WO2012066902A1 - Procédé pour la fabrication d'une feuille de scellement en résine - Google Patents

Procédé pour la fabrication d'une feuille de scellement en résine Download PDF

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Publication number
WO2012066902A1
WO2012066902A1 PCT/JP2011/074401 JP2011074401W WO2012066902A1 WO 2012066902 A1 WO2012066902 A1 WO 2012066902A1 JP 2011074401 W JP2011074401 W JP 2011074401W WO 2012066902 A1 WO2012066902 A1 WO 2012066902A1
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WO
WIPO (PCT)
Prior art keywords
resin sheet
sealing resin
sealing
pressure plate
resin body
Prior art date
Application number
PCT/JP2011/074401
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English (en)
Japanese (ja)
Inventor
有彌 井田
裕樹 北山
彰夫 勝部
渡部　浩司
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201180055141.8A priority Critical patent/CN103221191B/zh
Publication of WO2012066902A1 publication Critical patent/WO2012066902A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers

Definitions

  • the present invention relates to a method for producing a sealing resin sheet for sealing electronic components mounted on a substrate.
  • An electronic component module in which an electronic component is mounted on a substrate has a sealing resin layer that seals the electronic component mounted on the substrate in order to protect the electronic component from heat, humidity, and the like.
  • a method for forming a sealing resin layer on a substrate a liquid resin is applied to a substrate on which electronic components are mounted, and the applied resin is heated and pressurized.
  • a semi-cured sealing is applied to the substrate on which electronic components are mounted.
  • FIG. 11 is a schematic view showing a method for manufacturing an electronic component module in which a sealing resin layer is formed using a sealing resin sheet.
  • a circuit pattern 91 is formed by etching a Cu foil or the like attached on the surface of the support layer 90 as an electrode.
  • a conductive adhesive 92 is applied to a predetermined position of the circuit pattern 91, and an electronic component 93 is mounted on the conductive adhesive 92 and placed in an oven to cure the conductive adhesive 92.
  • a semi-cured sealing resin sheet 94 is placed on the electronic component 93 mounting side of the support layer 90.
  • the support layer 90 on which the circuit pattern 91 is formed and another support layer 96 on the surface of which the circuit pattern 95 is formed are pressure-bonded, and the semi-cured sealing resin sheet 94 is temporarily cured.
  • the electronic component 93 is embedded in the sealing resin sheet 94 by pressure bonding, and the circuit patterns 91 and 95 are embedded and held near both the front and back surfaces of the sealing resin sheet 94.
  • the support layers 90 and 96 are peeled off from the temporarily cured sealing resin sheet 94.
  • the electronic component module is manufactured through a process of curing the temporarily cured sealing resin sheet 94 and forming a sealing resin layer.
  • FIG. 12 is a schematic diagram illustrating a method for producing a sealing resin sheet disclosed in Patent Document 1.
  • a liquid epoxy resin composition (resin) 102 is applied to the upper surface of a support film (protective film) 103 by a coating apparatus 101, and the applied epoxy resin composition 102 is made into a semi-cured state, and then released.
  • a method of manufacturing a sealing resin sheet by disposing a release film 105 fed from a mold film roller 104 on an upper surface of an epoxy resin composition 102 and pressing the same with a pressing roller 106 is disclosed.
  • FIG. 13 is a cross-sectional view of a sealing resin sheet manufactured by the method for manufacturing a sealing resin sheet disclosed in Patent Document 1.
  • silica 131 is precipitated in the sealing resin sheet 94 manufactured by the method for manufacturing a sealing resin sheet disclosed in Patent Document 1.
  • the sealing resin sheet 94 has mechanical strength due to the presence of the silica 131.
  • physical property values such as a linear expansion coefficient and an elastic modulus vary depending on a place. There was also a problem that the mechanical strength became unstable.
  • this invention is made
  • a method for producing a sealing resin sheet according to the present invention is a method for producing a sealing resin sheet for sealing an electronic component mounted on a substrate.
  • a liquid resin is put into a mold, and a resin body is formed in a semi-cured state by heat treatment, and the formed resin body is heated at a temperature lower than the curing temperature and pressurized to be stretched.
  • expensive equipment such as a coating device and a release film roller becomes unnecessary, and the manufacturing cost can be reduced.
  • the resin sheet for sealing is manufactured by pressurizing and stretching a resin body having a thickness larger than the film thickness of the resin sheet for sealing, even when a resin sheet for sealing having a large film thickness is manufactured.
  • a sealing resin sheet having a desired film thickness can be produced without requiring a step of bonding a plurality of sealing resin sheets.
  • the resin body in the second step, is sandwiched and pressed by two pressure plates, and the two pressure plates are used for the sealing. It is also preferable to sandwich a spacer for adjusting the film thickness of the resin sheet.
  • the two pressure plates also sandwich the spacer for adjusting the film thickness of the sealing resin sheet, so that the resin body until the film thickness of the sealing resin sheet becomes the same as the height of the spacer. Can be sandwiched between two pressure plates and pressurized, and a sealing resin sheet having a uniform film thickness can be produced.
  • an outer frame forming an outer edge of the sealing resin sheet is formed by the spacer.
  • the outer frame that forms the outer edge of the sealing resin sheet is formed by the spacer, so that the resin body can be stretched until it contacts the spacer. And since the outer edge of the resin sheet for sealing can be formed with a spacer, it is not necessary to cut an unnecessary part after manufacture.
  • the resin body and the spacer are put in a bag having gas barrier properties by being sandwiched between two pressure plates. It is preferable to apply pressure to the resin body in the bag, which has been reduced in pressure and sealed, and opened to the atmosphere from the outside of the bag, and further to heat.
  • the resin body and the spacer are put in a bag having gas barrier properties by being sandwiched between two pressure plates, the inside of the bag is sealed under reduced pressure, and the resin body in the bag sealed under reduced pressure is sealed.
  • the manufacturing cost can be reduced compared to the case of using an expensive vacuum press or the like.
  • the resin body and the spacer are put into a bag having gas barrier properties by being sandwiched between two pressure plates, and the inside of the bag is sealed under reduced pressure, so that there is no problem that air bubbles enter the sealing resin sheet. .
  • a protective film is provided between at least one of the pressure plate and the resin body, and the resin body is pressurized. preferable.
  • a protective film is provided between at least one pressure plate and the resin body, and the resin body is pressurized. Therefore, a sealing resin sheet provided with a protective film on at least one surface can be manufactured and sealed. While protecting the surface of the resin sheet for a stop, handling of the resin sheet for sealing can be made easy.
  • a method for manufacturing a sealing resin sheet according to the present invention includes a sealing resin sheet manufacturing method for sealing an electronic component mounted on a substrate.
  • a second step of applying pressure with the pressure plate is provided.
  • an outer frame that forms the outer edge of the sealing resin sheet is disposed on one surface of the first pressure plate, and liquid resin is supplied onto one surface of the first pressure plate surrounded by the disposed outer frame.
  • the liquid resin supplied on one surface of the first pressure plate surrounded by the outer frame is heated at a temperature at which it is in a semi-cured state, and the second pressure located above the first pressure plate and the first pressure plate. Since pressure is applied with the pressure plate, expensive equipment such as a coating device and a release film roller is not required, and the manufacturing cost can be reduced. Further, since the film thickness of the sealing resin sheet to be manufactured can be adjusted by the height of the outer frame, a plurality of sealing resins can be used even when manufacturing a sealing resin sheet having a large film thickness. A sealing resin sheet having a desired film thickness can be produced without requiring a step of laminating the sheets.
  • a liquid resin is put into a mold, a resin body is formed in a semi-cured state by heat treatment, and the formed resin body is heated at a temperature lower than the curing temperature and is pressed and stretched.
  • expensive equipment such as a coating device and a release film roller is not required, and the manufacturing cost can be reduced.
  • the resin sheet for sealing is manufactured by pressurizing and stretching a resin body having a thickness larger than the film thickness of the resin sheet for sealing, even when a resin sheet for sealing having a large film thickness is manufactured.
  • a sealing resin sheet having a desired film thickness can be produced without requiring a step of bonding a plurality of sealing resin sheets.
  • the resin is stirred by a small vortex generated at the stretched tip portion of the resin body, and the resin sheet for sealing dispersed evenly without the silica being settled and unevenly distributed. It can be manufactured.
  • the outer frame which forms the outer edge of the resin sheet for sealing on one surface of a 1st pressurization board is arrange
  • the film thickness of the sealing resin sheet to be manufactured can be adjusted by the height of the outer frame, a plurality of sealing resins can be used even when manufacturing a sealing resin sheet having a large film thickness.
  • a sealing resin sheet having a desired film thickness can be produced without requiring a step of laminating the sheets.
  • FIG. 1 It is the schematic which shows the manufacturing method of the electronic component module which forms a sealing resin layer using the resin sheet for sealing. It is the schematic which shows the manufacturing method of the resin sheet for sealing disclosed by patent document 1.
  • FIG. It is sectional drawing of the resin sheet for sealing manufactured with the manufacturing method of the resin sheet for sealing disclosed by patent document 1.
  • FIG. 1 is a schematic diagram showing a configuration of a sealing resin sheet according to Embodiment 1 of the present invention.
  • the sealing resin sheet 1 is provided with protective films 2 on both sides.
  • the sealing resin sheet 1 is a resin sheet for sealing an electronic component mounted on a substrate, and is a semi-cured thermosetting resin (for example, epoxy resin).
  • the sealing resin sheet 1 is provided with protective films 2 on both sides for easy handling.
  • the protective film 2 may be made of a resin material that can withstand the curing temperature of the sealing resin sheet 1.
  • the protective film 2 is in the form of a film or a thin sheet, and is, for example, PET (polyethylene terephthalate), PTFE (polytetrafluoroethylene), or the like. In addition, it is not limited to when the protective film 2 is provided on both surfaces of the sealing resin sheet 1, and the protective film 2 may be provided only on one surface (at least one surface). Moreover, the resin sheet 1 for sealing which provided the conductor layer can also be manufactured by forming the protective film 2 as a conductor layer using the material which has electroconductivity.
  • FIG. 2 is a schematic view showing a method for producing the sealing resin sheet 1 according to Embodiment 1 of the present invention.
  • a cylindrical mold 20 is prepared, a liquid resin 21 is put into the mold 20, and a resin body 22 is formed in a semi-cured state by heat treatment.
  • the thickness of the formed resin body 22 is larger than the thickness of the sealing resin sheet 1 to be manufactured.
  • the liquid resin 21 is an epoxy resin containing silica or alumina. Silica or alumina is contained in order to increase the mechanical strength of the sealing resin sheet 1.
  • the resin body 22 may be formed with a vertically long cylindrical mold 20 and cut to form the resin body 22 having a desired thickness.
  • the heat treatment for making the liquid resin 21 in a semi-cured state varies depending on the material of the liquid resin 21, for example, heating in an oven or the like at 40 ° C. to 160 ° C. for 5 to 120 minutes.
  • a pressure plate 23 is prepared, a spacer 24 for adjusting the film thickness of the sealing resin sheet 1 is arranged on one surface of the pressure plate 23, and the arranged spacer 24.
  • the protective film 2 is placed on one surface of the pressure plate 23 surrounded by.
  • the protective film 2 and the spacer 24 are subjected to release treatment so that they can be separated from the sealing resin sheet 1 after being manufactured.
  • a release treatment is performed on the pressure plate 23.
  • the material used for the pressure plate 23 and the spacer 24 may be stainless steel (SUS), aluminum (Al), PET, PTFE, or the like as long as the shape can be maintained even when pressed.
  • the resin body 22 is placed on a substantially central portion on the protective film 2.
  • the thickness of the resin body 22 is larger than the height of the spacer 24.
  • the protective film 2 is placed on the resin body 22.
  • the protective film 2 placed on the resin body 22 has the same shape and the same material as the protective film 2 placed on one surface of the pressure plate 23, but the protective film 2 placed on one surface of the pressure plate 23 Different shapes or different materials may be used.
  • the protective film 2 placed on the resin body 22 is also subjected to mold release treatment so that it can be separated from the sealing resin sheet 1 after production.
  • the semi-cured resin body 22 is heated at a temperature lower than the curing temperature (for example, 160 ° C.) (heating time is 120 minutes or less), and is pressurized and stretched.
  • the resin sheet 1 for sealing is manufactured.
  • the sealing resin sheet 1 provided with the protective film 2 is manufactured by sandwiching and pressing the resin body 22 sandwiched between the two protective films 2 with the two pressure plates 23 and 25. Can do.
  • the two pressure plates 23 and 25 also sandwich the spacer 24 for adjusting the film thickness of the sealing resin sheet 1, so that the film thickness of the sealing resin sheet 1 is the same as the height of the spacer 24.
  • the resin body 22 can be sandwiched and pressed between the two pressure plates 23 and 25, and the sealing resin sheet 1 having a uniform film thickness can be manufactured.
  • the sealing resin sheet 1 having a desired film thickness can be manufactured.
  • the pressure plate 25 has the same shape as the pressure plate 23 and is the same material, but may have a different shape from the pressure plate 23 or a different material.
  • the protective resin sheet 1 is not provided on the sealing resin sheet 1, the pressure plate 25 is subjected to a release treatment so that it can be separated from the sealing resin sheet 1 after manufacturing.
  • the resin body 22 can be stretched until it contacts the spacer 24. And since the outer edge of the resin sheet 1 for sealing can be formed with the spacer 24, it is not necessary to cut
  • FIG. 3 is a schematic view showing the configuration of a vacuum press used in the method for manufacturing the sealing resin sheet 1 according to Embodiment 1 of the present invention.
  • a vacuum press 30 shown in FIG. 3 includes a resin body 22 and a spacer 24 sandwiched between two protective films 2, sandwiched between two pressure plates 23 and 25, and sandwiched between two press plates 31. 22 is pressurized.
  • the vacuum press 30 can create a vacuum state (for example, 5000 Pa or less). By pressurizing the resin body 22 in a vacuum state, the problem that bubbles enter the sealing resin sheet 1 does not occur.
  • the sealing resin sheet 1 provided with the protective film 2 can be manufactured by releasing the air from the vacuum state to the atmosphere and taking out the resin body 22 that has been pressurized and stretched from the vacuum press machine 30 after cooling.
  • a press that presses in the atmospheric state instead of the vacuum press 30 may be used.
  • the resin body 22 can be pressurized while adjusting the film thickness of the sealing resin sheet 1 with the vacuum press machine 30, it is necessary to sandwich the spacer 24 between the two pressure plates 23 and 25. Absent.
  • FIG. 4 is a schematic diagram showing the configuration of another pressurizing means used in the method for manufacturing the sealing resin sheet 1 according to Embodiment 1 of the present invention.
  • the pressurizing means shown in FIG. 4 includes a resin body 22 and a spacer 24 sandwiched between two protective films 2, sandwiched between two pressurizing plates 23 and 25, and a laminated pack (bag) 40 having gas barrier properties. Then, the inside of the laminate pack 40 is decompressed and sealed with a decompression pack device (not shown). Pressure is applied from the outside of the laminate pack 40 to the resin body 22 in the laminate pack 40 which is sealed by reducing the pressure, and further heat is applied.
  • the manufacturing cost of the sealing resin sheet 1 can be suppressed as compared with the case where the expensive vacuum press machine 30 is used. Further, since the resin body 22 and the spacer 24 sandwiched between the two pressure plates 23 and 25 are put in a laminate pack 40 having gas barrier properties, and the inside of the laminate pack 40 is decompressed and sealed, the sealing resin sheet 1 There is no problem that air bubbles enter into. Furthermore, it becomes possible to cool the resin body 22 in the laminated pack 40 sealed by reducing the pressure while applying pressure, and the shape of the sealing resin sheet 1 can be maintained.
  • the liquid resin 21 is placed in the mold 20 and the resin body 22 is formed in a semi-cured state by heat treatment. Since the resin body 22 is heated at a temperature lower than the curing temperature and is pressed and stretched, expensive equipment such as a coating apparatus and a release film roller is not required in addition to the pressurizing means that pressurizes the resin body 22, and the manufacturing cost is reduced. Can be suppressed. Moreover, since the sealing resin sheet 1 is manufactured by pressurizing and stretching the resin body 22 having a thickness larger than the thickness of the sealing resin sheet 1, the sealing resin sheet 1 having a large thickness is manufactured. Even so, the step of bonding the plurality of sealing resin sheets 1 is not required, and the sealing resin sheet 1 having a desired film thickness can be manufactured.
  • the sealing resin sheet 1 provided with the protective film 2 on both sides is manufactured. It is possible to protect the surface of the sealing resin sheet 1 and to facilitate the handling of the sealing resin sheet 1.
  • FIG. 5 is a schematic diagram showing another configuration of the pressure plate and the spacer used in the method for manufacturing the sealing resin sheet 1 according to Embodiment 1 of the present invention.
  • a resin body sandwiched between two protective films 2 by a flat pressure plate 23 and a convex pressure plate 25 a fitted to a spacer 24 arranged on one surface of the pressure plate 23. 22 and the spacer 24 are sandwiched.
  • the convex pressure plate 25a the resin body 22 can be further pressurized, and the high-density sealing resin sheet 1 can be manufactured.
  • FIG. 6 is a schematic view showing still another configuration of the pressure plate and the spacer used in the method for manufacturing the sealing resin sheet 1 according to Embodiment 1 of the present invention.
  • a resin body 22 sandwiched between two protective films 2 is sandwiched between a pressure plate 23 a integrally formed with a spacer and a pressure plate and a flat pressure plate 25.
  • a step of arranging a spacer on one surface of the pressure plate is not necessary, and the manufacturing cost of the sealing resin sheet 1 can be suppressed.
  • the protective film 2 is mounted along the shape of the pressure plate 23a and the pressure plate 25, the pressure plate 23a and the pressure plate 25 and the resin body 22 are not in direct contact.
  • the depth of the recessed part formed in the pressurization plate 23a which integrally formed the spacer and the pressurization plate and the film thickness of the sealing resin sheet 1 are designed regardless of the thickness of the protective film 2. be able to.
  • FIG. 7 is a schematic view showing still another configuration of the pressure plate and the spacer used in the method for manufacturing the sealing resin sheet 1 according to Embodiment 1 of the present invention.
  • the resin body 22 and the spacer 24 sandwiched between the two protective films 2 are sandwiched between two flat pressure plates 23 and 25.
  • a spacer 24 is disposed on the protective film 2 placed on one surface of the pressure plate 23. Since the spacer 24 is disposed on the protective film 2 placed on one surface of the pressure plate 23, the pressure plate 23 and the spacer 24 can be easily separated.
  • the silica 131 in the sealing resin sheet 94 is unevenly distributed on the bottom surface side. This is because the silica 131 settles between application of the liquid resin and curing.
  • the silica 131 is evenly dispersed.
  • FIG. 8 is a cross-sectional view of the sealing resin sheet 1 manufactured by the manufacturing method of the sealing resin sheet 1 according to Embodiment 1 of the present invention. As shown in FIG. 8, the silica 131 in the sealing resin sheet 1 is evenly dispersed. When the silica 131 is evenly dispersed, the mechanical strength of the encapsulating resin sheet 1 is stabilized.
  • FIG. 9 is a schematic diagram showing a state in the sealing resin sheet 1 when the resin body 22 is pressurized and heated.
  • a small vortex 132 is generated in the semi-cured resin body 22 at the tip portion stretched by pressurization and heating.
  • the bubbles 133 are guided to the outside of the resin body 22 by the generated small vortex 132.
  • the resin is stirred by the small vortex 132, and the resin body 22 can be cured in a state where the silica 131 is settled and dispersed without being unevenly distributed.
  • the silica 131 in the sealing resin sheet 1 is evenly dispersed.
  • FIG. 10 is a schematic view illustrating a method for manufacturing the sealing resin sheet 1 according to Embodiment 2 of the present invention.
  • a pressure plate (first pressure plate) 81 is prepared, and an outer frame 82 that forms the outer edge of the sealing resin sheet 1 is disposed on one surface of the pressure plate 81.
  • the protective film 2 is placed on one surface of the pressure plate 81 surrounded by the arranged outer frame 82.
  • the protective film 2 and the outer frame 82 are subjected to a mold release process so that they can be separated from the sealing resin sheet 1 after being manufactured.
  • the pressure plate 81 is subjected to a release treatment.
  • the material used for the pressure plate 81 and the outer frame 82 may be stainless steel (SUS), aluminum (Al), PET, PTFE, or the like as long as the shape can be maintained even when pressed.
  • the liquid resin 83 is supplied onto one surface of the pressure plate 81 surrounded by the arranged outer frame 82 with a dispenser or the like.
  • the protective film 2 is placed on the liquid resin 83 supplied onto one surface of the pressure plate 81 surrounded by the outer frame 82.
  • the protective film 2 placed on the liquid resin 83 has the same shape as the protective film 2 placed on one surface of the pressure plate 81 and the same material, but the protective film 2 placed on one surface of the pressure plate 81 Different shapes or different materials may be used.
  • the liquid resin 83 sandwiched between the two protective films 2 is heated at a temperature at which it becomes a semi-cured state (for example, 160 ° C.) (heating time is 120 minutes or less).
  • the sealing resin sheet 1 is manufactured by applying pressure with the pressure plate 81 and the pressure plate (second pressure plate) 84 positioned above the pressure plate 81. Since the outer frame 82 arranged on one surface of the pressure plate 81 also functions as a spacer for adjusting the film thickness of the sealing resin sheet 1, a desired film thickness can be obtained by changing the height of the outer frame 82.
  • the sealing resin sheet 1 can be manufactured.
  • the pressure plate 84 has the same shape as the pressure plate 81 and is made of the same material, but may have a different shape from the pressure plate 81 or a different material.
  • the pressurizing unit that pressurizes the liquid resin 83 with the two pressurizing plates 81 and 84 the same pressurizing unit as that of the first embodiment (for example, the vacuum press machine 30, the laminate pack 40 and the decompression pack apparatus) is used. be able to.
  • the manufacturing method of the sealing resin sheet 1 according to Embodiment 2 of the present invention arranges the outer frame 82 that forms the outer edge of the sealing resin sheet 1 on one surface of the pressure plate 81,
  • the temperature at which the liquid resin 83 is supplied onto one surface of the pressure plate 81 surrounded by the outer frame 82 and the liquid resin 83 supplied onto the one surface of the pressure plate 81 surrounded by the outer frame 82 is in a semi-cured state.
  • the pressure plate 81 and the pressure plate 84 positioned above the pressure plate 81 are used, so that expensive equipment such as a coating device and a release film roller is not required, and the manufacturing cost can be reduced.
  • the film thickness of the sealing resin sheet 1 to be manufactured can be adjusted depending on the height of the outer frame 82, even when the sealing resin sheet 1 having a large film thickness is manufactured, a plurality of sealing resin sheets 1 are manufactured.
  • the sealing resin sheet 1 having a desired film thickness can be produced without requiring a step of bonding the stopping resin sheet 1.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Sealing Material Composition (AREA)

Abstract

La présente invention vise à proposer un procédé pour fabriquer une feuille de scellement en résine, le procédé permettant de fabriquer la feuille de scellement en résine ayant une épaisseur souhaitée à un coût de fabrication réduit. La présente invention est un procédé de fabrication d'une feuille de scellement en résine (1) destinée à sceller un composant électronique monté sur une carte de circuit. Une résine liquide (21) est placée dans un moule (20), portée à un état semi-durci par traitement thermique et transformée en un corps de résine (22). Le corps de résine formé (22) est chauffé à une température inférieure à la température de durcissement, mis sous pression et étiré. L'épaisseur du corps de résine (22) est supérieure à l'épaisseur de la feuille de scellement en résine (1).
PCT/JP2011/074401 2010-11-17 2011-10-24 Procédé pour la fabrication d'une feuille de scellement en résine WO2012066902A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201180055141.8A CN103221191B (zh) 2010-11-17 2011-10-24 密封用树脂片材的制造方法

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JP2010-257081 2010-11-17
JP2010257081 2010-11-17
JP2011-226956 2011-10-14
JP2011226956 2011-10-14

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WO2016204149A1 (fr) * 2015-06-18 2016-12-22 日東電工株式会社 Feuille

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WO2013129307A1 (fr) * 2012-03-01 2013-09-06 株式会社村田製作所 Procédé de fabrication de feuille de scellement en résine
JP2014229791A (ja) * 2013-05-23 2014-12-08 日東電工株式会社 封止シート貼付け方法
JP6156085B2 (ja) * 2013-11-14 2017-07-05 株式会社デンソー モールドパッケージの製造方法
EP3388143B1 (fr) * 2017-04-10 2019-10-09 GEMÜ Gebr. Müller Apparatebau GmbH & Co. Kommanditgesellschaft Procédé de fabrication d'une membrane élastomère
JP7094233B2 (ja) * 2019-01-25 2022-07-01 三菱重工業株式会社 ギャップの型取り方法、シムの製造方法、及び型取りキットの製造方法

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JP2006175638A (ja) * 2004-12-21 2006-07-06 Sainekkusu:Kk 圧縮成形用のシート状樹脂及び圧縮成形方法
JP2010003857A (ja) * 2008-06-20 2010-01-07 Panasonic Corp 熱プレス装置および電子装置の製造方法
JP2010179507A (ja) * 2009-02-04 2010-08-19 Apic Yamada Corp 圧縮成形方法

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JP4799883B2 (ja) * 2005-03-01 2011-10-26 日東電工株式会社 エポキシ樹脂組成物硬化体およびその製法ならびにそれを用いた光半導体装置

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JP2000290471A (ja) * 1999-04-08 2000-10-17 Nitto Denko Corp 封止用樹脂組成物
JP2006175638A (ja) * 2004-12-21 2006-07-06 Sainekkusu:Kk 圧縮成形用のシート状樹脂及び圧縮成形方法
JP2010003857A (ja) * 2008-06-20 2010-01-07 Panasonic Corp 熱プレス装置および電子装置の製造方法
JP2010179507A (ja) * 2009-02-04 2010-08-19 Apic Yamada Corp 圧縮成形方法

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Publication number Priority date Publication date Assignee Title
WO2016204149A1 (fr) * 2015-06-18 2016-12-22 日東電工株式会社 Feuille

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CN103221191B (zh) 2015-08-19
CN103221191A (zh) 2013-07-24
JP2013101990A (ja) 2013-05-23

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