WO2013136926A1 - Dispositif et procédé de fabrication de feuille de résine d'étanchéité - Google Patents

Dispositif et procédé de fabrication de feuille de résine d'étanchéité Download PDF

Info

Publication number
WO2013136926A1
WO2013136926A1 PCT/JP2013/054127 JP2013054127W WO2013136926A1 WO 2013136926 A1 WO2013136926 A1 WO 2013136926A1 JP 2013054127 W JP2013054127 W JP 2013054127W WO 2013136926 A1 WO2013136926 A1 WO 2013136926A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin
pressing
sealing
elastic member
resin sheet
Prior art date
Application number
PCT/JP2013/054127
Other languages
English (en)
Japanese (ja)
Inventor
有彌 井田
裕樹 北山
彰夫 勝部
渡部　浩司
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2014504751A priority Critical patent/JP5748023B2/ja
Priority to CN201380010995.3A priority patent/CN104136191B/zh
Publication of WO2013136926A1 publication Critical patent/WO2013136926A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum

Definitions

  • the present invention relates to a sealing resin sheet manufacturing apparatus and a sealing resin sheet manufacturing method used for insulating and sealing a plurality of electronic components mounted on a substrate.
  • an insulating resin layer is formed on the substrate so as to cover the electronic components in order to protect the electronic components from moisture, external contact, and the like.
  • the insulating resin layer is formed by embedding an electronic component in a semi-cured sealing resin sheet and then heat-curing the sealing resin sheet.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2009-29930 describes a method for producing this sealing resin sheet. According to the description of Patent Document 1, as shown in FIG. 19, a liquid resin composition 102 is applied to the upper surface of a support film 103 by a coating apparatus 101, and a release film 105 fed from a release film roller 104 is removed. The sealing resin sheet 205 is manufactured by overlapping the upper surface of the resin composition 102 and pressing the resin composition 102 with the pressing roller 106.
  • the liquid resin composition 102 is wet and spreads, and thus a thick sealing resin sheet 205 is manufactured. Difficult to do.
  • the problem to be solved by the present invention is to reduce the problems related to the production of the sealing resin sheet described above.
  • a sealing resin sheet manufacturing apparatus is for insulatingly sealing a plurality of electronic components mounted on a substrate, and is a semi-cured resin made of an insulating resin material.
  • a molding die for defining a space for molding a sealing resin sheet from the body, a heating mechanism for heating the resin body at a temperature lower than the curing temperature of the resin body, and for evacuating the inside of the molding die
  • a vacuum mechanism and a pressurizing mechanism for pressing the resin body and filling the molding die with a resin material. The molding die presses and seals the resin body with the pressing force from the pressing mechanism.
  • a pair of pressing plates for molding the resin sheet for use a rigid plate arranged between the pair of pressing plates for setting the thickness of the sealing resin sheet after molding, and a resin body inside the rigid plate It is arranged between a pair of pressing plates so as to surround it, rather than the thickness of the rigid plate Only large, and the deformable resilient member by a pressing force from the pressing plate, by.
  • the elastic member has a resin reservoir cut out from the surface on the resin body side toward the rigid plate.
  • the elastic member has a first resin reservoir portion penetrating from the surface on the resin body side to the surface of the rigid plate, and the rigid plate communicates with the first resin reservoir portion and is notched inside the rigid plate. It has a resin reservoir.
  • the rigid plate has a relief groove cut out along the inner periphery.
  • the pressing plate has a recess on the surface for pressing the resin body, and the elastic member is arranged in a state of being fitted in the recess.
  • the method for producing a sealing resin sheet according to the present invention is for insulatingly sealing a plurality of electronic components mounted on a substrate, and is a semi-cured resin composed of an insulating resin material.
  • Body, a pair of pressing plates for pressing the resin body to mold the sealing resin sheet, a rigid plate for setting the thickness of the sealing resin sheet after molding, and the thickness of the rigid plate A preparatory step for preparing an elastic member having a large thickness and being deformable by a pressing force from the pressing plate; a resin body is disposed between the pair of pressing plates; a rigid plate is disposed between the pair of pressing plates; Is disposed between a pair of pressing plates so as to surround the resin body inside the rigid plate, a space forming step for forming a space surrounding the resin body by the pair of pressing plates and the elastic member, and evacuating the space Depressurization step and the resin body is lower than the curing temperature of the resin body
  • the elastic member is deformed by pressing the pressing plate, and in the filling step, the resin material is dammed between the elastic member and the pressing plate.
  • a pair of protective films for protecting the main surface of the molded resin sheet after molding is prepared in the preparation step, and the elastic member and the upper surface of the rigid plate are formed from the bottom surface of the resin body in the space formation step.
  • One protective film is disposed so as to pass through, and the other protective film is disposed so as to face the upper surface of the resin body and the one protective film, thereby enclosing the resin body with the one and other protective films.
  • region is formed, the area
  • the elastic member has a resin reservoir portion cut out from the surface on the resin body side toward the rigid plate, and allows the resin material to enter the resin reservoir portion in the filling step.
  • the elastic member has a first resin reservoir portion penetrating from the resin body-side surface to the rigid plate-side surface, and the rigid plate communicates with the first resin reservoir portion and is cut out inside the rigid plate. It is preferable to have two resin reservoirs and to allow the resin material to enter the second resin reservoir through the first resin reservoir in the filling step.
  • the rigid plate preferably has a relief groove cut out along the inner periphery, and in the filling step, the elastic member is preferably bent toward the relief groove by a pressing force transmitted through the resin material.
  • the pressing plate has a recess on a surface for pressing the resin body, and the elastic member is arranged in a state of being fitted in the recess.
  • the sealing resin sheet manufacturing apparatus can manufacture a sealing resin sheet having a large film thickness at low cost without requiring expensive equipment. Further, the resin material can be prevented from leaking out of the molding die, and the thickness accuracy of the sealing resin sheet after molding can be improved.
  • the resin material can be prevented from leaking outside, and the thickness accuracy of the sealing resin sheet can be improved.
  • FIG. 2 it is the figure which showed the mode of the resin body 22 in the middle of shaping
  • a sealing resin sheet is used for insulating and sealing the electronic components.
  • the sealing resin sheet 11 has a flat plate shape and a thickness of 0.1 mm to 3.5 mm.
  • the sealing resin sheet 11 is made of a semi-cured insulating resin material 15 (for example, epoxy resin), and contains silica or alumina, for example, as a filler in order to increase mechanical strength.
  • Protective films 12 ⁇ / b> A and 12 ⁇ / b> B are attached to both main surfaces of the sealing resin sheet 11 in order to protect the surface of the sealing resin sheet 11.
  • the protective film 12 ⁇ / b> B formed on the upper surface of the sealing resin sheet 11 is flat, and the protective film 12 ⁇ / b> A formed on the lower surface is convex downward along the sealing resin sheet 11. It has a shape.
  • the material of the protective films 12A and 12B is, for example, PET (polyethylene terephthalate) or PTFE (polytetrafluoroethylene).
  • the surface of the protective films 12A and 12B is subjected to a release treatment with a silicone resin or the like.
  • the protective films 12A and 12B are peeled off and used. .
  • the sealing resin sheet manufacturing apparatus 30 (hereinafter referred to as the manufacturing apparatus 30) includes a molding die 40 for molding the sealing resin sheet 11 from the resin body 22.
  • the molding die 40 includes a pair of pressing plates 43 and 45, a side rigid plate 44, and an elastic member 48 disposed inside the rigid plate 44.
  • the resin body 22 is disposed inside the molding die 40.
  • the resin body 22 is a material for molding the sealing resin sheet 11.
  • the resin body 22 is composed of a semi-cured insulating resin material 15 and contains, for example, silica or alumina as a filler.
  • the pair of pressing plates 43 and 45 are for pressing the resin body 22.
  • the pressing plates 43 and 45 have a flat plate shape and are respectively disposed above and below the resin body 22 so as to sandwich the resin body 22.
  • the material of the pressing plates 43 and 45 may be any material that can maintain the shape even when pressed, and for example, stainless steel or aluminum is used.
  • the rigid plate 44 is for setting the thickness of the sealing resin sheet 11 to be molded.
  • the rigid plate 44 is a frame and is disposed between the pair of pressing plates 43 and 45 along the outer periphery of the pressing plates 43 and 45.
  • the material of the rigid plate 44 may be any material that can maintain the shape even when pressed, and for example, stainless steel or aluminum is used.
  • the elastic member 48 is for preventing the resin body 22 from leaking out of the molding die 40.
  • the elastic member 48 is a frame, and the thickness thereof is larger than the thickness of the rigid plate 44 and is disposed between the pair of pressing plates 43 and 45 so as to surround the resin body 22 inside the rigid plate 44.
  • the elastic member 48 can be deformed by the pressing force from the pressing plates 43 and 45, and the material is, for example, silicone resin.
  • the space 46 surrounding the resin body 22 is defined by the pair of pressing plates 43 and 45 and the elastic member 48 by configuring the molding die 40 in the positional relationship shown above.
  • a pair of protective film 12A, so that the resin body 22 may be enclosed in the space 46, 12B is inserted.
  • one protective film 12A is disposed so as to pass from the bottom surface of the resin body 22 to the upper surface of the elastic member 48 and the rigid plate 44, and so as to face the upper surface of the resin body 22 and the one protective film 12A.
  • the other protective film 12B is attached to the pressing plate 45.
  • an in-film region 47 that encloses the resin body 22 with the one and the other protective films 12A and 12B is defined.
  • the manufacturing apparatus 30 depressurizes the space 46 and the in-film region 47 of the molding die 40 and heats and presses the resin body 22.
  • the manufacturing apparatus 30 includes heating mechanisms 33A and 33B for heating the resin body 22.
  • the heating mechanisms 33 ⁇ / b> A and 33 ⁇ / b> B are incorporated in each of the pressure plate 32 installed on the upper side of the press plate 45 and the pressure receiving plate 31 installed on the lower side of the press plate 43.
  • the resin body 22 is heated via the pressing plates 43 and 45 by the heating mechanisms 33A and 33B.
  • the manufacturing apparatus 30 includes a vacuum mechanism 38 for decompressing the space 46 and the in-film region 47.
  • the vacuum mechanism 38 is installed so as to surround the pressure plate 32 and the pressure receiving plate 31.
  • the inside of the vacuum mechanism 38 is evacuated by a vacuum source (not shown), whereby the space 46 and the in-film region 47 are also decompressed.
  • the manufacturing apparatus 30 includes a pressurizing mechanism 34 for pressing the resin body 22.
  • the pressurizing mechanism 34 is installed at the center of the top plate 36, and the top plate 36 is fixed to a support column 37 that stands on the lower base 35.
  • the drive shaft 39 of the pressurizing mechanism 34 is connected to the upper side of the pressurizing plate 32, and the pressurizing plate 32 and the pressing plate 45 are pushed by lowering the drive shaft 39.
  • the resin body 22 is extended between the press plates 43 and 45 along the surface direction of a pair of protective films 12A and 12B.
  • the space 46 and the in-film region 47 defined by the molding die 40 are filled with the resin material 15, and the molding of the resin body 22 is completed.
  • 3 (A) and 3 (B) are views showing the state of the resin body 22 in the molding die 40.
  • a plan view is shown in FIG. 3 (A)
  • a front view is shown in FIG. 3 (B).
  • 3A is a Z1-Z1 cross section with respect to FIG. 3B
  • FIG. 3B is a Y1-Y1 cross section with respect to FIG. 3A.
  • the shape of the resin body 22 is a cylinder for easy understanding, and the protective film 12A is omitted.
  • the thickness of the elastic member 48 is larger than the thickness of the rigid plate 44. Therefore, as shown in FIG. 3B, the pressing plate 45 contacts the elastic member 48 via the protective films 12A and 12B before the rigid plate 44. Further, since the elastic member 48 can be deformed by the pressing force from the pressing plate 45, it deforms following the surface of the pressing plate 45. Therefore, as shown in FIGS. 3A and 3B, the resin material 15 that has flowed during the molding is dammed between the elastic member 48 and the pressing plate 45. As a result, leakage of the resin material 15 to the outside of the molding die 40 is suppressed, and the sealing resin sheet 11 having a desired shape is molded.
  • FIG. 4 (A) and FIG. 4 (B) are the figures which showed the comparative example at the time of shape
  • a top view is shown to (A).
  • a front view is shown at (B).
  • 4A is a Z2-Z2 cross section with respect to FIG. 4B
  • FIG. 4B is a Y2-Y2 cross section with respect to FIG. 4A.
  • the shape of the resin body 22 is a cylinder, and the protective film 12A is omitted.
  • the resin body 22 was demonstrated as a cylinder above, it is not limited to the shape. Depending on the position where the resin body 22 is arranged and the initial parallelism of the pressing plates 43 and 45, the state after the resin body 22 is extended is biased. There are challenges.
  • the resin material 15 being molded can be dammed between the elastic member 48 and the pressing plate 45. Thereby, the leakage of the resin material 15 to the outside of the molding die 40 can be suppressed, and the sealing resin sheet 11 having a desired shape can be molded.
  • the sealing resin sheet 11 can be manufactured without using expensive equipment. Further, if the manufacturing apparatus 30 is used, the sealing resin sheet 11 having a relatively large film thickness can be manufactured by setting the rigid plate 44.
  • a cylindrical cylinder 20 having a bottom is prepared, and a liquid resin 21 is put into the cylinder mold 20 to be semi-cured by heat treatment to produce a resin body 22.
  • the semi-cured state refers to a state at an intermediate stage of the curing reaction and is also called a B stage.
  • the liquid resin 21 in the case of an epoxy resin, it is heated in an oven at a temperature of 40 ° C. to 160 ° C. for 5 minutes to 120 minutes.
  • a resin body having a viscosity of 120 Pa ⁇ s to 2000 Pa ⁇ s at a temperature of 60 ° C. can be used as the resin body 22 .
  • the viscosity at this time is a value measured under the conditions of a tool size of ⁇ 8 mm, a measurement thickness of 550 ⁇ m, a frequency of 1 Hz, and a strain of 0.1% using an AR550 manufactured by TA Instruments.
  • a molding die 40 for molding the sealing resin sheet 11 is prepared.
  • the molding die 40 includes a pair of upper and lower pressing plates 43 and 45, a side rigid plate 44, and an elastic member 48 disposed inside the rigid plate 44.
  • a space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43 and 45 and the elastic member 48.
  • a pair of protective films 12 ⁇ / b> A and 12 ⁇ / b> B are inserted into the space 46 to form an in-film region 47 that surrounds the resin body 22.
  • the pair of pressing plates 43 and 45 are moved in a direction approaching each other, and the pressing plate 45 and the elastic member 48 are brought into contact with each other through the protective films 12A and 12B. As a result, the resin body 22 flows and extends between the pair of pressing plates 43 and 45.
  • the resin body 22 When the resin body 22 is extended, the resin body 22 is heated, and the heating temperature is lower than the curing temperature of the resin body 22 (for example, 40 ° C. to 160 ° C.).
  • the space 46 and the in-film region 47 are depressurized by evacuation, and the pressure is 5000 Pa or less.
  • the lower protective film 12A is pressed by the resin material 15 of the extended resin body 22 to form the molding metal. It spreads along the inner wall of the mold 40. As a result, the space 46 and the in-film region 47 defined by the molding die 40 are filled with the resin material 15 and the molding of the resin body 22 is completed.
  • FIGS. 3A and 3 (B) are views showing the state of the resin material 15 in the middle of molding.
  • FIG. 5 the state between FIG. 5 (C) and FIG. 5 (D) is shown.
  • FIG. 3A and 3B the resin material 15 in the middle of molding reaches the center of the four sides inside the elastic member 48.
  • the elastic member 48 and the pressing plate 45 are in contact with each other via the protective films 12 ⁇ / b> A and 12 ⁇ / b> B, and the resin material 15 is dammed at the center of the four sides of the elastic member 48.
  • the resin material 15 flows toward the four corners inside the elastic member 48. Thereby, the resin material 15 is formed in a rectangular shape.
  • the pressing force by the pressing plates 43 and 45 is released, and the space 46 surrounded by the pressing plates 43 and 45 and the elastic member 48 is opened to the atmosphere.
  • the sealing resin sheet 11 with the protective films 12A and 12B on both sides as shown in FIG. since the heating temperature at the time of molding is lower than the curing temperature of the resin material 15, the sealing resin sheet 11 remains in a semi-cured state.
  • the resin material 15 in the middle of molding is dammed between the elastic member 48 and the pressing plate 45. As a result, leakage of the resin material 15 to the outside of the molding die 40 is suppressed, and the sealing resin sheet 11 having a desired shape is molded.
  • a cylindrical cylinder 20 having a bottom is prepared, and a liquid resin 21 is placed in the cylinder 20, and the resin body 22 is made into a semi-cured state by heat treatment.
  • a molding die 40 for molding the sealing resin sheet 11 is prepared.
  • the molding die 40 includes a pair of upper and lower pressing plates 43 and 45, a side rigid plate 44, and an elastic member 48 disposed inside the rigid plate 44.
  • the material of the elastic member 48 is a silicone resin.
  • the pressing plates 43 and 45 are subjected to a mold release process using a silicone resin or the like.
  • a space 46 surrounding the resin body 22 by the pair of pressing plates 43 and 45 and the elastic member 48 is formed.
  • the heating temperature when the resin body 22 is extended is lower than the curing temperature of the resin body 22, and the space 46 is evacuated.
  • the pair of pressing plates 43, 45 move in a direction approaching each other, and the resin body 22 is extended between the pair of pressing plates 43, 45. At this time, the fluidized resin material 15 is dammed between the elastic member 48 and the pressing plate 45.
  • the space 46 defined by the molding die 40 is filled with the resin material 15, and the molding of the resin body 22 is completed.
  • the sealing resin sheet 11 can be manufactured without using the protective films 12A and 12B. Therefore, the sealing resin sheet 11 can be manufactured at a lower cost.
  • the third embodiment is an embodiment in which the elastic member shown in the first embodiment is provided with a function of storing excess resin material 15. Detailed description of the configuration common to the first embodiment is omitted.
  • FIG. 7 (A) to 7 (C) are plan views sequentially showing the state of the resin body 22 in the molding die 50.
  • FIG. For ease of understanding, the shape of the resin body 22 is a cylinder, and the protective film 12A is omitted.
  • the molding die 50 includes a pair of upper and lower pressing plates 43 and 45 (the pressing plate 45 is not shown), a rigid plate 44 disposed on the outer periphery of the pressing plate 43, and a rigid body. And an elastic member 51 disposed inside the plate 44.
  • the four elastic members 51 of the quadrangular prism are arranged with a gap so as to surround the resin body 22.
  • notches are formed in the four corners of the elastic member 51 having a frame shape from the surface on the resin body 22 side toward the rigid plate 44.
  • This notch serves as a resin reservoir 52 for storing excess resin material 15.
  • the resin reservoir 52 can widen the allowable range of the amount of resin that can be charged into the molding die 50.
  • the resin material 15 of the resin body 22 extended by the pressing process reaches the center of the four sides inside the elastic member 51 and is dammed up by the elastic member 51. As shown in FIG. The dammed resin material 15 flows toward the four corners of the elastic member 51.
  • the space 46 and the in-film region 47 defined by the molding die 50 are filled with the resin material 15, and the surplus resin material 15 is filled. Enters the resin reservoir 52 at the four corners of the elastic member 51.
  • the resin sheet 11 for sealing which has the surplus part 53 of the resin material 15 in four corners is shape
  • the produced resin sheet 11 for sealing is used for manufacture of an electronic component module, after the surplus part 53 is removed by cutting
  • the sealing resin sheet 11 it is necessary to sufficiently fill the resin material 15 in the molding die 50, and the volume of the resin body 22 to be charged is larger than the volume in the molding die 50. It is set large. Therefore, surplus resin material 15 is generated during molding. If there is no place for the surplus resin material 15, the resin material 15 may leak out of the molding die 50.
  • the resin material 15 corresponding to the volume of the resin reservoir 52 can be accommodated in excess. Therefore, even if the volume of the resin body 22 is larger than the volume in the molding die 50, the sealing resin sheet 11 can be molded without any problem.
  • FIG. 8 to FIG. 11 are diagrams showing typical modifications thereof.
  • FIG. 8 is a view showing a first modified example related to the molding die 50.
  • the elastic member 51A of the molding die 50A is a frame that is integrally formed as a whole.
  • the four corners inside the elastic member 51A have cutouts 52A in which a part of the elastic member 51A is cut out.
  • This notch 52 ⁇ / b> A becomes a resin reservoir 52 for storing the resin material 15.
  • FIG. 9 is a view showing a second modified example related to the resin body 22.
  • the shape of the resin body 22B is a rectangular parallelepiped. Even in this case, the gap formed between the elastic members 51 becomes the resin reservoir 52.
  • FIG. 10 is a view showing a third modified example related to the molding die 50 and the resin body 22.
  • a notch 52C is provided at the center of the four sides of the elastic member 51C of the molding die 50C.
  • This notch 52 ⁇ / b> C serves as a resin reservoir 52 for storing the resin material 15.
  • the shape of the resin body 22C is a star shape, and when pressed, the resin material 15 is first filled into the four corners of the elastic member 51C, and then the resin material 15 is filled toward the notch 52C at the center of the four sides. Is done.
  • FIG. 11 is a view showing a fourth modified example related to the molding die 50.
  • the elastic member 51D and the rigid plate 44D of the molding die 50D have a ring shape.
  • the elastic member 51D has a notch 52D at every 90 ° angle. This notch 52D becomes a resin reservoir 52 for storing the resin material 15.
  • both the elastic member and the rigid plate shown in the first embodiment are provided with a function of storing excess resin material 15. Detailed description of the configuration common to the first embodiment is omitted.
  • FIGS. 12 to 14 are views sequentially showing the state of the resin body 22 in the molding die 60, and a plan view and a front view thereof are shown in FIG. 12A and FIG. 12A is a Z3-Z3 cross section with respect to FIG. 12B, and FIG. 12B is a Y3-Y3 cross section with respect to FIG. 12A.
  • FIG. 12A for easy understanding, the shape of the resin body 22 is a cylinder, and the protective film 12A is omitted. The same applies to FIGS. 13 and 14 below.
  • the molding die 60 includes a pair of upper and lower pressing plates 43 and 45, a rigid plate 62 disposed on the outer periphery of the pressing plate 43, and an inner side of the rigid plate 62. And an elastic member 51 disposed on the surface.
  • a space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43 and 45 and the elastic member 51.
  • a pair of protective films 12 ⁇ / b> A and 12 ⁇ / b> B are inserted in the space 46 to form an in-film region 47 that surrounds the resin body 22.
  • the four elastic members 51 of the quadrangular prism are arranged with a gap so as to surround the resin body 22.
  • notches penetrating from the surface on the side of the resin body 22 toward the surface of the rigid plate 62 are formed at the four corners of the elastic member 51 having a frame shape. This notch serves as a first resin reservoir 63 for storing excess resin material 15.
  • a notch is formed along the inside of the rigid plate 62. This notch communicates with the first resin reservoir 63 and becomes the second resin reservoir 64 for storing the resin material 15.
  • the first and second resin reservoirs 63 and 64 can further widen the allowable width of the amount of resin that can be charged into the molding die 60.
  • the resin material 15 of the resin body 22 extended by the pressing process reaches the center of the four sides inside the elastic member 51 and is dammed by the elastic member 51. It is done. The dammed resin material 15 flows toward the four corners of the elastic member 51.
  • the resin material 15 enters the first resin reservoir 63 of the elastic member 51, and further the first resin. Part of the second resin reservoir 64 passes through the reservoir 63. Thereby, the resin sheet 11 for sealing which has the surplus 65 of the resin material 15 as shown to FIG. 14 (A) in four corners is shape
  • the resin material 15 corresponding to the volume of the first and second resin reservoirs 63 and 64 is further added. Can be accommodated. Therefore, even if the volume of the resin body 22 is larger than the volume in the molding die 600, the sealing resin sheet 11 can be molded without any problem.
  • FIG. 15 and FIG. 16 are views showing the state of the resin body 22 in the molding die 70.
  • the plan view is shown in (A) and the front view is shown in (B).
  • 15A is a Z6-Z6 cross section with respect to FIG. 15B
  • FIG. 15B is a Y6-Y6 cross section with respect to FIG. 15A.
  • the resin body 22 has a cylindrical shape for easy understanding, and the protective film 12A is omitted. The same applies to FIG.
  • the molding die 70 includes a pair of upper and lower pressing plates 43 and 45, a rigid plate 71 arranged on the outer periphery of the pressing plate 43, and a rigid plate 71. And an elastic member 48 disposed inside.
  • a space 46 surrounding the resin body 22 is formed by the pair of pressing plates 43 and 45 and the elastic member 48.
  • a pair of protective films 12 ⁇ / b> A and 12 ⁇ / b> B are inserted in the space 46 to form an in-film region 47 that surrounds the resin body 22.
  • the volume of the resin body 22 that is the material of the sealing resin sheet 11 usually varies to some extent. If the volume of the resin body 22 is larger than the volume in the molding die 70 due to the variation, excess resin material 15 is generated during molding.
  • the rigid plate 71 is formed with a relief groove 72 cut out along the inner periphery of the rigid plate 71.
  • the presence of the escape groove 72 allows a variation in the volume of the resin body 22 put into the molding die 70.
  • the excess resin material 15 presses the elastic member 48 to the side. Due to the pressing force transmitted through the resin material 15, the elastic member 48 is bent toward the escape groove 72 of the rigid plate 71, and outward bulges 73 are formed on the four sides of the elastic member 38. As a result, the resin material 15 of the swelled volume can be accommodated in excess, and even when the volume of the resin body 22 is slightly larger than the volume in the molding die 70, the sealing resin sheet 11 is molded without any problem. can do.
  • the produced sealing resin sheet 11 bulges outward on its four sides, but has a substantially rectangular shape, and can be used for manufacturing an electronic component module as it is.
  • the molding die 80 includes a pair of upper and lower pressing plates 81 and 45, a side rigid plate 44, and an elastic member 83 disposed inside the rigid plate 44.
  • the 6th Embodiment forms the groove-shaped recessed part 82 in the lower press board 81, and the elastic member 83 is arrange
  • the elastic member 83 is arranged in a state of being fitted in the concave portion 82 of the pressing plate 81, so that the above-described positional deviation can be prevented.
  • FIG. 18 shows a modification in which the cross section of the elastic member is elliptical.
  • the concave portion 82A of the pressing plate 81A is a tapered groove, and is arranged in a state in which the lower half or more of the elliptical elastic member 83A is fitted therein. Thereby, not only the displacement of the elastic member 83A but also the elastic member 83A can be prevented from coming out of the recess 82A.
  • cross section of the elastic member 83A may be circular instead of elliptical. If the cross section of the elastic member 83A is circular, a commercially available rubber packing can be used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

La présente invention permet de produire à moindre coût une feuille de résine d'étanchéité pour le scellement isolé de plusieurs composants électriques montés sur un substrat, et d'améliorer la précision de l'épaisseur de la feuille de résine d'étanchéité. Un dispositif (30) de production d'une feuille de résine d'étanchéité est prévu avec : une matrice de moulage (40) pour mouler une feuille de résine d'étanchéité (11) à partir d'un corps en résine (22) ; des mécanismes de chauffage (33A, 33B) ; un mécanisme sous vide (38) ; et un mécanisme de pressurisation (34). La matrice de moulage (40) comprend : une paire de plaques de pression (43, 45) ; une plaque de corps rigide (44) servant à régler l'épaisseur de la feuille de résine d'étanchéité (11) ; et un élément élastique (48). L'élément élastique (48) est plus épais que la plaque de corps rigide (44) et peut être déformé par la force de pression provenant de la plaque de pression (45). Le corps en résine (22) est étalé par pression mais est retenu entre un élément élastique déformé (28) et la plaque de pression (45) et, de ce fait, le corps en résine ne peut pas couler à l'extérieur de la matrice de moulage (40).
PCT/JP2013/054127 2012-03-16 2013-02-20 Dispositif et procédé de fabrication de feuille de résine d'étanchéité WO2013136926A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014504751A JP5748023B2 (ja) 2012-03-16 2013-02-20 封止用樹脂シートの製造装置および封止用樹脂シートの製造方法
CN201380010995.3A CN104136191B (zh) 2012-03-16 2013-02-20 密封用树脂片材的制造装置及密封用树脂片材的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-060889 2012-03-16
JP2012060889 2012-03-16

Publications (1)

Publication Number Publication Date
WO2013136926A1 true WO2013136926A1 (fr) 2013-09-19

Family

ID=49160845

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/054127 WO2013136926A1 (fr) 2012-03-16 2013-02-20 Dispositif et procédé de fabrication de feuille de résine d'étanchéité

Country Status (4)

Country Link
JP (1) JP5748023B2 (fr)
CN (1) CN104136191B (fr)
TW (1) TWI483831B (fr)
WO (1) WO2013136926A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017170729A (ja) * 2016-03-23 2017-09-28 パナソニックＩｐマネジメント株式会社 成形品の製造方法
GB2589655A (en) * 2019-05-21 2021-06-09 Airbus Defence & Space Gmbh Pressure plate arrangement, production arrangement, device and method for producing a transition region between aerodynamic profile elements
JP2021159856A (ja) * 2020-03-31 2021-10-11 株式会社テクノラボ 樹脂成形品製造方法及び樹脂成形品

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015046573A (ja) * 2013-07-31 2015-03-12 日東電工株式会社 貼着治具および電子装置の製造方法
CN106356437B (zh) * 2016-09-30 2019-07-26 广东晶科电子股份有限公司 一种白光led封装器件及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291322A (ja) * 1992-04-07 1993-11-05 Toshiba Corp 封止用樹脂シートの製造方法および樹脂封止型半導体装置の製造方法
JPH08168999A (ja) * 1994-12-16 1996-07-02 Toshiba Chem Corp 半導体封止用樹脂シートの製造方法
JP2012054363A (ja) * 2010-08-31 2012-03-15 Kyocera Chemical Corp 電子部品の封止方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0966523A (ja) * 1995-08-30 1997-03-11 Toshiba Chem Corp 半導体封止用樹脂成型体の製造方法
JP3795790B2 (ja) * 2001-10-26 2006-07-12 株式会社サイネックス 樹脂封止方法
JP2006256195A (ja) * 2005-03-18 2006-09-28 Towa Corp 電子部品の圧縮成形方法及び樹脂材料
JP5382693B2 (ja) * 2009-02-04 2014-01-08 アピックヤマダ株式会社 圧縮成形方法
JP5055326B2 (ja) * 2009-06-29 2012-10-24 Ｔｏｗａ株式会社 樹脂封止型及び樹脂封止方法
JP5203317B2 (ja) * 2009-08-06 2013-06-05 住友重機械工業株式会社 圧縮成形封止装置
JP5385886B2 (ja) * 2010-11-02 2014-01-08 Ｔｏｗａ株式会社 電気回路部品の樹脂封止成形方法及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291322A (ja) * 1992-04-07 1993-11-05 Toshiba Corp 封止用樹脂シートの製造方法および樹脂封止型半導体装置の製造方法
JPH08168999A (ja) * 1994-12-16 1996-07-02 Toshiba Chem Corp 半導体封止用樹脂シートの製造方法
JP2012054363A (ja) * 2010-08-31 2012-03-15 Kyocera Chemical Corp 電子部品の封止方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017170729A (ja) * 2016-03-23 2017-09-28 パナソニックＩｐマネジメント株式会社 成形品の製造方法
GB2589655A (en) * 2019-05-21 2021-06-09 Airbus Defence & Space Gmbh Pressure plate arrangement, production arrangement, device and method for producing a transition region between aerodynamic profile elements
GB2589655B (en) * 2019-05-21 2021-12-22 Airbus Defence & Space Gmbh Pressure plate arrangement, production arrangement, device and method for producing a transition region between aerodynamic profile elements
US11946264B2 (en) 2019-05-21 2024-04-02 Airbus Defence and Space GmbH Pressure plate arrangement, production arrangement, device and method for producing a transition region between aerodynamic profile elements
JP2021159856A (ja) * 2020-03-31 2021-10-11 株式会社テクノラボ 樹脂成形品製造方法及び樹脂成形品
JP7026408B2 (ja) 2020-03-31 2022-02-28 株式会社テクノラボ 樹脂成形品製造方法及び樹脂成形品

Also Published As

Publication number Publication date
JP5748023B2 (ja) 2015-07-15
TWI483831B (zh) 2015-05-11
JPWO2013136926A1 (ja) 2015-08-03
CN104136191A (zh) 2014-11-05
CN104136191B (zh) 2016-09-14
TW201343357A (zh) 2013-11-01

Similar Documents

Publication Publication Date Title
JP5748023B2 (ja) 封止用樹脂シートの製造装置および封止用樹脂シートの製造方法
JP5774545B2 (ja) 樹脂封止成形装置
WO2010146860A1 (fr) Procédé de production d'un composant électronique moulé en résine
JP6541746B2 (ja) 樹脂成形装置及び樹脂成形品の製造方法
JP2009170488A (ja) モールドコイルの製造方法
JP2019081294A (ja) 樹脂成形装置及び樹脂成形品の製造方法
WO2012066902A1 (fr) Procédé pour la fabrication d'une feuille de scellement en résine
KR101854494B1 (ko) 컨택트 렌즈 또는 안내 렌즈를 제조하는 성형 금형 및 방법
CN110545990B (zh) 用于制造光学制品的方法
JP5854125B2 (ja) 封止用樹脂シートの製造方法
JP2005324341A (ja) 樹脂モールド方法および樹脂モールド装置
JP5143617B2 (ja) 圧縮成形方法
WO2018139631A1 (fr) Dispositif d'étanchéité en résine et procédé d'étanchéité en résine
TWI629163B (zh) 沖壓機構、沖壓方法、壓縮成形裝置以及壓縮成形方法
JP5413165B2 (ja) 樹脂モールド型コンデンサの製造方法およびこの製造方法に用いられる成形金型
JP6888114B2 (ja) 蓋体および電子装置
JP2019214127A (ja) 電子部品モジュールの外装樹脂成形方法
WO2015140923A1 (fr) Procédé pour fabriquer une garniture étanche vis-à-vis de l'eau, et garniture étanche vis-à-vis de l'eau fabriquée par ce même procédé
WO2019235925A1 (fr) Procédé, feuille, partie de moule et couche de surface d'encapsulation de composants électroniques montés sur un support au moyen d'espaces d'expansion absorbant des déplacements locaux de couche de feuille
JP6693376B2 (ja) モータの製造方法
JP5353588B2 (ja) 樹脂モールド型コンデンサの製造方法
JP2014192300A (ja) 放熱基板の製造方法
JP2012043582A (ja) 貼合構造体及びその製造方法
KR101799626B1 (ko) 반도체 소자 몰딩 장치
KR101015586B1 (ko) 전자 부품 몰딩 장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13761761

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2014504751

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13761761

Country of ref document: EP

Kind code of ref document: A1