JPH09129659A - Sheetlike resin for sealing semiconductor - Google Patents
Sheetlike resin for sealing semiconductorInfo
- Publication number
- JPH09129659A JPH09129659A JP31011995A JP31011995A JPH09129659A JP H09129659 A JPH09129659 A JP H09129659A JP 31011995 A JP31011995 A JP 31011995A JP 31011995 A JP31011995 A JP 31011995A JP H09129659 A JPH09129659 A JP H09129659A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor
- sheet
- sheetlike
- central part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、成形不良の少ない
半導体封止用シート状樹脂に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet-shaped resin for semiconductor encapsulation with less molding defects.
【0002】[0002]
【従来の技術】近年の半導体装置の品種の増加に伴い、
その製造方法も多岐にわたっている。とりわけ、エポキ
シ樹脂等の熱硬化性樹脂による樹脂封止方法も、移送成
形法以外にポッティング法などその製造方法の種類も増
加している。最近、特開平2-257662号公報のように樹脂
シート或いは薄形の樹脂ペレットを利用した成形法もそ
の一つであり、図5(a)〜(b)に示したように、リ
ードフレーム12にフエイスダウン接続された半導体素
子13を封止する樹脂シート或いは樹脂ペレット10
(以下樹脂ペレットという)が圧縮成形法封止に利用さ
れて、ポッティング封止用樹脂の代替として使用されて
いる。これらの製造法に用いられる樹脂ペレット10
は、図4(a)〜(d)に示したように、一般に四角形
などの目的とするパッケージの形状に対応した形状であ
って、図5(a)における半導体チップ13に対向する
中央部とその周辺部の厚さが同じで、図4(b)の正面
図、同(c)の側面図に示したように、樹脂ペレットが
均一の厚さを有するものである。2. Description of the Related Art With the recent increase in the types of semiconductor devices,
There are various manufacturing methods. In particular, in addition to the transfer molding method, the number of types of manufacturing methods such as the potting method as well as the resin sealing method using a thermosetting resin such as an epoxy resin are increasing. Recently, one of them is a molding method using a resin sheet or thin resin pellets as disclosed in JP-A-2-257662, and as shown in FIGS. 5 (a) and 5 (b), the lead frame 12 is used. Sheet or resin pellet 10 for encapsulating the semiconductor element 13 face-down connected to the
(Hereinafter referred to as resin pellet) is used for compression molding encapsulation and is used as a substitute for the potting encapsulation resin. Resin pellets 10 used in these manufacturing methods
As shown in FIGS. 4A to 4D, is a shape generally corresponding to the shape of the intended package such as a quadrangle, and a central portion facing the semiconductor chip 13 in FIG. The peripheral portion has the same thickness, and as shown in the front view of FIG. 4B and the side view of FIG. 4C, the resin pellet has a uniform thickness.
【0003】[0003]
【発明が解決しようとする課題】しかし、図5(a)に
示したようにこれらの樹脂ペレット10を用いて圧縮成
形を行った場合は、金型11やリードフレーム12や半
導体素子13と樹脂との間に取り込まれた空気或いは樹
脂ペレット10中に含まれる空気を、除去することは大
変困難である。図5(b)に示すようにそのような樹脂
ペレット10で製造された樹脂封止型半導体装置14は
内部ボイドの増加による成形不良が発生しやすいという
欠点があった。However, when compression molding is performed using these resin pellets 10 as shown in FIG. 5A, the mold 11, the lead frame 12, the semiconductor element 13 and the resin are It is very difficult to remove the air taken in between and the air contained in the resin pellet 10. As shown in FIG. 5B, the resin-encapsulated semiconductor device 14 manufactured from such a resin pellet 10 has a defect that defective molding is likely to occur due to an increase in internal voids.
【0004】本発明は、上記の欠点を解消するためにな
されたもので、樹脂ペレットの圧縮成形においても空気
を除去し、内部ボイドによる成形不良を防止した半導体
封止用シート状樹脂を提供しようとするものである。The present invention has been made to solve the above-mentioned drawbacks, and provides a sheet-like resin for semiconductor encapsulation in which air is removed even in compression molding of resin pellets to prevent molding defects due to internal voids. It is what
【0005】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、シート状樹脂の
中央部を突出させ厚くすることによって上記の目的が達
成されることを見いだし、本発明を完成したものであ
る。Means for Solving the Problems As a result of intensive studies to achieve the above-mentioned object, the present inventor has found that the above-mentioned object can be achieved by making the central portion of the sheet-like resin project and thicken it. They have found and completed the present invention.
【0006】即ち、本発明は、半導体封止用のシート状
樹脂において、該シート状樹脂における少なくとも片面
の中央部分を突出させることにより、半導体素子中央に
対応するシート状樹脂中央部が半導体素子周辺に対応す
るシート状樹脂周辺部より厚いことを特徴とする半導体
封止用シート状樹脂である。That is, according to the present invention, in a sheet-shaped resin for semiconductor encapsulation, by projecting the central portion of at least one surface of the sheet-shaped resin, the central portion of the sheet-shaped resin corresponding to the center of the semiconductor element is the periphery of the semiconductor element. The sheet-shaped resin for semiconductor encapsulation is characterized by being thicker than the peripheral portion of the sheet-shaped resin corresponding to.
【0007】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【0008】本発明に用いる樹脂としては、一般に樹脂
封止型半導体装置に使用されている樹脂が使用され、特
に制限されるものではない。具体的な樹脂としては、エ
ポキシ樹脂、ポリイミド樹脂等の熱硬化性樹脂、ポリフ
ェニレンサルファイド等の熱可塑性樹脂およびこれらの
変性樹脂、樹脂組成物等が使用される。As the resin used in the present invention, a resin generally used in a resin-encapsulated semiconductor device is used and is not particularly limited. As a specific resin, a thermosetting resin such as an epoxy resin or a polyimide resin, a thermoplastic resin such as polyphenylene sulfide, a modified resin thereof, a resin composition or the like is used.
【0009】次に本発明を図面を用いて説明する。Next, the present invention will be described with reference to the drawings.
【0010】図1は、第一実施例の半導体封止用シート
状樹脂を示す図で、分図(a)は平面図、同(b)正面
図、同(c)は右側面図、同(d)は斜視図である。図
1(b)および図1(c)で示したように、半導体封止
用シート状樹脂(以下単にシートともいう)3の周辺部
2から中央部1がなだらかに厚くなっている。図2
(a)〜(d)には本発明の第二実施例である半導体封
止用シート状樹脂を示す図である。図2の場合もシート
3の中央部1が周辺部2よりも厚くなっているが、この
場合はシート3の外周の周辺部2はほぼ均一な厚さを有
している部分4があるが、周辺部2の素子チップの周辺
は均一厚さ部分4から突然厚くなっている。そして厚く
なっている周辺部2より、素子チップの中央に対応する
中央部1がさらに厚くなっている。この状態を図2
(b)正面図および図2(c)右側面図で示した。FIG. 1 is a view showing a sheet-shaped resin for semiconductor encapsulation of a first embodiment, wherein FIG. 1 (a) is a plan view, FIG. 1 (b) is a front view, and FIG. 1 (c) is a right side view. (D) is a perspective view. As shown in FIGS. 1B and 1C, a peripheral portion 2 to a central portion 1 of a semiconductor-sealing sheet-shaped resin (hereinafter also simply referred to as a sheet) 3 is gently thickened. FIG.
(A)-(d) is a figure which shows the sheet-shaped resin for semiconductor sealing which is a 2nd Example of this invention. In the case of FIG. 2 as well, the central portion 1 of the sheet 3 is thicker than the peripheral portion 2, but in this case, the peripheral portion 2 of the outer periphery of the sheet 3 has a portion 4 having a substantially uniform thickness. The periphery of the element chip in the peripheral portion 2 is suddenly thickened from the uniform thickness portion 4. The central portion 1 corresponding to the center of the element chip is thicker than the thicker peripheral portion 2. This state is shown in FIG.
2B is a front view and FIG. 2C is a right side view.
【0011】図1および図2において、シート3の片面
のみ中央部1が周辺部2よりも厚くなっているものを説
明したが、本発明においては両面とも中央部1が周辺部
2よりも厚くなっているものも本発明の範囲に含まれる
ものである。即ち、少なくとも片面が中央部1が周辺部
2よりも厚くなっていればよい。1 and 2, the central portion 1 is thicker than the peripheral portion 2 only on one side of the sheet 3, but in the present invention, the central portion 1 is thicker than the peripheral portion 2 on both sides. Those that are included in the scope of the present invention. That is, it is sufficient that the central portion 1 is thicker than the peripheral portion 2 on at least one side.
【0012】これらのシートの製造方法については特に
限定するものではなく、たとえば臼部と杵部から構成さ
れる打錠金型の杵部の打錠面中央部に窪みを設け、樹脂
粉末をこの金型を用いて圧縮成形して製造することがで
きる。或いは、軟化させた樹脂板を平坦な台において、
窪みを設けた板を押し当て、その後、切断して中央部1
が周辺部2よりも厚くなっているシートを製造すること
ができる。The method for producing these sheets is not particularly limited. For example, a depression is provided in the center of the tableting surface of the punch of a tableting die composed of a die and a punch, and resin powder is It can be manufactured by compression molding using a mold. Or, the softened resin plate on a flat table,
Press the plate with the depression and then cut to cut the central part 1
It is possible to manufacture a sheet in which is thicker than the peripheral portion 2.
【0013】こうして製造したシートを用いて、図3
(a)に示したように、半導体素子封止の圧縮成形を行
うことができる。リードフレーム5に接着されている半
導体素子6を、その両面から中央部1が周辺部2よりも
厚くなっているシート3で挾み、それ全体を金型7を用
いて圧縮成形して図3(b)のような樹脂封止型半導体
装置8を製造することができる。Using the sheet manufactured in this way, FIG.
As shown in (a), compression molding for semiconductor element encapsulation can be performed. The semiconductor element 6 adhered to the lead frame 5 is sandwiched from both sides by a sheet 3 having a central portion 1 thicker than a peripheral portion 2, and the whole thereof is compression-molded by using a die 7 and The resin-encapsulated semiconductor device 8 as shown in (b) can be manufactured.
【0014】[0014]
【作用】本発明の半導体封止用シート状樹脂を使用する
ことによって、内部ボイドの発生のない信頼性の高い樹
脂封止型半導体装置を製造することができる。即ち、中
央部が周辺部よりも厚くなっている半導体封止用シート
状樹脂を使用することによって、金型の締結の際、半導
体封止用シート状樹脂の最も厚い部分である中央部から
溶融し始め、樹脂が中央部から周辺部に流動し、これに
巻き込まれた空気は、周辺に押し出されて圧縮成形され
る。その結果、内部ボイドのない、樹脂封止型半導体装
置を製造できる。By using the sheet-shaped resin for semiconductor encapsulation of the present invention, it is possible to manufacture a highly reliable resin-encapsulated semiconductor device without the generation of internal voids. That is, by using the semiconductor-sealing sheet-shaped resin whose central portion is thicker than the peripheral portion, when the mold is fastened, the semiconductor-sealing sheet-shaped resin melts from the central portion, which is the thickest portion. Then, the resin flows from the central part to the peripheral part, and the air caught in the resin is extruded to the peripheral part and compression-molded. As a result, a resin-sealed semiconductor device without internal voids can be manufactured.
【0015】[0015]
【実施例】次に本発明を実施例によって説明する。Next, the present invention will be described by way of examples.
【0016】実施例 打錠用金型を用いて、片面中央部に直径15mm、中心高
さ0.5 mmの凸部を有する20mm×1.0 mm(中央部は
1.5 mm)のエポキシ樹脂を主成分とする半導体封止用
シート状樹脂を製造した。Example Using a tableting die, 20 mm × 1.0 mm having a convex part with a diameter of 15 mm and a central height of 0.5 mm in the central part of one side (the central part is
A sheet-shaped resin for semiconductor encapsulation containing 1.5 mm of epoxy resin as a main component was manufactured.
【0017】比較例 打錠用金型を用いて、片面に凸部を持たない両面平坦な
20mm×20mm×1.0mmのエポキシ樹脂を主成分とす
る半導体封止用シート状樹脂を製造した。Comparative Example A tableting die was used to flatten both sides without any protrusions.
A 20 mm × 20 mm × 1.0 mm epoxy resin-based sheet material for semiconductor encapsulation was manufactured.
【0018】実施例および比較例で製造した半導体封止
用シート状樹脂を用いて半導体素子付きリードフレーム
を2 枚の半導体封止用シート状樹脂で凸部が半導体素子
の反対側を向くように挾み込み、加熱加圧一体に圧縮成
形して20mm×20mm×2.2mmの樹脂封止型半導体装
置を製造した。これらの樹脂封止型半導体装置の表面上
のボイドと、表面を0.5 mmの深さまで研磨して内部ボ
イドを調査した。その結果を表1に示したが、本発明の
特性が優れており、本発明の効果を確認することができ
た。Using the sheet resin for semiconductor encapsulation manufactured in the examples and comparative examples, the lead frame with a semiconductor element is made of two sheet resin for semiconductor encapsulation so that the convex portion faces the opposite side of the semiconductor element. A resin-encapsulated semiconductor device having a size of 20 mm × 20 mm × 2.2 mm was manufactured by sandwiching and compression-molding integrally with heating and pressing. The voids on the surface of these resin-sealed semiconductor devices and the internal voids were investigated by polishing the surface to a depth of 0.5 mm. The results are shown in Table 1, and the characteristics of the present invention were excellent, and the effects of the present invention could be confirmed.
【0019】[0019]
【表1】 *1 :表面に発生した0.5 mm以上の大きさの樹脂封止型半導体装置1個当りの ボイド数を調査した。 *2 :内部に発生した0.5 mm以上の大きさの樹脂封止型半導体装置1個当りの ボイド数を調査した。[Table 1] * 1: The number of voids per resin-sealed semiconductor device with a size of 0.5 mm or more generated on the surface was investigated. * 2: The number of voids per resin-sealed semiconductor device with a size of 0.5 mm or more generated inside was investigated.
【0020】[0020]
【発明の効果】以上の説明および表1から明らかなよう
に、本発明の半導体封止用シート状樹脂は圧縮成形の封
止おいて空気が除去され、内部ボイドによる成形不良を
防止したもので、このシート状樹脂を使用することによ
って信頼性の高い樹脂封止型半導体装置を製造すること
ができる。As is clear from the above description and Table 1, the sheet-shaped resin for semiconductor encapsulation of the present invention is one in which air is removed during compression molding and molding defects due to internal voids are prevented. By using this sheet-shaped resin, a highly reliable resin-sealed semiconductor device can be manufactured.
【図1】本発明の半導体封止用シート状樹脂の一実施例
を示す図で、分図(a)は平面図、同(b)は正面図、
同(c)は右側面図、同(d)は斜視図である。1A and 1B are views showing an embodiment of a sheet-shaped resin for semiconductor encapsulation of the present invention, in which FIG. 1A is a plan view, FIG. 1B is a front view,
The same (c) is a right side view and the same (d) is a perspective view.
【図2】本発明の半導体封止用シート状樹脂の他の施例
を示す図で、分図(a)は平面図、同(b)は正面図、
同(c)は右側面図、同(d)は斜視図である。2A and 2B are views showing another embodiment of the sheet-shaped resin for semiconductor encapsulation of the present invention, in which FIG. 2A is a plan view and FIG. 2B is a front view.
The same (c) is a right side view and the same (d) is a perspective view.
【図3】図3(a)は、図2の半導体封止用シート状樹
脂を用いた圧縮成形の断面図、図3(b)は、得られた
樹脂封止型半導体装置の正面図である。3 (a) is a cross-sectional view of compression molding using the sheet-shaped resin for semiconductor encapsulation of FIG. 2, and FIG. 3 (b) is a front view of the obtained resin-encapsulated semiconductor device. is there.
【図4】従来の樹脂ペレットを示す図で、分図(a)は
平面図、同(b)は正面図、同(c)は右側面図、同
(d)は斜視図である。4A and 4B are views showing a conventional resin pellet, in which FIG. 4A is a plan view, FIG. 4B is a front view, FIG. 4C is a right side view, and FIG. 4D is a perspective view.
【図5】図5(a)は、図4の樹脂ペレットを用いた圧
縮成形の断面図、図5(b)は得られた樹脂封止型半導
体装置の正面図である。5 (a) is a sectional view of compression molding using the resin pellet of FIG. 4, and FIG. 5 (b) is a front view of the obtained resin-encapsulated semiconductor device.
1 中央部 2 周辺部 3 半導体封止用シート状樹脂 4 周辺部の均一厚さ部分 5,12 リードフレーム 6,13 半導体素子 7,11 金型 8,14 樹脂封止型半導体装置 10 樹脂ペレット DESCRIPTION OF SYMBOLS 1 Central part 2 Peripheral part 3 Sheet resin for semiconductor encapsulation 4 Uniform thickness part of peripheral part 5,12 Lead frame 6,13 Semiconductor element 7,11 Mold 8,14 Resin encapsulation type semiconductor device 10 Resin pellet
Claims (1)
該シート状樹脂における少なくとも片面の中央部分を突
出させることにより、半導体素子中央に対応するシート
状樹脂中央部が半導体素子周辺に対応するシート状樹脂
周辺部より厚いことを特徴とする半導体封止用シート状
樹脂。1. A sheet-shaped resin for encapsulating a semiconductor,
By enlarging at least a central portion of one surface of the sheet-shaped resin, a central portion of the sheet-shaped resin corresponding to the center of the semiconductor element is thicker than a peripheral portion of the sheet-shaped resin corresponding to the periphery of the semiconductor element. Sheet resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31011995A JPH09129659A (en) | 1995-11-02 | 1995-11-02 | Sheetlike resin for sealing semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31011995A JPH09129659A (en) | 1995-11-02 | 1995-11-02 | Sheetlike resin for sealing semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09129659A true JPH09129659A (en) | 1997-05-16 |
Family
ID=18001413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31011995A Pending JPH09129659A (en) | 1995-11-02 | 1995-11-02 | Sheetlike resin for sealing semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09129659A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007196586A (en) * | 2006-01-27 | 2007-08-09 | Nitto Denko Corp | Mold regenerating sheet |
JP2007196587A (en) * | 2006-01-27 | 2007-08-09 | Nitto Denko Corp | Mold regenerating sheet |
JP2008132759A (en) * | 2006-10-23 | 2008-06-12 | Nitto Denko Corp | Sheet for regenerating mold |
JP2008143144A (en) * | 2006-12-13 | 2008-06-26 | Nitto Denko Corp | Sheet for mold reproduction |
WO2009093109A1 (en) | 2008-01-22 | 2009-07-30 | Nxp B.V. | Method for manufacturing a microelectronic package comprising at least one microelectronic device |
JP2013006406A (en) * | 2011-05-20 | 2013-01-10 | Nitto Denko Corp | Resin kneaded material and sheet |
KR101296981B1 (en) * | 2006-01-27 | 2013-08-14 | 히타치가세이가부시끼가이샤 | Sheet for recycling mold |
JP2014103176A (en) * | 2012-11-16 | 2014-06-05 | Shin Etsu Chem Co Ltd | Sealing material with support base material, substrate having sealed semiconductor element mounted thereon, wafer having sealed semiconductor element formed thereon, semiconductor device, and method for manufacturing semiconductor device |
CN104425292A (en) * | 2013-09-11 | 2015-03-18 | 株式会社东芝 | Semiconductor device manufacturing method, semiconductor manufacturing apparatus and sheet-shaped resin for resin sealing |
-
1995
- 1995-11-02 JP JP31011995A patent/JPH09129659A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007196586A (en) * | 2006-01-27 | 2007-08-09 | Nitto Denko Corp | Mold regenerating sheet |
JP2007196587A (en) * | 2006-01-27 | 2007-08-09 | Nitto Denko Corp | Mold regenerating sheet |
KR101296981B1 (en) * | 2006-01-27 | 2013-08-14 | 히타치가세이가부시끼가이샤 | Sheet for recycling mold |
JP2008132759A (en) * | 2006-10-23 | 2008-06-12 | Nitto Denko Corp | Sheet for regenerating mold |
JP2008143144A (en) * | 2006-12-13 | 2008-06-26 | Nitto Denko Corp | Sheet for mold reproduction |
WO2009093109A1 (en) | 2008-01-22 | 2009-07-30 | Nxp B.V. | Method for manufacturing a microelectronic package comprising at least one microelectronic device |
US8232628B2 (en) | 2008-01-22 | 2012-07-31 | Nxp B.V. | Method for manufacturing a microelectronic package comprising at least one microelectronic device |
JP2013006406A (en) * | 2011-05-20 | 2013-01-10 | Nitto Denko Corp | Resin kneaded material and sheet |
JP2014103176A (en) * | 2012-11-16 | 2014-06-05 | Shin Etsu Chem Co Ltd | Sealing material with support base material, substrate having sealed semiconductor element mounted thereon, wafer having sealed semiconductor element formed thereon, semiconductor device, and method for manufacturing semiconductor device |
CN104425292A (en) * | 2013-09-11 | 2015-03-18 | 株式会社东芝 | Semiconductor device manufacturing method, semiconductor manufacturing apparatus and sheet-shaped resin for resin sealing |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1315605B1 (en) | Mold and method for encapsulating an electronic device | |
US7049166B2 (en) | Methods and apparatus for making integrated circuit package including opening exposing portion of the IC | |
US5043199A (en) | Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet | |
US6372551B1 (en) | Method of manufacturing an image-sensor integrated circuit package without resin flash on lead frame and with increased wire bondability | |
JPH09129659A (en) | Sheetlike resin for sealing semiconductor | |
TWI244145B (en) | Method for fabricating semiconductor package | |
CN100495689C (en) | Method of packaging an optical sensor and image sensor device | |
US4592131A (en) | Method for manufacturing resin-sealed semiconductor device | |
US6383842B1 (en) | Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom | |
JP2957335B2 (en) | Lead frame manufacturing method | |
JPH05218275A (en) | Lead frame for semiconductor device | |
JPS60133741A (en) | Semiconductor device and manufacture thereof | |
CN107994005A (en) | A kind of high reliability array locking-type lead frame and its application in an enclosure | |
US11088054B2 (en) | Lead frame and method for manufacturing the same | |
US6114013A (en) | Sealing label for sealing semiconductor element | |
TW201232849A (en) | Methodology of forming optical lens for semiconductor light emitting device | |
US7803667B2 (en) | Manufacturing process for a quad flat non-leaded chip package structure | |
JP6404734B2 (en) | RESIN MOLDING METHOD, RESIN MOLDING MOLD, AND METHOD FOR PRODUCING MOLDED ARTICLE | |
JP4033969B2 (en) | Semiconductor package, manufacturing method thereof and wafer carrier | |
JPH0697353A (en) | Semiconductor device and manufacture thereof | |
TWI236716B (en) | Window ball grid array semiconductor package with substrate having opening and method for fabricating the same | |
JP2001144390A (en) | Solid circuit board and manufacturing method therefor | |
JP2661152B2 (en) | Manufacturing method of IC card module | |
JP3161449B2 (en) | Semiconductor resin sealing method | |
JP3127104B2 (en) | Mold for sealing resin-encapsulated semiconductor device and manufacturing method using the same |