JP2008293575A5 - - Google Patents
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- Publication number
- JP2008293575A5 JP2008293575A5 JP2007137235A JP2007137235A JP2008293575A5 JP 2008293575 A5 JP2008293575 A5 JP 2008293575A5 JP 2007137235 A JP2007137235 A JP 2007137235A JP 2007137235 A JP2007137235 A JP 2007137235A JP 2008293575 A5 JP2008293575 A5 JP 2008293575A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- flat surface
- resin layer
- cured
- pressed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000011347 resin Substances 0.000 claims 30
- 229920005989 resin Polymers 0.000 claims 30
- 239000000758 substrate Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
Claims (6)
第１の平坦面を有する土台部と、
前記第１の平坦面に樹脂を供給する樹脂供給部と、
前記第１の平坦面とともに、樹脂層に対応する領域を形成する型部と、
前記型部の周囲の空間を覆うチャンバと、
前記チャンバ内を真空とする減圧部と、
を有し、
前記土台部及び前記型部の少なくとも一方は、互いに接離する方向に移動可能に設けられ、
前記型部は、
少なくとも樹脂層の外周を規定する枠部と、
前記枠部内に移動可能に設けられ、真空にした前記チャンバ内において、前記第１の平坦面に供給された樹脂を、第２の平坦面により押圧する押圧部と、
前記第２の平坦面により押圧された樹脂を硬化させる硬化部と、
を有することを特徴とする樹脂層形成装置。 In a resin layer forming apparatus for forming a resin layer on a substrate for a recording medium ,
A base portion having a first flat surface;
A resin supply unit for supplying resin to the first flat surface;
A mold part that forms a region corresponding to the resin layer together with the first flat surface;
A chamber covering a space around the mold part;
A depressurizing unit for evacuating the chamber;
Have
At least one of the base part and the mold part is provided so as to be movable in a direction in which the base part and the mold part come into contact with each other,
The mold part is
A frame that defines at least the outer periphery of the resin layer;
A pressing portion that is movably provided in the frame portion and presses the resin supplied to the first flat surface by the second flat surface in the vacuumed chamber;
A curing portion for curing the resin pressed by the second flat surface;
A resin layer forming apparatus comprising:
前記土台部は、電磁波を透過する材質により形成され、
前記硬化部は、前記押圧部によって押圧された樹脂に、電磁波を照射する照射装置を有することを特徴とする請求項１記載の樹脂層形成装置。 The resin is a material that is cured by irradiation with electromagnetic waves,
The base portion is formed of a material that transmits electromagnetic waves,
The resin layer forming apparatus according to claim 1, wherein the curing unit includes an irradiation device that irradiates the resin pressed by the pressing unit with electromagnetic waves.
第１の平坦面上に樹脂を供給し、
樹脂の周囲を真空とし、
少なくとも樹脂層の外周を規定する枠部を第１の平坦面に接触させ、
枠部内を移動可能な第２の平坦面によって、樹脂を押圧し、
押圧された樹脂を硬化させることを特徴とする樹脂層形成方法。 In a resin layer forming method for forming a resin layer to be attached to a substrate for a recording medium ,
Supplying resin on the first flat surface;
Vacuum around the resin,
Contacting at least the frame portion defining the outer periphery of the resin layer with the first flat surface;
The resin is pressed by the second flat surface that can move in the frame,
A method for forming a resin layer, comprising: curing a pressed resin.
前記土台部は、電磁波を透過する材質により形成され、
押圧された樹脂の硬化は、照射装置によって電磁波を照射することによって行うことを特徴とする請求項４記載の樹脂層形成方法。 The resin is a material that is cured by irradiation with electromagnetic waves,
The base portion is formed of a material that transmits electromagnetic waves,
The method for forming a resin layer according to claim 4, wherein the cured resin is cured by irradiating an electromagnetic wave with an irradiation device.
硬化した樹脂上に接着剤を塗布した基板を載置し、
基板の周囲を真空とし、
第２の平坦面によって基板を押圧することを特徴とする請求項４又は請求項５記載の樹脂層形成方法。 After curing the resin pressed by the second flat surface,
Place the substrate coated with adhesive on the cured resin,
Make a vacuum around the board,
6. The method for forming a resin layer according to claim 4, wherein the substrate is pressed by the second flat surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007137235A JP2008293575A (en) | 2007-05-23 | 2007-05-23 | Resin layer forming device and resin layer forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007137235A JP2008293575A (en) | 2007-05-23 | 2007-05-23 | Resin layer forming device and resin layer forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008293575A JP2008293575A (en) | 2008-12-04 |
| JP2008293575A5 true JP2008293575A5 (en) | 2010-07-08 |
Family
ID=40168157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007137235A Withdrawn JP2008293575A (en) | 2007-05-23 | 2007-05-23 | Resin layer forming device and resin layer forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008293575A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5672652B2 (en) * | 2009-03-17 | 2015-02-18 | 凸版印刷株式会社 | Semiconductor element substrate manufacturing method and semiconductor device |
-
2007
- 2007-05-23 JP JP2007137235A patent/JP2008293575A/en not_active Withdrawn
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