JP5083161B2 - Electronic component manufacturing method and manufacturing apparatus - Google Patents

Electronic component manufacturing method and manufacturing apparatus Download PDF

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JP5083161B2
JP5083161B2 JP2008259168A JP2008259168A JP5083161B2 JP 5083161 B2 JP5083161 B2 JP 5083161B2 JP 2008259168 A JP2008259168 A JP 2008259168A JP 2008259168 A JP2008259168 A JP 2008259168A JP 5083161 B2 JP5083161 B2 JP 5083161B2
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resin
sheet resin
temperature
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heating
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JP2009278058A (en
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宗一 久米
彰夫 勝部
啓 田中
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Murata Manufacturing Co Ltd
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
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    • H01L2924/151—Die mounting substrate
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  • Engineering & Computer Science (AREA)
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Description

この発明は、例えばチップサイズパッケージの電子部品の製造方法及びその製造装置に関するものである。   The present invention relates to a method for manufacturing an electronic component of a chip size package, for example, and a manufacturing apparatus therefor.

従来、半導体ベアチップ等のチップ状電子機能素子を備えたパッケージの小型化及び低背化を図るために、各種構造のチップサイズパッケージ（ＣＳＰ）の開発が行われている。   2. Description of the Related Art Conventionally, chip size packages (CSPs) having various structures have been developed in order to reduce the size and height of a package including a chip-like electronic functional element such as a semiconductor bare chip.

このような目的で樹脂封止パッケージを行うものとして特許文献１が開示されている。
図１は特許文献１に示されている電子部品製造時の各工程図である。 Patent Document 1 discloses that a resin-sealed package is used for such a purpose.
FIG. 1 is a process chart for manufacturing an electronic component disclosed in Patent Document 1.

まず実装工程では、図１（Ａ）に示すように、実装集合基板１１の上に素子を突起状電極３を介して実装し、配置工程において、各素子２の上に樹脂フィルム１２が配置される。続く真空パック工程において、図１（Ｂ）のように実装集合基板１１と実装された各素子２と樹脂フィルム１２との積層体が真空パック用の袋１３に入れられて、この袋１３の内部が減圧され、袋１３の開口部の近傍が両側から熱融着用ヒータにより融着されて開口部が閉じられる。   First, in the mounting process, as shown in FIG. 1A, an element is mounted on the mounting aggregate substrate 11 via the protruding electrodes 3, and in the disposing process, the resin film 12 is disposed on each element 2. The In the subsequent vacuum packing process, as shown in FIG. 1B, a laminated body of the mounting collective substrate 11, each element 2 mounted, and the resin film 12 is put in a bag 13 for vacuum packing, The pressure is reduced, and the vicinity of the opening of the bag 13 is fused from both sides by a heat fusion heater, and the opening is closed.

その後、図１（Ｃ）のように、袋１３ごと樹脂フィルム１２の硬化温度未満の温度に加熱される。   Thereafter, as shown in FIG. 1C, the bag 13 is heated to a temperature lower than the curing temperature of the resin film 12.

これによって、袋１３により真空パックされた実装集合基板１１の上に実装された各素子２の間に、軟化した樹脂フィルム１２が浸入し、樹脂フィルム１２からの封止樹脂前躯体４ａによって封止される。   As a result, the softened resin film 12 enters between the elements 2 mounted on the mounting collective substrate 11 vacuum-packed by the bag 13 and sealed by the sealing resin precursor 4a from the resin film 12. Is done.

次の硬化工程において、各素子２と実装集合基板１１とが樹脂フィルム１２からの封止樹脂前躯体４ａの硬化温度までさらに加熱されて、封止樹脂前躯体４ａが硬化される。その結果、図１（Ｄ）に示すように各素子２がそれぞれ封止樹脂部４で覆われる。   In the next curing step, each element 2 and the mounted assembly substrate 11 are further heated to the curing temperature of the sealing resin precursor 4a from the resin film 12, and the sealing resin precursor 4a is cured. As a result, each element 2 is covered with the sealing resin portion 4 as shown in FIG.

その後、分割工程で図１（Ｅ）に示すように、実装集合基板１１を素子２ごとに仮想分断線９に沿って分割される。
再公表特許ＷＯ２００５／０７１７３１号公報 Thereafter, as shown in FIG. 1E, the mounting assembly substrate 11 is divided along the virtual dividing line 9 for each element 2 in the dividing step.
Republished patent WO2005 / 071731

前述の減圧及び加熱を伴う樹脂封止は、加熱工程以外の工程が一般的には室温でのプロセスとなるため、使用可能な樹脂の粘度物性値が限定される。仮にそれを逸脱する物性値の樹脂材料を使用した場合は、実装済み素子や接合部にダメージを与えたり、粘度が高く流動性が不充分なため必要な充填性を確保できなかったりするという課題がある。   In the above-described resin sealing with reduced pressure and heating, steps other than the heating step are generally processes at room temperature, so that the viscosity property value of the usable resin is limited. If a resin material with a physical property value that deviates from that is used, the mounted element and the joint may be damaged, or the required filling properties may not be ensured due to insufficient viscosity and fluidity. There is.

また、樹脂には揮発性の溶剤成分が含まれているものがあるが、本硬化時にそれが揮発する過程でボイド（樹脂が充填されずに残った気泡）が生じるおそれがあり、充填不良や外観品位の低下を招く。そのため、揮発性溶剤成分の含有量を厳しく制限する必要があったり、使用可能な樹脂材料が無溶剤系材料に限定されたりする問題があった。   In addition, some resins contain volatile solvent components, but there is a risk of voids (bubbles remaining without being filled with resin) in the process of volatilization during main curing. The appearance quality is degraded. Therefore, there is a problem that it is necessary to strictly limit the content of the volatile solvent component, or that the usable resin material is limited to a solventless material.

さらに、チップ状電子機能素子がある程度以上大きいと、そのチップ状電子機能素子と実装集合基板との間への樹脂の充填が不充分となる、すなわちアンダーフィルが完全に形成されない。そのため、接合強度が不充分になるおそれがあった。   Further, if the chip-like electronic functional element is larger than a certain extent, the resin filling between the chip-like electronic functional element and the mounting assembly substrate is insufficient, that is, the underfill is not completely formed. For this reason, there is a possibility that the bonding strength becomes insufficient.

そこで、この発明の目的は、前述の問題を解消して、樹脂の充填性を高め、実装済み素子の接合部に対するダメージを抑え、ボイドの発生を防止し、封止樹脂として利用可能な樹脂の物性値の範囲を広げた、電子部品の製造方法及びその製造装置を提供することにある。   Accordingly, an object of the present invention is to solve the above-mentioned problems, improve the resin filling property, suppress damage to the joint portion of the mounted element, prevent the generation of voids, and can be used as a sealing resin. An object of the present invention is to provide an electronic component manufacturing method and a manufacturing apparatus thereof in which the range of physical property values is expanded.

前記課題を解決するために、この発明は次のようにして電子部品を製造する。
（１）複数のチップ状電子機能素子を実装集合基板上にそれぞれ実装する電子機能素子実装工程と、
前記電子機能素子が実装された前記実装集合基板上に溶剤を含むシート樹脂を配置して、前記実装集合基板と前記シート樹脂との積層体を構成するシート樹脂積層工程と、
ガスバリア性を備えた袋に前記積層体を入れ、減圧下で前記シート樹脂の硬化温度未満の温度に加熱して前記シート樹脂中の溶剤を揮発させる、溶剤揮発工程と、
前記溶剤揮発工程の後、前記袋を密封し、前記積層体に対して大気圧または大気圧を超える圧力を加えるとともに、前記積層体を前記シート樹脂の硬化温度に達するまで加熱することによって、前記複数のチップ状電子機能素子と前記実装集合基板との間に前記シート樹脂を充填した後に前記シート樹脂を硬化させて、前記各電子機能素子を前記実装集合基板上に樹脂封止する樹脂充填封止工程と、
前記樹脂封止された各電子機能素子を備えた前記実装集合基板を電子機能素子毎に分割する分割工程と、
を有して、電子部品を製造する。 In order to solve the above-mentioned problems, the present invention manufactures an electronic component as follows.
(1) an electronic functional element mounting step of mounting a plurality of chip-shaped electronic functional elements on a mounting assembly substrate;
A sheet resin laminating step of disposing a sheet resin containing a solvent on the mounting assembly substrate on which the electronic functional element is mounted, and constituting a laminate of the mounting assembly substrate and the sheet resin;
Putting the laminate in a bag having a gas barrier property, heating to a temperature below the curing temperature of the sheet resin under reduced pressure to volatilize the solvent in the sheet resin, a solvent volatilization step,
After the solvent volatilization step, the bag is sealed, the atmospheric pressure or a pressure exceeding atmospheric pressure is applied to the laminated body, and the laminated body is heated until reaching the curing temperature of the sheet resin. A resin-filled seal that fills the sheet resin between a plurality of chip-like electronic functional elements and the mounting collective substrate, and then cures the sheet resin to seal each electronic functional element on the mounting collective substrate. Stop process,
A dividing step of dividing the mounting assembly substrate including the resin-sealed electronic functional elements for each electronic functional element;
To manufacture electronic components.

この製造方法によれば、溶剤揮発工程で減圧時にシート樹脂を加熱して室温時より粘度を低下させることで樹脂流動圧力による部品や接合部へのダメージを低減して封止時の接合部破壊を防ぐだけでなく、ボイドや樹脂充填時に樹脂内に混入した気泡（以下、「エア噛み」という。）がなくなり、空隙への樹脂浸入・充填性も向上する。   According to this manufacturing method, the sheet resin is heated at the time of depressurization in the solvent volatilization process to reduce the viscosity from the room temperature, thereby reducing damage to parts and joints due to the resin flow pressure and destroying the joints at the time of sealing. In addition to preventing air bubbles, voids and bubbles mixed in the resin during filling of the resin (hereinafter referred to as “air biting”) are eliminated, and resin penetration and filling into the voids are also improved.

また、溶剤揮発工程でシート樹脂を減圧下で加熱する（減圧しながら加熱するか、加熱しながら減圧する）ことで、従来工法の硬化過程で発生するのと同等量の溶剤成分を揮発蒸散させることができ、その後に行う樹脂充填封止工程（本硬化過程）では既に溶剤成分残留量が減少しているので溶剤の揮発によるボイドが発生せず、素子へのダメージも無い。そのため、樹脂充填封止工程（本硬化過程）で例えば昇温速度を遅くするといった温度プロファイルの制御を行う必要もなく、単にシート樹脂の硬化温度以上に加熱することによって前記シート樹脂を本硬化させるだけで済むため、硬化時間（プロセス時間）も短縮できる。またシート樹脂中の溶剤量を厳密に管理することなくボイドレスの封止が可能となるため管理コストが低減できる。   In addition, by heating the sheet resin under reduced pressure in the solvent volatilization process (heating while reducing pressure or reducing pressure while heating), the same amount of solvent component as that generated in the curing process of the conventional method is volatilized and evaporated. In the subsequent resin filling and sealing process (main curing process), since the residual amount of the solvent component has already decreased, no void is generated due to the volatilization of the solvent, and there is no damage to the device. Therefore, there is no need to control the temperature profile such as slowing the rate of temperature rise in the resin filling and sealing process (main curing process), and the sheet resin is fully cured simply by heating it above the curing temperature of the sheet resin. Therefore, the curing time (process time) can be shortened. Further, since the voidless can be sealed without strictly managing the amount of solvent in the sheet resin, the management cost can be reduced.

（２）前記樹脂充填封止工程では、前記袋を密封したまま前記積層体に対して大気圧環境に戻した状態で加熱する。 (2) In the resin filling and sealing step, the laminated body is heated while being returned to an atmospheric pressure environment while the bag is sealed.

この製造方法によれば、加圧＋加熱＋真空機能を満たすために大型プレスやそのための大型真空チャンバーとポンプなどを必要とせずに、安価な装置で同様の効果を得られ、低コストなプロセスで製造できる。また、樹脂充填封止工程では、大気圧環境下で単にシート樹脂の硬化温度以上に加熱することによって前記シート樹脂を本硬化させるだけで済むため、硬化時間（プロセス時間）も短縮でき、シート樹脂中の溶剤量を厳密に管理する必要もなくなり管理コストが低減できる。   According to this manufacturing method, the same effect can be obtained with an inexpensive apparatus without requiring a large press or a large vacuum chamber and pump for satisfying the pressurization + heating + vacuum function, and a low-cost process. Can be manufactured. Also, in the resin filling and sealing step, the sheet resin only needs to be fully cured by heating it to a temperature equal to or higher than the curing temperature of the sheet resin in an atmospheric pressure environment, so that the curing time (process time) can be shortened. It is not necessary to strictly control the amount of solvent in the solvent, and the management cost can be reduced.

（３）前記樹脂充填封止工程では、前記袋を密封したまま、加圧装置によって前記積層体に大気圧以上の圧力を加えた状態で加熱する。 (3) In the resin filling and sealing step, while the bag is sealed, heating is performed in a state where a pressure higher than atmospheric pressure is applied to the laminate by a pressurizing device.

この製造方法によれば、溶剤揮発工程でシート樹脂から抜け切れなかった溶剤などにより発生するボイドや、エア噛みがある場合、後にその気体が揮発し、膨張して、おおきなボイドまたはエア噛みによる空間が発生することがあるが、これを加圧装置によって圧力をかけながら硬化温度まで上げることで、ボイドやエア噛みをつぶすことができる。   According to this manufacturing method, when there is a void or air bite generated by a solvent that has not been completely removed from the sheet resin in the solvent volatilization step, the gas volatilizes and expands later, resulting in a large void or air bite space Although this may occur, the void and the air bite can be crushed by raising the temperature to the curing temperature while applying pressure with a pressure device.

（４）前記樹脂充填封止工程では、前記積層体に対して、前記シート樹脂の硬化温度未満の温度で一旦加熱し、その後に前記シート樹脂の硬化温度以上の温度で加熱する。 (4) In the resin filling and sealing step, the laminate is once heated at a temperature lower than the curing temperature of the sheet resin, and then heated at a temperature equal to or higher than the curing temperature of the sheet resin.

この製造方法によれば、前記シート樹脂の硬化温度未満の温度で、樹脂の粘性が下がっている状態で加圧するため、樹脂の流動性が非常によい。そのため、より大きなチップ状電子機能素子についても、その下面と実装集合基板との間に樹脂の充填が可能となる。   According to this manufacturing method, since the pressure is applied in a state where the viscosity of the resin is lowered at a temperature lower than the curing temperature of the sheet resin, the fluidity of the resin is very good. Therefore, even a larger chip-like electronic functional element can be filled with resin between the lower surface and the mounting assembly substrate.

前記課題を解決するために、この発明の電子部品の製造装置は次のように構成する。
（５）複数のチップ状電子機能素子が実装された実装集合基板上に溶剤を含むシート樹脂が配置されてなる積層体を、ガスバリア性を備えた袋に入れられた状態で減圧するチャンバーと、
前記チャンバー内を減圧するとともに前記シート樹脂の硬化温度未満の温度に加熱して前記シート樹脂中の溶剤を揮発させる減圧下加熱手段と、
前記袋を密封し、大気圧環境に戻した後に、前記積層体を前記シート樹脂の硬化温度に達するまで加熱することによって前記シート樹脂を硬化させて、前記各電子機能素子を前記実装集合基板上に樹脂封止する加圧加熱硬化手段と、
を備える。 In order to solve the above-described problems, an electronic component manufacturing apparatus according to the present invention is configured as follows.
(5) a chamber in which a laminate in which a sheet resin containing a solvent is disposed on a mounting assembly substrate on which a plurality of chip-like electronic functional elements are mounted is decompressed in a state of being put in a bag having gas barrier properties;
Heating means under reduced pressure that depressurizes the inside of the chamber and volatilizes the solvent in the sheet resin by heating to a temperature lower than the curing temperature of the sheet resin;
After the bag is sealed and returned to the atmospheric pressure environment, the laminate is cured by heating the laminated body until it reaches the curing temperature of the sheet resin, and the electronic functional elements are mounted on the mounting assembly substrate. Pressure heat curing means for resin sealing to,
Is provided.

この構成により、加圧＋加熱＋真空機能を満たすために大型プレスやそのための大型真空チャンバーとポンプなどを必要とせずに、安価な装置で同様の効果を得られ、低コストなプロセスで製造できる。   With this configuration, the same effect can be obtained with an inexpensive device without the need for a large press or a large vacuum chamber and pump for satisfying the pressurization + heating + vacuum function, and it can be manufactured by a low-cost process. .

（６）複数のチップ状電子機能素子が実装された実装集合基板上に溶剤を含むシート樹脂が配置されてなる積層体を、ガスバリア性を備えた袋に入れられた状態で減圧するチャンバーと、
前記チャンバー内を減圧するとともに前記シート樹脂の硬化温度未満の温度に加熱して前記シート樹脂中の溶剤を揮発させる減圧下加熱手段と、
前記袋を密封し、前記積層体に大気圧以上の圧力を加えるとともに、前記積層体を前記シート樹脂の硬化温度未満の温度に加熱し、その後に前記積層体を前記シート樹脂の硬化温度以上に加熱することによって前記シート樹脂を硬化させて、前記各電子機能素子を前記実装集合基板上に樹脂封止する加圧加熱硬化手段と、
を備える。 (6) A chamber in which a laminated body in which a sheet resin containing a solvent is disposed on a mounting aggregate substrate on which a plurality of chip-like electronic functional elements are mounted is decompressed in a state of being put in a bag having gas barrier properties;
Heating means under reduced pressure that depressurizes the inside of the chamber and volatilizes the solvent in the sheet resin by heating to a temperature lower than the curing temperature of the sheet resin;
The bag is sealed, a pressure equal to or higher than atmospheric pressure is applied to the laminated body, the laminated body is heated to a temperature lower than the curing temperature of the sheet resin, and then the laminated body is heated to a temperature higher than the curing temperature of the sheet resin. Pressure heating and curing means for curing the sheet resin by heating and resin-sealing each electronic functional element on the mounting assembly substrate;
Is provided.

この構成により、減圧下加熱手段でシート樹脂から抜け切れなかった溶剤などにより発生するボイドやエアーの混入によるエア噛みが加圧加熱硬化手段によってつぶされる。また、前記シート樹脂の硬化温度未満の温度で、樹脂の粘性が下がっている状態で加圧することになるので、より大きなチップ状電子機能素子についても、その下面と実装集合基板との間に樹脂の充填が可能となる。   With this configuration, the air bite caused by the mixing of voids and air generated by the solvent that cannot be completely removed from the sheet resin by the heating means under reduced pressure is crushed by the pressure heating and curing means. In addition, since pressure is applied in a state where the viscosity of the resin is lowered at a temperature lower than the curing temperature of the sheet resin, even for a larger chip-like electronic functional element, the resin is placed between the lower surface and the mounting aggregate substrate. Can be filled.

この発明によれば、樹脂流動圧力による部品や接合部へのダメージを低減して封止時の接合部破壊が防止できる。また、ボイドやエア噛みがなくなり、空隙への樹脂浸入・充填性が向上する。また、溶剤の揮発によるボイドが発生せず、素子へのダメージも無い。さらに、従来は困難であった大きなチップ状電子機能素子についても、その下面と実装集合基板との間に樹脂の充填が可能となる。   According to this invention, damage to parts and joints due to resin flow pressure can be reduced, and joint breakage during sealing can be prevented. In addition, voids and air biting are eliminated, and the resin penetration / filling into the voids is improved. Further, no void is generated due to the volatilization of the solvent, and there is no damage to the element. Furthermore, it is possible to fill a resin between the lower surface of the large chip-shaped electronic functional element, which has been difficult in the past, and the mounting aggregate substrate.

《第１の実施形態》
この発明の第１の実施形態に係る電子部品の製造方法及びその製造装置について、図２〜図６を参照して説明する。
図２はシート樹脂積層工程での状態と樹脂充填封止工程での状態について示す断面図である。 << First Embodiment >>
An electronic component manufacturing method and a manufacturing apparatus thereof according to a first embodiment of the present invention will be described with reference to FIGS.
FIG. 2 is a cross-sectional view showing the state in the sheet resin lamination step and the state in the resin filling and sealing step.

各工程については後に詳述するが、シート樹脂積層工程では、図２（Ａ）に示すように、この発明に係る「実装集合基板」に相当する実装基板２３にシート樹脂２４を積層するとともに、これをセパレータ２２，２５の間に挟みこみ、更にこれらの積層体をベース板２１の上部に配置した状態で、ガスバリア性を備えた袋（以下「パック」という。）３０に入れ、基板入りパック５０を構成する。   Each step will be described in detail later. In the sheet resin lamination step, as shown in FIG. 2A, the sheet resin 24 is laminated on the mounting substrate 23 corresponding to the “mounting assembly substrate” according to the present invention. This is sandwiched between the separators 22 and 25, and further, these laminated bodies are arranged on the upper part of the base plate 21, and are put in a bag 30 (hereinafter referred to as "pack") having a gas barrier property, and packed in a substrate. 50.

図２（Ｂ）は、この時の実装基板２３に実装されている、チップ状電子機能素子（例えば半導体素子）４０の実装状態を示す部分拡大断面図である。実装基板２３の上面には金属ナノ粒子等によるバンプ４２が形成されていて、チップ状電子機能素子４０の回路パターン形成面の接続端子４１がバンプ４２によって接続されている。   FIG. 2B is a partial enlarged cross-sectional view showing a mounted state of the chip-like electronic functional element (for example, a semiconductor element) 40 mounted on the mounting substrate 23 at this time. Bumps 42 made of metal nanoparticles or the like are formed on the upper surface of the mounting substrate 23, and the connection terminals 41 on the circuit pattern forming surface of the chip-like electronic functional element 40 are connected by the bumps 42.

樹脂充填封止工程では、図２（Ｃ）で示すように、パック３０がシール部Ｓでシールされ、大気圧環境に戻されることによって、前記積層体はパック３０内部で大気圧により加圧され樹脂封止が行われる。   In the resin filling and sealing step, as shown in FIG. 2C, the pack 30 is sealed by the seal portion S and returned to the atmospheric pressure environment, whereby the laminate is pressurized by the atmospheric pressure inside the pack 30. Resin sealing is performed.

図２（Ｄ）はチップ状電子機能素子４０周囲の樹脂封止の様子を示す部分拡大断面図である。このように実装基板２３の表面に実装されたチップ状電子機能素子４０の周囲及びチップ状電子機能素子４０と実装基板２３との間隙部にもシート樹脂２４が充填される。   FIG. 2D is a partially enlarged cross-sectional view showing a state of resin sealing around the chip-shaped electronic functional element 40. Thus, the sheet resin 24 is filled around the chip-shaped electronic functional element 40 mounted on the surface of the mounting substrate 23 and also in the gap between the chip-shaped electronic functional element 40 and the mounting substrate 23.

図３は溶剤揮発工程と樹脂充填封止工程の処理を行う装置の構成図である。図３（Ｂ）は主要部の断面図、図３（Ａ）は主要部の上面図である。この装置は加熱ラミネート装置であり、図中の基板入りパック５０（図２（Ａ）に示した状態）を配置する加熱ステージ（減圧下加熱手段）５１、基板入りパック５０のパック３０のシール部Ｓをシールするシールヒータ５２、シール用当て板５３、吸入ダクト５４、及びこれらを覆うカバー５５を備えている。このカバー５５を閉じて、所定の真空度に到達してから所定の時間その状態を維持した後に、シールヒータ５２とシール用当て板５３とがパック３０のシール部Ｓとなる箇所を上下から挟み込むように動作し、パック３０の当該箇所を加圧・加熱してシール部Ｓを形成し、基板入りパック５０を密封する。加熱ステージ５１は、カートリッジヒータプレートや誘導加熱などにより、基板入りパック５０を加熱する。   FIG. 3 is a configuration diagram of an apparatus for performing a solvent volatilization process and a resin filling sealing process. 3B is a cross-sectional view of the main part, and FIG. 3A is a top view of the main part. This apparatus is a heating laminating apparatus, and includes a heating stage (heating means under reduced pressure) 51 for arranging a substrate-containing pack 50 (the state shown in FIG. 2A) in the figure, and a seal portion of the pack 30 of the substrate-containing pack 50 A seal heater 52 for sealing S, a sealing plate 53, a suction duct 54, and a cover 55 for covering them are provided. After closing the cover 55 and maintaining that state for a predetermined time after reaching a predetermined degree of vacuum, the portion where the seal heater 52 and the sealing plate 53 become the seal portion S of the pack 30 is sandwiched from above and below. The portion of the pack 30 is pressurized and heated to form the seal portion S, and the substrate pack 50 is sealed. The heating stage 51 heats the substrate pack 50 by a cartridge heater plate or induction heating.

この加熱ラミネート装置は不図示の真空チャンバー内に入れて、真空ポンプによって減圧時に真空チャンバー内を減圧する。   This heating laminating apparatus is placed in a vacuum chamber (not shown), and the inside of the vacuum chamber is decompressed by a vacuum pump during decompression.

図４は、図３に示した加熱ラミネート装置及び不図示の真空チャンバーを用いて電子部品を製造する電子部品の製造方法における各工程を図示したものである。   FIG. 4 shows each step in the electronic component manufacturing method for manufacturing the electronic component using the heating laminating apparatus and the vacuum chamber (not shown) shown in FIG.

まず、「電子機能素子実装工程」で、アルミナ等のセラミック基板、ガラスエポキシ等の樹脂基板である実装基板２３の上面に金属ナノ粒子等によるバンプ４２を形成し、このバンプを用いて、実装基板２３上に複数のチップ状電子機能素子４０をそれぞれフェイスダウン方式で実装する（図２参照）。   First, in the “electronic functional element mounting process”, bumps 42 made of metal nanoparticles or the like are formed on the upper surface of a mounting substrate 23 that is a ceramic substrate such as alumina or a resin substrate such as glass epoxy, and the mounting substrate is formed using the bumps. A plurality of chip-like electronic functional elements 40 are each mounted on the substrate 23 in a face-down manner (see FIG. 2).

次に、「シート樹脂積層工程」で、図４（Ａ）に示すように、金属製のベース板２１の上にセパレータ２２、実装基板２３及びシート樹脂２４をこの順に積層し、図４（Ｂ）に示すように、その上部に更にセパレータ２５を配置してパック３０内に入れることによって、基板入りパック５０を作成する。   Next, in the “sheet resin laminating step”, as shown in FIG. 4A, a separator 22, a mounting board 23, and a sheet resin 24 are laminated in this order on a metal base plate 21, and FIG. As shown in FIG. 2, the separator 25 is further placed on the upper part and placed in the pack 30, thereby creating the board-containing pack 50.

なお、上記セパレータ２２，２５は、粘性を有するシート樹脂２４がパック３０の内面に貼り付かないようにするためのものであり、そのような目的を達成できるものであれば材質は特に問わない。またパックの内面自体が離型機能を有する場合は、セパレータ２２，２５で実装基板２３とシート樹脂２４を挟み込まなくてもよい。このような離型機能は、例えば離型剤のコーティングなどの方法により付与することができる。   The separators 22 and 25 are for preventing the sheet resin 24 having viscosity from sticking to the inner surface of the pack 30, and the material is not particularly limited as long as such a purpose can be achieved. When the inner surface of the pack itself has a release function, the mounting substrate 23 and the sheet resin 24 may not be sandwiched between the separators 22 and 25. Such a release function can be provided by a method such as coating with a release agent.

パック３０としては、柔軟性とガスバリア性を備え、内層にシーラント層を有するラミネートパックを用いる。上記ベース板２１はパック収縮時の実装基板の反りや外的ダメージを防止する。   As the pack 30, a laminate pack having flexibility and gas barrier properties and having a sealant layer as an inner layer is used. The base plate 21 prevents warping or external damage of the mounting board when the pack contracts.

なお、実装基板２３が十分な剛性を有し、パック収縮時の反りが無視できる程度である場合には、ベース板２１を配置せずに基板入りパック５０を作成してもよい。   If the mounting substrate 23 has sufficient rigidity and warpage when the pack contracts is negligible, the board-containing pack 50 may be created without arranging the base plate 21.

前記シート樹脂は、封止樹脂をシート状に形成したものであり、実装基板の素子搭載面に搭載する。このシート樹脂は実装素子の搭載エリアを完全に覆うサイズであり、厚さは搭載素子高さより厚め（例えば素子高さ約１８０μｍに対して２３０μｍ厚程度）のものを用いる。この厚みは搭載素子の実装基板内での集積度によっても適宜定める。   The sheet resin is formed by forming a sealing resin into a sheet shape and is mounted on an element mounting surface of a mounting substrate. The sheet resin has a size that completely covers the mounting area of the mounting element, and the thickness is larger than the mounting element height (for example, about 230 μm thick with respect to the element height of about 180 μm). This thickness is also determined appropriately depending on the degree of integration of the mounting element in the mounting substrate.

その後、「溶剤揮発工程」で、図４（Ｃ）及び図３に示すように、基板入りパック５０を加熱ラミネート装置の加熱ステージにセットし、減圧するとともにシート樹脂２４の硬化温度未満の温度にまで加熱する。このことによってシート樹脂中の溶剤を揮発させる。   Thereafter, in the “solvent volatilization step”, as shown in FIG. 4C and FIG. 3, the substrate-containing pack 50 is set on the heating stage of the heating laminator, and the pressure is reduced and the temperature is lower than the curing temperature of the sheet resin 24. Until heated. This volatilizes the solvent in the sheet resin.

具体的には、加熱ステージ５１にセットした後、７０〜１２０℃の加熱を行い、その後真空チャンバーを閉じて減圧を開始し、所定の真空度（１２０Ｐａ程度）にまで到達させる。   Specifically, after setting on the heating stage 51, heating at 70 to 120 ° C. is performed, and then the vacuum chamber is closed and pressure reduction is started to reach a predetermined degree of vacuum (about 120 Pa).

上記加熱と減圧のタイミングは、所望の真空度到達時点で所望の温度（樹脂温度）に到達していれば任意に変更可能である。所望の温度に到達したときの真空度より最終的な到達真空度はさらに高くても構わない。また、到達温度は、シート樹脂の温度−粘度特性、実装基板の空隙の状態と樹脂の浸入量、及びシート樹脂の溶剤成分の揮発量に基づいて本硬化後にボイドが発生しない範囲で決定する。   The heating and decompression timings can be arbitrarily changed as long as the desired temperature (resin temperature) is reached when the desired degree of vacuum is reached. The final vacuum degree may be higher than the vacuum degree when the desired temperature is reached. Further, the ultimate temperature is determined within a range in which no voids are generated after the main curing based on the temperature-viscosity characteristics of the sheet resin, the state of the voids of the mounting substrate and the amount of penetration of the resin and the volatilization amount of the solvent component of the sheet resin.

真空度及び温度が所定値に到達した後に時間管理を行う。例えば３０ｓ程度の時間が経過するのを待つ。   Time management is performed after the degree of vacuum and temperature reach predetermined values. For example, it waits for a time of about 30 s to elapse.

次に、「樹脂充填封止工程」で、図４（Ｄ）に示すようにパック３０をシールしてラミネートパックを密封し、真空チャンバーを開放して大気圧下に戻す。その後、図４（Ｅ）に示すように、パックのまま大気圧下の硬化条件である１７５℃／１Ｈの加熱処理を行い、樹脂を本硬化させる。   Next, in the “resin filling and sealing step”, as shown in FIG. 4D, the pack 30 is sealed to seal the laminate pack, and the vacuum chamber is opened to return to atmospheric pressure. Thereafter, as shown in FIG. 4E, heat treatment at 175 ° C./1H, which is a curing condition under atmospheric pressure, is performed as it is in the pack, and the resin is fully cured.

上記加熱処理では、先ずシート樹脂の硬化温度未満の温度で所定時間だけ保持し、その後にシート樹脂の硬化温度以上の温度まで加熱する、という２段階で加熱してもよい。   In the above heat treatment, heating may be performed in two stages: first, holding at a temperature lower than the curing temperature of the sheet resin for a predetermined time, and then heating to a temperature equal to or higher than the curing temperature of the sheet resin.

さらに、その後、「分割工程」で、パックを開封し、ベース板２１、セパレータ２２，２５を取り除いて、実装基板２３をダイシングまたはスクライブ分割によって複数の子基板にする。   Further, after that, in the “dividing step”, the pack is opened, the base plate 21 and the separators 22 and 25 are removed, and the mounting board 23 is made into a plurality of sub-boards by dicing or scribe division.

図５は、従来用いられていた封止用樹脂及びこの発明で適用可能なシート樹脂についての、温度に対するシート樹脂の粘度、及びシート樹脂からの溶剤揮発量の特性を示すものである。   FIG. 5 shows the characteristics of the viscosity of the sheet resin with respect to the temperature and the solvent volatilization amount from the sheet resin for the conventionally used sealing resins and sheet resins applicable in the present invention.

この図５において特性曲線Ｖ１は従来の封止用樹脂の温度変化に対する樹脂の粘度の特性を表している。また、特性曲線Ｓ１は、その従来の封止用樹脂の、温度変化に対する溶剤揮発量の特性を表している。   In FIG. 5, a characteristic curve V1 represents a resin viscosity characteristic with respect to a temperature change of a conventional sealing resin. Further, the characteristic curve S1 represents the characteristic of the solvent volatilization amount with respect to the temperature change of the conventional sealing resin.

従来の封止温度は室温であり、この従来の封止用樹脂は樹脂封止を行った後に樹脂硬化設定温度にまで加熱する段階で、特性曲線Ｓ１で示すように樹脂からわずかに溶剤が揮発することになる。   The conventional sealing temperature is room temperature, and the solvent for this conventional sealing resin volatilizes slightly from the resin as shown by the characteristic curve S1 when the resin is sealed and heated to the resin curing set temperature. Will do.

一方、特性曲線Ｖ２は、本発明により新たに適用可能となる或る樹脂の温度変化に対する樹脂の粘度の特性を表している。また特性曲線Ｓ２は、本発明の電子部品の製造方法により生じる、温度変化による溶剤揮発量の変化を表している。   On the other hand, a characteristic curve V2 represents a characteristic of the viscosity of the resin with respect to a temperature change of a certain resin that can be newly applied according to the present invention. A characteristic curve S2 represents a change in the solvent volatilization amount due to a temperature change, which is caused by the method for manufacturing an electronic component of the present invention.

本発明では溶剤揮発工程での設定温度をその樹脂の溶剤揮発温度（特性曲線Ｓのピーク温度）より高く設定しているので、減圧下における温度上昇に伴って溶剤が揮発する。したがって、その後に、図４（Ｄ），（Ｅ）に示したように、パックをシールして大気圧環境に戻した際には、樹脂中から既に溶剤が揮発している。そのため、このように従来の封止用樹脂より溶剤揮発量の多い樹脂を用いてもボイドのない電子部品が製造できる。例えば溶剤成分が０．１ｗｔ％以上含まれていても適用可能である。   In the present invention, since the set temperature in the solvent volatilization step is set higher than the solvent volatilization temperature of the resin (the peak temperature of the characteristic curve S), the solvent volatilizes as the temperature rises under reduced pressure. Therefore, after that, as shown in FIGS. 4D and 4E, when the pack is sealed and returned to the atmospheric pressure environment, the solvent is already volatilized from the resin. For this reason, an electronic component having no voids can be manufactured by using a resin having a larger amount of solvent volatilization than a conventional sealing resin. For example, the present invention can be applied even when the solvent component is contained in an amount of 0.1 wt% or more.

因みに、特性曲線Ｖ２、Ｓ２で示した、本発明により適用可能となった樹脂を用いて従来の製造方法により樹脂封止を行ったとすると、本硬化のための温度上昇過程で、図５において特性曲線Ｓ３で示すように多量の溶剤が揮発する。この揮発した溶剤はパック内に閉じ込められたままであるので、これがボイドとなって現れる。   Incidentally, if resin sealing is performed by the conventional manufacturing method using the resin that can be applied according to the present invention shown by the characteristic curves V2 and S2, the characteristics in FIG. A large amount of solvent volatilizes as shown by curve S3. Since the volatilized solvent remains trapped in the pack, it appears as a void.

図６は、この発明の実施形態による電子部品の製造方法で製造した電子部品と従来の製造方法によって製造した電子部品の拡大外観図（写真）及び拡大断面図（写真）である。   FIG. 6 is an enlarged external view (photograph) and an enlarged cross-sectional view (photograph) of an electronic component manufactured by an electronic component manufacturing method according to an embodiment of the present invention and an electronic component manufactured by a conventional manufacturing method.

本発明によれば、図６（Ｂ）に示すように、チップ状電子機能素子４０の周囲や実装基板２３との間にボイドなども発生することなく、シート樹脂２４が完全に充填されることが分かる。また、その外観も図６（Ａ）のように良好である。   According to the present invention, as shown in FIG. 6B, the sheet resin 24 is completely filled without generating voids around the chip-like electronic functional element 40 or between the mounting substrate 23. I understand. Moreover, the external appearance is also favorable as shown in FIG.

これに対して、同じシート樹脂を用いて従来の製造方法により製造した場合には、図６（Ｄ）のように、チップ状電子機能素子４０の周囲及びチップ状電子機能素子４０と実装基板２３との間にボイドＶが生じるのが分かる。また、その外観も図６（Ｃ）のように、その品位が著しく低下する。   On the other hand, when manufactured by the conventional manufacturing method using the same sheet resin, as shown in FIG. 6D, the periphery of the chip-like electronic functional element 40 and the chip-like electronic functional element 40 and the mounting substrate 23 are used. It can be seen that a void V is generated between the two. In addition, the quality of the external appearance is remarkably lowered as shown in FIG.

なお、チップ状電子機能素子の接続端子の接合材料は金属ナノ粒子に限らず、導電性接着剤、はんだなどの種々の材料を用いることができる。また、Ａｕバンプ接合による接合、ワイヤボンディング、およびこれらの組み合わせによる接合にも適用可能である。   Note that the bonding material of the connection terminal of the chip-like electronic functional element is not limited to the metal nanoparticles, and various materials such as a conductive adhesive and solder can be used. Further, the present invention can also be applied to bonding by Au bump bonding, wire bonding, and a combination thereof.

以上に示した方法により、次のような効果を奏する。
パック３０のシールの後、大気圧下に戻す時にパック内の圧力（真空度とシール時の内容積で決まる）と大気圧とに差圧が生じてパック３０が内容物を押し付ける。このときシート樹脂２４が変形することでチップ状電子機能素子４０にストレスが掛かることになるが、一般に封止樹脂は加熱することで低粘度化するので、チップ状電子機能素子４０へのダメージを低減でき、チップ状電子機能素子４０及びその接合部の破壊を防止できる。 The following effects are obtained by the method described above.
After the pack 30 is sealed, when the pressure is returned to atmospheric pressure, a differential pressure is generated between the pressure in the pack (determined by the degree of vacuum and the internal volume at the time of sealing) and the atmospheric pressure, and the pack 30 presses the contents. When the sheet resin 24 is deformed at this time, stress is applied to the chip-shaped electronic functional element 40. However, since the sealing resin generally decreases in viscosity by heating, damage to the chip-shaped electronic functional element 40 is caused. It can reduce, and destruction of chip-like electronic functional element 40 and its junction part can be prevented.

同様に、シート樹脂が室温時より低粘度化することによりボイドの発生やエア噛みが防止され、空隙への樹脂浸入・充填性が向上する。   Similarly, when the sheet resin has a lower viscosity than that at room temperature, generation of voids and air biting are prevented, and the resin penetration and filling properties into the voids are improved.

減圧下でシート樹脂を加熱するので、大気圧で加熱する場合に比較してより低温で多量の溶剤成分がシート樹脂から揮発蒸散し、パック後に行う本硬化加熱過程においてボイドの原因となる溶剤成分が残留しない、あるいは非常に減少していることになる。したがってボイドが発生しない。その結果、樹脂材料の溶剤有無による制約を受けることなく、多くの樹脂が封止樹脂として使用可能となり、高信頼性及び低コスト化が図れる。   Since the sheet resin is heated under reduced pressure, a large amount of solvent components evaporate and evaporate from the sheet resin at a lower temperature than when heated at atmospheric pressure, which causes voids in the main curing heating process performed after packing. Does not remain or is very low. Therefore, no void is generated. As a result, many resins can be used as the sealing resin without being restricted by the presence or absence of a solvent in the resin material, and high reliability and cost reduction can be achieved.

《第２の実施形態》
この発明の第２の実施形態に係る電子部品の製造方法及びその製造装置について、図７〜図９を参照して説明する。
図７・図８は、電子部品の製造方法における各工程を図示したものである。図７（Ａ）（Ｂ）はシート樹脂積層工程、図７（Ｃ）は溶剤揮発工程、での状態を示す断面図である。また、図７（Ｄ）は樹脂充填封止工程の前半工程である。
第２の実施形態では、比較的大型のチップ状電子機能素子が搭載された電子部品を対象としている。 << Second Embodiment >>
A method of manufacturing an electronic component and a manufacturing apparatus thereof according to a second embodiment of the present invention will be described with reference to FIGS.
7 and 8 illustrate each step in the method of manufacturing an electronic component. 7A and 7B are cross-sectional views showing the state in the sheet resin laminating process, and FIG. 7C is the solvent volatilization process. FIG. 7D shows the first half of the resin filling and sealing process.
In the second embodiment, an electronic component on which a relatively large chip-like electronic functional element is mounted is targeted.

まず、シート樹脂積層工程では、図７（Ａ）に示すように、例えばＩＣの様な比較的大型のチップ状電子機能素子４０が実装された実装基板（実装集合基板）２３にシート樹脂２４を積層し、さらのその上部にセパレータ２５を積層することによって積層体を構成する。   First, in the sheet resin laminating step, as shown in FIG. 7A, the sheet resin 24 is applied to a mounting substrate (mounting assembly substrate) 23 on which a relatively large chip-like electronic functional element 40 such as an IC is mounted. The laminate is formed by laminating and laminating the separator 25 on the upper part of the laminate.

次に、図７（Ｂ）に示すように、前記積層体をパック３０に入れ、基板入りパック５０を構成する。   Next, as shown in FIG. 7B, the laminate is put into a pack 30 to form a pack 50 with a substrate.

その後、「溶剤揮発工程」で、図７（Ｃ）に示すように、基板入りパック５０を加熱ラミネート装置の加熱ステージにセットし、減圧するとともにシート樹脂２４の硬化温度未満の温度にまで加熱する。このことによってシート樹脂中の溶剤を揮発させる。   Thereafter, in the “solvent volatilization step”, as shown in FIG. 7C, the substrate-containing pack 50 is set on the heating stage of the heating laminator, and the pressure is reduced and heated to a temperature lower than the curing temperature of the sheet resin 24. . This volatilizes the solvent in the sheet resin.

次に、「樹脂充填封止工程」で、図７（Ｄ）に示すようにパック３０をシールしてラミネートパックを密封し、真空チャンバーを開放して大気圧下に戻す。   Next, in the “resin filling sealing step”, as shown in FIG. 7D, the pack 30 is sealed to seal the laminate pack, and the vacuum chamber is opened to return to atmospheric pressure.

図７の（Ａ）〜（Ｄ）の各工程は、第１の実施形態で図４（Ａ）〜（Ｄ）に示した各工程と基本的に同じである。第２の実施形態では、第１の実施形態と異なり、樹脂充填封止工程の後半で、基板入りパック５０に対して大気圧を超える圧力を加える。   7A to 7D are basically the same as the steps shown in FIGS. 4A to 4D in the first embodiment. In the second embodiment, unlike the first embodiment, a pressure exceeding the atmospheric pressure is applied to the substrate pack 50 in the latter half of the resin filling and sealing process.

図８は、図７（Ｄ）に示した樹脂充填封止工程前半工程に続く後半工程について示す図である。図７（Ｄ）に示したように、パック３０をシールしてラミネートパックを密封し、真空チャンバーを開放して大気圧下に戻した後、図８に示す温間静水圧加圧法（ＷＩＰ法）により、基板入りパック５０を加熱加圧する。   FIG. 8 is a diagram showing a second half process subsequent to the first half process of the resin filling and sealing process shown in FIG. As shown in FIG. 7D, the pack 30 is sealed to seal the laminate pack, the vacuum chamber is opened to return to atmospheric pressure, and then the warm isostatic press method (WIP method) shown in FIG. ) To heat and press the substrate pack 50.

図８に示すように、基板入りパック５０を加圧容器６０内に入れて、加熱加圧水６１を介して加熱及び加圧する（加圧加熱硬化手段）。   As shown in FIG. 8, the board-containing pack 50 is placed in a pressurized container 60, and heated and pressurized via heated and pressurized water 61 (pressurized heat curing means).

図９は図８に示した温間静水圧加圧法での加熱・加圧プロファイルの例である。
先ず、第１の一定温度Ｔａになるまで加熱し、また所定圧力Ｐになるまで加圧する。この第１の一定温度Ｔａは、シート樹脂２４の硬化温度未満の温度であり、且つシート樹脂２４の樹脂がチップ状電子機能素子の下面と実装基板の表面との間に流入するに要する粘度にまで粘性が下がる温度である。この第１の一定温度Ｔａを所定時間Ｔ１持続させる。この時間Ｔ１はシート樹脂２４の樹脂がチップ状電子機能素子の下面と実装基板の表面との間に完全に流入するに要する時間である。これにより、チップ状電子機能素子の下面と実装基板の上面との間に樹脂を浸入させる。 FIG. 9 is an example of a heating / pressing profile in the warm isostatic pressing method shown in FIG.
First, heating is performed until the first constant temperature Ta is reached, and pressurization is performed until a predetermined pressure P is reached. The first constant temperature Ta is a temperature lower than the curing temperature of the sheet resin 24, and the viscosity required for the resin of the sheet resin 24 to flow between the lower surface of the chip-like electronic functional element and the surface of the mounting substrate. This is the temperature at which the viscosity decreases to The first constant temperature Ta is maintained for a predetermined time T1. This time T1 is the time required for the resin of the sheet resin 24 to completely flow between the lower surface of the chip-like electronic functional element and the surface of the mounting substrate. Thereby, the resin is allowed to enter between the lower surface of the chip-like electronic functional element and the upper surface of the mounting substrate.

その後、圧力Ｐは一定にしたまま、シート樹脂２４の硬化温度以上の第２の一定温度Ｔｂにまで温度を上げる。この状態を所定時間Ｔ２だけ持続させる。この時間Ｔ２は、チップ状電子機能素子周囲及びチップ状電子機能素子の下面と実装基板の表面との間の樹脂が熱硬化するに要する充分な時間である。   Thereafter, the temperature is raised to a second constant temperature Tb that is equal to or higher than the curing temperature of the sheet resin 24 while keeping the pressure P constant. This state is maintained for a predetermined time T2. This time T2 is a sufficient time required for the resin around the chip-shaped electronic functional element and between the lower surface of the chip-shaped electronic functional element and the surface of the mounting substrate to be thermally cured.

続いて、加熱温度・加圧圧力を徐々に下げて、樹脂充填封止工程の後半工程を終了する。
なお、上記の実施形態は温間静水圧加圧法により加熱・加圧を行った例であるが、水以外の不活性液体などを使用してもよく、また気体を加熱・加圧するオートクレーブ法も同様に適用できる。 Subsequently, the heating temperature and the pressurizing pressure are gradually decreased, and the latter half of the resin filling and sealing process is completed.
The above embodiment is an example of heating and pressurizing by the warm isostatic pressurizing method, but an inert liquid other than water may be used, and an autoclave method for heating and pressurizing gas is also available. The same applies.

最後に分割工程で、パックを開封しセパレータ２５を取り除いて、実装基板２３をダイシングまたはスクライブ分割によって複数の子基板にする。   Finally, in the dividing step, the pack is opened, the separator 25 is removed, and the mounting substrate 23 is made into a plurality of sub-substrates by dicing or scribe division.

なお、図９に示した例では、シート樹脂２４の硬化温度未満の温度Ｔａを保持する時間とシート樹脂２４の硬化温度以上の温度を保持する時間とを分けたが、加熱温度を徐々に上昇させることによって、加熱温度がシート樹脂２４の硬化温度未満である時間にシート樹脂の流動による充填を行い、加熱温度がシート樹脂２４の硬化温度以上となる時間でシート樹脂を硬化させるようにしてもよい。   In the example shown in FIG. 9, the time for maintaining the temperature Ta below the curing temperature of the sheet resin 24 and the time for maintaining the temperature above the curing temperature of the sheet resin 24 are divided, but the heating temperature is gradually increased. Thus, the sheet resin is filled by the flow of the sheet resin when the heating temperature is lower than the curing temperature of the sheet resin 24, and the sheet resin is cured during the time when the heating temperature is equal to or higher than the curing temperature of the sheet resin 24. Good.

《第３の実施形態》
この発明の第３の実施形態に係る電子部品の製造方法及びその製造装置について、図１０を参照して説明する。
図１０は樹脂充填封止工程で基板入りパックを加熱加圧する状態を示す図である。第２の実施形態では、温間静水圧加圧法で基板入りパック５０を加熱加圧したが、図１０に示す例では、一軸プレス装置のステージ７１に基板入りパック５０を置き、一軸プレス装置の可動部７２で、加熱しつつ基板入りパック５０を所定押圧力でプレスする。
基板入りパック５０の構成は図７（Ａ）〜（Ｄ）に示した工程と同じ工程で構成する。 << Third Embodiment >>
An electronic component manufacturing method and apparatus according to a third embodiment of the present invention will be described with reference to FIG.
FIG. 10 is a view showing a state in which the pack containing the substrate is heated and pressurized in the resin filling and sealing step. In the second embodiment, the substrate pack 50 is heated and pressurized by the warm isostatic pressurization method, but in the example shown in FIG. 10, the substrate pack 50 is placed on the stage 71 of the uniaxial press device, and the uniaxial press device The movable part 72 presses the substrate pack 50 with a predetermined pressing force while heating.
The structure of the board-containing pack 50 is configured by the same process as that illustrated in FIGS.

プレス時の加熱温度は、シート樹脂２４の硬化温度未満の温度であり、且つシート樹脂２４の樹脂がチップ状電子機能素子の下面と実装基板の表面との間に流入するに要する粘度にまで粘性が下がる温度である。これにより、チップ電子機能素子の下面と実装基板の上面との間に樹脂を浸入させる。   The heating temperature at the time of pressing is lower than the curing temperature of the sheet resin 24, and the viscosity is such that the resin of the sheet resin 24 is required to flow between the lower surface of the chip-like electronic functional element and the surface of the mounting substrate. Is the temperature that falls. Thereby, the resin is infiltrated between the lower surface of the chip electronic functional element and the upper surface of the mounting substrate.

その後、圧力Ｐは一定にしたまま、シート樹脂２４の硬化温度以上の温度にまで温度を上げる。このことにより、チップ状電子機能素子周囲及びチップ状電子機能素子の下面と実装基板の表面との間の樹脂が熱硬化する。
その後の工程は第１・第２の実施形態の場合と同様である。 Thereafter, the temperature is raised to a temperature equal to or higher than the curing temperature of the sheet resin 24 while keeping the pressure P constant. As a result, the resin around the chip-shaped electronic functional element and between the lower surface of the chip-shaped electronic functional element and the surface of the mounting substrate is thermally cured.
The subsequent steps are the same as those in the first and second embodiments.

このように、一軸プレス装置を用いると、平坦性が高い剛体（ステージ７１及び可動部７２）で基板入りパックに熱と圧力をかけることになるので、シート樹脂が流動することによって生じる樹脂面の平面度が上がる。   As described above, when a uniaxial press apparatus is used, heat and pressure are applied to the pack containing the substrate by a rigid body (stage 71 and movable portion 72) having high flatness, and therefore, the resin surface generated by the flow of the sheet resin. Flatness goes up.

なお、実装基板がセラミック基板である場合のように、その基板の凹凸や突起などで基板割れが発生するおそれがある場合には、基板入りパック５０と一軸プレス装置のステージ７１及び可動部７２との間にゴムシートなどの、セラミックや樹脂より柔らかい弾性体や柔軟体を挟んでもよい。   When there is a possibility that substrate cracking may occur due to the unevenness or protrusion of the substrate, such as when the mounting substrate is a ceramic substrate, the substrate pack 50, the stage 71 and the movable part 72 of the uniaxial press device, An elastic body or a soft body softer than ceramic or resin, such as a rubber sheet, may be sandwiched between the two.

特許文献１に示されている電子部品製造時の各工程図である。It is each process figure at the time of electronic component manufacture shown by patent documents 1. 第１の実施形態におけるシート樹脂積層工程の状態と樹脂充填封止工程の状態について示す断面図である。It is sectional drawing shown about the state of the sheet resin lamination process in 1st Embodiment, and the state of a resin filling sealing process. 第１の実施形態における溶剤揮発工程と樹脂充填封止工程の処理を行う装置の構成図である。It is a block diagram of the apparatus which processes the solvent volatilization process and resin filling sealing process in 1st Embodiment. 図３に示した加熱ラミネート装置及び真空チャンバーを用いて電子部品を製造する電子部品の製造方法における各工程を示す図である。It is a figure which shows each process in the manufacturing method of the electronic component which manufactures an electronic component using the heating laminating apparatus and vacuum chamber which were shown in FIG. 従来用いられていた封止用樹脂及びこの発明で適用可能な樹脂についての、温度に対する樹脂の粘度、及び樹脂からの溶剤揮発量の特性を示すものである。The characteristics of the viscosity of the resin with respect to the temperature and the solvent volatilization amount from the resin for the sealing resin and the resin that can be used in the present invention are shown. この発明の第１の実施形態による製造方法で製造した電子部品と従来の製造方法で製造した電子部品の拡大外観図（写真）及び拡大断面図（写真）である。It is the expansion external view (photograph) and the expanded sectional view (photograph) of the electronic component manufactured with the manufacturing method by 1st Embodiment of this invention, and the electronic component manufactured with the conventional manufacturing method. 第２の実施形態に係る電子部品の製造方法における各工程を示す図である。It is a figure which shows each process in the manufacturing method of the electronic component which concerns on 2nd Embodiment. 第２の実施形態に係る電子部品の製造方法における樹脂充填封止工程の後半工程を示す図である。It is a figure which shows the latter half process of the resin filling sealing process in the manufacturing method of the electronic component which concerns on 2nd Embodiment. 図８に示した温間静水圧加圧法での加熱・加圧プロファイルの例である。FIG. 9 is an example of a heating / pressurizing profile in the warm isostatic pressing method shown in FIG. 8. FIG. 第３の実施形態に係る樹脂充填封止工程で、基板入りパックを加熱加圧する状態を示す図である。It is a figure which shows the state which heat-presses a pack containing a board | substrate at the resin filling sealing process which concerns on 3rd Embodiment.

符号の説明Explanation of symbols

２１…ベース板
２２，２５…セパレータ
２３…実装基板（実装集合基板）
２４…シート樹脂
３０…パック
４０…チップ状電子機能素子
４１…接続端子
４２…金属ナノ粒子バンプ
５０…基板入りパック
５１…加熱ステージ
５２…シールヒータ
５３…シール用当て板
５４…吸入ダクト
５５…カバー
６０…加圧容器
６１…加熱加圧水
７１…一軸プレス装置のステージ
７２…一軸プレス装置の可動部
Ｓ…シール部
Ｖ…ボイド 21 ... Base plate 22, 25 ... Separator 23 ... Mounting board (Mounting collective board)
DESCRIPTION OF SYMBOLS 24 ... Sheet resin 30 ... Pack 40 ... Chip-shaped electronic functional element 41 ... Connection terminal 42 ... Metal nanoparticle bump 50 ... Board containing pack 51 ... Heating stage 52 ... Seal heater 53 ... Sealing plate 54 ... Suction duct 55 ... Cover DESCRIPTION OF SYMBOLS 60 ... Pressurized container 61 ... Heated pressurized water 71 ... Stage of uniaxial press apparatus 72 ... Movable part S of uniaxial press apparatus ... Seal part V ... Void

Claims (6)

複数のチップ状電子機能素子を実装集合基板上にそれぞれ実装する電子機能素子実装工程と、
前記チップ状電子機能素子が実装された前記実装集合基板上に溶剤を含むシート樹脂を配置して、前記実装集合基板と前記シート樹脂との積層体を構成するシート樹脂積層工程と、
ガスバリア性を備えた袋に前記積層体を入れ、減圧下で前記シート樹脂の硬化温度未満の温度に加熱して前記シート樹脂中の溶剤を揮発させる溶剤揮発工程と、
前記溶剤揮発工程の後、前記袋を密封し、前記積層体に対して大気圧または大気圧を超える圧力を加えるとともに、前記積層体を前記シート樹脂の硬化温度に達するまで加熱することによって、前記チップ状電子機能素子と前記実装集合基板との間に前記シート樹脂を充填した後に前記シート樹脂を硬化させて、前記チップ状電子機能素子を前記実装集合基板上に樹脂封止する樹脂充填封止工程と、
前記樹脂封止された電子機能素子を備えた前記実装集合基板を電子機能素子毎に分割する分割工程と、
を有することを特徴とする電子部品の製造方法。 An electronic functional element mounting process for mounting a plurality of chip-shaped electronic functional elements on the mounting assembly substrate,
A sheet resin laminating step of disposing a sheet resin containing a solvent on the mounting assembly substrate on which the chip-like electronic functional element is mounted, and constituting a laminate of the mounting assembly substrate and the sheet resin;
A solvent volatilization step of putting the laminate in a bag with gas barrier properties, and heating the solution under a reduced pressure to a temperature lower than the curing temperature of the sheet resin to volatilize the solvent in the sheet resin;
After the solvent volatilization step, the bag is sealed, the atmospheric pressure or a pressure exceeding atmospheric pressure is applied to the laminated body, and the laminated body is heated until reaching the curing temperature of the sheet resin. Resin-filled sealing in which the sheet resin is filled between the chip-like electronic functional element and the mounting aggregate substrate, and then the sheet resin is cured, and the chip-like electronic functional element is resin-sealed on the mounting aggregate substrate Process,
A dividing step of dividing the mounting assembly substrate including the resin-sealed electronic functional elements for each electronic functional element;
A method for manufacturing an electronic component, comprising: 前記樹脂充填封止工程は、
前記袋を密封したまま前記積層体に対して大気圧環境に戻した状態で加熱する、請求項１に記載の電子部品の製造方法。 The resin filling sealing step
The method of manufacturing an electronic component according to claim 1, wherein the laminated body is heated while being returned to an atmospheric pressure environment while the bag is sealed. 前記樹脂充填封止工程は、
前記袋を密封したまま、加圧装置によって前記積層体に大気圧以上の圧力を加えた状態で加熱する、請求項１に記載の電子部品の製造方法。 The resin filling sealing step
2. The method of manufacturing an electronic component according to claim 1, wherein the bag is sealed and heated in a state where a pressure equal to or higher than atmospheric pressure is applied to the laminate by a pressurizing device. 前記樹脂充填封止工程は、
前記積層体に対して、前記シート樹脂の硬化温度未満の温度で一旦加熱し、その後に前記シート樹脂の硬化温度以上の温度で加熱する、請求項２又は３に記載の電子部品の製造方法。 The resin filling sealing step
The method of manufacturing an electronic component according to claim 2 or 3, wherein the laminate is heated once at a temperature lower than a curing temperature of the sheet resin, and then heated at a temperature equal to or higher than a curing temperature of the sheet resin. 複数のチップ状電子機能素子が実装された実装集合基板上に溶剤を含むシート樹脂が配置されてなる積層体を、ガスバリア性を備えた袋に入れられた状態で減圧するチャンバーと、
前記チャンバー内を減圧するとともに前記シート樹脂の硬化温度未満の温度に加熱して前記シート樹脂中の溶剤を揮発させる減圧下加熱手段と、
前記袋を密封し、大気圧環境に戻した後に、前記積層体を前記シート樹脂の硬化温度に達するまで加熱することによって前記シート樹脂を硬化させて、前記チップ状電子機能素子を前記実装集合基板上に樹脂封止する加圧加熱硬化手段と、
を備えたことを特徴とする電子部品の製造装置。 A chamber in which a laminate in which a sheet resin containing a solvent is disposed on a mounting assembly substrate on which a plurality of chip-like electronic functional elements are mounted is decompressed in a state of being put in a bag having a gas barrier property;
Heating means under reduced pressure that depressurizes the inside of the chamber and volatilizes the solvent in the sheet resin by heating to a temperature lower than the curing temperature of the sheet resin;
After the bag is sealed and returned to the atmospheric pressure environment, the laminated body is heated until it reaches the curing temperature of the sheet resin, the sheet resin is cured, and the chip-like electronic functional element is mounted on the mounting assembly substrate. Pressure heating and curing means for resin sealing on top,
An electronic component manufacturing apparatus comprising: 複数のチップ状電子機能素子が実装された実装集合基板上に溶剤を含むシート樹脂が配置されてなる積層体を、ガスバリア性を備えた袋に入れられた状態で減圧するチャンバーと、
前記チャンバー内を減圧するとともに前記シート樹脂の硬化温度未満の温度に加熱して前記シート樹脂中の溶剤を揮発させる減圧下加熱手段と、
前記袋を密封し、前記積層体に大気圧以上の圧力を加えるとともに、前記積層体を前記シート樹脂の硬化温度未満の温度に加熱し、その後に前記積層体を前記シート樹脂の硬化温度以上に加熱することによって前記シート樹脂を硬化させて、前記チップ状電子機能素子を前記実装集合基板上に樹脂封止する加圧加熱硬化手段と、
を備えたことを特徴とする電子部品の製造装置。 A chamber in which a laminate in which a sheet resin containing a solvent is disposed on a mounting assembly substrate on which a plurality of chip-like electronic functional elements are mounted is decompressed in a state of being put in a bag having a gas barrier property;
Heating means under reduced pressure that depressurizes the inside of the chamber and volatilizes the solvent in the sheet resin by heating to a temperature lower than the curing temperature of the sheet resin;
The bag is sealed, a pressure equal to or higher than atmospheric pressure is applied to the laminated body, the laminated body is heated to a temperature lower than the curing temperature of the sheet resin, and then the laminated body is heated to a temperature higher than the curing temperature of the sheet resin. A pressure heating curing means for curing the sheet resin by heating, and sealing the chip-like electronic functional element on the mounting assembly substrate;
An electronic component manufacturing apparatus comprising:
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