JP7234781B2 - Substrate manufacturing method - Google Patents

Description

The present invention relates to a method for manufacturing a substrate .

Conventionally, as a base material, a material whose rigidity is reinforced with a reinforcing fiber material such as carbon fiber or glass fiber has been widely used. As an example of such a base material, there is known a resin molded product obtained by solidifying a laminated body in which sheet-shaped reinforcing fiber materials are superimposed on the front and back surfaces of a core material made of foamed resin with a thermosetting resin. (See Patent Document 1, for example). This type of resin molding is molded using the RTM (Resin Transfer Molding) method. Specifically, in a state in which the laminate is set in the cavity of the mold, an uncured thermosetting resin is injected into the cavity, and the resin is impregnated into the reinforcing fiber material of the laminate. The resin molding is produced by thermal curing.

JP-A-04-224915

However, in the process disclosed in Patent Literature 1, if the inside of the cavity becomes an unnecessarily high pressure state due to the injection of the thermosetting resin, the resin molding (especially the core material of the laminate) may be crushed. In order to prevent this, it is conceivable to provide the mold with a cylinder that communicates with the cavity, and adjust the pressure in the cavity with a plunger that can move back and forth within the cylinder. However, in that case, the thermosetting resin remains on the inner surface of the cylinder, which reduces the slidability of the plunger. Therefore, periodic cleaning of the cylinder is required, which is troublesome. Moreover, when a cylinder is provided, the molding die as a whole becomes thicker (higher) by the height of the cylinder.

The present invention has been completed based on the circumstances as described above, and provides a practical molding apparatus and a method for manufacturing a substrate that can suitably adjust the pressure in the cavity of the molding die. With the goal.

The present invention is a molding apparatus comprising an upper mold and a lower mold, comprising: a resin supply device for supplying an uncured resin to a cavity surrounded by the upper mold and the lower mold in a mold closed state; a pressure adjusting device provided in at least one of the mold and the lower mold for adjusting the pressure in the cavity, wherein the pressure adjusting device is a portion facing the cavity and is flexible. and a pressure adjusting main body capable of adjusting the pressure applied to the film body.

According to such a molding apparatus, for example, when an uncured resin is supplied to the cavity, the pressure applied to the film body by the pressure adjusting body is a predetermined pressure (for example, a pressure lower than the resin supply pressure). , the membrane portion can be deformed in the direction in which the cavity space expands. Thereby, an excessive increase in the pressure inside the cavity can be suppressed. Further, after that, the pressure applied to the film body by the pressure adjusting main body is adjusted to a pressure higher than the predetermined pressure, and the film body presses part of the uncured resin in the cavity. can. Thereby, it is possible to suppress the generation of air bubbles in the uncured resin due to insufficient pressure in the cavity. In addition, the lower mold and the upper mold can be provided in a relatively thin (low) shape, compared with a molding apparatus having, for example, a cylinder for adjusting the pressure in the cavity. The mold closed state refers to a state in which the upper mold and the lower mold are brought close to each other and closed.

In the above configuration, the pressure adjusting main body has a concave recess having an opening that communicates with the cavity, and the membrane body covers the opening. It can be assumed to be attached.

According to such a molding apparatus, since the film body part is attached so as to cover the opening of the concave recess, the film body part is formed in the direction opposite to the opening (the direction in which the film body is recessed). can transform. As a result, the pressure is adjusted by the pressure adjusting main body to deform the film body, suitably widen the cavity space, or suitably press a part of the uncured resin in the cavity with the film body. can be done.

In the above configuration, the pressure adjusting main body can adjust the pressure applied to the membrane by movement of the fluid, and the membrane separates the cavity from the fluid. be able to.

According to such a molding apparatus, since the membrane separates the cavity from the fluid, it is possible to prevent the uncured resin supplied to the cavity from moving toward the fluid. As a result, it is possible to suppress contamination of the pressure adjustment main body. Therefore, compared with a molding apparatus having a cylinder for adjusting the pressure inside the cavity, it is possible to avoid, for example, a decrease in slidability of the plunger and the need to clean the inside of the cylinder.

In the above configuration, the upper mold and the lower mold may have molding surfaces surrounding the cavity, and the film body portion may be arranged parallel to the molding surfaces.

According to such a molding apparatus, the film body portion is arranged parallel to the molding surface. The uncured resin that impregnates the body can be pressurized with a uniform force by the membrane body.

Further, according to the present invention, a laminate comprising a core material and a pair of reinforcing fibrous materials respectively superimposed on the front and back surfaces of the core material is impregnated with an uncured resin, and then the resin is cured. A substrate manufacturing method for manufacturing a substrate by the molding apparatus described above, comprising: a mold closing step of closing the upper mold and the lower mold such that the laminate is accommodated in the cavity; a resin supply step of supplying the uncured resin from the resin supply device to the cavity in which the laminate is accommodated, wherein the resin supply step is performed by the pressure adjustment body portion to the film body portion. A low pressure step of deforming the film body portion in the direction in which the cavity space expands by adjusting the pressure applied to the pressure to a predetermined pressure, and after stopping the supply of the uncured resin from the resin supply device, the A high pressure that presses part of the uncured resin in the cavity with the film by adjusting the pressure applied to the film by the pressure adjusting main body to a pressure higher than the predetermined pressure. It is characterized in that it includes steps.

According to this base material manufacturing method, in the low-pressure step, the pressure applied to the membrane portion by the pressure adjusting body portion is adjusted to a predetermined pressure, thereby deforming the membrane portion in the direction in which the cavity space expands. As a result, the pressure in the cavity can be prevented from becoming excessively high, and crushing of the core material can be suppressed. Further, in the high-pressure process, the pressure applied to the membrane by the pressure adjusting main body is adjusted to be higher than the predetermined pressure in the low-pressure process, and part of the uncured resin in the cavity is removed by the membrane. By pressing, it is possible to suppress the generation of air bubbles in the uncured resin due to insufficient pressure in the cavity.

Further, in the high pressure step, the pressure applied to the membrane portion by the pressure adjusting body portion can be kept constant for a predetermined time.

According to such a substrate manufacturing method, it is possible to suitably suppress the generation of air bubbles in the uncured resin.

Further, in the low-pressure step, the predetermined pressure may be lower than the pressure for supplying the uncured resin from the resin supply device.

According to such a method for manufacturing a base material, in the low-pressure step, the membrane portion can be suitably deformed in the direction in which the cavity space expands.

ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the practical molding apparatus which can adjust the pressure in the cavity of a shaping|molding die suitably, and the manufacturing method of a base material.

Explanatory drawing schematically showing the cross-sectional structure of the base material according to Embodiment 1 Diagram showing the process of setting the core material and reinforcing fiber material in the lower mold Diagram showing mold opening Diagram showing mold closing process and resin supply process Diagram showing low pressure process Diagram showing high pressure process Diagram showing the process of removing the base material from the lower mold An enlarged view showing a pressure regulating device according to Embodiment 2. Enlarged view showing a pressure regulating device according to a modification

<Embodiment 1>
Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 7. FIG. In this embodiment, a molding apparatus 20 for manufacturing a fiber-reinforced resin molded product (base material) 10 using the RTM method and a method for manufacturing the fiber-reinforced resin molded product 10 will be exemplified. First, a fiber-reinforced resin molded product 10 manufactured by a molding apparatus 20 will be described with reference to FIG.

FIG. 1 is an explanatory view schematically showing the cross-sectional configuration of a fiber-reinforced resin molded product (hereinafter referred to as base material) 10. As shown in FIG. The base material 10 is lightweight and highly rigid, and is used as part of a vehicle seat (for example, a backboard). Such a base material 10 includes a core material 11, sheet-like reinforcing fiber materials 12, 12 respectively superimposed on the front and rear surfaces of the core material 11, and a thermosetting resin impregnated in the reinforcing fiber materials 12, 12 and cured. and a resin portion 13 made of. As the thermosetting resin for the resin portion 13, a material generally used in the RTM method (for example, a two-liquid mixing type epoxy resin) can be employed.

The core material 11 is a plate-like body made of synthetic resin (so-called foamed resin) having a closed-cell structure, and has a plate-like (layered) shape with a greater thickness than the reinforcing fiber material 12 . As a material of the core material 11, a synthetic resin such as an acrylic resin can be used. Although the core material 11 is composed of one layer (single layer), it is not limited to this, and may be composed of a multilayer structure in which a plurality of core materials 11 are laminated.

The reinforcing fiber material 12 is made of a carbon fiber (carbon fiber) fabric processed into a sheet. Alternatively, glass fiber can be used as the material of the reinforcing fiber material 12 . For convenience, the reinforcing fiber material 12 superimposed on the front side (upper side) of the core material 11 is referred to as a reinforcing fiber material 12A, and the reinforcing fiber material 12 superimposed on the back side (lower side) of the core material 11 is referred to as a reinforcing fiber material 12B. Sometimes. The thickness of the reinforcing fiber material 12A on the front side is equal to the thickness of the reinforcing fiber material 12B on the back side. The core material 11 has a sandwich structure sandwiched from the front and back sides by a pair of reinforcing fiber materials 12A and 12B.

In the base material 10 , the cured thermosetting resin forming the resin portion 13 is formed so as to cover not only the inside of the reinforcing fiber material 12 but also the surface of the reinforcing fiber material 12 . Therefore, in the base material 10, the resin portion 13 is formed so as to wrap the entire laminated body composed of the core material 11 and the pair of reinforcing fiber materials 12A and 12B. Thereby, smoothness can be imparted to the surface of the laminate. In addition, since the base material 10 includes the core material 11, it is possible to reduce the usage amount of the relatively expensive reinforcing fiber material 12 (especially made of carbon fiber) while maintaining lightness and high rigidity. .

Next, a molding device 20 for molding the base material 10 will be described with reference to FIGS. 3 and 4. FIG. The molding apparatus 20 includes a molding die 30 composed of a lower die 31 and an upper die 32 arranged to face the lower die 31, and a resin supply device 40 disposed on the left end (periphery) side of the upper die 32. , and a pressure adjusting device 50 disposed in the center of the upper die 32 . The mold 30 is composed of a lower mold 31 as a fixed mold that is one split mold and an upper mold 32 as a movable mold that is the other split mold.

The lower mold 31 has a molding surface 31A for molding the front side of the substrate 10 . On the other hand, the upper mold 32 has a molding surface 32A for molding the back side of the substrate 10 . The upper die 32 is driven up and down so as to approach or separate from the lower die 31 by an elevating mechanism (reciprocating mechanism) such as a hydraulic cylinder. An injection hole (sprue) 33 for injecting uncured resin supplied from the resin supply device 40 into the mold 30 is provided at the left end of the upper mold 32 . The injection hole 33 is provided so as to pass through the upper mold 32 and communicate with a cavity C (described later using FIG. 4) of the mold 30 . A nozzle 41 of a resin supply device 40 is attached to the injection hole 33 so as to be inserted from the outside (upper side) toward the inside (the inside of the molding die 30).

Incidentally, as shown in FIG. 3, the state in which the upper mold 32 is arranged at a position separated from the lower mold 31 is called a mold open state. Then, as shown in FIG. 4, the state in which the upper mold 32 is arranged at a position close to the lower mold 31 and closed is called a mold closed state. In the closed mold 30 , a cavity C of the mold 30 is defined by the molding surface 32 A of the upper mold 32 and the molding surface 31 A of the lower mold 31 .

As shown in FIG. 4, a seal portion 34 surrounding the periphery of the cavity C is provided inside the periphery of the upper die 32 (on the molding surface 32A side). In the mold closed state, the sealing portion 34 is sandwiched between the lower mold 31 and the upper mold 32, thereby preventing uncured resin from leaking out of the cavity C beyond the sealing portion 34. .

The resin supply device 40 is a device that supplies an uncured thermosetting resin R to the cavity C in the mold closed state. The resin supply device 40 of the present embodiment supplies a two-liquid mixed type epoxy resin composed of a main agent and a curing agent into the mold 30 . The resin supply device 40 includes a mixing head that discharges the main resin and the curing agent to the molding die 30 side while collision-mixing them. The main agent and the curing agent are stored in predetermined tanks, respectively, and are sent to the mixing head at a predetermined compounding ratio by respective pressure-feeding pumps. In the mixing head, the main agent and the curing agent are mixed while colliding with each other, and an uncured resin R, which is a mixture of them, is discharged from the nozzle 41 at the tip of the mixing head. A resin R discharged from the nozzle 41 is supplied to the cavity C through the injection hole 33 .

A pressure adjusting device 50 for adjusting the pressure of the resin R injected into the molding die 30 (the pressure inside the cavity C) is provided at the central portion of the upper mold 32 . The pressure regulating device 50 is a portion facing the inside of the mold 30 (cavity C), and includes a film body portion 51 made of a flexible film body, and a pressure applied to the film body portion 51 by a fluid. a pressure adjustment body 52 that can be adjusted by movement. The pressure adjusting main body 52 includes a recess 54 that is recessed upward (outward) from the side (inner side) of the molding surface 32A of the upper die 32, and a recess that forms a wall portion in the direction (upward) in which the recess 54 is recessed. and a flow pipe 53 provided to vertically penetrate the bottom portion 54C.

The recessed portion 54 has an opening 55 that opens downward to communicate with the cavity C. As shown in FIG. The opening 55 has a circular shape when viewed from the lower die 31 side (planar view). The film body portion 51 covers the opening portion 55 and is attached to the opening portion 55 so as to be parallel to the molding surface 32A of the upper mold 32 . The film body part 51 is disc-shaped, and has a circular shape when viewed from the lower mold 31 side (planar view).

A space S surrounded by the membrane portion 51 and the recess 54 is filled with a fluid that communicates with the flow pipe 53 and is movable between the flow pipe 53 and the flow pipe 53 . As the fluid, a flowable medium such as air, water, or oil can be used. The membrane portion 51 separates the cavity C from the fluid that fills the space S. As shown in FIG. A mechanism is connected to the flow pipe 53 for injecting the fluid into the space S or sucking it out of the space S, and adjusting the pressure of the fluid applied to the membrane body portion 51 to a predetermined pressure based on the injection movement or the suctioning movement. It is Examples of such a mechanism include an air compressor, a hydraulic pump, and the like, which are connected to the flow pipe 53 via a pressure-resistant tube. The pressure adjustment device 50 is configured to reciprocate the film body 51 up and down by deforming the film body 51 toward the concave bottom 54C side or the cavity C side by increasing or decreasing the pressure applied to the fluid filling the space S. It can be said that there is. As the pressure regulating device 50, for example, a mechanism of a diaphragm pump can be adopted.

Next, a method for manufacturing the substrate 10 by the molding device 20 will be described with reference to FIGS. 1 to 7. FIG. The method of manufacturing the substrate 10 can be broadly divided into a mold closing step of closing the upper mold 32 and the lower mold 31 in such a manner that the laminate P is accommodated in the cavity C, and a cavity C in which the laminate P is accommodated. and a resin supply step of supplying uncured resin R from the resin supply device 40 . The resin supply process includes a low pressure process and a high pressure process.

In the mold closing step, as shown in FIG. 2, a laminate P comprising a core material 11 and a pair of reinforcing fiber materials 12A and 12B is set in a lower mold 31 of a molding apparatus 20 in an open mold state. The laminate P is set on the molding surface 31A of the lower mold 31 in a state following the shape of the molding surface 31A (a state in which the peripheral portion is raised). In addition, the laminate P may be molded (preformed) in advance into a shape following the shape of the molding surface 31A. A binder (for example, a powdery adhesive) is applied in advance to the reinforcing fiber materials 12A, 12B, etc. that constitute the laminate P, and the laminate P is maintained in a predetermined shape by the action of the binder. . In addition, you may shape the laminated body P using 31 A of molding surfaces, such as pressing the laminated body P against 31 A of molding surfaces.

The core material 11 of the laminate P is smaller than the reinforcing fiber materials 12A and 12B, and the peripheral edges of the reinforcing fiber materials 12A and 12B are arranged outside the peripheral edge of the core material 11 . The peripheral edges of the reinforcing fiber materials 12A and 12B overlap each other without the core material 11 interposed therebetween.

As shown in FIG. 3 , after setting the laminate P on the molding surface 31A of the lower mold 31 , the upper mold 32 is brought closer to the lower mold 31 . Then, as shown in FIG. 4, the upper mold 32 is brought into contact with the lower mold 31 and the laminate P to bring the mold 30 into a closed state. When the mold 30 is closed, a cavity C is formed as a space surrounded by the molding surface 31A of the lower mold 31 and the molding surface 32A of the upper mold 32 . A laminate P is accommodated in the cavity C of the closed molding die 30 .

In the resin supply step, the inside of the cavity C is kept airtight by closing the mold 30 . After that, the resin supply device 40 supplies a two-liquid mixing type uncured resin R composed of a main agent and a curing agent into the cavity C while performing collision mixing. The supply pressure of the resin supply device 40 is set to 0.3 MPa to 5 MPa in order to suppress crushing of the core material 11 of the laminate P. Moreover, it is preferably set to 1 MPa or less.

As shown in FIG. 5, the uncured resin R supplied into the cavity C impregnates the interior of the reinforcing fiber material 12 or flows along the surface of the reinforcing fiber material 12, thereby supplied throughout the At this time, the pressure applied to the membrane body portion 51 is adjusted to a predetermined pressure by movement of the fluid in the pressure adjustment main body portion 52 (low pressure step). The predetermined pressure is set lower than the pressure at which the uncured resin R is supplied from the resin supply device 40 . For example, when the pressure at which the uncured resin R is supplied from the resin supply device 40 is 0.7 MPa, the pressure applied by the pressure adjusting body portion 52 to the film body portion 51 is set at 0.5 MPa. Then, the film body portion 51 is deformed toward the concave bottom portion 54C (deformed in the direction in which the cavity space expands). Of the uncured resin R, the resin R1 passing near the film body portion 51 flows so as to fill the space expanded by the deformation of the film body portion 51 (a part R1 of the uncured resin R is It can be said that it flows so as to deform 51 toward the concave bottom portion 54C side).

As shown in FIG. 6, after the supply of the uncured resin R from the resin supply device 40 is stopped, the pressure applied to the film body portion 51 is reduced by the movement of the fluid in the pressure adjustment main body portion 52 to the low pressure. Adjusting the pressure higher than the predetermined pressure in the process (high pressure process). For example, when the pressure applied by the pressure adjusting main body 52 to the film body part 51 in the low pressure process is 0.5 MPa, the pressure applied by the pressure adjusting main body part 52 to the film body part 51 in the high pressure process is is 1 MPa. Then, compared to the low-pressure step, the film body portion 51 is deformed in the direction away from the concave bottom portion 54C side (toward the lower die 31 side) (deformed in the direction in which the cavity space narrows). Further, part R1 of the uncured resin R in the cavity C, which has flowed so as to deform the film portion 51 toward the concave bottom portion 54C in the low-pressure process, is pressed by the film portion 51 toward the lower die 31 side. .

At this time, the pressure applied to the film body portion 51 by the pressure adjusting main body portion 52 and the pressure inside the cavity C are held at constant values for a predetermined time (pressure retention). As a result, it is possible to prevent small air bubbles present in the uncured resin R from expanding and congregating to form visible air bubbles on the surface of the cured resin. Then, in a state where the pressure inside the cavity C is maintained, the temperature of the molding die 30 is raised to a predetermined temperature, and the inside of the cavity C is heated to cure the uncured resin R. As shown in FIG.

After curing the uncured resin R, as shown in FIG. 7, the upper mold 32 is raised to open the mold. Then, the base material 10 is obtained by removing the molding from the lower mold 31 . A bulging portion R2 formed by curing the resin R1 is formed on the rear surface side of the base material 10. As shown in FIG. The bulging portion R2 may be used as a part of the base material 10 as it is, or may be removed from the base material 10 when unnecessary.

Next, the effects of this embodiment will be described. In this embodiment, the molding apparatus 20 includes an upper mold 32 and a lower mold 31, and in a mold closed state, uncured resin R is supplied to a cavity C surrounded by the upper mold 32 and the lower mold 31. A supply device 40 and a pressure adjustment device 50 provided in the upper mold 32 for adjusting the pressure in the cavity C. The pressure adjustment device 50 is a portion facing the cavity C and is a flexible membrane. The molding apparatus 20 includes the film body portion 51 made of a body and the pressure adjustment main body portion 52 capable of adjusting the pressure applied to the film body portion 51 .

According to such a molding apparatus 20, when the uncured resin R is supplied to the cavity C, the pressure applied to the film body portion 51 by the pressure adjusting main body portion 52 is set to a predetermined pressure (higher than the resin supply pressure). By adjusting the pressure to a small value, the membrane portion 51 can be deformed in the direction in which the cavity C space expands. Thereby, an excessive increase in the pressure inside the cavity C can be suppressed. Further, after that, the pressure applied to the film body portion 51 by the pressure adjusting main body portion 52 is adjusted to a pressure higher than the predetermined pressure, and a portion R1 of the uncured resin R in the cavity C is removed from the film body portion. 51 can be pressed. Thereby, in the cavity C, it is possible to suppress the generation of air bubbles in the uncured resin R due to insufficient pressure. In addition, the lower mold and the upper mold can be provided in a relatively thin (low) shape, compared with a molding apparatus having, for example, a cylinder for adjusting the pressure in the cavity.

Further, the pressure adjusting main body portion 52 is provided with a concave portion 54 having an opening portion 55 that opens in a manner communicating with the cavity C, and the membrane portion 51 has a shape that covers the opening portion 55. is attached with

According to such a molding apparatus 20, since the film body part 51 is attached so as to cover the opening part 55 of the recessed part 54, the film body part 51 is attached in the direction opposite to the opening part 55 (the direction of depression in the recessed shape). , the film body portion 51 can be deformed. As a result, the pressure is adjusted by the pressure adjusting main body portion 52 to deform the film body portion 51 , suitably widen the space of the cavity C, or remove a portion R1 of the uncured resin R in the cavity C from the film body portion 51 . can be suitably pressed with

Further, the pressure adjusting main body portion 52 can adjust the pressure applied to the membrane body portion 51 by movement of the fluid, and the membrane body portion 51 separates the cavity C and the fluid.

According to such a molding apparatus 20, since the film portion 51 separates the cavity C from the fluid, it is possible to prevent the uncured resin R supplied to the cavity C from moving to the fluid side. As a result, it is possible to suppress contamination of the pressure adjustment body portion 52 . Therefore, compared with a molding apparatus having a cylinder for adjusting the pressure inside the cavity, it is possible to avoid, for example, a decrease in slidability of the plunger and the need to clean the inside of the cylinder.

The upper mold 32 and the lower mold 31 are provided with molding surfaces 32A and 31A surrounding the cavity C, and the film body portion 51 is arranged parallel to the molding surface 32A.

According to such a molding apparatus 20, the film body portion 51 is arranged parallel to the molding surface 32A. The film body portion 51 can press the laminate P and the uncured resin R with which the laminate P is impregnated with a uniform force.

Further, in this embodiment, after impregnating a laminate P including a core material 11 and a pair of reinforcing fiber materials 12 respectively superimposed on the front and back surfaces of the core material 11 with an uncured resin R, the resin is added. A method for manufacturing the base material 10 by manufacturing the cured base material 10 by the molding apparatus 20 described above, wherein the upper mold 32 and the lower mold 31 are formed so that the laminate P is accommodated in the cavity C. and a resin supply step of supplying uncured resin R from the resin supply device 40 to the cavity C in which the laminate P is accommodated. By adjusting the pressure applied to the film body portion 51 to a predetermined pressure, a low pressure step of deforming the film body portion 51 in the direction in which the cavity C space expands, and supply of uncured resin R from the resin supply device 40. is stopped, the pressure applied to the film body portion 51 by the pressure adjusting main body portion 52 is adjusted to a pressure higher than the predetermined pressure, so that part of the uncured resin R in the cavity C is removed from the film body portion. and a high pressure step of pressing at portion 51 .

According to the manufacturing method of the base material 10 as described above, in the low-pressure step, the pressure applied to the film body part 51 by the pressure adjusting main body part 52 is adjusted to a predetermined pressure, so that the film body part 51 is formed into the cavity C space. By deforming in the widening direction, it is possible to prevent the pressure in the cavity C from becoming excessively high and to suppress the crushing of the core material 11 . Further, in the high-pressure step, the pressure applied to the film body portion 51 by the pressure adjusting main body portion 52 is adjusted to a pressure higher than the predetermined pressure in the low-pressure step, and part of the uncured resin R in the cavity C is removed. By pressing with the film body portion 51, it is possible to suppress the generation of air bubbles in the uncured resin R due to insufficient pressure in the cavity C.

Further, in the high-pressure step, the pressure applied to the film body portion 51 by the pressure adjusting main body portion 52 is kept constant for a predetermined time. According to such a method for manufacturing the base material 10, it is possible to suitably suppress the generation of air bubbles in the uncured resin R.

Also, in the low-pressure process, the predetermined pressure is lower than the pressure at which the uncured resin R is supplied from the resin supply device 40 . According to the manufacturing method of the base material 10 as described above, in the low-pressure step, the film body portion 51 can be suitably deformed in the direction in which the space of the cavity C expands.

<Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIG. In the present embodiment, a molding apparatus 120 having a pressure adjusting device with a different configuration from that in the first embodiment, and a method for manufacturing a substrate are illustrated. In addition, in this embodiment, the same reference numerals are used for the same portions as those in the above-described embodiment, and overlapping descriptions of structures, functions, and effects are omitted.

In the molding apparatus 120 , the pressure adjustment device 150 includes a film body portion 51 and a pressure adjustment body portion 152 . The pressure adjusting body portion 152 includes a recess 54 and a cylinder 153 having a plunger 156 capable of pressing the membrane portion 51 from the direction (upper side) opposite to the cavity C space (upper surface side). The membrane portion 51 separates the cavity C and the plunger 156 . The pressure adjusting main body 152 moves the upper surface of the membrane body 51 up and down by the plunger 156, and deforms the membrane body 51 upward (toward the cylinder 153) and downward (toward the lower die 31). The pressure applied to 51 is adjusted.

In the method of manufacturing the substrate by the molding apparatus 120, in the low-pressure step, the plunger 156 is moved upward to deform the membrane portion 51 upward (deform in the direction in which the cavity space expands). Then, part of the uncured resin is made to flow so as to fill the space expanded by the deformation of the film body portion 51 . In the high-pressure process, the plunger 156 is moved downward to deform the membrane body portion 51 downward (deform in the direction in which the cavity space narrows) compared to the low-pressure process. Then, part of the uncured resin is pressed toward the lower die 31 side by the film body portion 51 .

<Modification>
Next, a modified example of the present invention will be described with reference to FIG. In this modified example, a molding device 220 having a pressure adjusting device with a different configuration from that of the above-described embodiment is exemplified. In addition, in this embodiment, the same reference numerals are used for the same portions as those in the above-described embodiment, and overlapping descriptions of structures, functions, and effects are omitted.

The forming apparatus 220 includes a pressure adjusting device 250 in a slope forming portion 232C provided on the left side of the upper die 232 for forming a slope portion of the base material that slopes upward toward the left. The pressure adjustment device 250 includes a membrane body portion 51 and a pressure adjustment body portion 252 . The pressure adjustment main body 252 has a concave portion 254 that is recessed from the slope forming portion 232C toward the upper right, and a concave bottom portion 254C that constitutes a wall portion in the direction (upper right) in which the recess 254 is recessed. and a flow pipe 53 provided in a form penetrating in the direction. An inner portion 257 at the right end of the opening 255 provided in the recess 254 is tapered so that the thickness decreases toward the bottom. As a result, even if the pressure adjusting device 250 is provided in the slope forming portion 232C when the base material is manufactured using the molding device 220, the inner portion 257 of the upper die 232 is not affected after the uncured resin is cured. It is possible to smoothly shift to the mold opening state without being caught by the hardened resin.

<Other embodiments>
The present invention is not limited to the embodiments described above and illustrated in the drawings. For example, the following embodiments are also included in the technical scope of the present invention. can be implemented with various changes.

(1) In addition to the above embodiments, the shapes of the opening and the membrane can be changed as appropriate. In the above-described embodiment, the opening and the film are circular in plan view, but the present invention is not limited to this. For example, the opening and the film body may have various shapes such as a rectangular shape, a trapezoidal shape, and a polygonal shape in plan view.

(2) In the above embodiment, the mold is a split mold that is arranged on the upper side and the lower side in the vertical direction, but it is not limited to this. For example, the mold may be a split mold arranged on the right side and the left side in the horizontal direction.

(3) The pressure in each process can be appropriately changed in addition to the above embodiment. In the above embodiment, when the uncured resin is supplied from the resin supply device at a pressure of 0.7 MPa, the pressure applied by the pressure adjusting body to the film body is 0.5 MPa in the low pressure process and 0.5 MPa in the high pressure process. Although it is set to 1 MPa, it is not limited to this. For example, when the pressure for supplying the uncured resin from the resin supply device is 0.5 MPa, the pressure applied by the pressure adjusting body to the film body is 0.5 MPa in the low pressure process and 1 MPa in the high pressure process. may be Moreover, the pressure for supplying the uncured resin from the resin supply device may be increased with time.

DESCRIPTION OF SYMBOLS 10... Fiber reinforced resin molding (base material), 11... Core material, 12... Reinforcing fiber material, 20, 120, 220... Molding device, 30, 130, 230... Mold, 31... Lower mold, 32, 132, 232 Upper mold 40 Resin supply device 50, 150, 250 Pressure adjusting device 51 Membrane body 52, 152, 252 Pressure adjusting body 55, 255 Opening C Cavity P ... laminate, R ... uncured resin

Claims (6)

A base material obtained by impregnating a laminate comprising a core material and a pair of reinforcing fiber materials superimposed on the front and back surfaces of the core material with an uncured resin and then curing the resin is placed in an upper mold . A method for manufacturing a substrate manufactured by a molding apparatus comprising a lower mold ,
The molding device is
a resin supply device that supplies uncured resin to a cavity surrounded by the upper mold and the lower mold in a mold closed state;
a pressure adjusting device provided in at least one of the upper mold and the lower mold for adjusting the pressure in the cavity;
The pressure regulator is
a film body portion facing the cavity and made of a flexible film body;
a pressure adjustment main body capable of adjusting the pressure applied to the film body,
The method for manufacturing the base material is
a mold closing step of closing the upper mold and the lower mold such that the laminate is accommodated in the cavity;
a resin supply step of supplying the uncured resin from the resin supply device to the cavity containing the laminate;
a curing step of curing the uncured resin to obtain the base material,
The resin supply step includes:
By adjusting the pressure applied to the film body portion by the pressure adjusting body portion to a predetermined pressure, the film body portion is deformed in the direction in which the cavity space expands , and the laminated body and the deformed film body portion are formed. a low pressure step of flowing the uncured resin between
After stopping the supply of the uncured resin from the resin supply device, the pressure applied to the film body portion by the pressure adjustment body portion is adjusted to a pressure higher than the predetermined pressure, whereby the cavity is and a high-pressure step of pressing a part of the uncured resin inside with the film body part ,
In the high-pressure step, pressing is performed by the film body part so that part of the uncured resin remains between the laminate and the film body part,
In the curing step, part of the uncured resin remaining between the laminate and the film body portion is cured to form a bulging portion that bulges from the plate surface of the base material. A method for producing a base material, characterized by: the pressure adjusting body comprises a concave recess having an opening that communicates with the cavity;
2. The method of manufacturing a substrate according to claim 1, wherein the film body is attached so as to cover the opening. The pressure adjusting main body can adjust the pressure applied to the membrane by movement of the fluid,
3. The method of manufacturing a substrate according to claim 1, wherein the film body separates the cavity from the fluid. The upper mold and the lower mold have molding surfaces surrounding the cavity,
4. The method of manufacturing a substrate according to claim 1, wherein the film body portion is arranged parallel to the molding surface. 5. The substrate according to any one of claims 1 to 4, wherein in the high-pressure step, the pressure applied to the membrane portion by the pressure adjusting body portion is kept constant for a predetermined time. manufacturing method. 6. The substrate according to any one of claims 1 to 5, wherein in the low-pressure step, the predetermined pressure is lower than the pressure at which the uncured resin is supplied from the resin supply device. Production method.

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