化温度より低い温度で加熱され、かつ、前記樹脂体が前記押圧板により０．００４ｍｍ／秒以上０．０６ｍｍ／秒以下の押圧速度で押圧されて延ばされる延ばし工程と、
を有することを特徴とする封止用樹脂シートの製造方法。A method of manufacturing a sealing resin sheet for insulatingly sealing a plurality of electronic components mounted on a substrate,
Resin body arrangement in which a semi-cured resin body serving as a material for a sealing resin sheet is disposed in a space surrounded by a pair of opposing pressing plates and a side plate provided on the outer peripheral side of the pressing plate Process,
While the enclosed space is evacuated, the resin body is heated at a temperature lower than the curing temperature of the resin body, and the resin body is 0.004 mm / second or more and 0.06 mm / second by the pressing plate. An extending step of being pressed and extended at a pressing speed of less than a second;
The manufacturing method of the resin sheet for sealing characterized by having.
前記延ばし工程では、前記樹脂体が押圧されて前記保護フィルムの面方向に延ばされることを特徴とする請求項１に記載された封止用樹脂シートの製造方法。In the resin body arranging step, a protective film subjected to a release treatment is inserted between the resin body and the pressing plate,
The method for producing a sealing resin sheet according to claim 1, wherein in the extending step, the resin body is pressed and extended in a surface direction of the protective film.
前記延ばし工程では、前記樹脂体が押圧されて前記押圧板の面方向に延ばされることを特徴とする請求項１に記載された封止用樹脂シートの製造方法。The pressing plate is subjected to a mold release process,
The method for producing a sealing resin sheet according to claim 1, wherein in the extending step, the resin body is pressed and extended in a surface direction of the pressing plate.
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