JP2003037427A - Manufacturing method of antenna pattern - Google Patents

Manufacturing method of antenna pattern

Info

Publication number
JP2003037427A
JP2003037427A JP2001222555A JP2001222555A JP2003037427A JP 2003037427 A JP2003037427 A JP 2003037427A JP 2001222555 A JP2001222555 A JP 2001222555A JP 2001222555 A JP2001222555 A JP 2001222555A JP 2003037427 A JP2003037427 A JP 2003037427A
Authority
JP
Japan
Prior art keywords
die
punching
antenna pattern
adhesive layer
aluminum layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001222555A
Other languages
Japanese (ja)
Inventor
Masanao Watanabe
正直 渡辺
Yasuko Hirata
保子 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2001222555A priority Critical patent/JP2003037427A/en
Publication of JP2003037427A publication Critical patent/JP2003037427A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a RFID data carrier, having productivity higher than that of an etching method, without using expensive etching facilities. SOLUTION: A first trimming die with a trimming blade having a part along one side edge of an antenna line and a second trimming die with a trimming blade, having a part along the other side edge and connected to the first trimming die, are formed as a trimming die of the coil-shaped antenna pattern. A manufacturing material, made up of an aluminum layer on a base with an adhesive layer in between, is prepared. The aluminum layer and the adhesive layer are subjected to trimming manufacturing with the first trimming die and is also subjected to the trimming manufacturing with the second trimming die. An adhesive layer in a region which is to become a coil-shaped antenna pattern is heated with a heater having a projected part for the shape of the coil-shaped antenna pattern, to increase the adhesive strength to the base. Then, the aluminum layer in the antenna line and an area among the antenna line is pulled off.

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明はRFIDデータキャ
リアのコイル状アンテナパターンの製造方法に関する。 【0002】 【従来の技術】従来よりプラスチック等の基材の上にコ
イル状アンテナパターンを備えこのアンテナパターンと
容量素子とにより共振回路を形成して一定周波数の電波
を受信し送信できるように構成されたRFIDデータキ
ャリアが利用されている。このRFIDデータキャリア
は主として基材上に積層したアルミニウム層上にレジス
トパターンを形成しエッチングすることにより製造され
ている。 【0003】しかしエッチング法による場合、レジスト
製版の設備及びエッチング用の設備が必要であり、また
製品ごとにレジストパターンの作製を要し、またエッチ
ング加工後にレジスト膜を剥離しなければならず生産ス
ピードを上げるにしても限度がある。また抜き刃の強
度、及び抜きにかかる圧力により、1つの型に1mm以下
の接近した2つの抜き刃を形成することは困難である。 【0004】 【発明が解決しようとする課題】本発明は高価なエッチ
ング設備を必要とせずしかもエッチング法よりも生産性
よく製造し得るRFIDデータキャリアの製造方法を提
供することである。 【0005】 【課題を解決するための手段】本発明者は上記の課題を
解決すべく研究の結果、互いに独立した2つの抜き型を
使うことで1mm幅のアンテナ線が形成できることを見出
しかかる知見に基づいて本発明を完成した。即ち、本発
明は、請求項1に記載の通り、アンテナ線がコイル状に
はしるRFIDデータキャリアのコイル状アンテナパタ
ーンの製造方法であって、コイル状アンテナパターンの
抜き型としてアンテナ線の一方の側縁に沿う部分を有す
る抜き刃を備える第1の抜き型と他方の側縁に沿う部分
を有し、前記第1の抜き型の抜き刃につながる抜き刃を
備える第2の抜き型を形成する過程と、加工材料として
基板上に粘着層を介してアルミニウム層を積層してなる
ものを用意し、この材料に第1の抜き型を用いてアルミ
ニウム層及び粘着層に抜き加工を施す過程と、第2の抜
き型を用いてアルミニウム層及び粘着層に抜き加工を施
す過程と、コイル状アンテナパターンの形状の凸部を有
するヒーターを用いてコイル状アンテナパターンとなる
領域の粘着層部分を加熱して基材に対する接着強度を高
める過程と、しかる後アンテナ線とアンテナ線の間の領
域のアルミニウム層部分を毟り取る過程とからなること
を特徴とする。 【0006】本発明により、コイル状アンテナパターン
の抜き型としてアンテナ線の一方の側縁に沿う部分を有
する抜き刃を備える第1の抜き型と他方の側縁に沿う部
分を有し、前記第1の抜き型の抜き刃につながる抜き刃
を備える第2の抜き型を形成し、素材として基板上に粘
着層を介してアルミニウム層を積層してなるものを用意
し、この素材に第1の抜き型を用いてアルミニウム層及
び粘着層に抜き加工を施し、第2の抜き型を用いてアル
ミニウム層及び粘着層に抜き加工を施し、コイル状アン
テナパターンの形状の凸部を有するヒーターを用いてコ
イル状アンテナパターンとなる領域の粘着層部分を加熱
して基材に対する接着強度を高め、しかる後アンテナ線
とアンテナ線の間の領域のアルミニウム層部分を毟り取
ることにより、エッチング法に比べて安価に且つ能率よ
くアンテナパターンを製造することができる。またアン
テナ線の一方の側縁に沿う部分の打ち抜きと他方の側縁
に沿う部分の打ち抜きを同時に行わず別々に行うことに
より狭い間隔で切り込みを入れるときの困難さを解消す
ることができる。 【0007】 【発明の実施の形態】次に図1〜図5を用いて本発明の
製造方法について説明する。図面において、図1は第1
の抜き型の平面図である。図2は第2の抜き型の平面図
である。図3はアンテナパターンの形状の凸部を有する
ヒーターの平面図である。図4は本発明の製造過程を示
す説明図である。また図5は本発明の方法により得た製
品の平面図である。 【0008】先ず図1に示すようなアンテナ線の一方の
側縁に沿う部分を有する抜き刃4を備える第1の抜き型
Aと、図2に示すようなアンテナ線の他方の側縁に沿う
部分を有し、前記第1の抜き型の抜き刃につながる抜き
刃5を備える第2の抜き型Bをアンテナパターンの原板
に従って形成する。 【0009】次いでポリエステル等の基材の上に粘着層
を介して0.5〜0.6mm厚のアルミニウム層を積層し
たものを加工材料として用意し、図4(a)に示すよう
に図1に示す第1の抜き型Aを用いてアルミニウム層3
及び粘着層2に抜き加工を施す。 【0010】次いで図4(b)に示すように図2に示す
第2の抜き型Bを用いてアルミニウム層3及び粘着層2
に抜き加工を施す。 【0011】しかる後図3に示すようなアンテナパター
ンの形状の凸部6を有するヒーターCを図4(c)に示
すように抜き加工したパターンと整合させてアルミニウ
ム層3に押しあててその下の粘着層2を加熱して基材に
対する接着性を高める。 【0012】しかる後図4(d)に示すようにアンテナ
線とアンテナ線の間のアルミニウム層の部分を毟り取る
(剥がす)ことにより基材1上にアルミニウム3からな
るアンテナパターンが形成された製品を得ることができ
る。 【0013】本発明において粘着層の材料としてコンデ
ンサーや圧力センサーの接着に用いるアクリル系接着剤
に低軟化点のタック剤を含有するものや、未硬化の熱硬
化ポリマー、オリゴマーを持つ熱硬化タイプのものがあ
る。 【0014】本発明において抜き刃が平打ち刃かロータ
リー刃かに関わらず2つの抜き型の刃の位置を合わせる
には、積層フィルムを2カ所の刃の位置に正確に順層送
りして移動させるための方法として、(1) 高精度のリニ
アステップモータでフィルムを一定テンションで送る方
法と、(2) 固定ステージに2枚の刃が交互に下りるスラ
イド型方式が考えられる。 【0015】尚、本発明の製造方法において第1及び第
2の抜き型並びにヒーターを多面付けで形成し多数の製
品を一度に製造することができることはいうまでもない
ことである。 【0016】 【発明の効果】以上詳細に説明したように本発明によれ
ば、コイル状アンテナパターンの抜き型としてアンテナ
線の一方の側縁に沿う部分を有する抜き刃を備える第1
の抜き型と他方の側縁に沿う部分を有し、前記第1の抜
き型の抜き刃につながる抜き刃を備える第2の抜き型を
形成し、加工材料として基板上に粘着層を介してアルミ
ニウム層を積層してなるものを用意し、この材料に第1
の抜き型を用いてアルミニウム層及び粘着層に抜き加工
を施し、次いで第2の抜き型を用いてアルミニウム層及
び粘着層に抜き加工を施し、コイル状アンテナパターン
の形状の凸部を有するヒーターを用いてコイル状アンテ
ナパターンとなる領域の粘着層部分を加熱して基材に対
する接着強度を高め、しかる後アンテナ線とアンテナ線
の間の領域のアルミニウム層部分を毟り取る製造方法で
あり、抜き型及びヒーターは一度用意すれば反復して使
用することが可能であり、それ以外に高価な設備を必要
としないので、エッチング加工に比べて安価にしかもエ
ッチング加工よりも生産性よくコイル状アンテナパター
ンの製造を行うことができる。 【0017】また一度に細かいピッチで抜き加工を行う
のでなくアンテナ線の一方の側縁に沿う部分の抜き加工
とアンテナ線の他方の側縁に沿う部分の抜き加工を別々
に行うので抜き型の刃のピッチを広くとることができ
る。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a coiled antenna pattern of an RFID data carrier. 2. Description of the Related Art Conventionally, a coil-shaped antenna pattern is provided on a base material such as plastic, and a resonance circuit is formed by the antenna pattern and a capacitance element so that a radio wave of a constant frequency can be received and transmitted. The used RFID data carrier is used. This RFID data carrier is mainly manufactured by forming a resist pattern on an aluminum layer laminated on a base material and etching the resist pattern. [0003] However, in the case of using the etching method, equipment for resist plate making and equipment for etching are required, a resist pattern is required to be formed for each product, and a resist film must be peeled off after etching, so that the production speed is increased. There is a limit to raising. Also, due to the strength of the punching blade and the pressure applied to the punching, it is difficult to form two punching blades close to each other by 1 mm or less in one mold. SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing an RFID data carrier which does not require expensive etching equipment and can be manufactured with higher productivity than the etching method. [0005] The present inventors have conducted research to solve the above-mentioned problems, and as a result, have found that an antenna line having a width of 1 mm can be formed by using two independent dies. Based on the above, the present invention has been completed. That is, the present invention provides a method for manufacturing a coiled antenna pattern of an RFID data carrier in which the antenna wire is formed in a coil shape, wherein one side of the antenna wire is used as a cutting die for the coiled antenna pattern. Forming a first cutting die with a cutting blade having a portion along the edge and a second cutting die with a cutting blade having a portion along the other side edge and leading to the cutting blade of the first cutting die. And a step of preparing a processing material prepared by laminating an aluminum layer on a substrate via an adhesive layer, and performing a punching process on the aluminum layer and the adhesive layer using a first punching die on this material; A step of punching the aluminum layer and the adhesive layer using the second punching die, and a step of forming a coil antenna pattern by using a heater having a projection having the shape of the coil antenna pattern. A process to increase the adhesive strength to heat the sealable layer portion substrate, characterized in that comprising a step of pluck off the aluminum layer portion of the region between Thereafter antenna line and the antenna line. According to the present invention, there is provided a first punching die having a punching blade having a portion along one side edge of an antenna wire as a punching die for a coiled antenna pattern, and a portion along the other side edge, A second punching die having a punching blade connected to the punching blade of the first punching die is formed, and a material obtained by laminating an aluminum layer on a substrate via an adhesive layer is prepared as a material. The punching process is performed on the aluminum layer and the adhesive layer using the punching die, the punching process is performed on the aluminum layer and the adhesive layer using the second punching die, and the heater having the convex portion in the shape of the coil-shaped antenna pattern is used. The adhesive layer in the area where the coil-shaped antenna pattern is formed is heated to increase the adhesive strength to the base material, and then the aluminum layer in the area between the antenna wires is peeled off to remove the air. It can be produced inexpensively and efficiently antenna pattern in comparison with quenching method. In addition, by punching out a portion along one side edge of the antenna wire and separately punching out a portion along the other side edge, it is possible to eliminate the difficulty in making cuts at narrow intervals by not performing simultaneously but separately. Next, a manufacturing method of the present invention will be described with reference to FIGS. In the drawings, FIG.
It is a top view of the cutting die. FIG. 2 is a plan view of the second punching die. FIG. 3 is a plan view of a heater having a protrusion having the shape of an antenna pattern. FIG. 4 is an explanatory view showing the manufacturing process of the present invention. FIG. 5 is a plan view of a product obtained by the method of the present invention. First, a first punching die A having a punching blade 4 having a portion along one side edge of the antenna wire as shown in FIG. 1 and a second punching die A along the other side edge of the antenna wire as shown in FIG. A second cutting die B having a portion and having a cutting blade 5 connected to the cutting blade of the first cutting die is formed according to the original plate of the antenna pattern. Next, an aluminum layer having a thickness of 0.5 to 0.6 mm laminated on a base material such as polyester via an adhesive layer is prepared as a processing material, and as shown in FIG. Aluminum layer 3 using a first punching die A shown in FIG.
Then, a punching process is performed on the adhesive layer 2. Next, as shown in FIG. 4 (b), an aluminum layer 3 and an adhesive layer 2 are formed using a second die B shown in FIG.
Is punched. Thereafter, a heater C having a convex portion 6 having the shape of an antenna pattern as shown in FIG. 3 is aligned with the punched pattern as shown in FIG. Is heated to increase the adhesiveness to the substrate. Thereafter, as shown in FIG. 4D, a product in which an antenna pattern made of aluminum 3 is formed on the base material 1 by tearing off (peeling) off the aluminum layer between the antenna wires. Can be obtained. In the present invention, an acrylic adhesive used for bonding a capacitor or a pressure sensor containing a tackifier having a low softening point as a material of the adhesive layer, or a thermosetting type having an uncured thermosetting polymer or oligomer is used. There is something. In order to adjust the positions of the two punching dies, regardless of whether the punching blades are flat punching blades or rotary blades in the present invention, the laminated film is moved to the positions of the two blades by precisely forward-layering and moving. There are two ways to do this: (1) a method of feeding the film with a constant tension using a high-precision linear step motor, and (2) a slide-type method in which two blades descend alternately on a fixed stage. In the manufacturing method of the present invention, it goes without saying that a large number of products can be manufactured at once by forming the first and second blanking dies and the heater in multiple faces. As described above in detail, according to the present invention, the first die having the portion along one side edge of the antenna wire as the die for the coiled antenna pattern is provided.
Forming a second punching die having a punching die and a portion along the other side edge and having a punching blade connected to the punching blade of the first punching die, as a processing material via an adhesive layer on a substrate. Prepare a laminate of aluminum layers.
The punching process is performed on the aluminum layer and the adhesive layer using the punching die, and then the punching process is performed on the aluminum layer and the adhesive layer using the second punching die. This is a manufacturing method in which the adhesive layer portion in the region that becomes the coiled antenna pattern is heated to increase the adhesive strength to the base material, and then the aluminum layer portion in the region between the antenna wires is peeled off. Once the heater is prepared, it can be used repeatedly, and no other expensive equipment is required, so the coiled antenna pattern is less expensive than etching and more productive than etching. Manufacturing can be performed. Also, the punching process is not performed at a fine pitch at a time, but the punching process of the portion along one side edge of the antenna wire and the punching process of the portion along the other side edge of the antenna wire are performed separately. The blade pitch can be widened.

【図面の簡単な説明】 【図1】第1の抜き型の平面図である。 【図2】第2の抜き型の平面図である。 【図3】アンテナパターンの形状の凸部を有するヒータ
ーの平面図である。 【図4】本発明の製造過程を示す説明図である。 【図5】本発明の方法により得た製品の平面図である。 【符号の説明】 1 基材 2 粘着層 3 アルミニウム層 A 第1の抜き型 B 第2の抜き型 C ヒーター 4 第1の抜き型の抜き刃 5 第2の抜き型の抜き刃 6 ヒーターの凸部
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a first punching die. FIG. 2 is a plan view of a second punching die. FIG. 3 is a plan view of a heater having a protrusion having the shape of an antenna pattern. FIG. 4 is an explanatory view showing a manufacturing process of the present invention. FIG. 5 is a plan view of a product obtained by the method of the present invention. [Description of Signs] 1 Base material 2 Adhesive layer 3 Aluminum layer A First cutting die B Second cutting die C Heater 4 First cutting die cutting blade 5 Second cutting die cutting blade 6 Heater convex Department

Claims (1)

【特許請求の範囲】 【請求項1】 アンテナ線がコイル状にはしるRFID
データキャリアのコイル状アンテナパターンの製造方法
であって、コイル状アンテナパターンの抜き型としてア
ンテナ線の一方の側縁に沿う部分を有する抜き刃を備え
る第1の抜き型と他方の側縁に沿う部分を有し、前記第
1の抜き型の抜き刃につながる抜き刃を備える第2の抜
き型を形成する過程と、加工材料として基板上に粘着層
を介してアルミニウム層を積層してなるものを用意し、
この材料に第1の抜き型を用いてアルミニウム層及び粘
着層に抜き加工を施す過程と、第2の抜き型を用いてア
ルミニウム層及び粘着層に抜き加工を施す過程と、コイ
ル状アンテナパターンの形状の凸部を有するヒーターを
用いてコイル状アンテナパターンとなる領域の粘着層部
分を加熱して基材に対する接着強度を高める過程と、し
かる後アンテナ線とアンテナ線の間の領域のアルミニウ
ム層部分を毟り取る過程とからなることを特徴とするア
ンテナパターンの製造方法。
Claims: 1. An RFID in which an antenna wire is coiled.
A method for manufacturing a coiled antenna pattern of a data carrier, comprising: a first punched die having a punched edge having a portion along one side edge of an antenna wire as a die for the coiled antenna pattern; Forming a second cutting die having a portion and having a cutting blade connected to the cutting blade of the first cutting die, and laminating an aluminum layer on a substrate via an adhesive layer as a processing material Prepare
A step of punching the aluminum layer and the adhesive layer using the first punching die, a step of punching the aluminum layer and the adhesive layer using the second punching die, A process of heating the adhesive layer portion in a region to be a coiled antenna pattern by using a heater having a convex portion having a shape to increase the adhesive strength to a base material, and thereafter, an aluminum layer portion in a region between the antenna lines. And a step of tearing off the antenna pattern.
JP2001222555A 2001-07-24 2001-07-24 Manufacturing method of antenna pattern Pending JP2003037427A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001222555A JP2003037427A (en) 2001-07-24 2001-07-24 Manufacturing method of antenna pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001222555A JP2003037427A (en) 2001-07-24 2001-07-24 Manufacturing method of antenna pattern

Publications (1)

Publication Number Publication Date
JP2003037427A true JP2003037427A (en) 2003-02-07

Family

ID=19056019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001222555A Pending JP2003037427A (en) 2001-07-24 2001-07-24 Manufacturing method of antenna pattern

Country Status (1)

Country Link
JP (1) JP2003037427A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010538556A (en) * 2007-09-04 2010-12-09 ビエロマティーク ロイツェ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント カンパニー コマンディートゲゼルシャフト Chip module for RFID system
JP2011035794A (en) * 2009-08-05 2011-02-17 Nec Tokin Corp Winding implement, and method of manufacturing antenna sheet using the same
US8026851B2 (en) 2005-03-25 2011-09-27 Toray Industries, Inc. Planar antenna and manufacturing method thereof
CN102394358A (en) * 2011-06-16 2012-03-28 焦林 Manufacturing method of transfer type radio frequency identification read-write antenna
JP2014225070A (en) * 2013-05-15 2014-12-04 凸版印刷株式会社 Conductivity-imparting transfer foil, data carrier, and conductive pattern formation method
WO2022124094A1 (en) * 2020-12-09 2022-06-16 日東電工株式会社 Method for producing metal pattern laminated substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0676659A (en) * 1992-08-28 1994-03-18 Mitsubishi Cable Ind Ltd Manufacture of flat cable circuit
JPH07221435A (en) * 1994-02-07 1995-08-18 Sumitomo Wiring Syst Ltd Flexible printed substrate
JPH0944762A (en) * 1994-12-01 1997-02-14 Miyake:Kk Production of metallic foil sheet like circuit for resonance tag or the like
JP2001101366A (en) * 1999-09-29 2001-04-13 Mitsui High Tec Inc Antenna substrate manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0676659A (en) * 1992-08-28 1994-03-18 Mitsubishi Cable Ind Ltd Manufacture of flat cable circuit
JPH07221435A (en) * 1994-02-07 1995-08-18 Sumitomo Wiring Syst Ltd Flexible printed substrate
JPH0944762A (en) * 1994-12-01 1997-02-14 Miyake:Kk Production of metallic foil sheet like circuit for resonance tag or the like
JP2001101366A (en) * 1999-09-29 2001-04-13 Mitsui High Tec Inc Antenna substrate manufacturing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8026851B2 (en) 2005-03-25 2011-09-27 Toray Industries, Inc. Planar antenna and manufacturing method thereof
JP2010538556A (en) * 2007-09-04 2010-12-09 ビエロマティーク ロイツェ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント カンパニー コマンディートゲゼルシャフト Chip module for RFID system
JP2011035794A (en) * 2009-08-05 2011-02-17 Nec Tokin Corp Winding implement, and method of manufacturing antenna sheet using the same
CN102394358A (en) * 2011-06-16 2012-03-28 焦林 Manufacturing method of transfer type radio frequency identification read-write antenna
JP2014225070A (en) * 2013-05-15 2014-12-04 凸版印刷株式会社 Conductivity-imparting transfer foil, data carrier, and conductive pattern formation method
WO2022124094A1 (en) * 2020-12-09 2022-06-16 日東電工株式会社 Method for producing metal pattern laminated substrate

Similar Documents

Publication Publication Date Title
CN100358119C (en) Method of manufacturing RFID
US7253027B2 (en) Method of manufacturing hybrid integrated circuit device
JPH06334110A (en) Film of excellent stamping property and lead frame using it
US5281556A (en) Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane
EP0147807B1 (en) Method for forming a substrate for tape automated bonding for electronic circuit elements
JP2003037427A (en) Manufacturing method of antenna pattern
US7152317B2 (en) Circuit forming method
CN114340156A (en) Manufacturing method of PET material die cutting process flexible single panel
JP4251104B2 (en) RFID tag manufacturing method
JP4012019B2 (en) Method for forming antenna wiring pattern
JP2004094502A (en) Method for forming antenna wiring pattern
JPH0964512A (en) Production of flexible circuit board
TWI357125B (en)
JPH10166771A (en) Non-contact type ic card and its manufacture
US4101361A (en) Method of manufacturing laminated buses
JP2013030864A (en) Wiring structure and manufacturing method of the same
JP2009032071A (en) Production method and device of conductive member for non-contact type data carrier
JPH10147089A (en) Non-contact ic card and production thereof
JPH11204587A (en) Metal plate with adhesive tape for semiconductor device and manufacture thereof
CN117393229A (en) LOD flat cable processing method
CN117340950A (en) Simple, convenient and quick opposite-pasting technology for high-temperature film of flexible screen
JP2001160123A (en) Non-contact communication medium and its manufacture
JP2023016152A (en) Film roll with thick film printing handle and production method thereof
JPH06268354A (en) Manufacture of flexible circuit board
JPH11272834A (en) Ic card and its manufacture

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080627

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100806

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100908

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101102

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110303

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110706